WO2020113836A1 - 显示面板、掩膜版以及显示设备 - Google Patents

显示面板、掩膜版以及显示设备 Download PDF

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Publication number
WO2020113836A1
WO2020113836A1 PCT/CN2019/077628 CN2019077628W WO2020113836A1 WO 2020113836 A1 WO2020113836 A1 WO 2020113836A1 CN 2019077628 W CN2019077628 W CN 2019077628W WO 2020113836 A1 WO2020113836 A1 WO 2020113836A1
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WO
WIPO (PCT)
Prior art keywords
inorganic layer
display panel
length
layer
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/077628
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English (en)
French (fr)
Inventor
陈娥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US16/339,365 priority Critical patent/US11043657B1/en
Publication of WO2020113836A1 publication Critical patent/WO2020113836A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/411—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H10D86/0231—Manufacture or treatment of multiple TFTs using masks, e.g. half-tone masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present application relates to the field of display technology, in particular to a display panel, a mask, and a display device.
  • the active matrix organic light-emitting diode (Active-matrix Organic light-emitting diode (AMOLED) has attracted more and more attention and research due to its advantages of high contrast, wide viewing angle, and bendability.
  • AMOLED Active-matrix Organic light-emitting diode
  • a mask plate is usually used to make a display panel.
  • This traditional structure of the mask plate requires strict control of position accuracy and occlusion during preparation and use. When some cells exceed the technical specifications, it is necessary Replacing the mask plate, on the one hand, the manufacturing process is more complicated, on the other hand, the mask plate has a shorter service life and a larger manufacturing cost.
  • Embodiments of the present application provide a display panel, a mask plate for making a display panel, and a display device, which can effectively reduce the complexity of the manufacturing process and the manufacturing cost, increase the service life of the mask plate, and effectively reduce the production cost.
  • an embodiment of the present application provides a display panel, including:
  • a crack blocking structure is provided on the first flexible layer, the crack blocking structure includes a cutting portion and concave portions on both sides of the cutting portion, the concave portion includes an opening and from the opening to the first In the cavity extending inside the flexible layer, the first inorganic layer and the second inorganic layer are disconnected at the opening of the concave portion, and when the cutting portion cuts the display panel, the concave portion is used for Cracks of the first inorganic layer and the second inorganic layer are prevented from extending to both sides of the crack blocking structure.
  • the length of the opening of the recessed portion away from the cutting portion to the cutting portion is greater than the sum of the deviation length and the effective length, and the deviation length is the cutting portion
  • the offset length is the effective length in the horizontal direction of the thermal influence generated by cutting the cutting part.
  • the opening length of the opening of the concave portion in the horizontal direction is greater than the sum of the vertical thickness of the first inorganic layer and the vertical thickness of the second inorganic layer, so that The first inorganic layer and the second inorganic layer flow into the inner cavity of the concave portion.
  • the vertical length of the inner cavity of the recessed portion is greater than the sum of the vertical thickness of the first inorganic layer and the vertical thickness of the second inorganic layer.
  • the vertical length of the concave portion is smaller than the vertical thickness of the first flexible layer.
  • the side wall of the inner cavity of the inner recess extends horizontally with respect to the central axis of the inner recess to form a sub-inner cavity, and the sub-inner cavity is used to The first inorganic layer and the second inorganic layer are disconnected in the inner cavity of the concave portion.
  • the length of the bottom of the inner cavity of the recessed portion in the horizontal direction is greater than the opening length of the opening of the recessed portion in the horizontal direction.
  • a thin film transistor and a light emitting device are further provided between the first flexible layer and the first inorganic layer, the thin film transistor partially covers the first flexible layer, and the light is emitted
  • the device is disposed on the thin film transistor.
  • an organic encapsulation layer is provided between the first inorganic layer and the second inorganic layer.
  • the substrate includes a second flexible layer and an isolation layer disposed on the second flexible layer.
  • the first inorganic layer and the second inorganic layer are made of a mask plate, and the mask plate is made of a metal plate hollowed out inside and partially shielding the display panel
  • the shielding strip of the binding part is formed by welding.
  • an embodiment of the present application further provides a mask plate for manufacturing the display panel as described above.
  • the mask plate is used for manufacturing the first inorganic layer and the second inorganic layer of the display panel, including:
  • the plurality of shielding strips are perpendicular to the metal edge welded to both ends of each of the plurality of shielding strips, and the shielding strips are used to make the display During panel operation, the first inorganic layer and the second inorganic layer partially block the binding portion of the display panel to expose the binding position of the binding portion.
  • the plurality of shielding strips are arranged parallel to each other.
