WO2019127705A1 - 液晶显示装置 - Google Patents

液晶显示装置 Download PDF

Info

Publication number
WO2019127705A1
WO2019127705A1 PCT/CN2018/073049 CN2018073049W WO2019127705A1 WO 2019127705 A1 WO2019127705 A1 WO 2019127705A1 CN 2018073049 W CN2018073049 W CN 2018073049W WO 2019127705 A1 WO2019127705 A1 WO 2019127705A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
flexible circuit
liquid crystal
backlight module
display device
Prior art date
Application number
PCT/CN2018/073049
Other languages
English (en)
French (fr)
Inventor
白宇杰
黄俊宏
Original Assignee
武汉华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US15/996,421 priority Critical patent/US10509277B2/en
Publication of WO2019127705A1 publication Critical patent/WO2019127705A1/zh

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13454—Drivers integrated on the active matrix substrate
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13456—Cell terminals located on one side of the display only

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a liquid crystal display device.
  • the liquid crystal display has the characteristics of small size, low power consumption, relatively low manufacturing cost, and no radiation, and has a dominant position in the current flat panel display market.
  • Chip on Film is a driving unit used in a liquid crystal display device, and is usually bonded to the edge of a liquid crystal panel by means of hot pressing.
  • Narrow Bezel display products attract a large number of consumers because they can provide users with a better viewing experience.
  • it is generally required to bend the flip-chip film from the side of the liquid crystal panel to the back surface of the backlight module to reduce the space of the side frame occupied by the flip chip.
  • the driving chip is oriented toward the side of the backlight module on the flip chip.
  • the driving chip itself generates a large heat radiation
  • the backlight module also generates a large amount of heat radiation
  • the driving chip is directed toward the side of the backlight module, the backlight module is The distance is small, and the thermal radiation generated by the backlight module is superimposed with the thermal radiation generated by the driving chip itself, which will make the temperature of the driving chip too high.
  • the driving chip is an important component for transmitting and processing signals. If the temperature is too high, the stability of the working performance will be affected, thereby causing the reliability of the driving chip to be lowered, and even the driving chip may be damaged due to overheating.
  • the present invention provides a liquid crystal display device which can reduce the influence of heat generated by the backlight module on the driving chip, thereby improving the reliability of the driving chip.
  • a liquid crystal display device comprising:
  • a backlight module includes a light emitting surface and a back surface opposite to the light emitting surface;
  • liquid crystal panel disposed on a light emitting surface of the backlight module, wherein a signal binding end is disposed on a front surface of the liquid crystal panel facing away from the backlight module;
  • a flip chip comprising a flexible circuit board and a bonding portion and a driving chip disposed on the first surface of the flexible circuit board, the flexible circuit board being electrically connected to the signal binding end through the binding portion And bending and extending to the back of the backlight module;
  • the first surface of the flexible circuit board includes a first area facing away from the backlight module, and the driving chip is at a portion of the flexible circuit board that extends to a back surface of the backlight module. Connected in the first area.
  • the flip chip comprises a flexible circuit board
  • the binding portion comprises a first binding portion and a second binding portion
  • the first binding portion is located at the first end of the flexible circuit board, Electrically connecting the flexible circuit board to the signal binding end
  • the second binding portion is located at the second end of the flexible circuit board for electrically connecting the flexible circuit board to the printed circuit
  • a driving chip is located between the first binding portion and the second binding portion on a signal transmission line.
  • the flexible circuit board is provided with two or more bent portions between the first end and the second end, and the two or more bent portions cause the flexible circuit board to be bent in an S shape to extend to the The back side of the backlight module.
  • first bent portion and the second bent portion are disposed between the first end and the second end of the flexible circuit board, wherein the first surface is located at the second bent portion and the second portion An area between the ends faces away from the backlight module to form the first area.
  • the first binding portion is connected to the signal binding end by a first anisotropic conductive glue
  • the second binding portion is connected to the printed circuit board by a second anisotropic conductive glue.
  • the flip chip comprises a plurality of flexible circuit boards connected in sequence, and the first surfaces of the adjacent two flexible circuit boards connected to each other are opposite in direction, wherein at least one flexible circuit board is located on the back of the backlight module And the first surface thereof faces away from the backlight module to form the first region.
  • the flip chip includes a first flexible circuit board and a second flexible circuit board connected to each other, and the binding portion includes a first binding portion, a second binding portion, a third binding portion, and a fourth binding portion.
  • the first binding portion is located at the first end of the first flexible circuit board, and is configured to electrically connect the first flexible circuit board to the signal binding end; the second binding a second end of the first flexible circuit board for electrically connecting the first flexible circuit board to the second flexible circuit board;
  • the third binding portion is located at the second flexible circuit a first end of the board for electrically connecting the second flexible circuit board to the first flexible circuit board;
  • the fourth binding portion is located at a second end of the second flexible circuit board, Electrically connecting the second flexible circuit board to the printed circuit board;
