WO2019061683A1 - 内嵌式触控面板 - Google Patents

内嵌式触控面板 Download PDF

Info

Publication number
WO2019061683A1
WO2019061683A1 PCT/CN2017/109581 CN2017109581W WO2019061683A1 WO 2019061683 A1 WO2019061683 A1 WO 2019061683A1 CN 2017109581 W CN2017109581 W CN 2017109581W WO 2019061683 A1 WO2019061683 A1 WO 2019061683A1
Authority
WO
WIPO (PCT)
Prior art keywords
pin
touch panel
line
signal
display
Prior art date
Application number
PCT/CN2017/109581
Other languages
English (en)
French (fr)
Inventor
黄耀立
张红森
Original Assignee
武汉华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US15/735,492 priority Critical patent/US20200033972A1/en
Publication of WO2019061683A1 publication Critical patent/WO2019061683A1/zh

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13338—Input devices, e.g. touch panels
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • G09G3/3611—Control of matrices with row and column drivers
    • G09G3/3648—Control of matrices with row and column drivers using an active matrix
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates

Definitions

  • the present application relates to the field of touch and display technologies, and in particular, to an in-cell touch panel.
  • the screen ratio refers to the ratio of the display area of the display device to the overall surface area.
  • the screen ratio has a great influence on the overall effect of the display device.
  • the high screen ratio makes the display device more overall and more popular with users.
  • In-cell touch technology has begun to be more and more applied to display products such as mobile phones by virtue of good touch performance and low thickness.
  • the touch circuit structure can be integrated on the side of the Thin Film Transistor (TFT) or integrated on the side of the Color Filter (CF) side.
  • TFT Thin Film Transistor
  • CF Color Filter
  • the method for increasing the screen ratio of a liquid crystal display using an in-cell touch circuit generally narrows the size of the upper, left, and right borders of the display device, and can even achieve a three-sided borderless design with the glass cover design of the whole machine. Visual effect.
  • the current narrow bezel design basically compresses the peripheral circuits of the left, right, and upper bezels to the extreme (if the narrowest frame has been compressed to 0.3mm).
  • the lower frame of the display device usually adopts an integrated circuit (Integrity Circuit, IC) design of a flexible printed circuit board (FPC), although the size of the related circuit and the related circuit function unit are compressed. It can reduce the effect of the border, but the reduction of the lower border is limited, and the size of the lower border is still large, resulting in a relatively low screen, which affects the user experience.
  • IC Insulegrity Circuit
  • FPC flexible printed circuit board
  • the technical problem to be solved by the present application is to provide an in-cell touch panel for solving the problems of large frame size, low screen occupation, and poor user experience of the in-cell touch panel in the prior art.
  • the present application provides an in-cell touch panel including an array substrate and a flip chip, the array substrate including a display area and a non-display area, and the non-display area is provided for passing through the lap joint.
  • a flip-chip bonding region for receiving an external signal, wherein the flip-chip bonding region is provided with a plurality of transmission pins, and the non-display region is further provided with the transmission pin a connecting line for transmitting the external signal to the display area; and an integrated circuit for implementing touch and display functions on the flip chip.
  • the flip chip comprises a fixed end and a carrying portion which are interconnected, the fixed end is overlapped to the flip-chip bonding area on the array substrate, and the carrying portion is provided with The integrated circuit that implements touch and display functions.
  • the fixed end comprises a staggered first pin and a second pin, and the first pin and the second pin are electrically passed through the transfer pin on the flip chip bonding area Connect the cable.
  • the first pin transmits a scan signal or a data signal
  • the second pin transmits a touch signal
  • connection line includes a first connection line, one end of the first connection line is electrically connected to the first pin, and the other end is electrically connected to a gate line or a data line.
  • the connecting line further includes a second connecting line, one end of the second connecting line is electrically connected to the second pin, and the other end is electrically connected to the touch electrode.
  • the array substrate includes two conductive layers insulated from each other, and the first connecting line and the second connecting line are respectively disposed on the two conductive layers.
  • the gate line and the data line intersect to form a plurality of sub-pixel regions, each of the sub-pixel regions is provided with a thin film transistor and a pixel electrode, and the first connection line is electrically connected to the data line.
  • a display signal is input to the pixel electrode when the thin film transistor is turned on.
  • the integrated circuit integrates a touch and display function, and the touch signal and the display signal generated by the integrated circuit are transmitted from the flip chip to the flip chip through the first pin and the second pin, respectively. In the array substrate.
  • the touch electrodes located in the display area are electrically connected to the second connection line through via holes.
  • first pin and the second pin in at least a portion of the fixed end are staggered, and the first pin and the second pin pass through the flip chip bonding region
  • the transfer pin on the upper is electrically connected to the connection line.
  • the first pin transmits a scan signal or a data signal
  • the second pin transmits a touch signal
  • each of the transmission pins for receiving a touch signal is disposed on two adjacent ones for receiving a scan signal or a data signal. Between the transfer pins.
  • the transmission pins for receiving the scan signal or the data signal are respectively disposed in the adjacent two for receiving the touch signal. Between the transfer pins.
  • an integrated circuit packaged on a Chip On Film integrates display and touch functions, and the integrated circuit is electrically connected to the display area through a connection line to realize display and touch functions, and integration
  • the circuit does not occupy the size of the non-display area, and the flip-chip film occupies a small size of the non-display area, thereby reducing the size of the non-display area, improving the screen ratio of the display device, and improving the user experience.
  • FIG. 1 is a schematic structural diagram of an in-cell touch panel according to an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of an array substrate according to an embodiment of the present application.
  • FIG. 3 is an enlarged schematic view showing a partial structure of an in-cell touch panel according to an embodiment of the present application.
  • FIG. 4 is a schematic rear view of a flip chip according to an embodiment of the present application.
  • FIG. 5 is a side view of an in-cell touch panel according to an embodiment of the present application.
  • FIG. 6 is a schematic diagram of a touch electrode of an in-cell touch panel according to an embodiment of the present disclosure.
  • the in-cell touch panel provided by the embodiment of the present application has a function of displaying and controlling, wherein the display function is implemented by a display panel, such as a liquid crystal display panel or an organic light emitting diode display panel.
  • the touch function is implemented by the touch electrode 60 embedded in the display panel.
  • the in-cell touch panel includes a color filter substrate 80, an array substrate 40, and a liquid crystal layer 50.
  • the color filter substrate 80 is disposed opposite to the array substrate 40, and the liquid crystal layer 50 is disposed on the color filter substrate 80 and the array substrate 40.
