WO2021033329A1 - エポキシ樹脂組成物 - Google Patents

エポキシ樹脂組成物 Download PDF

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Publication number
WO2021033329A1
WO2021033329A1 PCT/JP2019/032925 JP2019032925W WO2021033329A1 WO 2021033329 A1 WO2021033329 A1 WO 2021033329A1 JP 2019032925 W JP2019032925 W JP 2019032925W WO 2021033329 A1 WO2021033329 A1 WO 2021033329A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
component
resin composition
cured product
thiol
Prior art date
Application number
PCT/JP2019/032925
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
一希 岩谷
篤志 齊藤
Original Assignee
ナミックス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ナミックス株式会社 filed Critical ナミックス株式会社
Priority to JP2019547729A priority Critical patent/JP6651161B1/ja
Priority to KR1020207004495A priority patent/KR102129331B1/ko
Priority to KR1020207018358A priority patent/KR20220039515A/ko
Priority to CN201980004492.2A priority patent/CN112752783B/zh
Publication of WO2021033329A1 publication Critical patent/WO2021033329A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66—Mercaptans
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Definitions

  • the present invention relates to an epoxy resin composition, a sealing material containing the epoxy resin composition, a cured product obtained by curing the epoxy resin composition, and an electronic component containing the cured product.
  • the epoxy resin composition of the present invention contains, if desired, other additives such as carbon black, titanium black, ion trapping agent, leveling agent, and oxidation, as long as the gist of the present invention is not impaired.
  • additives such as carbon black, titanium black, ion trapping agent, leveling agent, and oxidation, as long as the gist of the present invention is not impaired.
  • Inhibitors, antifoaming agents, rocking agents, viscosity modifiers, flame retardants, colorants, solvents and the like can be added.
  • the type and amount of each additive are the same as usual.

Landscapes

  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
PCT/JP2019/032925 2019-08-21 2019-08-22 エポキシ樹脂組成物 WO2021033329A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019547729A JP6651161B1 (ja) 2019-08-21 2019-08-22 エポキシ樹脂組成物
KR1020207004495A KR102129331B1 (ko) 2019-08-21 2019-08-22 에폭시 수지 조성물
KR1020207018358A KR20220039515A (ko) 2019-08-21 2019-08-22 에폭시 수지 조성물
CN201980004492.2A CN112752783B (zh) 2019-08-21 2019-08-22 环氧树脂组合物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-151618 2019-08-21
JP2019151618 2019-08-21

Publications (1)

Publication Number Publication Date
WO2021033329A1 true WO2021033329A1 (ja) 2021-02-25

Family

ID=74660816

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/032925 WO2021033329A1 (ja) 2019-08-21 2019-08-22 エポキシ樹脂組成物

Country Status (4)

Country Link
JP (1) JP2021036021A (zh)
CN (1) CN112752783B (zh)
TW (1) TWI826714B (zh)
WO (1) WO2021033329A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7217566B1 (ja) 2022-10-28 2023-02-03 ナミックス株式会社 樹脂組成物、接着剤、封止材、硬化物及び半導体装置
JP7217565B1 (ja) 2022-10-28 2023-02-03 ナミックス株式会社 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品
WO2024024881A1 (ja) * 2022-07-29 2024-02-01 株式会社スリーボンド エポキシ樹脂組成物
WO2024090259A1 (ja) * 2022-10-28 2024-05-02 ナミックス株式会社 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113851055B (zh) * 2021-09-27 2023-09-29 京东方科技集团股份有限公司 一种显示模组及其制备方法、拼接显示装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49130999A (zh) * 1973-04-20 1974-12-16
JPS55102624A (en) * 1979-02-01 1980-08-06 Mitsubishi Petrochem Co Ltd Epoxy resin composition having excellent curability
JPH03273021A (ja) * 1990-02-15 1991-12-04 Toray Chiokoole Kk エポキシ樹脂組成物
WO2000046317A1 (en) * 1999-02-08 2000-08-10 The Yokohama Rubber Co., Ltd. Resin compositions
WO2001098411A1 (fr) * 2000-06-21 2001-12-27 Mitsui Chemicals Inc. Materiau de scellement pour cellules d'affichage a cristaux liquides plastiques
JP2015218152A (ja) * 2014-05-21 2015-12-07 四国化成工業株式会社 トリアジン化合物、該化合物の合成方法およびエポキシ樹脂組成物

