WO2020124740A1 - 一种柔性显示装置 - Google Patents

一种柔性显示装置 Download PDF

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Publication number
WO2020124740A1
WO2020124740A1 PCT/CN2019/072902 CN2019072902W WO2020124740A1 WO 2020124740 A1 WO2020124740 A1 WO 2020124740A1 CN 2019072902 W CN2019072902 W CN 2019072902W WO 2020124740 A1 WO2020124740 A1 WO 2020124740A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
layer
circuit board
groove
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/072902
Other languages
English (en)
French (fr)
Inventor
王海峰
王硕晟
潘坤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US16/332,795 priority Critical patent/US11029546B2/en
Publication of WO2020124740A1 publication Critical patent/WO2020124740A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/13306—Circuit arrangements or driving methods for the control of single liquid crystal cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
    • G02F1/133385—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell with cooling means, e.g. fans
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/36—Airflow channels, e.g. constructional arrangements facilitating the flow of air

Definitions

  • the invention relates to a liquid crystal display neighborhood.
  • it relates to a flexible display device.
  • liquid crystal display Liquid Crystal
  • LCD liquid crystal display
  • a chip on film is a driving unit used in a liquid crystal display device, and is usually attached to the edge of the liquid crystal panel by hot pressing.
  • display products with narrow bezels Narrow Bezel
  • the driving chip faces the side close to the backlight module on the flip chip.
  • the driver chip itself generates greater heat radiation, and the backlight module also generates a large amount of heat radiation. Since the driver chip is directed toward the side of the backlight module, it and the backlight module The distance is very small, the heat radiation generated by the backlight module and the heat radiation generated by the driver chip itself will superimpose the temperature of the driver chip.
  • the driver chip is an important component for transmitting and processing signals. Too high a temperature will affect the stability of the working performance, thereby reducing the reliability of the driver chip and even causing the driver chip to be damaged due to overheating.
  • the driving chip faces the side close to the backlight module on the flip chip.
  • the driver chip itself generates greater heat radiation, and the backlight module also generates a large amount of heat radiation. Since the driver chip is directed toward the side of the backlight module, it and the backlight module The distance is very small, the heat radiation generated by the backlight module and the heat radiation generated by the driver chip itself will superimpose the temperature of the driver chip.
  • the driver chip is an important component for transmitting and processing signals. Too high a temperature will affect the stability of the working performance, thereby reducing the reliability of the driver chip and even causing the driver chip to be damaged due to overheating.
  • the technical problem to be solved by the present invention is to provide a flexible display device by changing the relative positions of the driving element and the circuit board components and the flexible panel, and combining the solution of the slotted design of the heat dissipation support layer, the driving element and the circuit board
  • the components are embedded inside the material, which solves the technical problem of excessively thick flexible display devices in the prior art.
  • the present invention provides a flexible display device including a flexible panel, the flexible panel includes a non-bending area, a bending area connected to the non-bending area, and a connection with the bending area And a plane area parallel to the non-bending area; a heat dissipation support layer is provided between the non-bending area and the plane area, and the heat dissipation support layer is provided with at least one groove on a side facing the plane area ; A flip chip, one side of which is connected to the plane area, the flip chip is provided with a driving element on the side facing the heat dissipation support layer; a circuit board, one side of which is connected to the flip chip, The other side is connected to the heat dissipation support layer, and a circuit board component is provided on a side of the circuit board facing the heat dissipation support layer; the driving element and the circuit board component are correspondingly disposed in the groove.
  • the groove includes a first groove corresponding to the flip chip, and the driving element is located in the first groove; a second groove corresponding to the circuit board, and the The driving element is located in the second groove.
  • the first groove and the second groove divide the heat dissipation support layer into first support sections, corresponding to the A planar area; and a second support section, corresponding to the junction section of the circuit board and the flip chip; and a third support section, corresponding to one side of the circuit board.
  • first support member is supported between the first support section and the plane area; a second support member is supported between the second support section and the junction section; a third support member Supported between the third support section and the circuit board.
  • first shield plate which is disposed between the non-bending area and the heat dissipation support layer; a second shield plate, which is disposed between the third support member and the planar area.
  • the heat dissipation support layer includes a graphite layer, the graphite layer is disposed on a side close to the non-bending area; a heat dissipation layer, the heat dissipation layer is disposed on a side close to the plane area; a foam layer, It is provided between the graphite layer and the heat dissipation layer.
  • the groove penetrates the entire heat dissipation layer and the foam layer; or the groove penetrates the entire heat dissipation layer, the foam layer, and the graphite layer.