  • the connection line controls the deflection of the liquid crystal molecules of the liquid crystal layer 50 by controlling the voltage difference between the color filter substrate 80 and the array substrate 40, thereby controlling image display.
  • the touch electrode 60 is embedded in the display panel. Specifically, the touch electrode 60 is located on the array substrate 40, and the touch electrode 60 is located between the liquid crystal layer 50 and the array substrate 40.
  • the touch signal applied by the user's finger to the in-cell touch panel is converted into an electrical signal and transmitted to the integrated circuit 24 for processing analysis.
  • the touch electrode 60 is a patterned transparent conductive film, such as an indium tin oxide (ITO) film.
  • the in-cell touch panel further includes a flip chip 20, and the flip chip 20 is provided with an integrated circuit 24, the flip chip 20 itself can be bent, and the integrated circuit 24 is electrically connected to both ends of the flip chip 20. Connect the in-line touch panel to the system board.
  • the integrated circuit 24 integrates display and touch functions.
  • the integrated circuit 24 can be a TDDI IC, that is, a Touch & Display Driver Integrity IC.
  • the array substrate 40 includes a display area 12 and a non-display area 14 , and the non-display area 14 is located at an edge of the display area 12 .
  • the edge of the display area 12 and the edge of the array substrate 40 are both non-display areas 14 . Since the display area 12 is located at the center of the array substrate 40 , the non-display area 14 is a frame type area surrounding the display area 12 .
  • the non-display area 14 referred to in the embodiment of the present application may be a lower binding area, that is, a non-display area 14 on the side where the external line binding area 142 is located.
  • the non-display area 14 includes an external line bonding area 142 and a routing area 144.
  • the routing area 144 is a vertical projection and display area of the array substrate 40 near the edge of the color circuit substrate 80 adjacent to the external line bonding area 142. The area between the edges of 12.
  • the display area 12 is provided with a gate line and a data line for controlling image display.
  • the display area 12 is further provided with a thin film transistor and a pixel electrode connected to a drain or a source of the thin film transistor, and a data line.
  • the drain or source of the thin film transistor is connected, and the scan line is connected to the gate of the thin film transistor.
  • the non-display area 14 is provided with a flip chip bonding region 140, and the flip chip bonding region 140 receives an external signal by overlapping the flip chip 20.
  • the flip chip 20 is fixed to the flip chip bonding region 140 to be fixedly connected to the array substrate 40.
  • the flip-chip bonding area 140 is provided with a plurality of transmission pins 150, and the non-display area 14 is further provided with a connection line 30 connected to the transmission pin 150, and the connection line 30 is used.
  • the external signal is transmitted to the display area 12.
  • the transfer pins 150 are sequentially arranged along the length direction of the flip chip bonding region 140.
  • the flip chip 20 includes a fixed end 220 and a carrying portion 222.
  • the fixed end 220 overlaps the non-display area 14.
  • the carrying portion 222 is located outside the array substrate 40, and the carrying portion 222 is used for carrying The integrated circuit 24, the integrated circuit 24 electrically connects the gate line or the data line and the touch electrode 60 through the flip chip 20.
  • the fixed end 220 is bonded to the flip-chip bonding area 140 by an anisotropic conductive film (ACF). In other embodiments, the fixed end 220 may also be fixed by soldering.
  • ACF anisotropic conductive film
  • the flip chip bonding region 140 is located in the external line bonding region 142, and the size of the external wiring bonding region 142 is affected by the size of the flip chip bonding region 140.
  • the size of the flip chip bonding region 140 is larger. Small, the smaller the external line bonding area 142 is, that is, the smaller the size of the non-display area 14.
  • the integrated circuit 24 packaged on the flip chip 20 integrates display and touch functions, and the integrated circuit 24 is electrically connected to the gate line or the data line and the touch electrode 60 through the gate line or the data line to realize display and touch functions.
  • the fixed end 220 of the flip chip 20 is overlapped in the non-display area 14 (external line bonding area 142), and the integrated circuit 24 is located in the carrying area 222 outside the array substrate 40, which is disposed in the non-display area 14 compared to the prior art.
  • the in-cell touch panel provided by the embodiment of the present application has only the fixed end 220 (the flip-chip bonding area 140 occupies a width as shown in FIG. 1) and the fixed end of the connection.
  • the width of the connection line 30 occupying the width as shown in FIG. 1 occupy the size of the frame 14
  • the integrated circuit 24 does not occupy the size of the non-display area 14
  • the connection lines of the integrated circuit 24 and the flip chip 20 are also The size of the non-display area 14 is not occupied, thereby reducing the size of the non-display area 14 (external line binding area 142), increasing the screen ratio of the display device, and improving the user experience.
  • the flip chip 20 fixed on the flip chip bonding region 140 is electrically connected to the gate line or the data line and the touch electrode 60 through the connection line 30.
  • the fixed end 220 of the flip chip 20 includes a first pin 262 and a second pin 264 which are sequentially staggered, and the first pin 262 and the second pin 264 pass through the flip chip bonding region 140.
  • the transmission pin 150 is electrically connected to the connection line 30, wherein the first pin 262 transmits a scan signal or a data signal, and the second pin 264 transmits a touch signal.
  • the first pin 262 and the second pin 264 are electrically connected to the connection line 30 through the transmission pin 150 on the flip chip bonding region 140.
  • the transmission pin 150 includes the first transmission arranged in a staggered arrangement.
  • the pin 1502 and the second transfer pin 1504, the first transfer pin 1502 is electrically connected to the gate line or the data line through the connection line 30, and the second transfer pin 1504 is electrically connected to the touch electrode 60 through the connection line 30.
  • the connection line 30 includes a first connection line 302 and a second connection line 304.
  • first connection line 302 is electrically connected to the first pin 262, and the other end is electrically connected to the gate line or the data line.
  • One end of the second connection line 304 is electrically connected to the second pin 264, and the other end is electrically connected to the touch electrode 60.
  • the connecting line 30 is a patterned metal layer forming metal line.
  • the connecting line 30 may be Mo, Mo/Al/Mo, Ti/Al/Ti, or Cu.
  • the first pin 262 and the second pin 264 in at least a portion of the fixed end 220 are staggered, and the first pin 262 and the second pin 264 are transmitted through the flip chip bonding region 140.
  • the pin 150 is electrically connected to the connection line 30, wherein the first pin 262 transmits a scan signal or a data signal, and the second pin 264 transmits a touch signal.
  • each transmission pin 150 for receiving a touch signal is disposed on two adjacent ones for receiving a scan signal or a data signal. Between the transmission pins 150; or each of the transmission pins 150 for receiving a scan signal or a data signal is disposed between two adjacent transmission pins 150 for receiving a touch signal.
