WO2020211401A1 - 一种改善led显示屏色差的工艺方法 - Google Patents

一种改善led显示屏色差的工艺方法 Download PDF

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WO2020211401A1
WO2020211401A1 PCT/CN2019/123789 CN2019123789W WO2020211401A1 WO 2020211401 A1 WO2020211401 A1 WO 2020211401A1 CN 2019123789 W CN2019123789 W CN 2019123789W WO 2020211401 A1 WO2020211401 A1 WO 2020211401A1
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Prior art keywords
led
ink
screen
display screen
led display
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PCT/CN2019/123789
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English (en)
French (fr)
Inventor
黄国科
向华
杨俊�
余小丰
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珠海中京电子电路有限公司
惠州中京电子科技有限公司
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Priority to JP2021561050A priority Critical patent/JP2022529267A/ja
Priority to DE112019007223.4T priority patent/DE112019007223T5/de
Priority to US17/602,798 priority patent/US12027504B2/en
Publication of WO2020211401A1 publication Critical patent/WO2020211401A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/052—Magnetographic patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0766—Rinsing, e.g. after cleaning or polishing a conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board

Definitions

  • the present invention relates to the field of LED display screen manufacturing technology, in particular to a process method for improving the color difference of the LED display screen.
  • LED displays Due to the different light-emitting principles of LCD displays and LED displays, LED displays have low power consumption and low power consumption compared with LCD displays. The advantages of long life and high brightness. Therefore, the research on LED display screens in the market has been widely supported, and the application of LED display screens has become more and more popular.
  • the main method is to first produce multiple LED printed circuit boards, then splicing multiple LED printed circuit boards, and finally use the spliced LED printed circuit boards as LED display screens.
  • ink will be printed on the circuit board; at the same time, to enhance the utilization efficiency of the LED light source, it will be printed on the LED printed circuit board Printing photosensitive ink.
  • the embodiment of the present invention provides a process method for improving the color difference of the LED display screen, so as to solve the problem that the color difference between each LED printed circuit board in the LED display screen in the prior art affects the image display effect of the LED display screen.
  • a process method for improving the color difference of LED display screens including:
  • the multiple LED printed circuit boards are spliced to obtain an LED display screen.
  • the circuit surfaces of a plurality of LED substrates are drilled and polished first, and then the circuit surfaces of the plurality of LED substrates are screen-printed, and every preset printing cycle is performed during the screen printing.
  • the screen plate is subjected to oil-receiving treatment so that the ink viscosity on the screen plate is within the preset viscosity range, and then the screen-printed multiple LED substrates are exposed and shaped to obtain multiple LED printed circuit boards.
  • a plurality of LED printed circuit boards are spliced to obtain an LED display screen.
  • the process of oil absorbing treatment is added to the screen printing process to control the viscosity of the ink on the screen board to maintain a small range. Within this range, each LED printed circuit board The color difference between them is small, and the use of multiple LED substrates to form an LED display screen can significantly slow down the "mosaic" visual effect, which can effectively improve the image display effect of the LED display screen.
  • Figure 1 is a flow chart of the process method for improving the color difference of the LED display screen in this embodiment
  • FIG. 2 is a flowchart of the drilling and polishing process in this embodiment
  • Figure 3 is a flow chart of polishing, cleaning, and drying in this embodiment
  • Figure 5 is an experimental effect diagram of an experimental group in this embodiment
  • Figure 6 is an experimental effect diagram of an experimental group in this embodiment
  • Figure 7 is an experimental effect diagram of an experimental group in this embodiment.
  • Fig. 8 is a flowchart of the exposure setting process in this embodiment.
  • a process method for improving the color difference of an LED display screen is provided, and the method specifically includes the following steps:
  • Step 100 Drill and polish the circuit surfaces of multiple LED substrates.
  • Step 200 Perform screen printing on the circuit surfaces of a plurality of LED substrates, and perform an oil-removing process on the screen plate during the screen printing every preset printing cycle, so that the ink viscosity on the screen plate is at Within the preset viscosity range.