  • the first surface of the second flexible circuit board faces away from the backlight module, and the driving chip is disposed on the second flexible circuit board On the surface.
  • first flexible portion is provided with a first bending portion between the first end and the second end, the first bending portion bending the second end of the first flexible circuit board to
  • the back surface of the backlight module is connected to the second end of the first flexible circuit board in a straight manner.
  • the first binding portion is connected to the signal binding end by a first anisotropic conductive glue, and the second binding portion is mutually coupled to the third binding portion by a second anisotropic conductive adhesive.
  • the fourth binding portion is connected to the printed circuit board by a third anisotropic conductive paste.
  • the flip chip comprises a gate flip chip for providing a scan signal and a source flip chip for providing a data signal.
  • the flip chip is bent to the back surface of the backlight module, and the driving chip is facing away from the backlight module on the flip chip, and the driving chip and the backlight module are enlarged.
  • the distance is beneficial to realize the design of the narrow bezel, and the influence of the heat generated by the backlight module on the driving chip is reduced, the performance degradation of the driving chip due to the excessive temperature is avoided, and the reliability of the driving chip is improved.
  • FIG. 1 is a schematic structural view of a liquid crystal display device according to Embodiment 1 of the present invention.
  • FIG. 2 is a schematic structural view of a flip chip of Embodiment 1 of the present invention.
  • FIG. 3 is a schematic structural diagram of a liquid crystal display device according to Embodiment 2 of the present invention.
  • FIG. 4 is a schematic view showing the structure of a flip chip in Embodiment 2 of the present invention.
  • the liquid crystal display device includes a backlight module 1 , a liquid crystal panel 2 , a flip chip 3 , and a printed circuit board 4 .
  • the backlight module 1 and the liquid crystal panel 2 are oppositely disposed.
  • the backlight module 1 includes a light emitting surface 1a and a back surface 1b opposite to the light emitting surface 1a.
  • the liquid crystal panel 2 is disposed on the backlight module.
  • a signal binding end 201 is disposed on the front surface 2a of the liquid crystal panel 2 facing away from the backlight module 1.
  • the liquid crystal panel 2 includes a thin film transistor array substrate 21 and a color filter substrate 22 disposed opposite to each other, and the signal bonding end 201 is disposed on an edge of the thin film transistor array substrate 21.
  • the flip chip 3 includes a flexible wiring board 30 and binding portions 32a, 32b and a driving chip 33 disposed on the first surface 31 of the flexible wiring board 30, the flexibility
  • the circuit board 30 is electrically connected to the signal binding end 201 and the printed circuit board 4 through the binding portions 32a, 32b, and the flexible circuit board 30 is bent and extended to the back of the backlight module 1. 1b. Further, in a portion where the flexible circuit board 30 is bent to extend to the back surface 1b of the backlight module 1, the first surface 31 of the flexible circuit board 30 includes a back surface of the backlight module 1.
  • the driving chip 33 is connected in the first region 31a, whereby the driving chip 33 is protruded from the first surface 31 in a direction away from the back surface of the backlight module 1.
  • the direction of 1b increases the distance between the driving chip 33 and the backlight module 1, and reduces the influence of the heat generated by the backlight module 1 on the driving chip 33.
  • the flip chip 3 includes a flexible circuit board 30, and the flexible circuit board 30 is provided with a first binding portion 32a and a second binding portion 32b.
  • the first binding portion 32a and the second binding portion 32b and the driving chip 33 are disposed on the first surface 31 of the flexible circuit board 30, that is, the first binding portion 32a and the second The binding portion 32b and the driving chip 33 are located on the same side of the flip chip 3.
  • the first binding portion 32a is located at a first end of the flexible circuit board 30, and is used for electrically connecting the flexible circuit board 30 to the signal binding end 201;
  • the fixed portion 32b is located at the second end of the flexible circuit board 30 for electrically connecting the flexible circuit board 30 to the printed circuit board 4;
  • the driving chip 33 is located at the first line on the signal transmission line Between the binding unit 32a and the second binding unit 32b.
  • the first binding portion 32a is connected to the signal binding end 201 by a first anisotropic conductive adhesive 51
  • the second binding portion 32b is connected to the second anisotropic conductive adhesive 52.
  • the printed circuit board 4 is described.
  • a first bent portion 301 and a second bent portion 302 are disposed between the first end and the second end of the flexible circuit board 30 , and the first bent portion 301 and the first portion
  • the two bent portions 302 cause the flexible circuit board 30 to be bent in an S shape to extend to the back surface 1b of the backlight module 1.
  • the area of the first surface 31 between the second bent portion 302 and the second end faces away from the backlight module 1 to form the first area 31a
  • the first The second region 31b of the surface 31 between the first bent portion 301 and the second bent portion 302 faces the backlight module 1.
  • the driving chip 33 is connected in the first region 31a, and the driving chip 33 is directed away from the back surface 1b of the backlight module 1.
  • the driving chip 33 and the backlight module 1 are separated by two segments of the flexible circuit board 30, This can also better prevent thermal radiation generated by the backlight module 1 from being applied to the driving chip 33.
  • a greater number of bends may be disposed between the first end and the second end of the flexible circuit board 30, and the plurality of bends also enable the The flexible wiring board 30 is bent and extended in an S shape.
  • the first surface 31 includes a plurality of regions facing away from the backlight module 1, and the driving chip 33 may be connected to any one of the plurality of regions.
