TWI798212B - 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片及印刷電路板 - Google Patents
樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片及印刷電路板 Download PDFInfo
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- TWI798212B TWI798212B TW107112224A TW107112224A TWI798212B TW I798212 B TWI798212 B TW I798212B TW 107112224 A TW107112224 A TW 107112224A TW 107112224 A TW107112224 A TW 107112224A TW I798212 B TWI798212 B TW I798212B
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Abstract
一種樹脂組成物,含有通式(1)表示之環氧樹脂(A)及氰酸酯化合物(B)。
Description
本發明關於樹脂組成物、預浸體、使用了該樹脂組成物、預浸體之覆金屬箔疊層板及樹脂片、以及使用了該等之印刷電路板。
近年,廣泛使用於電子設備、通訊設備、個人電腦等之半導體的高整合化、微細化越發加速。與此相伴,針對用於印刷電路板之半導體封裝用疊層板所要求的各種特性變得越發嚴格。就所要求的特性而言,例如可列舉低吸水性、吸濕耐熱性、阻燃性、低介電常數、低介電損耗正切、低熱膨脹率、耐熱性、耐藥品性、高鍍敷剝離強度等特性。但,到目前為止,該等要求特性未必都令人滿意。
自以往,就耐熱性、電特性優異之印刷電路板用樹脂而言,氰酸酯化合物係為人們所知,於氰酸酯化合物倂用環氧樹脂、雙馬來醯亞胺化合物等而成的樹脂組成物,近年廣泛使用在半導體塑膠封裝用途等高功能的印刷電路板用材料等。又,由於多層印刷電路板的小型化、高密度化,電子零件內會蓄積大量的熱,要求印刷電路板的散熱性。進一步,由於多層印刷電路板會產生諸如翹曲擴大的問題,故要求成為絕緣層之材料的樹脂組成物具有低熱膨脹性、高彎曲彈性模量。
例如,專利文獻1及2中提出了密接性、低吸水性、吸濕耐熱性、絕緣可靠性等特性優異的由氰酸酯化合物與環氧樹脂構成之樹脂組成物。
專利文獻3中揭示了具有特定結構之環氧樹脂,並揭示若使於該環氧樹脂中摻合作為硬化劑之苯酚酚醛清漆樹脂與預定的硬化觸媒而成者預浸體化的話,獲得之預浸體之包括耐熱性及熱傳導性的各種特性優異。該文獻中,就上述具有特定結構之環氧樹脂之中間體而言,揭示了下式(4)表示之化合物。
[專利文獻1]國際公開第2016/062166號小冊 [專利文獻2]國際公開第2014/203866號小冊 [專利文獻3]日本特開2014-185271號公報
[發明所欲解決之課題]
例如專利文獻1及2中提出了密接性、低吸水性、吸濕耐熱性、絕緣可靠性等特性優異的由氰酸酯化合物與環氧樹脂構成之樹脂組成物,但熱傳導率、低線熱膨脹率、及彎曲彈性模量的改善仍不充分,故尋求進一步改善該等特性。專利文獻3中,就式(4)表示之化合物而言,僅記載了中間體,實施例中並未就性能進行評價。又,該文獻中並未探討以良好的平衡改善熱傳導率、低線熱膨脹率及彎曲彈性模量。
故,本發明旨在提供可實現熱傳導性、低熱膨脹性、及彎曲彈性模量優異之印刷電路板等的樹脂組成物,並旨在提供使用了該樹脂組成物之預浸體、樹脂片(例如,單層或疊層片)、使用了預浸體之覆金屬箔疊層板及印刷電路板等。 [解決課題之手段]
本案發明人等針對上述課題進行努力研究的結果,發現藉由使用含有通式(1)表示之環氧樹脂(A)及氰酸酯化合物(B)之樹脂組成物,可獲得具有高熱傳導性、彎曲彈性模量、低熱膨脹性之硬化物,而完成了本發明。亦即,本發明如下。
[1]一種樹脂組成物,含有下列通式(1)表示之環氧樹脂(A)及氰酸酯化合物(B); [化2](1) 式中,R各自獨立地表示碳數1~3之烷基或氫原子。 [2]如[1]之樹脂組成物,其中,該環氧樹脂(A)在樹脂組成物中之含量,相對於樹脂固體成分100質量份為1~90質量份。 [3]如[1]或[2]之樹脂組成物,更含有選自由該環氧樹脂(A)以外之環氧樹脂、馬來醯亞胺化合物、苯酚樹脂、氧雜環丁烷樹脂、苯并
化合物、及具可聚合之不飽和基之化合物構成之群中之1種以上。 [4]如[1]~[3]中任一項之樹脂組成物,其中,氰酸酯化合物(B)係選自由苯酚酚醛清漆型氰酸酯化合物、萘酚芳烷基型氰酸酯化合物、聯苯芳烷基型氰酸酯化合物、伸萘基醚型氰酸酯化合物、二甲苯樹脂型氰酸酯化合物、金剛烷骨架型氰酸酯化合物、及含有烯丙基或丙烯基之氰酸酯化合物構成之群中之1種以上。 [5]如[4]之樹脂組成物,其中,氰酸酯化合物(B)包括萘酚芳烷基型氰酸酯化合物。 [6]如[1]~[5]中任一項之樹脂組成物,更含有填充材(C)。 [7]如[6]之樹脂組成物,其中,該填充材(C)在樹脂組成物中之含量,相對於樹脂固體成分100質量份為50~1600質量份。 [8]一種預浸體,具有:基材;以及含浸或塗佈於該基材之如[1]~[7]中任一項之樹脂組成物。 [9]一種覆金屬箔疊層板,具有:疊層了至少1片以上的如[8]之預浸體;及配置在該預浸體之單面或兩面的金屬箔。 [10]一種樹脂片,含有如[1]~[7]中任一項之樹脂組成物。 [11]一種印刷電路板,具有絕緣層及形成在該絕緣層表面之導體層,該絕緣層含有如[1]~[7]中任一項之樹脂組成物。 [發明之效果]
