WO2021033329A1 - Composition de résine époxy - Google Patents
Composition de résine époxy Download PDFInfo
- Publication number
- WO2021033329A1 WO2021033329A1 PCT/JP2019/032925 JP2019032925W WO2021033329A1 WO 2021033329 A1 WO2021033329 A1 WO 2021033329A1 JP 2019032925 W JP2019032925 W JP 2019032925W WO 2021033329 A1 WO2021033329 A1 WO 2021033329A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- epoxy resin
- component
- resin composition
- cured product
- thiol
- Prior art date
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/66—Mercaptans
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Definitions
- the present invention relates to an epoxy resin composition, a sealing material containing the epoxy resin composition, a cured product obtained by curing the epoxy resin composition, and an electronic component containing the cured product.
- the epoxy resin composition of the present invention contains, if desired, other additives such as carbon black, titanium black, ion trapping agent, leveling agent, and oxidation, as long as the gist of the present invention is not impaired.
- additives such as carbon black, titanium black, ion trapping agent, leveling agent, and oxidation, as long as the gist of the present invention is not impaired.
- Inhibitors, antifoaming agents, rocking agents, viscosity modifiers, flame retardants, colorants, solvents and the like can be added.
- the type and amount of each additive are the same as usual.
Landscapes
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
La présente invention concerne : une composition de résine époxy qui durcit en peu de temps même dans des conditions de basse température pour produire un produit durci ayant un point de transition vitreuse (Tg) bas et une résistance à la traction élevée ; un matériau d'étanchéité la contenant ; un produit durci obtenu par durcissement de la composition ; et un composant électronique comprenant le produit durci. Ladite composition de résine époxy, une fois durcie, donne un produit durci ayant un Tg bas et une résistance à la traction élevée, et est par conséquent extrêmement utile en tant qu'agent adhésif, matériau d'étanchéité ou agent de barrage pour un semi-conducteur ou un composant électronique.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019547729A JP6651161B1 (ja) | 2019-08-21 | 2019-08-22 | エポキシ樹脂組成物 |
KR1020207004495A KR102129331B1 (ko) | 2019-08-21 | 2019-08-22 | 에폭시 수지 조성물 |
KR1020207018358A KR20220039515A (ko) | 2019-08-21 | 2019-08-22 | 에폭시 수지 조성물 |
CN201980004492.2A CN112752783B (zh) | 2019-08-21 | 2019-08-22 | 环氧树脂组合物 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019151618 | 2019-08-21 | ||
JP2019-151618 | 2019-08-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2021033329A1 true WO2021033329A1 (fr) | 2021-02-25 |
Family
ID=74660816
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2019/032925 WO2021033329A1 (fr) | 2019-08-21 | 2019-08-22 | Composition de résine époxy |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2021036021A (fr) |
CN (1) | CN112752783B (fr) |
TW (1) | TWI826714B (fr) |
WO (1) | WO2021033329A1 (fr) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7217566B1 (ja) | 2022-10-28 | 2023-02-03 | ナミックス株式会社 | 樹脂組成物、接着剤、封止材、硬化物及び半導体装置 |
JP7217565B1 (ja) | 2022-10-28 | 2023-02-03 | ナミックス株式会社 | 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品 |
WO2024024881A1 (fr) * | 2022-07-29 | 2024-02-01 | 株式会社スリーボンド | Composition de résine époxydique |
WO2024090259A1 (fr) * | 2022-10-28 | 2024-05-02 | ナミックス株式会社 | Composition de résine, adhésif, matériau d'étanchéité, produit durci, dispositif à semi-conducteur et composant électronique |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113851055B (zh) * | 2021-09-27 | 2023-09-29 | 京东方科技集团股份有限公司 | 一种显示模组及其制备方法、拼接显示装置 |
Citations (6)
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JPS49130999A (fr) * | 1973-04-20 | 1974-12-16 | ||
JPS55102624A (en) * | 1979-02-01 | 1980-08-06 | Mitsubishi Petrochem Co Ltd | Epoxy resin composition having excellent curability |
JPH03273021A (ja) * | 1990-02-15 | 1991-12-04 | Toray Chiokoole Kk | エポキシ樹脂組成物 |
