WO2020107654A1 - 显示屏及显示装置 - Google Patents

显示屏及显示装置 Download PDF

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Publication number
WO2020107654A1
WO2020107654A1 PCT/CN2019/070622 CN2019070622W WO2020107654A1 WO 2020107654 A1 WO2020107654 A1 WO 2020107654A1 CN 2019070622 W CN2019070622 W CN 2019070622W WO 2020107654 A1 WO2020107654 A1 WO 2020107654A1
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WO
WIPO (PCT)
Prior art keywords
display area
display screen
display
chip
circuit board
Prior art date
Application number
PCT/CN2019/070622
Other languages
English (en)
French (fr)
Inventor
李明娟
Original Assignee
武汉华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US16/344,055 priority Critical patent/US20210333841A1/en
Publication of WO2020107654A1 publication Critical patent/WO2020107654A1/zh

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1686—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being an integrated camera
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays

Definitions

  • the present disclosure relates to the field of display technology, in particular to a display screen and a display device.
  • the special-shaped structure will not only cause the integrated circuit (Integrated) Circuit (IC) chip or chip on chip (chip on film, COF), the lower border is wider, and the special-shaped structure of the upper border will also cause a wider border feeling, reducing the screen ratio of the display, thereby affecting the user's overall screen experience.
  • IC integrated circuit
  • COF chip on film
  • the present disclosure provides a display screen and a display device thereof, which solves the technical problem that the irregular-shaped screen structure not only causes the lower frame of the IC chip or COF to be wider, but also the irregular-shaped structure causes the upper frame to be wider.
  • An embodiment of the present disclosure provides a display screen.
  • the irregular-shaped structure of the display screen is a notch type.
  • the display screen includes:
  • a non-display area the non-display area surrounding the display area, the non-display area includes a first non-display area and a second non-display area, and the first non-display area is located on both sides of the second non-display area side;
  • the front sensor is arranged in the second non-display area
  • a flexible circuit board connected to the end of the display screen
  • At least one IC chip is installed in the first non-display area and connected with the signal line of the flexible circuit board for driving the display screen.
  • both the first non-display area and the second non-display area are located at the top of the display screen.
  • the non-display area further includes a third non-display area, and the third non-display area is located on opposite sides of the display screen and a lower border of the display screen.
  • the IC chips are respectively located on opposite sides of the second non-display area.
  • the IC chip is located on either side of the second non-display area.
  • the size and length of the IC chip is smaller than the length of one side of the corresponding first non-display area.
  • the shape of the second non-display area is one of a triangle, a polygon and a circle.
  • the IC chip is disposed on the flexible circuit board to form a flip chip.
  • the display screen provided by the embodiment of the present disclosure further includes an anisotropic conductive adhesive, and the IC chip and the flexible circuit board are connected by the anisotropic conductive adhesive.
  • An embodiment of the present disclosure provides a display screen, including:
  • a non-display area the non-display area surrounding the display area, the non-display area includes a first non-display area and a second non-display area, and the first non-display area is located on both sides of the second non-display area side;
  • the front sensor is arranged in the second display area
  • a flexible circuit board connected to the end of the display screen
  • At least one IC chip is installed in the first non-display area and connected with the signal line of the flexible circuit board for driving the display screen.
  • both the first non-display area and the second non-display area are located at the top of the display screen.
  • the non-display area further includes a third non-display area, and the third non-display area is located on opposite sides of the display screen and a lower border of the display screen.
  • the IC chips are respectively located on opposite sides of the second non-display area.
  • the IC chip is located on either side of the second non-display area.
  • the size and length of the IC chip is smaller than the length of one side of the corresponding first non-display area.
  • the shape of the second non-display area is one of a triangle, a polygon and a circle.
  • the IC chip is disposed on the flexible circuit board to form a flip chip.
  • the display screen provided by the embodiment of the present disclosure further includes an anisotropic conductive adhesive, and the IC chip and the flexible circuit board are connected by the anisotropic conductive adhesive.
  • the display screen is a liquid crystal display screen or an organic light-emitting display screen.
  • An embodiment of the present disclosure provides a display device including the above display screen.
  • the display screen and the display device provided by the embodiments of the present disclosure invert the IC chip or COF originally arranged on the lower frame and set it in the first non-display area located on the upper frame, thereby realizing the display screen
  • the narrow border of the lower border further improves the screen ratio.
  • FIG. 1A to 1F are schematic structural diagrams of a display screen provided by Embodiment 1 of the present disclosure.
  • 2A ⁇ 2F are schematic structural diagrams of a display screen provided by Embodiment 2 of the present disclosure.
  • FIG. 3 is a schematic cross-sectional structural diagram of a display device provided by Embodiment 3 of the present disclosure.
