WO2020019721A1 - 柔性基板以及柔性面板 - Google Patents

柔性基板以及柔性面板 Download PDF

Info

Publication number
WO2020019721A1
WO2020019721A1 PCT/CN2019/077137 CN2019077137W WO2020019721A1 WO 2020019721 A1 WO2020019721 A1 WO 2020019721A1 CN 2019077137 W CN2019077137 W CN 2019077137W WO 2020019721 A1 WO2020019721 A1 WO 2020019721A1
Authority
WO
WIPO (PCT)
Prior art keywords
region
groove
substrate
length
flexible
Prior art date
Application number
PCT/CN2019/077137
Other languages
English (en)
French (fr)
Inventor
郑颖博
Original Assignee
武汉华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US16/476,305 priority Critical patent/US20200187359A1/en
Publication of WO2020019721A1 publication Critical patent/WO2020019721A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Definitions

  • the present application relates to the field of display technology, and in particular, to a flexible substrate and a flexible panel.
  • Display modules currently on the market include display substrates, driver chips, and flexible printed circuit boards (FPCs). Such display modules are widely used in mobile phones, tablet computers, and liquid crystal displays.
  • FPCs flexible printed circuit boards
  • the lead-in pads on the display substrate and the output pads of the FPC are connected through an anisotropic conductive film.
  • the material of the FPC is a polyimide film
  • the expansion coefficient is large
  • the material of the display substrate is usually borosilicate glass.
  • the thermal expansion and contraction coefficient interpolation between the FPC and the display substrate resulting in FPC. Since it cannot accurately correspond to the position of the display substrate, the product yield is reduced.
  • the technical problem mainly solved in this application is how to improve the accuracy of FPC and substrate alignment, thereby improving product yield.
  • the present application provides a flexible substrate, including:
  • the flexible circuit board includes a plurality of pin areas arranged along a preset direction, a plurality of metal pins are arranged on the pin areas, and a groove is provided between the adjacent pin areas so that Preventing the metal pins from being misaligned when the flexible circuit board is aligned with the substrate;
  • the substrate has a support surface, and an adhesive layer is disposed on the support surface.
  • the flexible circuit board is bonded to the substrate through the adhesive layer, and the plurality of metal pins pass through.
  • the adhesive layer is electrically connected to the substrate;
  • the material of the adhesive layer is an anisotropic conductive adhesive.
  • the pin region includes a first region, a second region, and a third region arranged along a preset direction, and the groove includes a first groove and a second groove; wherein, The first groove is disposed between the first region and the second region, and the second groove is disposed between the second region and the third region.
  • the length of the first region is greater than the length of the second region, and the length of the second region is greater than the length of the third region; wherein the cross section of the first groove is The area is larger than the cross-sectional area of the second groove.
  • the length of the first region, the length of the second region, and the length of the third region are all equal.
  • the length of the first region is between 0 and 70 mm.
  • a depth of the groove is greater than a length of the metal pin.
  • a plurality of protrusions are provided on the substrate, the protrusions are in one-to-one correspondence with the grooves, and a cross-sectional area of the grooves is larger than a cross-sectional area of the protrusions.
  • a flexible substrate including:
  • the flexible circuit board includes a plurality of pin areas arranged along a preset direction, a plurality of metal pins are arranged on the pin areas, and a groove is provided between the adjacent pin areas so that When the flexible circuit board is aligned with the substrate, the metal pins are prevented from being misaligned.
  • the pin region includes a first region, a second region, and a third region arranged along a preset direction, and the groove includes a first groove and a second groove; wherein, The first groove is disposed between the first region and the second region, and the second groove is disposed between the second region and the third region.
  • the length of the first region is greater than the length of the second region, and the length of the second region is greater than the length of the third region; wherein the cross section of the first groove is The area is larger than the cross-sectional area of the second groove.
