TWI713784B - 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片及印刷電路板 - Google Patents
樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片及印刷電路板 Download PDFInfo
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- TWI713784B TWI713784B TW106129876A TW106129876A TWI713784B TW I713784 B TWI713784 B TW I713784B TW 106129876 A TW106129876 A TW 106129876A TW 106129876 A TW106129876 A TW 106129876A TW I713784 B TWI713784 B TW I713784B
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Abstract
一種樹脂組成物,含有下式(1)表示之環氧樹脂(A)及氰酸酯化合物(B)。
Description
本發明關於樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片及印刷電路板。
近年,廣泛使用於電子設備或通訊器材、個人電腦等之半導體的高整合化、微細化日益加速。與此相伴,對於使用在印刷電路板之半導體封裝用疊層板所要求的各種特性變得越發嚴格。就所要求的特性而言,例如可列舉:低吸水性、吸濕耐熱性、阻燃性、低介電常數、低介電正切、低熱膨脹率、耐熱性、耐藥品性、高鍍敷剝離強度等特性。但到目前為止,該等要求特性未必都令人滿意。
自以往,就耐熱性、電特性優異之印刷電路板用材料而言,已知有氰酸酯化合物,近年,於氰酸酯化合物倂用環氧樹脂、雙馬來醯亞胺化合物等而成的樹脂組成物廣泛使用在半導體塑膠封裝體用等高機能之印刷電路板用材料等。 例如,專利文獻1及2中提出了密合性、低吸水性、吸濕耐熱性、絕緣可靠性等特性優異的由氰酸酯化合物與環氧樹脂構成之樹脂組成物。 [先前技術文獻] [專利文獻]
專利文獻1:國際公開第2013/065694號 專利文獻2:國際公開第2014/203866號
[發明所欲解決之課題] 專利文獻1~2記載之樹脂組成物,關於密合性、低吸水性、吸濕耐熱性、絕緣可靠性,可謂有良好的物性,但考量銅箔剝離強度、彎曲強度、彎曲彈性模量、吸水率、線熱膨脹係數、熱重量減少率及熱傳導率的觀點,不能說有充分的物性平衡。
本發明係鑒於上述問題而進行,旨在提供展現優異銅箔剝離強度、彎曲強度、彎曲彈性模量、吸水率、線熱膨脹係數、熱重量減少率及熱傳導率的樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片、及印刷電路板。 [解決課題之手段]
本案發明人等為了解決上述課題而進行努力研究。其結果,發現藉由倂用氰酸酯化合物與具有特定結構之環氧樹脂,可達成上述課題,並完成了本發明。
亦即,本發明包含以下的態樣。 [1]一種樹脂組成物,含有下式(1)表示之環氧樹脂(A)及氰酸酯化合物(B)。 [化1]式(1)中,Ar表示多環芳香族基,R各自獨立地表示氫原子或甲基,G表示環氧丙基,n表示0~15之整數。 [2]如[1]之樹脂組成物,其中,該式(1)中,該多環芳香族基各自獨立地為聯苯基、乙烷合萘基(Acenaphthenyl)、茀基、二苯并呋喃基、蒽基、菲基、或來自雙酚類之基。 [3]如[1]或[2]之樹脂組成物,其中,該環氧樹脂(A)以下式(1-1)表示。 [化2](1-1) 式(1-1)中,n表示0~15之整數。 [4]如[1]~[3]中任一項之樹脂組成物,其中,該環氧樹脂(A)之含量相對於樹脂固體成分100質量份為1~90質量份。 [5]如[1]~[4]中任一項之樹脂組成物,更含有填充材(C)。 [6]如[1]~[5]中任一項之樹脂組成物,更含有選自於由該式(1)表示之環氧樹脂(A)以外之環氧樹脂、馬來醯亞胺化合物、苯酚樹脂、氧雜環丁烷樹脂、苯并 化合物、及具可聚合之不飽和基之化合物構成之群組中之一種以上。 [7]如[5]或[6]之樹脂組成物,其中,該填充材(C)之含量相對於樹脂固體成分100質量份為50~1600質量份。 [8]一種預浸體,具有:基材、及含浸或塗佈於該基材之如[1]~[7]中任一項之樹脂組成物。 [9]一種覆金屬箔疊層板,具有:疊層了至少1片以上之如[8]之預浸體、配置於該預浸體之單面或兩面之金屬箔。 [10]一種樹脂片,具備:支持體、及配置於該支持體之表面之如[1]~[7]中任一項之樹脂組成物。 [11]一種印刷電路板,具有絕緣層及形成在該絕緣層之表面之導體層,該絕緣層含有如[1]~[7]中任一項之樹脂組成物。 [發明之效果]
根據本發明,可提供展現優異銅箔剝離強度、彎曲強度、彎曲彈性模量、吸水率、線熱膨脹係數、熱重量減少率及熱傳導率的樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片、及印刷電路板。
以下,針對用以實施本發明之形態(以下,稱為「本實施形態」。)進行詳細說明,但本發明並不限定於此,在不脫離其要旨的範圍內可進行各種變形。
本實施形態之樹脂組成物含有下式(1)表示之環氧樹脂(A)及氰酸酯化合物(B)。由於以此種方式構成,本實施形態之樹脂組成物可展現優異的銅箔剝離強度、彎曲強度、彎曲彈性模量、吸水率、線熱膨脹係數、熱重量減少率及熱傳導率。
以下,針對構成本實施形態之樹脂組成物的各成分進行說明。
[環氧樹脂(A)] 本實施形態之環氧樹脂(A)係以上述式(1)表示。 式(1)中之多環芳香族基並無特別限定,宜各自獨立地為聯苯基、乙烷合萘基、茀基、二苯并呋喃基、蒽基、菲基、或來自雙酚類之基較佳。來自雙酚類之基並無特別限定,例如可列舉:來自雙酚F、雙酚A、雙酚S、雙酚茀等雙酚類之基。本實施形態中,考量使銅箔剝離強度、彎曲強度、彎曲彈性模量、吸水率、線熱膨脹係數、熱重量減少率及熱傳導率之物性平衡更為良好的觀點,式(1)中之多環芳香族基為聯苯基更佳。 又,式(1)中的n為15以下,較佳為10以下。n大於15的話,樹脂的軟化點上升,有時會給作業性帶來不便。
