WO2022065437A1 - Soldering work program creation system, soldering work program creation device, and soldering robot - Google Patents

Soldering work program creation system, soldering work program creation device, and soldering robot Download PDF

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Publication number
WO2022065437A1
WO2022065437A1 PCT/JP2021/035126 JP2021035126W WO2022065437A1 WO 2022065437 A1 WO2022065437 A1 WO 2022065437A1 JP 2021035126 W JP2021035126 W JP 2021035126W WO 2022065437 A1 WO2022065437 A1 WO 2022065437A1
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WO
WIPO (PCT)
Prior art keywords
soldering
program
circuit board
printed circuit
soldering work
Prior art date
Application number
PCT/JP2021/035126
Other languages
French (fr)
Japanese (ja)
Inventor
浩介 中島
忍 山本
猛 三村
重登 佐藤
Original Assignee
昭立電気工業株式会社
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Application filed by 昭立電気工業株式会社 filed Critical 昭立電気工業株式会社
Publication of WO2022065437A1 publication Critical patent/WO2022065437A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1656—Programme controls characterised by programming, planning systems for manipulators
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/409—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by using manual data input [MDI] or by using control panel, e.g. controlling functions with the panel; characterised by control panel details or by setting parameters
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/4093—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by part programming, e.g. entry of geometrical information as taken from a technical drawing, combining this with machining and material information to obtain control information, named part programme, for the NC machine
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/42—Recording and playback systems, i.e. in which the programme is recorded from a cycle of operations, e.g. the cycle of operations being manually controlled, after which this record is played back on the same machine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • Patent Document 1 describes means for teaching coordinate data indicating a soldering point, moving speed to the point, moving acceleration, and soldering condition data as required data from a personal computer.
  • the soldering iron is moved to the taught point according to the control program built in in advance, and the soldering conditions are controlled via the soldering unit controller so that the soldering is performed in order. At that time, it is not necessary to input the program using the dedicated language.
  • Patent Document 2 describes a means capable of deriving the coordinate values of the parts to be soldered without the operator individually inputting the coordinate values representing the target positions for soldering.
  • the operator only needs to input the Gerber data of the board and the reference coordinate value indicating the position of the predetermined part on the board, and the derivation part is the position of the part to be soldered on the board with respect to the predetermined part from the Gerber data.
  • the difference coordinate value representing the above can be extracted, and the coordinate value of the part to be soldered can be derived by using the extracted difference coordinate value and the reference coordinate value.
  • the labor of the operator for inputting the target position for soldering can be effectively reduced.
  • a printed circuit board display means a soldering position specifying means for specifying a soldering position to be mounted on the displayed printed circuit board, and a soldering work recording means for recording the soldering positions in the order of soldering work are provided.
  • a soldering work program creation system wherein the soldering position specifying means is provided with a back surface image display means for displaying image information of the back surface of a printed circuit board. Solve the problem.
  • (2) The problem is solved by the soldering work program creation system according to (1), wherein the back surface image display means displays the transmission information of the back surface image information superimposed on the front surface image information. do.
  • a printed circuit board display device a soldering position specifying device for specifying a soldering position to be mounted on the displayed printed circuit board, and a soldering work recording device for recording soldering positions in the order of soldering work are provided.
  • a soldering work program creating device wherein the soldering position specifying device is provided with a back surface image display device for displaying image information of the back surface of a printed circuit board. Solve the problem.
  • the problem is solved by the soldering work program creating device according to (3), wherein the back surface image display device displays the transmission information of the back surface image information superimposed on the front surface image information. do.
  • the problem is solved by a soldering robot equipped with the system according to (1) or (2).
  • the image information of the back surface in addition to the front surface of the printed circuit board is displayed, so the soldering position can be specified quickly and accurately.
  • the configuration of the soldering robot is shown.
  • the program making apparatus in the system of Example 1 is shown.
  • the outline of the whole system of Example 1 is shown.
  • the processing procedure of the display image data creation program in the system of Example 1 is shown.
  • the processing procedure of the board object data creation program in the system of Example 1 is shown.
  • the processing procedure of the program for creating the operation program at the time of implementation in the system of Example 1 is shown.
  • the operation screen of the first embodiment is shown.
  • the operation screen of the first embodiment is shown.
  • the operation screen of the first embodiment is shown.
  • the operation screen of the first embodiment is shown.
  • the operation screen of the first embodiment is shown.
  • the operation screen of the first embodiment is shown.
  • the operation screen of the first embodiment is shown.
  • the operation screen of the first embodiment is shown.
  • the operation screen of the first embodiment is shown.
  • the operation screen of the first embodiment is shown.
  • the operation screen of the first embodiment is shown.
  • the operation screen of the first embodiment is shown. The
  • soldering robot configuration The soldering robot 10 has a known configuration, and as shown in FIG. 1, the soldering robot 10 includes a soldering iron unit 11, a printed circuit board mounting device 12, a driving device 13, and a storage device 14 as main devices.
  • the soldering iron unit 11 is attached to the robot frame via an arm, and moves up and down above the printed circuit board mounting device 12 in order to solder electronic components to the printed circuit board mounted on the printed circuit board mounting device 12. Move freely from side to side.
  • the soldering iron unit 11 includes a heating mechanism, a soldering iron, and a solder supply mechanism (not shown). The soldering iron is heated by the heating mechanism, and the solder supplied from the solder supply mechanism is melted and soldered.
  • the printed circuit board to be mounted with electronic components is placed on the printed circuit board mounting device 12 with the side to be soldered (front side) facing up.
  • the drive device 13 functions for driving any device of the robot.
  • a program for soldering and the like are recorded in the storage device 14.
  • the program creation device 20 includes a display device 21, an input device 22, each program storage device 23, a display image storage device 24, and a board object storage device 25, as shown in FIG. , Existing various data storage devices 26, and operation recording device 27 at the time of soldering.
  • the program creation device 20 creates a program for executing the system of the first embodiment.
  • the program creation device 20 is, for example, a tablet-type computer or the like, and it is desirable that the program creation device 20 can be connected to Internet communication.
  • a program for executing the system of the first embodiment is created through the display by the display device 21 and the input by the input device 22.
  • each program storage device 23 in addition to a general program, a display image data creation program (FIG. 4), a board object data creation program (FIG. 5), The operation program creation program (FIG. 6) at the time of soldering is stored.
  • the display image storage device 24 stores the display image data created by the display image data creation program (FIG. 4).
  • the board object storage device 25 stores the board object data created by the board object data creation program (FIG. 5).
  • the existing various data storage devices 26 store existing data such as tip data, solder work data, solder condition number data, and board preliminary information data.
  • the trowel data is data of various trowels.
  • the soldering work data is data such as soldering work such as point soldering and pulling solder, camera preliminary inspection, calling program, work correction, and the like.
  • the solder condition number data is data about a number indicating the optimum solder condition set according to the tip and preliminary board information (number of layers, plate thickness, etc.).
  • the substrate preliminary information data is the data of the substrate preliminary information such as the surface treatment of the printed circuit board, the thickness of the substrate, the number of layers, and the thickness of the copper foil.
  • the operation storage device 27 at the time of soldering stores the program created by the operation program creation program at the time of soldering (FIG. 6).
  • the system of the first embodiment is a system for creating an operation program used by a soldering robot when soldering an electronic component and a printed circuit board.
  • Create a program according to the following procedure (Fig. 3). 1. 1. Create display image data (front side and back side of printed circuit board) (31) 2. 2. Create board object data (32) 3. 3. Create an operation program for soldering (33) 4. Send to the robot (34)
  • image data for displaying the printed circuit board image data for display
  • data board object data
  • image data for display not only the front side of the printed circuit board but also the back side is used as transparent data, and when plotting the soldering points, the transparent data of the back side is superimposed on the front side and displayed.
  • the program creator can create the program while obtaining the information on the back side.
  • the processing procedure of the program for creating the image data for display is as follows (FIG. 4).
  • the main body of the process is the CPU of the program creation device.
  • the CPU acquires and records the captured image (41, 46).
  • the cropped images other than the printed circuit board are recorded (42, 47).
  • the captured image whose brightness and saturation are adjusted to be easy to see is recorded (43,48).
  • the image adjusted in this way is recorded as an adjusted photographed image (44).
  • the image adjusted in this way is converted into a transparent screen and recorded as an adjusted photographed image (49).
