WO2021021872A1 - High-resolution solid-state lidar transmitter - Google Patents

High-resolution solid-state lidar transmitter Download PDF

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Publication number
WO2021021872A1
WO2021021872A1 PCT/US2020/043979 US2020043979W WO2021021872A1 WO 2021021872 A1 WO2021021872 A1 WO 2021021872A1 US 2020043979 W US2020043979 W US 2020043979W WO 2021021872 A1 WO2021021872 A1 WO 2021021872A1
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Prior art keywords
pixel
sub
aperture
microlens
solid
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PCT/US2020/043979
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English (en)
French (fr)
Inventor
Larry Fabiny
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Opsys Tech Ltd
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Opsys Tech Ltd
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Priority to EP20846794.4A priority Critical patent/EP4004587A4/en
Priority to KR1020227003018A priority patent/KR20220038691A/ko
Priority to JP2022505574A priority patent/JP2022547389A/ja
Priority to CN202080054714.4A priority patent/CN114174869B/zh
Publication of WO2021021872A1 publication Critical patent/WO2021021872A1/en
Anticipated expiration legal-status Critical
Priority to JP2022110222A priority patent/JP2022171651A/ja
Priority to JP2023122242A priority patent/JP2023129650A/ja
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/88—Lidar systems specially adapted for specific applications
    • G01S17/93—Lidar systems specially adapted for specific applications for anti-collision purposes
    • G01S17/931—Lidar systems specially adapted for specific applications for anti-collision purposes of land vehicles
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/88—Lidar systems specially adapted for specific applications
    • G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/4808—Evaluating distance, position or velocity data
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4814—Constructional features, e.g. arrangements of optical elements of transmitters alone
    • G01S7/4815—Constructional features, e.g. arrangements of optical elements of transmitters alone using multiple transmitters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4817—Constructional features, e.g. arrangements of optical elements relating to scanning
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0009—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only
    • G02B19/0014—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only at least one surface having optical power
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0052—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a laser diode
    • G02B19/0057—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a laser diode in the form of a laser diode array, e.g. laser diode bar
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
    • G02B3/0068—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between arranged in a single integral body or plate, e.g. laminates or hybrid structures with other optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0425—Electrodes, e.g. characterised by the structure
    • H01S5/04256—Electrodes, e.g. characterised by the structure characterised by the configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H01S5/423—Arrays of surface emitting lasers having a vertical cavity

Definitions

  • FIG. l is a schematic diagram illustrating the operation of an embodiment of a high-resolution LIDAR system of the present teaching implemented in a vehicle.
  • FIG. 2A illustrates a two-dimensional vertical cavity surface emitting laser
  • VCSEL VCSEL array
  • FIG. 2B illustrates an array of sub-apertures of the two-dimensional VCSEL array of FIG. 2 A.
  • FIG. 3 A illustrates a transmit optical system for projecting optical beams from a laser array that uses two conventional bulk lenses.
  • FIG. 3B illustrates an expanded view of a portion of the transmit optical system shown in FIG. 3 A.
  • FIG. 3C illustrates a far field pattern generated by the transmit optical system for projecting optical beams from the laser array of FIG. 3 A.
  • FIG. 4 A illustrates a transmit optical system for projecting optical beams from a laser array that uses one microlens array and one bulk lens.
  • FIG. 4B illustrates an expanded view of a portion of the transmit optical system shown in FIG. 4A.
  • FIG. 4C illustrates a far field pattern generated by the transmit optical system for projecting optical beams from the laser array of FIG. 4 A.
  • FIG. 5 A illustrates an embodiment of a transmit optical system for projecting optical beams from a laser array that uses two microlens arrays and a bulk lens of the present teaching.
  • FIG. 5B illustrates an expanded view of a portion of the transmit optical system shown in FIG. 5A.
  • FIG. 5C illustrates an embodiment of a far field pattern generated by the transmit optical system for projecting optical beams from the laser array shown in FIG. 5 A.
