WO2020037751A1 - 全面显示屏及采用该全面显示屏的显示装置 - Google Patents

全面显示屏及采用该全面显示屏的显示装置 Download PDF

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Publication number
WO2020037751A1
WO2020037751A1 PCT/CN2018/106409 CN2018106409W WO2020037751A1 WO 2020037751 A1 WO2020037751 A1 WO 2020037751A1 CN 2018106409 W CN2018106409 W CN 2018106409W WO 2020037751 A1 WO2020037751 A1 WO 2020037751A1
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Prior art keywords
flip
display
display screen
box
chip
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PCT/CN2018/106409
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English (en)
French (fr)
Inventor
杨思捷
Original Assignee
武汉华星光电技术有限公司
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Priority to US16/316,050 priority Critical patent/US20200089041A1/en
Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Publication of WO2020037751A1 publication Critical patent/WO2020037751A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13458—Terminal pads
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133512—Light shielding layers, e.g. black matrix
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133331—Cover glasses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector

Definitions

  • the invention relates to the field of liquid crystal display, in particular to a comprehensive display screen and a display device using the comprehensive display screen.
  • the so-called screen-to-body ratio is the ratio of the screen area to the entire machine area. A higher screen-to-body ratio can bring a better visual experience to users.
  • the comprehensive display has a high screen ratio and good display effect, so the comprehensive display is more and more loved by consumers, and it has become an inevitable trend for the future development of electronic devices such as mobile phones.
  • the comprehensive display is a broad definition of the mobile phone industry for the design of ultra-high screen mobile phones.
  • the front of the phone is a screen, and the four border positions of the phone are frameless designs, pursuing a screen ratio close to 100%.
  • the full-screen mobile phones claimed by the industry for the time being are only ultra-high screen mobile phones, and there is no mobile phone that can achieve 100% of the front screen of mobile phones.
  • the full-screen mobile phone in the industry refers to a mobile phone with an ultra-narrow bezel design that can account for more than 80% of the real screen (unofficial promotion).
  • COF Chip On FPC, often referred to as flip-chip film
  • COF technology refers to a technology in which an IC chip is fabricated on a Flexible FPC (Flexible Printed Circuit).
  • COF technology is widely used in large-size panels, such as TV panels.
  • COG (Chip On Glass) technology refers to the fabrication of IC chips directly in glass panels.
  • the advantage of COG technology is that it can save FPC material costs. Therefore, COG technology is widely used in small-sized LCD panels.
  • the shortcomings of COG technology have become increasingly prominent.
  • COG technology must leave enough space on the periphery of the panel to house IC chips. .
  • small-sized panel vendors have begun to consider using COF technology.
  • the COF technology reduces the width of the border and increases the screen ratio.
  • Huawei P20 uses a COG packaging process and its screen ratio is 80.27%
  • OPPO R15 uses a COF packaging process and its screen ratio is 90%, which is higher than Huawei P20.
  • the bottom frame using the COF packaging process can be reduced by 1.5mm compared to the COG packaging process, thereby increasing the screen ratio.
  • the COF packaging process can reduce the width of the lower frame. As a result, the frame is reduced from the initial 2.0mm to 1.8mm and then to 1.6mm. It also continuously breaks the limit of the narrow frame under the COF packaging process.
  • the Notch full-screen display has increasingly higher requirements for a narrow lower bezel, and it is best to have a lower bezel; at the same time, it must meet the LCD
  • the yield rate of the box-based lighting test on the panel and the chip binding to the flexible circuit board have reached the requirements of mass production.
  • the existing notch comprehensive display COF panel design cannot meet the above requirements, and a new comprehensive display design needs to be invented.
  • the technical problem to be solved by the present invention is to provide a comprehensive display screen and a display device using the comprehensive display screen, which can achieve an ultra-narrow lower bezel, or even a bezel-free, and can simultaneously satisfy the ultra-narrow lower bezel of a comprehensive display Yield requirements for box lighting test and flip-chip film binding.
