WO2022065437A1 - はんだ付け作業プログラム作成システム、はんだ付け作業プログラム作成装置及びはんだ付ロボット - Google Patents

はんだ付け作業プログラム作成システム、はんだ付け作業プログラム作成装置及びはんだ付ロボット Download PDF

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Publication number
WO2022065437A1
WO2022065437A1 PCT/JP2021/035126 JP2021035126W WO2022065437A1 WO 2022065437 A1 WO2022065437 A1 WO 2022065437A1 JP 2021035126 W JP2021035126 W JP 2021035126W WO 2022065437 A1 WO2022065437 A1 WO 2022065437A1
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WO
WIPO (PCT)
Prior art keywords
soldering
program
circuit board
printed circuit
soldering work
Prior art date
Application number
PCT/JP2021/035126
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English (en)
French (fr)
Japanese (ja)
Inventor
浩介 中島
忍 山本
猛 三村
重登 佐藤
Original Assignee
昭立電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 昭立電気工業株式会社 filed Critical 昭立電気工業株式会社
Publication of WO2022065437A1 publication Critical patent/WO2022065437A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1656—Programme controls characterised by programming, planning systems for manipulators
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/409—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by using manual data input [MDI] or by using control panel, e.g. controlling functions with the panel; characterised by control panel details or by setting parameters
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/4093—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by part programming, e.g. entry of geometrical information as taken from a technical drawing, combining this with machining and material information to obtain control information, named part programme, for the NC machine
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/42—Recording and playback systems, i.e. in which the programme is recorded from a cycle of operations, e.g. the cycle of operations being manually controlled, after which this record is played back on the same machine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • Patent Document 1 describes means for teaching coordinate data indicating a soldering point, moving speed to the point, moving acceleration, and soldering condition data as required data from a personal computer.
  • the soldering iron is moved to the taught point according to the control program built in in advance, and the soldering conditions are controlled via the soldering unit controller so that the soldering is performed in order. At that time, it is not necessary to input the program using the dedicated language.
  • Patent Document 2 describes a means capable of deriving the coordinate values of the parts to be soldered without the operator individually inputting the coordinate values representing the target positions for soldering.
  • the operator only needs to input the Gerber data of the board and the reference coordinate value indicating the position of the predetermined part on the board, and the derivation part is the position of the part to be soldered on the board with respect to the predetermined part from the Gerber data.
  • the difference coordinate value representing the above can be extracted, and the coordinate value of the part to be soldered can be derived by using the extracted difference coordinate value and the reference coordinate value.
  • the labor of the operator for inputting the target position for soldering can be effectively reduced.
  • a printed circuit board display means a soldering position specifying means for specifying a soldering position to be mounted on the displayed printed circuit board, and a soldering work recording means for recording the soldering positions in the order of soldering work are provided.
  • a soldering work program creation system wherein the soldering position specifying means is provided with a back surface image display means for displaying image information of the back surface of a printed circuit board. Solve the problem.
  • (2) The problem is solved by the soldering work program creation system according to (1), wherein the back surface image display means displays the transmission information of the back surface image information superimposed on the front surface image information. do.
  • a printed circuit board display device a soldering position specifying device for specifying a soldering position to be mounted on the displayed printed circuit board, and a soldering work recording device for recording soldering positions in the order of soldering work are provided.
  • a soldering work program creating device wherein the soldering position specifying device is provided with a back surface image display device for displaying image information of the back surface of a printed circuit board. Solve the problem.
  • the problem is solved by the soldering work program creating device according to (3), wherein the back surface image display device displays the transmission information of the back surface image information superimposed on the front surface image information. do.
  • the problem is solved by a soldering robot equipped with the system according to (1) or (2).
  • the image information of the back surface in addition to the front surface of the printed circuit board is displayed, so the soldering position can be specified quickly and accurately.
  • the configuration of the soldering robot is shown.