根據本發明,可提供能實現熱傳導率、低熱膨脹性、及彎曲彈性模量優異之印刷電路板等的樹脂組成物,並可提供使用了該樹脂組成物之預浸體、樹脂片(例如,單層或疊層片)、使用了預浸體之覆金屬箔疊層板及印刷電路板等。
以下,針對本發明之實施形態進行說明。此外,下列實施形態係用於說明本發明之例示,本發明並不限定於該實施形態。
[樹脂組成物] 本實施形態之樹脂組成物含有下列通式(1)表示之環氧樹脂(A)及氰酸酯化合物(B)。本實施形態之樹脂組成物,藉由含有環氧樹脂(A)及氰酸酯化合物(B),可實現熱傳導率、彎曲彈性模量、及低熱膨脹性優異的預浸體、樹脂片、覆金屬箔疊層板等,並可實現高性能的印刷電路板,其工業上的實用性極高。
通式(1)表示之環氧樹脂(A)之製造方法並無特別限定,例如可藉由將對應的雙酚予以環氧丙基化而獲得。又,通式(1)表示之環氧樹脂(A)亦可使用市售品,例如可理想地使用新日鐵住金化學公司製的「YSLV-80DE」。含有通式(1)表示之環氧樹脂(A)的樹脂硬化物,具有使熱傳導性、低熱膨脹性、及彎曲彈性模量改善的效果。
通式(1)表示之環氧樹脂(A)在樹脂組成物中之含量,可因應所期望之特性適當設定,並無特別限定,令樹脂組成物中之樹脂固體成分為100質量份時,宜為1~90質量份。含量為1~90質量份之範圍時,可獲得耐熱性優異的樹脂組成物。考量同樣的觀點,含量為5~80質量份更佳,為10~70質量份尤佳。此處,「樹脂組成物中之樹脂固體成分」,除非另有說明,否則係指樹脂組成物中除溶劑、及填充材(C)以外的成分,樹脂固體成分100質量份,係指樹脂組成物中除溶劑、及填充材(C)以外的成分之合計為100質量份。
(氰酸酯化合物(B)) 本實施形態中使用之氰酸酯化合物(B),只要是於分子內具有經至少1個氰氧基(氰酸酯基)取代之芳香族部分的樹脂即可,並無特別限定。
就氰酸酯化合物(B)而言,例如可列舉通式(2)表示者。 [化4]式中,Ar1
各自獨立地表示亦可具有取代基之伸苯基、亦可具有取代基之伸萘基或亦可具有取代基之伸聯苯基。Ra各自獨立地選自於氫原子、亦可具有取代基之碳數1~6之烷基、亦可具有取代基之碳數6~12之芳基、亦可具有取代基之碳數1~4之烷氧基、碳數1~6之烷基與碳數6~12之芳基鍵結而得的亦可具有取代基之芳烷基、或碳數1~6之烷基與碳數6~12之芳基鍵結而得的亦可具有取代基之烷芳基中之任一種。p表示鍵結於Ar1
之氰氧基的數目,為1~3之整數。q表示鍵結於Ar1
之Ra的數目,Ar1
為伸苯基時為4-p,伸萘基時為6-p,伸聯苯基時為8-p。t表示平均重複數,為0~50之整數,可為t不同之化合物的混合物。X各自獨立地選自於單鍵、碳數1~50之2價有機基(氫原子也可取代為雜原子)、氮數1~10之2價有機基(-N-R-N-等)、羰基(-CO-)、羧基(-C(=O)O-)、二氧化羰基(carbonyl dioxide)(-OC(=O)O-)、磺醯基(-SO2
-)、或2價硫原子或2價氧原子中之任一種。
通式(2)之Ra中之烷基可具有鏈狀結構、及環狀結構(環烷基等)中之任一者。
又,通式(2)中之烷基及Ra之芳基中的氫原子亦可取代為氟、氯等鹵素原子、甲氧基、苯氧基等烷氧基、氰基等。
前述烷基之具體例可列舉:甲基、乙基、丙基、異丙基、正丁基、異丁基、三級丁基、正戊基、1-乙基丙基、2,2-二甲基丙基、環戊基、己基、環己基、三氟甲基等。
前述芳基之具體例可列舉:苯基、二甲苯基、三甲苯基、萘基、苯氧基苯基、乙基苯基、鄰、間或對氟苯基、二氯苯基、二氰基苯基、三氟苯基、甲氧基苯基、鄰、間或對甲苯基等。進一步,烷氧基可列舉:甲氧基、乙氧基、丙氧基、異丙氧基、正丁氧基、異丁氧基、三級丁氧基等。
通式(2)之X中之2價有機基之具體例可列舉:亞甲基、伸乙基、三亞甲基、伸環戊基、伸環己基、三甲基伸環己基、聯苯基亞甲基、二甲基亞甲基-伸苯基-二甲基亞甲基、茀二基、苯二甲內酯二基(phthalidiyl)等。該2價有機基中之氫原子亦可取代為氟、氯等鹵素原子、甲氧基、苯氧基等烷氧基、氰基等。
通式(2)之X中之氮數1~10之2價有機基,可列舉亞胺基、聚醯亞胺基等。
又,通式(2)中之X可列舉下列通式(3)或下列通式(4)表示之結構者。 [化5]式中,Ar2
表示選自於伸苯基、伸萘基及伸聯苯基中之任一種。Rb、Rc、Rf、Rg各自獨立地選自於氫原子、碳數1~6之烷基、碳數6~12之芳基、三氟甲基及經至少1個苯酚性羥基取代之芳基中之任一種。Rd、Re各自獨立地選自於氫原子、碳數1~6之烷基、碳數6~12之芳基、碳數1~4之烷氧基及羥基中之任一種。u表示0~5之整數,可為u不同之化合物的混合物。
[化6]式中,Ar3
選自於伸苯基、伸萘基或伸聯苯基中之任一種。Ri、Rj各自獨立地選自於氫原子、碳數1~6之烷基、碳數6~12之芳基、苄基、碳數1~4之烷氧基、羥基、三氟甲基及經至少1個氰氧基取代之芳基中之任一種。v表示0~5之整數,可為v不同之化合物的混合物。
進一步,通式(2)中之X可列舉下式表示之2價基。
通式(3)之Ar2
及通式(4)之Ar3
之具體例可列舉:1,4-伸苯基、1,3-伸苯基、4,4’-伸聯苯基、2,4’-伸聯苯基、2,2’-伸聯苯基、2,3’-伸聯苯基、3,3’-伸聯苯基、3,4’-伸聯苯基、2,6-伸萘基、1,5-伸萘基、1,6-伸萘基、1,8-伸萘基、1,3-伸萘基、1,4-伸萘基等。
通式(3)之Rb~Rg及通式(4)之Ri、Rj中之烷基及芳基與通式(2)所記載的內容同樣。