本實施形態中,考量使銅箔剝離強度、彎曲強度、彎曲彈性模量、吸水率、線熱膨脹係數、熱重量減少率及熱傳導率之物性平衡更為良好的觀點,環氧樹脂(A)宜為下式(1-1)表示者。
上述環氧樹脂(A)可單獨使用一種,亦可將二種以上組合使用。又,環氧樹脂(A)也可使用市售品,其示例不限定於以下,可列舉新日鐵住金化學(股)製的「GK-3007-50D」等。
本實施形態之環氧樹脂(A)之含量可因應所期望之特性適當設定,並無特別限定,考量使銅箔剝離強度、彎曲強度、彎曲彈性模量、吸水率、線熱膨脹係數、熱重量減少率及熱傳導率之物性平衡更為良好的觀點,宜相對於樹脂固體成分100質量份為1~90質量份,更佳為30~70質量份,尤佳為40~60質量份。
此外,本實施形態中,就「樹脂固體成分」而言,除非另有說明,係指本實施形態之樹脂組成物中之不包括溶劑及填充材的成分,「樹脂固體成分100質量份」,係指本實施形態之樹脂組成物中之不包括溶劑及填充材的成分之合計為100質量份。
本實施形態之環氧樹脂(A)的製造方法並無特別限定,可使用公知的方法。例如,可如下述般進行製造。 可列舉以下方法:使多環芳香族二羥基化合物與相對於該多環芳香族二羥基化合物1莫耳為0.1~0.9莫耳的下式(1A)表示之縮合劑反應,而製造下式(1B)表示之多元羥基化合物,然後,使該多元羥基化合物與表氯醇反應。 [化5]式(1A)中,R表示氫原子或甲基,R’表示氫原子或碳數1~4之烴基。 [化6]式(1B)中,A表示多環芳香族基,R表示氫原子或甲基,n表示0~15之整數。
式(1)表示之多官能環氧樹脂之原料即前述通式(1B)表示之多元羥基化合物,例如可藉由使多環芳香族二醇與前述通式(1A)表示之縮合劑反應而獲得。 就多環芳香族二醇而言,不限定於以下,例如可列舉:萘、聯苯、乙烷合萘(acenaphthene)、茀、二苯并呋喃、蒽、菲等之二羥基化合物;及雙酚F、雙酚A、雙酚S、雙酚茀等雙酚類。較佳為萘及聯苯之二羥基化合物。就具體例而言,不限定於以下,有:1,4-萘二醇、1,5-萘二醇、1,6-萘二醇、1,7-萘二醇、2,6-萘二醇、2,7-萘二醇、4,4-二羥基聯苯、2,2-二羥基聯苯等。 通式(1A)表示之縮合劑可為鄰位體、間位體、對位體中之任一者,較佳為間位體或對位體,具體而言,可列舉:對亞二甲苯二醇、α,α’-二甲氧基-對二甲苯、α,α’-二乙氧基-對二甲苯、α,α’-二-正丙氧基-對二甲苯、α,α’-二異丙氧基-對二甲苯、1,4-二(2-羥基-2-丙基)苯、1,4-二(2-甲氧基-2-丙基)苯、1,4-二(2-正丙氧基-2-丙基)苯、1,4-二(2-異丙氧基-2-丙基)苯等。 使上述多環芳香族二醇與縮合劑反應時之兩者的莫耳比,相對於多環芳香族二醇1莫耳,縮合劑宜為1莫耳以下,更佳為0.1~0.9之範圍。藉由為0.1莫耳以上,可減少未反應之多環芳香族二醇量,有充分確保形成環氧樹脂時之樹脂硬化物的耐熱性的傾向。又,為0.9莫耳以下時,可防止樹脂的軟化點變得過高,而可充分確保作業性。又,通式(1B)中,n宜為15以下。 使該多環芳香族二醇與縮合劑反應而製造多元羥基化合物的反應,可在酸觸媒的存在下進行。該酸觸媒可從習知的無機酸、有機酸中適當選擇,不限定於以下,例如可列舉:鹽酸、磷酸、硫酸等無機酸;甲酸、草酸、三氟乙酸、對甲苯磺酸等有機酸;氯化鋅、氯化鋁、氯化鐵等路易士酸或固體酸等。 該反應通常於10~250℃進行1~20小時。又,反應時可將甲醇、乙醇、丙醇、丁醇、乙二醇、二乙二醇、甲基賽珞蘇、乙基賽珞蘇等醇類、苯、甲苯、氯苯、二氯苯等芳香族烴類等作為溶劑使用。 就環氧樹脂(A)而言,可藉由使上述通式(1B)表示之多元羥基化合物與表氯醇反應而製造。該反應可與通常的環氧化反應同樣進行。例如可列舉如下方法:將上述通式(1B)表示之多元羥基化合物溶解於過剩的表氯醇,然後,在氫氧化鈉、氫氧化鉀等鹼金屬氫氧化物的存在下,於50~150℃,較佳為60~120℃之範圍反應1~10小時左右。此時的表氯醇的使用量,相對於多元羥基化合物中之羥基之莫耳數為2~15倍莫耳,較佳為2~10倍莫耳之範圍。又,鹼金屬氫氧化物的使用量,相對於多元羥基化合物中之羥基之莫耳數為0.8~1.2倍莫耳,較佳為0.9~1.1倍莫耳之範圍。 反應結束後,將過剩的表氯醇蒸餾除去,使殘留物溶解於甲苯、甲基異丁酮等溶劑,進行過濾、水洗,去除無機鹽,然後,將溶劑餾去,藉此,可獲得目的之環氧樹脂(A)。
[氰酸酯化合物(B)] 就氰酸酯化合物(B)而言,只要是在分子內具有經至少1個氰氧基(氰酸酯基)取代之芳香族部分的化合物即可,並無特別限定。使用氰酸酯化合物(B)之樹脂組成物,在形成硬化物時具有玻璃轉移溫度、低熱膨脹性、鍍敷密合性等優異的特性。
就氰酸酯化合物(B)之示例而言,不限定於以下,可列舉下式(2)表示者。
上述式(2)中,Ar1
表示苯環、萘環或2個苯環以單鍵鍵結而成者。有多數個時彼此可相同也可不同。Ra各自獨立地表示氫原子、碳數1~6之烷基、碳數6~12之芳基、碳數1~4之烷氧基、碳數1~6之烷基與碳數6~12之芳基鍵結而成的基。Ra中之芳香環也可以有取代基,Ar1
及Ra中之取代基可選擇任意的位置。p表示鍵結於Ar1
之氰氧基的數目,各自獨立地為1~3之整數。q表示鍵結於Ar1
之Ra的數目,Ar1
為苯環時為4-p,萘環時為6-p,2個苯環以單鍵鍵結時為8-p。t表示平均重複數,為0~50之整數,作為其他氰酸酯化合物,亦可為不同的t之化合物的混合物。X有多數個時,各自獨立地表示單鍵、碳數1~50之2價有機基(氫原子也可被雜原子取代。)、氮數1~10之2價有機基(例如-N-R-N-(此處,R表示有機基。))、羰基(-CO-)、羧基(-C(=O)O-)、二氧化羰基(carbonyl dioxide)(-OC(=O)O-)、磺醯基(-SO2
-)、2價硫原子或2價氧原子中之任一者。