  • the program making apparatus in the system of Example 1 is shown.
  • the outline of the whole system of Example 1 is shown.
  • the processing procedure of the display image data creation program in the system of Example 1 is shown.
  • the processing procedure of the board object data creation program in the system of Example 1 is shown.
  • the processing procedure of the program for creating the operation program at the time of implementation in the system of Example 1 is shown.
  • the operation screen of the first embodiment is shown.
  • the operation screen of the first embodiment is shown.
  • the operation screen of the first embodiment is shown.
  • the operation screen of the first embodiment is shown.
  • the operation screen of the first embodiment is shown.
  • the operation screen of the first embodiment is shown.
  • the operation screen of the first embodiment is shown.
  • the operation screen of the first embodiment is shown.
  • the operation screen of the first embodiment is shown.
  • the operation screen of the first embodiment is shown.
  • the operation screen of the first embodiment is shown.
  • the operation screen of the first embodiment is shown. The
  • soldering robot configuration The soldering robot 10 has a known configuration, and as shown in FIG. 1, the soldering robot 10 includes a soldering iron unit 11, a printed circuit board mounting device 12, a driving device 13, and a storage device 14 as main devices.
  • the soldering iron unit 11 is attached to the robot frame via an arm, and moves up and down above the printed circuit board mounting device 12 in order to solder electronic components to the printed circuit board mounted on the printed circuit board mounting device 12. Move freely from side to side.
  • the soldering iron unit 11 includes a heating mechanism, a soldering iron, and a solder supply mechanism (not shown). The soldering iron is heated by the heating mechanism, and the solder supplied from the solder supply mechanism is melted and soldered.
  • the printed circuit board to be mounted with electronic components is placed on the printed circuit board mounting device 12 with the side to be soldered (front side) facing up.
  • the drive device 13 functions for driving any device of the robot.
  • a program for soldering and the like are recorded in the storage device 14.
  • the program creation device 20 includes a display device 21, an input device 22, each program storage device 23, a display image storage device 24, and a board object storage device 25, as shown in FIG. , Existing various data storage devices 26, and operation recording device 27 at the time of soldering.
  • the program creation device 20 creates a program for executing the system of the first embodiment.
  • the program creation device 20 is, for example, a tablet-type computer or the like, and it is desirable that the program creation device 20 can be connected to Internet communication.
  • a program for executing the system of the first embodiment is created through the display by the display device 21 and the input by the input device 22.
  • each program storage device 23 in addition to a general program, a display image data creation program (FIG. 4), a board object data creation program (FIG. 5), The operation program creation program (FIG. 6) at the time of soldering is stored.
  • the display image storage device 24 stores the display image data created by the display image data creation program (FIG. 4).
  • the board object storage device 25 stores the board object data created by the board object data creation program (FIG. 5).
  • the existing various data storage devices 26 store existing data such as tip data, solder work data, solder condition number data, and board preliminary information data.
  • the trowel data is data of various trowels.
  • the soldering work data is data such as soldering work such as point soldering and pulling solder, camera preliminary inspection, calling program, work correction, and the like.
  • the solder condition number data is data about a number indicating the optimum solder condition set according to the tip and preliminary board information (number of layers, plate thickness, etc.).
  • the substrate preliminary information data is the data of the substrate preliminary information such as the surface treatment of the printed circuit board, the thickness of the substrate, the number of layers, and the thickness of the copper foil.
  • the operation storage device 27 at the time of soldering stores the program created by the operation program creation program at the time of soldering (FIG. 6).
  • the system of the first embodiment is a system for creating an operation program used by a soldering robot when soldering an electronic component and a printed circuit board.
  • Create a program according to the following procedure (Fig. 3). 1. 1. Create display image data (front side and back side of printed circuit board) (31) 2. 2. Create board object data (32) 3. 3. Create an operation program for soldering (33) 4. Send to the robot (34)
  • image data for displaying the printed circuit board image data for display
  • data board object data
  • image data for display not only the front side of the printed circuit board but also the back side is used as transparent data, and when plotting the soldering points, the transparent data of the back side is superimposed on the front side and displayed.