  • the length of the first region, the length of the second region, and the length of the third region are all equal.
  • the length of the first region is between 0 and 70 mm.
  • a depth of the groove is greater than a length of the metal pin.
  • a plurality of protrusions are provided on the substrate, the protrusions are in one-to-one correspondence with the grooves, and a cross-sectional area of the grooves is larger than a cross-sectional area of the protrusions .
  • the substrate has a supporting surface, and an adhesive layer is disposed on the supporting surface; wherein the flexible circuit board is adhered to the substrate through the adhesive layer. And the plurality of metal pins are electrically connected to the substrate through the adhesive layer.
  • a material of the adhesive layer is an anisotropic conductive adhesive.
  • the material of the substrate is borosilicate glass.
  • the present application provides a flexible panel including a flexible substrate
  • the flexible substrate includes:
  • the flexible circuit board includes a plurality of pin areas arranged along a preset direction, a plurality of metal pins are arranged on the pin areas, and a groove is provided between the adjacent pin areas so that When the flexible circuit board is aligned with the substrate, the metal pins are prevented from being misaligned.
  • the pin region includes a first region, a second region, and a third region arranged along a preset direction, and the groove includes a first groove and a second groove; wherein, The first groove is disposed between the first region and the second region, and the second groove is disposed between the second region and the third region.
  • the length of the first region is greater than the length of the second region, and the length of the second region is greater than the length of the third region; wherein the cross-section of the first groove is The area is larger than the cross-sectional area of the second groove.
  • a beneficial effect of the present application is that a groove is provided between adjacent lead regions to prevent the metal pins from being misaligned when the flexible circuit board is aligned with the substrate. Therefore, the precision of alignment between the flexible circuit board and the substrate can be improved, thereby improving the product yield.
  • FIG. 1 is a schematic plan view of a first embodiment of a flexible substrate provided by the present application.
  • FIG. 2 is a schematic structural diagram of a first embodiment of a flexible substrate provided by the present application.
  • FIG. 3 is a schematic plan view of a second embodiment of a flexible substrate provided by the present application.
  • FIG. 4 is a schematic plan view of a third embodiment of a flexible substrate provided by the present application.
  • FIG. 1 is a schematic plan view of a first embodiment of a flexible substrate provided by the present application.
  • the present application provides a flexible substrate 1 including a substrate 10 and a flexible circuit board 20 disposed on the substrate 10; wherein the flexible circuit board 20 includes a plurality of pin areas 21 arranged along a predetermined direction, and pins. A plurality of metal pins 201 are disposed on the region 21, and a groove 22 is disposed between the adjacent pin regions 21.
  • the material of the substrate 10 may be borosilicate glass.
  • the substrate 10 may be provided with a plurality of driving chips 11, and the plurality of driving chips 11 correspond to the plurality of metal pins 201 one-to-one.
  • the substrate 10 has a supporting surface.
  • An adhesive layer 30 is disposed on the supporting surface.
  • the adhesive layer 30 may be an anisotropic conductive adhesive.
  • the flexible circuit board 20 is bonded to the substrate 10 through the adhesive layer 30, and the plurality of metal pins 201 are electrically connected to the substrate 10 through the adhesive layer 30, that is, the plurality of metal leads
  • the legs 201 are electrically connected to the driving chips 11 through the adhesive layer 30.
  • a plurality of metal pins 201 can be pressed on the plurality of driving chips 11 by hot pressing using a pressing device.
  • the anisotropy of the pressing device on the substrate 10 is controlled.
  • the conductive adhesive 30 is heated, so that the resin layer in the anisotropic conductive adhesive 30 reacts, and at the same time, the pressure bonding device is controlled to press down the flexible circuit board 20, so that the conductive particles in the anisotropic conductive adhesive 30 form a plurality of conductions.