上述式(2)之Ra中之烷基,可具有直鏈或分支之鏈狀結構、及環狀結構(例如環烷基等)中之任一者。 又,通式(2)中之烷基及Ra中之芳基中的氫原子,也可取代為氟原子、氯原子等鹵素原子;甲氧基、苯氧基等烷氧基;或氰基等。 就烷基之具體例而言,不限定於以下,可列舉:甲基、乙基、丙基、異丙基、正丁基、異丁基、三級丁基、正戊基、1-乙基丙基、2,2-二甲基丙基、環戊基、己基、環己基、及三氟甲基。 就芳基之具體例而言,不限定於以下,可列舉:苯基、二甲苯基、三甲苯基、萘基、苯氧基苯基、乙基苯基、鄰、間或對氟苯基、二氯苯基、二氰基苯基、三氟苯基、甲氧基苯基、及鄰、間或對甲苯基等。 就烷氧基而言,不限定於以下,例如可列舉:甲氧基、乙氧基、丙氧基、異丙氧基、正丁氧基、異丁氧基、及三級丁氧基。 上述式(2)之X中之碳數1~50之2價有機基之具體例,不限定於以下,可列舉:亞甲基、伸乙基、三亞甲基、伸環戊基、伸環己基、三甲基伸環己基、聯苯基亞甲基、二甲基亞甲基-伸苯基-二甲基亞甲基、茀二基、及鄰苯二甲內酯二基(phthalidiyl)等。該2價有機基中的氫原子也可取代為氟原子、氯原子等鹵素原子;甲氧基、苯氧基等烷氧基;氰基等。 上述式(2)之X中之氮數1~10之2價有機基的示例,不限定於以下,可列舉亞胺基、聚醯亞胺基等。
又,上述式(2)中之X之有機基,例如可列舉為下式(3)或下式(4)表示之結構者。
[化8]上述式(3)中,Ar2
表示苯四基、萘四基或聯苯四基,u為2以上時,彼此可相同也可不同。Rb、Rc、Rf、及Rg各自獨立地表示氫原子、碳數1~6之烷基、碳數6~12之芳基、三氟甲基、或具有至少1個苯酚性羥基之芳基。Rd及Re各自獨立地選自於氫原子、碳數1~6之烷基、碳數6~12之芳基、碳數1~4之烷氧基、或羥基中之任一種。u表示0~5之整數。)
[化9]式(4)中,Ar3
表示苯四基、萘四基或聯苯四基,v為2以上時,彼此可相同也可不同。Ri、及Rj各自獨立地表示氫原子、碳數1~6之烷基、碳數6~12之芳基、苄基、碳數1~4之烷氧基、羥基、三氟甲基、或經至少1個氰氧基取代之芳基。v表示0~5之整數,亦可為不同的v之化合物的混合物。
進一步,通式(2)中之X可列舉下式表示之2價基。
通式(3)之Ar2
及通式(4)之Ar3
的具體例,可列舉:通式(3)所示之2個碳原子、或通式(4)所示之2個氧原子鍵結於1,4位或1,3位的苯四基;上述2個碳原子或2個氧原子鍵結於4,4’位、2,4’位、2,2’位、2,3’位、3,3’位、或3,4’位的聯苯四基;及上述2個碳原子或2個氧原子鍵結於2,6位、1,5位、1,6位、1,8位、1,3位、1,4位、或2,7位的萘四基。 通式(3)之Rb、Rc、Rd、Re、Rf及Rg、以及通式(4)之Ri、Rj中之烷基及芳基,和上述通式(2)中之Ra中的烷基及芳基同義。
上述通式(2)表示之氰氧基取代芳香族化合物之具體例,不限定於以下,可列舉:氰氧基苯、1-氰氧基-2-,1-氰氧基-3-,或1-氰氧基-4-甲基苯、1-氰氧基-2-,1-氰氧基-3-,或1-氰氧基-4-甲氧基苯、1-氰氧基-2,3-,1-氰氧基-2,4-,1-氰氧基-2,5-,1-氰氧基-2,6-,1-氰氧基-3,4-或1-氰氧基-3,5-二甲基苯、氰氧基乙基苯、氰氧基丁基苯、氰氧基辛基苯、氰氧基壬基苯、2-(4-氰氧基苯基)-2-苯基丙烷(4-α-異丙苯基苯酚之氰酸酯)、1-氰氧基-4-環己基苯、1-氰氧基-4-乙烯基苯、1-氰氧基-2-或1-氰氧基-3-氯苯、1-氰氧基-2,6-二氯苯、1-氰氧基-2-甲基-3-氯苯、氰氧基硝基苯、1-氰氧基-4-硝基-2-乙基苯、1-氰氧基-2-甲氧基-4-烯丙基苯(丁香酚之氰酸酯)、甲基(4-氰氧基苯基)硫醚、1-氰氧基-3-三氟甲基苯、4-氰氧基聯苯、1-氰氧基-2-或1-氰氧基-4-乙醯基苯、4-氰氧基苯甲醛、4-氰氧基苯甲酸甲酯、4-氰氧基苯甲酸苯酯、1-氰氧基-4-乙醯基胺基苯、4-氰氧基二苯甲酮、1-氰氧基-2,6-二-第三丁基苯、1,2-二氰氧基苯、1,3-二氰氧基苯、1,4-二氰氧基苯、1,4-二氰氧基-2-第三丁基苯、1,4-二氰氧基-2,4-二甲基苯、1,4-二氰氧基-2,3,4-三甲基苯、1,3-二氰氧基-2,4,6-三甲基苯、1,3-二氰氧基-5-甲基苯、1-氰氧基或2-氰氧基萘、1-氰氧基4-甲氧基萘、2-氰氧基-6-甲基萘、2-氰氧基-7-甲氧基萘、2,2’-二氰氧基-1,1’-聯萘、1,3-,1,4-,1,5-,1,6-,1,7-,2,3-,2,6-或2,7-二氰氧基萘、2,2’-或4,4’-二氰氧基聯苯、4,4’-二氰氧基八氟聯苯、2,4’-或4,4’-二氰氧基二苯基甲烷、雙(4-氰氧基-3,5-二甲基苯基)甲烷、1,1-雙(4-氰氧基苯基)乙烷、1,1-雙(4-氰氧基苯基)丙烷、2,2-雙(4-氰氧基苯基)丙烷、2,2-雙(4-氰氧基-3-甲基苯基)丙烷、2,2-雙(2-氰氧基-5-聯苯基)丙烷、2,2-雙(4-氰氧基苯基)六氟丙烷、2,2-雙(4-氰氧基-3,5-二甲基苯基)丙烷、1,1-雙(4-氰氧基苯基)丁烷、1,1-雙(4-氰氧基苯基)異丁烷、1,1-雙(4-氰氧基苯基)戊烷、1,1-雙(4-氰氧基苯基)-3-甲基丁烷、1,1-雙(4-氰氧基苯基)-2-甲基丁烷、1,1-雙(4-氰氧基苯基)-2,2-二甲基丙烷、2,2-雙(4-氰氧基苯基)丁烷、2,2-雙(4-氰氧基苯基)戊烷、2,2-雙(4-氰氧基苯基)己烷、2,2-雙(4-氰氧基苯基)-3-甲基丁烷、2,2-雙(4-氰氧基苯基)-4-甲基戊烷、2,2-雙(4-氰氧基苯基)-3,3-二甲基丁烷、3,3-雙(4-氰氧基苯基)己烷、3,3-雙(4-氰氧基苯基)庚烷、3,3-雙(4-氰氧基苯基)辛烷、3,3-雙(4-氰氧基苯基)-2-甲基戊烷、3,3-雙(4-氰氧基苯基)-2-甲基己烷、3,3-雙(4-氰氧基苯基)-2,2-二甲基戊烷、4,4-雙(4-氰氧基苯基)-3-甲基庚烷、3,3-雙(4-氰氧基苯基)-2-甲基庚烷、3,3-雙(4-氰氧基苯基)-2,2-二甲基己烷、3,3-雙(4-氰氧基苯基)-2,4-二甲基己烷、3,3-雙(4-氰氧基苯基)-2,2,4-三甲基戊烷、2,2-雙(4-氰氧基苯基)-1,1,1,3,3,3-六氟丙烷、雙(4-氰氧基苯基)苯基甲烷、1,1-雙(4-氰氧基苯基)-1-苯基乙烷、雙(4-氰氧基苯基)聯苯甲烷、1,1-雙(4-氰氧基苯基)環戊烷、1,1-雙(4-氰氧基苯基)環己烷、2,2-雙(4-氰氧基-3-異丙基苯基)丙烷、1,1-雙(3-環己基-