  • the heat dissipation layer is copper foil.
  • anisotropic conductive adhesive film connects the planar area and the flip chip; the anisotropic conductive adhesive film connects the flip chip and the circuit board.
  • the heat dissipation layer covers the inner wall of the groove.
  • the flexible display device of the present invention embeds the driving element and the circuit board component into the heat dissipation support layer by changing the relative positions of the direction of the driving element and the circuit board component and the direction of the flexible panel, and combining the groove formed in the heat dissipation support layer Inside, the purpose of thinning the flexible display device is achieved.
  • FIG. 1 is a schematic diagram of a flexible display device in Embodiment 1.
  • FIG. 1 is a schematic diagram of a flexible display device in Embodiment 1.
  • Fig. 2 is a schematic diagram of a flexible panel in an embodiment.
  • Embodiment 3 is a schematic diagram of a flexible display device in Embodiment 2.
  • FIG. 4 is a schematic diagram of a flexible display device of an embodiment.
  • FIG. 5 is a schematic diagram of a flexible display device in Embodiment 3.
  • FIG. 6 is a schematic diagram of a part of a flexible display device of an embodiment.
  • the flexible display device of the present invention includes a flexible panel 10, a heat dissipation support layer 20, a circuit board 30, a chip on film 40, a circuit board component 50, a driving element 60, a polarizer 70, The first support 810, the second support 820, the third support 830, and the shield 90.
  • the flexible panel 10 is a flexible film substrate made of plastic material or metal foil, wherein the flexible panel 10 includes a non-bending area 110 and a bend connected to the non-bending area 110
  • the folding area 120 and the non-bending area 110 further include a display area 1110 and a non-display area 1120.
  • the polarizing film 70 covers the display area 1110.
  • the bending area 120 is bent and extends from the non-display area 1120 side to the
  • the heat dissipation support layer 20 faces away from the flexible panel 10 and forms a planar area 1210.
  • the heat dissipation support layer 20 includes a foam layer 210, a graphite layer 220, and a heat dissipation layer 230, wherein the foam layer 210 is disposed on the side of the non-bending area 110 facing away from the display area 1110, so as to support the flexible panel 10 And heat dissipation.
  • the present invention adopts a first groove 201 and a second groove 202 formed on the heat dissipation support layer 20, wherein the first groove 201 and the second groove
  • the groove 202 divides the heat dissipation support layer 20 into three sections, including a first support section 2010, corresponding to one side of the circuit board 30; a second support section 2020, as shown in FIG. 6, corresponds to the circuit board 30 and the flip-chip thin film 40 are connected by an anisotropic conductive film 310 to form a junction section 311; the third support section 2030 corresponds to the planar area 1210.
  • the first groove 201 and the second groove 202 are used to accommodate the driving element 60 and the circuit board component 50.
  • the specific groove depth and size of the first groove 201 and the second groove 202 need to be determined according to the shapes of the driving element 60 and the circuit board component 50, for example, the driving element
  • the length, width and thickness of 60 are 33mm, 1.8mm and 0.2mm respectively.
  • the length and width of the corresponding first groove 201 are 33.3 mm and 2.1 mm, respectively, and the second groove 202 needs The size is determined according to the specific circuit board component 50.
  • the thickness of the driving element 60 is 0.2 mm, and the total thickness of the foam layer 210, the graphite layer 220, and the heat dissipation layer 230 is greater than 0.2 mm, so the foam layer 210, graphite One or two of the layer 220 and the heat dissipation layer 230 are provided with the first groove 201 and the second groove 202.
  • the first groove 201 and the second groove are selected to be provided in the graphite layer 220 and the heat dissipation layer 230 202.
  • the first support 810 supports the circuit board 30 and the first support section 2010, the second support 820 supports the interface section 311 and the second support section 2020, and the third support 830 supports the flip chip 40 and the third support section 2030, wherein the driving element 60 and the circuit can be controlled by adjusting the heights of the first support 810 and the second support 820
  • the height of the board component 50 in the first groove 201 and the second groove 202, and the third support 830 is used to adjust the bending arc of the bending area 120.
  • the circuit board component 50 is soldered to the side of the circuit board 30 facing the heat dissipation support layer 20 and electrically connected to the circuit board 30, and the circuit board component 50 is placed in the first groove Between 201 and the circuit board 30.
  • the side of the flip-chip film 40 away from the junction 311 is connected to the planar area 1210 through an anisotropic conductive film 310.
  • the driving element 60 is soldered to the side of the flip-chip film 40 facing the heat dissipation support layer 20 and electrically connected to the flip-chip film 40, and the driving element 60 is placed in the second groove 202 and Between the circuit boards 30.
