WO2021192680A1 - 樹脂組成物、プリプレグ、樹脂シート、積層板、金属箔張積層板、及びプリント配線板 - Google Patents

樹脂組成物、プリプレグ、樹脂シート、積層板、金属箔張積層板、及びプリント配線板 Download PDF

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Publication number
WO2021192680A1
WO2021192680A1 PCT/JP2021/004891 JP2021004891W WO2021192680A1 WO 2021192680 A1 WO2021192680 A1 WO 2021192680A1 JP 2021004891 W JP2021004891 W JP 2021004891W WO 2021192680 A1 WO2021192680 A1 WO 2021192680A1
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WO
WIPO (PCT)
Prior art keywords
resin composition
compound
resin
mass
molybdenum
Prior art date
Application number
PCT/JP2021/004891
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English (en)
French (fr)
Japanese (ja)
Inventor
工藤　博章
達郎 高村
典浩 志田
Original Assignee
三菱瓦斯化学株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱瓦斯化学株式会社 filed Critical 三菱瓦斯化学株式会社
Priority to JP2022509374A priority Critical patent/JPWO2021192680A1/ja
Priority to CN202180023867.7A priority patent/CN115335433B/zh
Priority to KR1020227019387A priority patent/KR20220157933A/ko
Publication of WO2021192680A1 publication Critical patent/WO2021192680A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/11—Compounds containing metals of Groups 4 to 10 or of Groups 14 to 16 of the Periodic Table
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Definitions

  • R 1 independently represents a hydrogen atom or a methyl group, and n 1 is 1 to 10.
  • the content of zinc oxide (D) in this case is calculated from the charged ratio and amount of molybdenum compound particles (molybdenum compound (C)) and zinc oxide, which are raw materials for preparing the molybdenum component to be mixed with the resin component. can do.
  • the content of zinc oxide (D) is, for example, the charging ratio and amount of molybdenum compound particles (molybdenum compound (C)) and zinc oxide, which are raw materials for preparing a molybdenum component to be mixed with a resin component. It can be adjusted by changing it.
  • the molybdenum compound (C) contains molybdenum in the molecule, but an oxide of molybdenum and a sulfide of molybdenum are preferable.
  • Specific examples of the molybdenum compound (C) include zinc molybdate (for example, ZnMoO 4 , Zn 3 Mo 2 O 9, etc.), ammonium molybdate, sodium molybdate, calcium molybdate, potassium molybdate, molybdenum disulfide. , Molybdenum trioxide, and molybdenum compounds such as molybdenum hydrate, but are not particularly limited. These can be used individually by 1 type or in combination of 2 or more types.
  • the molybdenum hydrate for example, molybdate monohydrate (MoO 3 ⁇ H 2 O) , ammonium molybdate tetrahydrate ((NH 4) 6 Mo 7 O 24 ⁇ 4H 2 O), zinc molybdate pentahydrate (Zn 5 Mo 2 O 11 ⁇ 5H 2 O) and the like.
  • molybdate monohydrate MoO 3 ⁇ H 2 O
  • ammonium molybdate tetrahydrate (NH 4) 6 Mo 7 O 24 ⁇ 4H 2 O)
  • zinc molybdate pentahydrate Zn 5 Mo 2 O 11 ⁇ 5H 2 O
  • zinc molybdate, molybdenum disulfide, and molybdenum hydrate are preferable from the viewpoint of drilling workability.
  • the shape of the molybdenum compound particles is not particularly limited, but the improvement in drilling workability tends to be more remarkable as the filling property of the molybdenum compound (C) in the resin composition and the molded product using the resin composition increases.
  • the molybdenum compound particles are spherical, the circularity thereof is preferably 0.88 to 1.00, preferably 0.90 to 1.00, and 0.92 to 1.00. Is more preferable.
  • the circularity can be measured by a wet flow type particle size / shape analyzer. More specifically, it can be measured according to the method described in the examples.
  • cresol novolac type phenol resin cresol novolac type phenol resin, biphenyl aralkyl type phenol resin represented by the following formula (4), naphthol aralkyl type phenol resin represented by the following formula (5), Aminotriazine novolac type phenol resin and naphthalene type phenol resin are preferable, and biphenyl aralkyl type phenol resin represented by the following formula (4) and naphthol aralkyl type phenol resin represented by the following formula (5) are more preferable.
  • the content of the phenol compound (F) is preferably 1 to 99 parts by mass with respect to a total of 100 parts by mass of the resin solid content of the resin composition. It is more preferably 3 to 90 parts by mass, further preferably 5 to 80 parts by mass, and may be 10 to 70 parts by mass, 20 to 60 parts by mass, or 30 to 50 parts by mass.
  • the content of the phenol compound (F) is within the above range, it tends to be more excellent in adhesiveness, flexibility and the like.
  • R 3 represents a methylene group, an isopropylidene group, CO, O, S or SO 2 .
  • the compound (I) having a polymerizable unsaturated group is not particularly limited, and generally known compounds can be used. Specific examples of the compound (I) having a polymerizable unsaturated group include vinyl compounds such as ethylene, propylene, styrene, divinylbenzene and divinylbiphenyl, methyl (meth) acrylate, and 2-hydroxyethyl (meth) acrylate.
  • the resin composition layer (insulating layer) of the resin sheet is surface-treated by a conventional method, and a wiring pattern (conductor layer) is formed on the surface of the insulating layer by plating. By doing so, the printed wiring board of the present embodiment can be obtained.
  • the form and arrangement of the reinforcing fibers are not particularly limited, and can be appropriately selected from woven fabrics, non-woven fabrics, mats, knits, braids, unidirectional strands, rovings, chopped and the like.
  • a preform a laminated woven base cloth made of reinforcing fibers, a sewn-integrated one with stitch threads, or a fiber structure such as a three-dimensional woven fabric or a braid
  • a metal foil-clad laminate (double-sided copper-clad laminate) having a thickness of 0.8 mm was produced by performing a vacuum press at a pressure of 20 kgf / cm 2 and a temperature of 220 ° C. for 120 minutes for laminating and molding. The appearance of the obtained metal foil-clad laminate was evaluated, the drill bit life, and the hole position accuracy were evaluated. The results are shown in Table 1.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
PCT/JP2021/004891 2020-03-25 2021-02-10 樹脂組成物、プリプレグ、樹脂シート、積層板、金属箔張積層板、及びプリント配線板 WO2021192680A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022509374A JPWO2021192680A1 (enrdf_load_stackoverflow) 2020-03-25 2021-02-10
CN202180023867.7A CN115335433B (zh) 2020-03-25 2021-02-10 树脂组合物、预浸料、树脂片、层叠板、覆金属箔层叠板、及印刷电路板
KR1020227019387A KR20220157933A (ko) 2020-03-25 2021-02-10 수지 조성물, 프리프레그, 수지 시트, 적층판, 금속박 피복 적층판, 및 프린트 배선판