  • the program creator can create the program while obtaining the information on the back side.
  • the processing procedure of the program for creating the image data for display is as follows (FIG. 4).
  • the main body of the process is the CPU of the program creation device.
  • the CPU acquires and records the captured image (41, 46).
  • the cropped images other than the printed circuit board are recorded (42, 47).
  • the captured image whose brightness and saturation are adjusted to be easy to see is recorded (43,48).
  • the image adjusted in this way is recorded as an adjusted photographed image (44).
  • the image adjusted in this way is converted into a transparent screen and recorded as an adjusted photographed image (49).
  • the transparent screen is an image in which the background data is made transparent among the image data.
  • the adjusted photographed image (front surface) and the image obtained by converting the adjusted photographed image into a transparent screen (back surface) are recorded in the display image storage device 24 of the program creation device 20.
  • the processing procedure of the program for creating the board object data is as follows (Fig. 5).
  • the main body of the process is the CPU of the program creation device.
  • Board objector data is created for the printed circuit board selected for soldering.
  • information about the selected printed circuit board is acquired (51).
  • the vertical and horizontal dimensions of the selected printed circuit board are acquired (52).
  • the dimensions may be acquired by actual measurement, or may be acquired by using the indication of the dimensions on the printed circuit board itself.
  • preliminary information about the selected printed circuit board is acquired (53).
  • the preliminary information is information on the thickness and the number of layers of the printed circuit board. Information such as the thickness and number of layers of the printed circuit board affects the soldering conditions when soldering electronic components. Therefore, the preliminary information is information necessary for determining the solder condition number.
  • the preliminary information is selected by the program creator from those called from the existing various data storage devices 26 and displayed on the display device 21, and the CPU acquires the information.
  • the coordinate values on the XY coordinates are applied to all the positions on the printed circuit board by the existing means.
  • the data obtained by applying the coordinate values on the XY coordinates to all the positions on the printed circuit board is referred to as a board object (54).
  • the board object is stored in the board object storage device 25 (FIG. 2) (55).
  • the processing procedure of the program for creating the operation program for soldering the electronic component to the printed circuit board is as follows (FIG. 6).
  • the main body of the process is the CPU of the program creation device.
  • the program creator selects the printed circuit board to which the electronic components are to be soldered.
  • the CPU acquires information on the selected printed circuit board (61).
  • the program creator selects the tip information called from the existing various data storage devices 26 (FIG. 2) and displayed on the display device 21, and the CPU acquires and records the information.
  • the recorded trowel information for all work is displayed in the "display of trowel information for all work" shown in process 69.
  • the CPU calls and displays the front side of the display screen corresponding to the printed circuit board selected in process 61 from the skin screen storage device 24 (63).
  • the program creator visually looks at this display screen and plots the soldering position.
  • the CPU acquires and records the coordinate values on the XY coordinates corresponding to the plotted positions as soldering position information (66).
  • the CPU calls and displays the soldering work data from the existing various data storage devices 26.
  • the program author selects the soldering work to be done at the plotted positions.
  • the CPU acquires and records soldering work information (67).
  • the program creator When the program creator wants to refer to the information on the back surface when plotting the soldering position, the program creator instructs the program creation device to display the back surface. Where the plot position and soldering work are determined by the type and position of the mounted component, information that is not displayed on the front surface is displayed on the back surface regarding the type and position of the mounted component. In addition, the copper foil pattern on the back surface is also displayed. The information displayed on the back surface influences the position of the plot and the determination of the soldering work, as the copper foil pattern on the back surface affects how heat is transferred. Therefore, the program creator can determine the plot position in a shorter time and more accurately by referring to the information on the back surface.