  • the present invention provides a comprehensive display screen, which includes a display unit, the display unit includes a display area and a non-display area, the upper end of the display area has a slot, and the slot is located at In the non-display area, the comprehensive display screen further includes a flip-chip thin film bonding pad and a box-forming test pad, and the flip-chip thin film bonding pad and the box-forming test pad are disposed on the Non-display area, and the flip-chip bonding pads are disposed in the notch, the box-forming test pads are disposed in the non-display area at the lower end of the display unit, and the full display screen further includes A functional component, said functional component being disposed in said slot
  • the present invention also provides a comprehensive display screen, which includes a display unit, the display unit includes a display area and a non-display area, the upper end of the display area has a slot, and the slot is located at In the non-display area, the comprehensive display screen further includes a flip-chip thin film bonding pad and a box-forming test pad, and the flip-chip thin film bonding pad and the box-forming test pad are disposed on the Non-display area, and at least one of the flip-chip bonding pads and the box-forming test pads is disposed in the slot.
  • the flip-chip bonding pads are disposed in the notch, and the box-forming test pads are disposed in a non-display area at the lower end of the display unit.
  • the box-forming test pad is disposed in the slot, and the flip-chip bonding pad is disposed in a non-display area at a lower end of the display unit.
  • the comprehensive display screen further includes a functional component, and the functional component is disposed in the slot.
  • the comprehensive display screen further includes a flip-chip film
  • the flip-chip film includes a flexible circuit board, a binding portion and a driving chip disposed on a surface of the flexible circuit board.
  • the flexible circuit board is electrically connected to the flip-chip film bonding pad through the binding portion, and is bent and extended to the back of the display unit.
  • the comprehensive display screen further includes a glass cover, and the glass cover is disposed above the display unit.
  • the glass cover has a light-shielding layer at a position corresponding to the flip-chip bonding pad and the box-forming test pad.
  • the present invention also provides a display device including a comprehensive display screen as described above and a backlight module located below the comprehensive display screen, bonding pads to the flip-chip film and the At the corresponding position of the box-forming test pad, the display device has no backlight.
  • the backlight module is blocked by a light-shielding layer at a position corresponding to the flip-chip bonding pads and the box-forming test pads.
  • the backlight module is not provided with a backlight source at a position corresponding to the flip-chip bonding pad and the box-forming test pad.
  • the advantage of the present invention is that at least one of the flip-chip film bonding pad and the box-forming test pad is disposed in the slot in the comprehensive display screen of the present invention, which can achieve an ultra-narrow bottom frame, and even It is frameless; at the same time, it can meet the requirements of the box lighting test of the ultra-narrow bottom frame of the full display and the yield of the flip-chip film binding.
  • FIG. 1 is a schematic plan view of a first embodiment of a comprehensive display screen according to the present invention.
  • FIG. 3 is a schematic top plan view of a second embodiment of a comprehensive display screen according to the present invention.
  • FIG. 4 is a schematic top plan view of a third embodiment of a comprehensive display screen according to the present invention.
  • FIG. 5 is a schematic structural diagram of a display device of the present invention.
  • FIG. 1 is a schematic top plan view of a first embodiment of a comprehensive display screen of the present invention. Please refer to FIG. 1.
  • the comprehensive display screen 1 of the present invention includes a display unit 10.
  • the display unit 10 includes a display area A and a non-display area B.
  • the non-display area B may surround the display area A, or may be provided only above and / or below the display area A.
  • the upper end of the display area A has a notch 11, and the notch 11 is located in the non-display area B, that is, no picture is displayed at the notch 11.
  • the location of the notch 11 is the non-display area B, and the other areas of the display unit 10 other than the notch 11 are the display area A, so the full display screen 1 is frameless Display.
  • the full display screen further includes a flip-chip bonding pad 12 and a box-forming test pad 13.
  • the flip-chip thin film bonding pad 12 and the box-forming test pad 13 are disposed in the non-display area B, and at least one of the flip-chip thin-film bonding pad 12 and the box-forming test pad 13 is provided.
  • One is disposed in the slot 11.
  • the flip-chip thin film bonding pads 12 and the box-forming test pads 13 are both disposed in the notch 11.
  • the full display screen further includes a flip-chip film 14.
  • FIG. 2 is a schematic structural diagram of the flip-chip film 14. Please refer to FIG. 1 and FIG. 2.