  • the flip-chip bonding region 140 is located near the center of the non-display region 14, that is, the flip chip 20 is fixed at a position centered on the non-display region 14, since the horizontal size of the flip chip 20 is smaller than the level of the display region 12.
  • the size, the connection line 30 connecting the transmission pins 150 needs to be bent.
  • the connection line 30 includes a first connection line 32 and a second connection line 34.
  • the first connection line 32 electrically connects the first transmission pin 1502 with the gate line or the data line, and the second connection line 34 is electrically connected.
  • the second transmission pin 1504 and the touch electrode 60 is electrically connected.
  • the first pin needs to be increased. 262 is perpendicular to the gate line or the data line to reduce the bending width of the first connecting line 32, resulting in an increase in the size of the wiring area 144; if the second pin 264 is horizontally spaced from the touch electrode 60 To be large, in order to ensure that the wiring area 144 can accommodate all the second connecting lines 34 and the second connecting line 34 is not easily broken, it is necessary to increase the vertical distance between the second pin 264 and the touch electrode 60 to reduce the second The extent of the bend of the connecting line 34 causes the size of the routing area 144 to increase.
  • the first transmission pin 1502 and the second transmission pin 1504 are staggered, and the corresponding first pin 262 and the second pin 264 are staggered to reduce the first transmission pin 1502 and the gate line or
  • the horizontal distance of the data line and the horizontal distance between the second transmission pin 1504 and the touch electrode 60 correspondingly reduce the vertical distance between the first pin 262 and the gate line or the data line, and the second pin 264 and the touch.
  • the vertical distance of the electrodes 60 thereby reducing the size of the routing area 144, i.e., reducing the size of the non-display area 14, increases the screen ratio.
  • the array substrate 40 includes two conductive layers insulated from each other.
  • the first connecting lines 32 and the second connecting lines 34 are respectively disposed on the two conductive layers, wherein the conductive layer is a metal layer.
  • the gate line or the data line is located at a different layer from the touch electrode 60.
  • the first connection line 32 electrically connects the gate line or the data line with the flip chip 20 to realize an image display function
  • the second connection line 34 is electrically connected.
  • the control electrode 60 and the flip chip 20 implement a touch function, and the first connection line 32 and the second connection line 34 are insulated from each other to The image display function and the touch function are independent of each other.
  • the conductive layer includes a first metal layer and a second metal layer, the first connection line 32 is formed by etching or the like, and the second connection line 34 is etched by the second metal layer.
  • the first metal layer and the second metal layer are both metal layers, and the first connection line 32 and the second connection line 34 are metal lines formed after the first metal layer and the second metal layer are patterned.
  • the connecting line 30 may be Mo, Mo/Al/Mo, Ti/Al/Ti, Cu or Ag.
  • the flip chip bonding region 140 includes a first edge 1400 facing away from the side of the display region 12, and the first edge 1400 is flush with the edge of the array substrate 40.
  • the flip-chip bonding region 140 is rectangular, and the first edge 1400 is a long side of the rectangle, and the first edge 1400 is flush with the edge of the external line bonding region 142 away from the side of the routing region 144.
  • the crystalline film bonding region 140 has no gap with the edge of the array substrate 40, thereby maximizing the size of the small non-display region 14, increasing the screen ratio of the display device and improving the user experience.
  • the gate line and the data line intersect to form a plurality of sub-pixel regions, each of the sub-pixel regions is provided with a thin film transistor and a pixel electrode, the gate line or the data line includes a data line, and the first connection line 32 is connected to the data.
  • the wire is electrically connected to the pixel electrode through the thin film transistor.
  • the thin film transistor includes a source, a drain and a gate, the gate is electrically connected to the scan line to be electrically connected to the scan connection line, and the scan connection line sends a scan signal to control the on/off state of the source and the drain, and the drain
  • the pole is electrically connected to the first connecting line 32, and the source is electrically connected to the pixel electrode. When the drain and the source are turned on, the first connecting line 32 transmits a data signal to control the pixel voltage of the pixel electrode.
  • the integrated circuit 24 integrates touch and display functions, and the touch signals and display signals generated by the integrated circuit 24 are transmitted from the flip chip 20 to the array substrate 40 through the first pin 262 and the second pin 264, respectively. in.
  • the touch electrode 60 is electrically connected to the second connection line 34 through the via 600 .
  • the via 600 connection method is simple to manufacture, has low processing cost, and has good electrical connection effect.
  • the integrated circuit 24 packaged on the flip chip 20 integrates display and touch functions.
  • the integrated circuit 24 electrically connects the gate lines or the data lines and the touch electrodes 60 to realize display and touch functions, and the fixed end of the flip chip 20 220 is lapped in the non-display area 14, and the integrated circuit 24 is located in the carrying area 222 outside the array substrate 40.
  • the area is integrated with the integrated circuit 24 and the flexible circuit board in the non-display area 14.
  • the integrated circuit 24 does not occupy.
  • the non-display area 14 size, the connection trace of the integrated circuit 24 and the flip chip 20 does not occupy the size of the non-display area 14, thereby reducing the size of the non-display area 14, increasing the screen ratio of the display device, and improving the user. Experience.
  • the integrated circuit 24 packaged on the flip chip 20 integrates display and touch functions, and the integrated circuit 24 is electrically connected to the gate line or the data line and the touch electrode 60 through the gate line or the data line to realize display and touch functions.
  • the fixed end 220 of the flip chip 20 is overlapped in the non-display area 14 (external line bonding area 142), and the integrated circuit 24 is located in the carrying area 222 outside the array substrate 40, compared to the prior art in the non-display area 14
  • the in-cell touch panel provided by the embodiment of the present application has only the fixed end 220 (the flip-chip bonding area 140 occupies a width as shown in FIG. 1) and the connection is fixed.
  • the end 220 and the area of the display area 12 (the width of the connection line 30 occupying the width as shown in FIG. 1) occupy the size of the frame 14, the integrated circuit 24 does not occupy the size of the non-display area 14, and the connection of the integrated circuit 24 and the flip chip 20 is connected.
  • the size of the non-display area 14 is also not occupied, thereby reducing the size of the non-display area 14 (external line binding area 142), increasing the screen ratio of the display device, and improving the user experience.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Nonlinear Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Optics & Photonics (AREA)
  • Human Computer Interaction (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Geometry (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种内嵌式触控面板，包括阵列基板（40）和覆晶薄膜（20），所述阵列基板（40）包括显示区（12）及非显示区（14），所述非显示区（14）设有用于通过搭接所述覆晶薄膜（20）来接收外部信号的覆晶薄膜绑定区域（140），所述覆晶薄膜绑定区域（140）上设有多个传输引脚（150），所述非显示区（14）上还设有与所述传输引脚（150）相连的连接线（30），所述连接线（30）用于传输所述外部信号至所述显示区（12）；所述覆晶薄膜（20）上设有用于实现触控与显示功能的集成电路（24）。提高了显示设备的屏占比，提高了用户体验。

