WO2021103092A1 - 半导体超结功率器件 - Google Patents
半导体超结功率器件 Download PDFInfo
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- WO2021103092A1 WO2021103092A1 PCT/CN2019/123313 CN2019123313W WO2021103092A1 WO 2021103092 A1 WO2021103092 A1 WO 2021103092A1 CN 2019123313 W CN2019123313 W CN 2019123313W WO 2021103092 A1 WO2021103092 A1 WO 2021103092A1
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 47
- 210000000746 body region Anatomy 0.000 claims abstract description 23
- 230000008878 coupling Effects 0.000 claims abstract description 6
- 238000010168 coupling process Methods 0.000 claims abstract description 6
- 238000005859 coupling reaction Methods 0.000 claims abstract description 6
- 238000011084 recovery Methods 0.000 abstract description 9
- 238000010586 diagram Methods 0.000 description 6
- 230000000903 blocking effect Effects 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/063—Reduced surface field [RESURF] pn-junction structures
- H01L29/0634—Multiple reduced surface field (multi-RESURF) structures, e.g. double RESURF, charge compensation, cool, superjunction (SJ), 3D-RESURF, composite buffer (CB) structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0629—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with diodes, or resistors, or capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7803—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
- H01L29/7804—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device the other device being a pn-junction diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7827—Vertical transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
Definitions
- This application belongs to the technical field of semiconductor super junction power devices, for example, it relates to a semiconductor super junction power device with fast reverse recovery speed.
- the equivalent circuit of a related art semiconductor super junction power device is shown in Figure 1, including a source 101, a drain 102, a gate 103, and a body diode 104.
- the body diode 104 is an intrinsic semiconductor super junction power device. Parasitic structure.
- the working mechanism of the related art semiconductor super junction power device is: 1) When the gate-source voltage Vgs is less than the threshold voltage Vth of the semiconductor super junction power device, and the drain-source voltage Vds is greater than 0V, the semiconductor super junction power device is in the off state; 2 ) When the gate-source voltage Vgs is greater than the threshold voltage Vth of the semiconductor super-junction power device, and the drain-source voltage Vds is greater than 0V, the semiconductor super-junction power device is turned on in the forward direction. At this time, the current flows from the drain to the current channel at the gate Source.
- the body diode of the semiconductor super junction power device When the related art semiconductor super junction power device is turned off, when the drain-source voltage Vds is less than 0V, the body diode of the semiconductor super junction power device is in a forward biased state, and the reverse current flows from the source to the drain through the body diode. At this time, the current of the body diode has the phenomenon of injecting minority carrier carriers, and these minority carrier carriers undergo reverse recovery when the semiconductor super junction power device is turned on again, resulting in a larger reverse recovery current and a long reverse recovery time.
- the present application provides a semiconductor super junction power device with a fast reverse recovery speed to solve the technical problem of long reverse recovery time caused by the minority carrier injection problem of the semiconductor super junction power device in the related art.
- p-type body region where the p-type body region is located on top of the n-type drift region;
- a p-type columnar doped region located below the p-type body region
- a gate structure located on the p-type body region including a gate dielectric layer, a gate and an n-type floating gate, the gate and the n-type floating gate are located between the gate dielectric layer And in the lateral direction, the gate is located on the side close to the n-type source region, the n-type floating gate is located on the side close to the n-type drift region, and the gate acts on the side close to the n-type drift region through capacitive coupling.
- the n-type floating gate including a gate dielectric layer, a gate and an n-type floating gate, the gate and the n-type floating gate are located between the gate dielectric layer And in the lateral direction, the gate is located on the side close to the n-type source region, the n-type floating gate is located on the side close to the n-type drift region, and the gate acts on the side close to the n-type drift region through capacitive coupling.
- the n-type floating gate including a gate dielectric layer, a
- the gate extends above the n-type floating gate.
- the gate extends above the n-type floating gate and covers the sidewall of the n-type floating gate close to the n-type drift region.
- the opening is located below the n-type floating gate and close to the n-type drift region.
- At least one gate of the super-junction MOSFET unit is electrically connected to the n-type source region.
- the semiconductor super-junction power device provided by the embodiment of the present invention has a high threshold voltage in the forward blocking state and the forward turn-on; the super-junction MOSFET cell has a low threshold voltage in the reverse conduction state, so that the super-junction MOSFET cell has a low threshold voltage.
- the gate voltage (or 0V voltage) is turned on, which can increase the reverse current flowing through the super junction MOSFET unit, reduce the current flowing through the parasitic body diode in the semiconductor super junction power device, and improve the reverse current of the semiconductor super junction power device. To the speed of recovery.
- FIG. 1 is a schematic diagram of an equivalent circuit of a related art semiconductor super junction power device
- FIG. 2 is a schematic cross-sectional structure diagram of a first embodiment of a semiconductor super junction power device provided by the present application
- FIG. 3 is a schematic cross-sectional structure diagram of a second embodiment of a semiconductor super junction power device provided by the present application.