  • the conductive path between the metal pin 201 and the driving chip 11 completes the binding between the flexible circuit board 20 and the substrate 10.
  • a groove 22 is provided between the adjacent pin areas 21 to prevent the misalignment of the metal pins 201 and cause a short circuit when the flexible circuit board 20 is aligned with the substrate 10, so that the accuracy of FPC and substrate alignment can be improved. This improves the product yield.
  • the depth of the groove 22 is greater than the length of the metal pin 201.
  • FIG. 3 is a schematic plan view of a second embodiment of a flexible substrate provided by the present application.
  • the pin region 20 includes a first region 211, a second region 212, and a third region 213 arranged along a predetermined direction.
  • the groove 22 includes a first groove 221 and a second groove 222.
  • the first groove 221 is provided.
  • a second groove 222 is provided between the second region 212 and the third region 213.
  • the preset direction may be a horizontal direction, that is, the first region 211, the second region 212, and the third region 213 are arranged on the flexible circuit board 20 along the horizontal direction, wherein the cross-sectional area of the first groove 221 and the second recess
  • the cross-sectional area of the groove 222 is specifically set according to the length of the first region 211, the length of the second region 212, and the length of the third region 213.
  • the cross-sectional area of the first groove 221 is equal to the cross-sectional area of the second groove 222.
  • the length of the first region 211 is greater than the length of the second region 212, and the length of the second region 212 is greater than the length of the third region 213; wherein the cross-sectional area of the first groove 221 is larger than the cross-sectional area of the second groove 222 .
  • the single pin area 21 cannot exceed 70 mm, otherwise a short circuit may occur due to dislocation of the driver chip 11 after expansion. That is, the length of a single pin region 21 is between 0 and 70 mm, that is, the length of the first region 211, the length of the second region 212, and the length of the third region 213 are between 0 and 70 mm. .
  • a groove 22 is provided between the adjacent pin areas 21 to prevent the metal pins 201 from being misaligned when the flexible circuit board 20 is aligned with the substrate 10. A short circuit is caused, so that the precision of the alignment between the flexible circuit board 20 and the substrate 10 can be improved, thereby improving the product yield.
  • providing a groove 22 between the adjacent pin areas 21 can also widen the binding area of the flexible circuit board 20, thereby providing signal input support for improving the resolution of the LCD screen.
  • FIG. 4 is a schematic plan view of a third embodiment of a flexible substrate provided by the present application.
  • the substrate 10 is provided with a plurality of protrusions 12.
  • the protrusions 12 correspond to the grooves 22 one by one, and the cross-sectional area of the grooves 22 is larger than the cross-sectional area of the protrusions 12.
  • the protrusions 12 are accommodated in the grooves 22, and the protrusions 12 have a certain distance from the side wall of the grooves 22.
  • the thickness of the plurality of protrusions 12 is consistent with the thickness of the flexible wiring board 20.
  • the plurality of pins 201 in each of the pin regions 21 will expand when heated. Since the protrusions 12 are accommodated in the grooves 22, the adjacent pin regions 21 do not affect each other even if they expand due to heat, so the product yield is further improved.
  • this application also provides a flexible panel, including any flexible substrate in the above embodiments.
  • a flexible panel including any flexible substrate in the above embodiments.
  • a groove 22 is provided between the adjacent pin areas 21 to prevent the metal pins 201 from being misaligned when the flexible circuit board 20 is aligned with the substrate 10. Therefore, the alignment accuracy of the flexible circuit board 20 and the substrate 10 can be improved, thereby improving the product yield.
  • a plurality of protrusions 12 are provided on the substrate 10, and the protrusions 12 correspond to the grooves 22 one by one.
  • the adjacent pin regions 21 do not affect each other even if they are expanded by heat. Therefore, the product yield is further improved.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种柔性基板（1）以及显示面板，柔性基板（1）包括：衬底（10）以及设置在衬底（10）上的柔性线路板（20）。其中，柔性线路板（20）包括多个沿预设方向排列的引脚区（21），引脚区（21）上设置有多个金属引脚（201），且相邻引脚区（21）之间设置有一凹槽（22）。通过在引脚区（21）之间设置有一凹槽（22），以在柔性线路板（20）与衬底（10）对位时，防止金属引脚（201）错位。