  • the transparent screen is an image in which the background data is made transparent among the image data.
  • the adjusted photographed image (front surface) and the image obtained by converting the adjusted photographed image into a transparent screen (back surface) are recorded in the display image storage device 24 of the program creation device 20.
  • the processing procedure of the program for creating the board object data is as follows (Fig. 5).
  • the main body of the process is the CPU of the program creation device.
  • Board objector data is created for the printed circuit board selected for soldering.
  • information about the selected printed circuit board is acquired (51).
  • the vertical and horizontal dimensions of the selected printed circuit board are acquired (52).
  • the dimensions may be acquired by actual measurement, or may be acquired by using the indication of the dimensions on the printed circuit board itself.
  • preliminary information about the selected printed circuit board is acquired (53).
  • the preliminary information is information on the thickness and the number of layers of the printed circuit board. Information such as the thickness and number of layers of the printed circuit board affects the soldering conditions when soldering electronic components. Therefore, the preliminary information is information necessary for determining the solder condition number.
  • the preliminary information is selected by the program creator from those called from the existing various data storage devices 26 and displayed on the display device 21, and the CPU acquires the information.
  • the coordinate values on the XY coordinates are applied to all the positions on the printed circuit board by the existing means.
  • the data obtained by applying the coordinate values on the XY coordinates to all the positions on the printed circuit board is referred to as a board object (54).
  • the board object is stored in the board object storage device 25 (FIG. 2) (55).
  • the processing procedure of the program for creating the operation program for soldering the electronic component to the printed circuit board is as follows (FIG. 6).
  • the main body of the process is the CPU of the program creation device.
  • the program creator selects the printed circuit board to which the electronic components are to be soldered.
  • the CPU acquires information on the selected printed circuit board (61).
  • the program creator selects the tip information called from the existing various data storage devices 26 (FIG. 2) and displayed on the display device 21, and the CPU acquires and records the information.
  • the recorded trowel information for all work is displayed in the "display of trowel information for all work" shown in process 69.
  • the CPU calls and displays the front side of the display screen corresponding to the printed circuit board selected in process 61 from the skin screen storage device 24 (63).
  • the program creator visually looks at this display screen and plots the soldering position.
  • the CPU acquires and records the coordinate values on the XY coordinates corresponding to the plotted positions as soldering position information (66).
  • the CPU calls and displays the soldering work data from the existing various data storage devices 26.
  • the program author selects the soldering work to be done at the plotted positions.
  • the CPU acquires and records soldering work information (67).
  • the program creator When the program creator wants to refer to the information on the back surface when plotting the soldering position, the program creator instructs the program creation device to display the back surface. Where the plot position and soldering work are determined by the type and position of the mounted component, information that is not displayed on the front surface is displayed on the back surface regarding the type and position of the mounted component. In addition, the copper foil pattern on the back surface is also displayed. The information displayed on the back surface influences the position of the plot and the determination of the soldering work, as the copper foil pattern on the back surface affects how heat is transferred. Therefore, the program creator can determine the plot position in a shorter time and more accurately by referring to the information on the back surface.
  • the CPU When the CPU receives the instruction for displaying the back surface (64), the CPU calls the transparent image of the back surface from the skin screen storage device 24 and displays it on the front surface (65). When the transparent image of the back surface is displayed overlapping with the front surface, the program creator plots the mounting soldering position, and the CPU acquires and records the mounting soldering position information (66).
  • Optimizing is soldering so that the position to be soldered, the soldering work, and the tip to be used are taken into consideration, the shortest moving distance, the number of times the tip is replaced is small, and efficient work can be performed. It is a work to judge the order of work.
  • the CPU receives an optimization instruction, optimizes by existing means, and records (71).
  • the created operation program is sent to the soldering robot that performs the soldering work. That is, the CPU acquires information on the operation program to be transmitted and the soldering robot to which the operation program is transmitted, and sends the operation program to the soldering robot (not shown).
  • FIGS. 7 to 21 will explain the operation program creation work at the time of soldering, which is performed by the display displayed on the display device of the program creation device.
  • the main body of the work is the program creator unless otherwise specified.
  • the screen shown in FIG. 7 is displayed.
  • the substrate displayed here is an image of the front surface of the images stored in the display image storage device 24.
  • the text "Align the border to the corner of the board” is displayed overlapping the image on the front side of the captured image.
  • the border is aligned to the corner of the board according to the instructions indicated by the characters, the image of the front surface other than the printed circuit board is trimmed and removed.
  • tap the "Next" button tap the "Next" button.
  • the screen shown in FIG. 8 is displayed.
  • the screen displayed here is an image of the front surface from which the image other than the printed circuit board is trimmed and removed from the image of the front surface.
  • the captured image of the front surface is recorded in the display image storage device 24 of the program creation device.
  • FIGS. 7 and 8 are displayed in order for the back surface of the captured images. Rotate and adjust the image on the back side as well as the front side, and tap the "Save" button when finished. As a result, the captured image of the back surface is recorded in the display image storage device 24 of the program creation device. The captured image of the back surface is recorded as a transparent image.
  • FIG. 9 The screen shown in FIG. 9 is displayed.
  • the substrate displayed here is an image stored in the display image storage device 24. Select the board to be used from the saved board images. If there is no image to use in the saved board image, tap the "Create new" button. Then, a screen for taking a picture of the board to be used appears (not shown), and the display image creation program is started. When the substrate is photographed, the screens are displayed in the order of FIGS. 7 and 8. After that, the screen shown in FIG. 9 is displayed again. After selecting the image to use, tap the "Next" button.
  • the screen shown in FIG. 10 is displayed.
  • the screen displayed here is the front side of the image selected as the image to be used among the images stored in the display image storage device 24.
  • the screen shown in FIG. 11 is displayed. Obtain the vertical length (Y dimension) of the substrate by measuring it, etc., and input it. Tap the "Next" button.
  • the screen shown in FIG. 12 is displayed.
  • the screen displayed here is stored in various existing data storage devices 26. Enter the surface treatment, substrate thickness, number of substrate layers, and copper foil thickness. Tap the "Next" button.
  • the CPU creates a board object to be used and records it in the board object storage device 25.
  • the screen shown in FIG. 13 is displayed.
  • the screen displayed here is stored in various existing data storage devices 26.
  • the auto tool changer function is a function in which a plurality of types of trowels are set in advance in the soldering iron unit, and a plurality of types of trowels can be changed without changing the trowels.
  • the operator taps the "Yes” button when using the auto tool changer function, and taps the "No” button when not using the auto tool changer function.
  • the screen shown in FIG. 14 is displayed.
  • the screen displayed here is stored in various existing data storage devices 26.
  • the operator selects and taps the trowel to use.
  • three types of trowels can be selected. If you do not use the autosul changer function, you can select one type of trowel.
  • the operator taps the "Next" button when the selection of the trowel is completed.
  • the screen shown in FIG. 15 is displayed.
  • the screen displayed here is an image of the front side of the images stored in the display image storage device 25.
  • the "BOTTOM surface” on the screen means the front surface.
  • tap the point where you want to solder The tapped points are converted into XY coordinate values stored in the board object storage device and recorded in the operation storage device 27 at the time of mounting.
  • tap the "Switch display” button When determining the point of soldering, if you want to check the image of the back surface, tap the "Switch display” button.
  • the screen shown in FIG. 16 is displayed.
  • the screen displayed here is an image in which the transparent image of the corresponding back surface is superimposed on the image of the front surface among the images stored in the display image storage device 25.
  • the "silk surface” on the screen means the back surface. Tap the "Display switching" button to return to the screen shown in FIG. Using the screen shown in FIG. 15 and the screen shown in FIG. 16, tap the point to be soldered.
  • the screen shown in FIG. 17 is displayed.
  • a tapped point is added as a black circle to the screen shown in FIG. 15 as a point for soldering. Display such as "Please select the work content” is shown overlapping. Select the content of the soldering work and tap the "Finish” button.
  • the content of the soldering work is stored in the operation storage device 27 at the time of soldering as the content of the soldering work performed at that point.
  • the points are specified and the soldering work contents are specified for all the points to be soldered.
  • the CPU displays the previous screen, etc., and the program creator can re-specify the mounting points, etc., and edit.
  • the program creator taps the "Save As” button, the CPU displays a screen for naming (not shown), and the CPU uses the name given by the program creator in the operation storage device 27 at the time of mounting. Record.