4-氰氧基苯基)環己烷、雙(4-氰氧基苯基)二苯基甲烷、雙(4-氰氧基苯基)-2,2-二氯乙烯、1,3-雙[2-(4-氰氧基苯基)-2-丙基]苯、1,4-雙[2-(4-氰氧基苯基)-2-丙基]苯、1,1-雙(4-氰氧基苯基)-3,3,5-三甲基環己烷、4-[雙(4-氰氧基苯基)甲基]聯苯、4,4-二氰氧基二苯甲酮、1,3-雙(4-氰氧基苯基)-2-丙烯-1-酮、雙(4-氰氧基苯基)醚、雙(4-氰氧基苯基)硫醚、雙(4-氰氧基苯基)碸、4-氰氧基苯甲酸-4-氰氧基苯酯(4-氰氧基苯基-4-氰氧基苯甲酸酯)、雙-(4-氰氧基苯基)碳酸酯、1,3-雙(4-氰氧基苯基)金剛烷、1,3-雙(4-氰氧基苯基)-5,7-二甲基金剛烷、3,3-雙(4-氰氧基苯基)異苯并呋喃-1(3H)-酮(酚酞之氰酸酯)、3,3-雙(4-氰氧基-3-甲基苯基)異苯并呋喃-1(3H)-酮(鄰甲酚酞之氰酸酯)、9,9’-雙(4-氰氧基苯基)茀、9,9-雙(4-氰氧基-3-甲基苯基)茀、9,9-雙(2-氰氧基-5-聯苯基)茀、參(4-氰氧基苯基)甲烷、1,1,1-參(4-氰氧基苯基)乙烷、1,1,3-參(4-氰氧基苯基)丙烷、α,α,α’-參(4-氰氧基苯基)-1-乙基-4-異丙基苯、1,1,2,2-肆(4-氰氧基苯基)乙烷、肆(4-氰氧基苯基)甲烷、2,4,6-參(N-甲基-4-氰氧基苯胺基)-1,3,5-三、2,4-雙(N-甲基-4-氰氧基苯胺基)-6-(N-甲基苯胺基)-1,3,5-三、雙(N-4-氰氧基-2-甲基苯基)-4,4’-氧基二鄰苯二甲醯亞胺、雙(N-3-氰氧基-4-甲基苯基)-4,4’-氧基二鄰苯二甲醯亞胺、雙(N-4-氰氧基苯基)-4,4’-氧基二鄰苯二甲醯亞胺、雙(N-4-氰氧基-2-甲基苯基)-4,4’-(六氟異亞丙基)二鄰苯二甲醯亞胺、參(3,5-二甲基-4-氰氧基苄基)異氰脲酸酯、2-苯基-3,3-雙(4-氰氧基苯基)苄甲內醯胺、2-(4-甲基苯基)-3,3-雙(4-氰氧基苯基)苄甲內醯胺、2-苯基-3,3-雙(4-氰氧基-3-甲基苯基)苄甲內醯胺、1-甲基-3,3-雙(4-氰氧基苯基)吲哚啉-2-酮、及2-苯基-3,3-雙(4-氰氧基苯基)吲哚啉-2-酮。
又,作為上述通式(2)表示之化合物之其他具體例,不限定於以下,可列舉利用與上述同樣的方法將苯酚樹脂予以氰酸酯化而得者等、以及該等之預聚物等,苯酚樹脂可列舉:苯酚酚醛清漆樹脂及甲酚酚醛清漆樹脂(利用公知的方法,使苯酚、烷基取代之苯酚或鹵素取代之苯酚與福馬林或多聚甲醛等甲醛化合物在酸性溶液中反應而得者)、參苯酚酚醛清漆樹脂(使羥基苯甲醛與苯酚在酸性觸媒的存在下反應而得者)、茀酚醛清漆樹脂(使茀酮化合物與9,9-雙(羥基芳基)茀類在酸性觸媒的存在下反應而得者)、苯酚芳烷基樹脂、甲酚芳烷基樹脂、萘酚芳烷基樹脂及聯苯芳烷基樹脂(利用公知的方法,使如Ar4
-(CH2
Y)2
(Ar4
表示苯基,Y表示鹵素原子。以下,在該段落中同樣。)表示之雙鹵代甲基化合物與苯酚化合物在酸性觸媒或無觸媒下反應而得者,使如Ar4
-(CH2
OR)2
表示之雙(烷氧基甲基)化合物與苯酚化合物在酸性觸媒的存在下反應而得者,或使如Ar4
-(CH2
OH)2
表示之雙(羥基甲基)化合物與苯酚化合物在酸性觸媒的存在下反應而得者,或使芳香族醛化合物、芳烷基化合物及苯酚化合物縮聚而得者)、苯酚改性二甲苯甲醛樹脂(利用公知的方法,使二甲苯甲醛樹脂與苯酚化合物在酸性觸媒的存在下反應而得者)、改性萘甲醛樹脂(利用公知的方法,使萘甲醛樹脂與羥基取代芳香族化合物在酸性觸媒的存在下反應而得者)、苯酚改性二環戊二烯樹脂、具有聚伸萘基醚結構之苯酚樹脂(利用公知的方法,使在1分子中具有2個以上之苯酚性羥基的多元羥基萘化合物在鹼性觸媒的存在下脫水縮合而得者)等。
上述氰酸酯化合物(B)可單獨使用1種,亦可將2種以上混合使用。
其中,宜為苯酚酚醛清漆型氰酸酯化合物、萘酚芳烷基型氰酸酯化合物、聯苯芳烷基型氰酸酯化合物、伸萘基醚型氰酸酯化合物、二甲苯樹脂型氰酸酯化合物、金剛烷骨架型氰酸酯化合物,為萘酚芳烷基型氰酸酯化合物特佳。
萘酚芳烷基型氰酸酯之具體例,可列舉式(5)表示之萘酚芳烷基型氰酸酯。藉由使用如此之萘酚芳烷基型氰酸酯,有獲得熱膨脹係數更低之硬化物的傾向
氰酸酯化合物(B)之含量可因應所期望之特性適當設定,並無特別限定,考量獲得熱膨脹係數更低之硬化物的觀點,宜相對於樹脂固體成分100質量份為1~90質量份,更佳為30~70質量份,尤佳為40~60質量份。
[填充材(C)] 就本實施形態之樹脂組成物而言,考量熱膨脹特性、尺寸穩定性、阻燃性、熱傳導率、介電特性等的觀點,宜進一步含有填充材(C)。填充材(C)可適當使用公知品,其種類並無特別限定。尤其可理想地將一般使用在疊層板用途中的填充材作為填充材(C)使用。填充材(C)之具體例,可列舉:天然二氧化矽、熔融二氧化矽、合成二氧化矽、非晶二氧化矽、AEROSIL、中空二氧化矽等二氧化矽類;白碳、鈦白、氧化鋅、氧化鎂、氧化鋯等氧化物;氮化硼、凝聚氮化硼、氮化矽、氮化鋁、硫酸鋇、氫氧化鋁、氫氧化鋁加熱處理品(將氫氧化鋁進行加熱處理,以減少一部分結晶水而得者)、軟水鋁石、氫氧化鎂等金屬水合物;氧化鉬、鉬酸鋅等鉬化合物;硼酸鋅、錫酸鋅、氧化鋁、黏土、高嶺土、滑石、煅燒黏土、煅燒高嶺土、煅燒滑石、雲母、E-玻璃、A-玻璃、NE-玻璃、C-玻璃、L-玻璃、D-玻璃、S-玻璃、M-玻璃G20、玻璃短纖維(包括E玻璃、T玻璃、D玻璃、S玻璃、Q玻璃等的玻璃微粉末類。)、中空玻璃、球狀玻璃等無機系的填充材,另外還可列舉:苯乙烯型、丁二烯型、丙烯酸型等的橡膠粉末、核殼型的橡膠粉末、及聚矽氧樹脂粉末、聚矽氧橡膠粉末、聚矽氧複合粉末等有機系的填充材等。該等填充材可單獨使用1種,亦可將2種以上組合使用。 該等中,選自於由二氧化矽、氫氧化鋁、軟水鋁石、氧化鎂及氫氧化鎂構成之群組中之1種或2種以上為較理想。藉由使用該等填充材,樹脂組成物之熱膨脹特性、尺寸穩定性、阻燃性等特性有更為改善的傾向。
本實施形態之樹脂組成物中之填充材(C)的含量,可因應所期望之特性適當設定,並無特別限定,考量樹脂組成物之成形性的觀點,令樹脂固體成分為100質量份時,宜為50~1600質量份,更佳為50~750質量份,尤佳為50~300質量份,特佳為50~200質量份。