- a semiconductor super junction power device provided by an embodiment of the present invention includes an n-type drain region 20 , The n-type drift region 21 located above the n-type drain region 20, and a super-junction MOSFET cell array composed of a plurality of super-junction MOSFET cells 200, only one super-junction MOSFET cell 200 is exemplarily shown in FIG. .
- the super-junction MOSFET unit 200 of the embodiment of the present invention includes a p-type body region 22, which is located on top of the n-type drift region 21; and a p-type columnar doped region 29 located below the p-type body region 22, which is doped with p-type columnar A charge balance is formed between the impurity region 29 and the adjacent n-type drift region 21 to improve the withstand voltage of the semiconductor super junction power device; the n-type source region 23 is located in the p-type body region 22; and the n-type source region 23 is located in the p-type body region 22
- the upper gate structure includes a gate dielectric layer 24, an n-type floating gate 25 and a gate 26.
- the gate 26 and the n-type floating gate 25 are located on the gate dielectric layer 24, and in the lateral direction, the gate The pole 26 is located on the side close to the n-type source region 23, the n-type floating gate 25 is located on the side close to the n-type drift region 21, the gate 26 and the n-type floating gate 25 are separated by an insulating dielectric layer 27, and the gate 26 is separated by a capacitor The coupling acts on the n-type floating gate 25.
- the insulating dielectric layer 27 is usually silicon dioxide.
- the n-type floating gate 25 is located on the gate dielectric layer 24 and close to the side of the n-type drift region 21, that is, the n-type floating gate 25 is close to the n-type drift region 21
- the gate 26 can be located on the side of the gate dielectric layer 24 and close to the n-type source region 23, that is, the gate 26 is only located on the side of the n-type floating gate 25 close to the n-type source region 23; the gate 26 It is also possible that one part is located on the side of the n-type floating gate 25 close to the n-type source region 23, and the other part extends above the n-type floating gate 25 (as shown in FIG. 2).
- the gate 26 extends to the side of the n-type drift region 21 above the n-type floating gate 25 to increase the area of the gate 26 covering the n-type floating gate 25, thereby increasing the capacitance of the gate 26 to the n-type floating gate 26 Coupling rate.
- An opening 28 is formed in the gate dielectric layer 24, and the n-type floating gate 25 contacts the p-type body region 22 through the opening 28 in the gate dielectric layer 24 to form a p-n junction diode.
- the semiconductor super junction power device of the embodiment of the present invention in the forward blocking state, a high voltage is applied to the n-type drain region 20, and the pn junction diode formed by contacting the n-type floating gate 25 with the p-type body region 22 is forwarded When biased, the n-type floating gate 25 is charged with positive charges, which lowers the threshold voltage Vht1 of the current channel under the n-type floating gate 25.
- the opening 28 is located below the n-type floating gate 25 and close to the n-type drift region 21, that is, in the lateral direction, the distance from the center of the opening 28 to the side end of the gate dielectric layer 24 close to the n-type drift region 21
- the distance from the center of the opening 28 to the side end of the gate dielectric layer 24 close to the n-type source region 23 is smaller, so that the opening 28 is arranged closer to the n-type drift region 21 in the gate dielectric layer 24, which can make the n-type floating gate 25 is more easily charged with positive charges, so that the voltage of the n-type floating gate 25 can be increased, and the threshold voltage Vht1 of the current channel under the n-type floating gate 25 can be reduced.
- the drain-source voltage Vds is greater than 0V
- the threshold voltage Vht1 of the current channel under the n-type floating gate 25 affects the entire super-junction MOSFET unit.
- the influence of the threshold voltage Vth is very low, and the semiconductor super junction power device still has a high threshold voltage.
- the semiconductor super-junction power device of the embodiment of the present invention When the semiconductor super-junction power device of the embodiment of the present invention is turned off, when the source-drain voltage Vsd is greater than 0V, the influence of the threshold voltage Vht1 of the current channel under the n-type floating gate 25 on the threshold voltage Vth of the entire super-junction MOSFET unit Very large, so that the super-junction MOSFET unit has a low threshold voltage Vth, so that the current channel of the super-junction MOSFET unit is turned on at a low gate voltage (or 0V voltage), thereby increasing the current flowing through the super-junction MOSFET unit, Reduce the current flowing through the parasitic body diode in the semiconductor super junction power device, and improve the reverse recovery speed of the semiconductor super junction power device.
- the gate 26 of at least one super-junction MOSFET cell 200 can be electrically connected to the n-type source region 23, that is, the part of the gate 26 is connected to the source. Voltage, which can reduce the gate charge of semiconductor superjunction power devices.
