TWI725956B - 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片、及印刷電路板 - Google Patents
樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片、及印刷電路板 Download PDFInfo
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- TWI725956B TWI725956B TW105104217A TW105104217A TWI725956B TW I725956 B TWI725956 B TW I725956B TW 105104217 A TW105104217 A TW 105104217A TW 105104217 A TW105104217 A TW 105104217A TW I725956 B TWI725956 B TW I725956B
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- resin
- resin composition
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- bis
- cyanate ester
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- 239000002184 metal Substances 0.000 title claims description 28
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- 239000004643 cyanate ester Substances 0.000 claims abstract description 63
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- 125000000217 alkyl group Chemical group 0.000 claims abstract description 22
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- 125000003710 aryl alkyl group Chemical group 0.000 description 4
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- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 4
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Abstract
本發明係提供含有氰酸酯化合物(A)及通式(1)表示之環氧樹脂(B)之樹脂組成物; 【化1】
Description
本發明係關於樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片、及印刷電路板。
近年來,廣泛使用於電子機器或通訊器材、個人電腦等之半導體更加速地高積體化及小型化。與此伴隨使得對於印刷電路板使用之半導體封裝用疊層板之各種特性之要求變得越來越嚴格。作為要求的特性可舉例如低吸水性、吸濕耐熱性、阻燃性、低介電係數、低介電正切、低熱膨脹率、耐熱性、耐藥品性、高鍍敷剝離強度等之特性。然而,到目前為止並非一定可滿足此等要求特性。
習知作為耐熱性或電特性優良之印刷電路板用樹脂已知有氰酸酯化合物,將該氰酸酯樹脂與環氧樹脂等併用之樹脂組成物近年來廣泛使用於半導體塑膠封裝體用等之高功能之印刷電路板用材料等。此外,由於多層印刷電路板之小型化、高密度化,而將使用於多層印刷電路板之疊層板薄膜化的研究已積極進行當中。 [先前技術文獻] [專利文獻]
[專利文獻1]國際公開第2013/065694號小冊 [專利文獻2]國際公開第2014/203866號小冊
[發明所欲解決之課題] 然而在此同時,將疊層板薄膜化的情況下產生多層印刷電路板之翹曲增大的問題。為了抑制此多層印刷電路板的翹曲,對於作為絕緣層之材料的樹脂組成物要求成為硬化物時之高玻璃轉化溫度的特性。此外,雖有人提出密合性、低吸水性、吸濕耐熱性、絕緣可靠性等特性優良之由氰酸酯及環氧樹脂構成之樹脂組成物(例如,參照專利文獻1、2),但針對上述玻璃轉化溫度之特性的改善仍不夠充分,故有更提高上述玻璃轉化溫度的需求。
本發明係以上述習知技術的問題為鑑而產生者,目的為提供成為硬化物時玻璃轉化溫度高的樹脂組成物。 [解決課題之手段]
本發明者們針對上述課題深入研究之結果,發現藉由使用含有氰酸酯化合物(A)及具有指定之結構的環氧樹脂(B)的樹脂組成物,可獲得具有高玻璃轉化溫度之硬化物,而完成本發明。也就是說,本發明如下所述。
[1] 含有氰酸酯化合物(A)及通式(1)中表示之環氧樹脂(B)的樹脂組成物 【化1】(1) (式中,存在多個之R各自獨立地表示氫原子、碳數1~6之烷基、及碳數1~6之烷氧基中之任一者。) [2] 如[1]之樹脂組成物,其中,該樹脂組成物中,相對於該樹脂組成物中之樹脂固體成分之總量(100質量%),含有1~90質量%之該通式(1)表示之環氧樹脂(B)。 [3] 如[1]或[2]之樹脂組成物,更含有填充材(C)。 [4] 如[1]~[3]之任一項之樹脂組成物,更含有選自於由該通式(1)表示之環氧樹脂(B)以外之環氧樹脂、馬來醯亞胺化合物、苯酚樹脂、氧雜環丁烷樹脂、苯并 化合物、及具有可聚合之不飽和基之化合物構成之群組中之1種或2種以上。 [5] 如[3]或[4]之樹脂組成物,其中,該樹脂組成物中,相對於該樹脂組成物中之樹脂固體成分之總量(100質量份),含有50~1600質量份之該填充材(C)。 [6] 一種預浸體,具有:基材;及含浸或塗佈於該基材之如[1]~[5]之任一項之樹脂組成物。 [7] 一種覆金屬箔疊層板,具有:1片或疊層了2片以上的如[6]之預浸體;及在該預浸體之單面或兩面疊層成形而得之金屬箔。 [8] 一種樹脂片,具有:片基材;及 塗佈在該片基材之單面或兩面並乾燥之如[1]~[5]之任一項之樹脂組成物。 [9] 一種印刷電路板,具有:含有如[1]~[5]之任一項之樹脂組成物之絕緣層;及在該絕緣層之單面或兩面形成之導體層。 [發明之效果]