  • the flip chip 3 includes a gate-on-film (Gate-COF) for supplying a scanning signal and a source-foam film (Source-COF) for supplying a data signal. Regardless of whether it is a gate-clad film or a source-clad film, the above assembly structure can be used to reduce the influence of heat generated by the backlight module on the driving chip.
  • Gate-COF gate-on-film
  • Source-COF source-foam film
  • the flip chip is bent to the back surface of the backlight module, and two or more bent portions are disposed, so that the driving chip is facing away from the backlight module on the flip chip.
  • the distance between the driving chip and the backlight module is increased, which is beneficial to realize the design of the narrow bezel, and reduces the influence of the heat generated by the backlight module on the driving chip, thereby avoiding the deterioration of the working performance of the driving chip due to the excessive temperature. Improve the reliability of the driver chip.
  • This embodiment provides a liquid crystal display device. Unlike the first embodiment, the flip-chip film of the present embodiment is different from the structure of the flip chip of the first embodiment.
  • the flip chip 6 includes a first flexible circuit board 61 and a second flexible circuit board 62 connected to each other, and the first flexible circuit board 61 is first.
  • the surface 611 is provided with a first binding portion 612 and a second binding portion 613.
  • the first surface 621 of the second flexible circuit board 62 is provided with a first binding portion 622, a second binding portion 623 and a driving Chip 63.
  • the first binding portion 612 is located at the first end of the first flexible circuit board 61 for electrically connecting the first flexible circuit board 61 to the signal binding end 201 of the liquid crystal panel 2;
  • the second binding portion 613 is located at the second end of the first flexible circuit board 61 for electrically connecting the first flexible circuit board 61 to the second flexible circuit board 62;
  • the third binding a fixed portion 622 is located at the first end of the second flexible circuit board 62 for electrically connecting the second flexible circuit board 62 to the first flexible circuit board 61;
  • the fourth binding portion 623 is located The second end of the second flexible circuit board 62 is configured to electrically connect the second flexible circuit board 62 to the printed circuit board 4.
  • the first end of the first flexible circuit board 61 is connected to the signal binding end 201 , and the second end is bent to extend to the back surface 1 b of the backlight module 1 .
  • the first surface 611 of the first flexible circuit board 61 faces the backlight module 1 .
  • the first end of the second flexible wiring board 62 is connected to the second end of the first flexible wiring board 61, and the first surface 621 of the second flexible wiring board 62 and the first flexible wiring board 61
  • the first surface 611 of the second flexible circuit board 62 faces away from the backlight module 1 , and the driving chip 63 is disposed on the second flexible circuit board 62 .
  • the direction in which the driving chip 63 protrudes from the first surface 621 is away from the back surface 1 b of the backlight module 1 , and the distance between the driving chip 33 and the backlight module 1 is increased, which is reduced.
  • a first bending portion 614 is disposed between the first end and the second end of the first flexible circuit board 61, and the first bending portion 614 makes the first flexible portion
  • the second end of the circuit board 61 is bent to extend to the back surface 1b of the backlight module 1, and the second flexible wiring board 62 is connected to the second end of the first flexible wiring board 61 in a straight shape.
  • the first binding portion 612 is connected to the signal binding end 201 by a first anisotropic conductive adhesive 71, and the second binding portion 613 passes the second anisotropy.
  • the conductive paste 72 is connected to the third bonding portion 622, and the fourth bonding portion 623 is connected to the printed circuit board 4 by a third anisotropic conductive paste 73.
  • the flip chip 6 may further include a greater number of flexible circuit boards.
  • a plurality of flexible circuit boards are sequentially connected to the second end of the second flexible circuit board 62, and The first surfaces of the adjacent two flexible circuit boards that are connected to each other are opposite in orientation. It is easy to understand that among a plurality of flexible circuit boards sequentially connected to each other, a part of the flexible circuit boards is similar to the first flexible circuit board 61, and the first surface thereof faces the backlight module 1 and the other portion of the flexible circuit board and the other flexible circuit board
  • the second flexible circuit board 62 is similar, and its first surface is facing away from the backlight module 1.
  • the driving chip 63 may be selectively connected to the second flexible circuit board 62, or may be selectively connected to any one of the flexible circuit boards having the first surface facing away from the backlight module 1.
  • the printed circuit board 4 is a flexible circuit board connected to the extreme end.
  • the flip chip is bent to the back surface of the backlight module, and the flip chip comprises two or more flexible circuit boards sequentially connected, wherein at least one flexible circuit board is located in the backlight module. a back surface and a first surface thereof facing away from the backlight module, wherein the driving chip is connected to the at least one flexible circuit board, thereby causing the driving chip to face away from the backlight module on the flip chip.
  • the distance between the driver chip and the backlight module is large, which is beneficial to realize the design of the narrow bezel, and reduces the influence of the heat generated by the backlight module on the driving chip, thereby avoiding the deterioration of the performance of the driving chip due to the excessive temperature.
  • the reliability of the driver chip is large, which is beneficial to realize the design of the narrow bezel, and reduces the influence of the heat generated by the backlight module on the driving chip, thereby avoiding the deterioration of the performance of the driving chip due to the excessive temperature.

