JPS5571763A - Epoxy resin coating composition - Google Patents
Epoxy resin coating compositionInfo
- Publication number
- JPS5571763A JPS5571763A JP14507778A JP14507778A JPS5571763A JP S5571763 A JPS5571763 A JP S5571763A JP 14507778 A JP14507778 A JP 14507778A JP 14507778 A JP14507778 A JP 14507778A JP S5571763 A JPS5571763 A JP S5571763A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- parts
- amine
- per
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: An epoxy resin coating composition that is composed of an epoxy resin, a polythiol resin, an amine compound, a tertiary amine and a curing accelerator, thus being cold curable and giving high corrosion resistance and adhesion to the coating films.
CONSTITUTION: Said composition comprises (A) an epoxy resin bearing 2 or more epoxy groups in one molecule, (B) a mixture consisting of a polythiol resin and 1W3 equivalents, per 1 equivalent of mercaptan in the polythiol resin, of amine active hydrogens in at least one amine compound selected from amine-adduct resin, polyamide resin and polyamine, (C) 2W15 parts by wt, per 100 parts of the epoxy resin, of a tertiary amine, and (D) 0.5W10 parts, per 100 parts of the epoxy resin, of a curing accelerator. The tertiary amine used is, e.g., tris(dimethylaminomethyl)phenol or dimethylaminoethanol.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14507778A JPS5571763A (en) | 1978-11-24 | 1978-11-24 | Epoxy resin coating composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14507778A JPS5571763A (en) | 1978-11-24 | 1978-11-24 | Epoxy resin coating composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5571763A true JPS5571763A (en) | 1980-05-30 |
JPS5733309B2 JPS5733309B2 (en) | 1982-07-16 |
Family
ID=15376840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14507778A Granted JPS5571763A (en) | 1978-11-24 | 1978-11-24 | Epoxy resin coating composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5571763A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59232117A (en) * | 1983-06-15 | 1984-12-26 | Toray Chiokoole Kk | Curing of epoxy resin |
JPS6090217A (en) * | 1983-10-24 | 1985-05-21 | Dainippon Ink & Chem Inc | Epoxy resin composition for new construction or repair and application material containing the same |
JPH05112632A (en) * | 1991-10-23 | 1993-05-07 | Daito Sangyo Kk | Method for curing epoxy resin |
US5521274A (en) * | 1991-12-19 | 1996-05-28 | Morton International Limited | Polysulfide-modified epoxy resins |
CN102516915A (en) * | 2011-12-09 | 2012-06-27 | 安徽中铁工程材料科技有限公司 | Preparation method of modified cross-linked bisphenol A reinforcement adhesive for ballastless track mortar defect repair |
EP2698250A1 (en) * | 2011-04-11 | 2014-02-19 | Dai Nippon Printing Co., Ltd. | Reinforcing material for solid polymer fuel cell, and cohesive/adhesive composition for use in same |
WO2018173991A1 (en) * | 2017-03-23 | 2018-09-27 | ナミックス株式会社 | Resin composition, adhesive for electronic part, semiconductor device, and electronic part |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5977113A (en) * | 1982-10-25 | 1984-05-02 | 株式会社黒木工業所 | Bolt and its manufacture |
JPS59140914A (en) * | 1983-01-28 | 1984-08-13 | 株式会社 黒木工業所 | Nut and its manufacture |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5150399A (en) * | 1974-10-30 | 1976-05-01 | Matsumoto Seiyaku Kogyo Kk | EHOKISHIJUSHISOSEIBUTSU |
-
1978
- 1978-11-24 JP JP14507778A patent/JPS5571763A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5150399A (en) * | 1974-10-30 | 1976-05-01 | Matsumoto Seiyaku Kogyo Kk | EHOKISHIJUSHISOSEIBUTSU |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59232117A (en) * | 1983-06-15 | 1984-12-26 | Toray Chiokoole Kk | Curing of epoxy resin |
JPS6090217A (en) * | 1983-10-24 | 1985-05-21 | Dainippon Ink & Chem Inc | Epoxy resin composition for new construction or repair and application material containing the same |
JPH05112632A (en) * | 1991-10-23 | 1993-05-07 | Daito Sangyo Kk | Method for curing epoxy resin |
US5521274A (en) * | 1991-12-19 | 1996-05-28 | Morton International Limited | Polysulfide-modified epoxy resins |
EP2698250A1 (en) * | 2011-04-11 | 2014-02-19 | Dai Nippon Printing Co., Ltd. | Reinforcing material for solid polymer fuel cell, and cohesive/adhesive composition for use in same |
EP2698250A4 (en) * | 2011-04-11 | 2014-12-10 | Dainippon Printing Co Ltd | Reinforcing material for solid polymer fuel cell, and cohesive/adhesive composition for use in same |
US9437881B2 (en) | 2011-04-11 | 2016-09-06 | Dai Nippon Printing Co., Ltd. | Reinforcing material for solid polymer fuel cell, and cohesive/adhesive composition for use in same |
CN102516915A (en) * | 2011-12-09 | 2012-06-27 | 安徽中铁工程材料科技有限公司 | Preparation method of modified cross-linked bisphenol A reinforcement adhesive for ballastless track mortar defect repair |
WO2018173991A1 (en) * | 2017-03-23 | 2018-09-27 | ナミックス株式会社 | Resin composition, adhesive for electronic part, semiconductor device, and electronic part |
JPWO2018173991A1 (en) * | 2017-03-23 | 2020-01-23 | ナミックス株式会社 | Resin composition, adhesive for electronic parts, semiconductor device, and electronic parts |
TWI816661B (en) * | 2017-03-23 | 2023-10-01 | 日商納美仕有限公司 | Resin composition, adhesive for electronic component, semiconductor device, and electronic component |
Also Published As
Publication number | Publication date |
---|---|
JPS5733309B2 (en) | 1982-07-16 |
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