  • an embodiment of the present application further provides a display device, including a housing and a display panel, the display panel is disposed on the housing, the display panel includes:
  • a crack blocking structure is provided on the first flexible layer, the crack blocking structure includes a cutting portion and concave portions on both sides of the cutting portion, the concave portion includes an opening and from the opening to the first In the cavity extending inside the flexible layer, the first inorganic layer and the second inorganic layer are disconnected at the opening of the concave portion, and when the cutting portion cuts the display panel, the concave portion is used for Preventing the cracks of the first inorganic layer and the second inorganic layer from extending to both sides of the crack blocking structure, wherein the length of the opening of the concave portion away from the cutting portion to the cutting portion is greater than the deviation
  • the offset length is the offset length of the cutting part
  • the action length is the action length in the horizontal direction of the heat effect generated by cutting the cutting part
  • the vertical of the concave part The length is less than the vertical thickness of the first flexible layer.
  • the opening length of the opening of the concave portion in the horizontal direction is greater than the sum of the vertical thickness of the first inorganic layer and the vertical thickness of the second inorganic layer, so that The first inorganic layer and the second inorganic layer flow into the inner cavity of the concave portion.
  • the vertical length of the inner cavity of the recessed portion is greater than the sum of the vertical thickness of the first inorganic layer and the vertical thickness of the second inorganic layer.
  • the side wall of the inner cavity of the inner recess extends horizontally relative to the central axis of the inner recess to form a sub-inner cavity, and the sub-inner cavity is used to The first inorganic layer and the second inorganic layer are disconnected in the inner cavity of the concave portion.
  • the length of the bottom of the inner cavity of the recessed portion in the horizontal direction is greater than the opening length of the opening of the recessed portion in the horizontal direction.
  • a thin film transistor and a light emitting device are further provided between the first flexible layer and the first inorganic layer, the thin film transistor partially covers the first flexible layer, and the light is emitted
  • the device is disposed on the thin film transistor.
  • a display panel provided by an embodiment of the present application includes a substrate, a first flexible layer, a first inorganic layer, and a second inorganic layer stacked in this order from bottom to top; wherein, a crack blocking structure is provided on the first flexible layer,
  • the crack blocking structure includes a cutting portion and concave portions on both sides of the cutting portion, the concave portion includes an opening and an inner cavity extending from the opening into the first flexible layer, the first inorganic layer And the second inorganic layer is disconnected at the opening of the concave portion, and when the cutting portion cuts the display panel, the concave portion is used to prevent the first inorganic layer and the second inorganic layer Of cracks extend to both sides of the crack barrier structure. Therefore, the risk of packaging failure is reduced, and due to the existence of the crack barrier structure, the mask plate for manufacturing the display panel does not need too much shielding, which reduces the complexity of the manufacturing process and the manufacturing cost, and increases the service life of the mask plate.
  • FIG. 1 is a schematic structural diagram of a display device provided by an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a display panel provided by an embodiment of the present application.
  • FIG. 3 is another schematic structural diagram of a display panel provided by an embodiment of the present application.
  • FIG. 4 is another schematic structural diagram of a display panel provided by an embodiment of the present application.
  • FIG. 5 is another schematic structural diagram of a display panel provided by an embodiment of the present application.
  • FIG. 6 is a top view of a motherboard composed of multiple display panels provided by an embodiment of the present application.
  • FIG. 7 is a mask plate for manufacturing a display panel provided by an embodiment of the present application.
  • first and second are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.
  • features defined as “first” and “second” may explicitly or implicitly include one or more of the features.
  • the meaning of “plurality” is two or more, unless otherwise specifically limited.
  • connection should be understood in a broad sense, for example, it can be fixed connection or detachable Connected, or integrally connected; may be mechanical, electrical, or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediary, may be the connection between two elements or the interaction of two elements relationship.
  • the first feature “above” or “below” the second feature may include the direct contact of the first and second features, or may include the first and second features Contact not directly but through another feature between them.
  • the first feature is “above”, “above” and “above” the second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature.
  • the first feature is “below”, “below” and “below” the second feature includes that the first feature is directly below and obliquely below the second feature, or simply means that the first feature is less horizontal than the second feature.
  • Embodiments of the present application provide a display panel, a mask plate, and a display device.
  • the mask plate is used to make the display panel.
  • the display panel can be integrated into the display device.
  • the display device can be a smart wearable device, a smart phone, or a tablet computer. , Smart TV and other equipment.
  • a mask plate is usually used to make a display panel.
  • the mask plate of this traditional structure only exposes a portion of the display panel, and blocks all other non-display panel portions. Therefore, it is necessary to strictly control the position accuracy and occlusion during preparation and use. When some cells exceed the technical specifications, the mask plate needs to be replaced again.
  • the display panel made with the mask plate of the traditional structure needs to be added with a stopper to block the crack extension when the display panel is cut, and the manufacturing process is relatively cumbersome.
  • An embodiment of the present application provides a display device, including a housing and a display panel.