  • Figure 20 shows an example of the screen displayed when the program creator edits.
  • the screen displayed here is information obtained by processing the information recorded in the operation storage device 27 at the time of mounting into a state that is easy for the program creator to see. That is, information such as the position of each plot and information on the soldering work performed in each plot is recorded in a horizontal row. In addition, the work number immediately before and the work number immediately after each plot are recorded, and the soldering order can be determined.
  • the position of each plot is indicated by the X coordinate, the Y coordinate, the Z coordinate, and the R coordinate. It is a numerical value displayed depending on the R coordinate, line speed, inscribed angle, condition number, and soldering work. Tap the "Back" button to return to the screen shown in FIG.
  • FIG. 21 shows a screen used by an operator to transfer a program to a robot.
  • the program is specified by the type of board and the data number, and the transfer destination is specified by the names such as Unit 1 and Unit 2.
  • the CPU sends the program recorded in the operation storage device 27 at the time of mounting to the robot.
  • Solding robot 11 Soldering iron unit 14 Storage device 20 Program creation device 21
  • Display device 22 Input device 23
  • Each program storage device 24 Display image storage device 25
  • Board object storage device 26 Existing various data storage devices 27 Operation memory during soldering Device 31 Create display image data (front side and back side) 32 Create board object data 33 Create operation program during soldering 34 Send to robot

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  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

[Problem] To provide a system capable of accurately identifying soldering positions within a short time through identification by referring to the back surface of a circuit board in a system or a device for creating a soldering work program. [Solution] This soldering work program creation system is characterized by being provided with: a printed circuit board display means; a soldering position identification means for identifying soldering positions of an object to be mounted on the displayed printed circuit board; and a soldering work recording means for recording the soldering positions in soldering work order. The soldering work program creation system is characterized in that the soldering position identification means is provided with a back surface image display means for displaying image information about the back surface of the printed circuit board.

Description

はんだ付け作業プログラム作成システム、はんだ付け作業プログラム作成装置及びはんだ付ロボットSoldering work program creation system, soldering work program creation device and soldering robot
　電子部品が実装されたプリント基板にはんだ付けを行うはんだ付けロボットのプログラムを作成する際に用いるシステムに関する Regarding the system used when creating a program for a soldering robot that solders to a printed circuit board on which electronic components are mounted.
　電子部品が実装されたプリント基板にはんだ付けを行うはんだ付けロボットのプログラムを効率よく作成する手段が数多く開発されている。 Many means have been developed to efficiently create programs for soldering robots that solder to printed circuit boards on which electronic components are mounted.
　例えば特許文献１には、パソコンから、所要のデータとして、はんだ付けポイントを示す座標データ、そのポイントへの移動速度、移動加速度およびはんだ付け条件データをティーチングする手段が記載されている。この手段により、予め組み込まれている制御用プログラムに従って、ティーチングされたポイントにはんだコテを移動させ、はんだ付けユニットコントローラを介してはんだ条件を制御してはんだ付けを順番に行うようにしており、ティーチングの際に、専用言語を用いたプログラムの入力を不要としている。 For example, Patent Document 1 describes means for teaching coordinate data indicating a soldering point, moving speed to the point, moving acceleration, and soldering condition data as required data from a personal computer. By this means, the soldering iron is moved to the taught point according to the control program built in in advance, and the soldering conditions are controlled via the soldering unit controller so that the soldering is performed in order. At that time, it is not necessary to input the program using the dedicated language.
　また例えば特許文献２には、操作者がはんだ付けの対象位置を表す座標値を個別に入力しなくても、はんだ付けに供される部位の座標値を導出することができる手段が記載されている。操作者は、基板のガーバーデータと、基板における所定部の位置を表す基準座標値を入力すればよく、導出部は、ガーバーデータから、基板におけるはんだ付けに供される部位の、所定部に対する位置を表す差分座標値を抽出し、当該抽出した差分座標値及び基準座標値を用いて、はんだ付けに供される部位の座標値を導出することができる。これにより、はんだ付けの対象位置を入力する操作者の労力を効果的に軽減することができる。 Further, for example, Patent Document 2 describes a means capable of deriving the coordinate values of the parts to be soldered without the operator individually inputting the coordinate values representing the target positions for soldering. There is. The operator only needs to input the Gerber data of the board and the reference coordinate value indicating the position of the predetermined part on the board, and the derivation part is the position of the part to be soldered on the board with respect to the predetermined part from the Gerber data. The difference coordinate value representing the above can be extracted, and the coordinate value of the part to be soldered can be derived by using the extracted difference coordinate value and the reference coordinate value. As a result, the labor of the operator for inputting the target position for soldering can be effectively reduced.
　ところで、プリント基板の「はんだ付けする面」（オモテ面）の裏側（ウラ面）には、実装する電気部品の位置や種類の情報が記載されていることが多い。そこで、はんだ付け作業のプログロム作成の作業者は、プログラム作成中、作業の正誤を確認するために、通常、プリント基板を裏返し、ウラ面に記載された電気部品の位置や種類を確認しながら作業する。このため、ウラ面の確認を効率よく行うことができることが望ましいところ、特許文献１、特許文献２を含め、先行技術に、ウラ面の確認を効率よく行うための思想は見当たらない。 By the way, information on the position and type of electrical components to be mounted is often written on the back side (back side) of the "soldered side" (front side) of the printed circuit board. Therefore, in order to confirm the correctness of the work, the worker who creates the program for the soldering work usually turns the printed circuit board over and checks the position and type of the electric parts written on the back surface. do. Therefore, it is desirable to be able to efficiently confirm the back surface, but there is no idea for efficiently confirming the back surface in the prior art including Patent Document 1 and Patent Document 2.
特開２０００－７５９１２Japanese Patent Application Laid-Open No. 2000-75912 特開２０１９－９８３５８JP-A-2019-98358
　はんだ付け作業プログラムを作成するためのシステムまたは装置において、はんだ付け位置を、基板のウラ面を参照しながら特定することにより、正確に、かつ短時間で特定できるシステムを提供することを課題とする。 In a system or device for creating a soldering work program, it is an object of the present invention to provide a system that can be specified accurately and in a short time by specifying the soldering position with reference to the back surface of the substrate. ..
（１）プリント基板表示手段と、表示された前記プリント基板に実装対象のはんだ付け位置を特定するはんだ付け位置特定手段と、はんだ付け位置をはんだ付け作業順に記録するはんだ付け作業記録手段とを備えたはんだ付け作業プログラム作成システムであって、前記はんだ付け位置特定手段が、プリント基板のウラ面の画像情報を表示するウラ面画像表示手段を備えたことを特徴とするはんだ付け作業プログラム作成システムによって課題を解決する。
（２）前記ウラ面画像表示手段がウラ面の画像情報の透過情報をオモテ面の画像情報と重ねて表示することを特徴とする（１）に記載のはんだ付け作業プログラム作成システムによって課題を解決する。
（３）プリント基板表示装置と、表示された前記プリント基板に実装対象のはんだ付け位置を特定するはんだ付け位置特定装置と、はんだ付け位置をはんだ付け作業順に記録するはんだ付け作業記録装置とを備えたはんだ付け作業プログラム作成装置であって、前記はんだ付け位置特定装置が、プリント基板のウラ面の画像情報を表示するウラ面画像表示装置を備えたことを特徴とするはんだ付け作業プログラム作成装置によって課題を解決する。
（４）前記ウラ面画像表示装置がウラ面の画像情報の透過情報をオモテ面の画像情報と重ねて表示することを特徴とする（３）に記載のはんだ付け作業プログラム作成装置によって課題を解決する。
（５）（１）又は（２）に記載のシステムを備えたはんだ付ロボットによって課題を解決する。 (1) A printed circuit board display means, a soldering position specifying means for specifying a soldering position to be mounted on the displayed printed circuit board, and a soldering work recording means for recording the soldering positions in the order of soldering work are provided. A soldering work program creation system, wherein the soldering position specifying means is provided with a back surface image display means for displaying image information of the back surface of a printed circuit board. Solve the problem.
(2) The problem is solved by the soldering work program creation system according to (1), wherein the back surface image display means displays the transmission information of the back surface image information superimposed on the front surface image information. do.