Description

内嵌式触控面板
本申请要求于2017年9月27日提交中国专利局、申请号为201710889843.5、申请名称为“内嵌式触控面板”的中国专利申请的优先权，上述在先申请的内容以引入的方式并入本文本中。
技术领域
本申请涉及触控和显示技术领域，尤其是涉及一种内嵌式触控面板。
背景技术
伴随着市场的不断发展，液晶显示技术与触控技术不断提高，用户对手机、平板电脑等外观设计提出了更苛刻的要求。屏占比是指显示设备的显示区面积与整体表面面积的比例，屏占比对显示设备的外观整体效果影响较大，高的屏占比使显示设备整体感更强，更受用户喜爱。
内嵌式触控(In-cell touch)技术依靠良好的触控效果与较低的厚度也开始越来越多的应用到手机等显示产品中。对于液晶显示器(Liquid Crystal Display，LCD)，触控电路结构既可以集成在阵列基板(Thin Film Transistor，TFT)侧，也可以集成在彩膜基板侧(Color Filter，CF)侧。提高采用内嵌式触控电路的液晶显示器的屏占比的方法一般是缩窄显示设备的上、左、右边框的尺寸，若再搭配整机玻璃盖板设计甚至可以实现三边无边框的视效。目前的窄边框设计基本上已将左、右、上边框的周边电路压缩到了极致(如最窄的边框已经压缩到了0.3mm)。
现有技术中，显示设备的下边框通常采用集成电路(Integrity Circuit，IC)组合柔性电路板(Flexible Print Circuit Board，FPC)的设计方案，虽然通过压缩相关走线以及相关的电路功能单元的尺寸可以起到缩小边框的效果，但对下边框可缩减的幅度有限，下边框尺寸仍然较大，导致屏占比较低，影响用户体验。
申请内容
本申请要解决的技术问题是提供一种内嵌式触控面板，用以解决现有技术中内嵌式触控面板的边框尺寸较大，屏占比较低，用户体验不佳的问题。
为解决上述技术问题，本申请提供一种内嵌式触控面板，包括阵列基板和覆晶薄膜，所述阵列基板包括显示区及非显示区，所述非显示区设有用于通过搭接所述覆晶薄膜来接收外部信号的覆晶薄膜绑定区域，所述覆晶薄膜绑定区域上设有多个传输引脚，所述非显示区上还设有与所述传输引脚相连的连接线，所述连接线用于传输所述外部信号至所述显示区；所述覆晶薄膜上设有用于实现触控与显示功能的集成电路。
其中，所述覆晶薄膜包括互连为一体的固定端和承载部，所述固定端搭接至位于所述阵列基板上的所述覆晶薄膜绑定区域，所述承载部上设置有用于实现触控与显示功能的所述集成电路。
其中，所述固定端包括交错排列的第一引脚和第二引脚，所述第一引脚和所述第二引脚通过所述覆晶薄膜绑定区域上的所述传输引脚电连接所述连接线。
其中，所述第一引脚传输扫描信号或数据信号，所述第二引脚传输触控信号。
其中，所述连接线包括第一连接线，所述第一连接线的一端电连接所述第一引脚，另一端电连接至栅极线或数据线。
其中，所述连接线还包括第二连接线，所述第二连接线的一端电连接所述第二引脚，另一端电连接至触控电极。
其中，所述阵列基板包括相互绝缘的两个导电层，所述第一连接线与所述第二连接线分别设于所述两个导电层上。
其中，所述栅极线和所述数据线相交形成多个子像素区域，每一所述子像素区域内都设有薄膜晶体管与像素电极，所述第一连接线电连接至所述数据线，在所述薄膜晶体管开启时向所述像素电极输入显示信号。
其中，所述集成电路集成了触控与显示功能，所述集成电路产生的触控信号和显示信号分别通过所述第一引脚和所述第二引脚从所述覆晶薄膜传递至 所述阵列基板中。
其中，位于所述显示区内的所述触控电极通过过孔电连接所述第二连接线。
其中，所述固定端中至少部分区域内的所述第一引脚和所述第二引脚交错排列，所述第一引脚和所述第二引脚通过所述覆晶薄膜绑定区域上的所述传输引脚电连接所述连接线。
其中，所述第一引脚传输扫描信号或数据信号，所述第二引脚传输触控信号。
其中，所述覆晶薄膜绑定区域内的多个所述传输引脚中，每一用于接收触控信号的所述传输引脚均设于相邻两用于接收扫描信号或数据信号的所述传输引脚之间。
其中，所述覆晶薄膜绑定区域内的多个所述传输引脚中，每一用于接收扫描信号或数据信号的所述传输引脚均设于相邻两用于接收触控信号的所述传输引脚之间。
本申请的有益效果如下：封装于覆晶薄膜(Chip On Film，COF)上的集成电路集成了显示和触控功能，集成电路通过连接线电连接至显示区实现了显示和触控功能，集成电路不占用非显示区尺寸，覆晶薄膜占用非显示区尺寸较小，从而减小了非显示区的尺寸，提高了显示设备的屏占比，提高了用户体验。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的明显变形方式。
图1为本申请实施例提供的内嵌式触控面板的结构示意图。
图2为本申请实施例提供的阵列基板的结构示意图。
图3为本申请实施例提供的内嵌式触控面板的部分结构放大示意图。
图4为本申请实施例提供的覆晶薄膜的背面示意图。
图5为本申请实施例提供的内嵌式触控面板的侧视图。
图6为本申请实施例提供的内嵌式触控面板的触控电极的示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
请一并参阅图1至图5，本申请实施例提供的内嵌式触控面板具有显示与触控的功能，其中，显示功能通过显示面板实现，例如液晶显示面板或有机发光二极管显示面板，触控功能通过内嵌于显示面板内的触控电极60实现。本实施例中，内嵌式触控面板包括彩膜基板80、阵列基板40及液晶层50，彩膜基板80与阵列基板40相对设置，液晶层50设置于彩膜基板80与阵列基板40之间从而形成液晶盒，连接线通过控制彩膜基板80与阵列基板40之间电压差控制液晶层50的液晶分子的偏转，从而控制图像显示。一种实施方式中，触控电极60内嵌于显示面板中，具体的，触控电极60位于阵列基板40上，并且触控电极60位于液晶层50与阵列基板40之间，触控电极60用于将用户手指对内嵌式触控面板施加的触控信号转换为电信号传递至集成电路24进行处理分析。一种实施方式中，触控电极60为图案化的透明导电薄膜，例如氧化铟锡(Indium tin oxide，ITO)薄膜等。