根據關於本發明之樹脂組成物,可達成:為玻璃轉化溫度高之硬化物的預浸體、覆金屬箔疊層板、樹脂片、及印刷電路板。
以下將針對本發明為了實施的形態(以下簡稱為「本實施形態」)進行詳細地說明。以下之本實施形態係為了說明本發明之示例,本發明並非限定於以下之實施形態。本發明係可在其意旨之範圍內適當地變形且實施。
<樹脂組成物> 本實施形態之樹脂組成物含有氰酸酯化合物(A)及通式(1)表示之環氧樹脂(B); 【化2】(1) 式中,存在多個之R各自獨立地表示氫原子、碳數1~6之烷基、及碳數1~6之烷氧基中之任一者。
本實施形態之樹脂組成物係藉由含有氰酸酯化合物及上述環氧樹脂(B),而於成為硬化物時具有高玻璃轉化溫度。原因推測如下(然而,原因並非限定於此。)。通式(1)表示之環氧樹脂(B)具有之兩個環氧基,因為與本實施形態之氰酸酯化合物(A)有優良之反應性,成為硬化物時會有效率地進行交聯反應。尤其從本實施形態之樹脂組成物獲得作為本實施形態之預浸體、覆金屬箔疊層板、樹脂片、或印刷電路板之硬化物時的反應條件中,以良好的效率進行上述交聯反應。藉此推得,本實施形態之樹脂組成物係成為硬化物時具有高玻璃轉化溫度之樹脂組成物。
本實施形態之氰酸酯化合物(A)(以下,也稱為「氰酸酯化合物」、「成分(A)」、「(A)」)只要是分子內具有經至少1個氰氧基(氰酸酯基)取代之芳香族部分的樹脂即可,並沒有特別之限制。
作為氰酸酯化合物(A),可舉例如通式(2)表示之化合物。 【化3】(2) 式中,Ar1
存在多個時各自獨立地表示可具有取代基之伸苯基、可具有取代基之伸萘基、或可具有取代基之伸聯苯基。Ra存在多個時各自獨立地表示氫原子、可具有取代基之碳數1~6之烷基、可具有取代基之碳數6~12之芳基、可具有取代基之碳數1~4之烷氧基、碳數1~6之烷基與碳數6~12之芳基鍵結而得之可具有取代基之芳烷基、及碳數1~6之烷基與碳數6~12之芳基鍵結而得之可具有取代基之烷芳基中的任一者。p表示與Ar1
鍵結之氰氧基之數量,該氰氧基之數量存在多個時各自獨立,為1~3之整數。q表示與Ar1
鍵結之Ra的數量,該Ra之數量當存在多個時各自獨立,例如Ar1
是伸苯基時為4-p、伸萘基時為6-p、伸聯苯基時為8-p。t表示平均重複數,該平均重複數為0~50之整數,通式(2)表示之化合物可為不同t之化合物的混合物。X存在多個時各自獨立地表示單鍵、碳數1~50之2價之有機基(氫原子可取代為雜原子)、氮元素數1~10之2價之有機基(例如:-N-R-N-(R表示可具有取代基之伸烷基))、羰基(-CO-)、羧基(-C(=O)O-)、二氧化羰基(-OC(=O)O-)、磺醯基(-SO2
-)、2價之硫原子及2價之氧原子中的任一者。
通式(2)中,Ra表示之烷基可具有鏈狀結構及環狀結構(例如環烷基)中之任一者。此外,通式(2)中,Ra表示之烷基及芳基中之氫原子可各自獨立地取代為氟、氯等之鹵素原子;甲氧基、苯氧基等之烷氧基;氰基等。
作為上述烷基,雖然沒有特別之限制,可舉例如甲基、乙基、丙基、異丙基、正丁基、異丁基、三級丁基、正戊基、1-乙基丙基、2,2-二甲基丙基、環戊基、己基、環己基、三氟甲基等。
作為上述之烷氧基,雖然沒有特別之限制,可舉例如甲氧基、乙氧基、丙氧基、異丙氧基、正丁氧基、異丁氧基、三級丁氧基、苯氧基等。
通式(2)中,作為X表示之碳數1~50之2價之有機基,雖然沒有特別之限制,可舉例如亞甲基、伸乙基、三亞甲基、伸丙基、伸環戊基、伸環己基、三甲基伸環己基、聯苯基亞甲基、二甲基亞甲基-伸苯基-二甲基亞甲基、茀二基、酞內酯二基等。上述之2價之有機基中之氫原子可取代為氟、氯等之鹵素原子;甲氧基、苯氧基等之烷氧基;氰基等。
通式(2)中,作為X表示之氮元素數1~10之2價之有機基,雖然沒有特別之限制,可舉例如亞胺基、聚醯亞胺基等。
此外,作為通式(2)中X表示之結構,雖然沒有特別之限制,可列舉通式(3)表示之結構及通式(4)表示之結構。 【化4】(3) 式中,Ar2
存在多個時各自獨立地表示伸苯基、伸萘基及伸聯苯基中之任一者。Rb、Rc、Rf及Rg各自獨立表示氫原子、碳數1~6之烷基、碳數6~12之芳基、三氟甲基及經至少1個苯酚性羥基取代之芳基中的任一者。此外Rb、Rc、Rf及Rg存在多個時各自獨立。Rd及Re各自獨立表示氫原子、碳數1~6之烷基、碳數6~12之芳基、碳數1~4之烷氧基、及羥基中的任一者。此外,Rd及Re存在多個時為各自獨立。u表示0~5之整數,通式(2)表示之化合物可為不同u之化合物的混合物。 【化5】(4) 式中,Ar3
存在多個時各自獨立表示伸苯基、伸萘基、及伸聯苯基中之任一者。Ri及Rj各自獨立表示氫原子、碳數1~6之烷基、碳數6~12之芳基、苄基、碳數1~4之烷氧基、羥基、三氟甲基、及有經至少1個氰氧基取代之芳基中之任一者。v表示0~5之整數,通式(2)表示之化合物可為不同v之化合物的混合物。
作為通式(3)之Ar2
及通式(4)之Ar3
,雖然沒有特別之限制,可舉例如1,4-伸苯基、1,3-伸苯基、4,4’-伸聯苯基、2,4’-伸聯苯基、2,2’-伸聯苯基、2,3’-伸聯苯基、3,3’-伸聯苯基、3,4’-伸聯苯基、2,6-伸萘基、1,5-伸萘基、1,6-伸萘基、1,8-伸萘基、1,3-伸萘基、1,4-伸萘基等。
通式(3)之Rb~Rf及通式(4)之Ri、Rj表示之烷基及芳基為各自獨立且與通式(2)所記載者相同。
