JPS55102624A - Epoxy resin composition having excellent curability - Google Patents

Epoxy resin composition having excellent curability

Info

Publication number
JPS55102624A
JPS55102624A JP1066579A JP1066579A JPS55102624A JP S55102624 A JPS55102624 A JP S55102624A JP 1066579 A JP1066579 A JP 1066579A JP 1066579 A JP1066579 A JP 1066579A JP S55102624 A JPS55102624 A JP S55102624A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
acid ester
epoxy
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1066579A
Other languages
Japanese (ja)
Other versions
JPS6021648B2 (en
Inventor
Yoshitomo Nakano
Ichiro Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Petrochemical Co Ltd
Original Assignee
Mitsubishi Petrochemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Petrochemical Co Ltd filed Critical Mitsubishi Petrochemical Co Ltd
Priority to JP1066579A priority Critical patent/JPS6021648B2/en
Publication of JPS55102624A publication Critical patent/JPS55102624A/en
Publication of JPS6021648B2 publication Critical patent/JPS6021648B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: To prepare an epoxy resin composition rapidly curable at ordinary temperature, by mixing an epoxy resin with a specific polythioalkyl acid ester and an amine.
CONSTITUTION: An epoxy resin composition comprising (A) an epoxy resin [two or more epoxy groups are contained in a molecule, e.g. the glycidyl ether of 2,2-bis- (4-hydroxyphenyl)propane], (B) a polythioalkyl acid ester (three or more -SH groups are contained in a molecule, e.g. the trimercaptopropionic acid ester of trimethylolpropane) and (C) an amine (e.g. polyamines, polyamide resins, etc.). The sum of the -SH group in (B) and the active hydrogen group in (C) is 0.3W3 equivalent on the basis of 1 equivalent of the epoxy group in (A).
EFFECT: Curable even at 0W15°C and useful for adhesives, coatings and grafting materials.
COPYRIGHT: (C)1980,JPO&Japio
JP1066579A 1979-02-01 1979-02-01 Epoxy resin composition with excellent curability Expired JPS6021648B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1066579A JPS6021648B2 (en) 1979-02-01 1979-02-01 Epoxy resin composition with excellent curability

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1066579A JPS6021648B2 (en) 1979-02-01 1979-02-01 Epoxy resin composition with excellent curability

Publications (2)

Publication Number Publication Date
JPS55102624A true JPS55102624A (en) 1980-08-06
JPS6021648B2 JPS6021648B2 (en) 1985-05-29

Family

ID=11756529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1066579A Expired JPS6021648B2 (en) 1979-02-01 1979-02-01 Epoxy resin composition with excellent curability

Country Status (1)

Country Link
JP (1) JPS6021648B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6090217A (en) * 1983-10-24 1985-05-21 Dainippon Ink & Chem Inc Epoxy resin composition for new construction or repair and application material containing the same
JPS61171727A (en) * 1985-01-28 1986-08-02 Dainippon Ink & Chem Inc Epoxy resin composition for use in new application or repair and applicative material containing same
JP2009504887A (en) * 2005-08-16 2009-02-05 シェブロン フィリップス ケミカル カンパニー エルピー Mercaptan-cured epoxy polymer composition and method for making and using the same
WO2012141167A1 (en) * 2011-04-11 2012-10-18 大日本印刷株式会社 Reinforcing material for solid polymer fuel cell, and cohesive/adhesive composition for use in same
JP2014504663A (en) * 2010-12-29 2014-02-24 スリーエム イノベイティブ プロパティズ カンパニー Structural hybrid adhesive
WO2018173991A1 (en) * 2017-03-23 2018-09-27 ナミックス株式会社 Resin composition, adhesive for electronic part, semiconductor device, and electronic part
JP6651161B1 (en) * 2019-08-21 2020-02-19 ナミックス株式会社 Epoxy resin composition
WO2021033329A1 (en) * 2019-08-21 2021-02-25 ナミックス株式会社 Epoxy resin composition

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6222438U (en) * 1985-07-25 1987-02-10
EP3037452B1 (en) 2013-08-23 2019-04-10 Adeka Corporation One-part curable resin composition

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6090217A (en) * 1983-10-24 1985-05-21 Dainippon Ink & Chem Inc Epoxy resin composition for new construction or repair and application material containing the same
JPS61171727A (en) * 1985-01-28 1986-08-02 Dainippon Ink & Chem Inc Epoxy resin composition for use in new application or repair and applicative material containing same
JP2009504887A (en) * 2005-08-16 2009-02-05 シェブロン フィリップス ケミカル カンパニー エルピー Mercaptan-cured epoxy polymer composition and method for making and using the same
JP2014504663A (en) * 2010-12-29 2014-02-24 スリーエム イノベイティブ プロパティズ カンパニー Structural hybrid adhesive
US9437881B2 (en) 2011-04-11 2016-09-06 Dai Nippon Printing Co., Ltd. Reinforcing material for solid polymer fuel cell, and cohesive/adhesive composition for use in same
CN103582562A (en) * 2011-04-11 2014-02-12 大日本印刷株式会社 Reinforcing material for solid polymer fuel cell, and cohesive/adhesive composition for use in same
JPWO2012141167A1 (en) * 2011-04-11 2014-07-28 大日本印刷株式会社 Reinforcing material for polymer electrolyte fuel cell and adhesive composition used therefor
JP5880546B2 (en) * 2011-04-11 2016-03-09 大日本印刷株式会社 Reinforcing material for polymer electrolyte fuel cell and adhesive composition used therefor
WO2012141167A1 (en) * 2011-04-11 2012-10-18 大日本印刷株式会社 Reinforcing material for solid polymer fuel cell, and cohesive/adhesive composition for use in same
WO2018173991A1 (en) * 2017-03-23 2018-09-27 ナミックス株式会社 Resin composition, adhesive for electronic part, semiconductor device, and electronic part
JPWO2018173991A1 (en) * 2017-03-23 2020-01-23 ナミックス株式会社 Resin composition, adhesive for electronic parts, semiconductor device, and electronic parts
TWI816661B (en) * 2017-03-23 2023-10-01 日商納美仕有限公司 Resin composition, adhesive for electronic component, semiconductor device, and electronic component
JP6651161B1 (en) * 2019-08-21 2020-02-19 ナミックス株式会社 Epoxy resin composition
KR102129331B1 (en) * 2019-08-21 2020-07-03 나믹스 가부시끼가이샤 Epoxy resin composition
WO2021033329A1 (en) * 2019-08-21 2021-02-25 ナミックス株式会社 Epoxy resin composition
TWI826714B (en) * 2019-08-21 2023-12-21 日商納美仕有限公司 Epoxy resin composition

Also Published As

Publication number Publication date
JPS6021648B2 (en) 1985-05-29

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