  • FIG. 6 illustrates a cross-sectional view of an embodiment of a dual-sided microlens array aligned to a VCSEL array of the present teaching.
  • FIG. 7A illustrates a perspective view showing one side of an embodiment of a dual-sided microlens array of the present teaching.
  • FIG. 7B illustrates a perspective view showing the other side of the embodiment of the dual-sided microlens array of FIG. 7A.
  • FIG. 8 illustrates an embodiment of a high-resolution LIDAR transmit system comprising multiple transmit optical systems of the present teaching.
  • FIG. 9A illustrates a far field pattern for a single LIDAR transmitter using a system for projecting optical beams from a laser array that uses two conventional bulk lenses.
  • FIG. 9B illustrates a far field pattern for multiple interleaved LIDAR transmitters using a system for projecting optical beams from a laser array that uses one microlens array and one conventional bulk lens.
  • FIG. 9C illustrates a far field pattern for multiple interleaved LIDAR transmitters using an embodiment of a transmit optical system that projects optical beams from a laser array that uses two microlens arrays and one conventional bulk lens of the present teaching.
  • the present teaching relates to Light Detection and Ranging (LIDAR), which is a remote sensing method that uses laser light to measure distances (ranges) to objects.
  • LIDAR systems measure distances to various objects or targets that reflect and/or scatter light.
  • LIDAR systems make use of LIDAR systems to generate a highly accurate three- dimensional (3D) map of the surrounding environment with fine resolution.
  • the systems and methods described herein are directed towards providing a solid-state, pulsed time-of-flight (TOF) LIDAR system with high levels of reliability, while also maintaining long measurement range and providing relatively low cost.
  • LIDAR systems according to the present teaching send out a short time duration laser pulse, and use direct detection of the return pulse in the form of a received return signal trace to measure TOF to the object.
  • LIDAR systems of the present teaching are capable of using multiple laser pulses to detect objects with various performance metrics.
  • multiple laser pulses can be used to improve SNR.
  • Multiple laser pulses can also be used to provide greater confidence in the detection of a particular object.
  • particular numbers of laser pulses can be selected to give particular levels of SNR and/or particular confidence values associated with detection of an object. This selection of a number of laser pulses can be combined with selection of an individual or group of laser devices that are associated with a particular pattern of illumination in the FOV.
  • One feature of the LIDAR systems of present teaching is that the emitters can emit light at different wavelengths. Thus, various emitters in the array can produce light with different wavelengths than other emitters.
  • emitters in a column or in a row may emit one wavelength, and emitters in an alternating column or row may emit a different wavelength.
  • a variety of wavelength patterns of emitted laser light with different wavelengths can be used, for example, to provide desired resolution, operate at long ranges within eye-safe limits of operation, and/or to increase the data rate of the system. See, for example, U.S. Patent Publication No. 20170307736 Al, entitled“Multi -Wavelength LIDAR System” and U.S. Patent Publication No. 20180259623 Al, entitled“Eye-Safe Scanning LIDAR System”, which are both assigned to the present assignee.
  • FIG. 1 is a schematic diagram illustrating the operation of a LIDAR system 100 of the present teaching implemented in a vehicle.
  • the LIDAR system 100 includes a transmit optical system, which is described in more detail herein, that projects light beams 102 generated by a laser array in the transmit optical system toward a target scene.
  • the LIDAR system also includes a receiver 103 that receives the light 104 that reflects from an object, shown as a person 106, in that target scene.
  • LIDAR systems typically also include a controller that computes the distance information about the object, person 106, from the reflected light.
  • the receiver comprises receive optics and a detector element that may be an array of detectors.
  • the receiver and controller are used to convert the received signal light into measurements that represent a pointwise 3D map of the surrounding environment that falls within the LIDAR system range and FOV.
  • the laser array comprises VCSEL laser emitters, which may include top-emitting VCSELs, bottom-emitting VCSELs, and/or various types of high-power VCSELs.
  • the VCSEL arrays may be monolithic.