  • the shield 90 includes a first shield 910 and a second shield 920, and the first shield 910 is disposed between the heat dissipation support layer 20 and the flexible panel 10 to support the flexible panel 10
  • the second shield 920 is placed between the bending zone 120 and the third support member 830, and its role is similar to that of the third support member, both of which play a role in adjusting the bending of the bending zone 120 The role of radians.
  • the flexible display device of the present invention includes a flexible panel 10, a heat dissipation support layer 20, a circuit board 30, a chip on film 40, a circuit board component 50, a driving element 60, a polarizer 70, The first support 810, the second support 820, the third support 830, and the shield 90.
  • the flexible panel 10 is a flexible film substrate whose material is plastic material or metal foil, wherein,
  • the flexible panel 10 includes a non-bending area 110 and a bending area 120.
  • the non-bending area 110 further includes a display area 1110 and a non-display area 1120.
  • the polarizer 70 covers the display area 1110.
  • the side of the non-display area 1120 extends to the side of the heat dissipation support layer 20 facing away from the flexible panel 10 and forms a planar area 1210.
  • the heat dissipation support layer 20 includes a foam layer 210, a graphite layer 220, and a heat dissipation layer 230, wherein the foam layer 210 is disposed on the side of the non-bending area 110 facing away from the display area 1110, to reach the flexible panel 10
  • the present invention adopts a third groove 203 and a fourth groove 204 formed on the heat dissipation support layer 20.
  • the third groove 203 and the fourth groove 204 divide the heat dissipation support layer 20 into three sections, including a first support section 2010, corresponding to one side of the circuit board 30; a second support section 2020, corresponding to the junction section 311 formed by connecting the circuit board 30 and the flip-chip film 40 through the anisotropic conductive film 310; the third support section 2030, corresponding to the planar area 1210.
  • the third groove 203 and the fourth groove 204 are used to accommodate the driving element 60 and the circuit board component 50.
  • the specific groove depth and size of the third groove 203 and the fourth groove 204 need to be determined according to the shapes of the driving element 60 and the circuit board component 50, for example, the driving element
  • the length, width and thickness of 60 are 33mm, 1.8mm and 0.2mm respectively.
  • the length and width of the corresponding foam layer 210, graphite layer 220, and heat dissipation layer 230 at the opening positions are 33.3 mm and 2.1 mm, respectively.
  • the thickness of the driving element 60 is 0.2 mm
  • the total thickness of the foam layer 210, the graphite layer 220, and the heat dissipation layer 230 is less than 0.2 mm, so it is necessary to combine the first support member 810 and the height of the second support 820 and the height of the third support 830 (the thickness of the third support in actual production is about 0.55 mm), and the third groove 203 and the fourth groove 204 are selected to pass through The entire heat dissipation support layer.
  • the first support 810 supports the circuit board 30 and the first support section 2010, the second support 820 supports the interface section 311 and the second support section 2020, and the third support 830 supports the flip chip 40 and the third support section 2030, wherein the driving element 60 and the circuit can be controlled by adjusting the heights of the first support 810 and the second support 820
  • the height of the board component 50 in the third groove 203 and the fourth groove 204, and the third support 830 is used to adjust the bending arc of the bending area 120.
  • the circuit board component 50 is soldered to the side of the circuit board 30 facing the heat dissipation support layer 20 and electrically connected to the circuit board 30, and the circuit board component 50 is placed in the third groove 203 and the circuit board 30.
  • the flip-chip thin film 40 is connected to the planar area 1210 through the anisotropic conductive film 310 on the side away from the junction 311.
  • the driving element 60 is soldered to a side of the flip-chip film 40 facing the heat dissipation support layer 20 and electrically connected to the flip-chip film 40, and the driving element 60 is placed in the fourth groove 204 and Between the circuit boards 30.
  • the shield 90 includes a first shield 910 and a second shield 920, and the first shield 910 is disposed between the heat dissipation support layer 20 and the flexible panel 10 to support the flexible panel 10
  • the second shield 920 is placed between the bending zone 120 and the third support member 830, and its role is similar to that of the third support member, both of which serve to adjust the bending of the bending zone 120 The role of radians.
  • a heat dissipation film 231 is placed inside the third groove 203 and the fourth groove 204
  • the material of the heat dissipation film 231 is copper foil.
  • the flexible display device of the present invention includes a flexible panel 10, a heat dissipation support layer 20, a circuit board 30, a chip on film 40, a circuit board component 50, a driving element 60, a polarizer 70, The fourth support 840, the fifth support 850, the third support 830, and the shield 90.