  • the present disclosure is directed to the display screen and the display device in the prior art.
  • the special-shaped screen structure will not only cause the lower frame to place the IC chip or COF to be wider, but also the special-shaped structure will cause the upper frame to be wider. This embodiment can solve this defect.
  • the special-shaped structure of the display screen provided in this embodiment is a notch (notch) type.
  • the display screen 100 provided in this embodiment includes: a display area 11;
  • a non-display area 10 the non-display area 10 surrounding the display area 11, the non-display area 10 includes a first non-display area 101, a second non-display area 102, the first non-display area 101 is located in the Both sides of the second non-display area 102; both the first non-display area and the second non-display area are located at the top of the display screen.
  • the front sensor 12 is disposed in the second non-display area 102;
  • a flexible circuit board 13 connected to the end of the display screen 100;
  • At least one IC chip 14 is installed in the first non-display area 101 and is connected to the signal line of the flexible circuit board 13 for driving the display screen 100.
  • the non-display area further includes a third non-display area 103, and the third non-display area is located on opposite sides of the display screen 100 and a lower border of the display screen 100.
  • the flexible circuit board 13 is connected to the end of the display screen 100, for example, a part of the flexible circuit board 13 is connected to the pad located in the first non-display area 101 of the display screen 100 section.
  • the IC chip 14 may be directly mounted on the substrate in the first non-display area 101, which is connected to the signal line of the flexible circuit board 13, and the IC chip 14 is used for driving a display panel.
  • the control signal generated by the driving circuit board (not shown in the figure) is supplied to the IC chip 14 through the flexible circuit board 13.
  • the IC chip 14 sends the output driving signal to the display panel of the display screen 100, specifically sending a signal for displaying an image to a pixel, and the IC chip 14 may be a scan driving circuit or a data driving circuit, wherein The scan drive circuit can generate scan signals, and the data drive circuit can generate data signals.
  • the second non-display area 102 in this embodiment is usually located in the middle of the frame area on the display screen 100, that is, the first non-display areas on both sides of the second non-display area 102 The length of one side of 101 remains the same.
  • a front sensor 12 is provided in the second non-display area 102, and the front sensor 12 may be an optical sensor, which is convenient for a user to use the optical sensor to take an image.
  • the length of the second non-display area 102 is large, resulting in the length of one side of the first non-display area 101 being smaller than the length of a single IC chip, therefore, a plurality of IC chips 14 of a smaller length may be used to replace a single IC chip 14, specifically, at least one IC chip 14 of a smaller length is respectively provided in the first non-display area 101 on opposite sides of the second non-display area 102, to Realize display panel drive. Therefore, the size of the IC chip 14 with a smaller length is smaller than the length of the corresponding one side of the first non-display area 101, so that one side of the first non-display area 101 can accommodate the IC chip 14 .
  • the IC chip 14 with a smaller length can be disposed on the flexible circuit board 13 , So that the flexible circuit board 13 carrying the IC chip 14 is a COF 15, and the IC chip 14 passes through an anisotropic conductive adhesive film (Anisotropic Conductive Film (ACF) is bonded to the flexible circuit board 13 to complete the packaging of the IC chip 14. Then, the COF 15 is placed in the first non-display area 101 on opposite sides of the second non-display area 102.
  • ACF anisotropic Conductive Film
  • the COF packaging method can effectively reduce the width of the upper frame, thereby increasing the size of the screen ratio of the display screen 100.
  • the first A single IC chip 14 can be completely placed on one side of the non-display area. Therefore, a single IC chip 14 can be placed on any single side of the first non-display area 101, that is, the second non-display area Either side of the display area 102.
  • the single IC chip 14 is installed in the first non-display area 101 on the left side of the second non-display area 102; as shown in FIG. 1D, the single IC chip 14 is installed in Located in the first non-display area 101 on the right side of the second non-display area 102.
  • a single IC chip 14 may be provided on the flexible circuit board 13 by COF packaging, so that the flexible circuit carrying the IC chip 14
  • the board 13 is a COF 15, and then the COF 15 is placed on any one side of the first non-display area 101.
  • 1E places the COF 15 in the first non-display area 101 on the left side of the second non-display area 102;
  • FIG. 1F places the COF 15 on the right side of the second non-display area 102 on the right side A non-display area 101.
  • the display screen 100 provided in this embodiment may be a liquid crystal display screen or an organic light-emitting display screen.
  • the fan-out trace located in the first non-display area of the display screen 100 has one end connected to the IC chip 14 and the other end connected to a plurality of scan lines provided in the display area 11
  • the IC chip 14 provides a scan signal to the scan line through the fan-out trace.