(3) A printed circuit board display device, a soldering position specifying device for specifying a soldering position to be mounted on the displayed printed circuit board, and a soldering work recording device for recording soldering positions in the order of soldering work are provided. A soldering work program creating device, wherein the soldering position specifying device is provided with a back surface image display device for displaying image information of the back surface of a printed circuit board. Solve the problem.
(4) The problem is solved by the soldering work program creating device according to (3), wherein the back surface image display device displays the transmission information of the back surface image information superimposed on the front surface image information. do.
(5) The problem is solved by a soldering robot equipped with the system according to (1) or (2).
　はんだ付け位置を特定する際に、プリント基板のオモテ面に加えてウラ面の画像情報が表示されるため、はんだ付け位置の特定を、短時間で、かつ正確に行うことができる。 When specifying the soldering position, the image information of the back surface in addition to the front surface of the printed circuit board is displayed, so the soldering position can be specified quickly and accurately.
はんだ付けロボットの構成を示す。The configuration of the soldering robot is shown. 実施例１のシステムにおけるプログラム作成装置を示す。The program making apparatus in the system of Example 1 is shown. 実施例１のシステム全体の概要を示す。The outline of the whole system of Example 1 is shown. 実施例１のシステムにおける表示用画像データ作成プログラムの処理手順を示す。The processing procedure of the display image data creation program in the system of Example 1 is shown. 実施例１のシステムにおける基板オブジェクトデータ作成プログラムの処理手順を示す。The processing procedure of the board object data creation program in the system of Example 1 is shown. 実施例１のシステムにおける実装時の動作プログラム作成のためのプログラムの処理手順を示すThe processing procedure of the program for creating the operation program at the time of implementation in the system of Example 1 is shown. 実施例１の操作画面を示す。The operation screen of the first embodiment is shown. 実施例１の操作画面を示す。The operation screen of the first embodiment is shown. 実施例１の操作画面を示す。The operation screen of the first embodiment is shown. 実施例１の操作画面を示す。The operation screen of the first embodiment is shown. 実施例１の操作画面を示す。The operation screen of the first embodiment is shown. 実施例１の操作画面を示す。The operation screen of the first embodiment is shown. 実施例１の操作画面を示す。The operation screen of the first embodiment is shown. 実施例１の操作画面を示す。The operation screen of the first embodiment is shown. 実施例１の操作画面を示す。The operation screen of the first embodiment is shown. 実施例１の操作画面を示す。The operation screen of the first embodiment is shown. 実施例１の操作画面を示す。The operation screen of the first embodiment is shown. 実施例１の操作画面を示す。The operation screen of the first embodiment is shown. 実施例１の操作画面を示す。The operation screen of the first embodiment is shown. 実施例１の操作画面を示す。The operation screen of the first embodiment is shown. 実施例１の操作画面を示す。The operation screen of the first embodiment is shown.
［はんだ付けロボットの構成］
　はんだ付けロボット１０は公知の構成であり、主な装置として、図１に示す通り、はんだコテユニット１１、プリント基板載置装置１２、駆動装置１３、記憶装置１４を備える。 [Soldering robot configuration]
The soldering robot 10 has a known configuration, and as shown in FIG. 1, the soldering robot 10 includes a soldering iron unit 11, a printed circuit board mounting device 12, a driving device 13, and a storage device 14 as main devices.
　はんだコテユニット１１は、アームを介してロボットの躯体に取り付けてあり、プリント基板載置装置１２に載置されたプリント基板に電子部品をはんだ付けするべく、プリント基板載置装置１２の上方を上下左右に自在に移動する。はんだコテユニット１１は、加熱機構とはんだコテとはんだ供給機構を備える（図示せず）。はんだコテが加熱機構により加熱され、はんだ供給機構から供給されるはんだが溶融されてはんだ付けが行われる。 The soldering iron unit 11 is attached to the robot frame via an arm, and moves up and down above the printed circuit board mounting device 12 in order to solder electronic components to the printed circuit board mounted on the printed circuit board mounting device 12. Move freely from side to side. The soldering iron unit 11 includes a heating mechanism, a soldering iron, and a solder supply mechanism (not shown). The soldering iron is heated by the heating mechanism, and the solder supplied from the solder supply mechanism is melted and soldered.
　はんだ付けの際は、プリント基板載置装置１２に、電子部品を実装する対象のプリント基板を、はんだ付けする面（オモテ面）を上に向けて載置する。駆動装置１３は、ロボットのあらゆる装置の駆動のために機能する。記憶装置１４には、はんだ付けのためのプログラム等が記録されている。 At the time of soldering, the printed circuit board to be mounted with electronic components is placed on the printed circuit board mounting device 12 with the side to be soldered (front side) facing up. The drive device 13 functions for driving any device of the robot. A program for soldering and the like are recorded in the storage device 14.
［プログラム作成装置の構成］
　プログラム作成装置２０は、プログラム作成のための一般的な装置に加え、図２に示す通り、表示装置２１、入力装置２２、各プログラム記憶装置２３、表示用画像記憶装置２４、基板オブジェクト記憶装置２５、既存各種データ記憶装置２６、はんだ付け時の動作記億装置２７、を備える。 [Configuration of program creation device]
In addition to a general device for creating a program, the program creation device 20 includes a display device 21, an input device 22, each program storage device 23, a display image storage device 24, and a board object storage device 25, as shown in FIG. , Existing various data storage devices 26, and operation recording device 27 at the time of soldering.
　プログラム作成装置２０は、実施例１のシステムを実行するためのプログラムを作成する。プログラム作成装置２０は例えばタブレット型のコンピュータ等であり、インターネット通信に接続できることが望ましい。表示装置２１による表示と入力装置２２による入力を介して実施例１のシステムを実行するためのプログラムが作成される。 The program creation device 20 creates a program for executing the system of the first embodiment. The program creation device 20 is, for example, a tablet-type computer or the like, and it is desirable that the program creation device 20 can be connected to Internet communication. A program for executing the system of the first embodiment is created through the display by the display device 21 and the input by the input device 22.
　各プログラム記憶装置２３には、一般的なプログラムに加え、表示用画像データ作成プログラム（図４）、基板オブジェクトデータ作成プログラム（図５）、
はんだ付け時の動作プログラム作成プログラム（図６）が記憶される。 In each program storage device 23, in addition to a general program, a display image data creation program (FIG. 4), a board object data creation program (FIG. 5),
The operation program creation program (FIG. 6) at the time of soldering is stored.
　表示用画像記憶装置２４には、表示用画像データ作成プログラム（図４）によって作成された表示用画像データが記憶される。 The display image storage device 24 stores the display image data created by the display image data creation program (FIG. 4).
　基板オブジェクト記憶装置２５には、基板オブジェクトデータ作成プログラム（図５）によって作成された基板オブジェクトデータが記憶される。 The board object storage device 25 stores the board object data created by the board object data creation program (FIG. 5).
　既存各種データ記憶装置２６には、こて先データ、はんだ作業データ、はんだ条件番号データ、基板予備情報データ、等の既存のデータが記憶される。こて先データとは、各種のこて先のデータである。はんだ作業データとは、点はんだ、引きはんだ等のはんだ作業、および、カメラ予備検査、呼び出しプログラム、ワーク補正、等のデータである。はんだ条件番号データとは、こて先や基板予備情報（層数、板厚等）に応じて設定された最適なはんだ条件を示す番号についてのデータである。基板予備情報データとは、プリント基板の表面処理、基板の厚さ、層数、銅箔の厚さ、等の基板予備情報のデータである。 The existing various data storage devices 26 store existing data such as tip data, solder work data, solder condition number data, and board preliminary information data. The trowel data is data of various trowels. The soldering work data is data such as soldering work such as point soldering and pulling solder, camera preliminary inspection, calling program, work correction, and the like. The solder condition number data is data about a number indicating the optimum solder condition set according to the tip and preliminary board information (number of layers, plate thickness, etc.). The substrate preliminary information data is the data of the substrate preliminary information such as the surface treatment of the printed circuit board, the thickness of the substrate, the number of layers, and the thickness of the copper foil.
　はんだ付け時の動作記憶装置２７にははんだ付け時の動作プログラム作成プログラム（図６）によって作成されたプログラムが記憶される。 The operation storage device 27 at the time of soldering stores the program created by the operation program creation program at the time of soldering (FIG. 6).