  • the flexible panel 10 is a flexible film substrate whose material is plastic material or metal foil, wherein,
  • the flexible panel 10 includes a non-bending area 110 and a bending area 120.
  • the non-bending area 110 further includes a display area 1110 and a non-display area 1120.
  • the polarizer 70 covers the display area 1110.
  • the side of the non-display area 1120 extends to the side of the heat dissipation support layer 20 facing away from the flexible panel 10 and forms a planar area 1210.
  • the heat dissipation supporting layer 20 includes a foam layer 210, a graphite layer 220, and a heat dissipation layer 230, wherein the foam layer 210 is disposed on the side of the non-bending area 110 facing away from the display area 1110, so as to reach the flexible panel 10 Support and heat dissipation.
  • the present invention adopts a fifth groove 205 formed on the heat dissipation support layer 20.
  • the fifth groove 205 divides the heat dissipation support layer 20 into two sections, including a fourth support section 2040 corresponding to one side of the circuit board 30; a fifth support section 2050 corresponding to the planar area 1210.
  • the fifth groove 205 is used to accommodate the driving element 60 and the circuit board component 50.
  • the fifth groove 205 has an opening facing away from the flexible panel 10, and the driving element 60 and the circuit board component 50 are placed in the fifth groove 205.
  • the fourth support 840 supports the circuit board 30 and the fourth support section 2040
  • the fifth support 850 supports the interface section 311 and the fifth groove 205.
  • the circuit board component 50 is soldered to the side of the circuit board 30 facing the heat dissipation support layer 20 and electrically connected to the circuit board 30, and one end of the flip chip 40 is connected to the anisotropic conductive film 310
  • the circuit board 30 is connected, and the other end is connected to the bending region 120 through an anisotropic conductive film 310 .
  • the driving element 60 is soldered to a side of the flip-chip film 40 facing the heat dissipation support layer 20 and electrically connected to the flip-chip film 40.