  • the flexible circuit board 13 is electrically connected to the bonding terminals located on the first non-display area 101 through an anisotropic conductive adhesive. The position of the bonding terminal corresponds to the position of the flexible circuit board 13.
  • the second non-display area Bonding terminals are respectively provided in the first non-display area 101 on opposite sides of the area 102; when the IC chip 14 is placed on any one side of the first non-display area 101, the Bonding terminals are provided on any one side of the first non-display area 101.
  • the arrangement of the fan-out wiring also changes accordingly.
  • the special-shaped structure of the display screen may be one of a triangle, a polygon and a circle
  • the circle here may include an ellipse, a circle, etc.
  • the polygon here may include a rectangle or other polygons, etc.
  • the second non-display area may have various shapes, and the shape of the second non-display area may be set according to the shape of the placed front sensor and the screen ratio of the display screen.
  • the shape of the second non-display area may be a notch type or a water drop type.
  • FIG. 2A it is a schematic structural diagram of a display screen 200 with a special-shaped structure and a drop-shaped structure provided by this embodiment.
  • the display screen 200 provided in this embodiment includes:
  • the front sensor 22 is disposed in the second non-display area 202;
  • the flexible circuit board 23 is connected to the end of the display screen 200;
  • At least one IC chip 24 is installed in the first non-display area 201 and connected to the signal line of the flexible circuit board 23 for driving the display panel.
  • the non-display area further includes a third non-display area 203, which is located on opposite sides of the display screen 200 and a lower border of the display screen 200.
  • the display screen 200 with a special-shaped structure and a drop-shaped structure provided in this embodiment is similar to the display screen 100 with a notch-shaped structure and a different-shaped structure provided in the first embodiment.
  • the difference is that in this embodiment, the second The length of the non-display area 202 is smaller than the second non-display area 102 of the display screen 100, therefore, the length of the first non-display area 201 is shorter than the length of the first non-display area 101 of the display screen 100 Big.
  • a plurality of IC chips 24 of a smaller length may be used to replace the original A single IC chip, specifically, at least one IC chip 24 of a smaller length is respectively disposed in the first non-display area 201 on opposite sides of the second non-display area 202 to implement a display panel drive. Therefore, the size and length of the IC chip 24 are smaller than the corresponding one-sided length of the first non-display area 201, so that one side of the first non-display area 201 can accommodate the IC chip 24.
  • the IC chip 24 with a smaller length can be disposed on the flexible circuit board 13 So that the flexible circuit board 23 carrying the IC chip 24 is a COF 25, and the IC chip 24 passes through an anisotropic conductive adhesive film (Anisotropic Conductive Film (ACF) is bonded to the flexible circuit board 23 to complete the packaging of the IC chip 24. Then, the COF 25 is placed in the first non-display area 201 on opposite sides of the second non-display area 202.
  • the COF packaging method can effectively reduce the width of the upper frame, thereby increasing the size of the screen ratio of the display screen 200.
  • the length of the first non-display area 201 in this embodiment is larger than that of the first non-display area 101 in the first embodiment, for the display screen 200 of this embodiment, all The IC chip 24 is placed on any one side of the first non-display area 201, which is easier than the display screen 100 provided in the first embodiment. Therefore, when the length of the second non-display area 202 is small, and the length of one side of the first non-display area 201 is greater than the length of a single IC chip 24, the IC chip 24 may be placed on the Any one side of the first non-display area 201, that is, either side of the second non-display area 202.
  • the single IC chip 24 is installed in the first non-display area 201 on the left side of the second non-display area 202; as shown in FIG. 2D, the single IC chip 24 is installed in Located in the first non-display area 201 on the right side of the second non-display area 202.
  • a single IC chip 24 may be provided on the flexible circuit board 23 in a COF packaging manner, so that the flexible circuit carrying the IC chip 24
  • the board 23 is a COF 25, and then the COF 25 is placed on any one side of the first non-display area 201.
  • the COF 25 is placed in the first non-display area 201 on the left side of the second non-display area 202; as shown in FIG. 2F, the COF 25 is placed on the right side of the second non-display area 202.
  • the first non-display area 201 Within the first non-display area 201.
  • the display screen 200 provided in this embodiment may be a liquid crystal display screen or an organic light-emitting display screen.
  • one end of the fan-out trace located in the first non-display area of the display screen 200 is connected to the IC chip 24, and the other end is connected to a plurality of scan lines provided in the display area 21
  • the IC chip 24 provides a scan signal to the scan line through the fan-out trace.
  • the flexible circuit board 23 is electrically connected to the bonding terminals located on the first non-display area 201 through an anisotropic conductive adhesive, and the positions of the bonding terminals correspond to the positions of the flexible circuit board 23.