通式(2)表示之氰氧基取代芳香族化合物之具體例,可列舉:氰氧基苯、1-氰氧基-2-、1-氰氧基-3-、或1-氰氧基-4-甲基苯、1-氰氧基-2-、1-氰氧基-3-、或1-氰氧基-4-甲氧基苯、1-氰氧基-2,3-、1-氰氧基-2,4-、1-氰氧基-2,5-、1-氰氧基-2,6-、1-氰氧基-3,4-或1-氰氧基-3,5-二甲基苯、氰氧基乙基苯、氰氧基丁基苯、氰氧基辛基苯、氰氧基壬基苯、2-(4-氰氧基苯基)-2-苯基丙烷(4-α-異丙苯基苯酚之氰酸酯)、1-氰氧基-4-環己基苯、1-氰氧基-4-乙烯基苯、1-氰氧基-2-或1-氰氧基-3-氯苯、1-氰氧基-2,6-二氯苯、1-氰氧基-2-甲基-3-氯苯、氰氧基硝基苯、1-氰氧基-4-硝基-2-乙基苯、1-氰氧基-2-甲氧基-4-烯丙基苯(丁香酚之氰酸酯)、甲基(4-氰氧基苯基)硫醚、1-氰氧基-3-三氟甲基苯、4-氰氧基聯苯、1-氰氧基-2-或1-氰氧基-4-乙醯基苯、4-氰氧基苯甲醛、4-氰氧基苯甲酸甲酯、4-氰氧基苯甲酸苯酯、1-氰氧基-4-乙醯基胺基苯、4-氰氧基二苯甲酮、1-氰氧基-2,6-二-三級丁基苯、1,2-二氰氧基苯、1,3-二氰氧基苯、1,4-二氰氧基苯、1,4-二氰氧基-2-三級丁基苯、1,4-二氰氧基-2,4-二甲基苯、1,4-二氰氧基-2,3,4-三甲基苯、1,3-二氰氧基-2,4,6-三甲基苯、1,3-二氰氧基-5-甲基苯、1-氰氧基或2-氰氧基萘、1-氰氧基-4-甲氧基萘、2-氰氧基-6-甲基萘、2-氰氧基-7-甲氧基萘、2,2’-二氰氧基-1,1’-聯萘、1,3-、1,4-、1,5-、1,6-、1,7-、2,3-、2,6-或2,7-二氰氧基萘、2,2’-或4,4’-二氰氧基聯苯、4,4’-二氰氧基八氟聯苯、2,4’-或4,4’-二氰氧基二苯基甲烷、雙(4-氰氧基-3,5-二甲基苯基)甲烷、1,1-雙(4-氰氧基苯基)乙烷、1,1-雙(4-氰氧基苯基)丙烷、2,2-雙(4-氰氧基苯基)丙烷、2,2-雙(4-氰氧基-3-甲基苯基)丙烷、2,2-雙(2-氰氧基-5-聯苯基)丙烷、2,2-雙(4-氰氧基苯基)六氟丙烷、2,2-雙(4-氰氧基-3,5-二甲基苯基)丙烷、1,1-雙(4-氰氧基苯基)丁烷、1,1-雙(4-氰氧基苯基)異丁烷、1,1-雙(4-氰氧基苯基)戊烷、1,1-雙(4-氰氧基苯基)-3-甲基丁烷、1,1-雙(4-氰氧基苯基)-2-甲基丁烷、1,1-雙(4-氰氧基苯基)-2,2-二甲基丙烷、2,2-雙(4-氰氧基苯基)丁烷、2,2-雙(4-氰氧基苯基)戊烷、2,2-雙(4-氰氧基苯基)己烷、2,2-雙(4-氰氧基苯基)-3-甲基丁烷、2,2-雙(4-氰氧基苯基)-4-甲基戊烷、2,2-雙(4-氰氧基苯基)-3,3-二甲基丁烷、3,3-雙(4-氰氧基苯基)己烷、3,3-雙(4-氰氧基苯基)庚烷、3,3-雙(4-氰氧基苯基)辛烷、3,3-雙(4-氰氧基苯基)-2-甲基戊烷、3,3-雙(4-氰氧基苯基)-2-甲基己烷、3,3-雙(4-氰氧基苯基)-2,2-二甲基戊烷、4,4-雙(4-氰氧基苯基)-3-甲基庚烷、3,3-雙(4-氰氧基苯基)-2-甲基庚烷、3,3-雙(4-氰氧基苯基)-2,2-二甲基己烷、3,3-雙(4-氰氧基苯基)-2,4-二甲基己烷、3,3-雙(4-氰氧基苯基)-2,2,4-三甲基戊烷、2,2-雙(4-氰氧基苯基)-1,1,1,3,3,3-六氟丙烷、雙(4-氰氧基苯基)苯基甲烷、1,1-雙(4-氰氧基苯基)-1-苯基乙烷、雙(4-氰氧基苯基)聯苯甲烷、1,1-雙(4-氰氧基苯基)環戊烷、1,1-雙(4-氰氧基苯基)環己烷、2,2-雙(4-氰氧基-3-異丙基苯基)丙烷、1,1-雙(3-環己基-4-氰氧基苯基)環己烷、雙(4-氰氧基苯基)二苯基甲烷、雙(4-氰氧基苯基)-2,2-二氯乙烯、1,3-雙[2-(4-氰氧基苯基)-2-丙基]苯、1,4-雙[2-(4-氰氧基苯基)-2-丙基]苯、1,1-雙(4-氰氧基苯基)-3,3,5-三甲基環己烷、4-[雙(4-氰氧基苯基)甲基]聯苯、4,4-二氰氧基二苯甲酮、1,3-雙(4-氰氧基苯基)-2-丙烯-1-酮、雙(4-氰氧基苯基)醚、雙(4-氰氧基苯基)硫醚、雙(4-氰氧基苯基)碸、4-氰氧基苯甲酸-4-氰氧基苯酯(4-氰氧基苯基-4-氰氧基苯甲酸酯)、雙-(4-氰氧基苯基)碳酸酯、1,3-雙(4-氰氧基苯基)金剛烷、1,3-雙(4-氰氧基苯基)-5,7-二甲基金剛烷、3,3-雙(4-氰氧基苯基)異苯并呋喃-1(3H)-酮(酚酞之氰酸酯)、3,3-雙(4-氰氧基-3-甲基苯基)異苯并呋喃-1(3H)-酮(鄰甲酚酞之氰酸酯)、9,9’-雙(4-氰氧基苯基)茀、9,9-雙(4-氰氧基-3-甲基苯基)茀、9,9-雙(2-氰氧基-5-聯苯基)茀、參(4-氰氧基苯基)甲烷、1,1,1-參(4-氰氧基苯基)乙烷、1,1,3-參(4-氰氧基苯基)丙烷、α,α,α’-參(4-氰氧基苯基)-1-乙基-4-異丙基苯、1,1,2,2-肆(4-氰氧基苯基)乙烷、肆(4-氰氧基苯基)甲烷、2,4,6-參(N-甲基-4-氰氧基苯胺基)-1,3,5-三、2,4-雙(N-甲基-4-氰氧基苯胺基)-6-(N-甲基苯胺基)-1,3,5-三、雙(N-4-氰氧基-2-甲基苯基)-4,4’-氧基二鄰苯二甲醯亞胺、雙(N-3-氰氧基-4-甲基苯基)-4,4’-氧基二鄰苯二甲醯亞胺、雙(N-4-氰氧基苯基)-4,4’-氧基二鄰苯二甲醯亞胺、雙(N-4-氰氧基-2-甲基苯基)-4,4’-(六氟異亞丙基)二鄰苯二甲醯亞胺、參(3,5-二甲基-4-氰氧基苄基)異氰尿酸酯、2-苯基-3,3-雙(4-氰氧基苯基)苄甲內醯胺、2-(4-甲基苯基)-3,3-雙(4-氰氧基苯基)苄甲內醯胺、2-苯基-3,3-雙(4-氰氧基-3-甲基苯基)苄甲內醯胺、1-甲基-3,3-雙(4-氰氧基苯基)吲哚啉-2-酮、2-苯基-3,3-雙(4-氰氧基苯基)吲哚啉-2-酮、苯酚酚醛清漆樹脂、甲酚酚醛清漆樹脂(利用公知的方法使苯酚、烷基取代苯酚或鹵素取代苯酚與福馬林、多聚甲醛等甲醛化合物在酸性溶液中反應而得者)、參苯酚酚醛清漆樹脂(使羥基苯甲醛與苯酚在酸性觸媒的存在下反應而得者)、茀酚醛清漆樹脂(使茀酮化合物與9,9-雙(羥基芳基)茀類在酸性觸媒的存在下反應而得者)、苯酚芳烷基樹脂、甲酚芳烷基樹脂、萘酚芳烷基樹脂、聯苯芳烷基樹脂(利用公知的方法使如Ar4