  • the CPU When the CPU receives the instruction for displaying the back surface (64), the CPU calls the transparent image of the back surface from the skin screen storage device 24 and displays it on the front surface (65). When the transparent image of the back surface is displayed overlapping with the front surface, the program creator plots the mounting soldering position, and the CPU acquires and records the mounting soldering position information (66).
  • Optimizing is soldering so that the position to be soldered, the soldering work, and the tip to be used are taken into consideration, the shortest moving distance, the number of times the tip is replaced is small, and efficient work can be performed. It is a work to judge the order of work.
  • the CPU receives an optimization instruction, optimizes by existing means, and records (71).
  • the created operation program is sent to the soldering robot that performs the soldering work. That is, the CPU acquires information on the operation program to be transmitted and the soldering robot to which the operation program is transmitted, and sends the operation program to the soldering robot (not shown).
  • FIGS. 7 to 21 will explain the operation program creation work at the time of soldering, which is performed by the display displayed on the display device of the program creation device.
  • the main body of the work is the program creator unless otherwise specified.
  • the screen shown in FIG. 7 is displayed.
  • the substrate displayed here is an image of the front surface of the images stored in the display image storage device 24.
  • the text "Align the border to the corner of the board” is displayed overlapping the image on the front side of the captured image.
  • the border is aligned to the corner of the board according to the instructions indicated by the characters, the image of the front surface other than the printed circuit board is trimmed and removed.
  • tap the "Next" button tap the "Next" button.
  • the screen shown in FIG. 8 is displayed.
  • the screen displayed here is an image of the front surface from which the image other than the printed circuit board is trimmed and removed from the image of the front surface.
  • the captured image of the front surface is recorded in the display image storage device 24 of the program creation device.
  • FIGS. 7 and 8 are displayed in order for the back surface of the captured images. Rotate and adjust the image on the back side as well as the front side, and tap the "Save" button when finished. As a result, the captured image of the back surface is recorded in the display image storage device 24 of the program creation device. The captured image of the back surface is recorded as a transparent image.
  • FIG. 9 The screen shown in FIG. 9 is displayed.
  • the substrate displayed here is an image stored in the display image storage device 24. Select the board to be used from the saved board images. If there is no image to use in the saved board image, tap the "Create new" button. Then, a screen for taking a picture of the board to be used appears (not shown), and the display image creation program is started. When the substrate is photographed, the screens are displayed in the order of FIGS. 7 and 8. After that, the screen shown in FIG. 9 is displayed again. After selecting the image to use, tap the "Next" button.
  • the screen shown in FIG. 10 is displayed.
  • the screen displayed here is the front side of the image selected as the image to be used among the images stored in the display image storage device 24.
  • the screen shown in FIG. 11 is displayed. Obtain the vertical length (Y dimension) of the substrate by measuring it, etc., and input it. Tap the "Next" button.
  • the screen shown in FIG. 12 is displayed.
  • the screen displayed here is stored in various existing data storage devices 26. Enter the surface treatment, substrate thickness, number of substrate layers, and copper foil thickness. Tap the "Next" button.
  • the CPU creates a board object to be used and records it in the board object storage device 25.
  • the screen shown in FIG. 13 is displayed.
  • the screen displayed here is stored in various existing data storage devices 26.
  • the auto tool changer function is a function in which a plurality of types of trowels are set in advance in the soldering iron unit, and a plurality of types of trowels can be changed without changing the trowels.
  • the operator taps the "Yes” button when using the auto tool changer function, and taps the "No” button when not using the auto tool changer function.
  • the screen shown in FIG. 14 is displayed.
  • the screen displayed here is stored in various existing data storage devices 26.
  • the operator selects and taps the trowel to use.
  • three types of trowels can be selected. If you do not use the autosul changer function, you can select one type of trowel.
  • the operator taps the "Next" button when the selection of the trowel is completed.
  • the screen shown in FIG. 15 is displayed.
  • the screen displayed here is an image of the front side of the images stored in the display image storage device 25.