作為通式(2)表示之氰酸酯化合物(A),雖然沒有特別之限制,可舉例如氰氧基苯、1-氰氧基-2-、1-氰氧基-3-、或1-氰氧基-4-甲基苯、1-氰氧基-2-、1-氰氧基-3-、或1-氰氧基-4-甲氧基苯、1-氰氧基-2,3-、1-氰氧基-2,4-、1-氰氧基-2,5-、1-氰氧基-2,6-、1-氰氧基-3,4-或1-氰氧基-3,5-二甲基苯、氰氧基乙基苯、氰氧基丁基苯、氰氧基辛基苯、氰氧基壬基苯、2-(4-氰氧基苯基)-2-苯基丙烷(4-α-基酚之氰酸酯)、1-氰氧基-4-環己基苯、1-氰氧基-4-乙烯基苯、1-氰氧基-2-或1-氰氧基-3-氯苯、1-氰氧基-2,6-二氯苯、1-氰氧基-2-甲基-3-氯苯、氰氧基硝基苯、1-氰氧基-4-硝基-2-乙基苯、1-氰氧基-2-甲氧基-4-烯丙苯(丁香酚之氰酸酯)、甲基(4-氰氧基苯基)硫醚、1-氰氧基-3-三氟甲基苯、4-氰氧基聯苯、1-氰氧基-2-或1-氰氧基-4-乙醯基苯、4-氰氧基苯甲醛、4-氰氧基苯甲酸甲酯、4-氰氧基苯甲酸苯酯、1-氰氧基-4-乙醯胺基苯、4-氰氧基二苯基酮、1-氰氧基-2,6-二(三級丁基)苯、1,2-二氰氧基苯、1,3-二氰氧基苯、1,4-二氰氧基苯、1,4-二氰氧基-2-三級丁基苯、1,4-二氰氧基-2,4-二甲基苯、1,4-二氰氧基-2,3,4-三甲基苯、1,3-二氰氧基-2,4,6-三甲基苯、1,3-二氰氧基-5-甲基苯、1-氰氧基或2-氰氧基萘、1-氰氧基-4-甲氧基萘、2-氰氧基-6-甲基萘、2-氰氧基-7-甲氧基萘、2,2’-二氰氧基-1,1’-聯萘、1,3-、1,4-、1,5-、1,6-、1,7-、2,3-、2,6-或2,7-二氰氧基萘、2,2’-或4,4’二氰氧基聯苯、4,4’-二氰氧基八氟聯苯、2,4’-或4,4’-二氰氧基二苯甲烷、雙(4-氰氧基-3,5-二甲基苯基)甲烷、1,1-雙(4-氰氧基苯基)乙烷、1,1-雙(4-氰氧基苯基)丙烷、2,2-雙(4-氰氧基苯基)丙烷、2,2-雙(4-氰氧基-3-甲基苯基)丙烷、2,2-雙(2-氰氧基-5-聯苯基)丙烷、2,2-雙(4-氰氧基苯基)六氟丙烷、2,2-雙(4-氰氧基-3,5-二甲基苯基)丙烷、1,1-雙(4-氰氧基苯基)丁烷、1,1-雙(4-氰氧基苯基)異丁烷、1,1-雙(4-氰氧基苯基)戊烷、1,1-雙(4-氰氧基苯基)-3-甲基丁烷、1,1-雙(4-氰氧基苯基)-2-甲基丁烷、1,1-雙(4-氰氧基苯基)-2,2-二甲基丙烷、2,2-雙(4-氰氧基苯基)丁烷、2,2-雙(4-氰氧基苯基)戊烷、2,2-雙(4-氰氧基苯基)己烷、2,2-雙(4-氰氧基苯基)-3-甲基丁烷、2,2-雙(4-氰氧基苯基)-4-甲基戊烷、2,2-雙(4-氰氧基苯基)-3,3-二甲基丁烷、3,3-雙(4-氰氧基苯基)己烷、3,3-雙(4-氰氧基苯基)庚烷、3,3-雙(4-氰氧基苯基)辛烷、3,3-雙(4-氰氧基苯基)-2-甲基戊烷、3,3-雙(4-氰氧基苯基)-2-甲基己烷、3,3-雙(4-氰氧基苯基)-2,2-二甲基戊烷、4,4-雙(4-氰氧基苯基)-3-甲基庚烷、3,3-雙(4-氰氧基苯基)-2-甲基庚烷、3,3-雙(4-氰氧基苯基)-2,2-二甲基己烷、3,3-雙(4-氰氧基苯基)-2,4-二甲基己烷、3,3-雙(4-氰氧基苯基)-2,2,4-三甲基戊烷、2,2-雙(4-氰氧基苯基)-1,1,1,3,3,3-六氟丙烷、雙(4-氰氧基苯基)苯基甲烷、1,1-雙(4-氰氧基苯基)-1-苯基乙烷、雙(4-氰氧基苯基)聯苯基甲烷、1,1-雙(4-氰氧基苯基)環戊烷、1,1-雙(4-氰氧基苯基)環己烷、2,2-雙(4-氰氧基-3-異丙基苯基)丙烷、1,1-雙(3-環己基-4-氰氧基苯基)環己烷、雙(4-氰氧基苯基)二苯基甲烷、雙(4-氰氧基苯基)-2,2-二氯乙烯、1,3-雙(2-(4-氰氧基苯基)-2-丙基)苯、1,4-雙(2-(4-氰氧基苯基)-2-丙基)苯、1,1-雙(4-氰氧基苯基)-3,3,5-三甲基環己烷、4-(雙(4-氰氧基苯基)甲基)聯苯、4,4-二氰氧基二苯基酮、1,3-雙(4-氰氧基苯基)-2-丙烷-1-酮、雙(4-氰氧基苯基)醚、雙(4-氰氧基苯基)硫醚、雙(4-氰氧基苯基)碸、4-氰氧基苯甲酸-4-氰氧基苯基酯(4-氰氧基苯基-4-氰氧基苯甲酸酯)、雙(4-氰氧基苯基)碳酸酯、1,3-雙(4-氰氧基苯基)金剛烷、1,3-雙(4-氰氧基苯基)-5,7-二甲基金剛烷、3,3-雙(4-氰氧基苯基)異苯并呋喃-1(3H)-酮(酚酞之氰酸酯)、3,3-雙(4-氰氧基-3-甲基苯基)異苯并呋喃-1(3H)-酮(鄰甲苯酚酞之氰酸酯)、9,9’-雙(4-氰氧基苯基)茀、9,9-雙(4-氰氧基-3-甲基苯基)茀、9,9-雙(2-氰氧基-5-聯苯基)茀、參(4-氰氧基苯基)甲烷、1,1,1-參(4-氰氧基苯基)乙烷、1,1,3-參(4-氰氧基苯基)丙烷、α,α,α’-參(4-氰氧基苯基)-1-乙基-4-異丙基苯、1,1,2,2,-肆(4-氰氧基苯基)乙烷、肆(4-氰氧基苯基)甲烷、2,4,6-參(N-甲基-4-氰氧基苯胺基)-1,3,5-三氮、2,4-雙(N-甲基-4-氰氧基苯胺基)-6-(N-甲基苯胺基)-1,3,5-三氮、雙(N-4-氰氧基-2-甲基苯基)-4,4’-氧基二酞醯亞胺、雙(N-3-氰氧基-4-甲基苯基)-4,4’-氧基二酞醯亞胺、雙(N-4-氰氧基苯基)-4,4’-氧基二酞醯亞胺、雙(N-4-氰氧基-2-甲基苯基)-4,4’-(六氟亞異丙基)二酞醯亞胺、參(3,5-二甲基-4-氰氧基苄基)異氰尿酸酯、2-苯基-3,3-雙(4-氰氧基苯基)苄甲內醯胺、2-(4-甲基苯基)-3,3-雙(4-氰氧基苯基)苄甲內醯胺、2-苯基-3,3-雙(4-氰氧基-3-甲基苯基)苄甲內醯胺、1-甲基-3,3-雙(4-氰氧基苯基)吲哚啉-2-酮、2-苯基-3,3-雙(4-氰氧基苯基)吲哚啉-2-酮、苯酚酚醛清漆(novolac)樹脂或甲酚酚醛清漆樹脂(藉由公知之方法,將苯酚、烷基取代之苯酚或鹵素取代之苯酚與福馬林或聚甲醛等甲醛化合物於酸性溶液中使其反應而得者)、三苯酚酚醛清漆樹脂(將羥苯甲醛與苯酚在酸性催化劑之存在下使其反應而得者)、茀酚醛清漆樹脂(將茀酮化合物與9,9-雙(羥芳基)茀類在酸性催化劑之存在下使其反應而得者)、苯酚芳烷基樹脂、甲酚芳烷基樹脂、萘酚芳烷基樹脂或聯苯芳烷基樹脂(藉由公知之方法,將如Ar2
-(CH2
Y)2
表示之雙鹵素甲基化合物與苯酚化合物在有酸性催化劑或無催化劑下使其反應而得者;如Ar2
-(CH2
OR)2
表示之雙(烷氧基甲基))化合物或如Ar2
-(CH2
OH)2
表示之雙(羥甲基)化合物與苯酚化合物在酸性催化劑之存在下使其反應而得者;或將芳香族醛類化合物、芳烷基化合物與苯酚化合物縮聚而得者)、苯酚改性二甲苯甲醛樹脂(藉由公知之方法,將二甲苯甲醛樹脂與苯酚化合物於酸性催化劑之存在下使其反應而得者)、改性萘甲醛樹脂(藉由公知之方法,將萘甲醛樹脂與羥取代芳香族化合物在酸性催化劑之存在下使其反應而得者)、苯酚改性二環戊二烯樹脂、具有聚伸萘基醚結構之苯酚樹脂(藉由公知之方法,將1分子中具有2個以上之苯酚性羥基的多價羥萘化合物在鹼性催化劑之存在下使其脫水縮合而得者)等將苯酚樹脂藉由與上述同樣之方法氰酸酯化者等。此等之其他的氰酸酯化合物(A)係可使用單獨1種或混合2種以上使用。
