JPS55102624A - Epoxy resin composition having excellent curability - Google Patents
Epoxy resin composition having excellent curabilityInfo
- Publication number
- JPS55102624A JPS55102624A JP1066579A JP1066579A JPS55102624A JP S55102624 A JPS55102624 A JP S55102624A JP 1066579 A JP1066579 A JP 1066579A JP 1066579 A JP1066579 A JP 1066579A JP S55102624 A JPS55102624 A JP S55102624A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- acid ester
- epoxy
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: To prepare an epoxy resin composition rapidly curable at ordinary temperature, by mixing an epoxy resin with a specific polythioalkyl acid ester and an amine.
CONSTITUTION: An epoxy resin composition comprising (A) an epoxy resin [two or more epoxy groups are contained in a molecule, e.g. the glycidyl ether of 2,2-bis- (4-hydroxyphenyl)propane], (B) a polythioalkyl acid ester (three or more -SH groups are contained in a molecule, e.g. the trimercaptopropionic acid ester of trimethylolpropane) and (C) an amine (e.g. polyamines, polyamide resins, etc.). The sum of the -SH group in (B) and the active hydrogen group in (C) is 0.3W3 equivalent on the basis of 1 equivalent of the epoxy group in (A).
EFFECT: Curable even at 0W15°C and useful for adhesives, coatings and grafting materials.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1066579A JPS6021648B2 (en) | 1979-02-01 | 1979-02-01 | Epoxy resin composition with excellent curability |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1066579A JPS6021648B2 (en) | 1979-02-01 | 1979-02-01 | Epoxy resin composition with excellent curability |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55102624A true JPS55102624A (en) | 1980-08-06 |
JPS6021648B2 JPS6021648B2 (en) | 1985-05-29 |
Family
ID=11756529
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1066579A Expired JPS6021648B2 (en) | 1979-02-01 | 1979-02-01 | Epoxy resin composition with excellent curability |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6021648B2 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6090217A (en) * | 1983-10-24 | 1985-05-21 | Dainippon Ink & Chem Inc | Epoxy resin composition for new construction or repair and application material containing the same |
JPS61171727A (en) * | 1985-01-28 | 1986-08-02 | Dainippon Ink & Chem Inc | Epoxy resin composition for use in new application or repair and applicative material containing same |
JP2009504887A (en) * | 2005-08-16 | 2009-02-05 | シェブロン フィリップス ケミカル カンパニー エルピー | Mercaptan-cured epoxy polymer composition and method for making and using the same |
WO2012141167A1 (en) * | 2011-04-11 | 2012-10-18 | 大日本印刷株式会社 | Reinforcing material for solid polymer fuel cell, and cohesive/adhesive composition for use in same |
JP2014504663A (en) * | 2010-12-29 | 2014-02-24 | スリーエム イノベイティブ プロパティズ カンパニー | Structural hybrid adhesive |
WO2018173991A1 (en) * | 2017-03-23 | 2018-09-27 | ナミックス株式会社 | Resin composition, adhesive for electronic part, semiconductor device, and electronic part |
JP6651161B1 (en) * | 2019-08-21 | 2020-02-19 | ナミックス株式会社 | Epoxy resin composition |
WO2021033329A1 (en) * | 2019-08-21 | 2021-02-25 | ナミックス株式会社 | Epoxy resin composition |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6222438U (en) * | 1985-07-25 | 1987-02-10 | ||
EP3037452B1 (en) | 2013-08-23 | 2019-04-10 | Adeka Corporation | One-part curable resin composition |
-
1979
- 1979-02-01 JP JP1066579A patent/JPS6021648B2/en not_active Expired
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6090217A (en) * | 1983-10-24 | 1985-05-21 | Dainippon Ink & Chem Inc | Epoxy resin composition for new construction or repair and application material containing the same |
JPS61171727A (en) * | 1985-01-28 | 1986-08-02 | Dainippon Ink & Chem Inc | Epoxy resin composition for use in new application or repair and applicative material containing same |
JP2009504887A (en) * | 2005-08-16 | 2009-02-05 | シェブロン フィリップス ケミカル カンパニー エルピー | Mercaptan-cured epoxy polymer composition and method for making and using the same |
JP2014504663A (en) * | 2010-12-29 | 2014-02-24 | スリーエム イノベイティブ プロパティズ カンパニー | Structural hybrid adhesive |
US9437881B2 (en) | 2011-04-11 | 2016-09-06 | Dai Nippon Printing Co., Ltd. | Reinforcing material for solid polymer fuel cell, and cohesive/adhesive composition for use in same |
CN103582562A (en) * | 2011-04-11 | 2014-02-12 | 大日本印刷株式会社 | Reinforcing material for solid polymer fuel cell, and cohesive/adhesive composition for use in same |
JPWO2012141167A1 (en) * | 2011-04-11 | 2014-07-28 | 大日本印刷株式会社 | Reinforcing material for polymer electrolyte fuel cell and adhesive composition used therefor |
JP5880546B2 (en) * | 2011-04-11 | 2016-03-09 | 大日本印刷株式会社 | Reinforcing material for polymer electrolyte fuel cell and adhesive composition used therefor |
WO2012141167A1 (en) * | 2011-04-11 | 2012-10-18 | 大日本印刷株式会社 | Reinforcing material for solid polymer fuel cell, and cohesive/adhesive composition for use in same |
WO2018173991A1 (en) * | 2017-03-23 | 2018-09-27 | ナミックス株式会社 | Resin composition, adhesive for electronic part, semiconductor device, and electronic part |
JPWO2018173991A1 (en) * | 2017-03-23 | 2020-01-23 | ナミックス株式会社 | Resin composition, adhesive for electronic parts, semiconductor device, and electronic parts |
TWI816661B (en) * | 2017-03-23 | 2023-10-01 | 日商納美仕有限公司 | Resin composition, adhesive for electronic component, semiconductor device, and electronic component |
JP6651161B1 (en) * | 2019-08-21 | 2020-02-19 | ナミックス株式会社 | Epoxy resin composition |
KR102129331B1 (en) * | 2019-08-21 | 2020-07-03 | 나믹스 가부시끼가이샤 | Epoxy resin composition |
WO2021033329A1 (en) * | 2019-08-21 | 2021-02-25 | ナミックス株式会社 | Epoxy resin composition |
TWI826714B (en) * | 2019-08-21 | 2023-12-21 | 日商納美仕有限公司 | Epoxy resin composition |
Also Published As
Publication number | Publication date |
---|---|
JPS6021648B2 (en) | 1985-05-29 |
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