  • the flip-chip film 14 includes a flexible circuit board 141 and a bundle disposed on a surface of the flexible circuit board 141. Fixed portion 142 and a driving chip 143.
  • the flexible circuit board 141 is electrically connected to the flip-chip thin film bonding pad 12 through the binding portion 142, and the flexible circuit board 141 is bent and extended to the back of the display unit 10, and is connected to the back of the display unit 10.
  • a driving circuit (not shown in the drawing) on the back of the display unit 10 is connected.
  • the comprehensive display screen 1 further includes a functional component 15.
  • the functional component 15 is disposed in the slot 11.
  • the functional components include, but are not limited to, a camera, a sensor, and other structures.
  • the full display screen 1 further includes a glass cover 17.
  • the glass cover 17 is disposed above the display unit 10.
  • the glass cover plate 17 covers the entire surface of the display unit 10. At a position corresponding to the flip-chip bonding pad 12 and the box-forming test pad 13, the glass cover plate 17 has a light-shielding layer. 16. Avoid exposing the flip-chip thin film bonding pads 12 and the box-forming test pads 13 to the display surface of the display unit 10, which affects the beauty of the full display screen 1.
  • the dotted line is used to illustrate the flip-chip thin film bonding pad 12 and the box-forming test in the figure. ⁇ ⁇ 13 ⁇ 13 solder pads.
  • the full-screen display of the present invention includes the flip-chip bonding pads 12 and the box-forming test pads 13 in the notch 11.
  • the full-screen display has no lower frame and
  • the side frame has a non-display area B only at the notch 11, which greatly increases the screen ratio of the full display screen, and because the flip-chip thin film bonding pads 12 and the box-forming test pads 13 are not narrow.
  • the bottom frame is inside the notch 11, so it will not affect the box lighting test of the full display and the yield of the flip-chip bonding.
  • FIG. 3 is a schematic top plan view of a second embodiment of a comprehensive display screen according to the present invention.
  • the flip-chip bonding pad 12 is disposed in the notch 11, and the box-forming test pad 13 is disposed in the display unit 10.
  • the non-display area B at the lower end, that is, the box-forming test pad 13 is disposed in the lower frame of the lower end of the display unit 10.
  • the flexible circuit board 141 of the flip-chip film 14 is electrically connected to the flip-chip film bonding pad 12 through the bonding portion 142, and the flexible circuit board 141 of the flip-chip film 14 is bent.
  • the fold extends to the back of the display unit 10 and is connected to a driving circuit (not shown in the drawings) on the back of the display unit 10.
  • the comprehensive display screen 1 further includes a functional component 15.
  • the functional component 15 is disposed in the slot 11.
  • the functional components include, but are not limited to, a camera, a sensor, and other structures.
  • the full display screen 1 further includes a glass cover 17.
  • the glass cover 17 is disposed above the display unit 10.
  • the glass cover plate 17 covers the entire surface of the display unit 10. At a position corresponding to the flip-chip bonding pad 12 and the box-forming test pad 13, the glass cover plate 17 has a light-shielding layer. 16. Avoid exposing the flip-chip thin film bonding pads 12 and the box-forming test pads 13 to the display surface of the display unit 10, which affects the beauty of the comprehensive display screen 1.
  • the full-screen display of the present invention includes the flip-chip bonding pads 12 disposed in the notch 11, and the box-forming test pads 13 disposed at the lower end of the display unit 10.
  • the box-forming test pads 13 disposed at the lower end of the display unit 10.
  • FIG. 4 is a schematic plan view of a third embodiment of a comprehensive display screen according to the present invention. Please refer to FIG. 4.
  • the box-forming test pad 13 is disposed in the notch 11
  • the flip-chip bonding pad 12 is disposed on the non-top of the display unit 10.
  • the flip-chip bonding pads 12 are disposed in the lower frame of the lower end of the display unit 10.
  • the flexible circuit board 141 of the flip-chip film 14 is electrically connected to the flip-chip film bonding pad 12 through the bonding portion 142.