  • the shield 90 includes a first shield 910 and a second shield 920, and the first shield 910 is disposed between the heat dissipation support layer 20 and the flexible panel 10 to support the flexible panel 10
  • the second shield 920 is placed between the bending zone 120 and the third support member 830, and its role is similar to that of the third support member, both of which play a role in adjusting the bending of the bending zone 120 The role of radians.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种柔性显示装置，包括柔性面板（10），柔性面板（10）包括非弯折区（110）、连接于非弯折区（110）的弯折区（120）、与弯折区（120）相连并与非弯折区（110）平行的平面区（1210）；散热支撑层（20），设置在非弯折区（110）和平面区（1210）之间，散热支撑层（20）朝向平面区（1210）的一侧设有至少一个凹槽（201，202，203，204，205）；覆晶薄膜（40），其一侧连接于平面区（1210），覆晶薄膜（40）朝向散热支撑层（20）的一侧设有驱动元件（60）；电路板（30），其一侧连接于覆晶薄膜（40）上，其另一侧连接于散热支撑层（20），电路板（30）朝向散热支撑层（20）的一侧设有电路板元器件（50）；驱动元件（60）和电路板元器件（50）对应设置在凹槽（201，202，203，204，205）内；通过改变驱动元件（60）与电路板元器件（50）的方向和柔性面板（10）的方向的相对位置，结合在散热支撑层（20）中开设的凹槽（201，202，203，204，205），达到柔性显示装置减薄和散热的目的。

Description

一种柔性显示装置 技术领域
本发明涉及液晶显示邻域。特别涉及一种柔性显示装置。
 背景技术
在平板显示装置中，液晶显示装置(Liquid Crystal Display，LCD)具有体积小、功耗低、制造成本相对较低和无辐射等特点，在当前的平板显示器市场占据了主导地位。
覆晶薄膜(Chip on Film，COF)是一种用于液晶显示装置上的驱动单元，通常借由热压的方式贴附绑定(bonding)于液晶面板的边缘上。随着显示技术的不断进步，具有窄边框(Narrow Bezel)的显示产品因其可以使用户获得较好的观看体验，吸引了大量的消费者。为了获得窄边框的液晶显示装置，通常需要将覆晶薄膜从液晶面板的侧面弯折至背光模组的背面，以减小覆晶薄膜所占用的侧边框的空间。
现有技术中，将覆晶薄膜弯折至背光模组的背面之后，驱动芯片在覆晶薄膜上是朝向靠近背光模组一侧。在液晶显示装置的工作期间，驱动芯片本身会产生较大的热辐射，同时背光模组也会产生大量的热辐射，而由于驱动芯片是朝向靠近背光模组一侧，其与背光模组的距离很小，背光模组产生的热辐射与驱动芯片本身产生的热辐射叠加，将会使得驱动芯片的温度过高。驱动芯片是传输和处理信号的重要部件，其温度过高将会影响到工作性能的稳定性，由此导致驱动芯片的可靠性降低，甚至会导致驱动芯片由于过热而损坏。
 技术问题
现有技术中，将覆晶薄膜弯折至背光模组的背面之后，驱动芯片在覆晶薄膜上是朝向靠近背光模组一侧。在液晶显示装置的工作期间，驱动芯片本身会产生较大的热辐射，同时背光模组也会产生大量的热辐射，而由于驱动芯片是朝向靠近背光模组一侧，其与背光模组的距离很小，背光模组产生的热辐射与驱动芯片本身产生的热辐射叠加，将会使得驱动芯片的温度过高。驱动芯片是传输和处理信号的重要部件，其温度过高将会影响到工作性能的稳定性，由此导致驱动芯片的可靠性降低，甚至会导致驱动芯片由于过热而损坏。
 技术解决方案
本发明所要解决的技术问题是，提供一种柔性显示装置，通过改变驱动元件和电路板元器件与柔性面板的相对位置，结合对散热支撑层进行开槽设计的方案，将驱动元件和电路板元器件埋入材料内部，解决现有技术中柔性显示装置过厚的技术问题。
为了解决上述问题，本发明提供了一种柔性显示装置，包括柔性面板，所述柔性面板包括非弯折区、连接于所述非弯折区的弯折区、及与所述弯折区相连并与所述非弯折区平行的平面区；散热支撑层，设置在所述非弯折区和平面区之间，所述散热支撑层朝向所述平面区的一侧设有至少一个凹槽；覆晶薄膜，其一侧连接于所述平面区，所述覆晶薄膜朝向所述散热支撑层的一侧设有驱动元件；电路板，其一侧连接于所述覆晶薄膜上，其另一侧连接于所述散热支撑层，所述电路板朝向所述散热支撑层的一侧设有电路板元器件；所述驱动元件和电路板元器件对应设置在所述凹槽内。