  • the laser emitters may all share a common substrate, including semiconductor substrates or ceramic substrates.
  • a single controlled laser emitter can include multiple sub-apertures that each emit an optical beam when the laser emitter is energized.
  • the energizing of individual lasers and/or groups of lasers in embodiments that use one or more transmitter arrays can be individually controlled.
  • Each individual emitter in the transmitter array can be fired independently, with the optical beam emitted by each laser emitter corresponding to a three-dimensional projection angle subtending only a portion of the total system field-of-view.
  • One example of such a LIDAR system is described in U.S. Patent Publication No. 2017/0307736 Al, which is assigned to the present assignee.
  • the number of pulses fired by an individual laser, or group of lasers can be controlled based on a desired performance objective of the LIDAR system. The duration and timing of this sequence can also be controlled. See, for example, U.S. Provisional Patent Application No. 62/714,463, entitled“Distributed Modular Solid-State LIDAR System”, which is assigned to the present assignee and incorporated herein by reference. See also, U.S.
  • Another feature of the LIDAR system of the present teaching is that it can provide a compact, reliable transmit optical assembly for a high-resolution LIDAR system.
  • Transmit optical assemblies of the present teaching utilize solid-state laser arrays that, in some
  • the substrate can be a semiconductor substrate. Electrical drive circuits are also fabricated on these array substrates that allow each laser in the array to be controlled individually. These arrays can be two-dimensional arrays that use a regular row and column configuration.
  • the electrical control drive scheme can be configured in a so-called matrix configuration, where an individual laser is addressed by appropriate application of an electrical control signal to a particular column and a particular row that contains that individual laser. See, for example, U.S. Patent Application No. 16/841,930, entitled“Solid-State LIDAR Transmitter with Laser Control”, which is assigned to the present assignee and is incorporated herein by reference.
  • FIG. 2A illustrates a two-dimensional vertical cavity surface emitting laser
  • the laser array 200 includes a 16X16 array of individual laser pixels 202, where each pixel 202 incorporates a 3X3 array of sub-apertures 204.
  • each pixel 202 is addressable individually by applying the correct electrical control signal to a row and column corresponding to that pixel 202 in the array.
  • individual pixels 202 are energized independently, and all sub-apertures 204 within one pixel 202 are energized together with the energization of the pixel 202.
  • nine optical beams are provided for each pixel that is energized.
  • the array 200 has a pixel pitch 206 in the x-direction and a pixel pitch 208 in the y-direction.
  • the x-directed pixel pitch 206 is equal to the y-directed pixel pitch 208.
  • the x-directed pixel pitch is 250 mih and the y-directed pixel pitch is 250 mih.
  • the number of elements in the array 200 varies in various embodiments.
  • the array pixel pitch may take on various values in various embodiments. It should be understood that while many examples provided herein describe arrays of particular sizes, the present teaching is not limited to any particular array size. One feature of the present teaching is that the solid state, microfabricated components can scale to large sizes simply, cost effectively and have high reliability.
  • FIG. 2B illustrates an array 250 of sub-apertures of the two-dimensional VCSEL array 200 of FIG. 2A.
  • a single pixel 202 is shown.
  • Each pixel 202 has nine sub-apertures 204 configured in a 3X3 array.
  • Each pixel 202 has an x-directed sub-aperture pitch 252 and a y- directed sub-aperture pitch 254.
  • the sub-apertures 204 associated with an individual pixel 202 are all energized at the same time in response to an appropriate electrical control signal. As such, all sub-apertures 204 within an individual pixel 202 illuminate at the same time.
  • multiple optical beams are generated, one from each aperture in the pixel, upon application of the electrical control signal to a pixel 202.
  • the x-directed sub-aperture pitch 252 is equal to the y-directed sub-aperture pitch 254.
  • the x-directed sub-aperture pitch is 76 mih and the y-directed sub-aperture pitch is 76 mih.
  • the number of apertures in the sub-array of an individual pixel varies in various embodiments.
  • the array sub-aperture pitch may take on various values in various embodiments.