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)

Abstract

一种液晶显示装置，其包括：背光模组(1)，包括出光面(1a)和与出光面(1a)相对的背面(1b)；液晶面板(2)，设置于背光模组(1)的出光面(1a)上，液晶面板(2)的背向背光模组(1)的前表面(2a)上设置有信号绑定端(201)；覆晶薄膜(3)，包括柔性线路板(30)和设置在柔性线路板(30)的第一表面(31)上的绑定部(32a,32b)和驱动芯片(33)，柔性线路板(30)通过绑定部(32a,32b)电性连接到信号绑定端(201)并弯折延伸至背光模组(1)的背面(1b)；其中，在柔性线路板(30)的弯折延伸至背光模组(1)的背面(1b)的部分，柔性线路板(30)的第一表面(31)包含有背向背光模组(1)的第一区域(31a)，驱动芯片(33)连接在第一区域(31a)中。液晶显示装置可以减少背光模组(1)产生的热量对驱动芯片(33)的影响，从而提高了驱动芯片(33)的可靠性。

Description

液晶显示装置 技术领域
本发明涉及显示技术领域,尤其涉及一种液晶显示装置。
背景技术
在平板显示装置中，液晶显示装置(Liquid Crystal Display，LCD)具有体积小、功耗低、制造成本相对较低和无辐射等特点，在当前的平板显示器市场占据了主导地位。
覆晶薄膜(Chip on Film，COF)是一种用于液晶显示装置上的驱动单元，通常借由热压的方式贴附绑定(bonding)于液晶面板的边缘上。随着显示技术的不断进步，具有窄边框(Narrow Bezel)的显示产品因其可以使用户获得较好的观看体验，吸引了大量的消费者。为了获得窄边框的液晶显示装置，通常需要将覆晶薄膜从液晶面板的侧面弯折至背光模组的背面，以减小覆晶薄膜所占用的侧边框的空间。
现有技术中，将覆晶薄膜弯折至背光模组的背面之后，驱动芯片在覆晶薄膜上是朝向靠近背光模组一侧。在液晶显示装置的工作期间，驱动芯片本身会产生较大的热辐射，同时背光模组也会产生大量的热辐射，而由于驱动芯片是朝向靠近背光模组一侧，其与背光模组的距离很小，背光模组产生的热辐射与驱动芯片本身产生的热辐射叠加，将会使得驱动芯片的温度过高。驱动芯片是传输和处理信号的重要部件，其温度过高将会影响到工作性能的稳定性，由此导致驱动芯片的可靠性降低，甚至会导致驱动芯片由于过热而损坏。
发明内容
有鉴于此，本发明提供了一种液晶显示装置，其可以减少背光模组产生的热量对驱动芯片的影响，从而提高了驱动芯片的可靠性。
为了实现上述目的，本发明采用了如下的技术方案：
一种液晶显示装置，其包括：
背光模组，包括出光面和与所述出光面相对的背面；
液晶面板，设置于所述背光模组的出光面上，所述液晶面板的背向所述背光模组的前表面上设置有信号绑定端；
覆晶薄膜，包括柔性线路板和设置在所述柔性线路板的第一表面上的绑定部和驱动芯片，所述柔性线路板通过所述绑定部电性连接到所述信号绑定端并弯折延伸至所述背光模组的背面；
其中，在所述柔性线路板的弯折延伸至所述背光模组的背面的部分，所述柔性线路板的第一表面包含有背向所述背光模组的第一区域，所述驱动芯片连接在所述第一区域中。
其中，所述覆晶薄膜包括一个柔性线路板，所述绑定部包括第一绑定部和第二绑定部；所述第一绑定部位于所述柔性线路板的第一端，用于将所述柔性线路板电性连接到所述信号绑定端；所述第二绑定部位于所述柔性线路板的第二端，用于将所述柔性线路板电性连接到印刷电路板；所述驱动芯片在信号传输的线路上位于所述第一绑定部和所述第二绑定部之间。
其中，所述柔性线路板的第一端和第二端之间设置有两个以上的弯折部，所述两个以上的弯折部使得所述柔性线路板呈S形状弯折延伸至所述背光模组的背面。
其中，所述柔性线路板的第一端和第二端之间设置有第一弯折部和第二弯折部，所述第一表面的位于所述第二弯折部和所述第二端之间的区域背向所述背光模组以形成所述第一区域。
其中，所述第一绑定部通过第一异方性导电胶连接到所述信号绑定端，所述第二绑定部通过第二异方性导电胶连接到所述印刷电路板。
其中，所述覆晶薄膜包括依次连接的多个柔性线路板，相互连接的相邻两个柔性线路板的第一表面的朝向相反，其中的至少一个柔性线路板位于所述背光模组的背面并且其第一表面为背向所述背光模组以形成所述第一区域。
其中，所述覆晶薄膜包括相互连接的第一柔性线路板和第二柔性线路板，所述绑定部包括第一绑定部、第二绑定部、第三绑定部和第四绑定部；所述第一绑定部位于所述第一柔性线路板的第一端，用于将所述第一柔性线路板电性连接到所述信号绑定端；所述第二绑定部位于所述第一柔性线路板的第二端， 用于将所述第一柔性线路板电性连接到所述第二柔性线路板；所述第三绑定部位于所述第二柔性线路板的第一端，用于将所述第二柔性线路板电性连接到所述第一柔性线路板；所述第四绑定部位于所述第二柔性线路板的第二端，用于将所述第二柔性线路板电性连接到印刷电路板；所述第二柔性线路板的第一表面背向所述背光模组，所述驱动芯片设置在所述第二柔性线路板的第一表面上。