［システムの概要］
　実施例１のシステムは、はんだ付けロボットが電子部品とプリント基板をはんだ付けする際に用いる動作プログラムを作成するシステムである。次の手順でプログラムを作成する（図３）。
１．表示用画像データ(プリント基板のオモテ面とウラ面)を作成する（３１）
２．基板オブジェクトデータを作成する（３２）
３．はんだ付け時の動作プログラムを作成する（３３）
４．ロボットに送信する（３４） [System overview]
The system of the first embodiment is a system for creating an operation program used by a soldering robot when soldering an electronic component and a printed circuit board. Create a program according to the following procedure (Fig. 3).
1. 1. Create display image data (front side and back side of printed circuit board) (31)
2. 2. Create board object data (32)
3. 3. Create an operation program for soldering (33)
4. Send to the robot (34)
　ロボットと隔離された装置を用いて動作プログラムを作成し（上記１から３）、完成した動作プログラムをロボットに送信する（上記４）。 Create an operation program using a device isolated from the robot (1 to 3 above), and send the completed operation program to the robot (4 above).
　予め、プリント基板を表示するための画像データ（表示用画像データ）と、実装箇所を電子的に特定し保存することを可能にしたデータ（基板オブジェクトデータ）を作成しておき（上記１と２）、はんだ付け時の動作プログラムを作成する際に、これらの二つのデータを用いる（上記３）。表示用画像データとして、プリント基板のオモテ面のみならずウラ面を透過データとしたデータも作成し、はんだ付け箇所をプロットする際に、ウラ面の透過データをオモテ面に重ねて表示することにより、プログラム作成者は、プログラム作成を、ウラ面の情報を得ながら行うことができる。 In advance, image data for displaying the printed circuit board (image data for display) and data (board object data) that enables the mounting location to be electronically specified and saved are created (1 and 2 above). ), These two data are used when creating the operation program at the time of soldering (3 above). As image data for display, not only the front side of the printed circuit board but also the back side is used as transparent data, and when plotting the soldering points, the transparent data of the back side is superimposed on the front side and displayed. , The program creator can create the program while obtaining the information on the back side.
［表示用画像データ作成プログラム］
　表示用画像データ作成のためのプログラムの処理手順は次の通りである（図４）。処理の主体はプログラム作成装置のＣＰＵである。まず、カメラでプリント基板のオモテ面とウラ面を写真撮影する。ＣＰＵは撮影画像を取得して記録する（４１、４６）。次に、撮影画像のうちプリント基板以外の画像がトリミングされたものを記録する（４２，４７）。次に、撮影画像の明度と彩度が見易いものに調整されたものを記録する（４３，４８）。オモテ面については、そのように調整された画像を調整済み撮影画像として記録する（４４）。次に、ウラ面については、そのように調整された画像を透過画面に変換して、調整済み撮影画像として記録する（４９）。透過画面とは、画像データのうち背景データを透明にした画像である。調整済み撮影画像（オモテ面）と調整済み撮影画像を透過画面に変換した画像（ウラ面）を、プログラム作成装置２０の表示画像記憶装置２４に記録する。 [Display image data creation program]
The processing procedure of the program for creating the image data for display is as follows (FIG. 4). The main body of the process is the CPU of the program creation device. First, take a picture of the front side and the back side of the printed circuit board with a camera. The CPU acquires and records the captured image (41, 46). Next, among the captured images, the cropped images other than the printed circuit board are recorded (42, 47). Next, the captured image whose brightness and saturation are adjusted to be easy to see is recorded (43,48). For the front surface, the image adjusted in this way is recorded as an adjusted photographed image (44). Next, with respect to the back surface, the image adjusted in this way is converted into a transparent screen and recorded as an adjusted photographed image (49). The transparent screen is an image in which the background data is made transparent among the image data. The adjusted photographed image (front surface) and the image obtained by converting the adjusted photographed image into a transparent screen (back surface) are recorded in the display image storage device 24 of the program creation device 20.
［基板オブジェクタデータ作成プログラム］
　基板オブジェクタデータ作成のためのプログラムの処理手順は次の通りである（図５）。処理の主体はプログラム作成装置のＣＰＵである。基板オブジェクタデータは、はんだ付けする対象として選択されたプリント基板について作成される。まず、選択されたプリント基板についての情報を取得する（５１）。次に、選択されたプリント基板の縦方向の寸法と横方向の寸法を取得する（５２）。寸法は、実測により取得しても良いし、プリント基板自体に寸法の表示がありそれを利用して取得しても良い。次に、選択されたプリント基板についての予備情報を取得する（５３）。予備情報とは、プリント基板の厚さや層数に関する情報である。プリント基板の厚さや層数といった情報は、電子部品をはんだ付けする際のはんだ条件に影響を与える。このため、予備情報ははんだ条件番号を決定するために必要な情報である。予備情報は、プログラウ作成者が、既存各種データ記憶装置２６から呼び出されて表示装置２１に表示されたものから、プログラム作成者が選択し、ＣＰＵはその情報を取得する。 [Board object data creation program]
The processing procedure of the program for creating the board object data is as follows (Fig. 5). The main body of the process is the CPU of the program creation device. Board objector data is created for the printed circuit board selected for soldering. First, information about the selected printed circuit board is acquired (51). Next, the vertical and horizontal dimensions of the selected printed circuit board are acquired (52). The dimensions may be acquired by actual measurement, or may be acquired by using the indication of the dimensions on the printed circuit board itself. Next, preliminary information about the selected printed circuit board is acquired (53). The preliminary information is information on the thickness and the number of layers of the printed circuit board. Information such as the thickness and number of layers of the printed circuit board affects the soldering conditions when soldering electronic components. Therefore, the preliminary information is information necessary for determining the solder condition number. The preliminary information is selected by the program creator from those called from the existing various data storage devices 26 and displayed on the display device 21, and the CPU acquires the information.
　次に、寸法情報と予備情報に基づいて、既存の手段により、プリント基板上の全ての位置に、ＸＹ座標上の座標値をあてはめる。プリント基板上の全ての位置に、ＸＹ座標上の座標値をあてはめたデータを基板オブジェクトと称す（５４）。基板オブジェクトを基板オブジェクト記憶装置２５（図２）に記憶する（５５）。 Next, based on the dimensional information and preliminary information, the coordinate values on the XY coordinates are applied to all the positions on the printed circuit board by the existing means. The data obtained by applying the coordinate values on the XY coordinates to all the positions on the printed circuit board is referred to as a board object (54). The board object is stored in the board object storage device 25 (FIG. 2) (55).
［はんだ付け時の動作プログラム作成プログラム］
　プリント基板に電子部品をはんだ付けする際の動作プログラムを作成するためのプログラムの処理手順は次の通りである（図６）。処理の主体はプログラム作成装置のＣＰＵである。まず、プログラム作成者が電子部品をはんだ付けする対象のプリント基板を選択する。ＣＰＵは選択されたプリント基板の情報を取得する（６１）。 [Soldering operation program creation program]
The processing procedure of the program for creating the operation program for soldering the electronic component to the printed circuit board is as follows (FIG. 6). The main body of the process is the CPU of the program creation device. First, the program creator selects the printed circuit board to which the electronic components are to be soldered. The CPU acquires information on the selected printed circuit board (61).
　次に、処理の６１で選択されたプリント基板に全ての電子部品を取り付けるにあたり使用する全てのコテ先の情報を取得し記録する（６２）。具体的には、既存各種データ記憶装置２６（図２）から呼び出されて表示装置２１に表示されたこて先情報らプログラム作成者が選択し、ＣＰＵはその情報を取得し記録する。記録された全作業の使用こて情報は、処理の６９で示された「全作業の使用こて情報表示」において表示される。 Next, the information of all the iron tips used for attaching all the electronic components to the printed circuit board selected in process 61 is acquired and recorded (62). Specifically, the program creator selects the tip information called from the existing various data storage devices 26 (FIG. 2) and displayed on the display device 21, and the CPU acquires and records the information. The recorded trowel information for all work is displayed in the "display of trowel information for all work" shown in process 69.