Description

柔性基板以及柔性面板 技术领域
本申请涉及显示技术领域，具体涉及一种柔性基板以及柔性面板。
 背景技术
现在市场上存在的显示模组包括显示基板、驱动芯片以及柔性线路板(Flexible Printed Circuit，FPC)等，这类显示模组广泛用于手机、平板电脑以及液晶显示屏上。
现有的显示基板与FPC进行绑定时，通过异性导电膜将显示基板上的导入焊盘与FPC的输出焊盘导通连接。但是由于FPC的材料是聚酰亚胺薄膜等膨胀系数大，而显示基板的材料通常是硅硼酸玻璃，在高温的情况下，FPC与显示基板之间会存在热胀缩系数插值，从而导致FPC与显示基板的位置无法准确地对应起来，因此使得产品良率降低。
 技术问题
本申请主要解决的技术问题，如何能够提高FPC与基板对位的精准度，从而提高了产品良率。
 技术解决方案
第一方面，本申请提供了一种柔性基板，包括：
衬底，以及设置在所述衬底上的柔性线路板；其中，
所述柔性线路板包括多个沿预设方向排列的引脚区，所述引脚区上设置有多个金属引脚，且相邻所述引脚区之间设置有一凹槽，以在所述柔性线路板与所述衬底对位时，防止所述金属引脚错位；
所述衬底具有一支撑面，所述支撑面上设置有一粘合胶层，所述柔性线路板通过所述粘合胶层与所述衬底粘接，且所述多个金属引脚通过所述粘合胶层与所述衬底进行电连接；
所述粘合胶层的材料为异性导电胶。
在本申请提供的柔性基板中，所述引脚区包括沿预设方向排列的第一区、第二区以及第三区，所述凹槽包括第一凹槽和第二凹槽；其中，所述第一凹槽设置在所述第一区和所述第二区之间，所述第二凹槽设置在所述第二区和所述第三区之间。
在本申请提供的柔性基板中，所述第一区的长度大于所述第二区长度，所述第二区的长度大于所述第三区的长度；其中，所述第一凹槽的截面面积大于所述第二凹槽的截面面积。
在本申请提供的柔性基板中，所述第一区的长度、所述第二区的长度以及所述第三区的长度均相等。
在本申请提供的柔性基板中，所述第一区的长度介于0至70毫米之间。
在本申请提供的柔性基板中，所述凹槽的纵深大于所述金属引脚的长度。
在本申请提供的柔性基板中，所述衬底上设置有多个突起部，所述突起部与所述凹槽一一对应，且所述凹槽的截面面积大于所述突起部的截面面积。
第二方面，本申请提供了一种柔性基板，包括：
衬底，以及设置在所述衬底上的柔性线路板；其中，
所述柔性线路板包括多个沿预设方向排列的引脚区，所述引脚区上设置有多个金属引脚，且相邻所述引脚区之间设置有一凹槽，以在所述柔性线路板与所述衬底对位时，防止所述金属引脚错位。
在本申请提供的柔性基板中，所述引脚区包括沿预设方向排列的第一区、第二区以及第三区，所述凹槽包括第一凹槽和第二凹槽；其中，所述第一凹槽设置在所述第一区和所述第二区之间，所述第二凹槽设置在所述第二区和所述第三区之间。
在本申请提供的柔性基板中，所述第一区的长度大于所述第二区长度，所述第二区的长度大于所述第三区的长度；其中，所述第一凹槽的截面面积大于所述第二凹槽的截面面积。
在本申请提供的柔性基板中，所述第一区的长度、所述第二区的长度以及所述第三区的长度均相等。
在本申请提供的柔性基板中，所述第一区的长度介于0至70毫米之间。
在本申请提供的柔性基板中，所述凹槽的纵深大于所述金属引脚的长度。
在本申请提供的柔性基板中，所述衬底上设置有多个突起部，所述突起部与所述凹槽一一对应，且所述凹槽的截面面积大于所述突起部的截面面积。
在本申请提供的柔性基板中，所述衬底具有一支撑面，所述支撑面上设置有一粘合胶层；其中，所述柔性线路板通过所述粘合胶层与所述衬底粘接，且所述多个金属引脚通过所述粘合胶层与所述衬底进行电连接。
在本申请提供的柔性基板中，所述粘合胶层的材料为异性导电胶。