  • the display panel is disposed on the housing, and the display panel includes:
  • a crack blocking structure is provided on the first flexible layer, the crack blocking structure includes a cutting portion and concave portions on both sides of the cutting portion, the concave portion includes an opening and from the opening to the first In the cavity extending inside the flexible layer, the first inorganic layer and the second inorganic layer are disconnected at the opening of the concave portion, and when the cutting portion cuts the display panel, the concave portion is used for Preventing the cracks of the first inorganic layer and the second inorganic layer from extending to both sides of the crack blocking structure, wherein the length of the opening of the concave portion away from the cutting portion to the cutting portion is greater than the deviation
  • the offset length is the offset length of the cutting part
  • the action length is the action length in the horizontal direction of the heat effect generated by cutting the cutting part
  • the vertical of the concave part The length is less than the vertical thickness of the first flexible layer.
  • the opening length of the opening of the concave portion in the horizontal direction is greater than the sum of the vertical thickness of the first inorganic layer and the vertical thickness of the second inorganic layer, so that the first inorganic layer and the The second inorganic layer flows into the inner cavity of the inner recess.
  • the vertical length of the inner cavity of the concave portion is greater than the sum of the vertical thickness of the first inorganic layer and the vertical thickness of the second inorganic layer.
  • the side wall of the inner cavity of the inner recess extends horizontally with respect to the central axis of the inner recess to form a sub-inner cavity, and the sub-inner cavity is used to make the first inorganic layer
  • the second inorganic layer is disconnected in the inner cavity of the inner recess.
  • the length of the bottom of the inner cavity of the concave portion in the horizontal direction is greater than the opening length of the opening of the concave portion in the horizontal direction.
  • a thin film transistor and a light emitting device are further provided between the first flexible layer and the first inorganic layer, the thin film transistor partially covers the first flexible layer, and the light emitting device is provided on the thin film transistor .
  • FIG. 1 is a schematic structural diagram of a display device 1000 provided by an embodiment of the present application.
  • the display device 100 may include a display panel 100, a control circuit 200, and a housing 300. It should be noted that the display device 1000 shown in FIG. 1 is not limited to the above, and it may also include other devices, such as a camera, an antenna structure, and a pattern unlocking module.
  • the display panel 100 is disposed on the housing 200.
  • the display panel 100 may be fixed to the housing 200, and the display panel 100 and the housing 300 form a closed space to accommodate devices such as the control circuit 200.
  • the housing 300 may be made of a flexible material, such as a plastic housing or a silicone housing.
  • the control circuit 200 is installed in the housing 300.
  • the control circuit 200 may be the main board of the display device 1000.
  • the control circuit 200 may be integrated with a battery, an antenna structure, a microphone, a speaker, a headphone jack, a universal serial bus interface, One, two or more of the functional components such as camera, distance sensor, ambient light sensor, receiver and processor.
  • the display panel 100 is installed in the housing 300, and at the same time, the display panel 100 is electrically connected to the control circuit 200 to form a display surface of the display device 1000.
  • the display panel 100 may include a display area and a non-display area.
  • the display area can be used to display the screen of the display device 1000 or for user touch manipulation.
  • the non-display area can be used to set various functional components.
  • FIG. 2 is a schematic structural diagram of a display panel provided by an embodiment of the present application
  • FIG. 3 is another schematic structural diagram of a display panel provided by an embodiment of the present application.
  • the display panel 100 includes: a substrate 10, a first flexible layer 20, a first inorganic layer 30, and a second inorganic layer 40 stacked in this order from bottom to top; wherein,
  • a crack blocking structure 201 is provided on the first flexible layer 20.
  • the crack blocking structure 201 includes a cutting portion 2011 and inner concave portions 2012 located on both sides of the cutting portion 2011.
  • the inner concave portion 2012 includes an opening 20121 and The opening 20121 extends into the inner cavity 20122 of the first flexible layer 20, and the first inorganic layer 30 and the second inorganic layer 40 are disconnected at the opening 20121 of the inner concave portion 2012.
  • the concave portion 2012 is used to prevent cracks of the first inorganic layer 30 and the second inorganic layer 40 from extending to both sides of the crack blocking structure 201.
  • the crack blocking structure 201 includes a cutting portion 2011 and concave portions 2012 provided on both sides of the cutting portion 2011.
  • An opening 20121 of the concave portion 2012 is provided on the surface of the first flexible layer 20, and an internal cavity 20122 is formed by the opening 20121 A receiving cavity extending toward the inside of the first flexible layer 20.
  • a mask plate is used to make the continuous first inorganic layer 30 and the second inorganic layer 40, it will be formed on the first flexible layer 20, and the first inorganic layer 30 and the second inorganic layer 40 will be opened in the concave portion 2012 Disconnected at 20121, the receiving cavity is used to load the portion where the first inorganic layer 30 and the second inorganic layer 40 are broken.
  • the first inorganic layer 30 and the second inorganic layer 40 on the cutting portion 2011 may have cracks, and extend outward, and after extending to the inner concave portion 2012, the inner concave portion 2012 prevents The crack extends to both sides of the inner recess 2012.
  • the display panel provided by an embodiment of the present application includes: a substrate 10, a first flexible layer 20, a first inorganic layer 30, and a second inorganic layer 40 stacked in this order from bottom to top; wherein, on the first flexible layer 20 A crack blocking structure 201 is provided.