  • FIG. 4 in order to show the relative relationship between the flip-chip thin film 14 and the flip-chip thin-film bonding pad 12, the flip-chip thin film 14 is schematically illustrated, and in practice, the flip-chip
  • the flexible circuit board 141 of the film 14 is bent to extend to the back surface of the display unit 10 and is connected to a driving circuit (not shown in the drawing) on the back surface of the display unit 10.
  • the comprehensive display screen 1 further includes a functional component 15.
  • the functional component 15 is disposed in the slot 11.
  • the functional components include, but are not limited to, a camera, a sensor, and other structures.
  • the full display screen 1 further includes a glass cover 17.
  • the glass cover 17 is disposed above the display unit 10.
  • the glass cover plate 17 covers the entire surface of the display unit 10. At a position corresponding to the flip-chip bonding pad 12 and the box-forming test pad 13, the glass cover plate 17 has a light-shielding layer. 16. Avoid exposing the flip-chip thin film bonding pads 12 and the box-forming test pads 13 to the display surface of the display unit 10, which affects the beauty of the comprehensive display screen 1.
  • the full-screen display of the present invention sets the box-forming test pad 13 in the notch 11, and the flip-chip bonding pad 12 is provided at the lower end of the display unit 10.
  • the lower frame it can improve the problem that the narrow lower frame affects the lighting test of the box and the yield of the flip-chip film binding in the prior art.
  • FIG. 5 is a schematic structural diagram of a display device of the present invention. Please refer to FIG. 5, the display device of the present invention includes a comprehensive display screen 1 as described above and a backlight module 2 located below the comprehensive display screen 1. The full display screen 1 is used for displaying pictures, and the backlight module 2 is used for providing backlight. At positions corresponding to the flip-chip bonding pads 12 and the box-forming test pads 13, the display device has no backlight.