  • Step 300 Perform exposure and shaping processing on multiple LED substrates that have been screen-printed to obtain multiple LED printed circuit boards.
  • Step 400 splicing multiple LED printed circuit boards to obtain an LED display screen.
  • the circuit surfaces of multiple LED substrates are drilled and polished respectively.
  • the circuit surface of the LED substrate may be the circuit surface of a single-sided LED substrate, or the circuit surface of a double-sided LED substrate.
  • the LED substrate may be a glass fiber board and/or an aluminum substrate. That is, the LED substrate may be a fiberglass board, an aluminum substrate, or a combination of a fiberglass board and an aluminum substrate.
  • the glass fiber board may be an alkali-free glass fiber board, a medium-alkali glass fiber board, a high-alkali glass fiber board, etc.
  • the aluminum substrate may be a tin-sprayed aluminum substrate, an alumina substrate, a silver-plated aluminum substrate, a gold-immersed aluminum substrate, etc.
  • the drilling and grinding process specifically further includes the following content:
  • Step 101 Drill positioning holes on multiple LED substrates.
  • Step 102 Polish a plurality of LED substrates, and sequentially clean and dry the polished LED substrates.
  • positioning holes are drilled on a plurality of LED substrates respectively, so as to generate corresponding positioning holes in each LED substrate.
  • the positioning holes may specifically be blind holes, buried holes, through holes, and the like. Drilling positioning holes on the LED substrate can be achieved in the following three ways:
  • Method 1 Fix the LED substrate on the positioning device used to fix the card position. For different types of LED substrates, the drilling machine drills the LED substrate through preset parameters.
  • Method 2 Fixing the LED substrate on the positioning device used for setting the card position.
  • the LED substrate has positioning hole marks, and the drilling machine is aligned with the positioning drilling mark to drill the LED substrate.
  • Method 3 Fix the LED substrate on the positioning device for setting the card position, and there are positioning hole marks on the LED substrate.
  • the drilling machine aligns and locates according to the preset parameters The hole mark drills the LED substrate.
  • the LED substrate is fixed on the positioning device for setting the card position, preferably with the circuit side of the LED substrate facing upward.
  • the circuit surface of the LED substrate can also be referred to as the copper surface of the LED substrate.
  • positioning holes can be drilled in the LED substrate to fix or position the LED substrate during subsequent processing of the LED substrate.
  • step 102 it specifically includes the following content:
  • Step 1021 Polish the LED substrate.
  • Step 1022 cleaning the LED substrate.
  • Step 1023 drying the LED substrate.
  • the polishing method may be automatic polishing equipment and/or manual polishing, and the polishing object may specifically include at least one or more of the circuit surface of the LED substrate, the outer wall of the LED substrate, and the hole wall of the LED.
  • the automatic grinding equipment may be a grinding machine, a grinding box, a plate grinding machine, etc.
  • the manual grinding may be manual grinding with fine sandpaper.
  • the LED substrate can be cleaned by tools such as an ultrasonic cleaning machine, an organic solvent, a hair dryer and the like.
  • the LED substrate is placed in a dryer for drying.
  • the LED substrate is polished to smooth the surface of the LED substrate, improve the printing quality of the LED substrate in the subsequent printing process, and reduce the damage to the screen plate.
  • steps 101 and 102 may not adopt the prescribed order, that is, for step 101 and step 102, step 102 may be first, and step 101 may follow.
  • step 200 performing screen printing on the circuit surfaces of multiple LED substrates specifically further includes the following steps:
  • Step 201 The circuit surfaces of the multiple LED substrates are attached to the screen plate and placed directly under the hollow pattern of the screen plate, and the ink is placed on the screen plate.
  • Step 202 Control the squeegee to scrape the ink back and forth on the screen plate to form the same ink pattern as the hollow pattern on the circuit surfaces of the multiple LED substrates.