  • the crack blocking structure 201 includes a cutting portion 2011 and inner concave portions 2012 located on both sides of the cutting portion 2011.
  • the inner concave portion 2012 includes an opening 20121 and from the opening 20121 to the first An inner cavity 20122 extending inside the flexible layer 30, the first inorganic layer 30 and the second inorganic layer 40 are disconnected at the opening 20121 of the concave portion 2012, and the display panel 100 is cut at the cutting portion 2011 At this time, the concave portion 2012 is used to prevent the cracks of the first inorganic layer 30 and the second inorganic layer 40 from extending to both sides of the crack blocking structure 201. Therefore, the risk of packaging failure is reduced, and due to the existence of the crack barrier structure, the mask plate for manufacturing the display panel does not need too much shielding, which reduces the complexity of the manufacturing process and the manufacturing cost, and increases the service life of the mask plate.
  • the length W1 of the opening 20121 of the recessed portion 2012 away from the cutting portion 2011 to the cutting portion 2011 is greater than the sum of the deviation length and the effective length, which is the cutting length
  • the offset length of the portion, the effective length is the effective length in the horizontal direction of the thermal influence generated by cutting the cutting portion.
  • the length of W1 should be greater than the length of the deviation length and the thermal effect of cutting in the horizontal direction to prevent the thermal effect of cutting from affecting the packaging structure on both sides of the recessed portion 2012 and causing packaging failure.
  • the opening length 20123 of the opening 20121 of the recessed portion 2012 is greater than the sum of the vertical thickness of the first inorganic layer 30 and the vertical thickness of the second inorganic layer 40, to The first inorganic layer 30 and the second inorganic layer 40 flow into the inner cavity 20122 of the concave portion 2012.
  • the vertical length H of the inner cavity 20122 of the inner recess 2012 is greater than the sum of the vertical thickness of the first inorganic layer 30 and the vertical thickness of the second inorganic layer 40.
  • the vertical length H of the concave portion 2012 is smaller than the vertical thickness of the first flexible layer 20.
  • FIG. 3 is another schematic structural diagram of a display panel provided by an embodiment of the present application.
  • the side walls of the inner cavity 20122 of the inner recess 2012 extend to both sides in the horizontal direction relative to the central axis of the inner recess 2012 to form a sub-inner cavity, and the sub-inner cavity is used to make the first inorganic layer 30
  • the second inorganic layer 40 is disconnected in the inner cavity 20122 of the inner recess 2012.
  • the mask plate is formed vertically downward when the first inorganic layer 30 and the second inorganic layer 40 are formed. Therefore, if there is no sub cavity, the first inorganic layer 30 and the second inorganic layer 40 will be formed
  • the continuity in the inner cavity 20122 of the inner concave portion 2012 causes the crack to extend during cutting. Therefore, the provided sub-inner cavity 20122 can avoid continuous formation, so that the formed first inorganic layer 30 and the second inorganic layer 40 will be disconnected in the inner cavity 20122 of the inner recess 2012.
  • a small amount of the first inorganic layer 30 and the second inorganic layer 40 are deposited on the bottom of the inner cavity 20122, and the second inorganic layer 40 is deposited on the first inorganic layer 30.
  • FIG. 4 is another schematic structural diagram of a display panel provided by an embodiment of the present application.
  • the inner concave portion 2012 has a cross structure or other structure, which is not limited herein.
  • FIG. 5 is another schematic structural diagram of a display panel provided by an embodiment of the present application.
  • the length W4 of the bottom of the inner cavity 20122 of the inner recess 2012 in the horizontal direction is greater than the opening length W3 of the opening 20121 of the inner recess 2012 in the horizontal direction.
  • the length W4 of the bottom of the inner cavity 20122 in the horizontal direction is greater than the opening length W3 of the opening 20121 in the horizontal direction.
  • a thin film transistor 50 and a light emitting device 60 are further provided between the first flexible layer 20 and the first inorganic layer 30.
  • the thin film transistor 50 partially covers the first flexible layer 20.
  • the light emitting device 60 is provided on the thin film transistor 50.
  • an organic encapsulation layer 70 is provided between the first inorganic layer 30 and the second inorganic layer 40.
  • the first inorganic layer 30 and the second inorganic layer 40 can be formed by chemical vapor deposition (Chemical Vapor Deposition, CVD).
  • the thickness in the vertical direction is generally less than 1.5 ⁇ m.
  • the organic encapsulation layer 70 can be made by Ink Jet Printing (IJP).
  • the substrate 10 includes a second flexible layer 101 and an isolation layer 102 disposed on the second flexible layer 101.
  • the first flexible layer 20 and the second flexible layer 101 can be selected from high temperature resistant organic materials, such as polyimide spin coating or knife coating, or other high temperature resistant organic materials.
  • high temperature resistant organic materials such as polyimide spin coating or knife coating, or other high temperature resistant organic materials.
  • the isolation layer 102 may be a silicon oxide inorganic isolation layer.