  • FIG. 3A illustrates a transmit optical system 300 for projecting optical beams from a laser array 302 that uses two conventional bulk lenses 304, 306.
  • the laser array 302 may be the same or similar to the laser array 200 described in connection with FIGS. 2A-B, for example.
  • FIG. 3B is an expanded view of a portion of the transmit optical system 300 shown in FIG. 3A.
  • the laser array 302 is shown in one dimension and includes individual pixels 308, 310. Only two pixels are shown, pixel 1 308 and pixel 2 310.
  • the pixels 308, 310 each have sub-aperture arrays. Also, show in one dimension are sub-apertures A 312, B 314 and C 316 of pixel 1 308 and sub-apertures A 318, B 320 and C 322 of pixel 2 310.
  • Optical beams 326 from each sub-aperture 312, 314, 316, 318, 320, 322 are emitted and diverge as shown in the expanded view 324. The divergence angle for each beam is related to the size of the respective sub-aperture.
  • the individual diverging optical beams 326 pass through a bulk lens 304 with a focal length, FI, which is positioned at a distance from the array 302 and a second bulk lens 306 with a focal length, F2, which is positioned at a distance from the first bulk lens 304.
  • the positions of the lenses 304, 306 and their focal lengths FI, F2 determine a projected far field pattern of the transmit optical system 300.
  • the two bulk lenses 304, 306 are configured to nominally generate an image of the laser array 302 in the far field.
  • the laser array pattern is recreated in the far field, magnified to a desired size based on the lens configuration, and the sub-apertures from individual pixels are separated in space.
  • the angular field-of-view (FOV) of each pixel is approximately the same as the angle spacing between pixels.
  • FIG. 3C illustrates a far field pattern 350 generated by the transmit optical system
  • the far field spots are shown for two vertically adjacent pixels, where each pixel comprises a 3X3 array of sub-apertures at 50- meter range.
  • This example far field pattern 350 is produced at a 50-meter distance from the optical system 300.
  • the pattern 350 includes nine individual spots 352 for each pixel region 354, 356.
  • the individual pixel regions 354, 356 are spaced a distance of 0.9 meters at the 50- meter range.
  • the pixel-spot-size-to-pixel-pitch ratio is -0.9.
  • FIGS. 3A-C illustrate only a portion of, for example, a 16X16 array of lasers that each have nine sub-apertures. For a full 16X16 array, the pattern will appear as (16X3) X (16X3) spots, or 48X48 spots.
  • FIG. 4 A illustrates a transmit optical system 400 for projecting optical beams from a laser array 402 that uses one microlens array 404 and one bulk lens 406.
  • FIG. 4B is an expanded view of a portion of the transmit optical system 400 shown in FIG. 4A.
  • the microlens array 404 has a pitch equal to the pitch of the pixels, pixel 1 408 and pixel 2 410, in the array 402.
  • the microlens array 404 collimates each sub-aperture, sub-apertures A 412, B 414, and C 416, of pixel 1 408, and sub-apertures A 418, B 420, and C 422 of pixel 2 410.
  • the microlens array 404 comprises multiple lenslets 424, 426 that are spaced at a pitch that is the same as the pixel pitch of the laser array 402.
  • Each lenslet 424, 426 collimates a beam emitted from a respective pixel 408, 410.
  • the bulk lens 406 has a focal length, F2, and is positioned a distance of F2 from the plane Z1 428.
  • the bulk lens 406 projects the optical beams from each pixel along nominally parallel paths to the far field.
  • FIG. 4C illustrates a far field pattern 450 generated by the transmit optical system
  • the far field spots are shown for two vertically adjacent pixels, where each pixel comprises a 3X3 array of sub apertures at 50-meter range.
  • the far field pattern 450 results in two large spots 452, 454 that are separated by a 0.9-meter distance 456 at a range of 50 meters.
  • large spot 454 the optical beams from all nine sub-apertures from a single pixel 408 overlap.
