WO2022050360A1 - Stratifié plaqué de métal ayant un bord protégé, procédé de production de carte de circuit imprimé, et procédé de production d'intermédiaire pour cartes de circuit imprimé - Google Patents

Stratifié plaqué de métal ayant un bord protégé, procédé de production de carte de circuit imprimé, et procédé de production d'intermédiaire pour cartes de circuit imprimé Download PDF

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Publication number
WO2022050360A1
WO2022050360A1 PCT/JP2021/032338 JP2021032338W WO2022050360A1 WO 2022050360 A1 WO2022050360 A1 WO 2022050360A1 JP 2021032338 W JP2021032338 W JP 2021032338W WO 2022050360 A1 WO2022050360 A1 WO 2022050360A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal
clad laminate
pressure
sensitive adhesive
adhesive layer
Prior art date
Application number
PCT/JP2021/032338
Other languages
English (en)
Japanese (ja)
Inventor
徳之 内田
良一 渡邊
Original Assignee
積水化学工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 積水化学工業株式会社 filed Critical 積水化学工業株式会社
Priority to KR1020227032796A priority Critical patent/KR20230058589A/ko
Priority to JP2021568399A priority patent/JPWO2022050360A1/ja
Priority to CN202180044112.5A priority patent/CN115868254A/zh
Publication of WO2022050360A1 publication Critical patent/WO2022050360A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

Abstract

La présente invention vise à fournir un stratifié plaqué de métal ayant un bord protégé, ledit stratifié plaqué de métal étant apte à empêcher la rupture du bord et à empêcher la pénétration d'une solution alcaline forte dans le bord lorsque le stratifié plaqué de métal est exposé à la solution. Un autre objet de la présente invention vise à fournir : un procédé de production d'une carte de circuit imprimé ; ainsi qu'un procédé de production d'un intermédiaire pour les cartes de circuit imprimé. La présente invention concerne un stratifié plaqué de métal ayant un bord protégé, le bord du stratifié revêtu de métal étant recouvert d'un matériau de protection.
PCT/JP2021/032338 2020-09-03 2021-09-02 Stratifié plaqué de métal ayant un bord protégé, procédé de production de carte de circuit imprimé, et procédé de production d'intermédiaire pour cartes de circuit imprimé WO2022050360A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020227032796A KR20230058589A (ko) 2020-09-03 2021-09-02 단부 보호된 금속 피복 적층판, 프린트 배선 기판의 제조 방법, 및, 프린트 배선 기판용 중간체의 제조 방법
JP2021568399A JPWO2022050360A1 (fr) 2020-09-03 2021-09-02
CN202180044112.5A CN115868254A (zh) 2020-09-03 2021-09-02 经端部保护的覆金属层叠板、印刷布线基板的制造方法及印刷布线基板用中间体的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020148505 2020-09-03
JP2020-148505 2020-09-03

Publications (1)

Publication Number Publication Date
WO2022050360A1 true WO2022050360A1 (fr) 2022-03-10

Family

ID=80492226

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/032338 WO2022050360A1 (fr) 2020-09-03 2021-09-02 Stratifié plaqué de métal ayant un bord protégé, procédé de production de carte de circuit imprimé, et procédé de production d'intermédiaire pour cartes de circuit imprimé

Country Status (5)

Country Link
JP (1) JPWO2022050360A1 (fr)
KR (1) KR20230058589A (fr)
CN (1) CN115868254A (fr)
TW (1) TW202214799A (fr)
WO (1) WO2022050360A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023136171A1 (fr) * 2022-01-13 2023-07-20 積水化学工業株式会社 Ruban adhésif simple face

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05283832A (ja) * 1992-03-30 1993-10-29 Hitachi Chem Co Ltd 端面保護膜を含む金属ベース基板及びその製造方法
JPH11154788A (ja) * 1997-11-20 1999-06-08 Nec Toyama Ltd 多層プリント配線板の製造方法
JP2000234081A (ja) * 1998-12-14 2000-08-29 Toyo Ink Mfg Co Ltd 接着シート及び該シートの製造方法並びに該シートの利用
JP2005197443A (ja) * 2004-01-07 2005-07-21 Hitachi Chem Co Ltd プリント配線板の製造方法
WO2006038547A1 (fr) * 2004-10-01 2006-04-13 Toyo Ink Manufacturing Co., Ltd. Adhésif sensible à la pression dont l’adhérence a été détruite par radiation d’énergie actinique, feuille adhésive dont l’adhérence a été détruite par radiation d’énergie actinique obtenue par application de l&
JP2009239215A (ja) * 2008-03-28 2009-10-15 Kyocer Slc Technologies Corp 銅張積層板およびこれを用いた配線基板の製造方法ならびに銅張積層板の端面処理方法およびこれに用いる端面処理装置
JP2009295620A (ja) * 2008-06-02 2009-12-17 Hitachi Cable Ltd プリント配線板用金属張基板およびプリント配線板ならびにその製造方法
JP2013216853A (ja) * 2012-03-16 2013-10-24 Nitto Denko Corp 粘着剤組成物および粘着シート
JP2018113283A (ja) * 2017-01-06 2018-07-19 大日本印刷株式会社 インターポーザー及びその製造方法、並びに、インターポーザーを備える半導体装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015021067A (ja) 2013-07-19 2015-02-02 Dic株式会社 熱伝導性粘着テープ、物品及び画像表示装置
JP6100654B2 (ja) 2013-09-06 2017-03-22 帝人株式会社 耐熱性粘着テープ用基材及びそれからなる耐熱性粘着テープ
JP6367599B2 (ja) 2013-11-22 2018-08-01 日東電工株式会社 両面粘着シート

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05283832A (ja) * 1992-03-30 1993-10-29 Hitachi Chem Co Ltd 端面保護膜を含む金属ベース基板及びその製造方法
JPH11154788A (ja) * 1997-11-20 1999-06-08 Nec Toyama Ltd 多層プリント配線板の製造方法
JP2000234081A (ja) * 1998-12-14 2000-08-29 Toyo Ink Mfg Co Ltd 接着シート及び該シートの製造方法並びに該シートの利用
JP2005197443A (ja) * 2004-01-07 2005-07-21 Hitachi Chem Co Ltd プリント配線板の製造方法
WO2006038547A1 (fr) * 2004-10-01 2006-04-13 Toyo Ink Manufacturing Co., Ltd. Adhésif sensible à la pression dont l’adhérence a été détruite par radiation d’énergie actinique, feuille adhésive dont l’adhérence a été détruite par radiation d’énergie actinique obtenue par application de l&
JP2009239215A (ja) * 2008-03-28 2009-10-15 Kyocer Slc Technologies Corp 銅張積層板およびこれを用いた配線基板の製造方法ならびに銅張積層板の端面処理方法およびこれに用いる端面処理装置
JP2009295620A (ja) * 2008-06-02 2009-12-17 Hitachi Cable Ltd プリント配線板用金属張基板およびプリント配線板ならびにその製造方法
JP2013216853A (ja) * 2012-03-16 2013-10-24 Nitto Denko Corp 粘着剤組成物および粘着シート
JP2018113283A (ja) * 2017-01-06 2018-07-19 大日本印刷株式会社 インターポーザー及びその製造方法、並びに、インターポーザーを備える半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023136171A1 (fr) * 2022-01-13 2023-07-20 積水化学工業株式会社 Ruban adhésif simple face

Also Published As

Publication number Publication date
TW202214799A (zh) 2022-04-16
JPWO2022050360A1 (fr) 2022-03-10
KR20230058589A (ko) 2023-05-03
CN115868254A (zh) 2023-03-28

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