上述中,氰酸酯化合物(A)宜為苯酚酚醛清漆型氰酸酯化合物、萘酚芳烷基型氰酸酯化合物、聯苯芳烷基型氰酸酯化合物、伸萘基醚型氰酸酯化合物、二甲苯樹脂型氰酸酯化合物、及金剛烷骨架型氰酸酯化合物,更宜為萘酚芳烷基型氰酸酯化合物。
作為苯酚酚醛清漆型氰酸酯化合物,只要是具有具氰氧基之苯環彼此間藉由伸烷基鍵結的結構者即可,並沒有特別之限制,可舉例如上述通式(2)中Ar1
表示伸苯基且X表示亞甲基者。具體言之可舉出下述通式(5)表示之氰酸酯化合物。藉由如此之聯苯芳烷基型氰酸酯化合物獲得之硬化物,有熱膨脹率低,燃燒性質、低吸水性及吸濕耐熱性更為優良之趨勢。 【化7】(5) 式中,R2
各自獨立地表示氫原子或烷基,宜為氫原子,n2表示1以上之整數,宜為1以上10以下之整數,更宜為1以上7以下之整數。
作為萘酚芳烷基型氰酸酯化合物,只要是具有具氰氧基之萘環與苯環間藉由伸烷基鍵結的結構者即可,並沒有特別之限制,可舉例如上述通式(2)中Ar1
表示伸萘基、X表示上述通式(3)且Ar2
表示伸苯基者。具體而言宜為下述通式(6)表示之氰酸酯化合物。下述通式(6)表示之氰酸酯化合物中,與苯環鍵結的兩個亞甲基可以鄰位、間位或對位鍵結。其中,與苯環鍵結之兩個亞甲基以苯環之間位、對位鍵結較為理想。藉由如此之萘酚芳烷基型氰酸酯化合物獲得之硬化物,有熱膨脹率低,燃燒性質、低吸水性及吸濕耐熱性更為優良之趨勢。 【化8】(6) 式中,n表示1~50之整數,宜為1~10之整數。
作為聯苯芳烷基型氰酸酯化合物,只要是具有具氰氧基之伸聯苯環與苯環間藉由伸烷基鍵結的結構者即可,並沒有特別之限制,可舉例如上述通式(2)中Ar1
表示伸聯苯基、X表示通式(3)且Ar2
表示伸苯基者。具體而言,可舉出下述通式(7)表示之氰酸酯化合物。藉由如此之聯苯芳烷基型氰酸酯化合物獲得之硬化物,有熱膨脹率低,燃燒性質、低吸水性、及吸濕耐熱性更為優良的趨勢。 【化9】(7) 式中,R5
各自獨立表示氫原子或烷基,宜為氫原子,n表示1以上之整數,宜為1以上10以下之整數,更宜為1以上7以下之整數。
作為伸萘基醚型氰酸酯化合物,只要是具有具氰氧基之伸萘基環彼此間藉由氧原子鍵結的結構者即可,並沒有特別之限制,可舉例如上述通式(2)中Ar1
表示伸萘基且X表示2價之氧原子者。藉由如此之伸萘基醚型氰酸酯化合物獲得之硬化物有熱膨脹率低,燃燒性質、低吸水性、及吸濕耐熱性更為優良之趨勢。
作為二甲苯樹脂型氰酸酯化合物,只要是具有具氰氧基及2個甲基之苯環彼此藉由伸烷基鍵結的結構者即可,並沒有特別之限制,可舉例如,於上述通式(2)中Ar1
表示伸苯基、Ra表示甲基、q表示2以上之整數且X表示亞甲基者。藉由如此之二甲苯樹脂型氰酸酯化合物獲得之硬化物,有熱膨脹率低,燃燒性質、低吸水性及吸濕耐熱性更為優良之趨勢。
作為金剛烷骨架型氰酸酯化合物,只要是具有具氰氧基之芳香環與金剛烷基鍵結的結構者即可,並沒有特別之限制,可舉例如上述通式(2)中X表示碳數1~50之2價之有機基者。具體而言可舉出下述通式(8)表示之氰酸酯化合物。藉由如此之金剛烷型氰酸酯化合物獲得之硬化物,有熱膨脹率低,阻燃性及耐熱性更為優良的趨勢。 【化10】(8) 式中,存在多個之Ar1
各自獨立表示可具有取代基之伸苯基、可具有取代基之伸萘基、或者可具有取代基之伸聯苯基,R各自獨立表示氫原子或碳數1~6之烷基,Ra與式(2)中之Ra相同,l表示與Ar1
鍵結之羥基之數量,為1~3之整數,m表示與Ar1
鍵結之Ra的數量,Ar1
為伸苯基時表示5-l之整數,Ar1
為伸萘基時表示7-l之整數,Ar1
為伸聯苯基時表示9-l之整數。
使用上述之氰酸酯化合物(A)之樹脂組成物的硬化物係具有高玻璃轉化溫度、低熱膨脹性、鍍敷密合性等更為優良的特性,使用了上述之苯酚酚醛清漆型氰酸酯化合物、萘酚芳烷基型氰酸酯化合物、聯苯芳烷基型氰酸酯化合物、伸萘基醚型氰酸酯化合物、二甲苯樹脂型氰酸酯化合物、及金剛烷骨架型氰酸酯化合物之氰酸酯化合物(A)之樹脂組成物的硬化物具有高玻璃轉化溫度、低熱膨脹性、鍍敷密合性等更為優良之特性,萘酚芳烷基型氰酸酯化合物具有其特性再更為優良之趨勢。
氰酸酯化合物(A)於本實施形態之樹脂組成物的含量可因應期望之特性適當設定,並沒有特別之限制。然而樹脂組成物中,相對於該樹脂組成物中樹脂固體成分之總量(100質量%),氰酸酯化合物之含量宜為1~90質量%,更宜為10~80質量%,進一步宜為20~70質量%,尤其宜為30~60質量%。氰酸酯化合物(A)之含量為如此之範圍的樹脂組成物,有成為硬化物時其玻璃轉化溫度更為優良的趨勢。
本實施形態之「樹脂組成物中之樹脂固體成分的總量」若無特別指明之情況下,係指於樹脂組成物中,扣除下述溶劑及填充材(C)後之樹脂成分的合計量。此外,樹脂成分係至少包含樹脂組成物中之氰酸酯化合物(A)及環氧樹脂(B),也包含其他樹脂成分。
本實施形態之環氧樹脂(B)(以下也稱為「環氧樹脂」、「成分(B)」、「(B)」)以通式(1)表示。 【化11】(1) 式中,存在多個之R各自獨立表示氫原子、碳數1~6之烷基、及碳數1~6之烷氧基中之任一者。
作為碳數1~6之烷基,雖然沒有特別之限制,可舉例如甲基、乙基、丙基、丁基、戊基、己基等具有直鏈、分支鏈或環狀結構之烷基。其中,碳數1~6之烷基宜為甲基、乙基,更宜為甲基。
此外,作為碳數1~6之烷氧基,雖然沒有特別之限制,可舉例如甲氧基、乙氧基、丙氧基、丁氧基等具有直鏈、分支鏈或環狀結構之烷氧基。其中,碳數1~6之烷氧基宜為甲氧基、乙氧基、丙氧基,更宜為甲氧基。
於此等示例中,考慮耐熱性之觀點,R更宜為氫原子。
通式(1)表示之環氧樹脂(B)係可使用市面販售者,例如適用R表示氫原子之日本化藥(股)公司製之商品名「WHR-991S」。
通式(1)表示之環氧樹脂(B)於本實施形態之樹脂組成物中的含量係可因應期望之特性適當設定,並沒有特別之限制。然而,樹脂組成物中,相對於該樹脂組成物中之樹脂固體成分之總量(100質量%),對於環氧樹脂(B)其含量宜為1~90質量%,更宜為10~80質量%,進一步宜為20~70質量%,尤其宜為30~60質量%。藉由使環氧樹脂(B)之含量為1~90質量%之範圍,有可獲得成為硬化物時其玻璃轉化溫度更為優良之樹脂組成物的趨勢。