  • the pixel-spot-size-to-pixel- pitch ratio is ⁇ 0.5.
  • FIG. 4 A only illustrates three sub-apertures 412, 414, 416 for pixel 1 408 because it is a side view, but the far-field pattern 450 is illustrated in two dimensions and so shows a spot provided by all nine sub-apertures of pixel 1 408. Likewise, for pixel 2 410 and associated spot 452. The pixel-spot-size-to-pixel-pitch ratio for this transmit optical system is -0.5.
  • a LIDAR system that uses the transmit optical system 400 illustrated in FIGS.
  • FIG. 5 A illustrates an embodiment of a transmit optical system 500 for projecting optical beams from a laser array 502 that uses two microlens arrays 504, 506 and a bulk lens 508 of the present teaching.
  • FIG. 5B is an expanded view of a portion of the transmit optical system 500 shown in FIG. 5A.
  • one microlens array 504 has lenslets 510, 512, 514 spaced at a pitch equal to the pitch of the pixels, pixel 1 516 and pixel 2 518, and pixel 3 520 in the laser array 502.
  • Another microlens array 506 has lenslets 522, 524, 526, 528, 530, 532, 534, 536, 538 spaced at a pitch equal to the pitch of sub-apertures 540, 542, 544, 546, 548, 550, 552, 554, 556 of the laser array 502.
  • microlens 506 comprises one lenslet per sub aperture
  • microlens 504 comprises one lenslet per pixel.
  • Microlens array 506 acts on each of the optical beams generated in each sub-aperture 540, 542, 544, 546, 548, 550, 552, 554, 556 such that each sub-aperture beam is focused without changing the propagation axis of those optical beams.
  • Microlens 504 redirects the optical beams from each sub-aperture 540, 542, 544, 546, 548, 550, 552, 554, 556 so that they overlap at the back focal plane Z1 558 of the lenslets 510, 512, 514.
  • the optical beams from each sub-aperture 540, 542, 544, 546, 548, 550 are examples of the optical beams from each sub-aperture 540, 542, 544, 546, 548, 550,
  • the bulk lens 508 is positioned a distance equal to a focal length of the lens 508, F2, from the plane Z1 558.
  • the combination of the microlens arrays 504, 506 creates an intermediate real image of an array of spots with the same pitch as the laser array 502 at a plane Z1 558.
  • the bulk lens 508 projects each of the spots from Z1 558 to a different angle in the far field.
  • the particular projected angle from the bulk lens 508 is a function of the perpendicular distance of the corresponding array spot from the principal optical axis of the system.
  • One feature of the present teaching is the use of two back-to-back micro lens arrays 504, 506 that serve to focus optical beams from each sub-aperture and direct those beams to overlap at a back focal plane of the second lens 504.
  • these two microlens array 504, 506 designs are very compact, and nominally focused overlapped beams occur at a distance of less than 2 mm from the laser array 502.
  • the microlens arrays 504, 506 are fabricated on a front and back surface of the same substrate. This advantageously provides a very compact system that is easy to assemble.
  • the microlens arrays 504, 506 are fabricated on separate substrates.
  • one or both of the microlens arrays 504, 506 may be refractive optical elements. In some embodiments, one or both of the microlens arrays 504, 506 may be diffractive optical elements. In some embodiments, one or both of the microlens arrays 504, 506 may be holographic optical elements.
  • FIG. 5C illustrates an embodiment of a far field pattern 580 generated by the transmit optical system 500 for projecting optical beams from a laser array 502 of FIG. 5 A.
  • the far field spots are shown for two vertically adjacent pixels, where each pixel comprises a 3X3 array of sub-apertures at 50-meter range.
  • the system diagram of FIG. 5 A shows a side view of the 2-dimensional arrays, but FIG. 5C illustrates a two-dimensional pattern in a plane perpendicular to the principle axis. Only portions of the system are illustrated for clarity.
  • the far field pattern 580 results in two small spots 582, 584 that are separated by a 0.9-meter distance 586 at a range of 50 meters.