进一步地，所述凹槽包括第一凹槽，对应于所述覆晶薄膜，且所述驱动元件位于所述第一凹槽中；第二凹槽，对应于所述电路板，且所述驱动元件位于所述第二凹槽中。
进一步地，所述电路板与所述覆晶薄膜之间具有一交接段；所述第一凹槽与所述第二凹槽将所述散热支撑层分为第一支撑段，对应于所述平面区；以及第二支撑段，对应于所述电路板和所述覆晶薄膜的交接段；以及第三支撑段，对应于所述电路板的一侧。
进一步地，第一支撑件，支撑于所述第一支撑段和所述平面区之间；第二支撑件，支撑于所述第二支撑段和所述交接段之间；第三支撑件，支撑于所述第三支撑段和所述电路板之间。
进一步地，还包括第一护板，置于所述非弯折区与所述散热支撑层之间；第二护板，置于所述第三支撑件与所述平面区之间。
进一步地，所述散热支撑层包括石墨层，所述石墨层设置在靠近所述非弯折区的一侧；散热层，所述散热层设置在靠近所述平面区的一侧；泡沫层，设于所述石墨层和所述散热层之间。
进一步地，所述凹槽贯穿整个所述散热层和所述泡沫层；或所述凹槽贯穿整个所述散热层、所述泡沫层和所述石墨层。
进一步地，所述散热层为铜箔。
进一步地，还包括异方性导电胶膜，所述异方性导电胶膜连接所述平面区与所述覆晶薄膜；所述异方性导电胶膜连接所述覆晶薄膜与所述电路板。
进一步地，所述散热层覆盖所述凹槽内壁。
 有益效果
本发明的柔性显示装置通过改变驱动元件与电路板元器件的方向和柔性面板的方向的相对位置，结合在散热支撑层中开设的凹槽，将驱动元件与电路板元器件埋入散热支撑层内部，达到柔性显示装置减薄的目的。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是实施例1中的柔性显示装置示意图。
图2是实施例中的柔性面板示意图。
图3是实施例2中的柔性显示装置示意图。
图4是实施例的柔性显示装置示意图。
图5是实施例3中的柔性显示装置示意图。
图6是实施例的部分柔性显示装置示意图。
附图中部件标记为：
10 柔性面板；
20 散热支撑层；
201 第一凹槽；     202 第二凹槽；           203 第三凹槽；
204 第四凹槽；     205 第五凹槽；
210 泡沫层；       220 石墨层；              230 散热层；
30 电路板；
310异方性导电膜胶；      311 交接段；
40 覆晶薄膜；            50 电路板元器件；
60 驱动元件；        70 偏光片；
810 第一支撑件；     820 第二支撑件；      830 第三支撑件；
840 第四支撑件；     850 第五支撑件；
2010 第一支撑段；    2020 第二支撑段；     2030 第三支撑段；
2040 第四支撑段；    2050 第五支撑段；
90 护板；            910 第一护板；        920 第二护板；
110 非弯折区；       1110 显示区域；      1120 非显示区域；
120 弯折区；         1210 平面区；        231 散热膜；
 本发明的实施方式
实施例1
如图1所示，本实施例中，本发明的柔性显示装置包括柔性面板10、散热支撑层20、电路板30、覆晶薄膜40、电路板元器件50、驱动元件60、偏光片70、第一支撑件810、第二支撑件820、第三支撑件830、护板90。
如图2所示，所述柔性面板10为柔性薄膜基板，其材质为塑料材料或金属箔，其中，所述柔性面板10包括非弯折区110和连接于所述非弯折区110的弯折区120，非弯折区110又包括显示区域1110和非显示区域1120，偏光片70覆盖所述显示区域1110，所述弯折区120从所述非显示区域1120一侧弯曲延伸至所述散热支撑层20背对所述柔性面板10一侧并形成平面区1210。
所述散热支撑层20包括泡沫层210、石墨层220和散热层230，其中所述泡沫层210置于所述非弯折区110背对显示区域1110一面，达到对所述柔性面板10的支撑和散热作用。同时为了达到减薄柔性显示屏的目的，本实施例中，本发明采用在所述散热支撑层20上开设第一凹槽201和第二凹槽202，其中第一凹槽201和第二凹槽202将所述散热支撑层20分为三段，包括第一支撑段2010，对应于所述电路板30的一侧；第二支撑段2020，如图6所示，对应于所述电路板30和所述覆晶薄膜40通过异方性导电膜310连接形成的交接段311；第三支撑段2030，对应于所述平面区1210。
所述第一凹槽201和所述第二凹槽202用以容纳所述驱动元件60和电路板元器件50。具体地，所述第一凹槽201和所述第二凹槽202具体的凹槽深度和大小需要根据所述驱动元件60和所述电路板元器件50的形状决定，举例来说，驱动元件60的尺寸长、宽、厚分别为33mm、1.8mm、0.2mm。考虑弯折区120的精度和第一支撑件810与电路板30的粘合精度，对应的所述第一凹槽201的长宽分别为33.3mm、2.1mm，所述第二凹槽202需根据具体的电路板元器件50来决定大小。
本实施例中，所述驱动元件60的厚度为0.2mm，所述泡沫层210、所述石墨层220、所述散热层230的厚度总厚度大于0.2mm，所以可以选择在泡沫层210、石墨层220、散热层230中的一层或两层开设第一凹槽201和第二凹槽202，本实施例选择在石墨层220、散热层230中开设第一凹槽201和第二凹槽202。
