Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B15/00—Layered products comprising a layer of metal
  • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
  • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
  • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
  • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
  • C08K3/013—Fillers, pigments or reinforcing additives
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/10—Metal compounds
  • C08K3/11—Compounds containing metals of Groups 4 to 10 or of Groups 14 to 16 of the Periodic Table
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
  • C08K3/20—Oxides; Hydroxides
  • C08K3/22—Oxides; Hydroxides of metals
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
  • C08L83/04—Polysiloxanes
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0313—Organic insulating material
  • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
  • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2305/00—Condition, form or state of the layers or laminate
  • B32B2305/07—Parts immersed or impregnated in a matrix
  • B32B2305/076—Prepregs
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2457/00—Electrical equipment
  • B32B2457/08—PCBs, i.e. printed circuit boards

Definitions

• R 1 independently represents a hydrogen atom or a methyl group, and n 1 is 1 to 10.
• the content of zinc oxide (D) in this case is calculated from the charged ratio and amount of molybdenum compound particles (molybdenum compound (C)) and zinc oxide, which are raw materials for preparing the molybdenum component to be mixed with the resin component. can do.
• the content of zinc oxide (D) is, for example, the charging ratio and amount of molybdenum compound particles (molybdenum compound (C)) and zinc oxide, which are raw materials for preparing a molybdenum component to be mixed with a resin component. It can be adjusted by changing it.
• the molybdenum compound (C) contains molybdenum in the molecule, but an oxide of molybdenum and a sulfide of molybdenum are preferable.
• Specific examples of the molybdenum compound (C) include zinc molybdate (for example, ZnMoO 4 , Zn 3 Mo 2 O 9, etc.), ammonium molybdate, sodium molybdate, calcium molybdate, potassium molybdate, molybdenum disulfide. , Molybdenum trioxide, and molybdenum compounds such as molybdenum hydrate, but are not particularly limited. These can be used individually by 1 type or in combination of 2 or more types.
• the molybdenum hydrate for example, molybdate monohydrate (MoO 3 ⁇ H 2 O) , ammonium molybdate tetrahydrate ((NH 4) 6 Mo 7 O 24 ⁇ 4H 2 O), zinc molybdate pentahydrate (Zn 5 Mo 2 O 11 ⁇ 5H 2 O) and the like.
• molybdate monohydrate MoO 3 ⁇ H 2 O
• ammonium molybdate tetrahydrate (NH 4) 6 Mo 7 O 24 ⁇ 4H 2 O)
• zinc molybdate pentahydrate Zn 5 Mo 2 O 11 ⁇ 5H 2 O
• zinc molybdate, molybdenum disulfide, and molybdenum hydrate are preferable from the viewpoint of drilling workability.
• the shape of the molybdenum compound particles is not particularly limited, but the improvement in drilling workability tends to be more remarkable as the filling property of the molybdenum compound (C) in the resin composition and the molded product using the resin composition increases.
• the molybdenum compound particles are spherical, the circularity thereof is preferably 0.88 to 1.00, preferably 0.90 to 1.00, and 0.92 to 1.00. Is more preferable.
• the circularity can be measured by a wet flow type particle size / shape analyzer. More specifically, it can be measured according to the method described in the examples.
• cresol novolac type phenol resin cresol novolac type phenol resin, biphenyl aralkyl type phenol resin represented by the following formula (4), naphthol aralkyl type phenol resin represented by the following formula (5), Aminotriazine novolac type phenol resin and naphthalene type phenol resin are preferable, and biphenyl aralkyl type phenol resin represented by the following formula (4) and naphthol aralkyl type phenol resin represented by the following formula (5) are more preferable.
• the content of the phenol compound (F) is preferably 1 to 99 parts by mass with respect to a total of 100 parts by mass of the resin solid content of the resin composition. It is more preferably 3 to 90 parts by mass, further preferably 5 to 80 parts by mass, and may be 10 to 70 parts by mass, 20 to 60 parts by mass, or 30 to 50 parts by mass.
• the content of the phenol compound (F) is within the above range, it tends to be more excellent in adhesiveness, flexibility and the like.
• R 3 represents a methylene group, an isopropylidene group, CO, O, S or SO 2 .
• the compound (I) having a polymerizable unsaturated group is not particularly limited, and generally known compounds can be used. Specific examples of the compound (I) having a polymerizable unsaturated group include vinyl compounds such as ethylene, propylene, styrene, divinylbenzene and divinylbiphenyl, methyl (meth) acrylate, and 2-hydroxyethyl (meth) acrylate.
• the resin composition layer (insulating layer) of the resin sheet is surface-treated by a conventional method, and a wiring pattern (conductor layer) is formed on the surface of the insulating layer by plating. By doing so, the printed wiring board of the present embodiment can be obtained.
• the form and arrangement of the reinforcing fibers are not particularly limited, and can be appropriately selected from woven fabrics, non-woven fabrics, mats, knits, braids, unidirectional strands, rovings, chopped and the like.
• a preform a laminated woven base cloth made of reinforcing fibers, a sewn-integrated one with stitch threads, or a fiber structure such as a three-dimensional woven fabric or a braid
• a metal foil-clad laminate (double-sided copper-clad laminate) having a thickness of 0.8 mm was produced by performing a vacuum press at a pressure of 20 kgf / cm 2 and a temperature of 220 ° C. for 120 minutes for laminating and molding. The appearance of the obtained metal foil-clad laminate was evaluated, the drill bit life, and the hole position accuracy were evaluated. The results are shown in Table 1.

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• Chemical & Material Sciences (AREA)
• Organic Chemistry (AREA)
• Health & Medical Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Medicinal Chemistry (AREA)
• Polymers & Plastics (AREA)
• Engineering & Computer Science (AREA)
• Materials Engineering (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Compositions Of Macromolecular Compounds (AREA)
• Reinforced Plastic Materials (AREA)
• Laminated Bodies (AREA)

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• 2021
  • 2021-02-10 CN CN202180023867.7A patent/CN115335433B/zh active Active
  • 2021-02-10 JP JP2022509374A patent/JP7799974B2/ja active Active
  • 2021-02-10 KR KR1020227019387A patent/KR20220157933A/ko active Pending
  • 2021-02-10 WO PCT/JP2021/004891 patent/WO2021192680A1/ja not_active Ceased
  • 2021-03-02 TW TW110107199A patent/TWI879901B/zh active

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