  • Spots 582, 584 are only shown for two pixels 516, 518. There is 1.06 degrees between pixels, resulting in 0.9-meter separation distance 586 at the 50-meter range.
  • the pixel-spot-size-to-pixel-pitch ratio is ⁇ 0.1.
  • the ultimate resolution is determined by the spot size from one pixel relative to the spot separation between spots from adjacent pixels.
  • the transmit optical system of the present teaching advantageously provides a much smaller pixel spot size-to-pixel-pitch ratio in the far field. This improves system resolution and also allows for effective and scalable interleaving of multiple transmit optical systems that provides many benefits for data collection, including the support of high data collection rates and flexibility in illumination patterns and timing sequences.
  • FIG. 6 illustrates a cross-sectional view 600 of an embodiment of a dual-sided microlens array 602 aligned to a VCSEL array 604 of the present teaching.
  • the VCSEL includes five pixels 606, 608, 610, 612, 614. Each pixel 606, 608, 610, 612, 614 comprises nine sub-apertures. For example, three sub-apertures 616, 618, 620 are visible in the cross-sectional view 600 for pixel.
  • the pixels are arranged in an array with pitch 622.
  • Five-pixel lenslets 624, 626, 628, 630, 632 are formed on a first surface 634 of a substrate 636.
  • the pixel lenslets 624, 626, 628, 630, 632 are arranged in an array with pitch 638 and match the array of pixels 606,
  • microlens array 602 configuration can be referred to as a dual-sided microlens.
  • the pixel pitch is 250 mih and the sub aperture pitch is 76 mih.
  • the laser and microlens arrays 602, 604 are one dimensional. Also, in some embodiments, the microlens arrays 602, 604 are two-dimensional.
  • the microlens arrays 602, 604 contain different numbers of pixels, sub apertures, pixel lenslets and/or sub-aperture lenslets.
  • the pixel pitch 622 is not an integer multiple of the sub-aperture pitch 642.
  • the sub-aperture pitch 642 does not extend across the boundaries of a pixel.
  • the sub-aperture lenslet 640 side of the microlens array is the sub-aperture lenslet 640 side of the microlens array
  • the 602 is positioned closest to the VCSEL array 604.
  • the pixel lenslet surface 634 is positioned furthest from the VCSEL array 602, with each lenslet 624, 626, 628, 630, 632 centered directly above a pixel. This positioning is specifically illustrated in FIG. 6, for example, for pixel lenslet 628 over pixel 610.
  • the sub-aperture lenslets are centered directly above a sub-aperture. This is illustrated in FIG. 6, for example, for sub-aperture lenslet 640 above sub-aperture 644.
  • FIG. 7A illustrates a perspective view 700 showing one side of an embodiment of a dual-sided microlens array 702 of the present teaching.
  • Pixel lenslets 704 are formed on one surface 706 of the substrate 708.
  • the lenslets 704 have a pitch that matches the pitch of, for example, a VCSEL array such that there is one lens per pixel in an embodiment of a transmit optical system of the present teaching.
  • a 5X5 array of lenslets 704 is illustrated in the perspective view 700.
  • the sub-aperture lenslets 712 are visible on the other surface 710 of the substrate 708.
  • FIG. 7B illustrates a perspective view 750 showing the other side of the dual sided microlens array of FIG. 7 A.
  • a circle 752 highlights a 9X9 array of sub-aperture lenslets 754 that are formed on the other surface 710 of the substrate.
  • the sub-aperture lenslet 754 pitch is matched to the pitch of a matching array of lasers, for example, the sub-apertures of a VCSEL array. There are nine sub-aperture lenslets per pixel.
  • FIG. 8 illustrates an embodiment of a high-resolution LIDAR transmit system 800 comprising multiple transmit optical systems 802, 804 of the present teaching.
  • One feature of the present teaching is that the two microlens array configuration described herein makes it possible to use separate transmit optical systems that are aligned so that the total FOV generated by one transmit optical system 802 is offset by less than one pixel FOV from the total FOV generated by a second transmit optical system 804.