  • the second non-display area Bonding terminals are respectively provided in the first non-display area 201 on opposite sides of the area 202; when the IC chip 24 is placed on any one side of the first non-display area 201, the Bonding terminals are provided on any one side of the first non-display area 201.
  • the arrangement of the fan-out wiring also changes accordingly.
  • an embodiment of the present disclosure further provides a display device 300.
  • the display device includes a backlight module 31 and a display screen 32 disposed on the backlight module 31.
  • the display screen 32 adopts the Display screen
  • the display device may be a mobile phone, or various electronic devices, such as smart tablets, e-book readers, MP3 players (Moving Picture Experts Group Audio Layer III, motion picture experts compressed standard audio layer 3), MP4(Moving Picture Experts Group Audio Layer IV, motion picture expert compression standard audio layer 4) Players, laptops and desktop computers, etc.
  • the display device provided in this embodiment has a large screen-to-body ratio.
  • the display screen and the display device provided by the embodiments of the present disclosure invert the IC chip or COF originally arranged on the lower frame and set it in the first non-display area located on the upper frame, thereby realizing the lower frame of the display screen Narrow bezels further improve screen ratio.

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  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
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Abstract

一种显示屏（100）及显示装置（300），包括：显示区（11）；非显示区（10）围绕显示区（11），包括第一非显示区（101）和第二非显示区（102）；前置传感器（12）；柔性电路板（13）连接于显示屏（100）的端部；至少一IC芯片（14），安装于第一非显示区（101）内，与柔性电路板（13）相连接，通过将下边框的IC芯片（14）或COF倒置，设置于第一非显示区（101），从而实现窄边框化，提高屏占比。

Description

显示屏及显示装置 技术领域
本揭示涉及显示技术领域，尤其涉及一种显示屏及显示装置。
 背景技术
随着显示屏的广泛应用以及显示屏使用者对屏幕显示的形状多元化及全面屏体验的高要求，异型等类型的显示器越来越多地取代了四方形显示器。然而，该异形结构不仅会造成显示屏放置集成电路(Integrated Circuit，IC）芯片或覆晶薄膜(chip on film, COF)的下边框较宽，而且上边框的异型结构也会造成较宽的边框感，降低了该显示屏的屏占比，从而影响了用户的全面屏体验。
因此，需要提供一种新的显示屏及其显示装置，来解决上述技术问题。
 技术问题
本揭示提供一种显示屏及其显示装置，解决了异形屏结构不仅会导致放置IC芯片或COF的下边框较宽，而且异形结构同时会导致上边框较宽的技术问题。
 技术解决方案
为解决上述问题，本揭示实施例提供的技术方案如下：
本揭示实施例提供一种显示屏，所述显示屏的异形结构为缺口型，所述显示屏包括：
显示区；
非显示区，所述非显示区围绕所述显示区，所述非显示区包括第一非显示区和第二非显示区，所述第一非显示区位于所述第二非显示区的两侧；