本實施形態之樹脂組成物係,宜更含有填充材(C)(以下也稱為「成分(C)」、「(C)」)。作為填充材(C),並沒有特別之限制可適用公知者,其種類也沒有特別之限制,可適當使用該業界一般所使用者。作為填充材(C)之具體例,可舉例如天然二氧化矽、熔融二氧化矽、合成二氧化矽、非晶二氧化矽、Aerosil、中空二氧化矽等二氧化矽類;白碳、鈦白、氧化鋅、氧化鎂、氧化鋯、氮化硼、凝聚氮化硼、氮化矽、氮化鋁、硫酸鋇、氫氧化鋁、氫氧化鋁加熱處理品(氫氧化鋁經加熱處理去除一部分結晶水者);水鋁石、氫氧化鎂等金屬水合物;氧化鉬或鉬酸鋅等鉬化合物;硼酸鋅、錫酸鋅、氧化鋁、黏土、高嶺土、滑石、煅燒黏土、煅燒高嶺土、煅燒滑石、雲母、E-玻璃、A-玻璃、NE-玻璃、C-玻璃、L-玻璃、D-玻璃、S-玻璃、M-玻璃G20、玻璃短纖維(包含E玻璃、T玻璃、D玻璃、S玻璃、Q玻璃等玻璃微粉末類)、中空玻璃、球狀玻璃等無機系之填充材;苯乙烯型、丁二烯型、丙烯酸型等橡膠粉末;核殼(core shell)型之橡膠粉末、矽酮樹脂粉末、矽酮橡膠粉末、矽酮複合粉末等有機系之填充材等。此等填充材(C)可單獨使用1種或組合2種以上使用。
含有此等之填充材(C)有使樹脂組成物之熱膨脹特性、尺寸安定性、阻燃性等特性提高之趨勢。
本實施形態之樹脂組成物之填充材(C)的含量可因應期望之特性適當設定,並沒有特別之限制。然而,樹脂組成物中,相對於該樹脂組成物中之樹脂固體成分的總量(100質量份),填充材(C)之含量宜為50~1600質量份。藉由使填充材(C)之含量為50~1600質量份,樹脂組成物之成形性有變得良好的趨勢。
此處,在使用填充材(C)時,宜一併使用矽烷偶聯劑或濕潤分散劑。作為矽烷偶聯劑,雖然沒有特別之限制,可適用一般之無機物之表面處理所使用者,其種類也沒有特別之限制。作為矽烷偶聯劑之具體例,可列舉矽烷偶聯劑如,γ-胺丙基三乙氧基矽烷、N-β-(胺乙基)-γ-胺丙基三甲氧基矽烷等胺基矽烷系;γ-環氧丙氧基丙基三甲氧基矽烷、β-(3,4-環氧基環己基)乙基三甲氧基矽烷等環氧矽烷系;γ-甲基丙烯醯氧丙基三甲氧基矽烷、乙烯-三(β-甲氧基乙氧基)矽烷等乙烯矽烷系;N-β-(N-乙烯苄基胺乙基)-γ-胺丙基三甲氧基矽烷鹽酸鹽等陽離子型矽烷系;苯基矽烷系。矽烷偶聯劑係可單獨使用1種或組合2種以上使用。此外,作為濕潤分散劑,雖然沒有特別之限制,可適用一般之塗料用所使用者,其種類也沒有特別之限制。濕潤分散劑宜使用共聚合系之濕潤分散劑,作為共聚合系之濕潤分散劑的具體例,雖然沒有特別之限制,可舉例如BYK Japan(股)製的Disperbyk-110、111、161、180、BYK-W996、BYK-W9010、BYK-W903、BYK-W940等。濕潤分散劑係可單獨使用1種或組合2種以上使用。
此外,本實施形態之樹脂組成物,於不損及藉由本發明而得之作用效果的範圍,可更含有選自於由上述式(1)表示之以外的環氧樹脂(以下稱為「其他的環氧樹脂」。)、馬來醯亞胺化合物、苯酚樹脂、氧雜環丁烷樹脂、苯并 化合物及具有可聚合之不飽和基之化合物構成之群組中之1種或2種以上。藉由將成分(A)及成分(B)與此等材料一併使用,有可使樹脂組成物硬化後之硬化物的阻燃性、低介電性等期望之性質提高的趨勢。
作為其他的環氧樹脂,只要是並非通式(1)表示者且1分子中具有2個以上之環氧基之環氧樹脂即可,並沒有特別之限制,例如可適用公知者,其種類也沒有特別之限制。作為其他的環氧樹脂之具體例,可舉例如,通式(1)未表示之雙酚A型環氧樹脂、雙酚E型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、苯酚酚醛清漆型環氧樹脂、雙酚A酚醛清漆型環氧樹脂、環氧丙基酯型環氧樹脂、芳烷基酚醛清漆型環氧樹脂、聯苯芳烷基型環氧樹脂、伸萘基醚型環氧樹脂、甲酚酚醛清漆型環氧樹脂、多官能苯酚型環氧樹脂、萘型環氧樹脂、蒽型環氧樹脂、萘骨架改性酚醛清漆型環氧樹脂、苯酚芳烷基型環氧樹脂、萘酚芳烷基型環氧樹脂、二環戊二烯型環氧樹脂、聯苯型環氧樹脂、脂環式環氧樹脂、多元醇型環氧樹脂、含磷環氧樹脂、環氧丙基胺、環氧丙基酯、使丁二烯等之雙鍵環氧化之化合物、藉由將含羥基之矽酮樹脂類與表氯醇反應而獲得之化合物等。此等之其他的環氧樹脂中,聯苯芳烷基型環氧樹脂、伸萘基醚型環氧樹脂、多官能苯酚型環氧樹脂、萘型環氧樹脂以其阻燃性、耐熱性方面而較理想。此等之其他的環氧樹脂,可單獨使用1種或組合2種以上使用。
作為馬來醯亞胺化合物,只要是1分子中具有1個以上之馬來醯亞胺基之化合物即可,並沒有特別之限制,可使用一般公知者。作為馬來醯亞胺化合物之具體例,可舉例如4,4-二苯基甲烷雙馬來醯亞胺、苯基甲烷馬來醯亞胺、間伸苯基雙馬來醯亞胺、2,2-雙(4-(4-馬來醯亞胺苯氧基)-苯基)丙烷、3,3-二甲基-5,5-二乙基-4,4-二苯基甲烷雙馬來醯亞胺、4-甲基-1,3-伸苯基雙馬來醯亞胺、1,6-雙馬來醯亞胺-(2,2,4-三甲基)己烷、4,4-二苯基醚雙馬來醯亞胺、4,4-二苯基碸雙馬來醯亞胺、1,3-雙(3-馬來醯亞胺苯氧基)苯、1,3-雙(4-馬來醯亞胺苯氧基)苯、聚苯甲烷馬來醯亞胺、酚醛清漆型馬來醯亞胺、聯苯芳烷基型馬來醯亞胺、及此等馬來醯亞胺化合物之預聚合物、馬來醯亞胺化合物與胺化合物之預聚合物等。此等之馬來醯亞胺化合物可單獨使用1種或混合2種以上使用。其中,宜為酚醛清漆型馬來醯亞胺化合物及聯苯芳烷基型馬來醯亞胺化合物。
作為苯酚樹脂、只要是1分子中具有2個以上羥基之苯酚樹脂即可,並沒有特別之限制,可使用一般公知者。作為苯酚樹脂的具體例,可舉例如雙酚A型苯酚樹脂、雙酚E型苯酚樹脂、雙酚F型苯酚樹脂、雙酚S型苯酚樹脂、苯酚酚醛清漆樹脂、雙酚A酚醛清漆型苯酚樹脂、環氧丙基酯型苯酚樹脂、芳烷基酚醛清漆型苯酚樹脂、聯苯芳烷基型苯酚樹脂、甲酚酚醛清漆型苯酚樹脂、多官能苯酚樹脂、萘酚樹脂、萘酚酚醛清漆樹脂、多官能萘酚樹脂、蒽型苯酚樹脂、萘骨架改性酚醛清漆型苯酚樹脂、苯酚芳烷基型苯酚樹脂、萘酚芳烷基型苯酚樹脂、二環戊二烯型苯酚樹脂、聯苯型苯酚樹脂、脂環式苯酚樹脂、多元醇型苯酚樹脂、含磷苯酚樹脂、含羥基矽酮樹脂類等。此等之苯酚樹脂中,聯苯芳烷基型苯酚樹脂、酚萘芳烷基型苯酚樹脂、含磷苯酚樹脂及含羥基矽酮樹脂以其阻燃性而較為理想。此等之苯酚樹脂,可單獨使用1種或組合2種以上使用。