  • This type of configuration can be referred to as an interleaved configuration.
  • the spatial resolution of the LIDAR system comprising the interleaved transmit system 800 is greatly improved compared with LIDAR systems that use only one transmit optical system.
  • the interleaving will have uniform spacing between spots generated by each of two different transmit optical systems (sometimes called perfect interleaving) at one target distance only.
  • the separation between the transmit optical systems 802, 804 can be small, in some embodiments separations are on the order of 10’s of millimeters, and the target distances in some embodiments are on the order of 10’s of meters, even imperfect interleaving is acceptable and improves resolution.
  • FIG. 8 shows the array of interleaved spots 806 at one target distance, illustrating the interleaving of a first array of spots 808 from transmit optical system 802 and a second array of spots 810 from transmit optical system 804.
  • FIG. 9A illustrates a far field pattern 900 for a single solid-state LIDAR transmitter using a system for projecting optical beams from a laser array that uses two conventional bulk lenses, as illustrated in FIG. 3 A.
  • the pixel spot size 902 and pixel pitch 904 are nominally the same.
  • the pixel spot size 902 is a full pixel. All the sub-aperture spots are illuminated by a control signal applied to energize that pixel and associated sub-apertures. As such, it is not possible to interleave pixel spots 906 from two different transmit optical systems that use only two bulk lenses and no microlenses.
  • the pixel-spot-size-to-pixel-pitch in the far field is close to one for this system. As a result, there is no room to interleave the spots and provide an improved resolution by using two optical transmit systems.
  • FIG. 9B illustrates a far field pattern 930 for multiple interleaved solid-state LIDAR transmitters using a system for projecting optical beams from a laser array that uses one microlens array and one conventional bulk lens, as illustrated, for example, in FIG. 4A.
  • a spot size from a single energized pixel is shown as a shaded spot 932, which is smaller than the pixel FOV pitch 934.
  • the ratio of pixel-spot-size-to-pixel-pitch in the far field is close to 0.5 for this system.
  • it is possible to interleave e.g. four transmit optical systems.
  • the interleaving of spots from four different transmit optical systems increases the spatial resolution by a factor of two in each dimension.
  • FIG. 9C illustrates a far field pattern 950 for multiple interleaved solid state LIDAR transmitters using an embodiment of a transmit optical system that projects optical beams from a laser array that uses two microlens arrays and one conventional bulk lens of the present teaching.
  • This embodiment of the transmit optical system could be, for example, the embodiment shown in FIG. 5A.
  • a pixel spot size 952 of a single pixel spot 954 is very small as compared to the pixel FOV pitch 956.
  • the ratio of pixel-spot-size-to-pixel -pitch in the far field is less than 0.1. It is possible to interleave spots 954 from at least nine transmit optical systems to increase spatial resolution. Different shades are used to illustrate pixel spots from different transmit optical systems.
  • FIGS. 9A-C illustrate far field patterns 900, 930, 950 generated by a VCSEL array with a 3X3 grid of pixels where each pixel includes a 3X3 grid of sub-apertures. Scaling to different array sizes and/or shapes for both pixels and/or sub-aperture sizes and/or shapes is a straightforward extension.
  • one feature of the transmit optical systems that utilize the combination of sub-aperture microlenses to focus optical beams from VCSEL pixel sub-aperture emitters, pixel microlenses to redirect the sub-aperture optical beams to their focus at an overlap point, and a bulk lens to project the sub-aperture beams in each pixel to a different angle in a far field is that it improves spatial resolution sufficiently to allow interleaving of transmit optical systems. This improvement is in part because a smaller far field pixel-spot-size-to-pixel-pitch ratio is achieved.
  • the different projected angles in the far field are based on the position of a particular pixel optical beam with respect to the central, or principle axis of the bulk lens. Thus, by using bulk lenses with different focal lengths and positions, a variety of far-field projection angles can be achieved.

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US12222445B2 (en) 2025-02-11
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