在本申请提供的柔性基板中，所述衬底的材料为硅硼酸玻璃。
第三方面，本申请提供一种柔性面板，包括柔性基板；
所述柔性基板包括：
衬底，以及设置在所述衬底上的柔性线路板；其中，
所述柔性线路板包括多个沿预设方向排列的引脚区，所述引脚区上设置有多个金属引脚，且相邻所述引脚区之间设置有一凹槽，以在所述柔性线路板与所述衬底对位时，防止所述金属引脚错位。
在本申请提供的柔性面板中，所述引脚区包括沿预设方向排列的第一区、第二区以及第三区，所述凹槽包括第一凹槽和第二凹槽；其中，所述第一凹槽设置在所述第一区和所述第二区之间，所述第二凹槽设置在所述第二区和所述第三区之间。
在本申请提供的柔性面板中，所述第一区的长度大于所述第二区长度，所述第二区的长度大于所述第三区的长度；其中，所述第一凹槽的截面面积大于所述第二凹槽的截面面积。
 有益效果
本申请的有益效果是：通过在相邻所述引脚区之间设置有一凹槽，以在所述柔性线路板与所述衬底对位时，防止所述金属引脚错位。因此，能够提高柔性线路板与衬底对位的精准度，从而提高了产品良率。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对本申请实施例中所需要使用的附图进行说明。
图1为本申请提供的柔性基板的第一种实施方式的平面示意图；
图2为本申请提供的柔性基板的第一种实施方式的结构示意图；
图3为本申请提供的柔性基板的第二种实施方式的平面示意图；
图4为本申请提供的柔性基板的第三种实施方式的平面示意图。
 本发明的实施方式
下面详细描述本申请的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。
请参阅图1，图1为本申请提供的柔性基板的第一种实施方式的平面示意图。
本申请提供一种柔性基板1，包括：衬底10，以及设置在衬底10上的柔性线路板20；其中，柔性线路板20包括多个沿预设方向排列的引脚区21，引脚区21上设置有多个金属引脚201，且相邻引脚区21之间设置有一凹槽22。
例如，衬底10的材料可以是硅硼酸玻璃，衬底10上可以设置有多个驱动芯片11，该多个驱动芯片11与多个金属引脚201一一对应。
请结合图1以及图2，衬底10具有一支撑面，该支撑面上设置有一粘合胶层30，该粘合胶层30可以是异性导电胶。其中，柔性线路板20通过该粘合胶层30与衬底10粘接，且该多个金属引脚201通过该粘合胶层30与该衬底10进行电连接，即该多个金属引脚201通过该粘合胶层30与该多个驱动芯片11进行电连接。具体压合时，可以利用压合设备将多个金属引脚201通过热压的方式压合在该多个驱动芯片11上，在压合过程中，控制压合设备对衬底10上的异性导电胶30进行加热，使得该异性导电胶30中的树脂层发生反应，同时控制压合设备对该柔性线路板20向下接触加压，使得异性导电胶30中的导电粒子形成多个导通金属引脚201与驱动芯片11的导电通路，完成柔性线路板20与衬底10的绑定。
需要说明的是，在高温的情况下，柔性线路板20与衬底10之间会存在热胀缩系数插值，从而导致柔性线路板20与衬底10的位置无法准确地对应起来，因此，在相邻引脚区21之间设置有一凹槽22，以在柔性线路板20与衬底10对位时，防止金属引脚201错位造成短路，因此，能够提高FPC与基板对位的精准度，从而提高了产品良率。其中，凹槽22的纵深大于金属引脚201的长度。
请参阅图3，图3为本申请提供的柔性基板的第二种实施方式的平面示意图。
引脚区20包括沿预设方向排列的第一区211、第二区212以及第三区213，凹槽22包括第一凹槽221和第二凹槽222，其中，第一凹槽221设置在第一区211和第二区212之间，第二凹槽222设置在第二区212和第三区213之间。