  • the light-shielding layer 20 is used to cover the backlight area corresponding to the flip-chip bonding pad 12 and the box-forming test pad 13 so that the bonding to the flip-chip bonding At the positions corresponding to the bonding pads 12 and the box-forming test bonding pads 13, the display device has no backlight.
  • the backlight region corresponding to the flip-chip bonding pad 12 and the box-forming test pad 13 may not A backlight source is provided so that the display device has no backlight emission at a position corresponding to the flip-chip bonding pad 12 and the box-forming test pad 13.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
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Abstract

一种全面显示屏及采用全面显示屏的显示装置，其将覆晶薄膜绑定焊垫（12）及成盒测试焊垫（13）至少其中之一设置在槽口（11）内，能够做到超窄下边框，甚至是无边框，同时可以满足全面显示屏超窄下边框的成盒点灯测试及覆晶薄膜绑定的良率的要求。

Description

全面显示屏及采用该全面显示屏的显示装置 技术领域
本发明涉及液晶显示领域，尤其涉及一种全面显示屏及采用该全面显示屏的显示装置。
 背景技术
目前全屏化手机普及程度越来越高，高屏占比的屏幕越来越受欢迎，因而催生出很多窄边框方案，主要针对的是左右边框，但是对手机来讲提高屏占比下边框一直是个很大的议题。所谓屏占比就是屏幕面积与整机面积的比例，较高的屏占比能够给用户带来更好的视觉体验。全面显示屏由于具有高屏占比，显示效果好，因此全面显示屏显示受到消费者越来越多的喜爱，成为了手机等电子设备未来发展的必然趋势。全面显示屏是手机业界对于超高屏占比手机设计的一个比较宽泛的定义。从字面上解释就是手机的正面全部都是屏幕，手机的四个边框位置都是采用无边框设计，追求接近100％的屏占比。但由于受限于目前的技术，业界宣称的全面屏手机暂时只是超高屏占比的手机，没有能做到手机正面屏占比100％的手机。现在业内所说的全面屏手机是指真实屏占比(非官方宣传)可以达到80％以上，拥有超窄边框设计的手机。
COF(Chip On FPC，常称覆晶薄膜)技术，顾名思义，是指将IC芯片制作在柔性FPC (Flexible Printed Circuit，即柔性电路板)上的一种技术。COF技术广泛应用于大尺寸面板，如电视面板上。COG(Chip On Glass常称覆晶玻璃)技术是指将IC芯片直接制作在玻璃面板内，COG技术的优点是能节约FPC材料成本，因此COG技术在小尺寸液晶面板中被广泛采用。但随着消费者对手机窄边框的需求，COG技术的缺点日益突出，COG技术必须在面板外围留出足够空间以安置IC芯片，这样就会导致面板的边框较宽，无法实现超窄边框设计。为解决超窄边框的难题，小尺寸面板商开始考虑采用COF技术。