  • the "BOTTOM surface” on the screen means the front surface.
  • tap the point where you want to solder The tapped points are converted into XY coordinate values stored in the board object storage device and recorded in the operation storage device 27 at the time of mounting.
  • tap the "Switch display” button When determining the point of soldering, if you want to check the image of the back surface, tap the "Switch display” button.
  • the screen shown in FIG. 16 is displayed.
  • the screen displayed here is an image in which the transparent image of the corresponding back surface is superimposed on the image of the front surface among the images stored in the display image storage device 25.
  • the "silk surface” on the screen means the back surface. Tap the "Display switching" button to return to the screen shown in FIG. Using the screen shown in FIG. 15 and the screen shown in FIG. 16, tap the point to be soldered.
  • the screen shown in FIG. 17 is displayed.
  • a tapped point is added as a black circle to the screen shown in FIG. 15 as a point for soldering. Display such as "Please select the work content” is shown overlapping. Select the content of the soldering work and tap the "Finish” button.
  • the content of the soldering work is stored in the operation storage device 27 at the time of soldering as the content of the soldering work performed at that point.
  • the points are specified and the soldering work contents are specified for all the points to be soldered.
  • the CPU displays the previous screen, etc., and the program creator can re-specify the mounting points, etc., and edit.
  • the program creator taps the "Save As” button, the CPU displays a screen for naming (not shown), and the CPU uses the name given by the program creator in the operation storage device 27 at the time of mounting. Record.
  • Figure 20 shows an example of the screen displayed when the program creator edits.
  • the screen displayed here is information obtained by processing the information recorded in the operation storage device 27 at the time of mounting into a state that is easy for the program creator to see. That is, information such as the position of each plot and information on the soldering work performed in each plot is recorded in a horizontal row. In addition, the work number immediately before and the work number immediately after each plot are recorded, and the soldering order can be determined.
  • the position of each plot is indicated by the X coordinate, the Y coordinate, the Z coordinate, and the R coordinate. It is a numerical value displayed depending on the R coordinate, line speed, inscribed angle, condition number, and soldering work. Tap the "Back" button to return to the screen shown in FIG.
  • FIG. 21 shows a screen used by an operator to transfer a program to a robot.
  • the program is specified by the type of board and the data number, and the transfer destination is specified by the names such as Unit 1 and Unit 2.
  • the CPU sends the program recorded in the operation storage device 27 at the time of mounting to the robot.
  • Solding robot 11 Soldering iron unit 14 Storage device 20 Program creation device 21
  • Display device 22 Input device 23
  • Each program storage device 24 Display image storage device 25
  • Board object storage device 26 Existing various data storage devices 27 Operation memory during soldering Device 31 Create display image data (front side and back side) 32 Create board object data 33 Create operation program during soldering 34 Send to robot

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • Robotics (AREA)
  • Geometry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Numerical Control (AREA)
  • Manipulator (AREA)
PCT/JP2021/035126 2020-09-24 2021-09-24 はんだ付け作業プログラム作成システム、はんだ付け作業プログラム作成装置及びはんだ付ロボット WO2022065437A1 (ja)

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JPH03282301A (ja) * 1990-03-30 1991-12-12 Toppan Printing Co Ltd 表裏パターン検査装置
JPH06231206A (ja) * 1993-02-01 1994-08-19 Fujitsu Ten Ltd Ｃａｄ出力装置、および画像表示装置
JP2014195827A (ja) * 2013-03-29 2014-10-16 株式会社タムラ製作所 位置設定装置、位置設定方法および位置設定プログラム
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JP7356608B1 (ja) 2022-08-10 2023-10-04 株式会社メイコー はんだ付けシステム、これを用いた装置及びロボット
WO2024034613A1 (ja) * 2022-08-10 2024-02-15 株式会社メイコー はんだ付けシステム、これを用いた装置及びロボット

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