所述第一支撑件810支撑所述电路板30与所述第一支撑段2010，所述第二支撑件820支撑所述交接段311与所述第二支撑段2020，所述第三支撑件830支撑所述覆晶薄膜40与所述第三支撑段2030，其中，可以通过调节所述第一支撑件810和所述第二支撑件820的高度来控制所述驱动元件60和所述电路板元器件50在所述第一凹槽201和所述第二凹槽202中的高度，所述第三支撑件830用于调节所述弯折区120弯折弧度。
所述电路板元器件50焊接至所述电路板30面对所述散热支撑层20一侧并与所述电路板30电性连接，所述电路板元器件50置于所述第一凹槽201与所述电路板30之间。
所述覆晶薄膜40远离所述交接段311的一侧与所述平面区1210通过异方性导电膜310相连。
所述驱动元件60焊接至所述覆晶薄膜40面对所述散热支撑层20一侧并与所述覆晶薄膜40电性连接，所述驱动元件60置于所述第二凹槽202与所述电路板30之间。
所述护板90包括第一护板910和第二护板920， 所述第一护板910置于所述散热支撑层20和所述柔性面板10之间，用以支撑所述柔性面板10；所述第二护板920置于所述弯折区120和所述第三支撑件830之间，其作用与所述第三支撑件类似，均起到调节所述弯折区120弯折弧度的作用。
实施例2
如图3所示，本实施例中，本发明的柔性显示装置包括柔性面板10、散热支撑层20、电路板30、覆晶薄膜40、电路板元器件50、驱动元件60、偏光片70、第一支撑件810、第二支撑件820、第三支撑件830、护板90。
所述柔性面板10为柔性薄膜基板，其材质为塑料材料或金属箔，其中，
所述柔性面板10包括非弯折区110和弯折区120，非弯折区110又包括显示区域1110和非显示区域1120，偏光片70覆盖所述显示区域1110，所述弯折区120从所述非显示区域1120一侧弯曲延伸至所述散热支撑层20背对所述柔性面板10一侧并形成平面区1210。
所述散热支撑层20包括泡沫层210、石墨层220、散热层230，其中所述泡沫层210置于所述非弯折区110背向所述显示区域1110一面，达到对所述柔性面板10的支撑和散热作用，为了达到减薄柔性显示屏的目的，本实施例中，本发明采用在所述散热支撑层20上开设第三凹槽203和第四凹槽204。
其中所述第三凹槽203和所述第四凹槽204将所述散热支撑层20分为三段，包括第一支撑段2010，对应于所述电路板30的一侧；第二支撑段2020，对应于所述电路板30和所述覆晶薄膜40通过异方性导电膜310连接形成的交接段311；第三支撑段2030，对应于所述平面区1210。
所述第三凹槽203和所述第四凹槽204用以容纳所述驱动元件60和电路板元器件50。具体地，所述第三凹槽203和所述第四凹槽204具体的凹槽深度和大小需要根据所述驱动元件60和所述电路板元器件50的形状决定，举例来说，驱动元件60的尺寸长、宽、厚分别为33mm、1.8mm、0.2mm。考虑弯折区120的精度和第一支撑件810与电路板30的粘合精度，对应的泡沫层210、石墨层220、散热层230开孔位置的长宽分别为33.3mm、2.1mm。
本实施例中，所述驱动元件60的厚度为0.2mm，所述泡沫层210、所述石墨层220、所述散热层230的厚度总厚度小于0.2mm，所以需要结合所述第一支撑件810和所述第二支撑件820的高度以及第三支撑件830（实际生产中第三支撑件厚度约为0.55mm）的高度，选择将所述第三凹槽203和第四凹槽204贯通整个散热支撑层。
所述第一支撑件810支撑所述电路板30与所述第一支撑段2010，所述第二支撑件820支撑所述交接段311与所述第二支撑段2020，所述第三支撑件830支撑所述覆晶薄膜40与所述第三支撑段2030，其中，可以通过调节所述第一支撑件810和所述第二支撑件820的高度来控制所述驱动元件60和所述电路板元器件50在所述第三凹槽203和所述第四凹槽204中的高度，所述第三支撑件830用于调节所述弯折区120弯折弧度。
所述电路板元器件50焊接至所述电路板30面对所述散热支撑层20一侧并与所述电路板30电性连接，所述电路板元器件50置于所述第三凹槽203与所述电路板30之间。
所述覆晶薄膜40远离所述交接段311一侧与所述平面区1210通过异方性导电膜310相连。
所述驱动元件60焊接至所述覆晶薄膜40面对所述散热支撑层20一侧并与所述覆晶薄膜40电性连接，所述驱动元件60置于所述第四凹槽204与所述电路板30之间。
所述护板90包括第一护板910和第二护板920， 所述第一护板910置于所述散热支撑层20和所述柔性面板10之间，用以支撑所述柔性面板10；所述第二护板920置于所述弯折区120和所述第三支撑件830之间，其作用与所述第三支撑件类似，均起到调节所述弯折区120弯折弧度的作用。
如图4所示，本实施例中考虑所述电路板元器件50和所述驱动元件60的散热问题，在所述第三凹槽203和所述第四凹槽204内部贴设散热膜231，所述散热膜231材质为铜箔。
实施例3