-(CH2
Y)2
表示之雙鹵代甲基化合物與苯酚化合物以酸性觸媒或無觸媒的條件反應而得者、使如Ar5
-(CH2
OR)2
表示之雙(烷氧基甲基)化合物、如Ar6
-(CH2
OH)2
表示之雙(羥基甲基)化合物與苯酚化合物在酸性觸媒的存在下反應而得者、或使芳香族醛化合物、芳烷基化合物、苯酚化合物縮聚而得者)、苯酚改性二甲苯甲醛樹脂(利用公知的方法使二甲苯甲醛樹脂與苯酚化合物在酸性觸媒的存在下反應而得者)、改性萘甲醛樹脂(利用公知的方法使萘甲醛樹脂與羥基取代芳香族化合物在酸性觸媒的存在下反應而得者)、苯酚改性二環戊二烯樹脂、具有聚伸萘基醚結構之苯酚樹脂(利用公知的方法使1分子中具有2個以上之苯酚性羥基的多價羥基萘化合物在鹼性觸媒的存在下脫水縮合而得者)等利用與上述同樣之方法使苯酚樹脂氰酸酯化而得者等,並無特別限制。該等氰酸酯化合物可使用1種,亦可將2種以上混合使用。前述Ar4
、Ar5
及Ar6
之具體例可列舉:1,4-伸苯基、1,3-伸苯基、4,4’-伸聯苯基、2,4’-伸聯苯基、2,2’-伸聯苯基、2,3’-伸聯苯基、3,3’-伸聯苯基、3,4’-伸聯苯基、2,6-伸萘基、1,5-伸萘基、1,6-伸萘基、1,8-伸萘基、1,3-伸萘基、1,4-伸萘基等。
就氰酸酯化合物(B)而言,該等之中,考量熱傳導性、低熱膨脹性、及彎曲彈性模量更加優異的觀點,宜為苯酚酚醛清漆型氰酸酯化合物、萘酚芳烷基型氰酸酯化合物、聯苯芳烷基型氰酸酯化合物、伸萘基醚型氰酸酯化合物、二甲苯樹脂型氰酸酯化合物、金剛烷骨架型氰酸酯化合物、及含有烯丙基或丙烯基之氰酸酯化合物,為萘酚芳烷基型氰酸酯化合物更佳。
含有烯丙基或丙烯基之氰酸酯化合物,例如可列舉下式(1A)表示之氰酸酯化合物。
式(1A)中,n表示重複單元數之平均值,為1~50之數,R1
表示單鍵、碳數1~50之2價有機基、氮數1~10之2價有機基、羰基(-CO-)、羧基(-C(=O)O-)、二氧化羰基(-OC(=O)O-)、磺醯基(-SO2
-)、2價硫原子(-S-)、及2價氧原子(-O-)中之任一者,Rx表示烯丙基或丙烯基,p各自獨立地表示1以上之整數,R1
有多數個時,多數個R1
可相同也可不同。
式(1A)表示之化合物,可為由式(1A)中之重複單元數n相同,且R1
相同之化合物構成的形態,亦可為式(1A)中之重複單元數n不同的化合物之混合物的形態,也可為式(1A)中之R1
不同的化合物之混合物的形態。式(1A)中之n表示重複單元數之平均值,為1~50。
式(3)中,R1
表示單鍵、碳數1~50之2價有機基、氮數1~10之2價有機基(例如,式:-N-R-N-表示之基(式中,R表示2價烴基)、亞胺基、聚醯亞胺基等)、羰基(-CO-)、羧基(-C(=O)O-)、二氧化羰基(-OC(=O)O-)、磺醯基(-SO2
-)、2價硫原子(-S-)、及2價氧原子(-O-)中之任一者,R1
有多數個時,多數個R1
可相同也可不同。又,R1
於芳香環上的鍵結位置並無特別限定。該等之中,宜為碳數1~50之2價有機基(以下,亦稱為「特定之2價有機基」)。
特定之2價有機基,例如可列舉亦可有雜原子之2價烴基。就上述2價烴基而言,例如可列舉:伸烷基(例如,亞甲基、伸乙基、三亞甲基、伸丙基等碳數1~10之伸烷基等)、亞烷基(例如,亞乙基、2,2-亞丙基等碳數1~10之亞烷基等)、伸環烷基(例如,伸環戊基、伸環己基、三甲基伸環己基等)、環亞烷基(例如,碳數5~8之環亞烷基)、具有芳香環之2價有機基(例如,聯苯基亞甲基、茀二基、苯二甲內酯二基、式:-(CH3
)C(CH3
)-Ph-(CH3
)C(CH3
)-(式中,Ph表示伸苯基。)表示之基等)。該等2價有機基中之氫原子亦可取代為取代基,取代基可列舉:鹵素原子(例如,氟原子、及氯原子)、烷氧基(例如,甲氧基、及苯氧基)、氰基等。
式(1A)中,Rx
表示烯丙基或丙烯基。p各自獨立地表示1以上之整數(較佳為1)。
氰酸酯化合物(B)在樹脂組成物中之含量可因應所期望之特性適當設定,並無特別限定,令樹脂組成物中之樹脂固體成分為100質量份時,宜為1~90質量份。含量為1~90質量份之範圍時,可獲得低熱膨脹性、熱傳導率及彎曲彈性模量更加優異的樹脂組成物。考量同樣的觀點,含量為5~80質量份更佳,為10~70質量份尤佳。
(填充材(C)) 本實施形態之樹脂組成物,考量進一步改善成形性、熱傳導率、低熱膨脹特性的觀點,宜更含有填充材(C)。
本實施形態中使用之填充材(C)可適當使用公知品,其種類並無特別限定,可適當使用該領域中通常使用者。具體而言,可列舉:天然二氧化矽、熔融二氧化矽、合成二氧化矽、非晶二氧化矽、AEROSIL、中空二氧化矽等二氧化矽類;白碳、鈦白、氧化鋅、氧化鎂、氧化鋯、氮化硼、凝聚氮化硼、氮化矽、氮化鋁、硫酸鋇、氫氧化鋁、經加熱處理之氫氧化鋁(將氫氧化鋁進行加熱處理,以減少部分結晶水而得者)、軟水鋁石、氫氧化鎂等金屬水合物;氧化鉬、鉬酸鋅等鉬化合物;硼酸鋅、錫酸鋅、氧化鋁、黏土、高嶺土、滑石、煅燒黏土、煅燒高嶺土、煅燒滑石、雲母、E-玻璃、A-玻璃、NE-玻璃、C-玻璃、L-玻璃、D-玻璃、S-玻璃、M-玻璃G20、玻璃短纖維(包括E玻璃、T玻璃、D玻璃、S玻璃、Q玻璃等之玻璃微粉末類。)、中空玻璃、球狀玻璃等無機系填充材,其他可列舉苯乙烯型、丁二烯型、丙烯酸型等的橡膠粉末、核殼型的橡膠粉末、聚矽氧樹脂粉末、聚矽氧橡膠粉末、聚矽氧複合粉末等有機系填充材等。該等填充材可單獨使用1種,亦可將2種以上組合使用。