  • FIG. 6 is a top view of a motherboard composed of multiple display panels provided by an embodiment of the present application
  • FIG. 7 is a mask for manufacturing a display panel provided by an embodiment of the present application.
  • the first inorganic layer 30 and the second inorganic layer 40 are made of a mask plate 300.
  • the mask plate 300 is formed by a metal plate 301 hollowed out inside and a binding portion 110 partially blocking the display panel 100
  • the shielding strip 302 is formed by welding.
  • the display panel provided by an embodiment of the present application includes: a substrate 10, a first flexible layer 20, a first inorganic layer 30, and a second inorganic layer 40 stacked in this order from bottom to top; wherein, on the first flexible layer 20 A crack blocking structure 201 is provided.
  • the crack blocking structure 201 includes a cutting portion 2011 and inner concave portions 2012 located on both sides of the cutting portion 2011.
  • the inner concave portion 2012 includes an opening 20121 and from the opening 20121 to the first An inner cavity 20122 extending inside the flexible layer 30, the first inorganic layer 30 and the second inorganic layer 40 are disconnected at the opening 20121 of the concave portion 2012, and the display panel 100 is cut at the cutting portion 2011 At this time, the concave portion 2012 is used to prevent the cracks of the first inorganic layer 30 and the second inorganic layer 40 from extending to both sides of the crack blocking structure 201. Therefore, the risk of packaging failure is reduced, and due to the existence of the crack barrier structure, the mask plate for manufacturing the display panel does not need too much shielding, which reduces the complexity of the manufacturing process and the manufacturing cost, and increases the service life of the mask plate.
  • the multiple molds are used to prepare a crack blocking structure
  • a thin film transistor partially covering the first flexible layer is provided on the cured first flexible layer
  • the light-emitting panel to be packaged is packaged to obtain a display panel.
  • the manufacturing method of the display panel provided by the embodiment of the present application is applied to a display device.
  • the display panel includes: a substrate, a first flexible layer, a first inorganic layer, and a second inorganic layer stacked in this order from bottom to top;
  • a crack blocking structure is provided on the first flexible layer, and the crack blocking structure includes a cutting portion and inner concave portions on both sides of the cutting portion, the inner concave portion includes an opening and from the opening to the first flexible In the cavity extending inside the layer, the first inorganic layer and the second inorganic layer are disconnected at the opening of the concave portion, and when the cutting portion cuts the display panel, the concave portion is used to prevent
  • the cracks of the first inorganic layer and the second inorganic layer extend to both sides of the crack blocking structure. Therefore, the risk of packaging failure is reduced, and due to the existence of the crack barrier structure, the mask plate for manufacturing the display panel does not need too much shielding, which reduces the complexity of the manufacturing process and the manufacturing cost,
  • An embodiment of the present application further provides a mask 300 for manufacturing the above display panel 100.
  • the mask 300 is used for manufacturing the first inorganic layer 30 and the second inorganic layer 40 of the display panel 100, including:
  • the plurality of shielding strips 302 are perpendicular to the metal edges welded to both ends of each of the plurality of shielding strips 302, and the shielding strips 302 are used to make the display panel At 100, the first inorganic layer 30 and the second inorganic layer 40 partially block the binding portion 110 of the display panel to expose the binding position 1101 of the binding portion 110.
  • the plurality of blocking bars 302 are arranged parallel to each other.
  • the mask plate 300 provided in the embodiment of the present application is used for manufacturing the first inorganic layer 30 and the second inorganic layer 40 of the display panel 100, and includes: a metal plate 301 hollowed out inside and a plurality of shielding strips 302. The two ends of each of the plurality of shielding bars 302 are welded to the metal edge of the metal plate 301.