本实施例中，内嵌式触控面板还包括覆晶薄膜20，覆晶薄膜20上设有集成电路24，覆晶薄膜20自身可以弯折，集成电路24通过覆晶薄膜20的两端电连接内嵌式触控面板和系统主板。一种实施方式中，集成电路24集成了显示和触控功能，具体的，集成电路24可以为TDDI IC，即Touch & Display Driver Integrity IC。
本实施例中，阵列基板40包括显示区12和非显示区14，非显示区14位于显示区12的边缘。具体的，显示区12的边缘与阵列基板40的边缘之间均为非显示区14，由于显示区12位于阵列基板40的中心位置，非显示区14为围绕显示区12的框型区域。进一步的，彩膜基板80与阵列基板40层叠设置，彩膜基板80的尺寸小于阵列基板40的尺寸，彩膜基板80在阵列基板40的垂直投影未覆盖的部分形成外接线路绑定区142(Outer Lead Bonding，OLB)，本申请实施例所指的非显示区14可以为下绑定区，即外接线路绑定区142所在一侧的非显示区14。本实施例中，非显示区14包括外接线路绑定区142和走线区144，走线区144为彩膜基板80靠近外接线路绑定区142的边缘在阵列基板40的垂直投影与显示区12的边缘之间的区域。
本实施例中，显示区12设有栅极线和数据线用于控制图像显示，具体的，显示区12还设有薄膜晶体管和连接于薄膜晶体管的漏极或源极的像素电极，数据线连接薄膜晶体管的漏极或源极，扫描线连接薄膜晶体管的栅极。具体到 图2，非显示区14设有覆晶薄膜绑定区域140，覆晶薄膜绑定区域140通过搭接覆晶薄膜20来接收外部信号。覆晶薄膜20固定于覆晶薄膜绑定区域140，从而固定连接阵列基板40。具体到图2，本实施例中，覆晶薄膜绑定区域140上设有多个传输引脚150，非显示区14上还设有与传输引脚150相连的连接线30，连接线30用于传输外部信号至显示区12。一种实施方式中，传输引脚150沿覆晶薄膜绑定区域140的长度方向依次排列。
本实施例中，覆晶薄膜20包括互连为一体的固定端220和承载部222，固定端220搭接至非显示区14，承载部222位于阵列基板40之外，承载部222用于承载集成电路24，集成电路24通过覆晶薄膜20电连接栅极线或数据线及触控电极60。一种实施方式中，固定端220通过异方性导电胶膜(Anisotropic Conductive Film，ACF)贴合在覆晶薄膜绑定区域140，其他实施方式中，固定端220也可以通过焊接的方式固定在覆晶薄膜绑定区域140。本实施例中，覆晶薄膜绑定区域140位于外接线路绑定区142，外接线路绑定区142的尺寸受到覆晶薄膜绑定区域140的尺寸影响，覆晶薄膜绑定区域140的尺寸越小，则外接线路绑定区142越小，即非显示区14的尺寸越小。
封装于覆晶薄膜20上的集成电路24集成了显示和触控功能，集成电路24通过栅极线或数据线电连接至栅极线或数据线及触控电极60实现了显示和触控功能，覆晶薄膜20的固定端220搭接在非显示区14(外接线路绑定区142)，集成电路24位于阵列基板40外的承载区222，相较于现有技术在非显示区14设置区域绑定集成电路24和柔性电路板，本申请实施例提供的内嵌式触控面板仅有固定端220(覆晶薄膜绑定区域140占用宽度如图1所示宽度b)和连接固定端220与显示区12的区域(连接线30占用宽度如图1所示宽度a)占用边框14尺寸，集成电路24不占用非显示区14尺寸，集成电路24与覆晶薄膜20的连接走线也不占用非显示区14尺寸，从而减小了非显示区14(外接线路绑定区142)的尺寸，提高了显示设备的屏占比，提高了用户体验。
本实施例中，固定在覆晶薄膜绑定区域140的覆晶薄膜20通过连接线30电连接至栅极线或数据线和触控电极60。具体到图4，覆晶薄膜20的固定端220包括依次交错排列的第一引脚262和第二引脚264，第一引脚262和第二引脚264通过覆晶薄膜绑定区域140上的传输引脚150电连接连接线30，其中，第一引脚262传输扫描信号或数据信号，第二引脚264传输触控信号。本实施例中，第一引脚262和第二引脚264通过覆晶薄膜绑定区域140上的传输引脚150电连接连接线30，具体的，传输引脚150包括交错排列的第一传输引脚1502和第二传输引脚1504，第一传输引脚1502通过连接线30电连接栅极线或数据线，第二传输引脚1504通过连接线30电连接触控电极60。覆晶薄膜20绑定至覆晶薄膜绑定区域140后，第一引脚262对应连接第一传输引脚1502，第二引脚264对应连接第二传输引脚1504，从而使第一引脚262电 连接至栅极线或数据线，第二引脚264通电连接至触控电极60。一种实施方式中，连接线30包括第一连接线302和第二连接线304，第一连接线302的一端电连接至第一引脚262，另一端电连接至栅极线或数据线；第二连接线304的一端电连接至第二引脚264，另一端电连接至触控电极60。具体的，连接线30为图案化的金属层形成金属线，一种实施方式中，连接线30可以为Mo、Mo/Al/Mo、Ti/Al/Ti、或者Cu。
本实施例中，固定端220中至少部分区域内的第一引脚262和第二引脚264交错排列，第一引脚262和第二引脚264通过覆晶薄膜绑定区域140上的传输引脚150电连接连接线30，其中，第一引脚262传输扫描信号或数据信号，第二引脚264传输触控信号。