就填充材(C)而言,該等之中,宜為選自於由二氧化矽、氫氧化鋁、軟水鋁石、氧化鎂及氫氧化鎂構成之群中之1種以上較理想。藉由使用該等填充材,會有樹脂組成物之熱膨脹特性、尺寸穩定性、阻燃性等特性得到改善的傾向。
填充材(C)在樹脂組成物中之含量可因應所期望之特性適當設定,並無特別限定,令樹脂組成物中之樹脂固體成分為100質量份時,宜為50~1600質量份。含量為50~1600質量份之範圍時,會有樹脂組成物之成形性變得更加良好,熱傳導率、熱膨脹特性等特性更為改善的傾向。考量同樣的觀點,含量為60~1200質量份更佳,為70~1000質量份尤佳。
此處,當使用填充材(C)時,宜倂用矽烷偶聯劑、濕潤分散劑。就矽烷偶聯劑而言,可適當使用一般用於無機物之表面處理者,其種類並無特別限定。具體而言,可列舉:γ-胺基丙基三乙氧基矽烷、N-β-(胺基乙基)-γ-胺基丙基三甲氧基矽烷等胺基矽烷系;γ-環氧丙氧丙基三甲氧基矽烷、β-(3,4-環氧環己基)乙基三甲氧基矽烷等環氧矽烷系;γ-甲基丙烯醯氧丙基三甲氧基矽烷、乙烯基-三(β-甲氧基乙氧基)矽烷等乙烯基矽烷系;N-β-(N-乙烯基苄基胺基乙基)-γ-胺基丙基三甲氧基矽烷鹽酸鹽等陽離子矽烷系;苯基矽烷系等。矽烷偶聯劑可單獨使用1種,亦可將2種以上組合使用。又,濕潤分散劑可適當使用一般用於塗料用者,其種類並無特別限定。宜使用共聚物系之濕潤分散劑,其具體例可列舉:BYK Japan(股)製的Disperbyk-110、111、161、180、BYK-W996、BYK-W9010、BYK-W903、BYK-W940等。濕潤分散劑可單獨使用1種,亦可將2種以上組合使用。
進一步,本實施形態之樹脂組成物,在不損及所期望之特性的範圍內,亦可含有選自於由環氧樹脂(A)以外之環氧樹脂(以下,稱為「其他環氧樹脂」。)、馬來醯亞胺化合物、苯酚樹脂、氧雜環丁烷樹脂、苯并
化合物、及具可聚合之不飽和基之化合物構成之群中之1種以上。藉由倂用該等樹脂,可使將樹脂組成物硬化而得之硬化物的阻燃性、低介電性等所期望之特性改善。
其他環氧樹脂只要不是通式(1)表示者,且於1分子中具有2個以上之環氧基的環氧樹脂即可,可適當使用公知的物質,其種類並無特別限定。具體而言,可列舉:雙酚A型環氧樹脂、雙酚E型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、苯酚酚醛清漆型環氧樹脂、雙酚A酚醛清漆型環氧樹脂、環氧丙酯型環氧樹脂、芳烷基酚醛清漆型環氧樹脂、聯苯芳烷基型環氧樹脂、伸萘基醚型環氧樹脂、甲酚酚醛清漆型環氧樹脂、多官能苯酚型環氧樹脂、萘型環氧樹脂、蒽型環氧樹脂、萘骨架改性酚醛清漆型環氧樹脂、苯酚芳烷基型環氧樹脂、萘酚芳烷基型環氧樹脂、二環戊二烯型環氧樹脂、聯苯型環氧樹脂、脂環族環氧樹脂、多元醇型環氧樹脂、含磷之環氧樹脂;環氧丙胺、環氧丙酯、將丁二烯等之雙鍵環氧化而得之化合物;藉由含有羥基之聚矽氧樹脂類與表氯醇之反應而得之化合物等。該等環氧樹脂中,聯苯芳烷基型環氧樹脂、伸萘基醚型環氧樹脂、多官能苯酚型環氧樹脂、萘型環氧樹脂在阻燃性、耐熱性方面為較佳。該等環氧樹脂可單獨使用1種,亦可將2種以上組合使用。
就馬來醯亞胺化合物而言,只要是於1分子中具有1個以上之馬來醯亞胺基的化合物即可,可使用一般公知的物質。例如可列舉:4,4-二苯基甲烷雙馬來醯亞胺、苯基甲烷馬來醯亞胺、間伸苯基雙馬來醯亞胺、2,2-雙(4-(4-馬來醯亞胺苯氧基)-苯基)丙烷、3,3-二甲基-5,5-二乙基-4,4-二苯基甲烷雙馬來醯亞胺、4-甲基-1,3-伸苯基雙馬來醯亞胺、1,6-雙馬來醯亞胺-(2,2,4-三甲基)己烷、4,4-二苯醚雙馬來醯亞胺、4,4-二苯碸雙馬來醯亞胺、1,3-雙(3-馬來醯亞胺苯氧基)苯、1,3-雙(4-馬來醯亞胺苯氧基)苯、聚苯基甲烷馬來醯亞胺、酚醛清漆型馬來醯亞胺、聯苯芳烷基型馬來醯亞胺、及該等馬來醯亞胺化合物的預聚物、或馬來醯亞胺化合物與胺化合物的預聚物等,並無特別限制。該等馬來醯亞胺化合物可使用1種,亦可將2種以上混合使用。其中,為酚醛清漆型馬來醯亞胺化合物、聯苯芳烷基型馬來醯亞胺化合物特佳。
就苯酚樹脂而言,只要是於1分子中具有2個以上之羥基的苯酚樹脂即可,可使用一般公知的物質。例如可列舉:雙酚A型苯酚樹脂、雙酚E型苯酚樹脂、雙酚F型苯酚樹脂、雙酚S型苯酚樹脂、苯酚酚醛清漆樹脂、雙酚A酚醛清漆型苯酚樹脂、環氧丙酯型苯酚樹脂、芳烷基酚醛清漆型苯酚樹脂、聯苯芳烷基型苯酚樹脂、甲酚酚醛清漆型苯酚樹脂、多官能苯酚樹脂、萘酚樹脂、萘酚酚醛清漆樹脂、多官能萘酚樹脂、蒽型苯酚樹脂、萘骨架改性酚醛清漆型苯酚樹脂、苯酚芳烷基型苯酚樹脂、萘酚芳烷基型苯酚樹脂、二環戊二烯型苯酚樹脂、聯苯型苯酚樹脂、脂環族苯酚樹脂、多元醇型苯酚樹脂、含磷之苯酚樹脂、含羥基之聚矽氧樹脂類等,並無特別限制。該等苯酚樹脂之中,聯苯芳烷基型苯酚樹脂、萘酚芳烷基型苯酚樹脂、含磷之苯酚樹脂、含羥基之聚矽氧樹脂在阻燃性方面為較佳。該等苯酚樹脂可單獨使用1種,亦可將2種以上組合使用。
氧雜環丁烷樹脂可使用一般公知的物質。例如可列舉:氧雜環丁烷、2-甲基氧雜環丁烷、2,2-二甲基氧雜環丁烷、3-甲基氧雜環丁烷、3,3-二甲基氧雜環丁烷等烷基氧雜環丁烷、3-甲基-3-甲氧基甲基氧雜環丁烷、3,3-二(三氟甲基)全氟氧雜環丁烷、2-氯甲基氧雜環丁烷、3,3-雙(氯甲基)氧雜環丁烷、聯苯型氧雜環丁烷、OXT-101(東亞合成製商品名)、OXT-121(東亞合成製商品名)等,並無特別限制。該等氧雜環丁烷樹脂可使用1種,亦可將2種以上混合使用。
就苯并
化合物而言,只要是於1分子中具有2個以上之二氫苯并