如图5所示，本实施例中，本发明的柔性显示装置包括柔性面板10、散热支撑层20、电路板30、覆晶薄膜40、电路板元器件50、驱动元件60、偏光片70、第四支撑件840、第五支撑件850、第三支撑件830、护板90。
所述柔性面板10为柔性薄膜基板，其材质为塑料材料或金属箔，其中，
所述柔性面板10包括非弯折区110和弯折区120，非弯折区110又包括显示区域1110和非显示区域1120，偏光片70覆盖所述显示区域1110，所述弯折区120从所述非显示区域1120一侧弯曲延伸至所述散热支撑层20背对所述柔性面板10一侧并形成平面区1210。
所述散热支撑层20包括泡沫层210、石墨层220、散热层230，其中所述泡沫层210置于所述非弯折区110背对显示区域1110一面，，达到对所述柔性面板10的支撑和散热作用。同时为了达到减薄柔性显示屏的目的，本实施例中，本发明采用在所述散热支撑层20上开设第五凹槽205。
所述第五凹槽205将所述散热支撑层20分为两段，包括第四支撑段2040对应所述电路板30一侧；第五支撑段2050，对应所述平面区1210。
所述第五凹槽205用以容纳所述驱动元件60和电路板元器件50。所述第五凹槽205开口背对所述柔性面板10，所述驱动元件60和电路板元器件50置于所述第五凹槽205内。
所述第四支撑件840支撑所述电路板30与所述第四支撑段2040，所述第五支撑件850支撑所述交接段311与所述第五凹槽205。
所述电路板元器件50焊接至所述电路板30面对所述散热支撑层20一侧并与所述电路板30电性连接，所述覆晶薄膜40一端通过异方性导电膜310与所述电路板30相连，另一端通过异方性导电膜310与所述弯折区120相连 。
所述驱动元件60焊接至所述覆晶薄膜40面对所述散热支撑层20一侧并与所述覆晶薄膜40电性连接。
所述护板90包括第一护板910和第二护板920， 所述第一护板910置于所述散热支撑层20和所述柔性面板10之间，用以支撑所述柔性面板10；所述第二护板920置于所述弯折区120和所述第三支撑件830之间，其作用与所述第三支撑件类似，均起到调节所述弯折区120弯折弧度的作用。
以上仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种柔性显示装置，其中，包括
    柔性面板，包括非弯折区、连接于所述非弯折区的弯折区、及与所述弯折区相连并与所述非弯折区平行的平面区；
    散热支撑层，设置在所述非弯折区和平面区之间，所述散热支撑层朝向所述平面区的一侧设有至少一个凹槽；
    覆晶薄膜，其一侧连接于所述平面区，所述覆晶薄膜朝向所述散热支撑层的一侧设有驱动元件；
    电路板，其一侧连接于所述覆晶薄膜上，其另一侧连接于所述散热支撑层，所述电路板朝向所述散热支撑层的一侧设有电路板元器件；
    所述驱动元件和电路板元器件对应设置在所述凹槽内。
  2. 如权利要求1所述的柔性显示装置，其中，
    所述凹槽包括
    第一凹槽，对应于所述覆晶薄膜，且所述驱动元件位于所述第一凹槽中；
    第二凹槽，对应于所述电路板，且所述驱动元件位于所述第二凹槽中。
  3. 如权利要求2所述的柔性显示装置，其中，
    所述电路板与所述覆晶薄膜之间具有一交接段；
    所述第一凹槽与所述第二凹槽将所述散热支撑层分为
    第一支撑段，对应于所述平面区；以及
    第二支撑段，对应于所述电路板和所述覆晶薄膜的交接段；以及
    第三支撑段，对应于所述电路板的一侧。
  4. 如权利要求3所述的柔性显示装置，其中，还包括
    第一支撑件，支撑于所述第一支撑段和所述平面区之间；
    第二支撑件，支撑于所述第二支撑段和所述交接段之间；
    第三支撑件，支撑于所述第三支撑段和所述电路板之间。
  5. 如权利要求4所述的柔性显示装置，其中，还包括
    第一护板，置于所述非弯折区与所述散热支撑层之间；
    第二护板，置于所述第三支撑件与所述平面区之间。
  6. 如权利要求5所述的柔性显示装置，其中，
    所述散热支撑层包括
    石墨层，所述石墨层设置在靠近所述非弯折区的一侧；
    散热层，所述散热层设置在靠近所述平面区的一侧；
    泡沫层，设于所述石墨层和所述散热层之间。
  7. 如权利要求6所述的柔性显示装置，其中，
    所述凹槽贯穿整个所述散热层和所述石墨层；或
    所述凹槽贯穿整个所述散热层、所述泡沫层和所述石墨层。
  8. 如权利要求4所述的柔性显示装置，其中，还包括
    所述散热层为铜箔。
  9. 如权利要求1所述的柔性显示装置，其中，还包括
    异方性导电胶膜，所述异方性导电胶膜连接所述平面区与所述覆晶薄膜；
    所述异方性导电胶膜连接所述覆晶薄膜与所述电路板。
  10. 如权利要求1所述的柔性显示装置，其中，
    所述散热层覆盖所述凹槽内壁。
PCT/CN2019/072902 2018-12-17 2019-01-24 一种柔性显示装置 Ceased WO2020124740A1 (zh)

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