本实施例中，覆晶薄膜绑定区域140内的多个传输引脚150中，每一用于接收触控信号的传输引脚150均设于相邻两用于接收扫描信号或数据信号的传输引脚150之间；或每一用于接收扫描信号或数据信号的传输引脚150均设于相邻两用于接收触控信号的传输引脚150之间。
具体到图3，覆晶薄膜绑定区域140靠近非显示区14居中的位置，即覆晶薄膜20固定于非显示区14居中的位置，由于覆晶薄膜20的水平尺寸小于显示区12的水平尺寸，连接传输引脚150的连接线30需要经过弯折。一种实施方式中，连接线30包括第一连接线32和第二连接线34，第一连接线32电连接第一传输引脚1502与栅极线或数据线，第二连接线34电连接第二传输引脚1504与触控电极60。若第一引脚262与栅极线或数据线的水平距离过大，为了保证走线区144能够容纳下所有第一连接线32且第一连接线32不易断裂，需要增大第一引脚262与栅极线或数据线的竖直距离，以减小第一连接线32的弯折幅度，导致走线区144的尺寸增大；若第二引脚264与触控电极60的水平距离过大，为了保证走线区144能够容纳下所有第二连接线34且第二连接线34不易断裂，需要增大第二引脚264与触控电极60的竖直距离，以减小第二连接线34的弯折幅度，导致走线区144的尺寸增大。本实施例中，第一传输引脚1502与第二传输引脚1504交错排列，对应的第一引脚262与第二引脚264交错排列，降低了第一传输引脚1502与栅极线或数据线的水平距离及第二传输引脚1504与触控电极60的水平距离，对应减小了第一引脚262与栅极线或数据线的竖直距离及第二引脚264与触控电极60的竖直距离，从而减小了走线区144的尺寸，即减小了非显示区14的尺寸，提高了屏占比。
本实施例中，阵列基板40包括相互绝缘的两个导电层，第一连接线32与第二连接线34分别设于两个导电层上，其中，导电层为金属层。具体的，栅极线或数据线与触控电极60位于不同的层，第一连接线32电连接栅极线或数据线与覆晶薄膜20实现图像显示功能，第二连接线34电连接触控电极60与覆晶薄膜20实现触控功能，第一连接线32与第二连接线34相互绝缘以使 图像显示功能与触控功能相互独立。一种实施方式中，导电层包括第一金属层与第二金属层，第一连接线32为第一金属层经过蚀刻等方式图案化形成，第二连接线34为第二金属层经过蚀刻等方式图案化形成，第一金属层和第二金属层均为金属层，第一连接线32和第二连接线34为图案化第一金属层和第二金属层后形成的金属线。一种实施方式中，连接线30可以为Mo、Mo/Al/Mo、Ti/Al/Ti、Cu或Ag。当第一连接线32和第二连接线34为Ag时，Ag线阻抗小，利于集成电路24调试。
本实施例中，覆晶薄膜绑定区域140包括背离显示区12一侧的第一边缘1400，第一边缘1400与阵列基板40的边缘平齐。具体的，覆晶薄膜绑定区域140为矩形，第一边缘1400为矩形的一条长边，第一边缘1400与外接线路绑定区142背离走线区144一侧的边缘平齐，以使覆晶薄膜绑定区域140与阵列基板40的边缘没有间隙，从而最大化的较小非显示区14的尺寸，提高了显示设备的屏占比，提高了用户体验。
本实施例中，栅极线和数据线相交形成多个子像素区域，每一子像素区域内都设有薄膜晶体管和像素电极，栅极线或数据线包括数据线，第一连接线32连接数据线，从而通过薄膜晶体管电连接至像素电极。一种实施方式中，薄膜晶体管包括源极、漏极及栅极，栅极电连接扫描线从而电连接至扫描连接线，扫描连接线发送扫描信号控制源极与漏极的通断状态，漏极电连接第一连接线32，源极电连接像素电极，当漏极与源极导通时，第一连接线32传递数据信号控制像素电极的像素电压。
本实施例中，集成电路24集成了触控与显示功能，集成电路24产生的触控信号和显示信号分别通过第一引脚262和第二引脚264从覆晶薄膜20传递至阵列基板40中。
结合图6，触控电极60通过过孔600电连接第二连接线34。过孔600连接方式制作简单，加工成本低，电连接效果好。
封装于覆晶薄膜20上的集成电路24集成了显示和触控功能，集成电路24电连接栅极线或数据线和触控电极60实现了显示和触控功能，覆晶薄膜20的固定端220搭接在非显示区14，集成电路24位于阵列基板40外的承载区222，相较于现有技术在非显示区14设置区域绑定集成电路24和柔性电路板，集成电路24不占用非显示区14尺寸，集成电路24与覆晶薄膜20的连接走线也不占用非显示区14尺寸，从而减小了非显示区14的尺寸，提高了显示设备的屏占比，提高了用户体验。
封装于覆晶薄膜20上的集成电路24集成了显示和触控功能，集成电路24通过栅极线或数据线电连接至栅极线或数据线及触控电极60实现了显示和触控功能，覆晶薄膜20的固定端220搭接在非显示区14(外接线路绑定区142)，集成电路24位于阵列基板40外的承载区222，相较于现有技术在非显示区14 设置区域绑定集成电路24和柔性电路板，本申请实施例提供的内嵌式触控面板仅有固定端220(覆晶薄膜绑定区域140占用宽度如图1所示宽度b)和连接固定端220与显示区12的区域(连接线30占用宽度如图1所示宽度a)占用边框14尺寸，集成电路24不占用非显示区14尺寸，集成电路24与覆晶薄膜20的连接走线也不占用非显示区14尺寸，从而减小了非显示区14(外接线路绑定区142)的尺寸，提高了显示设备的屏占比，提高了用户体验。
以上所揭露的仅为本申请几种较佳实施例而已，当然不能以此来限定本申请之权利范围，本领域普通技术人员可以理解实现上述实施例的全部或部分流程，并依本申请权利要求所作的等同变化，仍属于申请所涵盖的范围。