前置传感器，设置于所述第二非显示区内；
柔性电路板，连接于所述显示屏的端部；以及
至少一IC芯片，安装于所述第一非显示区内，且与所述柔性电路板的信号线相连接，用于所述显示屏的驱动。
根据本揭示实施例提供的显示屏，所述第一非显示区与所述第二非显示区均位于所述显示屏的顶端。
根据本揭示实施例提供的显示屏，所述非显示区还包括第三非显示区，所述第三非显示区位于所述显示屏的相对两侧及所述显示屏的下边框。
根据本揭示实施例提供的显示屏，所述IC芯片分别位于所述第二非显示区的相对两侧。
根据本揭示实施例提供的显示屏，所述IC芯片位于所述第二非显示区的任意一侧。
根据本揭示实施例提供的显示屏，所述IC芯片的尺寸长度小于其对应的所述第一非显示区的单边长度。
根据本揭示实施例提供的显示屏，所述第二非显示区的形状为三角形、多边形以及圆形中的一种。
根据本揭示实施例提供的显示屏，所述IC芯片设置于所述柔性电路板上以形成覆晶薄膜。
根据本揭示实施例提供的显示屏，还包括异方性导电胶，所述IC芯片与所述柔性电路板通过所述异方性导电胶连接。
本揭示实施例提供一种显示屏，包括：
显示区；
非显示区，所述非显示区围绕所述显示区，所述非显示区包括第一非显示区和第二非显示区，所述第一非显示区位于所述第二非显示区的两侧；
前置传感器，设置于所述第二显示区内；
柔性电路板，连接于所述显示屏的端部；以及
至少一IC芯片，安装于所述第一非显示区内，且与所述柔性电路板的信号线相连接，用于所述显示屏的驱动。
根据本揭示实施例提供的显示屏，所述第一非显示区与所述第二非显示区均位于所述显示屏的顶端。
根据本揭示实施例提供的显示屏，所述非显示区还包括第三非显示区，所述第三非显示区位于所述显示屏的相对两侧及所述显示屏的下边框。
根据本揭示实施例提供的显示屏，所述IC芯片分别位于所述第二非显示区的相对两侧。
根据本揭示实施例提供的显示屏，所述IC芯片位于所述第二非显示区的任意一侧。
根据本揭示实施例提供的显示屏，所述IC芯片的尺寸长度小于其对应的所述第一非显示区的单边长度。
根据本揭示实施例提供的显示屏，所述第二非显示区的形状为三角形、多边形以及圆形中的一种。
根据本揭示实施例提供的显示屏，所述IC芯片设置于所述柔性电路板上以形成覆晶薄膜。
根据本揭示实施例提供的显示屏，还包括异方性导电胶，所述IC芯片与所述柔性电路板通过所述异方性导电胶连接。
根据本揭示实施例提供的显示屏，所述显示屏为液晶显示屏或有机发光显示屏。
本揭示实施例提供一种显示装置，所述显示装置包括上述显示屏。
 有益效果
本揭示的有益效果为：本揭示实施例提供的显示屏及其显示装置，将原本设置在下边框的IC芯片或COF进行倒置，设置于位于上边框的第一非显示区，从而实现该显示屏的下边框的窄边框化，进一步提高屏占比。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是揭示的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1A~1F为本揭示实施例一提供的显示屏的结构示意图；
图2A~2F为本揭示实施例二提供的显示屏的结构示意图；以及
图3为本揭示实施例三提供的显示装置截面结构示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本揭示可用以实施的特定实施例。本揭示所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本揭示，而非用以限制本揭示。在图中，结构相似的单元是用以相同标号表示。
本揭示针对现有技术的显示屏及其显示装置，异形屏结构不仅会导致放置IC芯片或COF的下边框较宽，而且异形结构也会导致上边框较宽，本实施例能够解决该缺陷。
实施例一
如图1A所示，本实施例提供的显示屏的异形结构为notch（缺口）型，本实施例提供的显示屏100包括：显示区11；
非显示区10，所述非显示区10围绕所述显示区11，所述非显示区10包括第一非显示区101、第二非显示区102，所述第一非显示区101位于所述第二非显示区102的两侧；所述第一非显示区与所述第二非显示区均位于所述显示屏的顶端。
前置传感器12，设置于所述第二非显示区102内；
柔性电路板13，连接于所述显示屏100的端部；以及
至少一IC芯片14，安装于所述第一非显示区101内，且与所述柔性电路板13的信号线相连接，用于显示屏100的驱动。
同时，所述非显示区还包括第三非显示区103，所述第三非显示区位于所述显示屏100的相对两侧及所述显示屏100的下边框。
其中，所述柔性电路板13连接于所述显示屏100的端部，例如，所述柔性电路板13的一部分连接到位于所述显示屏100的所述第一非显示区101内的焊盘部分。所述IC芯片14可直接安装于所述第一非显示区101内的基板上，其与所述柔性电路板13的信号线相连接，所述IC芯片14用于显示面板的驱动。驱动电路基板（图中未示出）产生的控制信号通过所述柔性电路板13提供给所述IC芯片14。所述IC芯片14将输出的驱动信号发送至所述显示屏100的显示面板，具体为将用于显示图像的信号发送到像素，所述IC芯片14可为扫描驱动电路或数据驱动电路，其中，扫描驱动电路可以产生扫描信号，数据驱动电路可以产生数据信号。