  • step 201 it is implemented in two parts:
  • the first part the circuit side of the LED substrate is placed on the feeding platform of the feeder, and the feeding platform is pushed to the screen printer through the feeder, so that the LED substrate is located directly under the hollow pattern of the screen plate, and the LED substrate
  • the circuit surface is attached to the wire mesh board.
  • the second part Put the ink on the screen plate.
  • step 202 since the circuit surface of the LED substrate is attached to the screen plate and is located directly below the hollow pattern of the screen plate, at the same time, the scraper scrapes back and forth on the screen plate, which will affect the ink on the screen plate. Pressure is formed to force the ink into the hollow pattern of the screen plate to form the same ink pattern as the hollow pattern on the circuit surface of the LED substrate.
  • step 201 is re-executed, and it is cycled in turn to realize the formation of the ink pattern on the circuit surface of multiple LED substrates.
  • the ink pattern with the same hollow pattern is realized in step 202 that an ink pattern that is the same as the hollow pattern is formed on the circuit surface of an LED substrate.
  • the thinner can be nitrocellulose paint thinner, perchlorovinyl paint thinner, phenolic paint thinner, acrylic paint thinner, alkyd paint thinner, epoxy paint thinner, phenolic paint thinner, silicone paint thinner ⁇ etc.
  • the circuit boards of the same batch of LED substrates can be screen printed within two hours using the same batch of ink, which can meet the production needs.
  • screen printing is performed with the ink in the same batch of the ink tank for the circuit boards of the same batch of LED substrates, which can effectively protect the ink
  • the viscosity reduces the color difference between the circuit surfaces of each LED substrate.
  • the specification of the ink tank is 5 kg/tank. It should be noted that the larger the size of the ink tank is, the more ink is loaded, and the ink in the ink tank can meet the requirements of screen printing on the circuit surface of more LED substrates. If the ink in the same ink tank can be applied to the circuit surface of more LED substrates for screen printing, the color difference between the circuit boards of each LED substrate will be smaller.
  • the oil-removing process is performed on the screen plate during the screen printing at every preset printing cycle, so that the viscosity of the ink on the screen-screen board is within the preset viscosity range.
  • the specific oil-removing process is: The ink on the edge of the screen plate is scraped toward the center of the screen plate.
  • a preset number of LED substrates are printed as a preset printing cycle, and the value range of the preset number is [20,40].
  • the preset viscosity range of the ink is [80dPa ⁇ S, 140dPa ⁇ S]. It should be noted that the preset viscosity range of the ink is [80dPa ⁇ S, 140dPa ⁇ S] to meet production requirements. At the same time, within the preset viscosity range of the ink, the smaller the viscosity difference between the ink on the circuit surface of each LED substrate, the smaller the color difference between the circuit surfaces of each LED substrate.
  • the ink flowing from the edge of the screen plate to the center will cause a big change in the ink viscosity at the center of the original screen plate, which will affect the color difference between the circuit surfaces of multiple LED substrates. Therefore, by scraping the ink at the edge of the screen plate, the ink at the edge of the screen plate can be better integrated with the ink at the center of the screen plate, so that the viscosity of the ink at the edge of the screen plate is closer to the screen plate.
  • the viscosity difference between the viscosity of the ink at the center position is maintained within a small range, which reduces the amount of ink exposed to the air for a long time, thereby reducing the color difference between the circuit surfaces of the multiple LED substrates.
  • Experimental group two every preset printing cycle, the screen plate is oil-removed during the screen printing, and every 40 LED substrates are printed as a cycle.
  • Experimental group three the screen plate was oil-removed during the screen printing at every preset printing cycle, and every 20 LED substrates were printed as a cycle.
  • step 200 the color difference between each LED printed circuit board in the LED display screen can be effectively reduced.
  • step 300 the obtained multiple LED printed circuit boards are finished products.
  • the exposure setting processing specifically further includes the following content:
  • Step 301 drying the ink on multiple LED substrates
  • Step 302 Expose, develop and cure the substrate covered with ink.