  • the structure of the mask is simplified, the production difficulty and cost are reduced, and the accuracy and masking requirements of the mask are also reduced, and the service life of the mask is increased.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

显示面板、掩膜版及显示设备，包括：从下至上依次层叠设置的基板、第一柔性层、第一无机层、第二无机层；在第一柔性层上设置有裂纹阻挡结构，其包括切割部及位于切割部两侧的内凹部，第一无机层及第二无机层在内凹部开口处断开，切割部切割显示面板时，内凹部用于阻止第一无机层及第二无机层的裂纹向裂纹阻挡结构两侧延伸。

Description

显示面板、掩膜版以及显示设备 技术领域
本申请涉及显示技术领域，具体涉及一种显示面板、掩膜版以及显示设备。
 背景技术
近年来，相较于传统的液晶显示屏（Liquid Crystal Display，LCD），有源矩阵有机发光二极管（Active-matrix organic light-emitting diode，AMOLED）以其高对比度、广视角、可实现弯折等优势受到了越来越多的关注和研究。
现有技术中，通常使用掩膜版来制作显示面板，这种传统结构的掩膜版在制备和使用过程中都需严格控制位置精度、遮挡问题，当部分单元格超过技术规格时，就需重新更换掩膜版，一方面制作工艺较复杂，另一方面掩膜版的使用寿命较短，制作成本较大。
因此，现有技术存在缺陷，急需改进。
 技术问题
本申请实施例提供一种显示面板、制作显示面板的掩膜版以及显示设备，可以有效降低制作工艺复杂程度以及制作成本，提高掩膜版的使用寿命，从而有效降低生产成本。
 技术解决方案
第一方面，本申请实施例提供一种显示面板，包括：
从下至上依次层叠设置的基板、第一柔性层、第一无机层、第二无机层；其中，
在所述第一柔性层上设置有裂纹阻挡结构，所述裂纹阻挡结构包括切割部以及位于所述切割部两侧的内凹部，所述内凹部包括开口以及自所述开口向所述第一柔性层内部延伸的内腔，所述第一无机层以及所述第二无机层在所述内凹部的开口处断开，在所述切割部切割所述显示面板时，所述内凹部用于阻止所述第一无机层以及所述第二无机层的裂纹向裂纹阻挡结构的两侧延伸。
在本申请所述的显示面板中，所述内凹部的开口远离所述切割部的一侧到所述切割部的长度大于偏离长度与作用长度之和，所述偏离长度为切割所述切割部的偏离长度，所述作用长度为切割所述切割部产生的热影响在水平方向上的作用长度。
在本申请所述的显示面板中，所述内凹部的开口在水平方向上的开口长度大于所述第一无机层的竖直厚度与所述第二无机层的竖直厚度之和，以使所述第一无机层与所述第二无机层流入所述内凹部的内腔中。
在本申请所述的显示面板中，所述内凹部的内腔的竖直长度大于所述第一无机层的竖直厚度与所述第二无机层的竖直厚度之和。
在本申请所述的显示面板中，所述内凹部的竖直长度小于所述第一柔性层的竖直厚度。
在本申请所述的显示面板中，所述内凹部的内腔的侧壁相对于所述内凹部的中轴线向水平方向两侧延伸，以形成子内腔，所述子内腔用于使所述第一无机层与所述第二无机层在所述内凹部的内腔中断开。
在本申请所述的显示面板中，所述内凹部的内腔的底部在水平方向上的长度大于所述内凹部的开口在水平方向上的开口长度。
在本申请所述的显示面板中，所述第一柔性层与所述第一无机层之间还设置有薄膜晶体管以及发光器件，所述薄膜晶体管部分覆盖所述第一柔性层，所述发光器件设置在所述薄膜晶体管上。
在本申请所述的显示面板中，所述第一无机层与所述第二无机层之间设置有一有机封装层。
在本申请所述的显示面板中，所述基板包括：第二柔性层以及设置在所述第二柔性层上的隔离层。
在本申请所述的显示面板中，所述第一无机层以及所述第二无机层由掩膜版制作而成，所述掩膜版由内部镂空的金属板以及部分遮挡所述显示面板的绑定部的遮挡条焊接形成。
第二方面，本申请实施例还提供一种制作如上所述的显示面板的掩膜版，所述掩膜版用于制作所述显示面板的第一无机层以及第二无机层，包括：
一内部镂空的金属板以及多条遮挡条，所述多条遮挡条中每一遮挡条的两端焊接在所述金属板的金属边上。
在本申请所述的掩膜版中，所述多条遮挡条垂直于与所述多条遮挡条中每一遮挡条两端焊接的所述金属边，所述遮挡条用于制作所述显示面板时，所述第一无机层以及第二无机层部分遮挡所述显示面板的绑定部以露出所述绑定部的绑定位。
在本申请所述的掩膜版中，所述多条遮挡条相互平行设置。
第三方面，本申请实施例还提供一种显示设备，包括壳体以及显示面板，所述显示面板设置在所述壳体上，所述显示面板包括：
从下至上依次层叠设置的基板、第一柔性层、第一无机层、第二无机层；其中，