为了迎合用户的使用习惯，本实施例中的第二非显示区102通常位于所述显示屏100上边框区域的中部位置，即位于所述第二非显示区102两侧的第一非显示区101的单边长度保持相等。在所述第二非显示区102内设置有前置传感器12，所述前置传感器12可为光学传感器，便于用户使用该光学传感器进行拍摄图像。
当所述第二非显示区102的长度较大，导致所述第一非显示区101的单边长度小于单个IC芯片的长度时，因此，可使用多个较小长度的所述IC芯片14进行替代单个IC芯片14，具体为，在位于所述第二非显示区102的相对两侧的所述第一非显示区101内分别设置有至少一个较小长度的所述IC芯片14，以实现显示面板驱动。因此，较小长度的所述IC芯片14的尺寸长度小于其对应的所述第一非显示区101的单边长度，使得所述第一非显示区101的单边可容纳所述IC芯片14。
如图1B所示，所述IC芯片14除了直接安装在所述第一非显示区101内的基板上以外，还可将较小长度的所述IC芯片14设置于所述柔性电路板13上，使得载有所述IC芯片14的所述柔性电路板13为COF15，所述IC芯片14通过异方性导电胶膜(Anisotropic Conductive Film，ACF)与所述柔性电路板13进行贴合，从而完成所述IC芯片14的封装。然后将所述COF15放置于位于所述第二非显示区102的相对两侧的所述第一非显示区101内。采用COF封装的方法可有效降低所述上边框的宽度，从而提高所述显示屏100的屏占比的大小。
如图1C、1D所示，当所述第二非显示区102的长度较小，所述第一非显示区101的单边长度大于原来的单个IC芯片14的长度时，即所述第一非显示区的单边可完全放置单个所述IC芯片14，因此，可选择将单个所述IC芯片14放置于所述第一非显示区101的任一单边处，即所述第二非显示区102的任意一侧。如图1C所示，将单个所述IC芯片14安装于位于所述第二非显示区102左侧的第一非显示区101内；如图1D所示，将单个所述IC芯片14安装于位于所述第二非显示区102右侧的第一非显示区101内。
如图1E、图1F所示，同样地，也可采用COF封装的方式，将单个所述IC芯片14设置于所述柔性电路板13上，使得载有所述IC芯片14的所述柔性电路板13为COF15，然后将所述COF15放置于所述第一非显示区101的任一单边处。其中，图1E将所述COF15放置在位于所述第二非显示区102左侧的第一非显示区101内；图1F将所述COF15放置在所述第二非显示区102右侧的第一非显示区101内。
本实施例提供的显示屏100可以是液晶显示屏，也可以是有机发光显示屏。在本实施例中，位于所述显示屏100的所述第一非显示区的扇出走线，其一端连接所述IC芯片14，另一端与设置于所述显示区11内的多条扫描线进行电连接，所述IC芯片14通过所述扇出走线向所述扫描线提供扫描信号。所述柔性电路板13通过异方性导电胶与位于所述第一非显示区101上的邦定端子进行电连接。所述邦定端子的位置与所述柔性电路板13的位置相互对应。例如，当在位于所述第二非显示区102的相对两侧的所述第一非显示区101内分别设置有至少一个较小长度的所述IC芯片14时，在所述第二非显示区102相对两侧的所述第一非显示区101内分别设置有邦定端子；当将所述IC芯片14放置于所述第一非显示区101的任一单边处时，在所述第一非显示区101的任一单边处设置有邦定端子。同时，所述扇出走线的排列方式也相应地发生变化。
实施例二
由于，显示屏的异形结构可以为三角形、多边形以及圆形中的一种，此处的圆形可以包括椭圆形、类圆形等等，此处的多边形可以包括矩形或其他多边形等等，也就是说，所述第二非显示区可以为各种形状，所述第二非显示区的形状可根据放置的前置传感器的形状以及该显示屏的屏占比的要求来设置。在实施例一中，第二非显示区的形状可以示notch型，或者也可以是水滴型。
如图2A所示为本实施例提供的异形结构形状为水滴型的显示屏200的结构示意图。本实施例提供的所述显示屏200包括：
显示区21；
非显示区20，所述非显示区20围绕所述显示区21，所述非显示区20包括第一非显示区201、第二非显示区202，所述第一非显示区201位于所述第二非显示区202的两侧；所述第一非显示区201与所述第二非显示区202均位于所述显示区21的顶端；
前置传感器22，设置于所述第二非显示区202内；
柔性电路板23，连接于所述显示屏200的端部；
至少一IC芯片24，安装于所述第一非显示区201，且与所述柔性电路板23的信号线相连接，用于显示面板的驱动。
同时，所述非显示区还包括第三非显示区203，所述第三非显示区位于所述显示屏200的相对两侧及所述显示屏200的下边框。
本实施例提供的异形结构形状为水滴型的显示屏200与实施例一提供的异形结构形状为notch型的显示屏100的结构相似，不同之处在于，在本实施例中，所述第二非显示区202的长度相比显示屏100的第二非显示区102较小，因此，所述第一非显示区201的长度相比所述显示屏100的第一非显示区101的长度较大。
如图2A所示，与实施例一相同，当所述第一非显示区201的单边长度小于单个所述IC芯片的长度时，可使用多个较小长度的IC芯片24进行替代原来的单个IC芯片，具体为，在位于所述第二非显示区202的相对两侧的所述第一非显示区201内分别设置有至少一个较小长度的所述IC芯片24，以实现显示面板驱动。因此，所述IC芯片24的尺寸长度小于其对应的所述第一非显示区201的单边长度，使得所述第一非显示区201的单边可容纳所述IC芯片24。