作為氧雜環丁烷樹脂,沒有特別之限制,可使用一般公知者。作為氧雜環丁烷樹脂的具體例,可舉例如氧雜環丁烷、2-甲基氧雜環丁烷、2,2-二甲基氧雜環丁烷、3-甲基氧雜環丁烷、3,3-二甲基氧雜環丁烷等烷基氧雜環丁烷、3-甲基-3-甲氧基甲基氧雜環丁烷、3,3-二(三氟甲基)全氟氧雜環丁烷、2-氯甲基氧雜環丁烷、3,3-雙(氯甲基)氧雜環丁烷、聯苯型氧雜環丁烷、OXT-101(東亞合成製商品名)、OXT-121(東亞合成製商品名)等。此等之氧雜環丁烷樹脂係可單獨使用1種或混合2種以上使用。
作為苯并 化合物,只要是1分子中具有2個以上之二氫苯并 環之化合物即可,並沒有特別之限制,可使用一般之公知者。作為苯并 化合物之具體例,可舉例如雙酚A型苯并 BA-BXZ(小西化學製商品名)、雙酚F型苯并 BF-BXZ(小西化學製商品名)、雙酚S型苯并 BS-BXZ(小西化學製商品名)等。此等之苯并 化合物可單獨使用1種或混合2種以上使用。
作為具有可聚合之不飽和基之化合物,並沒有特別之限制,可使用一般之公知者。作為具有可聚合之不飽和基之化合物的具體例,可舉例如乙烯、丙烯、苯乙烯、二乙烯苯、二乙烯聯苯等乙烯化合物、(甲基)丙烯酸甲酯、(甲基)丙烯酸-2-羥基乙酯、(甲基)丙烯酸-2-羥基丙酯、二(甲基)丙烯酸聚丙二醇酯、三羥甲基丙烷二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、四(甲基)丙烯酸新戊四醇酯、六(甲基)丙烯酸二新戊四醇酯等1元或多元醇之(甲基)丙烯酸酯類、雙酚A型環氧(甲基)丙烯酸酯、雙酚F型環氧(甲基)丙烯酸酯等環氧(甲基)丙烯酸酯類、苯并環丁烯樹脂、(雙)馬來醯亞胺樹脂等。此等之具有不飽和基之化合物係可單獨使用1種或混合2種以上使用。
此外,本實施形態之樹脂組成物雖然沒有特別之限制,因應需求可更含有為了適當調節硬化速度的硬化促進劑。作為此硬化促進劑,沒有特別之限制,可適用作為氰酸酯化合物或環氧樹脂等之硬化促進劑一般所使用者,其種類也沒有特別之限制。作為硬化促進劑之具體例,可舉例如辛酸鋅、環烷酸辛、環烷酸鈷、環烷酸銅、乙醯丙酮鐵、辛酸鎳、辛酸錳等有機金屬鹽類;苯酚、二甲酚、甲酚、間苯二酚、兒茶酚、辛基酚、壬基酚等苯酚化合物;1-丁醇、2-乙基己醇等醇類;2-甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、1-氰乙基-2-苯基咪唑、1-氰乙基-2-乙基-4-甲基咪唑、2-苯基-4,5-二羥甲基咪唑、2-苯基-4-甲基-5-羥甲基咪唑等咪唑類;此等咪唑類之羧酸及其酸酐類之加成物等之衍生物;二氰基二醯胺、苄基二甲基胺、4-甲基-N,N-二甲基苄基胺等之胺類;膦系化合物、氧化膦系化合物、鏻鹽系化合物、二膦系化合物等磷化合物;環氧-咪唑加成物系化合物、過氧化苯甲醯、對氯過氧化苯甲醯、二(三級丁基)過氧化物、過氧碳酸二異丙酯、過氧碳酸二-2-乙基己酯等之過氧化物;偶氮雙異丁腈等偶氮化合物等。硬化促進劑可單獨使用1種或組合2種以上使用。
硬化促進劑之含量,可考慮樹脂之硬化度或樹脂組成物之黏度等適當調整,並沒有特別之限制。然而,相對於該樹脂組成物中之樹脂固體成分的總量(100質量份),樹脂組成物之硬化促進劑的含量宜為0.005~10質量份。
此外,本實施形態之樹脂組成物在不損及藉由本發明而得之作用效果的範圍,可更含有上述以外的熱固性樹脂、熱塑性樹脂、及其寡聚合物、彈性體類等各種高分子化合物、阻燃性化合物、各種添加劑等。此等物質只要是一般所使用者即可,並沒有特別之限制。作為阻燃性化合物,雖然沒有特別之限制,可舉例如4,4’-二溴聯苯等溴化合物、磷酸酯、磷酸三聚氰胺、含磷環氧樹脂、三聚氰胺或苯胍胺等氮化合物;含 環化合物、矽酮系化合物等。此外,作為各種添加劑,雖然沒有特別之限制,可舉例如紫外線吸收劑、抗氧化劑、光聚合起始劑、螢光增白劑、光敏劑、染料、顏料、增黏劑、流動調整劑、潤滑劑、消泡劑、分散劑、塗平劑、光澤劑、聚合抑制劑等。此等物質可因應期望單獨使用1種或組合2種以上使用。
本實施形態之樹脂組成物,因應需求可更含有有機溶劑。此情況下,本實施形態之樹脂組成物係可作為將上述之各種樹脂成分至少一部分,宜為全部,溶解於有機溶劑或相溶於有機溶劑之態樣(溶液或清漆(varnish))來使用。作為有機溶劑,只要可將上述之各種樹脂成分之至少一部分,宜為全部,溶解或可相溶者即可,並沒有特別之限制,可適用公知者,其種類也沒有特別之限制。作為有機溶劑之具體例,可舉例如丙酮、甲乙酮、甲基異丁酮等酮類;丙二醇一甲基醚、丙二醇一甲醚醋酸酯等賽珞蘇(cellosolve)系溶劑;乳酸乙酯、乙酸甲酯、乙酸乙酯、乙酸丁酯、乙酸異戊酯、乳酸乙酯、甲氧基丙酸甲酯、羥基異丁酸甲酯等酯系溶劑;二甲基乙醯胺、二甲基甲醯胺等醯胺類等極性溶劑類;甲苯、二甲苯等芳香族烴等無極性溶劑等。此等溶劑可單獨使用1種或組合2種以上使用。
本實施形態之樹脂組成物係可依循通常方法製備。作為其製備方法,只要是可獲得均勻含有氰酸酯化合物(A)及通式(1)表示之環氧樹脂(B)之樹脂組成物的方法即可,並沒有特別之限制,宜為獲得也均勻含有上述之其他的任意成分之樹脂組成物的方法。作為製備方法之具體例,例如可藉由將氰酸酯化合物(A)及通式(1)表示之環氧樹脂(B)依序於溶液中摻合並充分攪拌,而輕易地製備本實施形態之樹脂組成物。
其中,於製備樹脂組成物時,可進行為了使各成分均勻地溶解或分散之公知的處理(例如攪拌、混合、混練處理)。例如,在均勻分散填充材(C)時,使用具有適當之攪拌能力的攪拌機設置之攪拌槽進行攪拌分散處理,對於樹脂組成物有提高其分散性的趨勢。上述之攪拌、混合、混練處理係可使用例如球磨機、珠粒磨機等以混合為目的之裝置及公轉·自轉型之混合裝置等公知的裝置來適當進行。
本實施形態之樹脂組成物,雖然沒有特別之限制,可作為印刷電路板之絕緣層用材料、半導體封裝體用材料使用。例如可將本實施形態之樹脂組成物溶解於溶劑而得之溶液含浸或塗布於基材並乾燥而成為預浸體。
此外,使用可剝離之塑膠薄膜作為支持體,將本實施形態之樹脂組成物溶解於溶劑而得之溶液塗布於塑膠薄膜並乾燥後可成為樹脂片。樹脂片可使用作為增建用薄膜或乾膜阻焊膜。此處,溶劑可於20℃~150℃之溫度加熱1~90分鐘而乾燥。此外,樹脂組成物可於只乾燥溶劑之未硬化之狀態使用,也可因應需求使成為半硬化(B階段化)之狀態後使用。