　次に、ＣＰＵは、処理の６１で選択されたプリント基板に対応する表示画面のうちオモテ面を表皮画面記憶装置２４から呼び出し表示する（６３）。プログラム作成者は、この表示画面を目視してはんだ付け位置をプロットする。ＣＰＵは、プロットされた位置に対応するＸＹ座標上の座標値をはんだ付け位置情報として取得し記録する（６６）。 Next, the CPU calls and displays the front side of the display screen corresponding to the printed circuit board selected in process 61 from the skin screen storage device 24 (63). The program creator visually looks at this display screen and plots the soldering position. The CPU acquires and records the coordinate values on the XY coordinates corresponding to the plotted positions as soldering position information (66).
　次にＣＰＵは既存各種データ記憶装置２６からはんだ作業データを呼び出し表示する。プログラム作成者は、プロットした位置に行うべきはんだ作業を選択する。ＣＰＵははんだ作業情報を取得し、記録する（６７）。 Next, the CPU calls and displays the soldering work data from the existing various data storage devices 26. The program author selects the soldering work to be done at the plotted positions. The CPU acquires and records soldering work information (67).
　プログラム作成者は、はんだ付け位置をプロットするに際し、ウラ面の情報を参照したいと考えた場合には、プログラム作成装置に、ウラ面を表示するよう指示する。実装部品の種類と位置によりプロット位置とはんだ作業が決定されるところ、ウラ面には、実装部品の種類と位置に関し、オモテ面には表示されていない情報が表示されている。また、ウラ面の銅箔パターンも表示されている。ウラ面の銅箔パターンは熱の伝わり方に影響を与えるため、ウラ面に表示された情報は、プロットの位置とはんだ作業の決定に影響を与える。このため、プログラム作成者はウラ面の情報を参照することより、より短時間にかつより正確にプロット位置を決定することができる。ＣＰＵはウラ面表示の指示を受け取ると（６４）、ウラ面の透過画像を表皮画面記憶装置２４から呼び出しオモテ面に重ねて表示する（６５）。ウラ面の透過画像がオモテ面と重複させて表示されると、プログラム作成者は、実装はんだ付け位置をプロットし、ＣＰＵはこれにより実装はんだ付け位置情報を取得し記録する（６６）。 When the program creator wants to refer to the information on the back surface when plotting the soldering position, the program creator instructs the program creation device to display the back surface. Where the plot position and soldering work are determined by the type and position of the mounted component, information that is not displayed on the front surface is displayed on the back surface regarding the type and position of the mounted component. In addition, the copper foil pattern on the back surface is also displayed. The information displayed on the back surface influences the position of the plot and the determination of the soldering work, as the copper foil pattern on the back surface affects how heat is transferred. Therefore, the program creator can determine the plot position in a shorter time and more accurately by referring to the information on the back surface. When the CPU receives the instruction for displaying the back surface (64), the CPU calls the transparent image of the back surface from the skin screen storage device 24 and displays it on the front surface (65). When the transparent image of the back surface is displayed overlapping with the front surface, the program creator plots the mounting soldering position, and the CPU acquires and records the mounting soldering position information (66).
　はんだ付け位置情報の取得・記録が、全てのはんだ付け位置について行われるまで、この作業は繰り返される（６８）。全てのはんだ付け位置が記録されると（６８）、次に、全作業の使用こて情報が表示される（６９）。プログラム作成者は、はんだ付け位置毎に使用するこてを決定する。ＣＰＵははんだ付け位置毎の使用こて情報を取得し、記録する（７０）。 This work is repeated until the acquisition and recording of the soldering position information is performed for all the soldering positions (68). Once all soldering positions have been recorded (68), trowel information for all operations is then displayed (69). The program creator decides which trowel to use for each soldering position. The CPU acquires and records the trowel information for each soldering position (70).
　次にプログラム作成者はプログラム作成装置に最適化を行うよう指示する。最適化とは、はんだ付けするべき位置とはんだ作業、使用するこて先、を鑑み、最短の移動距離で、かつ、こて先の交換回数を少なく、効率的な作業ができるよう、はんだ付け作業の順番を判断する作業である。ＣＰＵは、最適化の指示を受け、既存の手段で最適化を行い、記録する（７１）。 Next, the program creator instructs the program creator to perform optimization. Optimizing is soldering so that the position to be soldered, the soldering work, and the tip to be used are taken into consideration, the shortest moving distance, the number of times the tip is replaced is small, and efficient work can be performed. It is a work to judge the order of work. The CPU receives an optimization instruction, optimizes by existing means, and records (71).
　次に、作成された動作プログラムは、はんだ付け作業を行うはんだ付けロボットに送られる。すなわち、ＣＰＵは、送信対象の動作プログラムと、動作プログラムの送信先であるはんだ付けロボットの情報を取得し、動作プログラムをはんだ付けロボットに送る（図示せず）。 Next, the created operation program is sent to the soldering robot that performs the soldering work. That is, the CPU acquires information on the operation program to be transmitted and the soldering robot to which the operation program is transmitted, and sends the operation program to the soldering robot (not shown).
　図７から図２１により、プログラム作成装置の表示装置に表示された表示により行われる、はんだ付け時の動作プログラム作成作業を説明する。図７から図２１において、作業の主体は特段の記載がない限りプログラム作成者である。 FIGS. 7 to 21 will explain the operation program creation work at the time of soldering, which is performed by the display displayed on the display device of the program creation device. In FIGS. 7 to 21, the main body of the work is the program creator unless otherwise specified.
［操作１　表示用画像データ（オモテ面とウラ面）作成］
　プログラム作成者は、実装対象のプリント基板のオモテ面とウラ面をカメラで撮影する（図示せず）。カメラはプログラム作成装置に内蔵されていてもよいし、プログラム作成装置と別体でもよい。カメラがプログラム作成装置と別体の場合には、撮影画像をプログラム作成装置に送る。 [Operation 1 Create display image data (front side and back side)]
The program creator photographs the front side and back side of the printed circuit board to be mounted with a camera (not shown). The camera may be built in the program creation device or may be separate from the program creation device. If the camera is separate from the program creation device, the captured image is sent to the program creation device.
　図７に示す画面が表示される。ここで表示される基板は表示画像記憶装置２４に記憶された画像のうち、オモテ面の画像である。「枠線を基板の角まで合わせて下さい」の文字が、撮影画像のうちオモテ面の画像の上にオーバーラップして表示されている。文字で示された指示に従い、枠線を基板の角まで合わせると、オモテ面の画像のうちプリント基板以外の画像がトリミングされて取り除かれる。取り除き作業が終了したら「次へ」のボタンをタップする。 The screen shown in FIG. 7 is displayed. The substrate displayed here is an image of the front surface of the images stored in the display image storage device 24. The text "Align the border to the corner of the board" is displayed overlapping the image on the front side of the captured image. When the border is aligned to the corner of the board according to the instructions indicated by the characters, the image of the front surface other than the printed circuit board is trimmed and removed. When the removal work is completed, tap the "Next" button.
　図８に示す画面が表示される。ここで表示される画面はオモテ面の画像のうちプリント基板以外の画像がトリミングされて取り除かれたオモテ面の画像である。「回転」のボタンを左右に移動させ、画像の傾斜がなくなるように回転させる。「明度」「彩度」のボタンを左右に移動させ、画像が見易くなるよう明度と彩度を調節する。回転と調節が終了したら「保存」のボタンをタップする。これにより、オモテ面の撮影画像がプログラム作成装置の表示画像記憶装置２４に記録される。 The screen shown in FIG. 8 is displayed. The screen displayed here is an image of the front surface from which the image other than the printed circuit board is trimmed and removed from the image of the front surface. Move the "Rotate" button left and right to rotate the image so that it is not tilted. Move the "Brightness" and "Saturation" buttons left and right to adjust the brightness and saturation so that the image is easier to see. Tap the "Save" button when rotation and adjustment are complete. As a result, the captured image of the front surface is recorded in the display image storage device 24 of the program creation device.
　撮影画像のうちウラ面についても、図７と図８に示す画像が順に表示される。ウラ面についてもオモテ面と同様に画像の回転と調節を行い、終了したら「保存」のボタンをタップする。これにより、ウラ面の撮影画像がプログラム作成装置の表示画像記憶装置２４に記録される。ウラ面の撮影画像は、透過画像として記録される。 The images shown in FIGS. 7 and 8 are displayed in order for the back surface of the captured images. Rotate and adjust the image on the back side as well as the front side, and tap the "Save" button when finished. As a result, the captured image of the back surface is recorded in the display image storage device 24 of the program creation device. The captured image of the back surface is recorded as a transparent image.