其中，所述第一柔性线路板的第一端和第二端之间设置有第一弯折部，所述第一弯折部使得所述第一柔性线路板的第二端弯折延伸至所述背光模组的背面，所述第二柔性线路板呈平直状地连接到所述第一柔性线路板的第二端。
其中，所述第一绑定部通过第一异方性导电胶连接到所述信号绑定端，所述第二绑定部通过第二异方性导电胶与所述第三绑定部相互连接，所述第四绑定部通过第三异方性导电胶连接到所述印刷电路板。
其中，所述覆晶薄膜包括用于提供扫描信号的栅极覆晶薄膜和用于提供数据信号的源极覆晶薄膜。
本发明实施例提供的液晶显示装置，将覆晶薄膜弯折至背光模组的背面，并且驱动芯片在覆晶薄膜上是朝向背离背光模组一侧，增大了驱动芯片与背光模组的距离，在有利于实现窄边框设计的同时，减少了背光模组产生的热量对驱动芯片的影响，避免了驱动芯片因温度过高而导致工作性能劣化，提高了驱动芯片的可靠性。
附图说明
图1是本发明实施例1提供的液晶显示装置的结构示意图；
图2是本发明实施例1中的覆晶薄膜的结构示意图；
图3是本发明实施例2提供的液晶显示装置的结构示意图；
图4是本发明实施例2中的覆晶薄膜的结构示意图。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚，下面结合附图对本发明的具体实施方式进行详细说明。这些优选实施方式的示例在附图中进行了例示。附图中所示和根据附图描述的本发明的实施方式仅仅是示例性的，并且本发明并不限于这些实施方式。
在此，还需要说明的是，为了避免因不必要的细节而模糊了本发明，在附图中仅仅示出了与根据本发明的方案密切相关的结构和/或处理步骤，而省略了与本发明关系不大的其他细节。
实施例1
本实施例提供了一种液晶显示装置，如图1所示，所述液晶显示装置包括背光模组1、液晶面板2、覆晶薄膜3以及印刷电路板4。其中，所述背光模组1和所述液晶面板2相对设置，所述背光模组1包括出光面1a和与所述出光面1a相对的背面1b，所述液晶面板2设置于所述背光模组1的出光面1a上，所述液晶面板2的背向所述背光模组1的前表面2a上设置有信号绑定端201。具体地，所述液晶面板2包括相对设置的薄膜晶体管阵列基板21和彩色滤光基板22，所述信号绑定端201设置在所述薄膜晶体管阵列基板21的边缘上。
其中，参阅图1和图2，所述覆晶薄膜3包括柔性线路板30和设置在所述柔性线路板30的第一表面31上的绑定部32a、32b和驱动芯片33，所述柔性线路板30通过所述绑定部32a、32b电性连接到所述信号绑定端201和所述印刷电路板4，并且所述柔性线路板30弯折延伸至所述背光模组1的背面1b。进一步地，在所述柔性线路板30的弯折延伸至所述背光模组1的背面1b的部分，所述柔性线路板30的第一表面31包含有背向所述背光模组1的第一区域31a，所述驱动芯片33连接在所述第一区域31a中，由此，所述驱动芯片33从所述第一表面31上凸起的方向为朝向背离所述背光模组1的背面1b的方向，增大驱动芯片33与背光模组1的距离，减少了背光模组1产生的热量对驱动芯片33的影响。
在本实施例中，如图1和图2所示，所述覆晶薄膜3包括一个柔性线路板30，所述柔性线路板30上设置有第一绑定部32a和第二绑定部32b，所述第一绑定部32a和第二绑定部32b以及所述驱动芯片33设置于所述柔性线路板30的第一表面31上，即，所述第一绑定部32a和第二绑定部32b以及所述驱动芯片33位于所述覆晶薄膜3的同一侧。具体地，所述第一绑定部32a位于所述柔性线路板30的第一端，其用于将所述柔性线路板30电性连接到所述信号绑定端201；所述第二绑定部32b位于所述柔性线路板30的第二端，其用于将所述柔性线路板30电性连接到印刷电路板4；所述驱动芯片33在信号传输的线路上位于所述第一绑定部32a和所述第二绑定部32b之间。具体地，所述第一绑定部32a通过第一异方性导电胶51连接到所述信号绑定端201，所述第二绑定部 32b通过第二异方性导电胶52连接到所述印刷电路板4。
其中，如图1所示，所述柔性线路板30的第一端和第二端之间设置有第一弯折部301和第二弯折部302，所述第一弯折部301和第二弯折部302使得所述柔性线路板30呈S形状弯折延伸至所述背光模组1的背面1b。其中，所述第一表面31的位于所述第二弯折部302和所述第二端之间的区域背向所述背光模组1以形成所述第一区域31a，而所述第一表面31的位于所述第一弯折部301和所述第二弯折部302之间的第二区域31b则是面向所述背光模组1。所述驱动芯片33连接在所述第一区域31a中，所述驱动芯片33是朝向背离所述背光模组1的背面1b的方向。并且，从图1中可以看出，由于所述柔性线路板30是往返地弯折，因此所述驱动芯片33和所述背光模组1之间间隔着两段所述柔性线路板30，由此也可以更好地阻止所述背光模组1产生的热辐射施加在所述驱动芯片33上。