環的化合物即可,可使用一般公知的物質。例如可列舉:雙酚A型苯并
BA-BXZ(小西化學製商品名)、雙酚F型苯并
BF-BXZ(小西化學製商品名)、雙酚S型苯并
BS-BXZ(小西化學製商品名)、P-d型苯并
(四國化成工業製商品名)、F-a型苯并
(四國化成工業製商品名)等,並無特別限制。該等苯并
化合物可使用1種,亦可將2種以上混合使用。
具可聚合之不飽和基之化合物可使用一般公知的物質。例如可列舉:乙烯、丙烯、苯乙烯、二乙烯基苯、二乙烯基聯苯等乙烯基化合物;(甲基)丙烯酸甲酯、(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、聚丙二醇二(甲基)丙烯酸酯、三羥甲基丙烷二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、新戊四醇四(甲基)丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯等1元或多元醇之(甲基)丙烯酸酯類;雙酚A型環氧(甲基)丙烯酸酯、雙酚F型環氧(甲基)丙烯酸酯等環氧(甲基)丙烯酸酯類;苯并環丁烯樹脂、(雙)馬來醯亞胺樹脂等,並無特別限制。該等具有不飽和基之化合物可使用1種,亦可將2種以上混合使用。
又,本實施形態之樹脂組成物,視需要亦可含有用以適當調節硬化速度的硬化促進劑。就該硬化促進劑而言,可適當使用一般用作氰酸酯化合物、環氧樹脂等之硬化促進劑者,其種類並無特別限定。其具體例可列舉:辛酸鋅、環烷酸鋅、環烷酸鈷、環烷酸銅、乙醯丙酮鐵、辛酸鎳、辛酸錳等有機金屬鹽類;苯酚、二甲酚、甲酚、間苯二酚、兒茶酚、辛基酚、壬基酚等苯酚化合物;1-丁醇、2-乙基己醇等醇類;2-甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、1-氰基乙基-2-苯基咪唑、1-氰基乙基-2-乙基-4-甲基咪唑、2-苯基-4,5-二羥基甲基咪唑、2-苯基-4-甲基-5-羥基甲基咪唑等咪唑類及該等咪唑類之羧酸或其酸酐類的加成物等衍生物;二氰二胺(dicyandiamide)、苄基二甲胺、4-甲基-N,N-二甲基苄胺、N,N-二甲基苄胺、N,N-二甲基苯胺、N,N-二甲基甲苯胺、N,N-二甲基胺基吡啶、2-N-乙基苯胺基乙醇、三-正丁胺、二甲基吡啶、吡啶、喹啉、N-甲基啉、三乙醇胺、三乙二胺、四甲基丁烷二胺、N-甲基哌啶等胺類;膦系化合物、氧化膦系化合物、鏻鹽系化合物、二膦系化合物等磷化合物;環氧-咪唑加成物系化合物;過氧化苯甲醯、過氧化對氯苯甲醯、二-三級丁基過氧化物、過氧化碳酸二異丙酯、過氧化碳酸二-2-乙基己酯等過氧化物;或偶氮雙異丁腈等偶氮化合物等。硬化促進劑可單獨使用1種,亦可將2種以上組合使用。 此外,硬化促進劑之使用量可考慮樹脂的硬化度、樹脂組成物的黏度等適當調整,並無特別限定,通常宜相對於樹脂組成物中之樹脂固體成分100質量份為0.005~10質量份。
進一步,本實施形態之樹脂組成物,在不損及所期望之特性的範圍內,可倂用其他熱硬化性樹脂、熱塑性樹脂及其低聚物、彈性體類等各種高分子化合物、阻燃性化合物、各種添加劑等。該等只要是一般使用者即可,並無特別限定。例如,就阻燃性化合物而言,可列舉:4,4’-二溴聯苯等溴化合物、磷酸酯、磷酸三聚氰胺、含磷之環氧樹脂、三聚氰胺或苯胍胺等氮化合物、含
環之化合物、聚矽氧系化合物等。又,就各種添加劑而言,可列舉:紫外線吸收劑、抗氧化劑、光聚合引發劑、螢光增白劑、光增感劑、染料、顏料、增黏劑、流動調整劑、潤滑劑、消泡劑、分散劑、調平劑、光澤劑、聚合抑制劑等。該等可因應期望而單獨使用1種或將2種以上組合使用。
此外,本實施形態之樹脂組成物,視需要可使用有機溶劑。此時,本發明之樹脂組成物能以上述各種樹脂成分之至少一部分,較佳為全部溶解於有機溶劑或與有機溶劑互溶之態樣(溶液或清漆)使用。有機溶劑只要是可將上述各種樹脂成分之至少一部分,較佳為可將全部予以溶解或能互溶者即可,可適當使用公知的物質,其種類並無特別限定。具體而言,可列舉:丙酮、甲乙酮、甲基異丁酮等酮類;丙二醇單甲醚、丙二醇單甲醚乙酸酯等賽珞蘇系溶劑;乳酸乙酯、乙酸甲酯、乙酸乙酯、乙酸丁酯、乙酸異戊酯、甲氧基丙酸甲酯、羥基異丁酸甲酯等酯系溶劑;二甲基乙醯胺、二甲基甲醯胺等醯胺類等極性溶劑類;甲苯、二甲苯等芳香族烴等無極性溶劑等。該等可單獨使用1種,亦可將2種以上組合使用。
本實施形態之樹脂組成物可依常法進行製備,只要是可獲得均勻地含有通式(1)表示之環氧樹脂(A)及氰酸酯化合物(B)、上述其他任意成分之樹脂組成物的方法即可,其製備方法並無特別限定。例如,藉由將通式(1)表示之環氧樹脂(A)及氰酸酯化合物(B)按順序摻合至溶劑中,並充分攪拌,可輕易地製備本實施形態之樹脂組成物。
此外,製備樹脂組成物時,可進行用以使各成分均勻地溶解或分散之公知的處理(攪拌、混合、混練處理等)。例如,當均勻分散填充材(C)時,藉由使用設置有具適當攪拌能力之攪拌機的攪拌槽進行攪拌分散處理,對於樹脂組成物的分散性提高。上述攪拌、混合、混練處理,例如可使用球磨機、珠磨機等以混合為目的之裝置、或公轉・自轉型混合裝置等公知的裝置而適當進行。
本實施形態之樹脂組成物可用作印刷電路板之絕緣層、半導體封裝用材料。例如,藉由將本發明之樹脂組成物溶解於溶劑而得之溶液含浸或塗佈於基材並進行乾燥,可製成預浸體。
又,藉由將本實施形態之樹脂組成物溶解於溶劑而得之溶液進行乾燥,可製成樹脂片。樹脂片可用作堆積(build-up)用薄膜或乾膜防焊劑。
又,本實施形態之樹脂組成物亦能以剛使溶劑乾燥之未硬化狀態使用,也可視需要使其成為半硬化(B階段化)之狀態而使用。