在所述第一柔性层上设置有裂纹阻挡结构，所述裂纹阻挡结构包括切割部以及位于所述切割部两侧的内凹部，所述内凹部包括开口以及自所述开口向所述第一柔性层内部延伸的内腔，所述第一无机层以及所述第二无机层在所述内凹部的开口处断开，在所述切割部切割所述显示面板时，所述内凹部用于阻止所述第一无机层以及所述第二无机层的裂纹向裂纹阻挡结构的两侧延伸，其中，所述内凹部的开口远离所述切割部的一侧到所述切割部的长度大于偏离长度与作用长度之和，所述偏离长度为切割所述切割部的偏离长度，所述作用长度为切割所述切割部产生的热影响在水平方向上的作用长度，所述内凹部的竖直长度小于所述第一柔性层的竖直厚度。
在本申请所述的显示设备中，所述内凹部的开口在水平方向上的开口长度大于所述第一无机层的竖直厚度与所述第二无机层的竖直厚度之和，以使所述第一无机层与所述第二无机层流入所述内凹部的内腔中。
在本申请所述的显示设备中，所述内凹部的内腔的竖直长度大于所述第一无机层的竖直厚度与所述第二无机层的竖直厚度之和。
在本申请所述的显示设备中，所述内凹部的内腔的侧壁相对于所述内凹部的中轴线向水平方向两侧延伸，以形成子内腔，所述子内腔用于使所述第一无机层与所述第二无机层在所述内凹部的内腔中断开。
在本申请所述的显示设备中，所述内凹部的内腔的底部在水平方向上的长度大于所述内凹部的开口在水平方向上的开口长度。
在本申请所述的显示设备中，所述第一柔性层与所述第一无机层之间还设置有薄膜晶体管以及发光器件，所述薄膜晶体管部分覆盖所述第一柔性层，所述发光器件设置在所述薄膜晶体管上。
 有益效果
本申请实施例提供的显示面板，包括从下至上依次层叠设置的基板、第一柔性层、第一无机层、第二无机层；其中，在所述第一柔性层上设置有裂纹阻挡结构，所述裂纹阻挡结构包括切割部以及位于所述切割部两侧的内凹部，所述内凹部包括开口以及自所述开口向所述第一柔性层内部延伸的内腔，所述第一无机层以及所述第二无机层在所述内凹部的开口处断开，在所述切割部切割所述显示面板时，所述内凹部用于阻止所述第一无机层以及所述第二无机层的裂纹向裂纹阻挡结构的两侧延伸。从而降低了封装失败的风险，并且由于裂纹阻挡结构的存在，制作显示面板的掩膜版也无需过多遮挡，降低制作工艺复杂程度以及制作成本，提高掩膜版的使用寿命。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的显示设备的结构示意图。
图2为本申请实施例提供的显示面板的结构示意图。
图3为本申请实施例提供的显示面板的另一结构示意图。
图4为本申请实施例提供的显示面板的又一结构示意图。
图5为本申请实施例提供的显示面板的再一结构示意图。
图6为本申请实施例提供的由多个显示面板组成的母板的俯视图。
图7为本申请实施例提供的制作显示面板的掩膜版。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
本申请实施例提供一种显示面板、掩膜版以及显示设备，掩膜版用于制作该显示面板，显示面板可以集成在显示设备中，该显示设备可以是智能穿戴设备、智能手机、平板电脑、智能电视等设备。
现有技术中，通常使用掩膜版来制作显示面板，这种传统结构的掩膜版只露出显示面板的部分，将其他非显示面板的部分全部遮挡。因此，在制备和使用过程中都需严格控制位置精度、遮挡问题，当部分单元格超过技术规格时，就需重新更换掩膜版。并且用传统结构的掩膜版制作的显示面板需要加装挡块以阻隔切割显示面板时的裂纹延伸，制作工艺较为繁琐。
本申请实施例提供一种显示设备，包括壳体以及显示面板，所述显示面板设置在所述壳体上，所述显示面板包括：
从下至上依次层叠设置的基板、第一柔性层、第一无机层、第二无机层；其中，
在所述第一柔性层上设置有裂纹阻挡结构，所述裂纹阻挡结构包括切割部以及位于所述切割部两侧的内凹部，所述内凹部包括开口以及自所述开口向所述第一柔性层内部延伸的内腔，所述第一无机层以及所述第二无机层在所述内凹部的开口处断开，在所述切割部切割所述显示面板时，所述内凹部用于阻止所述第一无机层以及所述第二无机层的裂纹向裂纹阻挡结构的两侧延伸，其中，所述内凹部的开口远离所述切割部的一侧到所述切割部的长度大于偏离长度与作用长度之和，所述偏离长度为切割所述切割部的偏离长度，所述作用长度为切割所述切割部产生的热影响在水平方向上的作用长度，所述内凹部的竖直长度小于所述第一柔性层的竖直厚度。
其中，所述内凹部的开口在水平方向上的开口长度大于所述第一无机层的竖直厚度与所述第二无机层的竖直厚度之和，以使所述第一无机层与所述第二无机层流入所述内凹部的内腔中。
其中，所述内凹部的内腔的竖直长度大于所述第一无机层的竖直厚度与所述第二无机层的竖直厚度之和。
其中，所述内凹部的内腔的侧壁相对于所述内凹部的中轴线向水平方向两侧延伸，以形成子内腔，所述子内腔用于使所述第一无机层与所述第二无机层在所述内凹部的内腔中断开。
其中，所述内凹部的内腔的底部在水平方向上的长度大于所述内凹部的开口在水平方向上的开口长度。
其中，所述第一柔性层与所述第一无机层之间还设置有薄膜晶体管以及发光器件，所述薄膜晶体管部分覆盖所述第一柔性层，所述发光器件设置在所述薄膜晶体管上。