COF技术相比常规的COG (chip on glass)设计，缩小了下边框（Border）的宽度并提高了屏占比。例如，华为P20采用COG封装工艺，其屏占比80.27%，而OPPO R15采用 COF封装工艺，其屏占比为90%，高于华为P20。采用COF封装工艺下边框较COG封装工艺可以减少1.5mm, 从而提升屏占比。COF封装工艺可以减小下边框的宽度，由此，边框由最初的2.0mm减小至1.8mm再减小至1.6mm，也在不断的突破COF封装工艺下窄边框的极限。
 技术问题
现有槽口（Notch）全面显示屏COF面板的缺点是:
（1）下边框不断变窄后，芯片绑定（Bonding）到柔性线路板上的良率降低。
（2）COF封装工艺中，当下边框的宽度为1.8mm或者1.6mm时，液晶面板上的成盒测试垫（Cell Test pad）的尺寸大幅减小，影响液晶面板的成盒点灯测试和时序（Timing）调试。
（3）无论下边框的宽度为1.8mm还是下边框的宽度1.6mm都无法做到类似Iphone X的无下边框状态，始终会有“下巴”存在。
随着中小尺寸电子显示行业日新月异的发展，COF封装工艺下，槽口（Notch）全面显示屏对窄下边框提出的要求越来越高，最好能够做到无下边框；同时还要满足液晶面板上的成盒点灯测试与芯片绑定到柔性线路板上良率达到可量产的要求。现有的槽口全面显示屏COF面板设计无法满足上述要求，需要发明新的全面显示屏设计。
 技术解决方案
本发明所要解决的技术问题是，提供一种全面显示屏及采用该全面显示屏的显示装置，其能够做到超窄下边框，甚至是无边框，同时可以满足全面显示屏超窄下边框的成盒点灯测试及覆晶薄膜绑定的良率的要求。
为了解决上述问题，本发明提供了一种全面显示屏，其包括一显示单元，所述显示单元包括一显示区及一非显示区，所述显示区上端具有一槽口，所述槽口位于所述非显示区，所述全面显示屏还包括一覆晶薄膜绑定焊垫及一成盒测试焊垫，所述覆晶薄膜绑定焊垫及所述成盒测试焊垫设置在所述非显示区，且所述覆晶薄膜绑定焊垫设置在所述槽口内，所述成盒测试焊垫设置在所述显示单元下端的所述非显示区内，所述全面显示屏还包括一功能组件，所述功能组件设置在所述槽口内
为了解决上述问题，本发明还提供了一种全面显示屏，包括一显示单元，所述显示单元包括一显示区及一非显示区，所述显示区上端具有一槽口，所述槽口位于所述非显示区，所述全面显示屏还包括一覆晶薄膜绑定焊垫及一成盒测试焊垫，所述覆晶薄膜绑定焊垫及所述成盒测试焊垫设置在所述非显示区，且所述覆晶薄膜绑定焊垫及所述成盒测试焊垫至少其中之一设置在所述槽口内。
在一实施例中，所述覆晶薄膜绑定焊垫设置在所述槽口内，所述成盒测试焊垫设置在所述显示单元下端的非显示区内。
在一实施例中，所述成盒测试焊垫设置在所述槽口内，所述覆晶薄膜绑定焊垫设置在所述显示单元下端的非显示区内。
在一实施例中，所述全面显示屏还包括功能组件，所述功能组件设置在所述槽口内。
在一实施例中，所述全面显示屏还包括一覆晶薄膜，所述覆晶薄膜包括一柔性线路板和一设置在所述柔性线路板的一表面上的一绑定部和一驱动芯片，所述柔性线路板通过所述绑定部电性连接到所述覆晶薄膜绑定焊垫并弯折延伸至所述显示单元的背面。
在一实施例中，所述全面显示屏还包括一玻璃盖板，所述玻璃盖板设置在所述显示单元上方。
在一实施例中，在与所述覆晶薄膜绑定焊垫及所述成盒测试焊垫对应位置处，所述玻璃盖板具有遮光层。
为了解决上述问题，本发明还提供一种显示装置，其包括一如上述的全面显示屏及位于所述全面显示屏下方的背光模组，在与所述覆晶薄膜绑定焊垫及所述成盒测试焊垫对应位置处，所述显示装置无背光出射。
在一实施例中，在与所述覆晶薄膜绑定焊垫及所述成盒测试焊垫对应位置处，所述背光模组被遮光层遮挡。
在一实施例中，在与所述覆晶薄膜绑定焊垫及所述成盒测试焊垫对应位置处，所述背光模组未设置背光源。
 有益效果
本发明的优点在于，本发明全面显示屏将所述覆晶薄膜绑定焊垫及所述成盒测试焊垫至少其中之一设置在所述槽口内，其能够做到超窄下边框，甚至是无边框；同时可以满足全面显示屏超窄下边框的成盒点灯测试及覆晶薄膜绑定的良率的要求。
 附图说明
图1是本发明全面显示屏第一实施例的俯视结构示意图；
图2是所述覆晶薄膜的结构示意图；
图3是本发明全面显示屏第二实施例的俯视结构示意图；
图4是本发明全面显示屏第三实施例的俯视结构示意图；
图5是本发明显示装置的一结构示意图。
 本发明的实施方式
下面结合附图对本发明提供的全面显示屏及采用该全面显示屏的显示装置的具体实施方式做详细说明。
图1是本发明全面显示屏第一实施例的俯视结构示意图，请参阅图1，本发明全面显示屏1包括一显示单元10。所述显示单元10包括一显示区A及一非显示区B。其中，所述非显示区B可以包围所述显示区A，也可以仅设置在所述显示区A的上方和/或下方。