<預浸體> 以下,針對本實施型態之預浸體進行詳細描述。本實施形態之預浸體係具有:基材;及,含浸或塗布於該基材之上述本實施形態的樹脂組成物。預浸體的製造方法只要是組合本實施形態之樹脂組成物與基材來製造預浸體之方法即可,並沒有特別之限制,將上述本實施形態之樹脂組成物含浸或塗布於基材便可獲得。更具體來說,將本實施形態之樹脂組成物含浸或塗布於基材後,藉由於120~220℃乾燥2~15分鐘左右之方法等使其半硬化後,可製造本實施形態之預浸體。此時,樹脂組成物相對於基材之附著量,也就是樹脂組成物的量(包含填充材(C))相對於半硬化後之預浸體之總量(100質量%)係宜為20~99質量%之範圍。
作為本實施型態之基材雖然沒有特別之限制,例如可使用於各種印刷電路板材料中所使用之公知者。具體而言可列舉E玻璃、D玻璃、L玻璃、S玻璃、T玻璃、Q玻璃、UN玻璃、NE玻璃、球狀玻璃等玻璃纖維;石英等玻璃以外的無機纖維;聚醯亞胺、聚醯胺、聚酯等有機纖維;液晶聚酯等織布。作為基材之形狀,雖然並沒有特別之限制,可舉例如織布、不織布、粗紗、切股氈(chopped strand mat)、表面氈(surfacing mat)等,可為任一者皆無影響。基材係可單獨使用1種或組合2種以上使用。此外,雖然沒有特別之限制,若是作為疊層板用途,基材之厚度宜為0.01~0.2mm之範圍,考慮尺寸安定性之觀點,基材係尤其以經施以超開纖處理或孔目堵塞處理之織布較為理想。另外,考慮吸濕耐熱性之觀點以經環氧矽烷處理、胺基矽烷處理等矽烷偶聯劑等表面處理之玻璃織布較為理想。此外,考慮電特性之方面,液晶聚酯織布較為理想。
<覆金屬箔疊層板> 本實施形態之覆金屬箔疊層板具有:1片或疊層2片以上之上述本實施形態之預浸體,及於該預浸體之單面或兩面疊層成形而得之金屬箔。具體而言,覆金屬箔疊層板可藉由將上述預浸體一片或重疊數片,於其單面或兩面配置銅或鋁等金屬箔並疊層成形來製作。本實施形態之金屬箔只要是可使用於印刷電路板材料者即可,並沒有特別之限制,但宜為壓延銅箔或電解銅箔等銅箔。此外,金屬箔之厚度雖然沒有特別之限制,宜為2~70μm,更宜為3~35μm。作為成形條件,可適用通常之印刷電路板用疊層板及多層板之手法。例如可藉由使用多段壓合機、多段真空壓合機、連續成形機、高壓釜成形機等,於溫度180~350℃、加熱時間100~300分鐘、表面壓力20~100kg/cm2
進行疊層成形,而製造本實施形態之覆金屬箔疊層板。此外,藉由將上述預浸體與另外製作之內層用的電路板組合並疊層成形,也可製成多層板。作為多層板之製造方法,例如可藉由以下方法製作多層板:於上述1片預浸體的兩面配置35μm的銅箔,在上述條件下疊層形成後,形成內層電路,對該電路實施黑化處理形成內層電路板,之後將該內層電路板與上述預浸體1片片地交替配置,更於最外層配置銅箔,於上述條件下,宜為於真空下進行疊層成形。
接著,本實施形態之覆金屬箔疊層板可適用作為印刷電路板。印刷電路板係可依循通常方法製造,其製造方法並沒有特別之限制。以下展示印刷電路板之製造方法的一例。首先準備上述之覆銅疊層板等之覆金屬箔疊層板。接著,於覆金屬箔疊層板之表面施以蝕刻處理形成內層電路來製作內層基板。於該內層基板之內層電路表面,因應需求進行為了提高密合強度的表面處理,接著於該內層電路表面重疊所需之上述預浸體片數,進一步於其外側疊層外層電路用的金屬箔,經加熱加壓而一體成形。如此來製造內層電路與外層電路用之金屬箔之間形成了基材及由熱固性樹脂組成物之硬化物構成之絕緣層之多層的疊層板。接下來於該多層之疊層板施以通孔(through hole)或介層孔(via hole)用之穿孔加工後,於此孔之壁面形成使內層電路與外層電路用之金屬箔導通之鍍敷金屬皮膜,進一步地於外層電路用之金屬箔施以蝕刻處理形成外層電路,而製造出印刷電路板。
<印刷電路板> 本實施形態之印刷電路板具有:含有上述本實施形態之樹脂組成物的絕緣層、及於該絕緣層之單面或兩面形成之導體層。絕緣層為含有上述之本實施形態之樹組組成物的構成。也就是說,上述本實施型態之預浸體(基材,及含浸或塗布於基材之本實施形態的樹脂組成物)、上述本實施形態之覆金屬箔疊層板之樹脂組成物的層(由本實施形態之樹脂組成物構成之層)為由含有本實施形態之樹脂組成物的絕緣層構成而成。
<樹脂片> 本實施形態之樹脂片具有:片基材,及塗布於該片基材之單面或兩面並乾燥之上述本實施形態的樹脂組成物。樹脂片可將溶解於溶劑中而得之溶液(樹脂組成物)塗布(塗覆)於片基材並乾燥而獲得。作為本實施形態之片基材,雖然沒有特別之限制,可舉例如聚乙烯薄膜、聚丙烯薄膜、聚碳酸酯薄膜、聚對苯二甲酸乙二醇酯薄膜、乙烯四氟乙烯共聚合物薄膜、及於此等之薄膜的表面塗布了離型劑之離型薄膜、聚醯亞胺薄膜等有機系薄膜基材、銅箔、鋁箔等導體箔、玻璃板、SUS板、FRP等板狀者。作為塗布方法,雖然沒有特別之限制,可舉例如將本實施形態之樹脂組成物溶解於溶劑後而得之溶液,以桿塗布機、模塗布機、刮刀片、BAKER式塗膜器等塗布於片基材上之方法。此外,藉由於塗布後乾燥並將樹脂片從疊層片剝離或蝕刻,也可成為單層片(樹脂片)。其中,藉由將使上述本實施形態之樹脂組成物溶解於溶劑而得之溶液供給至具有片狀之模槽的模具內並乾燥等使其成形為片狀,也可不使用片基材而獲得單層片(樹脂片)。
於本實施形態之單層片或疊層之樹脂片的製作,去除溶劑時的乾燥條件雖然沒有特別之限制,若為低溫則樹脂組成物中溶劑容易殘留,若為高溫會使樹脂組成物進行硬化,故宜為於20℃~200℃之溫度乾燥1~90分鐘。此外,本實施形態之單層片或疊層之樹脂片的樹脂層之厚度可藉由本實施形態之樹脂組成物的溶液濃度與塗布厚度來調整,雖然並沒有特別之限制,一般而言若塗布厚度厚會使乾燥時溶劑容易殘留,故塗布厚度宜為0.1~500μm。 [實施例]
以下展示合成例、實施例及比較例來更詳細說明本實施形態,然而本實施形態並非僅限定為以下示例。
(合成例1)氰酸酯化合物之合成 將1-萘酚芳烷基樹脂(新日鐵住金化學(股)公司製)300g(OH基換算為1.28mol)及三乙胺194.6g(1.92mol)(相對於羥基1mol為1.5mol)溶解於二氯甲烷1800g,命其為溶液1。
將氯化氰125.9g(2.05mol)(相對於羥基1mol為1.6mol)、二氯甲烷293.8g、36%鹽酸194.5g(1.92mol)(相對於羥基1莫耳為1.5莫耳)、水1205.9g在攪拌下保持液溫為-2~-0.5℃的同時,花費30分鐘滴加溶液1。在溶液1滴加結束後,於相同溫度攪拌30分鐘後,花費10分鐘滴加三乙胺65g(0.64mol)(相對於羥基1mol為0.5mol)溶解於二氯甲烷65g而得之溶液(溶液2)。溶液2滴加結束後於相同溫度攪拌30分鐘完成反應。