Claims (14)

  1. 一种内嵌式触控面板，其中，包括阵列基板和覆晶薄膜，所述阵列基板包括显示区及非显示区，所述非显示区设有用于通过搭接所述覆晶薄膜来接收外部信号的覆晶薄膜绑定区域，所述覆晶薄膜绑定区域上设有多个传输引脚，所述非显示区上还设有与所述传输引脚相连的连接线，所述连接线用于传输所述外部信号至所述显示区；所述覆晶薄膜上设有用于实现触控与显示功能的集成电路。
  2. 根据权利要求1所述的内嵌式触控面板，其中，所述覆晶薄膜包括互连为一体的固定端和承载部，所述固定端搭接至位于所述阵列基板上的所述覆晶薄膜绑定区域，所述承载部上设置有用于实现触控与显示功能的所述集成电路。
  3. 根据权利要求2所述的内嵌式触控面板，其中，所述固定端包括交错排列的第一引脚和第二引脚，所述第一引脚和所述第二引脚通过所述覆晶薄膜绑定区域上的所述传输引脚电连接所述连接线。
  4. 根据权利要求3所述的内嵌式触控面板，其中，所述第一引脚传输扫描信号或数据信号，所述第二引脚传输触控信号。
  5. 根据权利要求4所述的内嵌式触控面板，其中，所述连接线包括第一连接线，所述第一连接线的一端电连接所述第一引脚，另一端电连接至栅极线或数据线。
  6. 根据权利要求5所述的内嵌式触控面板，其中，所述连接线还包括第二连接线，所述第二连接线的一端电连接所述第二引脚，另一端电连接至触控电极。
  7. 根据权利要求6所述的内嵌式触控面板，其中，所述阵列基板包括相互绝缘的两个导电层，所述第一连接线与所述第二连接线分别设于所述两个导电层上。
  8. 根据权利要求7所述的内嵌式触控面板，其中，所述栅极线和所述数据线相交形成多个子像素区域，每一所述子像素区域内都设有薄膜晶体管与像素电极，所述第一连接线电连接至所述数据线，在所述薄膜晶体管开启时向所述像素电极输入显示信号。
  9. 根据权利要求4所述的内嵌式触控面板，其中，所述集成电路集成了触控与显示功能，所述集成电路产生的触控信号和显示信号分别通过所述第一引脚和所述第二引脚从所述覆晶薄膜传递至所述阵列基板中。
  10. 根据权利要求6所述的内嵌式触控面板，其中，位于所述显示区内的所述触控电极通过过孔电连接所述第二连接线。
  11. 根据权利要求4所述的内嵌式触控面板，其中，所述固定端中至少部分区域内的所述第一引脚和所述第二引脚交错排列，所述第一引脚和所述第二引脚通过所述覆晶薄膜绑定区域上的所述传输引脚电连接所述连接线。
  12. 根据权利要求11所述的内嵌式触控面板，其中，所述第一引脚传输扫描信号或数据信号，所述第二引脚传输触控信号。
  13. 根据权利要求1所述的内嵌式触控面板，其中，所述覆晶薄膜绑定区域内的多个所述传输引脚中，每一用于接收触控信号的所述传输引脚均设于相邻两用于接收扫描信号或数据信号的所述传输引脚之间。
  14. 根据权利要求1所述的内嵌式触控面板，其中，所述覆晶薄膜绑定区域内的多个所述传输引脚中，每一用于接收扫描信号或数据信号的所述传输引脚均设于相邻两用于接收触控信号的所述传输引脚之间。
PCT/CN2017/109581 2017-09-27 2017-11-06 内嵌式触控面板 WO2019061683A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/735,492 US20200033972A1 (en) 2017-09-27 2017-11-06 In-cell touch panel

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710889843.5 2017-09-27
CN201710889843.5A CN107703664A (zh) 2017-09-27 2017-09-27 内嵌式触控面板

Publications (1)

Publication Number Publication Date
WO2019061683A1 true WO2019061683A1 (zh) 2019-04-04

Family

ID=61175048

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/109581 WO2019061683A1 (zh) 2017-09-27 2017-11-06 内嵌式触控面板

Country Status (3)

Country Link
US (1) US20200033972A1 (zh)
CN (1) CN107703664A (zh)
WO (1) WO2019061683A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110133883A (zh) * 2019-04-22 2019-08-16 北京集创北方科技股份有限公司 显示装置、显示系统及制造方法