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US3980604A (en) * 1973-06-08 1976-09-14 Whiting David A Resin impregnation of siliceous materials
JP3047179U (ja) * 1997-09-16 1998-03-31 ジェフリー アーネスト プレーン マスクカバー
US6653371B1 (en) * 1998-01-16 2003-11-25 Barry E. Burns One-part curable composition of polyepoxide, polythiol, latent hardener and solid organic acid
CA2318167A1 (en) * 1998-01-16 1999-07-22 Loctite (R & D) Limited Curable epoxy-based compositions
JP3079204U (ja) * 2000-08-21 2001-08-10 倶子 冨山 フイルムサングラス。
CN101553909B (zh) * 2006-12-04 2011-08-17 松下电器产业株式会社 密封材料以及使用该密封材料的安装方法
JP5143019B2 (ja) * 2006-12-04 2013-02-13 パナソニック株式会社 封止材料、実装方法、リペア方法および実装構造体
JP4986719B2 (ja) * 2007-06-06 2012-07-25 株式会社白元 マスク
JP2009273910A (ja) * 2009-08-11 2009-11-26 Nippon Suisan Kaisha Ltd 織布製マスク
KR101898742B1 (ko) * 2010-11-05 2018-09-13 헨켈 아이피 앤드 홀딩 게엠베하 개선된 안정성을 가지는 에폭시-티올 조성물
JP5673237B2 (ja) * 2011-03-10 2015-02-18 住友ベークライト株式会社 封止用樹脂組成物及び電子部品装置
CN103184022B (zh) * 2011-12-30 2017-09-19 汉高股份有限及两合公司 用于硅片制备中的暂时性粘合用粘合剂组合物
CN102702686B (zh) * 2012-06-19 2015-04-15 广州聚合电子材料有限公司 一种可应用于生产兆瓦级风力叶片的环氧树脂体系及其制备方法
CN105324363B (zh) * 2013-07-05 2018-07-17 味之素株式会社 含硫醇基的化合物和单组分环氧树脂组合物
RU2018100340A (ru) * 2015-06-25 2019-07-25 Торэй Индастриз, Инк. Композиция эпоксидной смолы, армированный волокном композиционный материал, формованное изделие и сосуд высокого давления
JP3204220U (ja) * 2015-12-25 2016-05-26 明美 鹿村 マスクの取替えガーゼ
CN107641193A (zh) * 2016-07-22 2018-01-30 北京化工大学 一步法制备低粘度高强高韧性环氧树脂
JP2020523450A (ja) * 2017-06-12 2020-08-06 スリーエム イノベイティブ プロパティズ カンパニー エポキシ／チオール樹脂組成物、方法、及びテープ
JP3226831U (ja) * 2020-04-01 2020-07-27 有限会社テクノフーズ マスクカバー

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49130999A (zh) * 1973-04-20 1974-12-16
JPS55102624A (en) * 1979-02-01 1980-08-06 Mitsubishi Petrochem Co Ltd Epoxy resin composition having excellent curability
JPH03273021A (ja) * 1990-02-15 1991-12-04 Toray Chiokoole Kk エポキシ樹脂組成物
WO2000046317A1 (en) * 1999-02-08 2000-08-10 The Yokohama Rubber Co., Ltd. Resin compositions
WO2001098411A1 (fr) * 2000-06-21 2001-12-27 Mitsui Chemicals Inc. Materiau de scellement pour cellules d'affichage a cristaux liquides plastiques
JP2015218152A (ja) * 2014-05-21 2015-12-07 四国化成工業株式会社 トリアジン化合物、該化合物の合成方法およびエポキシ樹脂組成物

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024024881A1 (ja) * 2022-07-29 2024-02-01 株式会社スリーボンド エポキシ樹脂組成物
JP7217566B1 (ja) 2022-10-28 2023-02-03 ナミックス株式会社 樹脂組成物、接着剤、封止材、硬化物及び半導体装置
JP7217565B1 (ja) 2022-10-28 2023-02-03 ナミックス株式会社 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品
WO2024090259A1 (ja) * 2022-10-28 2024-05-02 ナミックス株式会社 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品
JP2024064649A (ja) * 2022-10-28 2024-05-14 ナミックス株式会社 樹脂組成物、接着剤、封止材、硬化物及び半導体装置
JP2024064648A (ja) * 2022-10-28 2024-05-14 ナミックス株式会社 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品

Also Published As

Publication number Publication date
CN112752783B (zh) 2022-08-02
CN112752783A (zh) 2021-05-04
JP2021036021A (ja) 2021-03-04
TWI826714B (zh) 2023-12-21
TW202116849A (zh) 2021-05-01

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