此處,當樹脂組成物進一步含有填充材(C)時,宜倂用矽烷偶聯劑、濕潤分散劑。就矽烷偶聯劑而言,可理想地使用一般用在無機物之表面處理者,其種類並無特別限定。作為矽烷偶聯劑,具體而言,不限定於以下,可列舉:γ-胺基丙基三乙氧基矽烷、N-β-(胺基乙基)-γ-胺基丙基三甲氧基矽烷等胺基矽烷系;γ-環氧丙氧基丙基三甲氧基矽烷、β-(3,4-環氧環己基)乙基三甲氧基矽烷等環氧矽烷系;γ-甲基丙烯醯氧基丙基三甲氧基矽烷、乙烯基-三(β-甲氧基乙氧基)矽烷等乙烯基矽烷系;N-β-(N-乙烯基苄基胺基乙基)-γ-胺基丙基三甲氧基矽烷鹽酸鹽等陽離子矽烷系;以及苯基矽烷系。矽烷偶聯劑可單獨使用1種,亦可將2種以上組合使用。又,就濕潤分散劑而言,可理想地使用一般用在塗料用者,其種類並無特別限定。作為濕潤分散劑,較佳為使用共聚物系之濕潤分散劑,亦可使用市售品。就市售品之具體例而言,不限定於以下,可列舉:BYK Japan(股)製的Disperbyk-110、111、161、180、BYK-W996、BYK-W9010、BYK-W903、BYK-W940等。濕潤分散劑可單獨使用1種,亦可將2種以上組合使用。
[其他成分] 進一步,本實施形態之樹脂組成物中,在不損及所期望之特性的範圍內,可進一步含有上述式(1)表示之環氧樹脂(A)以外之環氧樹脂(以下,稱為「其他環氧樹脂」。)、馬來醯亞胺化合物、苯酚樹脂、氧雜環丁烷樹脂、苯并 化合物、具可聚合之不飽和基之化合物等。藉由倂用該等,將樹脂組成物硬化而獲得之硬化物的阻燃性、低介電性等所期望之特性有改善的傾向。
(其他環氧樹脂) 就其他環氧樹脂而言,只要不是式(1)表示者,並在1分子中具有2個以上之環氧基的環氧樹脂即可,可適當使用公知品,其種類並無特別限定。具體而言,可列舉:雙酚A型環氧樹脂、雙酚E型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、苯酚酚醛清漆型環氧樹脂、雙酚A酚醛清漆型環氧樹脂、環氧丙酯型環氧樹脂、芳烷基酚醛清漆型環氧樹脂、聯苯芳烷基型環氧樹脂、伸萘基醚型環氧樹脂、甲酚酚醛清漆型環氧樹脂、多官能苯酚型環氧樹脂、萘型環氧樹脂、蒽型環氧樹脂、萘骨架改性酚醛清漆型環氧樹脂、苯酚芳烷基型環氧樹脂、萘酚芳烷基型環氧樹脂、二環戊二烯型環氧樹脂、聯苯型環氧樹脂、脂環族環氧樹脂、多元醇型環氧樹脂、含有磷之環氧樹脂、環氧丙胺、環氧丙酯、將丁二烯等之雙鍵環予以氧化而得的化合物、藉由含有羥基之聚矽氧樹脂類與表氯醇之反應而獲得的化合物等。該等環氧樹脂中,考量阻燃性、耐熱性的方面,聯苯芳烷基型環氧樹脂、伸萘基醚型環氧樹脂、多官能苯酚型環氧樹脂、萘型環氧樹脂為較佳。該等環氧樹脂可單獨使用1種,亦可將2種以上組合使用。
(馬來醯亞胺化合物) 就馬來醯亞胺化合物而言,只要是在1分子中具有1個以上之馬來醯亞胺基的化合物即可,可使用一般公知品。例如可列舉:4,4-二苯基甲烷雙馬來醯亞胺、苯基甲烷馬來醯亞胺、間伸苯基雙馬來醯亞胺、2,2-雙(4-(4-馬來醯亞胺苯氧基)-苯基)丙烷、3,3-二甲基-5,5-二乙基-4,4-二苯基甲烷雙馬來醯亞胺、4-甲基-1,3-伸苯基雙馬來醯亞胺、1,6-雙馬來醯亞胺-(2,2,4-三甲基)己烷、4,4-二苯醚雙馬來醯亞胺、4,4-二苯基碸雙馬來醯亞胺、1,3-雙(3-馬來醯亞胺苯氧基)苯、1,3-雙(4-馬來醯亞胺苯氧基)苯、聚苯基甲烷馬來醯亞胺、酚醛清漆型馬來醯亞胺、聯苯芳烷基型馬來醯亞胺、及該等馬來醯亞胺化合物之預聚物、或馬來醯亞胺化合物與胺化合物之預聚物等,並無特別限定。該等馬來醯亞胺化合物可使用1種,亦可將2種以上混合使用。其中,酚醛清漆型馬來醯亞胺化合物、聯苯芳烷基型馬來醯亞胺化合物為特佳。
(苯酚樹脂) 就苯酚樹脂而言,只要是在1分子中具有2個以上之羥基的苯酚樹脂即可,可使用一般公知品。其具體例可列舉:雙酚A型苯酚樹脂、雙酚E型苯酚樹脂、雙酚F型苯酚樹脂、雙酚S型苯酚樹脂、苯酚酚醛清漆樹脂、雙酚A酚醛清漆型苯酚樹脂、環氧丙酯型苯酚樹脂、芳烷基酚醛清漆型苯酚樹脂、聯苯芳烷基型苯酚樹脂、甲酚酚醛清漆型苯酚樹脂、多官能苯酚樹脂、萘酚樹脂、萘酚酚醛清漆樹脂、多官能萘酚樹脂、蒽型苯酚樹脂、萘骨架改性酚醛清漆型苯酚樹脂、苯酚芳烷基型苯酚樹脂、萘酚芳烷基型苯酚樹脂、二環戊二烯型苯酚樹脂、聯苯型苯酚樹脂、脂環族苯酚樹脂、多元醇型苯酚樹脂、含有磷之苯酚樹脂、含有羥基之聚矽氧樹脂類等,並無特別限定。該等苯酚樹脂中,考量阻燃性的觀點,聯苯芳烷基型苯酚樹脂、萘酚芳烷基型苯酚樹脂、含有磷之苯酚樹脂、含有羥基之聚矽氧樹脂為較佳。該等苯酚樹脂可單獨使用1種,亦可將2種以上組合使用。
(氧雜環丁烷樹脂) 氧雜環丁烷樹脂可使用一般公知品。例如可列舉:氧雜環丁烷、2-甲基氧雜環丁烷、2,2-二甲基氧雜環丁烷、3-甲基氧雜環丁烷、3,3-二甲基氧雜環丁烷等烷基氧雜環丁烷、3-甲基-3-甲氧基甲基氧雜環丁烷、3,3-二(三氟甲基)全氟氧雜環丁烷、2-氯甲基氧雜環丁烷、3,3-雙(氯甲基)氧雜環丁烷、聯苯型氧雜環丁烷、OXT-101(東亞合成製商品名)、OXT-121(東亞合成製商品名)等,並無特別限定。該等氧雜環丁烷樹脂可使用1種,亦可將2種以上混合使用。
(苯并 化合物) 就苯并 化合物而言,只要是在1分子中具有2個以上之二氫苯并 環的化合物即可,可使用一般公知品。例如可列舉:雙酚A型苯并 BA-BXZ(小西化學製商品名)、雙酚F型苯并 BF-BXZ(小西化學製商品名)、雙酚S型苯并 BS-BXZ(小西化學製商品名)、P-d型苯并 (四國化成工業製商品名)、F-a型苯并 (四國化成工業製商品名)等,並無特別限定。該等苯并 化合物可使用1種,亦可將2種以上混合使用。
(具可聚合之不飽和基之化合物) 具可聚合之不飽和基之化合物可使用一般公知品。例如可列舉:乙烯、丙烯、苯乙烯、二乙烯基苯、二乙烯基聯苯等乙烯基化合物;(甲基)丙烯酸甲酯、(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、聚丙二醇二(甲基)丙烯酸酯、三羥甲基丙烷二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、新戊四醇四(甲基)丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯等1元或多元醇之(甲基)丙烯酸酯類;雙酚A型環氧(甲基)丙烯酸酯、雙酚F型環氧(甲基)丙烯酸酯等環氧(甲基)丙烯酸酯類;及苯并環丁烯樹脂,並無特別限定。該等具有不飽和基之化合物可使用1種,亦可將2種以上混合使用。此外,上述「(甲基)丙烯酸酯」,係包括丙烯酸酯及與之對應之甲基丙烯酸酯的概念。