需要说明的是，在另外的一些实施例中，所述柔性线路板30的第一端和第二端之间也可以设置有更多数量的弯折部，多个弯折部也是使得所述柔性线路板30呈S形状弯折延伸。相比于以上实施例仅设置有两个弯折部的方案，设置有更多数量的弯折部仅仅是增加所述柔性线路板30的往返弯折的次数，此时，所述第一表面31包含有背向所述背光模组1的多个区域，所述驱动芯片33可以是连接在这些多个区域中的任意一个。
另外，在液晶显示装置中，所述覆晶薄膜3包括用于提供扫描信号的栅极覆晶薄膜(Gate-COF)和用于提供数据信号的源极覆晶薄膜(Source-COF)。不管是栅极覆晶薄膜还是源极覆晶薄膜，都可以采用以上的装配结构来减少背光模组产生的热量对驱动芯片的影响。
如上实施例提供的液晶显示装置，将覆晶薄膜弯折至背光模组的背面，并且设置了两个以上的弯折部，使得驱动芯片在覆晶薄膜上是朝向背离背光模组一侧，增大了驱动芯片与背光模组的距离，在有利于实现窄边框设计的同时，减少了背光模组产生的热量对驱动芯片的影响，避免了驱动芯片因温度过高而导致工作性能劣化，提高了驱动芯片的可靠性。
实施例2
本实施例提供了一种液晶显示装置，与实施例1不同的是，本实施例中的覆晶薄膜与实施例1中的覆晶薄膜的结构有所不同。
具体地，参阅图3和图4，本实施例中，所述覆晶薄膜6包括相互连接的第一柔性线路板61和第二柔性线路板62，所述第一柔性线路板61的第一表面611上设置有第一绑定部612和第二绑定部613，所述第二柔性线路板62的第一表面621上设置有第一绑定部622、第二绑定部623和驱动芯片63。
其中，所述第一绑定部612位于所述第一柔性线路板61的第一端，用于将所述第一柔性线路板61电性连接到液晶面板2的信号绑定端201；所述第二绑定部613位于所述第一柔性线路板61的第二端，用于将所述第一柔性线路板61电性连接到所述第二柔性线路板62；所述第三绑定部622位于所述第二柔性线路板62的第一端，用于将所述第二柔性线路板62电性连接到所述第一柔性线路板61；所述第四绑定部623位于所述第二柔性线路板62的第二端，用于将所述第二柔性线路板62电性连接到印刷电路板4。
进一步地，如图1所示，所述第一柔性线路板61的第一端连接到所述信号绑定端201，第二端则弯折延伸至所述所述背光模组1的背面1b，所述第一柔性线路板61的第一表面611面向所述背光模组1。所述第二柔性线路板62的第一端连接到所述第一柔性线路板61的第二端，并且所述第二柔性线路板62的第一表面621与所述第一柔性线路板61的第一表面611朝向相反，即，所述第二柔性线路板62的第一表面621是背向所述背光模组1，所述驱动芯片63设置在所述第二柔性线路板62的第一表面621上。由此，所述驱动芯片63从所述第一表面621上凸起的方向为朝向背离所述背光模组1的背面1b的方向，增大驱动芯片33与背光模组1的距离，减少了背光模组1产生的热量对驱动芯片63的影响。
具体地，如图3所示，所述第一柔性线路板61的第一端和第二端之间设置有第一弯折部614，所述第一弯折部614使得所述第一柔性线路板61的第二端弯折延伸至所述背光模组1的背面1b，所述第二柔性线路板62呈平直状地连接到所述第一柔性线路板61的第二端。
具体地，如图3所示，所述第一绑定部612通过第一异方性导电胶71连接到所述信号绑定端201，所述第二绑定部613通过第二异方性导电胶72与所述第三绑定部622相互连接，所述第四绑定部623通过第三异方性导电胶73连接到所述印刷电路板4。
进一步地，在另外的一些实施例中，所述覆晶薄膜6还可以包括更多数量的柔性线路板。具体地，参照以上实施例中的所述第一柔性线路板61和第二柔 性线路板62的连接方式，在所述第二柔性线路板62的第二端依次连接若干个柔性线路板，并且相互连接的相邻两个柔性线路板的第一表面的朝向相反。易于理解的是，在相互依次连接的多个柔性线路板中，其中一部分柔性线路板与第一柔性线路板61类似的，其第一表面是面向背光模组1，而另一部分柔性线路板与第二柔性线路板62类似的，其第一表面是背向背光模组1。此时，所述驱动芯片63可以选择连接在第二柔性线路板62，也可以选择连接在任意一个具有第一表面是背向背光模组1柔性线路板。其中，印刷电路板4则是连接到最末端的柔性线路板。
如上实施例提供的液晶显示装置，将覆晶薄膜弯折至背光模组的背面，所述覆晶薄膜包括两个以上依次连接的柔性线路板，其中的至少一个柔性线路板位于背光模组的背面并且其第一表面为背向所述背光模组，驱动芯片则是连接在所述至少一个柔性线路板上，由此使得驱动芯片在覆晶薄膜上是朝向背离背光模组一侧，增大了驱动芯片与背光模组的距离，在有利于实现窄边框设计的同时，减少了背光模组产生的热量对驱动芯片的影响，避免了驱动芯片因温度过高而导致工作性能劣化，提高了驱动芯片的可靠性。
需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。
以上所述仅是本申请的具体实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (15)