该预设方向可以是水平方向，即第一区211、第二区212以及第三区213沿水平方向排列在该柔性线路板20上，其中，第一凹槽221的截面面积和第二凹槽222的截面面积具体根据第一区211的长度、第二区212的长度以及第三区213的长度进行设置。
比如，第一区211的长度、第二区212的长度以及第三区213的长度均相等，则第一凹槽221的截面面积等于第二凹槽222的截面面积。
又比如，第一区211的长度大于第二区212的长度，第二区212的长度大于第三区213的长度；其中，第一凹槽221的截面面积大于第二凹槽222的截面面积。
需要说明的是，由于单个引脚区21能容纳的总引脚数受到绑定时的制程限制影响，因此单个引脚区21不能超过70mm，否则会因驱动芯片11膨胀后错位造成短路。也就是说，单个引脚区21的长度介于0至70毫米之间，即第一区211的长度、第二区212的长度以及第三区213的长度均介于0至70毫米之间。
在本实施例中，通过在相邻所述引脚区21之间设置有一凹槽22，以在所述柔性线路板20与所述衬底10对位时，防止所述金属引脚201错位引起短路，因此，能够提高柔性线路板20与衬底10对位的精准度，从而提高了产品良率。同时，在相邻所述引脚区21之间设置有凹槽22还可以使得柔性线路板20的绑定区变宽，进而为液晶屏分辨率的提升而提供信号输入上的支持。
请参阅图4，图4为本申请提供的柔性基板的第三种实施方式的平面示意图。衬底10上设置有多个突起部12，突起部12与所述凹槽22一一对应，且凹槽22的截面面积大于突起部12的截面面积。
例如，突起部12收容于凹槽22内，并且，该突起部12与凹槽22的侧壁具有一定的间隔，该多个突起部12的厚度与柔性线路板20的厚度一致。在柔性线路板20与衬底10对位时，每个引脚区21中多个引脚201的受热均会发生膨胀。由于突起部12收容于凹槽22内，相邻引脚区21即便受热发生膨胀也不会相互影响，因此，进一步的提高了产品良率。
相应的，本申请还提供了一种柔性面板，包括上述实施例任一柔性基板，具体请参阅前面的实施例，在此不再赘述。
在本实施例中，通过在相邻引脚区21之间设置有一凹槽22，以在柔性线路板20与衬底10对位时，防止金属引脚201错位。因此，能够提高柔性线路板20与衬底10对位的精准度，从而提高了产品良率。同时，在衬底10上设置多个突起部12，突起部12与凹槽22一一对应，相邻引脚区21即便受热发生膨胀也不会相互影响。因此，进一步的提高了产品良率。
以上对本申请提供的柔性基板以及柔性面板进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请。同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种柔性基板，其包括：
    衬底，以及设置在所述衬底上的柔性线路板；其中，
    所述柔性线路板包括多个沿预设方向排列的引脚区，所述引脚区上设置有多个金属引脚，且相邻所述引脚区之间设置有一凹槽，以在所述柔性线路板与所述衬底对位时，防止所述金属引脚错位；
    所述衬底具有一支撑面，所述支撑面上设置有一粘合胶层，所述柔性线路板通过所述粘合胶层与所述衬底粘接，且所述多个金属引脚通过所述粘合胶层与所述衬底进行电连接；
    所述粘合胶层的材料为异性导电胶。
  2. 根据权利要求1所述的柔性基板，其中，所述引脚区包括沿预设方向排列的第一区、第二区以及第三区，所述凹槽包括第一凹槽和第二凹槽；其中，所述第一凹槽设置在所述第一区和所述第二区之间，所述第二凹槽设置在所述第二区和所述第三区之间。
  3. 根据权利要求2所述的柔性基板，其中，所述第一区的长度大于所述第二区长度，所述第二区的长度大于所述第三区的长度；其中，所述第一凹槽的截面面积大于所述第二凹槽的截面面积。