(硬化促進劑) 又,本實施形態之樹脂組成物,視需要亦可含有用於適當調節硬化速度之硬化促進劑。作為該硬化促進劑,可理想地使用一般用作氰酸酯化合物或環氧樹脂等之硬化促進劑者,其種類並無特別限定。硬化促進劑之具體例可列舉:辛酸鋅、環烷酸鋅、環烷酸鈷、環烷酸銅、乙醯丙酮鐵、辛酸鎳、辛酸錳等有機金屬鹽類;苯酚、二甲酚、甲酚、間苯二酚、兒茶酚、辛基苯酚、壬基苯酚等苯酚化合物;1-丁醇、2-乙基己醇等醇類;2-甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、1-氰基乙基-2-苯基咪唑、1-氰基乙基-2-乙基-4-甲基咪唑、2-苯基-4,5-二羥基甲基咪唑、2-苯基-4-甲基-5-羥基甲基咪唑等咪唑類及該等咪唑類之羧酸或其酸酐類的加成體等衍生物;二氰二胺(dicyandiamide)、苄基二甲基胺、4-甲基-N,N-二甲基苄基胺等胺類;膦系化合物、氧化膦系化合物、鏻鹽系化合物、二膦系化合物等磷化合物;環氧-咪唑加成物系化合物、苯甲醯基過氧化物、對氯苯甲醯基過氧化物、二-第三丁基過氧化物、過氧化碳酸二異丙酯、過氧化碳酸二-2-乙基己酯等過氧化物;或偶氮雙異丁腈等偶氮化合物。硬化促進劑可單獨使用1種,亦可將2種以上組合使用。 硬化促進劑的使用量,可考慮樹脂之硬化度、樹脂組成物之黏度等適當調整,並無特別限定。硬化促進劑的使用量,可相對於樹脂組成物中之樹脂固體成分100質量份為0.005~10質量份。
(其他添加劑) 進一步,在不損及所期望之特性的範圍內,本實施形態之樹脂組成物可倂用其他熱硬化性樹脂、熱塑性樹脂及其低聚物、彈性體類等各種高分子化合物、阻燃性化合物、以及各種添加劑等。該等只要是一般使用者即可,並無特別限定。作為阻燃性化合物之具體例,不限定於以下,可列舉:4,4’-二溴聯苯等溴化合物;磷酸酯、磷酸三聚氰胺、含有磷之環氧樹脂、三聚氰胺及苯并胍胺等氮化合物;含有 環之化合物、以及聚矽氧系化合物等。又,作為各種添加劑,不限定於以下,例如可列舉:紫外線吸收劑、抗氧化劑、光聚合引發劑、螢光增白劑、光增感劑、染料、顏料、增黏劑、流動調整劑、潤滑劑、消泡劑、分散劑、調平劑、光澤劑、聚合抑制劑等。該等可因應期望而單獨使用1種,亦可將2種以上組合使用。
(有機溶劑) 此外,本實施形態之樹脂組成物中,視需要可含有有機溶劑。此時,本實施形態之樹脂組成物能以上述各種樹脂成分之至少一部分,較佳為全部溶解於有機溶劑或與有機溶劑互溶的態樣(溶液或清漆)使用。有機溶劑只要是能將上述各種樹脂成分之至少一部分,較佳為全部予以溶解或能互溶者即可,可適當使用公知品,其種類並無特別限定。有機溶劑之具體例可列舉:丙酮、甲乙酮、甲基異丁酮等酮類;丙二醇單甲醚、丙二醇單甲醚乙酸酯等賽珞蘇系溶劑;乳酸乙酯、乙酸甲酯、乙酸乙酯、乙酸丁酯、乙酸異戊酯、甲氧基丙酸甲酯、羥基異丁酸甲酯等酯系溶劑;二甲基乙醯胺、二甲基甲醯胺等醯胺類等極性溶劑類;甲苯、二甲苯等芳香族烴等無極性溶劑等。該等可單獨使用1種,亦可將2種以上組合使用。
本實施形態之樹脂組成物可依常法進行製備,只要是可獲得均勻地含有式(1)表示之環氧樹脂(A)及氰酸酯化合物(B)、上述其他任意成分之樹脂組成物的方法即可,其製備方法並無特別限定。例如,藉由將式(1)表示之環氧樹脂(A)及氰酸酯化合物(B)依序摻合至溶劑中,並充分攪拌,可輕易地製備本實施形態之樹脂組成物。
此外,製備樹脂組成物時,可進行用以使各成分均勻地溶解或分散的公知處理(攪拌、混合、混練處理等)。例如,當均勻分散填充材(C)時,藉由使用設置有具適當攪拌能力之攪拌機的攪拌槽進行攪拌分散處理,對於樹脂組成物的分散性提高。上述攪拌、混合、混練處理,例如可使用球磨機、珠磨機等以混合為目的的裝置、或公轉、自轉型混合裝置等公知的裝置適當進行。
本實施形態之樹脂組成物可用作預浸體、覆金屬箔疊層板、印刷電路板、及半導體封裝之構成材料。例如,藉由將本實施形態之樹脂組成物溶解於溶劑而得之溶液含浸或塗佈於基材,並進行乾燥,可獲得預浸體。 又,使用可剝離之塑膠薄膜作為基材,將本實施形態之樹脂組成物溶解於溶劑而得之溶液塗佈於該塑膠薄膜,並進行乾燥,可獲得堆積(build-up)用薄膜或乾薄膜防焊劑。此處,藉由在20℃~150℃之溫度乾燥1~90分鐘,可將溶劑乾燥。 又,本實施形態之樹脂組成物,能以剛將溶劑乾燥後之未硬化的狀態使用,視需要亦可使其成為半硬化(B階段化)的狀態並使用。
以下,針對本實施形態之預浸體進行詳述。本實施形態之預浸體具有基材、及含浸或塗佈於該基材之上述樹脂組成物。本實施形態之預浸體之製造方法,只要是將本實施形態之樹脂組成物與基材予以組合而製造預浸體的方法即可,並無特別限定。具體而言,可藉由將本實施形態之樹脂組成物含浸或塗佈於基材後,利用在120~220℃之乾燥機中乾燥2~15分鐘左右的方法等使其半硬化,而製造本實施形態之預浸體。此時,樹脂組成物相對於基材之附著量,亦即樹脂組成物相對於半硬化後之預浸體之總量的含量(包括填充材(C)。),宜為20~99質量%之範圍。
製造本實施形態之預浸體時所使用之基材,可為用於各種印刷電路板材料之公知者。就如此之基材而言,例如可列舉:E玻璃、D玻璃、L玻璃、S玻璃、T玻璃、Q玻璃、UN玻璃、NE玻璃、球狀玻璃等之玻璃纖維;石英等玻璃以外之無機纖維;聚醯亞胺、聚醯胺、聚酯等有機纖維;液晶聚酯等織布,但並不限定於該等。基材的形狀已知有織布、不織布、粗紗、切股氈、及表面氈等,可為該等中之任意者。基材可單獨使用1種,亦可將2種以上適當組合使用。織布中,考量尺寸穩定性的觀點,尤其已施以超開纖處理、孔目堵塞處理之織布為較理想。進一步,考量吸濕耐熱性的觀點,經環氧矽烷處理、或胺基矽烷處理等用矽烷偶聯劑等進行表面處理之玻璃織布為較佳。又,考量電特性的方面,液晶聚酯織布為較佳。進一步,基材的厚度並無特別限定,若為疊層板用途,0.01~0.2mm之範圍為較佳。