之後將反應液靜置,使有機相與水相分離。獲得之有機相以水1300g清洗5次。水洗第5次之廢水的電導度為5μS/cm,確認藉由水的清洗已充分去除可去除之離子性化合物。
水洗後之有機相於減壓下濃縮,於90℃下濃縮1小時使其乾燥硬化最後獲得目的之萘酚芳烷基型之氰酸酯化合物(SNCN)(橙色黏性物)331g。獲得之SNCN之質量平均分子量Mw為600。此外,SNCN之紅外線光譜顯示有2250cm-1
(氰酸酯基)的吸收,且未顯示羥基之吸收。
(實施例1) 將由合成例1獲得之SNCN50質量份、下述式(9)表示之環氧樹脂(WHR-991S,日本化藥(股)製)50質量份、熔融二氧化矽(SC2050MB,Admatechs.製)100質量份、辛酸鋅(日本化學產業(股)製)0.15質量份混合而獲得清漆。將此清漆以甲乙酮稀釋,含浸塗布於厚度0.1mm之E玻璃織布,在150℃加熱乾燥5分鐘,獲得樹脂含量50質量%之預浸體。
將獲得之預浸體重疊8片並於上下配置12μm厚的電解銅箔(3EC-M3-VLP,三井金屬(股)製),在壓力30kgf/cm2
、溫度220℃下進行120分鐘之疊層成形而獲得絕緣層厚度0.8mm之覆金屬箔疊層板。使用獲得之覆金屬箔疊層板進行玻璃轉化溫度(Tg)的評價。結果如表1所示。
(比較例1) 將實施例1中,使用聯苯芳烷基型環氧樹脂(NC-3000-FH,日本化藥(股)製)50質量份替換式(5)表示之環氧樹脂50質量份,使用之辛酸鋅從0.15質量份改為0.12質量份以外,以與實施例1相同方法獲得厚度0.8mm之覆金屬箔疊層板。獲得之覆金屬箔疊層板之評價結果如表1所示。
(測定方法及評價方法) 玻璃轉化溫度:將實施例1及比較例1中獲得之各覆金屬箔疊層板切出40mm×20mm的大小,依循JIS C6481,以動態黏彈性測定裝置(TA Instruments.製)測定玻璃轉化溫度。
鍍敷剝離強度:將實施例1中獲得之覆金屬箔疊層板的電解銅箔藉由蝕刻去除,於奧野製藥工業製之膨潤處理液(OPC-B103 Pre Etch 400ml/L,氫氧化鈉13g/L)中於65℃浸漬5分鐘。接著,於奧野製藥工業製之粗糙化處理液(OPC-1540MN 100ml/L、OPC-1200 Epo Etch 100ml/L)於80℃浸漬8分鐘。最後於奧野製藥工業製之中和處理液(OPC-1300 Neutralizer 200ml/L)在45℃下進行5分鐘表面去汙跡處理(desmear)。之後,以奧野製藥工業製之無電解銅鍍敷程序(使用藥液名: OPC-370 Condiclean M、OPC-SAL M、OPC-80 catalyst、OPC-555 accelerator M、ATS Addcopper IW)施以約0.5μm之無電解銅鍍敷並於130℃乾燥1小時。接著,施以電解銅鍍敷使鍍敷銅之厚度成為18μm,於180℃乾燥1小時。以如此方式製作出於絕緣層上形成厚度18μm之導體層(鍍敷銅)的電路佈線板樣本。使用此電路佈線板樣本,依循JIS C6481測定鍍敷銅之密合力3次,求其平均值,作為鍍敷剝離強度。
從表1可明顯地至少確認到,使用實施例之樹脂組成物可達成玻璃轉化溫度優良之預浸體、覆金屬箔疊層板及印刷電路板。
本申請案係基於2015年3月18日向日本專利局提申之日本專利申請案(日本特願2015-054268),其內容納入於此作為參考。 [產業上利用性]
如同以上說明,關於本發明之樹脂組成物於電氣電子材料、機具材料、航空材料等之各種用途中,可作為例如電絕緣材料、半導體塑膠封裝體、密封材料、黏著劑、疊層材料、阻劑(resist)、增建疊層板材料等,可廣泛且有效地利用,特別可有效地利用作為近年之資訊終端設備或通信設備等之因應高積體、高密度化之印刷電路板材料。此外,關於本發明之預浸體、覆金屬箔疊層板、樹脂片及印刷電路板,因為具有優良之玻璃轉化溫度的性能,為其工業方面之實用性極高者。
Claims (9)
- 如申請專利範圍第1項之樹脂組成物,其中,該樹脂組成物中,相對於該樹脂組成物中之樹脂固體成分之總量(100質量%),含有1~90質量%之該通式(1)表示之環氧樹脂(B)。
- 如申請專利範圍第1或2項之樹脂組成物,更含有填充材(C)。
- 如申請專利範圍第3項之樹脂組成物,其中,該樹脂組成物中,相對於該樹脂組成物中之樹脂固體成分之總量(100質量份),含有50~1600質量份之該填充材(C)。
- 一種預浸體,具有:基材;及含浸或塗佈於該基材之如申請專利範圍第1至5項中任一項之樹脂組成物。
- 一種覆金屬箔疊層板,具有:1片或疊層了2片以上的如申請專利範圍第6項之預浸體;及在該預浸體之單面或兩面疊層成形而得之金屬箔。
- 一種樹脂片,具有:片基材;及塗佈在該片基材之單面或兩面並乾燥之如申請專利範圍第1至5項中任一項之樹脂組成物。
- 一種印刷電路板,具有:含有如申請專利範圍第1至5項中任一項之樹脂組成物之絕緣層;及在該絕緣層之單面或兩面形成之導體層。
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- 2016-02-04 EP EP16764566.2A patent/EP3272782B1/en active Active
- 2016-02-15 TW TW105104217A patent/TWI725956B/zh active
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KR102490151B1 (ko) | 2023-01-18 |
KR20170129119A (ko) | 2017-11-24 |
TW201634570A (zh) | 2016-10-01 |
EP3272782A1 (en) | 2018-01-24 |
US20180009935A1 (en) | 2018-01-11 |
JP7046602B2 (ja) | 2022-04-04 |
CN107406577A (zh) | 2017-11-28 |
EP3272782A4 (en) | 2018-09-19 |
EP3272782B1 (en) | 2023-03-22 |
WO2016147735A1 (ja) | 2016-09-22 |
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