所述显示区A上端具有一槽口11，所述槽口11位于所述非显示区B，即在所槽口11处不显示画面。在本实施例中，所述槽口11所在的位置为非显示区B，所述槽口11之外的显示单元10的其他区域均为显示区A，则所述全面显示屏1为无边框显示屏。
所述全面显示屏还包括一覆晶薄膜绑定焊垫12及一成盒测试焊垫13。所述覆晶薄膜绑定焊垫12及所述成盒测试焊垫13设置在所述非显示区B，且所述覆晶薄膜绑定焊垫12及所述成盒测试焊垫13至少其中之一设置在所述槽口11内。具体地说，在本第一实施例中，所述覆晶薄膜绑定焊垫12及所述成盒测试焊垫13均设置在所述槽口11内。
所述全面显示屏还包括一覆晶薄膜14。图2是所述覆晶薄膜14的结构示意图，请参阅图1及图2，所述覆晶薄膜14包括一柔性线路板141和一设置在所述柔性线路板141的一表面上的一绑定部142和一驱动芯片143。所述柔性线路板141通过所述绑定部142电性连接到所述覆晶薄膜绑定焊垫12，所述柔性线路板141弯折延伸至所述显示单元10的背面，并与所述显示单元10背面的驱动电路（附图中未绘示）连接。
其中，所述全面显示屏1还包括功能组件15。所述功能组件15设置在所述槽口11内。所述功能组件包括但不限于摄像头、传感器等结构。所述全面显示屏1还包括一玻璃盖板17。所述玻璃盖板17设置在所述显示单元10上方。所述玻璃盖板17覆盖所述显示单元10的整个表面，在与所述覆晶薄膜绑定焊垫12及所述成盒测试焊垫13对应位置处，所述玻璃盖板17具有遮光层16，避免所述覆晶薄膜绑定焊垫12及所述成盒测试焊垫13暴露于所述显示单元10的显示表面，影响全面显示屏1的美观。由于所述覆晶薄膜绑定焊垫12及所述成盒测试焊垫13被遮光层16遮挡，则在图中采用虚线绘示所述覆晶薄膜绑定焊垫12及所述成盒测试焊垫13。
在本第一实施例中，本发明全面显示屏将所述覆晶薄膜绑定焊垫12及所述成盒测试焊垫13均设置在槽口11内，所述全面显示屏无下边框及侧边框，仅在槽口11处具有非显示区B，大大增加了全面显示屏的屏占比，且由于覆晶薄膜绑定焊垫12及所述成盒测试焊垫13并未处于狭窄的下边框内，而是处于槽口11内，所以不会影响全面显示屏的成盒点灯测试及覆晶薄膜绑定的良率。
图3是本发明全面显示屏第二实施例的俯视结构示意图。请参阅图2及图3，在本第二实施例中，所述覆晶薄膜绑定焊垫12设置在所述槽口11内，所述成盒测试焊垫13设置在所述显示单元10下端的非显示区B内，即所述成盒测试焊垫13设置在所述显示单元10下端的下边框内。其中，所述覆晶薄膜14的柔性线路板141通过所述绑定部142电性连接到所述覆晶薄膜绑定焊垫12上，所述覆晶薄膜14的所述柔性线路板141弯折延伸至所述显示单元10的背面，并与所述显示单元10背面的驱动电路（附图中未绘示）连接。
其中，所述全面显示屏1还包括功能组件15。所述功能组件15设置在所述槽口11内。所述功能组件包括但不限于摄像头、传感器等结构。所述全面显示屏1还包括一玻璃盖板17。所述玻璃盖板17设置在所述显示单元10上方。所述玻璃盖板17覆盖所述显示单元10的整个表面，在与所述覆晶薄膜绑定焊垫12及所述成盒测试焊垫13对应位置处，所述玻璃盖板17具有遮光层16，避免所述覆晶薄膜绑定焊垫12及所述成盒测试焊垫13暴露于所述显示单元10的显示表面，影响所述全面显示屏1的美观。
在该第二实施例中，本发明全面显示屏将所述覆晶薄膜绑定焊垫12设置在所述槽口11内，所述成盒测试焊垫13设置在所述显示单元10下端的下边框内，其能够改善现有技术中窄下边框影响成盒点灯测试及覆晶薄膜绑定的良率的问题。
图4是本发明全面显示屏第三实施例的俯视结构示意图。请参阅图4，在本第三实施例中，所述成盒测试焊垫13设置在所述槽口11内，所述覆晶薄膜绑定焊垫12设置在所述显示单元10下端的非显示区B内，即所述覆晶薄膜绑定焊垫12设置在所述显示单元10下端的下边框内。
其中，所述覆晶薄膜14的柔性线路板141通过所述绑定部142电性连接到所述覆晶薄膜绑定焊垫12上。在图4中，为了显示所述覆晶薄膜14与所述覆晶薄膜绑定焊垫12之间的相对关系，示意性地绘示出覆晶薄膜14，而在实务中，所述覆晶薄膜14的所述柔性线路板141弯折延伸至所述显示单元10的背面，并与所述显示单元10背面的驱动电路（附图中未绘示）连接。