以下,針對本實施形態之預浸體進行詳述。本實施形態之預浸體,係將上述本實施形態之樹脂組成物含浸或塗佈於基材而得者。預浸體之製造方法,只要是將本實施形態之樹脂組成物與基材予以組合而製造預浸體的方法即可,並無特別限定。具體而言,將本實施形態之樹脂組成物含浸或塗佈於基材後,利用在120~220℃乾燥2~15分鐘左右的方法等使其半硬化,藉此可製造本實施形態之預浸體。此時,樹脂組成物相對於基材之附著量,亦即樹脂組成物的量(包括填充材(C)。)相對於半硬化後之預浸體之總量宜為20~99質量%之範圍。
製造本實施形態之預浸體時所使用之基材,可使用用於各種印刷電路板材料之公知的物質。例如可列舉:E玻璃、D玻璃、L玻璃、S玻璃、T玻璃、Q玻璃、UN玻璃、NE玻璃、球狀玻璃等之玻璃纖維;石英等玻璃以外之無機纖維;聚醯亞胺、聚醯胺、聚酯等之有機纖維;液晶聚酯等之織布,但並不限定於該等。基材的形狀已知有織布、不織布、粗紗、切股氈、表面氈等,可為任意形狀。基材可單獨使用1種,亦可將2種以上組合使用。又,基材的厚度並無特別限定,若為疊層板用途,則宜為0.01~0.2mm之範圍,特別是已施以超開纖處理、孔目堵塞處理之織布,考量尺寸穩定性的觀點為較理想。進一步,經環氧矽烷處理、胺基矽烷處理等以矽烷偶聯劑等進行表面處理之玻璃織布,考量吸濕耐熱性的觀點為較佳。又,液晶聚酯織布,在電特性的方面為較佳。
又,本實施形態之覆金屬箔疊層板,係重疊了至少1片以上的上述預浸體,並在其單面或兩面配置金屬箔來疊層成形而得者。具體而言,可藉由將一片或多片前述預浸體予以重疊,並在其單面或兩面配置銅、鋁等之金屬箔,進行疊層成形而製作。此處使用之金屬箔只要是用於印刷電路板材料者即可,並無特別限定,宜為壓延銅箔、電解銅箔等銅箔。又,金屬箔的厚度並無特別限定,宜為2~70μm,為3~35μm更佳。成形條件可使用通常之印刷電路板用疊層板及多層板的方法。例如,可藉由使用多段壓製機、多段真空壓製機、連續成形機、高壓釜成形機等,以溫度180~350℃、加熱時間100~300分鐘、面壓20~100kg/cm2
進行疊層成形,而製造本發明之覆金屬箔疊層板。又,亦可藉由將上述預浸體、與另外製作的內層用配線板組合並疊層成形,而製成多層板。就多層板的製造方法而言,例如,可在1片上述預浸體之兩面配置35μm之銅箔,以上述條件進行疊層形成後,形成內層電路,對該電路實施黑化處理而形成內層電路板,之後,將該內層電路板與上述預浸體交替地各1片逐一配置,進一步於最外層配置銅箔,依上述條件,較佳為於真空下進行疊層成形,而製作多層板。
另外,本實施形態之覆金屬箔疊層板可理想地用作印刷電路板。印刷電路板可依常法製造,其製造方法並無特別限定。以下,顯示印刷電路板之製造方法之一例。首先,準備上述覆銅疊層板等覆金屬箔疊層板。然後,對於覆金屬箔疊層板之表面實施蝕刻處理而形成內層電路,製作內層基板。視需要對於該內層基板之內層電路表面實施用以提高黏接強度之表面處理,然後在該內層電路表面重疊所需片數的上述預浸體,進一步於其外側疊層外層電路用之金屬箔,加熱加壓並成形為一體。以此方式製成在內層電路與外層電路用之金屬箔之間形成有基材及由熱硬化性樹脂組成物之硬化物構成之絕緣層的多層疊層板。然後,對該多層的疊層板施以通孔(through hole)、介層孔(via hole)用之開孔加工後,在該孔之壁面形成用以使內層電路與外層電路用之金屬箔導通的鍍敷金屬皮膜,進一步對外層電路用之金屬箔實施蝕刻處理而形成外層電路,藉此製成印刷電路板。
上述製造例獲得之印刷電路板為如下之構成:具有絕緣層、及形成在該絕緣層表面之導體層,絕緣層含有上述本實施形態之樹脂組成物。亦即,上述本實施形態之預浸體(基材及含浸或塗佈於該基材之本實施形態之樹脂組成物)、上述本實施形態之覆金屬箔疊層板之樹脂組成物之層(由本發明之樹脂組成物構成之層),係由含有本實施形態之樹脂組成物的絕緣層構成。
本實施形態之樹脂片含有本實施形態之樹脂組成物。本實施形態之樹脂片,可藉由將上述樹脂組成物溶解於溶劑而得之溶液塗佈於支持體並進行乾燥而獲得。此處使用之支持體並無特別限定,例如可列舉:聚乙烯薄膜、聚丙烯薄膜、聚碳酸酯薄膜、聚對苯二甲酸乙二醇酯薄膜、乙烯四氟乙烯共聚物薄膜、及在該等薄膜表面塗佈脫模劑而成之脫模薄膜、聚醯亞胺薄膜等有機系薄膜基材;銅箔、鋁箔等導體箔;玻璃板、SUS板、FRP等板狀的無機系薄膜。就塗佈方法而言,例如可列舉將上述樹脂組成物溶解於溶劑而得之溶液利用塗佈棒、模塗機、刮刀塗佈機、貝克塗抹機等塗佈在支持體上,而製作支持體與樹脂片成為一體之疊層片的方法。又,乾燥後將支持體從疊層片予以剝離或蝕刻,藉此亦可製成單層片(樹脂片)。此外,藉由將上述本實施形態之樹脂組成物溶解於溶劑而得之溶液供給至具片狀空腔之模具內,並進行乾燥等而成形為片狀,也可獲得不使用支持體之單層片(樹脂片)。
此外,製作本實施形態之樹脂片(單層或疊層片)時,除去溶劑時的乾燥條件並無特別限定,考量為低溫的話樹脂組成物中容易有溶劑殘留,為高溫的話樹脂組成物會硬化,宜於20℃~200℃之溫度進行1~90分鐘。又,本實施形態之樹脂片(單層或疊層片)之樹脂層的厚度,可藉由本實施形態之樹脂組成物的溶液濃度與塗佈厚度調整,並無特別限定,一般而言,考量塗佈厚度變厚的話乾燥時溶劑容易殘留,宜為0.1~500μm。 [實施例]
以下,舉合成例、實施例及比較例對本發明進行更詳細地說明,但本發明並不限定於該等。