- FIG. 3 is a schematic cross-sectional structure diagram of a second embodiment of a semiconductor super junction power device provided by the present application. As shown in FIG. 3, this embodiment is similar to the semiconductor of the first embodiment of the present application shown in FIG. The difference in the structure of the superjunction power device is that the gate 26 in this embodiment extends to the side of the n-type drift region 21 above the n-type floating gate 25 and covers the n-type floating gate 25 near the side of the n-type drift region 21 This can increase the area of the gate 26 covering the n-type floating gate 25, thereby increasing the capacitive coupling ratio of the gate 26 to the n-type floating gate 26.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
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- Composite Materials (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
Claims (5)
- 一种半导体超结功率器件,包括:n型漏区,位于所述n型漏区之上的n型漂移区,以及由多个超结MOSFET单元组成的超结MOSFET单元阵列,所述超结MOSFET单元包括:p型体区,所述p型体区位于所述n型漂移区顶部;位于所述p型体区下方的p型柱状掺杂区;位于所述p型体区内的n型源区;位于所述p型体区之上的栅极结构,所述栅极结构包括栅介质层、栅极和n型浮栅,所述栅极和所述n型浮栅位于所述栅介质层之上,且在横向上,所述栅极位于靠近所述n型源区的一侧,所述n型浮栅位于靠近所述n型漂移区的一侧,所述栅极通过电容耦合作用于所述n型浮栅;位于所述栅介质层中的一个开口,所述n型浮栅通过所述开口与所述p型体区接触形成p-n结二极管。
- 如权利要求1所述的半导体超结功率器件,其中,所述栅极延伸至所述n型浮栅之上。
- 如权利要求1所述的半导体超结功率器件,其中,所述栅极延伸至所述n型浮栅之上且覆盖所述n型浮栅靠近所述n型漂移区一侧的侧壁。
- 如权利要求1所述的半导体超结功率器件,其中,所述开口位于所述n型浮栅下方且靠近所述n型漂移区的一侧。
- 如权利要求1所述的半导体超结功率器件,其中,在所述超结MOSFET单元阵列中,至少有一个所述超结MOSFET单元的栅极与所述n型源区电性连接。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE112019006590.4T DE112019006590T5 (de) | 2019-11-27 | 2019-12-05 | Halbleiter-Superübergangs-Leistungsbauelement |
KR1020217042460A KR20220012348A (ko) | 2019-11-27 | 2019-12-05 | 반도체 초접합 전력소자 |
US17/428,137 US11908889B2 (en) | 2019-11-27 | 2019-12-05 | Semiconductor super-junction power device |
JP2021551596A JP7177551B2 (ja) | 2019-11-27 | 2019-12-05 | 半導体スーパジャンクションパワーデバイス |
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CN201911184048.1 | 2019-11-27 | ||
CN201911184048.1A CN112864221B (zh) | 2019-11-27 | 2019-11-27 | 半导体超结功率器件 |
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WO2021103092A1 true WO2021103092A1 (zh) | 2021-06-03 |
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PCT/CN2019/123313 WO2021103092A1 (zh) | 2019-11-27 | 2019-12-05 | 半导体超结功率器件 |
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US (1) | US11908889B2 (zh) |
JP (1) | JP7177551B2 (zh) |
KR (1) | KR20220012348A (zh) |
CN (1) | CN112864221B (zh) |
DE (1) | DE112019006590T5 (zh) |
WO (1) | WO2021103092A1 (zh) |
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DE102005039564B4 (de) * | 2004-09-02 | 2011-03-31 | Fuji Electric Systems Co., Ltd. | Verfahren zum Herstellen eines Halbleiterbauteils |
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KR102117467B1 (ko) * | 2015-06-22 | 2020-06-01 | 삼성전기주식회사 | 전력 반도체 소자 |
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CN110212026B (zh) * | 2019-05-06 | 2022-09-16 | 上海功成半导体科技有限公司 | 超结mos器件结构及其制备方法 |
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2019
- 2019-11-27 CN CN201911184048.1A patent/CN112864221B/zh active Active
- 2019-12-05 US US17/428,137 patent/US11908889B2/en active Active
- 2019-12-05 KR KR1020217042460A patent/KR20220012348A/ko not_active Application Discontinuation
- 2019-12-05 WO PCT/CN2019/123313 patent/WO2021103092A1/zh active Application Filing
- 2019-12-05 DE DE112019006590.4T patent/DE112019006590T5/de active Pending
- 2019-12-05 JP JP2021551596A patent/JP7177551B2/ja active Active
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CN102270663A (zh) * | 2011-07-26 | 2011-12-07 | 无锡新洁能功率半导体有限公司 | 具有超结结构的平面型功率mosfet器件及其制造方法 |
CN103367157A (zh) * | 2012-04-06 | 2013-10-23 | 北大方正集团有限公司 | 一种超结mosfet的制备方法 |
CN103247626A (zh) * | 2013-05-02 | 2013-08-14 | 复旦大学 | 一种半浮栅器件及其制造方法 |
CN104465381A (zh) * | 2013-09-23 | 2015-03-25 | 苏州东微半导体有限公司 | 一种平面沟道的半浮栅器件的制造方法 |
CN103887313A (zh) * | 2014-03-04 | 2014-06-25 | 华为技术有限公司 | 一种半浮栅器件及其制备方法 |
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US11908889B2 (en) | 2024-02-20 |
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DE112019006590T5 (de) | 2021-12-23 |
JP2022522476A (ja) | 2022-04-19 |
KR20220012348A (ko) | 2022-02-03 |
US20220285486A1 (en) | 2022-09-08 |
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