［操作２　基板オブジェクトデータ作成］
　図９に示す画面が表示される。ここで表示される基板は表示画像記憶装置２４に記憶された画像である。保存された基板画像から、使用する基板を選択する。保存された基板画像の中に使用する画像がない場合には「新規作成」のボタンをタップする。そうすると、使用する基板を撮影するための画面が現れ（図示せず）、表示用画像作成プログラムが起動する。基板の撮影を行うと、次に図７、図８の順に画面が表示される。その後、再び図９に示す画面が表示される。使用する画像の選択が終了したら「次へ」のボタンをタップする。 [Operation 2 Create board object data]
The screen shown in FIG. 9 is displayed. The substrate displayed here is an image stored in the display image storage device 24. Select the board to be used from the saved board images. If there is no image to use in the saved board image, tap the "Create new" button. Then, a screen for taking a picture of the board to be used appears (not shown), and the display image creation program is started. When the substrate is photographed, the screens are displayed in the order of FIGS. 7 and 8. After that, the screen shown in FIG. 9 is displayed again. After selecting the image to use, tap the "Next" button.
　図１０に示す画面が表示される。ここで表示される画面は表示画像記憶装置２４に記憶された画像のうち、使用する画像として選択された画像のオモテ面である。基板の横の長さ（Ｘ寸法）を、計測する等して得て、入力する。「次へ」のボタンをタップする。 The screen shown in FIG. 10 is displayed. The screen displayed here is the front side of the image selected as the image to be used among the images stored in the display image storage device 24. Obtain the horizontal length (X dimension) of the board by measuring it, etc., and input it. Tap the "Next" button.
　図１１に示す画面が表示される。基板の縦の長さ（Ｙ寸法）を、計測する等して得て、入力する。「次へ」のボタンをタップする。 The screen shown in FIG. 11 is displayed. Obtain the vertical length (Y dimension) of the substrate by measuring it, etc., and input it. Tap the "Next" button.
　図１２に示す画面が表示される。ここで表示される画面は既存各種データ記憶装置２６に記憶されている。表面処理、基板の厚さ、基板の層数、銅箔の厚さ、を入力する。「次へ」のボタンをタップする。ＣＰＵは、使用対象の基板オブジェクトを作成し、基板オブジェクト記憶装置２５に記録する。 The screen shown in FIG. 12 is displayed. The screen displayed here is stored in various existing data storage devices 26. Enter the surface treatment, substrate thickness, number of substrate layers, and copper foil thickness. Tap the "Next" button. The CPU creates a board object to be used and records it in the board object storage device 25.
　図１３に示す画面が表示される。ここで表示される画面は既存各種データ記憶装置２６に記憶されている。オートツールチェンジャー機能とは、はんだコテユニットに予め複数種類のこて先がセットされてあり、複数種類のこて先を、こて先を付け替えることなくチェンジできる機能である。操作者は、オートツールチェンジャー機能を使用する場合には「はい」のボタンをタップし、オートツールチェンジャー機能を使用しない場合には「いいえ」のボタンをタップする。 The screen shown in FIG. 13 is displayed. The screen displayed here is stored in various existing data storage devices 26. The auto tool changer function is a function in which a plurality of types of trowels are set in advance in the soldering iron unit, and a plurality of types of trowels can be changed without changing the trowels. The operator taps the "Yes" button when using the auto tool changer function, and taps the "No" button when not using the auto tool changer function.
　図１４に示す画面が表示される。ここで表示される画面は既存各種データ記憶装置２６に記憶されている。操作者は使用するこて先を選択しタップする。オートツールチェンジャー機能を使用する場合には３種類のこて先を選択できる。オートスールチェンジャー機能を使用しない場合には１種類のこて先を選択できる。　操作者は、こて先の選択が終了すると「次へ」のボタンをタップする。 The screen shown in FIG. 14 is displayed. The screen displayed here is stored in various existing data storage devices 26. The operator selects and taps the trowel to use. When using the auto tool changer function, three types of trowels can be selected. If you do not use the autosul changer function, you can select one type of trowel. The operator taps the "Next" button when the selection of the trowel is completed.
　図１５に示す画面が表示される。ここで表示される画面は表示画像記憶装置２５に記憶された画像のうちオモテ面の画像である。画面上の「ＢＯＴＴＯＭ面」とはオモテ面を意味する。画面上で、はんだ付けを行うポイントをタップする。タップされたポイントは、基板オブジェクト記憶装置に記憶されたＸＹ座標値に変換されて実装時の動作記憶装置２７に記録される。はんだ付けを行うポイントを判断するにあたり、ウラ面の画像を確認したいと考えたときには、「表示切替」のボタンをタップする。「表示切替」のボタンをタップすると図１６に示す画面が表示される。ここで表示される画面は、表示画像記憶装置２５に記憶された画像のうちオモテ面の画像に、対応するウラ面の透過画像が重ねて表示された画像である。画面上の「シルク面」とはウラ面を意味する。「表示切替」のボタンをタップすると図１５に示す画面に戻る。図１５に示す画面と図１６に示す画面を用いて、はんだ付けを行うポイントをタップする。 The screen shown in FIG. 15 is displayed. The screen displayed here is an image of the front side of the images stored in the display image storage device 25. The "BOTTOM surface" on the screen means the front surface. On the screen, tap the point where you want to solder. The tapped points are converted into XY coordinate values stored in the board object storage device and recorded in the operation storage device 27 at the time of mounting. When determining the point of soldering, if you want to check the image of the back surface, tap the "Switch display" button. When the "display switching" button is tapped, the screen shown in FIG. 16 is displayed. The screen displayed here is an image in which the transparent image of the corresponding back surface is superimposed on the image of the front surface among the images stored in the display image storage device 25. The "silk surface" on the screen means the back surface. Tap the "Display switching" button to return to the screen shown in FIG. Using the screen shown in FIG. 15 and the screen shown in FIG. 16, tap the point to be soldered.
　図１７に示す画面が表示される。ここで表示される画面では、図１５に示した画面に、はんだ付けを行うポイントとしてタップした箇所が黒丸で追加されて示されている。「作業内容を選んでください」等の表示が、オーバーラップして示されている。はんだ作業の内容を選択し、「完了」のボタンをタップする。はんだ作業の内容は、そのポイントで行うはんだ作業内容としてはんだ付け時の動作記憶装置２７に記憶される。図１５から図１７に示す画面を用いて、はんだ付けを行う全てのポイントについて、ポイントの指定とはんだ作業内容の指定を行う。 The screen shown in FIG. 17 is displayed. In the screen displayed here, a tapped point is added as a black circle to the screen shown in FIG. 15 as a point for soldering. Display such as "Please select the work content" is shown overlapping. Select the content of the soldering work and tap the "Finish" button. The content of the soldering work is stored in the operation storage device 27 at the time of soldering as the content of the soldering work performed at that point. Using the screens shown in FIGS. 15 to 17, the points are specified and the soldering work contents are specified for all the points to be soldered.
　全てのポイントについてポイントの指定をはんだ作業内容の指定が終了すると、操作者は、「完了」をタップする。図１７に示す画面で「完了」がタップされると、図１８に示す画面が表示される。ここで表示される画面は、表示画像記憶装置２５に記憶されており、画像のうちオモテ面の画像に、はんだ付けを行う全てのポイントが黒丸で追加されて示されている。各ポイントで使用するこて先を、ポイントごとに割り当てて指定する。こて先を割り当てる作業中に、はんだ付けを行うポイントの誤りに気付いた際等、編集したいと考えた場合には「編集」のボタンをタップする。「編集」のボタンをタップすると、直前の画面等が表示され、編集することができる。各ポイントで使用するこて先ははんだ付け時の動作記憶装置２７に記録される。操作者は、全てのポイントについて使用するこて先を指定し終えると、「完了」のボタンをタップする。 Specifying points for all points Soldering After specifying the work content, the operator taps "Done". When "Done" is tapped on the screen shown in FIG. 17, the screen shown in FIG. 18 is displayed. The screen displayed here is stored in the display image storage device 25, and all the points to be soldered are added to the image of the front surface of the image by black circles. The destination to be used at each point is assigned and specified for each point. If you notice an error in the soldering point while allocating the tip, and want to edit it, tap the "Edit" button. When you tap the "Edit" button, the previous screen etc. is displayed and you can edit it. The tip used at each point is recorded in the operation storage device 27 at the time of soldering. When the operator finishes specifying the destination to be used for all points, he / she taps the "Done" button.