  • step 301 specifically, the LED substrate is placed in a dryer for drying.
  • an exposure machine is used to expose the corresponding position of the workpiece, and then the exposed workpiece is developed, and then the LED substrate is cured.
  • the exposure machine may be an LED hybrid wave exposure machine.
  • the exposure scale is 7 to 11 grids.
  • the LED substrate can be cured by ultraviolet curing or thermal curing.
  • step 300 multiple screen-printed LED substrates can be formed into multiple LED printed circuit boards.
  • the splicing can be specifically carried out through a printed circuit board connector to obtain an LED display that meets a predetermined specification.
  • the predetermined specifications may be LED display size specifications, pixel requirements, gray scale requirements, and so on.
  • step 400 an LED display screen meeting the predetermined specifications can be obtained.
  • the color difference between the LED printed circuit boards in the LED display screen can be effectively reduced, the "mosaic" visual effect can be significantly reduced, and the problem of the image display effect of the LED display screen can be effectively improved.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Screen Printers (AREA)
  • Printing Methods (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

本发明涉及LED显示屏制造工艺领域，提供了一种改善LED显示屏色差的工艺方法，其包括：对多个LED基板的线路面进行钻孔打磨处理，对多个LED基板的线路面进行丝网印刷，并每隔一个预设印刷周期在丝网印刷期间对丝网板进行收油处理，以使丝网板上的油墨粘度处于预设粘度范围内，对经过丝网印刷的多个LED基板进行曝光定型处理，以获得多个LED印制电路板，最后对多个LED印制电路板进行拼接，以获得LED显示屏。在本发明中，能够在丝网印刷期间对丝网板进行收油处理，从而有效减小LED显示屏中各个LED印制电路板之间的色差，明显减缓"马赛克"视觉效应，有效改善LED显示屏的图像显示效果的问题。

Description

一种改善LED显示屏色差的工艺方法 技术领域
本发明涉及LED显示屏制造工艺领域，尤其涉及一种改善LED显示屏色差的工艺方法。
背景技术