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-054954 2020-03-25
JP2020054954 2020-03-25

Publications (1)

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WO2021192680A1 true WO2021192680A1 (ja) 2021-09-30

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Country Status (5)

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JP (1) JPWO2021192680A1 (enrdf_load_stackoverflow)
KR (1) KR20220157933A (enrdf_load_stackoverflow)
CN (1) CN115335433B (enrdf_load_stackoverflow)
TW (1) TWI879901B (enrdf_load_stackoverflow)
WO (1) WO2021192680A1 (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023063267A1 (ja) * 2021-10-15 2023-04-20 日本化薬株式会社 封止材用マレイミド樹脂混合物、マレイミド樹脂組成物およびその硬化物
WO2023074484A1 (ja) * 2021-10-26 2023-05-04 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、樹脂シート、積層板、金属箔張積層板、及びプリント配線板
WO2023145471A1 (ja) * 2022-01-28 2023-08-03 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及びプリント配線板
WO2024080195A1 (ja) * 2022-10-12 2024-04-18 株式会社レゾナック プリプレグ、積層板、プリント配線板及び半導体パッケージ
CN118613445A (zh) * 2022-02-01 2024-09-06 株式会社雅都玛科技 复合氧化物粒子材料及其制造方法、填料、含填料的浆料组合物以及含填料的树脂组合物

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JP2016119480A (ja) * 2015-12-25 2016-06-30 日立化成株式会社 プリント配線板用樹脂組成物、プリプレグ、積層板、及びプリント配線板
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023063267A1 (ja) * 2021-10-15 2023-04-20 日本化薬株式会社 封止材用マレイミド樹脂混合物、マレイミド樹脂組成物およびその硬化物
JP7281246B1 (ja) * 2021-10-15 2023-05-25 日本化薬株式会社 封止材用マレイミド樹脂混合物、マレイミド樹脂組成物およびその硬化物
WO2023074484A1 (ja) * 2021-10-26 2023-05-04 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、樹脂シート、積層板、金属箔張積層板、及びプリント配線板
WO2023145471A1 (ja) * 2022-01-28 2023-08-03 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及びプリント配線板
CN118613445A (zh) * 2022-02-01 2024-09-06 株式会社雅都玛科技 复合氧化物粒子材料及其制造方法、填料、含填料的浆料组合物以及含填料的树脂组合物
WO2024080195A1 (ja) * 2022-10-12 2024-04-18 株式会社レゾナック プリプレグ、積層板、プリント配線板及び半導体パッケージ

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TWI879901B (zh) 2025-04-11
CN115335433A (zh) 2022-11-11
CN115335433B (zh) 2024-08-09
TW202142621A (zh) 2021-11-16
JPWO2021192680A1 (enrdf_load_stackoverflow) 2021-09-30
KR20220157933A (ko) 2022-11-29

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