　図１８に示す画面で「完了」がタップされると、図１９に示す画面が表示される。プログラム作成者が「最適化」のボタンをタップすると、ＣＰＵは最適化を開始する。「最適化」は、既存の手段により行われる。「最適化」によって、はんだ付け作業が効率よく行われるよう、はんだ付けの順序が定まる。効率がよいとは、例えば、はんだ付けの箇所については、はんだコテユニットの移動はできる限り少なくなるようにされる。また、こての種類については、こての交換ができる限り少なくなるようにされる。作業については、同じ作業が繰り返されるようにされる。そのような観点で、はんだ付け作業の順番が定められる。 When "Done" is tapped on the screen shown in FIG. 18, the screen shown in FIG. 19 is displayed. When the program creator taps the "optimize" button, the CPU starts optimization. "Optimization" is performed by existing means. "Optimization" determines the order of soldering so that the soldering work can be done efficiently. Efficient means, for example, that the movement of the soldering iron unit is minimized at the soldering point. Also, regarding the types of trowels, the number of trowel replacements will be reduced as much as possible. As for the work, the same work is repeated. From such a viewpoint, the order of soldering work is determined.
　プログラム作成者が「編集」のボタンをタップすると、ＣＰＵは直前の画面等を表示し、プログラム作成者は実装ポイントの指定等をやり直し、編集することができる。プログラム作成者が「名前を付けて保存」のボタンをタップすると、ＣＰＵは名前を付ける画面を表示し（図示せず）、ＣＰＵはプログラム作成者が付けた名前で実装時の動作記憶装置２７に記録する。 When the program creator taps the "Edit" button, the CPU displays the previous screen, etc., and the program creator can re-specify the mounting points, etc., and edit. When the program creator taps the "Save As" button, the CPU displays a screen for naming (not shown), and the CPU uses the name given by the program creator in the operation storage device 27 at the time of mounting. Record.
　図２０にプログラム作成者が編集する際に表示される画面の例を表示する。ここで表示される画面は、実装時の動作記憶装置２７に記録されている情報を、プログラム作成者が見易い状態に加工した情報である。すなわち、各プロットの位置と、各プロットで行うはんだ作業の情報等の情報が横一列に記録されている。また、各プロットの直前の作業番号と直後の作業番号が記録されており、はんだ付けの順番が判断できる。各プロットの位置は、Ｘ座標、Ｙ座標、Ｚ座標、Ｒ座標で示される。Ｒ座標、線速度、円周角度、条件番号、はんだ付け作業次第で表示される数値である。「戻る」のボタンをタップすると、図１９に示す画面に戻る。 Figure 20 shows an example of the screen displayed when the program creator edits. The screen displayed here is information obtained by processing the information recorded in the operation storage device 27 at the time of mounting into a state that is easy for the program creator to see. That is, information such as the position of each plot and information on the soldering work performed in each plot is recorded in a horizontal row. In addition, the work number immediately before and the work number immediately after each plot are recorded, and the soldering order can be determined. The position of each plot is indicated by the X coordinate, the Y coordinate, the Z coordinate, and the R coordinate. It is a numerical value displayed depending on the R coordinate, line speed, inscribed angle, condition number, and soldering work. Tap the "Back" button to return to the screen shown in FIG.
［操作４　ロボットに送信］
　図２１に、作業者がプログラムをロボットに転送する際に用いる画面をしめす。基板の種類とデータ番号によりプログラムが特定されており、１号機、２号機、といった名称で転送先が特定されている。作業者が「転送開始」のボタンをタップすると、ＣＰＵは実装時の動作記憶装置２７に記録されたプログラムをロボットに送る。 [Operation 4 Send to robot]
FIG. 21 shows a screen used by an operator to transfer a program to a robot. The program is specified by the type of board and the data number, and the transfer destination is specified by the names such as Unit 1 and Unit 2. When the operator taps the "transfer start" button, the CPU sends the program recorded in the operation storage device 27 at the time of mounting to the robot.
１０　はんだ付けロボット
１１　はんだコテユニット
１４　記憶装置
２０　プログラム作成装置
２１　表示装置
２２　入力装置
２３　各プログラム記憶装置
２４　表示用画像記憶装置
２５　基板オブジェクト記憶装置
２６　既存各種データ記憶装置
２７　はんだ付け時の動作記憶装置
３１　表示用画像データ（オモテ面とウラ面）作成
３２　基板オブジェクトデータ作成
３３　はんだ付け時の動作プログラム作成
３４　ロボットに送信 10 Solding robot 11 Soldering iron unit 14 Storage device 20 Program creation device 21 Display device 22 Input device 23 Each program storage device 24 Display image storage device 25 Board object storage device 26 Existing various data storage devices 27 Operation memory during soldering Device 31 Create display image data (front side and back side) 32 Create board object data 33 Create operation program during soldering 34 Send to robot

Claims (3)

  1. プリント基板表示手段と、
    表示された前記プリント基板において実装対象のはんだ付け位置を特定するはんだ付け位置特定手段と、
    表示された前記プリント基板において実装対象のはんだ作業を特定するはんだ作業特定手段と、
    はんだ付け位置とはんだ作業をはんだ付け作業順に記録するはんだ付け作業記録手段とを備えたはんだ付け作業プログラム作成システムであって、
    実装対象をはんだ付けする面であるオモテ面の画像情報に、
    オモテ面の裏側であり実装部品の位置や種類の情報が記録されたウラ面の画像情報の透過情報を重ねて表示するウラ面画像表示手段を備えており、
    ウラ面の画像情報とオモテ面の画像情報がはんだ付け位置の特定とはんだ作業の特定に用いられることを特徴とするはんだ付け作業プログラム作成システム。     Printed circuit board display means and
    The soldering position specifying means for specifying the soldering position to be mounted on the displayed printed circuit board, and the soldering position specifying means.
    A soldering work specifying means for specifying the soldering work to be mounted on the displayed printed circuit board, and
    It is a soldering work program creation system equipped with a soldering work recording means for recording the soldering position and the soldering work in the order of the soldering work.
    For image information on the front side, which is the side to solder the mounting target,
    It is equipped with a back surface image display means that superimposes and displays the transparency information of the back surface image information on the back side of the front surface where the position and type information of the mounted parts are recorded.
    A soldering work program creation system characterized in that the image information of the back surface and the image information of the front surface are used to specify the soldering position and the soldering work.
  2. プリント基板表示装置と、
    表示された前記プリント基板において実装対象のはんだ付け位置を特定するはんだ付け位置特定装置と、
    表示された前記プリント基板において実装対象のはんだ作業を特定するはんだ作業特定装置と、
    はんだ付け位置とはんだ作業をはんだ付け作業順に記録するはんだ付け作業記録装置とを備えたはんだ付け作業プログラム作成装置であって、
    実装対象をはんだ付けする面であるオモテ面の画像情報に、
    オモテ面の裏側であり実装部品の位置や種類の情報が記録されたウラ面の画像情報の透過情報を重ねて表示するウラ面画像表示装置を備えており、
    ウラ面の画像情報とオモテ面の画像情報がはんだ付け位置の特定とはんだ作業の特定に用いられることを特徴とするはんだ付け作業プログラム作成装置。     Printed circuit board display device and
    A soldering position specifying device that specifies the soldering position to be mounted on the displayed printed circuit board, and
    A soldering work specifying device that specifies the soldering work to be mounted on the displayed printed circuit board, and
    It is a soldering work program creation device equipped with a soldering work recording device that records the soldering position and the soldering work in the order of the soldering work.
    For image information on the front side, which is the side to solder the mounting target,
    It is equipped with a back surface image display device that superimposes and displays the transparency information of the back surface image information on the back side of the front surface where the position and type information of the mounted parts are recorded.
    A soldering work program creating device characterized in that the image information of the back surface and the image information of the front surface are used for specifying the soldering position and the soldering work.
  3. 請求項１に記載のはんだ付け作業プログラム作成システムを備えたはんだ付けロボット。 A soldering robot provided with the soldering work program creation system according to claim 1.
PCT/JP2021/035126 2020-09-24 2021-09-24 Soldering work program creation system, soldering work program creation device, and soldering robot WO2022065437A1 (en)

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