如图2B所示，所述IC芯片24除了直接安装在所述第一非显示区201内的基板上以外，还可将较小长度的所述IC芯片24设置于所述柔性电路板13上，使得载有IC芯片24的所述柔性电路板23为COF25，所述IC芯片24通过异方性导电胶膜(Anisotropic Conductive Film，ACF)与所述柔性电路板23进行贴合，从而完成所述IC芯片24的封装。然后将所述COF25放置于位于所述第二非显示区202的相对两侧的所述第一非显示区201内。采用COF封装的方法可有效降低所述上边框的宽度，从而提高所述显示屏200的屏占比的大小。
由于本实施例中所述第一非显示区201的长度相比实施例一种的第一非显示区101的长度较大，因此，对于本实施例的所述显示屏200来说，将所述IC芯片24放置于所述第一非显示区201的任一单边处，相对于实施例一提供的显示屏100更为容易。因此，当所述第二非显示区202的长度较小，所述第一非显示区201的单边长度大于单个所述IC芯片24的长度时，可选择将所述IC芯片24放置于所述第一非显示区201的任一单边处，即所述第二非显示区202的任意一侧。
如图2C所示，将单个所述IC芯片24安装于位于所述第二非显示区202左侧的第一非显示区201内；如图2D所示，将单个所述IC芯片24安装于位于所述第二非显示区202右侧的第一非显示区201内。
如图2E、图2F所示，同样地，也可采用COF封装的方式，将单个所述IC芯片24设置于所述柔性电路板23上，使得载有所述IC芯片24的所述柔性电路板23为COF25，然后将所述COF25放置于所述第一非显示区201的任一单边处。其中，如图2E将所述COF25放置于所述第二非显示区202左侧的第一非显示区201内；如图2F将所述COF25放置于所述第二非显示区202右侧的第一非显示区201内。
本实施例提供的显示屏200可以是液晶显示屏，也可以是有机发光显示屏。在本实施例中，位于所述显示屏200的所述第一非显示区的扇出走线，其一端连接所述IC芯片24，另一端与设置于所述显示区21内的多条扫描线进行电连接，所述IC芯片24通过所述扇出走线向所述扫描线提供扫描信号。所述柔性电路板23通过异方性导电胶与位于所述第一非显示区201上的邦定端子进行电连接，所述邦定端子的位置与所述柔性电路板23的位置相互对应。例如，当在位于所述第二非显示区202的相对两侧的所述第一非显示区201内分别设置有至少一个较小长度的所述IC芯片24时，在所述第二非显示区202相对两侧的所述第一非显示区201内分别设置有邦定端子；当将所述IC芯片24放置于所述第一非显示区201的任一单边处时，在所述第一非显示区201的任一单边处设置有邦定端子。同时，所述扇出走线的排列方式也相应地发生变化。实施例三
如图3所示，本揭示实施例还提供一显示装置300，所述显示装置包括背光模组31及设置在背光模组31上的显示屏32，所述显示屏32采用上述实施例中的显示屏，该显示装置可为手机，也可为各种电子设备，例如智平板电脑、电子书阅读器、 MP3播放器(Moving Picture Experts Group Audio Layer III，动态影像专家压缩标准音频层面3)、MP4(Moving Picture Experts Group Audio Layer IV，动态影像专家压缩标准音频层面4)播放器、膝上型便携计算机和台式计算机等等。本实施例提供的显示装置具有较大的屏占比。
有益效果为：本揭示实施例提供的显示屏及其显示装置，将原本设置在下边框的IC芯片或COF进行倒置，设置于位于上边框的第一非显示区，从而实现该显示屏的下边框窄边框化，进一步提高屏占比。
综上所述，虽然本揭示已以优选实施例揭露如上，但上述优选实施例并非用以限制本揭示，本领域的普通技术人员，在不脱离本揭示的精神和范围内，均可作各种更动与润饰，因此本揭示的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种显示屏，其中所述显示屏的异形结构为缺口型，所述显示屏包括：
    显示区；
    非显示区，所述非显示区围绕所述显示区，所述非显示区包括第一非显示区和第二非显示区，所述第一非显示区位于所述第二非显示区的两侧；
    前置传感器，设置于所述第二非显示区内；
    柔性电路板，连接于所述显示屏的端部；以及
    至少一IC芯片，安装于所述第一非显示区内，且与所述柔性电路板的信号线相连接，用于所述显示屏的驱动。
  2. 根据权利要求1所述的显示屏，其中所述第一非显示区与所述第二非显示区均位于所述显示屏的顶端。
  3. 根据权利要求1所述的显示屏，其中所述非显示区还包括第三非显示区，所述第三非显示区位于所述显示屏的相对两侧及所述显示屏的下边框。
  4. 根据权利要求1所述的显示屏，其中所述IC芯片分别位于所述第二非显示区的相对两侧。
  5. 根据权利要求1所述的显示屏，其中所述IC芯片位于所述第二非显示区的任意一侧。
  6. 根据权利要求4所述的显示屏，其中所述IC芯片的尺寸长度小于其对应的所述第一非显示区的单边长度。
  7. 根据权利要求1所述的显示屏，其中所述第二非显示区的形状为三角形、多边形以及圆形中的一种。
  8. 根据权利要求1所述的显示屏，其中所述IC芯片设置于所述柔性电路板上以形成覆晶薄膜。
  9. 根据权利要求8所述的显示屏，其中还包括异方性导电胶，所述IC芯片与所述柔性电路板通过所述异方性导电胶连接。