目前，市场上存在的显示屏主要有LCD显示屏和LED显示屏这两种，由于LCD显示屏与LED显示屏的发光原理不同，导致LED显示屏相对于LCD显示屏而言具有功耗低、寿命长、亮度高等优点。因此，市场上对LED显示屏的研究得到了广泛的支持，LED显示屏的应用也愈发普及。
在生产LED显示屏工艺中，主要方式是先生产多个LED印制电路板，然后将多个LED印制电路板进行拼接，最后将拼接形成的LED印制电路板作为LED显示屏。然而，为抵抗电路板在环境中发生蚀刻和增强电路板中的各元器件的绝缘性，会在电路板上印刷油墨；同时，为增强LED光源的利用效率，会在LED印制电路板上印刷感光油墨。
而在现有的LED印制电路板生产工艺中，由于印刷在各个LED印制电路板上的感光油墨的厚度和粘稠度不一，容易导致各个LED印制电路板之间产生色差，当多个LED印制电路板拼接形成LED显示屏时，会导致“马赛克”视觉效应，从而出现影响LED显示屏的图像显示效果的问题。
发明内容
本发明实施例提供一种改善LED显示屏色差的工艺方法，以解决现有技术中LED显示屏中各个LED印刷电路板之间产生色差，影响LED显示屏的图像显示效果的问题。
一种改善LED显示屏色差的工艺方法，包括：
对多个LED基板的线路面进行钻孔打磨处理；
对所述多个LED基板的线路面进行丝网印刷，并每隔一个预设印刷周期在丝网印刷期间对丝网板进行收油处理，以使所述丝网板上的油墨粘度处于预设粘度范围内；
对经过丝网印刷的所述多个LED基板进行曝光定型处理，以获得多个LED印制电路板；
对所述多个LED印制电路板进行拼接，以获得LED显示屏。
在本发明实施例中，先对多个LED基板的线路面进行钻孔打磨处理，再对多个LED基板的线路面进行丝网印刷，并每隔一个预设印刷周期在丝网印刷期间对丝网板进行收油处理，以使丝网板上的油墨粘度处于预设粘度范围内，然后对经过丝网印刷的多个LED基板进行曝光定型处理，以获得多个LED印制电路板，最后对多个LED印制电路板进行拼接，以获得LED显示屏。通过本实施例的实施，在丝网印刷过程中加入收油处理这一工艺过程，控制丝网板上的油墨粘度维持在一个较小的范围内，在该范围内，各个LED印制电路板之间的色差较小，利用多个LED基板拼接形成LED显示屏，明显减缓“马赛克”视觉效应，能够有效改善LED显示屏的图像显示效果的问题。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对本发明实施例的描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1是本实施例中改善LED显示屏色差的工艺方法的流程图；
图2是本实施例中钻孔打磨处理的流程图；
图3是本实施例中打磨、清洗、烘干的流程图；
图4是本实施例中对LED基板的线路面进行丝网印刷的流程图；
图5是本实施例中一实验组的实验效果图；
图6是本实施例中一实验组的实验效果图；
图7是本实施例中一实验组的实验效果图；
图8是本实施例中曝光定型处理的流程图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
为了说明本发明所提供的技术方案，下面通过具体实施例来说明。
在本实施例中，如图1所示，提供一种改善LED显示屏色差的工艺方法，该方法具体包括如下步骤：
步骤100：对多个LED基板的线路面进行钻孔打磨处理。
步骤200：对多个LED基板的线路面进行丝网印刷，并每隔一个预设印刷周期在丝网印刷期间对丝网板进行收油处理，以使所述丝网板上的油墨粘度处于预设粘度范围内。
步骤300：对经过丝网印刷的多个LED基板进行曝光定型处理，以获得多个LED印制电路板。
步骤400：对多个LED印制电路板进行拼接，以获得LED显示屏。
对于上述步骤100，具体是对多个LED基板的线路面分别进行钻孔打磨处理。其中，LED基板的线路面可以是单面LED基板的线路面，也可以是双面LED基板的线路面。另外，LED基板可以是玻纤板和/或铝基板。也即，LED基板可以是玻纤板，也可以是铝基板，还可以是玻纤板与铝基板的结合体。进一步地，玻纤板可以是无碱玻璃纤维板、中碱玻璃纤维板和高碱玻璃纤维板等，铝基板可以是喷锡铝基板，抗氧化铝基板，镀银铝基板，沉金铝基板等。