  1. 一种液晶显示装置，其中，包括：
    背光模组，包括出光面和与所述出光面相对的背面；
    液晶面板，设置于所述背光模组的出光面上，所述液晶面板的背向所述背光模组的前表面上设置有信号绑定端；
    覆晶薄膜，包括柔性线路板和设置在所述柔性线路板的第一表面上的绑定部和驱动芯片，所述柔性线路板通过所述绑定部电性连接到所述信号绑定端并弯折延伸至所述背光模组的背面；
    其中，在所述柔性线路板的弯折延伸至所述背光模组的背面的部分，所述柔性线路板的第一表面包含有背向所述背光模组的第一区域，所述驱动芯片连接在所述第一区域中。
  2. 根据权利要求1所述的液晶显示装置，其中，所述覆晶薄膜包括一个柔性线路板，所述绑定部包括第一绑定部和第二绑定部；其中，
    所述第一绑定部位于所述柔性线路板的第一端，用于将所述柔性线路板电性连接到所述信号绑定端；
    所述第二绑定部位于所述柔性线路板的第二端，用于将所述柔性线路板电性连接到印刷电路板；
    所述驱动芯片在信号传输的线路上位于所述第一绑定部和所述第二绑定部之间。
  3. 根据权利要求2所述的液晶显示装置，其中，所述柔性线路板的第一端和第二端之间设置有两个以上的弯折部，所述两个以上的弯折部使得所述柔性线路板呈S形状弯折延伸至所述背光模组的背面。
  4. 根据权利要求3所述的液晶显示装置，其中，所述柔性线路板的第一端和第二端之间设置有第一弯折部和第二弯折部，所述第一表面的位于所述第二弯折部和所述第二端之间的区域背向所述背光模组以形成所述第一区域。
  5. 根据权利要求2所述的液晶显示装置，其中，所述第一绑定部通过第一异方性导电胶连接到所述信号绑定端。
  6. 根据权利要求5所述的液晶显示装置，其中，所述印刷电路板通过第二异方性导电胶连接到所述第二绑定部。
  7. 根据权利要求2所述的液晶显示装置，其中，所述覆晶薄膜包括用于提供扫描信号的栅极覆晶薄膜和用于提供数据信号的源极覆晶薄膜。
  8. 根据权利要求2所述的液晶显示装置，其中，所述液晶面板包括相对设置的薄膜晶体管阵列基板和彩色滤光基板，所述信号绑定端设置在所述薄膜晶体管阵列基板的边缘上。
  9. 根据权利要求1所述的液晶显示装置，其中，所述覆晶薄膜包括依次连接的多个柔性线路板，相互连接的相邻两个柔性线路板的第一表面的朝向相反，其中的至少一个柔性线路板位于所述背光模组的背面并且其第一表面为背向所述背光模组以形成所述第一区域。
  10. 根据权利要求9所述的液晶显示装置，其中，所述覆晶薄膜包括相互连接的第一柔性线路板和第二柔性线路板，所述绑定部包括第一绑定部、第二绑定部、第三绑定部和第四绑定部；其中，
    所述第一绑定部位于所述第一柔性线路板的第一端，用于将所述第一柔性线路板电性连接到所述信号绑定端；
    所述第二绑定部位于所述第一柔性线路板的第二端，用于将所述第一柔性线路板电性连接到所述第二柔性线路板；
    所述第三绑定部位于所述第二柔性线路板的第一端，用于将所述第二柔性线路板电性连接到所述第一柔性线路板；
    所述第四绑定部位于所述第二柔性线路板的第二端，用于将所述第二柔性线路板电性连接到印刷电路板；
    所述第二柔性线路板的第一表面背向所述背光模组，所述驱动芯片设置在所述第二柔性线路板的第一表面上。
  11. 根据权利要求10所述的液晶显示装置，其中，所述第一柔性线路板的第一端和第二端之间设置有第一弯折部，所述第一弯折部使得所述第一柔性线路板的第二端弯折延伸至所述背光模组的背面，所述第二柔性线路板呈平直状地连接到所述第一柔性线路板的第二端。
  12. 根据权利要求10所述的液晶显示装置，其中，所述第一绑定部通过第一异方性导电胶连接到所述信号绑定端，所述第二绑定部通过第二异方性导电胶与所述第三绑定部相互连接。
  13. 根据权利要求12所述的液晶显示装置，其中，所述印刷电路板通过第三异方性导电胶连接到所述第四绑定部。
  14. 根据权利要求10所述的液晶显示装置，其中，所述覆晶薄膜包括用于提供扫描信号的栅极覆晶薄膜和用于提供数据信号的源极覆晶薄膜。
  15. 根据权利要求10所述的液晶显示装置，其中，所述液晶面板包括相对设置的薄膜晶体管阵列基板和彩色滤光基板，所述信号绑定端设置在所述薄膜晶体管阵列基板的边缘上。
PCT/CN2018/073049 2017-12-29 2018-01-17 液晶显示装置 WO2019127705A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/996,421 US10509277B2 (en) 2017-12-29 2018-06-01 Liquid crystal display device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201711483946.8A CN108008584B (zh) 2017-12-29 2017-12-29 液晶显示装置
CN201711483946.8 2017-12-29