(合成例1)氰酸酯化合物的合成 使1-萘酚芳烷基樹脂(新日鐵住金化學(股)公司製)300g(換算為OH基1.28mol)及三乙胺194.6g(1.92mol)(相對於羥基1mol為1.5mol)溶解於二氯甲烷1800g,將其作為溶液1。在氯化氰125.9g(2.05mol)(相對於羥基1mol為1.6mol)、二氯甲烷293.8g、36%鹽酸194.5g(1.92mol)(相對於羥基1莫耳為1.5莫耳)、及水1205.9g中,於攪拌下邊保持在液溫-2~-0.5℃,邊歷時30分鐘將溶液1注入。溶液1注入結束後,於同溫度攪拌30分鐘後,將三乙胺65g(0.64mol)(相對於羥基1mol為0.5mol)溶解於二氯甲烷65g而得之溶液(亦稱為「溶液2」。)歷時10分鐘注入。溶液2注入結束後,於同溫度攪拌30分鐘使反應結束。之後,將反應液靜置使有機相與水相分離。利用水1300g將獲得之有機相洗淨5次。第5次水洗的廢水的導電度為5μS/cm,確認到藉由以水洗淨,可充分去除待去除之離子性化合物。將水洗後之有機相在減壓下予以濃縮,最後於90℃濃縮乾固1小時而得到作為目標之萘酚芳烷基型氰酸酯化合物(SNCN)(橙色黏性物)331g。獲得之SNCN的質量平均分子量Mw為600。又,SNCN的IR光譜顯示2250cm-1
(氰酸酯基)的吸收,且並未顯示羥基的吸收。
(實施例1) 將合成例1獲得之SNCN50質量份、通式(1)表示之環氧樹脂(YSLV-80DE,新日鐵住金化學製)50質量份、熔融二氧化矽(SC2050MB,Admatechs製)100質量份、及辛酸鋅(日本化學產業(股)製)0.10質量份混合而得到清漆。將該清漆以甲乙酮進行稀釋,並含浸塗覆於厚度0.1mm之E玻璃織布,在150℃加熱乾燥5分鐘,得到樹脂含量50質量%的預浸體。
將8片獲得之預浸體予以重疊並在上下配置12μm厚之電解銅箔(3EC-M3-VLP,三井金屬(股)公司)製),於壓力30kgf/cm2
、溫度220℃進行120分鐘的疊層成型,得到絕緣層厚度0.8mm之覆金屬箔疊層板。使用獲得之覆金屬箔疊層板,進行熱傳導性、熱膨脹係數、彎曲彈性模量的評價。結果顯示於表1。
(比較例1) 使用聯苯芳烷基型環氧樹脂(NC-3000-FH,日本化藥(股)製)50質量份替代實施例1中使用之通式(1)表示之環氧樹脂50質量份,除此以外,與實施例1同樣進行,得到厚度0.8mm之覆金屬箔疊層板。獲得之覆金屬箔疊層板的評價結果顯示於表1。
(測定方法及評價方法) 1)彎曲彈性模量:將獲得之8片重疊之覆金屬箔疊層板之兩面的銅箔藉由蝕刻除去,然後依據JIS C6481,使用試驗片(50mm×25mm×0.8mm),以試驗數5測定彎曲彈性模量,以最大值之平均值作為測定值。 2)熱膨脹係數:對於獲得之8片重疊之覆金屬箔疊層板,藉由JlS C 6481規定之TMA法(Thermo-mechanical analysis),針對疊層板之絕緣層測定玻璃布之縱向方向(表中,記載為「CTE-y α1」。)、橫向方向(表中,記載為「CTE-x α1」。)、高度方向(表中,記載為「CTE-z α1」。)的熱膨脹係數(CTE),而求出其值。具體而言,將上述獲得之覆金屬箔疊層板之兩面的銅箔藉由蝕刻除去後,利用熱機械分析裝置(TA Instrument製)從40℃以每分鐘10℃升溫至340℃,測定從60℃到120℃的熱膨脹係數(ppm/℃)。 3)熱傳導率:測定獲得之8片重疊之覆金屬箔疊層板的密度,又,利用DSC(TA Instrumen Q100型)測定比熱,進一步,利用氙閃光分析儀(Bruker:LFA447Nanoflash)測定熱擴散率。熱傳導率係由下式算出。 熱傳導率(W/m・K)= 密度(kg/m3
)×比熱(kJ/kg・K)×熱擴散率(m2
/S)×1000
由表1可知:藉由使用本發明之樹脂組成物,確認可實現具有高熱傳導性、彎曲彈性、低熱膨脹性之預浸體及印刷電路板等。
本申請案係基於2017年4月10日提申的日本專利申請案(日本特願2017-077757),其內容在此納入作為參照。 [產業上利用性]
如以上之説明,本發明之樹脂組成物於電氣・電子材料、工作機械材料、航空材料等各種用途中,可廣泛且有效地用作例如:電絕緣材料、半導體塑膠封裝體、密封材料、黏接劑、疊層材料、阻劑、堆積疊層板材料等,尤其可特別有效地用作因應近年來資訊終端設備、通訊設備等之高整合・高密度化的印刷電路板材料。又,本發明之覆金屬箔疊層板、樹脂片及印刷電路板具有熱傳導性、低熱膨脹性、及彎曲彈性模量優異的性能,故其工業上的實用性極高。
Claims (11)
- 如申請專利範圍第1項之樹脂組成物,其中,該環氧樹脂(A)在樹脂組成物中之含量,相對於樹脂固體成分100質量份為1~90質量份。
- 如申請專利範圍第1或2項之樹脂組成物,其中,氰酸酯化合物(B)係選自由苯酚酚醛清漆型氰酸酯化合物、萘酚芳烷基型氰酸酯化合物、聯苯芳烷基型氰酸酯化合物、伸萘基醚型氰酸酯化合物、二甲苯樹脂型氰酸酯化合物、金剛烷骨架型氰酸酯化合物、及含有烯丙基或丙烯基之氰酸酯化合物構成之群中之1種以上。
- 如申請專利範圍第4項之樹脂組成物,其中,氰酸酯化合物(B)包括萘酚芳烷基型氰酸酯化合物。
- 如申請專利範圍第1或2項之樹脂組成物,更含有填充材(C)。
- 如申請專利範圍第6項之樹脂組成物,其中,該填充材(C)在樹脂組成物中之含量,相對於樹脂固體成分100質量份為50~1600質量份。
- 一種預浸體,具有:基材;以及含浸或塗佈於該基材之如申請專利範圍第1至7項中任一項之樹脂組成物。
- 一種覆金屬箔疊層板,具有:疊層了至少1片以上的如申請專利範圍第8項之預浸體;及配置在該預浸體之單面或兩面的金屬箔。
- 一種樹脂片,含有如申請專利範圍第1至7項中任一項之樹脂組成物。
- 一種印刷電路板,具有絕緣層及形成在該絕緣層表面之導體層,該絕緣層含有如申請專利範圍第1至7項中任一項之樹脂組成物。
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