如图2所示，在上述步骤100中，钻孔打磨处理具体还包括以下内容：
步骤101：在多个LED基板上钻出定位孔。
步骤102：打磨多个LED基板，并对经过打磨的多个LED基板依次进行清洗和烘干。
对于上述步骤101，具体是在多个LED基板上分别钻出定位孔，以在每个LED基板生成对应的定位孔。其中，定位孔具体可以是盲孔、埋孔、通孔等。在LED基板上钻出定位孔可以通过以下三种方式实现：
方式一：将LED基板固定在用于定型卡位的定位装置上，针对不同型号的LED基板，钻孔机通过预先设定的参数对LED基板进行钻孔。
方式二：将LED基板固定在用于定型卡位的定位装置上，在LED基板上具有定位孔标记，钻孔机对准定位钻孔标记对LED基板进行钻孔。
方式三：将LED基板固定在用于定型卡位的定位装置上，在LED基板上具有定位孔标记，针对该LED基板的型号和定位孔标记，钻孔机通过预先设定的参数对准定位孔标记对LED基板进行钻孔。
在上述方式一、方式二和方式三中，将LED基板的固定在用于定型卡位的定位装置上，优选的是将LED基板的线路面朝上。另外，LED基板的线路面也可以称之为LED基板的铜面。
通过上述步骤101的实施，能够在LED基板上钻出定位孔，以便在之后对LED基板的加工处理时对LED基板进行固定或定位。
如图3所示，对于上述步骤102，具体是是包括以下内容：
步骤1021：打磨LED基板。
步骤1022：清洗LED基板。
步骤1023：烘干LED基板。
对于上述步骤1021，其中，打磨的方式可以是利用自动打磨设备和/或人工打磨，打磨的对象具体可以包括LED基板的线路面、LED基板的外壁和LED的孔壁中的至少一种或几种。具体地，例如自动打磨设备可以是打磨机、 打磨箱、磨板机等，人工打磨可以是利用人工使用细砂纸进行打磨。
对于上述步骤1022，具体可以利用超声波清洗机、有机溶剂、吹风机等工具对LED基板进行清洗。
对于上述步骤1023，具体是将LED基板置于烘干机进行烘干。
通过上述步骤102的实施，对LED基板进行打磨，以使LED基板的表面光滑，提高在LED基板在之后的印刷过程中印刷的质量，减少对丝网板的损伤。
需要注意的是，上述步骤101和步骤102也可以不采用规定的上述顺序，也即，对于步骤101和步骤102，也可以是步骤102在先，步骤101在后。
在上述步骤200中，对多个LED基板的线路面进行丝网印刷具体还包括以下步骤：
步骤201：将多个LED基板的线路面贴合丝网板并置于丝网板的镂空图案的正下方，将油墨置于丝网板上。
步骤202：控制刮板在丝网板上来回刮动油墨，以在多个LED基板的线路面上形成与镂空图案相同的油墨图案。
对于步骤201，具体通过两个部分实现：
第一部分：LED基板的线路面朝上置于送料机的送料平台上，通过送料机将送料平台推送至丝网印刷机，使LED基板位于丝网板的镂空图案的正下方，并且LED基板的的线路面与丝网板贴合。
第二部分：将油墨置于丝网板上。
此处需要注意的是，第一部分与第二部分执行的顺序无先后区分。
对于步骤202，由于LED基板的线路面与丝网板贴合，并位于丝网板的镂空图案的正下方，同时，刮板在丝网板上来回刮动，会对丝网板上的油墨形成压力，迫使油墨进入丝网板的镂空图案，以在LED基板的线路面形成与镂空图案相同的油墨图案。
在本实施例中，每当在步骤202中实现一个LED基板的线路面上形成与 镂空图案相同的油墨图案，则重新执行步骤201，依次循环，实现在多个LED基板的线路面上形成与镂空图案相同的油墨图案。
在上述步骤201之前，还包括以下内容：
从油墨罐中取出油墨。其中，油墨中存在具有挥发性的稀释剂。例如，稀释剂可以是硝基漆稀释剂、过氯乙烯漆稀释剂、酚醛漆稀释剂、丙烯酸漆稀释剂、醇酸漆稀释剂、环氧漆稀释剂、酚醛漆稀释剂、有机硅漆稀释剂等。
油墨罐开启后，油墨中的稀释剂便缓慢会挥发，导致油墨的粘度提升。进一步地，为能够获得油墨粘度与油墨罐开启后静置时间的关系，进行实验，从实验中提取的数据如表1所示，从提取的数据可知：开启油墨罐后的时间区间[0min,120min]内，油墨的粘度在[90,120]。