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US15/996,421 Continuation US10509277B2 (en) 2017-12-29 2018-06-01 Liquid crystal display device

Publications (1)

Publication Number Publication Date
WO2019127705A1 true WO2019127705A1 (zh) 2019-07-04

Family

ID=62049439

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/073049 WO2019127705A1 (zh) 2017-12-29 2018-01-17 液晶显示装置

Country Status (2)

Country Link
CN (1) CN108008584B (zh)
WO (1) WO2019127705A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI793792B (zh) * 2020-10-15 2023-02-21 聯詠科技股份有限公司 發光二極體背光驅動器及顯示像素的發光二極體顯示驅動器
WO2023107519A1 (en) * 2021-12-07 2023-06-15 Meta Platforms Technologies, Llc Design to protect chip-on-flex for dual bending
EP4175264A4 (en) * 2020-08-04 2023-11-29 Samsung Electronics Co., Ltd. ELECTRONIC DEVICE WITH FLEXIBLE PLATE

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108684134B (zh) * 2018-05-10 2020-04-24 京东方科技集团股份有限公司 线路板和显示装置
CN110515481B (zh) * 2018-05-22 2023-05-26 鸿富锦精密工业（深圳）有限公司 电子装置及电子装置的制造方法
CN208188804U (zh) * 2018-05-25 2018-12-04 京东方科技集团股份有限公司 一种触控显示装置
CN108877501A (zh) * 2018-07-02 2018-11-23 京东方科技集团股份有限公司 显示面板及其制作方法、显示装置
CN108877528B (zh) * 2018-07-10 2020-03-17 武汉华星光电半导体显示技术有限公司 一种显示装置
CN110798970A (zh) * 2018-08-01 2020-02-14 鹏鼎控股(深圳)股份有限公司 具有柔性电路板的显示模组及其制作方法
CN109240013B (zh) * 2018-11-27 2022-03-11 上海中航光电子有限公司 显示面板和显示装置
CN111752057A (zh) * 2019-03-27 2020-10-09 北京小米移动软件有限公司 屏幕模组和电子设备
CN111752053A (zh) * 2019-03-27 2020-10-09 北京小米移动软件有限公司 屏幕模组和电子设备
CN110568681B (zh) * 2019-08-06 2021-03-16 深圳市华星光电半导体显示技术有限公司 显示面板及液晶显示器
CN111292614B (zh) * 2020-01-15 2022-07-12 京东方科技集团股份有限公司 显示模组、显示装置
CN113589964A (zh) 2020-04-30 2021-11-02 京东方科技集团股份有限公司 一种绑定电路板、显示装置和电器设备
CN112684624B (zh) * 2021-01-25 2023-04-25 惠科股份有限公司 液晶面板及液晶显示装置
CN215265347U (zh) * 2021-01-27 2021-12-21 京东方科技集团股份有限公司 弯折设备、弯折后的待弯折器件、显示装置
CN112927624A (zh) * 2021-03-18 2021-06-08 深圳市华星光电半导体显示技术有限公司 覆晶薄膜弯折装置与弯折方法、显示装置
CN113178137B (zh) * 2021-04-07 2022-09-27 Tcl华星光电技术有限公司 驱动基板及显示面板
CN116416857A (zh) * 2021-12-31 2023-07-11 华为技术有限公司 显示模组及电子设备
CN115083291B (zh) * 2022-07-25 2023-12-12 京东方科技集团股份有限公司 显示面板和显示装置
CN115909902A (zh) * 2022-12-01 2023-04-04 业泓科技(成都)有限公司 显示模组及其制备方法、显示装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090237588A1 (en) * 2008-03-19 2009-09-24 Hitachi Displays, Ltd. Liquid crystal display device
CN106814484A (zh) * 2016-12-26 2017-06-09 友达光电股份有限公司 显示装置
CN107193166A (zh) * 2017-06-06 2017-09-22 深圳天珑无线科技有限公司 一种显示装置及其制造方法
CN206541098U (zh) * 2017-03-21 2017-10-03 江西合力泰科技有限公司 一种液晶显示模组
CN107238964A (zh) * 2017-08-02 2017-10-10 深圳市华星光电技术有限公司 一种无边框液晶面板及其制作方法以及液晶模组

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003075857A (ja) * 2001-08-30 2003-03-12 Kyocera Corp 液晶表示装置
JP4561729B2 (ja) * 2006-11-06 2010-10-13 エプソンイメージングデバイス株式会社 電気光学装置及び電子機器
KR20110028124A (ko) * 2009-09-11 2011-03-17 삼성전자주식회사 액정 표시장치
CN107247372A (zh) * 2017-07-24 2017-10-13 武汉华星光电技术有限公司 一种显示装置及智能移动设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090237588A1 (en) * 2008-03-19 2009-09-24 Hitachi Displays, Ltd. Liquid crystal display device
CN106814484A (zh) * 2016-12-26 2017-06-09 友达光电股份有限公司 显示装置
CN206541098U (zh) * 2017-03-21 2017-10-03 江西合力泰科技有限公司 一种液晶显示模组
CN107193166A (zh) * 2017-06-06 2017-09-22 深圳天珑无线科技有限公司 一种显示装置及其制造方法
CN107238964A (zh) * 2017-08-02 2017-10-10 深圳市华星光电技术有限公司 一种无边框液晶面板及其制作方法以及液晶模组

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4175264A4 (en) * 2020-08-04 2023-11-29 Samsung Electronics Co., Ltd. ELECTRONIC DEVICE WITH FLEXIBLE PLATE
US11917759B2 (en) 2020-08-04 2024-02-27 Samsung Electronics Co., Ltd. Electronic device including flexible substrate
TWI793792B (zh) * 2020-10-15 2023-02-21 聯詠科技股份有限公司 發光二極體背光驅動器及顯示像素的發光二極體顯示驅動器
US11823635B2 (en) 2020-10-15 2023-11-21 Novatek Microelectronics Corp. LED backlight driver and LED driver of display pixels
WO2023107519A1 (en) * 2021-12-07 2023-06-15 Meta Platforms Technologies, Llc Design to protect chip-on-flex for dual bending

Also Published As

Publication number Publication date
CN108008584A (zh) 2018-05-08
CN108008584B (zh) 2020-11-13

Similar Documents

Publication Publication Date Title
WO2019127705A1 (zh) 液晶显示装置
US10509277B2 (en) Liquid crystal display device
US10585315B2 (en) Display panel and display apparatus thereof
US10721820B2 (en) Display device
US9210804B2 (en) Display device
CN109065589B (zh) 显示面板
WO2020124740A1 (zh) 一种柔性显示装置
US10809431B2 (en) Polarizer and touch device
JP4455570B2 (ja) 平板表示装置及び携帯用表示機器
CN108766250B (zh) 背光板和显示装置
TWI598661B (zh) 顯示裝置
US9874793B2 (en) Narrow frame liquid crystal display and method for producing the same, large screen liquid crystal display apparatus
CN106057082A (zh) 显示装置
US11537179B2 (en) Display panel, fabricating method thereof and display device
CN109496067B (zh) 柔性电路板、显示面板和显示装置
US10224346B2 (en) Display apparatus with curved contacts
WO2013179822A1 (ja) 表示モジュール及び表示装置
US10910450B2 (en) Chip on film package and display device
TWI637676B (zh) 具有覆晶薄膜封裝結構的穿戴式裝置
KR20080018729A (ko) 디스플레이 장치 및 이의 플렉시블 기판
JP2007086627A (ja) 液晶表示モジュール
TWI721836B (zh) 顯示裝置及拼接式顯示模組
US11682851B2 (en) Display device and connection method thereof
CN114842760B (zh) 显示模组和显示装置
TWI742681B (zh) 顯示裝置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18895121

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18895121

Country of ref document: EP

Kind code of ref document: A1