本實施形態之覆金屬箔疊層板具有:疊層了至少1片以上之上述預浸體、及配置於該預浸體之單面或兩面之金屬箔。具體而言,可藉由對於1片前述預浸體,或對於重疊有多片預浸體而成者,在其單面或兩面配置銅、鋁等金屬箔,並進行疊層成形而製作。此處,所使用之金屬箔只要是用於印刷電路板材料者即可,並無特別限定,壓延銅箔及電解銅箔等銅箔為較佳。又,金屬箔的厚度並無特別限定,宜為2~70μm,為3~35μm更佳。成形條件可採用通常之印刷電路板用疊層板及多層板之製作時使用的方法。例如,可藉由使用多段壓製機、多段真空壓製機、連續成形機、或高壓釜成形機等,以溫度180~350℃、加熱時間100~300分鐘、面壓20~100kg/cm2
之條件進行疊層成形,而製成本實施形態之覆金屬箔疊層板。又,亦可藉由將上述預浸體與另外製作的內層用配線板組合並疊層成形,而製成多層板。就多層板的製造方法而言,例如可在1片上述預浸體之兩面配置35μm之銅箔,以上述條件進行疊層形成後,形成內層電路,對該電路實施黑化處理而形成內層電路板。進一步,將該內層電路板與上述預浸體交替地各1片逐一配置,進一步於最外層配置銅箔,依上述條件,較佳為真空下進行疊層成形。如此,可製作多層板。
本實施形態之覆金屬箔疊層板,藉由進一步進行圖案形成,可理想地用作印刷電路板。印刷電路板可依常法製造,其製造方法並無特別限定。以下,顯示印刷電路板之製造方法之一例。首先,準備上述覆金屬箔疊層板。然後,對覆金屬箔疊層板之表面施以蝕刻處理而形成內層電路,製作內層基板。對該內層基板之內層電路表面視需要施以用以提高黏著強度之表面處理,然後,在該內層電路表面重疊所需片數的上述預浸體。進一步,於其外側疊層外層電路用之金屬箔,進行加熱加壓並一體成形。以此種方式製成在內層電路與外層電路用之金屬箔之間形成有基材及由熱硬化性樹脂組成物之硬化物構成之絕緣層的多層疊層板。然後,對該多層疊層板施以通孔(through hole)、介層孔(via hole)用之開孔加工後,在該孔之壁面形成使內層電路與外層電路用之金屬箔導通的鍍敷金屬皮膜。進一步,對外層電路用之金屬箔施以蝕刻處理而形成外層電路,藉此,製成印刷電路板。
上述製造例獲得之印刷電路板具有:絕緣層、及形成在該絕緣層之表面的導體層,為絕緣層含有上述本實施形態之樹脂組成物之構成。亦即,上述本實施形態之預浸體(基材及含浸或塗佈於該基材之本實施形態之樹脂組成物)、上述本實施形態之覆金屬箔疊層板之樹脂組成物之層(由本實施形態之樹脂組成物構成之層),係由含有本實施形態之樹脂組成物的絕緣層構成。
本實施形態之樹脂片,係指支持體、及配置於該支持體之表面之上述樹脂組成物層(疊層片),又,亦僅指不包括支持體之樹脂組成物層(單層片)。該疊層片可藉由將上述樹脂組成物溶解於溶劑而得之溶液塗佈於支持體並乾燥而獲得。此處所使用之支持體並無特別限定,例如可列舉:聚乙烯薄膜、聚丙烯薄膜、聚碳酸酯薄膜、聚對苯二甲酸乙二酯薄膜、乙烯四氟乙烯共聚物薄膜、及在該等薄膜之表面塗佈脫模劑而成之脫模薄膜、聚醯亞胺薄膜等有機系薄膜基材;銅箔、鋁箔等導體箔;玻璃板、SUS板、FRP等板狀無機系薄膜。就塗佈方法而言,例如可列舉將上述樹脂組成物溶解於溶劑而得之溶液利用塗佈棒、模塗機、刮刀塗佈機、貝克塗抹機等塗佈在支持體上,以製作支持體與樹脂組成物層成為一體之疊層片的方法。又,塗佈後,將支持體從進一步乾燥獲得之樹脂片剝離或進行蝕刻,亦可獲得單層片。此外,也可藉由將上述本實施形態之樹脂組成物溶解於溶劑或與溶劑相容而得之溶液供給至具片狀空腔之模具內,並進行乾燥等而成形為片狀,以獲得不使用支持體之單層片。
此外,製作本實施形態之樹脂片或單層片時,將溶劑去除時的乾燥條件並無特別限定,宜於20℃~200℃之溫度乾燥1~90分鐘。為20℃以上的話,可進一步防止溶劑殘存在樹脂組成物中,為200℃以下的話,可抑制樹脂組成物之硬化的進行。又,本實施形態之樹脂片或單層片之樹脂層的厚度,可利用本實施形態之樹脂組成物的溶液濃度與塗佈厚度進行調整,並無特別限定。惟,該厚度宜為0.1~500μm。樹脂層的厚度為500μm以下的話,乾燥時溶劑更不易殘留。 [實施例]
以下,利用實施例及比較例對本實施形態進行更具體地說明。本實施形態並不限定於以下之實施例。
(合成例1)氰酸酯化合物之合成 使1-萘酚芳烷基樹脂(新日鐵住金化學(股)公司製)300g(換算為OH基1.28mol)及三乙胺194.6g(1.92mol)(相對於羥基1mol為1.5mol)溶解於二氯甲烷1800g,將其作為溶液1。 將氯化氰125.9g(2.05mol)(相對於羥基1mol為1.6mol)、二氯甲烷293.8g、36%鹽酸194.5g(1.92mol)(相對於羥基1莫耳為1.5莫耳)、水1205.9g於攪拌下保持在液溫-2~-0.5℃,同時將溶液1歷時30分鐘注入。溶液1注入結束後,於同溫度攪拌30分鐘,然後,將三乙胺65g(0.64mol)(相對於羥基1mol為0.5mol)溶解於二氯甲烷65g而得之溶液(溶液2)歷時10分鐘注入。溶液2注入結束後,於同溫度攪拌30分鐘,使反應結束。 之後,將反應液靜置使有機相與水相分離。利用水1300g將獲得之有機相清洗5次。第5次水洗的廢水的導電度為5μS/cm,由此確認藉由以水清洗,可充分去除離子性化合物。 將水洗後的有機相在減壓下濃縮,最後於90℃濃縮乾燥1小時而得到係目的之萘酚芳烷基型之氰酸酯化合物(SNCN)(橙色黏性物)331g。獲得之SNCN的質量平均分子量Mw為600。又,SNCN的IR光譜顯示2250cm-1
(氰酸酯基)的吸收,且未顯示羥基的吸收。
(實施例1) 將合成例1獲得之SNCN50質量份、下式(1-1)表示之環氧樹脂(新日鐵住金化學(股)製「GK-3007-50D」)50質量份、熔融二氧化矽(SC2050MB,Admatechs(股)製)100質量份、辛酸鋅(日本化學產業(股)製)0.13質量份予以混合,得到清漆。將該清漆以甲乙酮進行稀釋,含浸塗覆於厚度0.1mm之E玻璃織布,並在165℃加熱乾燥5分鐘,獲得樹脂含量50質量%之預浸體。
將獲得之預浸體8片、及2片重疊,並在上下配置12μm厚之電解銅箔(3EC-M3-VLP,三井金屬(股)製),於壓力30kgf/cm2