表1
Figure PCTCN2019123789-appb-000001
针对同一批次的LED基板的线路板在两个小时内进行丝网印刷采用同一批次的油墨，能够满足生产需求。优选地，在油墨罐开启后静置的时间区间[900min,120min]范围内，再针对同一批次的LED基板的线路板采用同一批次油墨罐内的油墨进行丝网印刷，能够有效保障油墨的粘度，减少各个LED基板的线路面之间的色差。
在本实施例中，油墨罐的规格为5千克/罐。需要注意的是，油墨罐的规格越大，装载的油墨越多，油墨罐内的油墨能够满足对更多的LED基板的线路面进行丝网印刷。如果同一油墨罐内的油墨能够应用于更多LED基板的线路面进行丝网印刷，则各个LED基板的线路板的之间的色差也就越小。
在上述步骤200每隔一个预设印刷周期在丝网印刷期间对丝网板进行收油处理，以使丝网板上的油墨粘度处于预设粘度范围内中，收油处理具体是：将在丝网板边缘上的油墨刮向丝网板的中心位置。同时，在丝网印刷过程中以每印刷预设片数的LED基板为一个预设印刷周期，预设片数的取值范围为 [20,40]。
另外，在本实施例中，油墨的预设粘度范围为[80dPa·S,140dPa·S]。需要注意的是，油墨的预设粘度范围为[80dPa·S,140dPa·S]能够满足生产需求。同时，在油墨的预设粘度范围内，各个LED基板的线路面上的油墨之间的粘度差值越小，各个LED基板的线路面之间的色差也越小。
为能更好说明本实施例，此处再详述需要对丝网板进行收油处理的原因。由于刮板在丝网板上来回刮动油墨，一些油墨会被刮在丝网板的边缘，由于油墨具有一定的流动性，但是其流动性较低，这就会导致处于丝网板边缘位置的油墨虽然具有流向丝网板中心位置的趋势，但是流向丝网板中心位置的速度较为缓慢，进一步导致有一部分油墨长期暴露在空气中，这部分油墨的粘度与靠近丝网板中心位置的油墨的粘度有较大差异，从丝网板边缘位置流向中心位置的油墨会使原有丝网板中心位置的油墨粘度产生较大变化，从而影响多个LED基板的线路面之间的色差。因此，通过刮动丝网板边缘位置的油墨，以使丝网板边缘位置的油墨与靠近丝网板中心位置的油墨较好融合，使丝网板边缘位置的油墨的粘度和靠近丝网板中心位置的油墨的粘度之间的粘度差值均维持在较小的范围内，减少长期暴露在空气中油墨量，进而可减少多个LED基板的线路面之间的色差。
为能够证明丝网板边缘位置的油墨的粘度与靠近丝网板中心位置的油墨的粘度具有较大差异，需要获知丝网板边缘位置的油墨的粘度与时间之间的关系，靠近丝网板中心位置的油墨的粘度与时间之间的关系，因此，进行实验，从实验中提取的数据如下表2所示，从提取的数据可知：丝网板边缘位置油墨的粘度在两小时内的粘度变化不大，而靠近丝网板中心位置油墨的粘度有较大的变化差异。因此，在两小时内靠近丝网板中心位置油墨的粘度差异较小，在时间区间[60min,120min]内丝网板边缘位置油墨中的粘度差异较大。
表2
Figure PCTCN2019123789-appb-000002
为说明本实施中收油处理带来的技术效果，进行以下三组实验：
实验组一：在丝网印刷期间不进行收油处理。
实验组二：每隔一个预设印刷周期在丝网印刷期间对丝网板进行收油处理，每印刷40片LED基板为一个周期。
实验组三：每隔一个预设印刷周期在丝网印刷期间对丝网板进行收油处理，每印刷20片LED基板为一个周期。
实验组一、实验组二和实验组三对应的LED显示屏结果分别如图5、图6和图7所示。根据图5、图6和图7可知，三组实验组的LED显示屏中各个LED印制电路板之间的色差按照由好到差的顺序为：实验组三、实验组二、实验组一。
通过实验可知，每隔一个预设印刷周期在丝网印刷期间对丝网板进行收油处理，预设印刷周期越小，LED显示屏中各个LED印制电路板之间的色差越小。
通过上述步骤200的实施，能够有效减少LED显示屏中各个LED印制电路板之间的色差。
对于上述步骤300，其中，获得的多个LED印制电路板为成品。
如图8所示，在上述步骤300中，曝光定型处理具体还包括以下内容：
