JP2021036021A - エポキシ樹脂組成物 - Google Patents

エポキシ樹脂組成物 Download PDF

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Publication number
JP2021036021A
JP2021036021A JP2020001360A JP2020001360A JP2021036021A JP 2021036021 A JP2021036021 A JP 2021036021A JP 2020001360 A JP2020001360 A JP 2020001360A JP 2020001360 A JP2020001360 A JP 2020001360A JP 2021036021 A JP2021036021 A JP 2021036021A
Authority
JP
Japan
Prior art keywords
epoxy resin
component
resin composition
cured product
thiol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020001360A
Other languages
English (en)
Japanese (ja)
Inventor
一希 岩谷
Kazuki Iwatani
一希 岩谷
篤志 齊藤
Atsushi Saito
篤志 齊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Namics Corp
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of JP2021036021A publication Critical patent/JP2021036021A/ja
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66Mercaptans
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2020001360A 2019-08-21 2020-01-08 エポキシ樹脂組成物 Pending JP2021036021A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019151618 2019-08-21
JP2019151618 2019-08-21

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2019547729A Division JP6651161B1 (ja) 2019-08-21 2019-08-22 エポキシ樹脂組成物

Publications (1)

Publication Number Publication Date
JP2021036021A true JP2021036021A (ja) 2021-03-04

Family

ID=74660816

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020001360A Pending JP2021036021A (ja) 2019-08-21 2020-01-08 エポキシ樹脂組成物

Country Status (4)

Country Link
JP (1) JP2021036021A (fr)
CN (1) CN112752783B (fr)
TW (1) TWI826714B (fr)
WO (1) WO2021033329A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113851055B (zh) * 2021-09-27 2023-09-29 京东方科技集团股份有限公司 一种显示模组及其制备方法、拼接显示装置
WO2024024881A1 (fr) * 2022-07-29 2024-02-01 株式会社スリーボンド Composition de résine époxydique
JP7217565B1 (ja) 2022-10-28 2023-02-03 ナミックス株式会社 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品
JP7217566B1 (ja) 2022-10-28 2023-02-03 ナミックス株式会社 樹脂組成物、接着剤、封止材、硬化物及び半導体装置
WO2024090259A1 (fr) * 2022-10-28 2024-05-02 ナミックス株式会社 Composition de résine, adhésif, matériau d'étanchéité, produit durci, dispositif à semi-conducteur et composant électronique

Citations (6)

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JP3047179U (ja) * 1997-09-16 1998-03-31 ジェフリー アーネスト プレーン マスクカバー
JP3079204U (ja) * 2000-08-21 2001-08-10 倶子 冨山 フイルムサングラス。
JP2008301962A (ja) * 2007-06-06 2008-12-18 Hakugen:Kk マスク
JP2009273910A (ja) * 2009-08-11 2009-11-26 Nippon Suisan Kaisha Ltd 織布製マスク
JP3204220U (ja) * 2015-12-25 2016-05-26 明美 鹿村 マスクの取替えガーゼ
JP3226831U (ja) * 2020-04-01 2020-07-27 有限会社テクノフーズ マスクカバー

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JPS5222399B2 (fr) * 1973-04-20 1977-06-17
US3980604A (en) * 1973-06-08 1976-09-14 Whiting David A Resin impregnation of siliceous materials
JPS6021648B2 (ja) * 1979-02-01 1985-05-29 三菱油化株式会社 硬化性の優れたエポキシ樹脂組成物
JPH03273021A (ja) * 1990-02-15 1991-12-04 Toray Chiokoole Kk エポキシ樹脂組成物
US6653371B1 (en) * 1998-01-16 2003-11-25 Barry E. Burns One-part curable composition of polyepoxide, polythiol, latent hardener and solid organic acid
DE69903256T2 (de) * 1998-01-16 2003-08-07 Loctite (R & D) Ltd., Tallaght Härtbare epoxyharzzusammensetzungen
DE69921991T2 (de) * 1999-02-08 2005-11-03 The Yokohama Rubber Co., Ltd. Harzzusammensetzungen
CN1217991C (zh) * 2000-06-21 2005-09-07 三井化学株式会社 塑性液晶显示元件用密封剂组合物
CN101553910B (zh) * 2006-12-04 2012-03-28 松下电器产业株式会社 密封材料以及使用该密封材料的安装方法
US20100006329A1 (en) * 2006-12-04 2010-01-14 Panasonic Corporation Sealing material and mounting method using the sealing material
EP2635619A1 (fr) * 2010-11-05 2013-09-11 Henkel Ireland Limited Compositions d'époxy-thiol à stabilité améliorée
JP5673237B2 (ja) * 2011-03-10 2015-02-18 住友ベークライト株式会社 封止用樹脂組成物及び電子部品装置
CN103184022B (zh) * 2011-12-30 2017-09-19 汉高股份有限及两合公司 用于硅片制备中的暂时性粘合用粘合剂组合物
CN102702686B (zh) * 2012-06-19 2015-04-15 广州聚合电子材料有限公司 一种可应用于生产兆瓦级风力叶片的环氧树脂体系及其制备方法
JP6493764B2 (ja) * 2013-07-05 2019-04-03 味の素株式会社 チオール基含有化合物および一液性エポキシ樹脂組成物
JP6254902B2 (ja) * 2014-05-21 2017-12-27 四国化成工業株式会社 トリアジン化合物、該化合物の合成方法およびエポキシ樹脂組成物
CN107709399B (zh) * 2015-06-25 2020-01-24 东丽株式会社 环氧树脂组合物、纤维增强复合材料、成型品及压力容器
CN107641193A (zh) * 2016-07-22 2018-01-30 北京化工大学 一步法制备低粘度高强高韧性环氧树脂
EP3638711A1 (fr) * 2017-06-12 2020-04-22 3M Innovative Properties Company Compositions de résine époxy/thiol, procédés et rubans

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3047179U (ja) * 1997-09-16 1998-03-31 ジェフリー アーネスト プレーン マスクカバー
JP3079204U (ja) * 2000-08-21 2001-08-10 倶子 冨山 フイルムサングラス。
JP2008301962A (ja) * 2007-06-06 2008-12-18 Hakugen:Kk マスク
JP2009273910A (ja) * 2009-08-11 2009-11-26 Nippon Suisan Kaisha Ltd 織布製マスク
JP3204220U (ja) * 2015-12-25 2016-05-26 明美 鹿村 マスクの取替えガーゼ
JP3226831U (ja) * 2020-04-01 2020-07-27 有限会社テクノフーズ マスクカバー

Also Published As

Publication number Publication date
CN112752783B (zh) 2022-08-02
WO2021033329A1 (fr) 2021-02-25
TW202116849A (zh) 2021-05-01
TWI826714B (zh) 2023-12-21
CN112752783A (zh) 2021-05-04

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