JPWO2021192680A1 - - Google Patents

Info

Publication number
JPWO2021192680A1
JPWO2021192680A1 JP2022509374A JP2022509374A JPWO2021192680A1 JP WO2021192680 A1 JPWO2021192680 A1 JP WO2021192680A1 JP 2022509374 A JP2022509374 A JP 2022509374A JP 2022509374 A JP2022509374 A JP 2022509374A JP WO2021192680 A1 JPWO2021192680 A1 JP WO2021192680A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022509374A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021192680A1 publication Critical patent/JPWO2021192680A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/11—Compounds containing metals of Groups 4 to 10 or of Groups 14 to 16 of the Periodic Table
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
JP2022509374A 2020-03-25 2021-02-10 Pending JPWO2021192680A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020054954 2020-03-25
PCT/JP2021/004891 WO2021192680A1 (ja) 2020-03-25 2021-02-10 樹脂組成物、プリプレグ、樹脂シート、積層板、金属箔張積層板、及びプリント配線板

Publications (1)

Publication Number Publication Date
JPWO2021192680A1 true JPWO2021192680A1 (enrdf_load_stackoverflow) 2021-09-30

Family

ID=77891411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022509374A Pending JPWO2021192680A1 (enrdf_load_stackoverflow) 2020-03-25 2021-02-10

Country Status (5)

Country Link
JP (1) JPWO2021192680A1 (enrdf_load_stackoverflow)
KR (1) KR20220157933A (enrdf_load_stackoverflow)
CN (1) CN115335433B (enrdf_load_stackoverflow)
TW (1) TWI879901B (enrdf_load_stackoverflow)
WO (1) WO2021192680A1 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240088722A (ko) * 2021-10-15 2024-06-20 닛뽄 가야쿠 가부시키가이샤 봉지재용 말레이미드 수지 혼합물, 말레이미드 수지 조성물 및 그의 경화물
JPWO2023074484A1 (enrdf_load_stackoverflow) * 2021-10-26 2023-05-04
JPWO2023145471A1 (enrdf_load_stackoverflow) * 2022-01-28 2023-08-03
JP2023112353A (ja) * 2022-02-01 2023-08-14 株式会社アドマテックス 複合酸化物粒子材料及びその製造方法、フィラー、フィラー含有スラリー組成物、並びにフィラー含有樹脂組成物
JPWO2024080195A1 (enrdf_load_stackoverflow) * 2022-10-12 2024-04-18

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012099162A1 (ja) * 2011-01-20 2012-07-26 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、および積層板
WO2013146700A1 (ja) * 2012-03-30 2013-10-03 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ及び積層板
JP2015207753A (ja) * 2014-04-08 2015-11-19 パナソニックＩｐマネジメント株式会社 プリント配線板用樹脂組成物、プリプレグ、金属張積層板、プリント配線板
WO2016010033A1 (ja) * 2014-07-18 2016-01-21 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、及びプリント配線板
JP2016056094A (ja) * 2015-12-25 2016-04-21 日立化成株式会社 積層板用樹脂組成物、プリプレグ及び積層板
JP2016113592A (ja) * 2014-12-18 2016-06-23 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板及びプリント配線板
JP2016119480A (ja) * 2015-12-25 2016-06-30 日立化成株式会社 プリント配線板用樹脂組成物、プリプレグ、積層板、及びプリント配線板
JP2016147986A (ja) * 2015-02-13 2016-08-18 パナソニックＩｐマネジメント株式会社 プリント配線板用樹脂組成物、プリプレグ、金属張積層板およびプリント配線板
WO2017006888A1 (ja) * 2015-07-06 2017-01-12 三菱瓦斯化学株式会社 樹脂組成物、該樹脂組成物を用いたプリプレグ又はレジンシート並びにそれらを用いた積層板及びプリント配線板
WO2019131574A1 (ja) * 2017-12-27 2019-07-04 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、積層板、金属箔張積層板、プリント配線板及び多層プリント配線板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004059643A (ja) 2002-07-25 2004-02-26 Mitsubishi Gas Chem Co Inc プリプレグ及び積層板
JP2009120702A (ja) 2007-11-14 2009-06-04 Sumitomo Bakelite Co Ltd 耐熱基板用樹脂組成物、プリプレグおよび耐熱基板
CN101580626B (zh) * 2009-01-24 2012-02-08 南亚塑胶工业股份有限公司 一种高导热无卤难燃树脂组合物及其预浸渍体及涂层物
KR101378364B1 (ko) 2011-10-31 2014-03-27 방종관 클렌징 또는 에센스용 패드 제조방법 및 그 방법에 의해 제조된 패드

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012099162A1 (ja) * 2011-01-20 2012-07-26 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、および積層板
WO2013146700A1 (ja) * 2012-03-30 2013-10-03 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ及び積層板
JP2015207753A (ja) * 2014-04-08 2015-11-19 パナソニックＩｐマネジメント株式会社 プリント配線板用樹脂組成物、プリプレグ、金属張積層板、プリント配線板
WO2016010033A1 (ja) * 2014-07-18 2016-01-21 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、及びプリント配線板
JP2016113592A (ja) * 2014-12-18 2016-06-23 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板及びプリント配線板
JP2016147986A (ja) * 2015-02-13 2016-08-18 パナソニックＩｐマネジメント株式会社 プリント配線板用樹脂組成物、プリプレグ、金属張積層板およびプリント配線板
WO2017006888A1 (ja) * 2015-07-06 2017-01-12 三菱瓦斯化学株式会社 樹脂組成物、該樹脂組成物を用いたプリプレグ又はレジンシート並びにそれらを用いた積層板及びプリント配線板
JP2016056094A (ja) * 2015-12-25 2016-04-21 日立化成株式会社 積層板用樹脂組成物、プリプレグ及び積層板
JP2016119480A (ja) * 2015-12-25 2016-06-30 日立化成株式会社 プリント配線板用樹脂組成物、プリプレグ、積層板、及びプリント配線板
WO2019131574A1 (ja) * 2017-12-27 2019-07-04 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、積層板、金属箔張積層板、プリント配線板及び多層プリント配線板

Also Published As

Publication number Publication date
TWI879901B (zh) 2025-04-11
CN115335433A (zh) 2022-11-11
CN115335433B (zh) 2024-08-09
WO2021192680A1 (ja) 2021-09-30
TW202142621A (zh) 2021-11-16
KR20220157933A (ko) 2022-11-29

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