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107561764A (zh) * 2017-10-30 2018-01-09 上海天马微电子有限公司 一种显示面板及其显示装置
JP2019160174A (ja) * 2018-03-16 2019-09-19 シャープ株式会社 液晶表示パネル
WO2019174043A1 (zh) * 2018-03-16 2019-09-19 深圳市柔宇科技有限公司 Cof载带及其加工方法、cof载带加工设备
CN108469927B (zh) * 2018-04-28 2021-02-09 上海天马微电子有限公司 触控显示面板及其驱动方法、触控显示装置
WO2019244603A1 (ja) * 2018-06-20 2019-12-26 株式会社ジャパンディスプレイ 表示装置
CN108663861A (zh) * 2018-06-22 2018-10-16 Oppo广东移动通信有限公司 一种液晶显示装置
CN108828855A (zh) * 2018-06-22 2018-11-16 Oppo广东移动通信有限公司 一种显示装置
CN109087589B (zh) 2018-10-22 2021-06-18 惠科股份有限公司 阵列基板、显示面板及显示装置
CN109378335B (zh) 2018-11-22 2021-01-15 武汉华星光电半导体显示技术有限公司 显示面板
WO2020189894A1 (ko) * 2019-03-19 2020-09-24 주식회사 하이딥 디스플레이 장치
CN110335545A (zh) * 2019-06-25 2019-10-15 武汉华星光电技术有限公司 柔性显示装置
CN110600503A (zh) * 2019-08-12 2019-12-20 武汉华星光电半导体显示技术有限公司 柔性集成显示屏模组及其制备方法、显示装置
CN110989231A (zh) * 2019-11-25 2020-04-10 Tcl华星光电技术有限公司 偏光片和显示面板
CN111292614B (zh) * 2020-01-15 2022-07-12 京东方科技集团股份有限公司 显示模组、显示装置
CN111445806B (zh) * 2020-04-16 2022-07-26 上海中航光电子有限公司 显示面板和显示装置
CN111679751B (zh) * 2020-04-22 2023-09-29 信利（惠州）智能显示有限公司 一种触控显示模组及显示装置
CN111524461A (zh) * 2020-04-27 2020-08-11 武汉华星光电半导体显示技术有限公司 一种显示模组及其制备方法
CN111552407B (zh) * 2020-04-29 2023-03-31 业成科技（成都）有限公司 电子设备、触控模组及其制备方法
CN113703602A (zh) * 2020-05-22 2021-11-26 联咏科技股份有限公司 Oled触控显示芯片及包含其的oled触控显示装置
CN112542091A (zh) * 2020-12-02 2021-03-23 合肥维信诺科技有限公司 柔性显示面板及其制作方法、显示装置
CN115373535A (zh) * 2021-05-21 2022-11-22 瀚宇彩晶股份有限公司 触控显示面板
WO2023230913A1 (zh) * 2022-05-31 2023-12-07 京东方科技集团股份有限公司 触控显示装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1568116A (zh) * 2003-06-24 2005-01-19 铼宝科技股份有限公司 有机电激发光面板装置
US20140029219A1 (en) * 2012-07-25 2014-01-30 Lg Display Co., Ltd. Plastic panel and flat panel display device using the same
CN105159513A (zh) * 2015-09-15 2015-12-16 武汉华星光电技术有限公司 阵列基板、自容式触控显示面板及电子装置
CN106292098A (zh) * 2016-11-03 2017-01-04 厦门天马微电子有限公司 一种阵列基板、显示面板及显示装置
CN107093606A (zh) * 2017-03-31 2017-08-25 京东方科技集团股份有限公司 一种显示面板、显示装置及显示面板的制作方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101309862B1 (ko) * 2009-12-10 2013-09-16 엘지디스플레이 주식회사 터치 패널 일체형 액정 표시 장치
TW201441885A (zh) * 2013-04-30 2014-11-01 Innolux Corp 觸控顯示裝置
CN104516576B (zh) * 2013-09-29 2016-04-13 宸鸿科技(厦门)有限公司 触控面板的制作方法
CN105138184B (zh) * 2015-09-25 2018-06-22 深圳市华星光电技术有限公司 一种内嵌触摸液晶面板及其阵列基板
CN105653087B (zh) * 2015-12-25 2019-04-16 上海中航光电子有限公司 一种显示面板和显示装置
KR102548931B1 (ko) * 2016-03-22 2023-06-30 삼성디스플레이 주식회사 표시 장치
KR20180074982A (ko) * 2016-12-26 2018-07-04 주식회사 실리콘웍스 패널구동집적회로

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1568116A (zh) * 2003-06-24 2005-01-19 铼宝科技股份有限公司 有机电激发光面板装置
US20140029219A1 (en) * 2012-07-25 2014-01-30 Lg Display Co., Ltd. Plastic panel and flat panel display device using the same
CN105159513A (zh) * 2015-09-15 2015-12-16 武汉华星光电技术有限公司 阵列基板、自容式触控显示面板及电子装置
CN106292098A (zh) * 2016-11-03 2017-01-04 厦门天马微电子有限公司 一种阵列基板、显示面板及显示装置
CN107093606A (zh) * 2017-03-31 2017-08-25 京东方科技集团股份有限公司 一种显示面板、显示装置及显示面板的制作方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110133883A (zh) * 2019-04-22 2019-08-16 北京集创北方科技股份有限公司 显示装置、显示系统及制造方法
CN110133883B (zh) * 2019-04-22 2024-05-07 北京集创北方科技股份有限公司 显示装置、显示系统及制造方法

Also Published As

Publication number Publication date
US20200033972A1 (en) 2020-01-30
CN107703664A (zh) 2018-02-16

Similar Documents

Publication Publication Date Title
WO2019061683A1 (zh) 内嵌式触控面板
US11335739B2 (en) Display panel and display device
CN108122497B (zh) 一种柔性阵列基板、柔性显示装置及组装方法
KR102231368B1 (ko) 디스플레이 모듈 및 액정 디스플레이 스크린
CN102193678B (zh) 触摸面板及其制造方法
US8269940B2 (en) Sensing structure
US9619097B2 (en) Touch panel and display device with touch panel
KR101971164B1 (ko) 터치 기판 및 이를 포함하는 표시 장치
CN104698636A (zh) 一种显示面板和电子设备
CN104765485B (zh) 触控面板模块与具有触控面板模块的触控显示装置
CN109188747B (zh) 显示面板和显示装置
US20070052895A1 (en) Fan-out wire structure
JP2008134975A (ja) 入力装置及びその製造方法
CN107561764A (zh) 一种显示面板及其显示装置
US20040041796A1 (en) Touch panel device and method of fabricating the same
CN106338866B (zh) 一种液晶面板的焊盘区域结构
US11181764B2 (en) Display panel
WO2020133696A1 (zh) 窄边框显示模块及其显示装置
US20100026951A1 (en) Connection structure of display panel and flexible printed circuit board
US20210333841A1 (en) Display screen and display device
JP2007057885A (ja) 電気光学装置及び電子機器
KR20130022802A (ko) 액정표시장치
CN215895190U (zh) 一种胆固醇液晶显示屏的窄边框结构
US11099439B2 (en) Display device assembly having a spacer layer surrounding the integrated circuit
TWI401494B (zh) 接地結構

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17927194

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17927194

Country of ref document: EP

Kind code of ref document: A1