、溫度220℃進行120分鐘的疊層成型,獲得絕緣層厚度0.8mm之覆金屬箔疊層板。使用獲得之覆金屬箔疊層板,進行銅箔剝離強度、彎曲強度、彎曲彈性模量、吸水率、線熱膨脹係數、熱重量減少率及熱傳導率的評價。結果顯示於表1。
(比較例1) 使用下式(6)表示之聯苯芳烷基型環氧樹脂(NC-3000-FH,日本化藥(股)製)50質量份替換實施例1中之式(1)表示之環氧樹脂50質量份,並將辛酸鋅設定為0.12質量份,除此以外,與實施例1同樣進行,得到樹脂含量50質量%之預浸體。進一步獲得厚度0.8mm、及0.2mm之覆金屬箔疊層板。獲得之覆金屬箔疊層板的評價結果顯示於表1。
[測定方法及評價方法] (1)銅箔剝離強度 使用以上述方式獲得之絕緣層厚度0.8mm之覆銅疊層板的試驗片(30mm×150mm×厚度0.8mm),依據JIS C6481之印刷電路板用覆銅疊層板試驗方法(參照5.7剝離強度。),測定銅箔的剝離強度3次,將下限值之平均值作為測定值。
(2)彎曲強度 將獲得之絕緣層厚度0.8mm之覆金屬箔疊層板之兩面的銅箔利用蝕刻去除,然後依據JIS C6481,使用試驗片(50mm×25mm×0.8mm)以Autograph(島津製作所製的AG-IS)裝置,於25℃之溫度下以試驗數5測定彎曲強度,將最大值之平均值作為測定值。
(3)彎曲彈性模量 將獲得之絕緣層厚度0.8mm之覆金屬箔疊層板之兩面的銅箔利用蝕刻去除,然後依據JIS C6481,使用試驗片(50mm×25mm×0.8mm),以試驗數5測定彎曲彈性模量,將最大值之平均值作為測定值。
(4)吸水率 使用獲得之絕緣層厚度0.8mm之覆金屬箔疊層板的30mm×30mm之樣品,依據JIS C6481,測定以加壓蒸煮器試驗機(平山製作所製,PC-3型)在121℃、2大氣壓下處理5小時後的吸水率。
(5)線熱膨脹係數 對於獲得之絕緣層厚度0.8mm之覆金屬箔疊層板,利用JlS C6481規定之TMA法(Thermo-mechanical analysis),針對疊層板之絕緣層測定玻璃布之縱向方向、及試樣之厚度方向的熱膨脹係數,求出其值。具體而言,將上述獲得之覆金屬箔疊層板之兩面的銅箔利用蝕刻去除,然後,使用熱機械分析裝置(TA Instrument製)以每分鐘10℃從40℃升溫至340℃,測定從60℃到120℃之線熱膨脹係數(ppm/K)。
(6)熱重量減少率 將獲得之絕緣層厚度0.8mm之覆金屬箔疊層板的銅箔利用蝕刻去除,然後依據JIS K7120-1987,利用熱重-差示熱同時測定裝置TG/DTA6200(SII nanotechnology(股)製),以試驗片3mm×3mm×0.8mm、氮氣流通下、開始溫度300℃、升溫速度10℃/分的條件進行升溫,依下式求出到達450℃及500℃之時點的熱重量減少率(熱分解量(%))。 熱重量減少率(%)=(I-J)/I×100 (I表示於開始溫度之重量,J表示於450℃或500℃之重量。)
(7)熱傳導率 測定獲得之絕緣層厚度0.8mm之覆金屬箔疊層板的密度,又,利用DSC(TA Instrumen Q100型)測定比熱,進一步,利用氙閃光分析儀(Bruker:LFA447 Nanoflash)測定熱擴散率。然後,由下式算出厚度方向的熱傳導率。 熱傳導率(W/m・K)=密度(kg/m3
)×比熱(kJ/kg・K)×熱擴散率(m2
/S)×1000
本申請案係基於2016年9月12日提申的日本專利申請案(日本特願2016-177833號),其內容在此納入作為參照。
Claims (9)
- 如申請專利範圍第1項之樹脂組成物,其中,該環氧樹脂(A)之含量相對於樹脂固體成分100質量份為1~90質量份。
- 如申請專利範圍第1或2項之樹脂組成物,更含有填充材(C)。
- 如申請專利範圍第3項之樹脂組成物,其中,該填充材(C)之含量相對於樹脂固體成分100質量份為50~1600質量份。
- 一種預浸體,具有: 基材;及含浸或塗佈於該基材之如申請專利範圍第1至5項中任一項之樹脂組成物。
- 一種覆金屬箔疊層板,具有:疊層了至少1片以上之如申請專利範圍第6項之預浸體;配置於該預浸體之單面或兩面之金屬箔。
- 一種樹脂片,具備:支持體;及配置於該支持體之表面之如申請專利範圍第1至5項中任一項之樹脂組成物。
- 一種印刷電路板,具有絕緣層及形成在該絕緣層之表面之導體層;該絕緣層含有如申請專利範圍第1至5項中任一項之樹脂組成物。
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- 2017-09-01 CN CN201780016343.9A patent/CN109071772A/zh active Pending
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JP2012251048A (ja) * | 2011-06-01 | 2012-12-20 | Panasonic Corp | 半導体封止用エポキシ樹脂組成物および半導体装置 |
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KR101981440B1 (ko) | 2019-05-22 |
US20190023832A1 (en) | 2019-01-24 |
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EP3511355A4 (en) | 2019-09-25 |
JP6350891B1 (ja) | 2018-07-04 |
CN109071772A (zh) | 2018-12-21 |
JPWO2018047724A1 (ja) | 2018-09-20 |
EP3511355A1 (en) | 2019-07-17 |
US10703855B2 (en) | 2020-07-07 |
KR20180102692A (ko) | 2018-09-17 |
EP3511355B1 (en) | 2021-12-29 |
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