步骤301：烘干多个LED基板上的油墨；
步骤302：对覆盖有油墨的基板进行曝光、显影及固化处理。
对于步骤301，具体是将LED基板置于烘干机进行烘干。
对于步骤302，采用曝光机对工件相应位置进行曝光，然后对曝光后的工件进行显影处理，然后对LED基板进行固化。其中，曝光机可以是LED混合波曝光机。同时，曝光尺级数为7至11格。另外，可以通过紫外固化或者热固化的方式对LED基板进行固化。
通过步骤300的实施，能够将多个经过丝网印刷的LED基板形成多个LED印制电路板。
对于上述步骤400，具体可以通过印刷线路板连接器进行拼接，以获得符合预定规格的LED显示屏。进一步地，预定规格可以是LED显示屏大小规格、像素要求、灰度等级要求等。
通过步骤400的实施，能够获得符合预定规格的LED显示屏。
通过本实施例的实施，能够有效减少在LED显示屏中各个LED印制电路板之间的色差，明显减缓“马赛克”视觉效应，能够有效改善LED显示屏的图像显示效果的问题。
应理解，上述实施例中各步骤的序号的大小并不意味着执行顺序的先后，各过程的执行顺序应以其功能和内在逻辑确定，而不应对本发明实施例的实施过程构成任何限定。
以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围，均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种改善LED显示屏色差的工艺方法，其特征在于，包括：
    对多个LED基板的线路面进行钻孔打磨处理；
    对所述多个LED基板的线路面进行丝网印刷，并每隔一个预设印刷周期在丝网印刷期间对丝网板进行收油处理，以使所述丝网板上的油墨粘度处于预设粘度范围内；
    对经过丝网印刷的所述多个LED基板进行曝光定型处理，以获得多个LED印制电路板；
    对所述多个LED印制电路板进行拼接，以获得LED显示屏。
  2. 根据权利要求1所述的改善LED显示屏色差的工艺方法，其特征在于，所述钻孔打磨处理包括：
    在所述多个LED基板上钻出定位孔；
    打磨所述多个LED基板，并对经过打磨的所述多个LED基板依次进行清洗和烘干。
  3. 根据权利要求1所述的改善LED显示屏色差的工艺方法，其特征在于，所述对所述多个LED基板的线路面进行丝网印刷包括：
    将所述多个LED基板的线路面贴合所述丝网板并置于所述丝网板的镂空图案的正下方，将油墨置于所述丝网板上；
    控制刮板在所述丝网板上来回刮动所述油墨，以在所述多个LED基板的线路面上形成与所述镂空图案相同的油墨图案。
  4. 根据权利要求3所述的改善LED显示屏色差的工艺方法，其特征在于，在所述将所述多个LED基板的线路面置于所述丝网板的镂空图案的正下方，并将油墨置于所述丝网板上之前，还包括：
    从油墨罐中取出油墨；所述油墨罐的规格为5千克/罐。
  5. 根据权利要求1所述的改善LED显示屏色差的工艺方法，其特征在于，
    在丝网印刷过程中以每印刷预设片数的LED基板为一个所述预设印刷周期，所述预设片数的取值范围为[20,40]。
  6. 根据权利要求1所述的改善LED显示屏色差的工艺方法，其特征在于，所述收油处理为：将在所述丝网板边缘上的油墨刮向所述丝网板的中心位置。
  7. 根据权利要求1所述的改善LED显示屏色差的工艺方法，其特征在于，所述油墨的所述预设粘度范围为[80dPa·S,140dPa·S]。
  8. 根据权利要求1中任一所述的改善LED显示屏色差的工艺方法，其特征在于，所述曝光定型处理包括：
    烘干所述多个LED基板上的油墨；
    对覆盖有油墨的基板进行曝光、显影及固化处理。
  9. 根据权利要求1至8中任一所述的改善LED显示屏色差的工艺方法，其特征在于，所述LED基板包括玻纤板和/或铝基板。
  10. 根据权利要求1至8所述的改善LED显示屏色差的工艺方法，其特征在于，所述油墨中包含具有挥发性的稀释剂。
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