TWI879901B - 樹脂組成物、預浸體、樹脂片、疊層板、覆金屬箔疊層板、及印刷配線板 - Google Patents

樹脂組成物、預浸體、樹脂片、疊層板、覆金屬箔疊層板、及印刷配線板 Download PDF

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Publication number
TWI879901B
TWI879901B TW110107199A TW110107199A TWI879901B TW I879901 B TWI879901 B TW I879901B TW 110107199 A TW110107199 A TW 110107199A TW 110107199 A TW110107199 A TW 110107199A TW I879901 B TWI879901 B TW I879901B
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Taiwan
Prior art keywords
resin composition
compound
mass
resin
group
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TW110107199A
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English (en)
Chinese (zh)
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TW202142621A (zh
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工藤博章
高村達郎
志田典浩
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日商三菱瓦斯化學股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/11—Compounds containing metals of Groups 4 to 10 or of Groups 14 to 16 of the Periodic Table
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
TW110107199A 2020-03-25 2021-03-02 樹脂組成物、預浸體、樹脂片、疊層板、覆金屬箔疊層板、及印刷配線板 TWI879901B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-054954 2020-03-25
JP2020054954 2020-03-25

Publications (2)

Publication Number Publication Date
TW202142621A TW202142621A (zh) 2021-11-16
TWI879901B true TWI879901B (zh) 2025-04-11

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TW110107199A TWI879901B (zh) 2020-03-25 2021-03-02 樹脂組成物、預浸體、樹脂片、疊層板、覆金屬箔疊層板、及印刷配線板

Country Status (5)

Country Link
JP (1) JP7799974B2 (https=)
KR (1) KR20220157933A (https=)
CN (1) CN115335433B (https=)
TW (1) TWI879901B (https=)
WO (1) WO2021192680A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023063267A1 (ja) * 2021-10-15 2023-04-20 日本化薬株式会社 封止材用マレイミド樹脂混合物、マレイミド樹脂組成物およびその硬化物
CN118234802A (zh) * 2021-10-26 2024-06-21 三菱瓦斯化学株式会社 树脂组合物、预浸料、树脂片、层叠板、覆金属箔层叠板及印刷电路板
CN118541448A (zh) * 2022-01-28 2024-08-23 松下知识产权经营株式会社 树脂组合物、预浸料、具有树脂的膜、具有树脂的金属箔片材、覆金属层压体和印刷线路板
JP7788296B2 (ja) * 2022-02-01 2025-12-18 株式会社アドマテックス 複合酸化物粒子材料及びその製造方法、フィラー、フィラー含有スラリー組成物、並びにフィラー含有樹脂組成物
KR20250087553A (ko) * 2022-10-12 2025-06-16 가부시끼가이샤 레조낙 프리프레그, 적층판, 프린트 배선판 및 반도체 패키지

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101580626A (zh) * 2009-01-24 2009-11-18 南亚塑胶工业股份有限公司 一种高导热无卤难燃树脂组合物及其预浸渍体及涂层物
TW201348311A (zh) * 2012-03-30 2013-12-01 Mitsubishi Gas Chemical Co 樹脂組成物、預浸體及疊層板
TW201927841A (zh) * 2017-12-27 2019-07-16 日商三菱瓦斯化學股份有限公司 樹脂組成物、預浸體、疊層板、覆金屬箔疊層板、印刷配線板及多層印刷配線板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004059643A (ja) 2002-07-25 2004-02-26 Mitsubishi Gas Chem Co Inc プリプレグ及び積層板
JP2009120702A (ja) 2007-11-14 2009-06-04 Sumitomo Bakelite Co Ltd 耐熱基板用樹脂組成物、プリプレグおよび耐熱基板
WO2012099162A1 (ja) * 2011-01-20 2012-07-26 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、および積層板
KR101378364B1 (ko) 2011-10-31 2014-03-27 방종관 클렌징 또는 에센스용 패드 제조방법 및 그 방법에 의해 제조된 패드
JP6604565B2 (ja) * 2015-02-13 2019-11-13 パナソニックＩｐマネジメント株式会社 プリント配線板用樹脂組成物、プリプレグ、金属張積層板およびプリント配線板
JP6604564B2 (ja) * 2014-04-08 2019-11-13 パナソニックＩｐマネジメント株式会社 プリント配線板用樹脂組成物、プリプレグ、金属張積層板、プリント配線板
US11161979B2 (en) * 2014-07-18 2021-11-02 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, metallic foil-clad laminate, and printed wiring board
JP6405981B2 (ja) * 2014-12-18 2018-10-17 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板及びプリント配線板
CN107735409B (zh) * 2015-07-06 2020-08-11 三菱瓦斯化学株式会社 树脂组合物、使用该树脂组合物的预浸料或树脂片以及使用它们的层叠板和印刷电路板
JP6070812B2 (ja) * 2015-12-25 2017-02-01 日立化成株式会社 プリント配線板用樹脂組成物、プリプレグ、積層板、及びプリント配線板
JP6256457B2 (ja) * 2015-12-25 2018-01-10 日立化成株式会社 プリント配線板用含水モリブデン酸亜鉛、プリプレグ、積層板、プリント配線板及びプリント配線板用スラリー

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101580626A (zh) * 2009-01-24 2009-11-18 南亚塑胶工业股份有限公司 一种高导热无卤难燃树脂组合物及其预浸渍体及涂层物
TW201348311A (zh) * 2012-03-30 2013-12-01 Mitsubishi Gas Chemical Co 樹脂組成物、預浸體及疊層板
TW201927841A (zh) * 2017-12-27 2019-07-16 日商三菱瓦斯化學股份有限公司 樹脂組成物、預浸體、疊層板、覆金屬箔疊層板、印刷配線板及多層印刷配線板

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Publication number Publication date
JPWO2021192680A1 (https=) 2021-09-30
WO2021192680A1 (ja) 2021-09-30
CN115335433B (zh) 2024-08-09
KR20220157933A (ko) 2022-11-29
JP7799974B2 (ja) 2026-01-16
CN115335433A (zh) 2022-11-11
TW202142621A (zh) 2021-11-16

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