  4. 根据权利要求2所述的柔性基板，其中，所述第一区的长度、所述第二区的长度以及所述第三区的长度均相等。
  5. 根据权利要求4所述的柔性基板，其中，所述第一区的长度介于0至70毫米之间。
  6. 根据权利要求1所述的柔性基板，其中，所述凹槽的纵深大于所述金属引脚的长度。
  7. 根据权利要求6所述的柔性基板，其中，所述衬底上设置有多个突起部，所述突起部与所述凹槽一一对应，且所述凹槽的截面面积大于所述突起部的截面面积。
  8. 一种柔性基板，其包括：
    衬底，以及设置在所述衬底上的柔性线路板；其中，
    所述柔性线路板包括多个沿预设方向排列的引脚区，所述引脚区上设置有多个金属引脚，且相邻所述引脚区之间设置有一凹槽，以在所述柔性线路板与所述衬底对位时，防止所述金属引脚错位。
  9. 根据权利要求8所述的柔性基板，其中，所述引脚区包括沿预设方向排列的第一区、第二区以及第三区，所述凹槽包括第一凹槽和第二凹槽；其中，所述第一凹槽设置在所述第一区和所述第二区之间，所述第二凹槽设置在所述第二区和所述第三区之间。
  10. 根据权利要求9所述的柔性基板，其中，所述第一区的长度大于所述第二区长度，所述第二区的长度大于所述第三区的长度；其中，所述第一凹槽的截面面积大于所述第二凹槽的截面面积。
  11. 根据权利要求9所述的柔性基板，其中，所述第一区的长度、所述第二区的长度以及所述第三区的长度均相等。
  12. 根据权利要求11所述的柔性基板，其中，所述第一区的长度介于0至70毫米之间。
  13. 根据权利要求8所述的柔性基板，其中，所述凹槽的纵深大于所述金属引脚的长度。
  14. 根据权利要求13所述的柔性基板，其中，所述衬底上设置有多个突起部，所述突起部与所述凹槽一一对应，且所述凹槽的截面面积大于所述突起部的截面面积。
  15. 根据权利要求8所述的柔性基板，其中，所述衬底具有一支撑面，所述支撑面上设置有一粘合胶层；所述柔性线路板通过所述粘合胶层与所述衬底粘接，且所述多个金属引脚通过所述粘合胶层与所述衬底进行电连接。
  16. 根据权利要求15所述的柔性基板，其中，所述粘合胶层的材料为异性导电胶。
  17. 根据权利要求8所述的柔性基板，其中，所述衬底的材料为硅硼酸玻璃。
  18. 一种柔性面板，其包括柔性基板；
    所述柔性基板包括：
    衬底，以及设置在所述衬底上的柔性线路板；其中，
    所述柔性线路板包括多个沿预设方向排列的引脚区，所述引脚区上设置有多个金属引脚，且相邻所述引脚区之间设置有一凹槽，以在所述柔性线路板与所述衬底对位时，防止所述金属引脚错位。
  19. 根据权利要求18所述的柔性面板，其中，所述引脚区包括沿预设方向排列的第一区、第二区以及第三区，所述凹槽包括第一凹槽和第二凹槽；其中，所述第一凹槽设置在所述第一区和所述第二区之间，所述第二凹槽设置在所述第二区和所述第三区之间。
  20. 根据权利要求19所述的柔性面板，其中，所述第一区的长度大于所述第二区长度，所述第二区的长度大于所述第三区的长度；其中，所述第一凹槽的截面面积大于所述第二凹槽的截面面积。
PCT/CN2019/077137 2018-07-24 2019-03-06 柔性基板以及柔性面板 WO2020019721A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/476,305 US20200187359A1 (en) 2018-07-24 2019-03-06 Flexible substrate and flexible panel