  10. 一种显示屏，其中所述显示屏包括：
    显示区；
    非显示区，所述非显示区围绕所述显示区，所述非显示区包括第一非显示区和第二非显示区，所述第一非显示区位于所述第二非显示区的两侧；
    前置传感器，设置于所述第二非显示区内；
    柔性电路板，连接于所述显示屏的端部；以及
    至少一IC芯片，安装于所述第一非显示区内，且与所述柔性电路板的信号线相连接，用于所述显示屏的驱动。
  11. 根据权利要求10所述的显示屏，其中所述第一非显示区与所述第二非显示区均位于所述显示屏的顶端。
  12. 根据权利要求10所述的显示屏，其中所述非显示区还包括第三非显示区，所述第三非显示区位于所述显示屏的相对两侧及所述显示屏的下边框。
  13. 根据权利要求10所述的显示屏，其中所述IC芯片分别位于所述第二非显示区的相对两侧。
  14. 根据权利要求10所述的显示屏，其中所述IC芯片位于所述第二非显示区的任意一侧。
  15. 根据权利要求13所述的显示屏，其中所述IC芯片的尺寸长度小于其对应的所述第一非显示区的单边长度。
  16. 根据权利要求10所述的显示屏，其中所述第二非显示区的形状为三角形、多边形以及圆形中的一种。
  17. 根据权利要求10所述的显示屏，其中所述IC芯片设置于所述柔性电路板上以形成覆晶薄膜。
  18. 根据权利要求17所述的显示屏，其中还包括异方性导电胶，所述IC芯片与所述柔性电路板通过所述异方性导电胶连接。
  19. 根据权利要求10所述的显示屏，其中所述显示屏为液晶显示屏或有机发光显示屏。
  20. 一种显示装置，其中所述显示装置包括如权利要求10所述的显示屏。
PCT/CN2019/070622 2018-11-30 2019-01-07 显示屏及显示装置 WO2020107654A1 (zh)

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Publication number Priority date Publication date Assignee Title
CN110113453B (zh) * 2019-04-24 2021-04-06 维沃移动通信有限公司 一种移动终端
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017171498A1 (en) * 2016-04-01 2017-10-05 Samsung Electronics Co., Ltd. Electronic device including display
CN108230931A (zh) * 2018-01-24 2018-06-29 武汉华星光电半导体显示技术有限公司 一种显示模组及电子设备
CN108447413A (zh) * 2018-02-12 2018-08-24 武汉天马微电子有限公司 显示装置
CN108761627A (zh) * 2018-05-22 2018-11-06 武汉华星光电技术有限公司 异形屏面板
CN108845445A (zh) * 2018-08-24 2018-11-20 武汉华星光电技术有限公司 全面显示屏及采用该全面显示屏的显示装置
CN208141704U (zh) * 2018-05-03 2018-11-23 昆山国显光电有限公司 显示面板和显示装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205788905U (zh) * 2016-05-27 2016-12-07 京东方科技集团股份有限公司 一种异形显示屏
CN207663696U (zh) * 2017-11-17 2018-07-27 南京粤讯电子科技有限公司 显示装置及移动终端
CN108389881B (zh) * 2018-02-28 2020-09-01 上海天马微电子有限公司 显示面板和显示装置
CN108417606B (zh) * 2018-03-21 2021-01-26 武汉华星光电半导体显示技术有限公司 基于柔性显示面板的全面屏显示装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017171498A1 (en) * 2016-04-01 2017-10-05 Samsung Electronics Co., Ltd. Electronic device including display
CN108230931A (zh) * 2018-01-24 2018-06-29 武汉华星光电半导体显示技术有限公司 一种显示模组及电子设备
CN108447413A (zh) * 2018-02-12 2018-08-24 武汉天马微电子有限公司 显示装置
CN208141704U (zh) * 2018-05-03 2018-11-23 昆山国显光电有限公司 显示面板和显示装置
CN108761627A (zh) * 2018-05-22 2018-11-06 武汉华星光电技术有限公司 异形屏面板
CN108845445A (zh) * 2018-08-24 2018-11-20 武汉华星光电技术有限公司 全面显示屏及采用该全面显示屏的显示装置

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