WO2000046317A1 (fr) * | 1999-02-08 | 2000-08-10 | The Yokohama Rubber Co., Ltd. | Compositions resineuses |
WO2001098411A1 (fr) * | 2000-06-21 | 2001-12-27 | Mitsui Chemicals Inc. | Materiau de scellement pour cellules d'affichage a cristaux liquides plastiques |
JP2015218152A (ja) * | 2014-05-21 | 2015-12-07 | 四国化成工業株式会社 | トリアジン化合物、該化合物の合成方法およびエポキシ樹脂組成物 |
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US3980604A (en) * | 1973-06-08 | 1976-09-14 | Whiting David A | Resin impregnation of siliceous materials |
JP3047179U (ja) * | 1997-09-16 | 1998-03-31 | ジェフリー アーネスト プレーン | マスクカバー |
KR100573326B1 (ko) * | 1998-01-16 | 2006-04-24 | 록타이트(알 앤 디) 리미티드 | 경화성 에폭시-기제 조성물 |
US6653371B1 (en) * | 1998-01-16 | 2003-11-25 | Barry E. Burns | One-part curable composition of polyepoxide, polythiol, latent hardener and solid organic acid |
JP3079204U (ja) * | 2000-08-21 | 2001-08-10 | 倶子 冨山 | フイルムサングラス。 |
US8217275B2 (en) * | 2006-12-04 | 2012-07-10 | Panasonic Corporation | Sealing material and mounting method using the sealing material |
CN101553910B (zh) * | 2006-12-04 | 2012-03-28 | 松下电器产业株式会社 | 密封材料以及使用该密封材料的安装方法 |
JP4986719B2 (ja) * | 2007-06-06 | 2012-07-25 | 株式会社白元 | マスク |
JP2009273910A (ja) * | 2009-08-11 | 2009-11-26 | Nippon Suisan Kaisha Ltd | 織布製マスク |
EP2635619A1 (fr) * | 2010-11-05 | 2013-09-11 | Henkel Ireland Limited | Compositions d'époxy-thiol à stabilité améliorée |
JP5673237B2 (ja) * | 2011-03-10 | 2015-02-18 | 住友ベークライト株式会社 | 封止用樹脂組成物及び電子部品装置 |
CN103184022B (zh) * | 2011-12-30 | 2017-09-19 | 汉高股份有限及两合公司 | 用于硅片制备中的暂时性粘合用粘合剂组合物 |
CN102702686B (zh) * | 2012-06-19 | 2015-04-15 | 广州聚合电子材料有限公司 | 一种可应用于生产兆瓦级风力叶片的环氧树脂体系及其制备方法 |
KR102182890B1 (ko) * | 2013-07-05 | 2020-11-25 | 아지노모토 가부시키가이샤 | 티올기 함유 화합물 및 1액성 에폭시 수지 조성물 |
CN111187395B (zh) * | 2015-06-25 | 2022-11-22 | 东丽株式会社 | 环氧树脂组合物、纤维增强复合材料、成型品及压力容器 |
JP3204220U (ja) * | 2015-12-25 | 2016-05-26 | 明美 鹿村 | マスクの取替えガーゼ |
CN107641193A (zh) * | 2016-07-22 | 2018-01-30 | 北京化工大学 | 一步法制备低粘度高强高韧性环氧树脂 |
WO2018229583A1 (fr) * | 2017-06-12 | 2018-12-20 | 3M Innovative Properties Company | Compositions de résine époxy/thiol, procédés et rubans |
JP3226831U (ja) * | 2020-04-01 | 2020-07-27 | 有限会社テクノフーズ | マスクカバー |
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2019
- 2019-08-22 CN CN201980004492.2A patent/CN112752783B/zh active Active
- 2019-08-22 WO PCT/JP2019/032925 patent/WO2021033329A1/fr active Application Filing
-
2020
- 2020-01-08 JP JP2020001360A patent/JP2021036021A/ja active Pending
- 2020-08-10 TW TW109127071A patent/TWI826714B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49130999A (fr) * | 1973-04-20 | 1974-12-16 | ||
JPS55102624A (en) * | 1979-02-01 | 1980-08-06 | Mitsubishi Petrochem Co Ltd | Epoxy resin composition having excellent curability |
JPH03273021A (ja) * | 1990-02-15 | 1991-12-04 | Toray Chiokoole Kk | エポキシ樹脂組成物 |
WO2000046317A1 (fr) * | 1999-02-08 | 2000-08-10 | The Yokohama Rubber Co., Ltd. | Compositions resineuses |
WO2001098411A1 (fr) * | 2000-06-21 | 2001-12-27 | Mitsui Chemicals Inc. | Materiau de scellement pour cellules d'affichage a cristaux liquides plastiques |
JP2015218152A (ja) * | 2014-05-21 | 2015-12-07 | 四国化成工業株式会社 | トリアジン化合物、該化合物の合成方法およびエポキシ樹脂組成物 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024024881A1 (fr) * | 2022-07-29 | 2024-02-01 | 株式会社スリーボンド | Composition de résine époxydique |
JP7217566B1 (ja) | 2022-10-28 | 2023-02-03 | ナミックス株式会社 | 樹脂組成物、接着剤、封止材、硬化物及び半導体装置 |
JP7217565B1 (ja) | 2022-10-28 | 2023-02-03 | ナミックス株式会社 | 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品 |
WO2024090259A1 (fr) * | 2022-10-28 | 2024-05-02 | ナミックス株式会社 | Composition de résine, adhésif, matériau d'étanchéité, produit durci, dispositif à semi-conducteur et composant électronique |
JP2024064648A (ja) * | 2022-10-28 | 2024-05-14 | ナミックス株式会社 | 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品 |
JP2024064649A (ja) * | 2022-10-28 | 2024-05-14 | ナミックス株式会社 | 樹脂組成物、接着剤、封止材、硬化物及び半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
TWI826714B (zh) | 2023-12-21 |
CN112752783A (zh) | 2021-05-04 |
CN112752783B (zh) | 2022-08-02 |
JP2021036021A (ja) | 2021-03-04 |
TW202116849A (zh) | 2021-05-01 |
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