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810820377.X 2018-07-24
CN201810820377.XA CN109003543A (zh) 2018-07-24 2018-07-24 一种柔性基板以及柔性面板

Publications (1)

Publication Number Publication Date
WO2020019721A1 true WO2020019721A1 (zh) 2020-01-30

Family

ID=64597173

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/077137 WO2020019721A1 (zh) 2018-07-24 2019-03-06 柔性基板以及柔性面板

Country Status (3)

Country Link
US (1) US20200187359A1 (zh)
CN (1) CN109003543A (zh)
WO (1) WO2020019721A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109003543A (zh) * 2018-07-24 2018-12-14 武汉华星光电技术有限公司 一种柔性基板以及柔性面板
CN109884830B (zh) * 2019-02-28 2021-09-21 京东方科技集团股份有限公司 阵列基板及其制作方法、显示装置、掩模板
CN110119225B (zh) * 2019-05-20 2022-05-10 业成科技（成都）有限公司 触控面板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101216619A (zh) * 2008-01-10 2008-07-09 友达光电股份有限公司 平面显示器及其制造方法和光电装置及其制造方法
TW201039501A (en) * 2009-04-21 2010-11-01 Sunrex Technology Corp Circuit board device
CN204808271U (zh) * 2015-07-02 2015-11-25 宸鸿科技(厦门)有限公司 软性电路板及其应用之触控装置
CN206353887U (zh) * 2016-12-16 2017-07-25 昆山意力电路世界有限公司 一种柔性高密度隔段式高对准金手指线路板
CN207733053U (zh) * 2017-11-23 2018-08-14 深圳市柔宇科技有限公司 柔性电路板及电子装置
CN109003543A (zh) * 2018-07-24 2018-12-14 武汉华星光电技术有限公司 一种柔性基板以及柔性面板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101216619A (zh) * 2008-01-10 2008-07-09 友达光电股份有限公司 平面显示器及其制造方法和光电装置及其制造方法
TW201039501A (en) * 2009-04-21 2010-11-01 Sunrex Technology Corp Circuit board device
CN204808271U (zh) * 2015-07-02 2015-11-25 宸鸿科技(厦门)有限公司 软性电路板及其应用之触控装置
CN206353887U (zh) * 2016-12-16 2017-07-25 昆山意力电路世界有限公司 一种柔性高密度隔段式高对准金手指线路板
CN207733053U (zh) * 2017-11-23 2018-08-14 深圳市柔宇科技有限公司 柔性电路板及电子装置
CN109003543A (zh) * 2018-07-24 2018-12-14 武汉华星光电技术有限公司 一种柔性基板以及柔性面板

Also Published As

Publication number Publication date
CN109003543A (zh) 2018-12-14
US20200187359A1 (en) 2020-06-11

Similar Documents

Publication Publication Date Title
US7903067B2 (en) Driver chip and display apparatus having the same
TW538272B (en) Method for manufacturing electro-optical device, method for connecting terminals, electro-optical device, and electronic apparatus
WO2017140055A1 (zh) 基板、覆晶薄膜及电子设备
US10971465B2 (en) Driving chip, display substrate, display device and method for manufacturing display device
CN100495171C (zh) 安装结构体、电光装置及电子设备
WO2020019721A1 (zh) 柔性基板以及柔性面板
CN107300792B (zh) 表面贴装方法
JP2002314212A (ja) フレキシブルプリント回路と配線基板との接続構造、その接続方法、液晶表示装置及びその製造方法
WO2013170463A1 (zh) 一种柔性电路板、覆晶薄膜及制作方法
TWI282007B (en) Equipment and method for fabricating a liquid crystal display
US20170338074A1 (en) Package structure of display panel, connecting board, package method and display device
JP6515151B2 (ja) 薄膜表示器及びフレキシブル回路板の積層方法及びその積層装置
US7538278B2 (en) Printed circuit board for preventing increase of thermal expansion
US20060001820A1 (en) Liquid crystal module
JP3791431B2 (ja) 実装構造体の製造装置
CN101685205B (zh) 芯片、芯片-玻璃接合的封装结构及液晶面板
CN100362653C (zh) 显示器组件
JP3823845B2 (ja) 実装構造体
US11527470B2 (en) Film package and method of fabricating package module
WO2020024191A1 (zh) 电子装置、显示装置、基底与导电层
US7219824B2 (en) Mechanism and process for compressing chips
TWI807407B (zh) 柔性電路板及其製作方法
KR20070032463A (ko) 하나의 이방성 전도필름을 이용하여 액정패널에 부착되는반도체칩 및 플렉시블 인쇄회로기판을 포함하는액정표시장치 및 그 제조방법
JP4055151B2 (ja) 実装構造体の製造装置及び製造方法
KR102058271B1 (ko) 박막 디스플레이 및 소프트 회로보드 프레스 본딩 방법 및 그 머신

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19841830

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19841830

Country of ref document: EP

Kind code of ref document: A1