其中，所述全面显示屏1还包括功能组件15。所述功能组件15设置在所述槽口11内。所述功能组件包括但不限于摄像头、传感器等结构。所述全面显示屏1还包括一玻璃盖板17。所述玻璃盖板17设置在所述显示单元10上方。所述玻璃盖板17覆盖所述显示单元10的整个表面，在与所述覆晶薄膜绑定焊垫12及所述成盒测试焊垫13对应位置处，所述玻璃盖板17具有遮光层16，避免所述覆晶薄膜绑定焊垫12及所述成盒测试焊垫13暴露于所述显示单元10的显示表面，影响所述全面显示屏1的美观。
在该第三实施例中，本发明全面显示屏将所述成盒测试焊垫13设置在所述槽口11内，将所述覆晶薄膜绑定焊垫12设置在所述显示单元10下端的下边框内，其能够改善现有技术中窄下边框影响成盒点灯测试及覆晶薄膜绑定的良率的问题。
本发明还提供一种显示装置。图5是本发明显示装置的一结构示意图。请参阅图5，本发明显示装置包括一如上述的全面显示屏1及位于所述全面显示屏1下方的背光模组2。所述全面显示屏1用于显示画面，所述背光模组2用于提供背光。在与所述覆晶薄膜绑定焊垫12及所述成盒测试焊垫13对应位置处，所述显示装置无背光出射。其中，在本实施例中，在与所述覆晶薄膜绑定焊垫12及所述成盒测试焊垫13对应的背光区域采用遮光层20覆盖，以使在与所述覆晶薄膜绑定焊垫12及所述成盒测试焊垫13对应位置处，所述显示装置无背光出射。另外，在本发明显示装置的其他实施例中，在设计背光模组2的光源时，可以在与所述覆晶薄膜绑定焊垫12及所述成盒测试焊垫13对应的背光区域不设置背光源，从而使得在与所述覆晶薄膜绑定焊垫12及所述成盒测试焊垫13对应位置处，所述显示装置无背光出射。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。
 工业实用性
本申请的主题可以在工业中制造和使用，具备工业实用性。

Claims (11)

  1. 一种全面显示屏，其包括一显示单元，所述显示单元包括一显示区及一非显示区，所述显示区上端具有一槽口，所述槽口位于所述非显示区，所述全面显示屏还包括一覆晶薄膜绑定焊垫及一成盒测试焊垫，所述覆晶薄膜绑定焊垫及所述成盒测试焊垫设置在所述非显示区，且所述覆晶薄膜绑定焊垫设置在所述槽口内，所述成盒测试焊垫设置在所述显示单元下端的所述非显示区内，所述全面显示屏还包括一功能组件，所述功能组件设置在所述槽口内。
  2. 一种全面显示屏，其包括一显示单元，所述显示单元包括一显示区及一非显示区，所述显示区上端具有一槽口，所述槽口位于所述非显示区，所述全面显示屏还包括一覆晶薄膜绑定焊垫及一成盒测试焊垫，所述覆晶薄膜绑定焊垫及所述成盒测试焊垫设置在所述非显示区，且所述覆晶薄膜绑定焊垫及所述成盒测试焊垫至少其中之一设置在所述槽口内。
  3. 根据权利要求2所述的全面显示屏，其中所述覆晶薄膜绑定焊垫设置在所述槽口内，所述成盒测试焊垫设置在所述显示单元下端的所述非显示区内。
  4. 根据权利要求2所述的全面显示屏，其中所述成盒测试焊垫设置在所述槽口内，所述覆晶薄膜绑定焊垫设置在所述显示单元下端的所述非显示区内。
  5. 根据权利要求2所述的全面显示屏，其中所述全面显示屏还包括一功能组件，所述功能组件设置在所述槽口内。
  6. 根据权利要求2所述的全面显示屏，其中所述全面显示屏还包括一覆晶薄膜，所述覆晶薄膜包括一柔性线路板和一设置在所述柔性线路板的一表面上的一绑定部和一驱动芯片，所述柔性线路板通过所述绑定部电性连接到所述覆晶薄膜绑定焊垫并弯折延伸至所述显示单元的背面。
  7. 根据权利要求2所述的全面显示屏，其中，所述全面显示屏还包括一玻璃盖板，所述玻璃盖板设置在所述显示单元上方。
  8. 根据权利要求7所述的全面显示屏，其中在与所述覆晶薄膜绑定焊垫及所述成盒测试焊垫对应位置处，所述玻璃盖板具有一遮光层。
  9. 一种显示装置，其包括一如权利要求2所述的全面显示屏及位于所述全面显示屏下方的背光模组，在与所述覆晶薄膜绑定焊垫及所述成盒测试焊垫对应位置处，所述显示装置无背光出射。
  10. 根据权利要求9所述的显示装置，其中在与所述覆晶薄膜绑定焊垫及所述成盒测试焊垫对应位置处，所述背光模组被一遮光层遮挡。
  11. 根据权利要求9所述的显示装置，其中在与所述覆晶薄膜绑定焊垫及所述成盒测试焊垫对应位置处，所述背光模组未设置一背光源。
PCT/CN2018/106409 2018-08-24 2018-09-19 全面显示屏及采用该全面显示屏的显示装置 WO2020037751A1 (zh)

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