请参阅图1，图1为本申请实施例提供的显示设备1000的结构示意图。该显示设备100可以包括显示面板100、控制电路200、以及壳体300。需要说明的是，图1所示的显示设备1000并不限于以上内容，其还可以包括其他器件，比如还可以包括摄像头、天线结构、纹解锁模块等。
其中，显示面板100设置于壳体200上。
在一些实施例中，显示面板100可以固定到壳体200上，显示面板100和壳体300形成密闭空间，以容纳控制电路200等器件。
在一些实施例中，壳体300可以为由柔性材料制成，比如为塑胶壳体或者硅胶壳体等。
其中，该控制电路200安装在壳体300中，该控制电路200可以为显示设备1000的主板，控制电路200上可以集成有电池、天线结构、麦克风、扬声器、耳机接口、通用串行总线接口、摄像头、距离传感器、环境光传感器、受话器以及处理器等功能组件中的一个、两个或多个。
其中，该显示面板100安装在壳体300中，同时，该显示面板100电连接至控制电路200上，以形成显示设备1000的显示面。该显示面板100可以包括显示区域和非显示区域。该显示区域可以用来显示显示设备1000的画面或者供用户进行触摸操控等。该非显示区域可用于设置各种功能组件。
进一步的，请参阅图2以及图3，图2为本申请实施例提供的显示面板的结构示意图，图3为本申请实施例提供的显示面板的另一结构示意图。
其中，该显示面板100包括：从下至上依次层叠设置的基板10、第一柔性层20、第一无机层30、第二无机层40；其中，
在所述第一柔性层20上设置有裂纹阻挡结构201，所述裂纹阻挡结构201包括切割部2011以及位于所述切割部2011两侧的内凹部2012，所述内凹部2012包括开口20121以及自所述开口20121向所述第一柔性层20内部延伸的内腔20122，所述第一无机层30以及所述第二无机层40在所述内凹部2012的开口20121处断开，在所述切割部2011切割所述显示面板100时，所述内凹部2012用于阻止所述第一无机层30以及所述第二无机层40的裂纹向裂纹阻挡结构201的两侧延伸。
具体的，裂纹阻挡结构201包括切割部2011以及设置在该切割部2011两侧的内凹部2012，内凹部2012的开口20121设置在第一柔性层20的表面上，内腔20122为由该开口20121向第一柔性层20的内部延伸形成的一个收容腔。当使用掩膜版来制作连续的第一无机层30以及第二无机层40时会在第一柔性层20上形成，并且第一无机层30与第二无机层40会在内凹部2012的开口20121处断开，该收容腔用于装载第一无机层30与第二无机层40断裂的部分。当在切割部2011处切割显示面板100时，切割部2011上的第一无机层30与第二无机层40存在裂纹的情况，并向外侧延伸，当延伸至内凹部2012后，内凹部2012阻止裂纹延伸至内凹部2012两侧。
本申请实施例提供的显示面板，包括：从下至上依次层叠设置的基板10、第一柔性层20、第一无机层30、第二无机层40；其中，在所述第一柔性层20上设置有裂纹阻挡结构201，所述裂纹阻挡结构201包括切割部2011以及位于所述切割部2011两侧的内凹部2012，所述内凹部2012包括开口20121以及自所述开口20121向所述第一柔性层30内部延伸的内腔20122，所述第一无机层30以及所述第二无机层40在所述内凹部2012的开口20121处断开，在所述切割部2011切割所述显示面板100时，所述内凹部2012用于阻止所述第一无机层30以及所述第二无机层40的裂纹向裂纹阻挡结构201的两侧延伸。从而降低了封装失败的风险，并且由于裂纹阻挡结构的存在，制作显示面板的掩膜版也无需过多遮挡，降低制作工艺复杂程度以及制作成本，提高掩膜版的使用寿命。
在一些实施例中，所述内凹部2012的开口20121远离所述切割部2011的一侧到所述切割部2011的长度W1大于偏离长度与作用长度之和，所述偏离长度为切割所述切割部的偏离长度，所述作用长度为切割所述切割部产生的热影响在水平方向上的作用长度。
可以理解，当对显示面板100进行切割时，由于采用机械臂或其他方式切割，存在精度上的误差，因此会有切割偏离。并且，切割所产生的热量也会使裂纹阻挡结构201两侧的封装层断裂。因此，W1的长度应大于偏离长度与切割产生的热影响在水平方向上的作用长度，以防止切割产生的热影响会对内凹部2012两侧的封装结构造成影响进而造成封装失败。
在一些实施例中，所述内凹部2012的开口20121在水平方向上的开口长度W3大于所述第一无机层30的竖直厚度与所述第二无机层40的竖直厚度之和，以使所述第一无机层30与所述第二无机层40流入所述内凹部2012的内腔20122中。
在一些实施例中，所述内凹部2012的内腔20122的竖直长度H大于所述第一无机层30的竖直厚度与所述第二无机层40的竖直厚度之和。
在一些实施例中，所述内凹部2012的竖直长度H小于所述第一柔性层20的竖直厚度。
在一些实施例中，请参阅图3，图3为本申请实施例提供的显示面板的另一结构示意图。所述内凹部2012的内腔20122的侧壁相对于所述内凹部2012的中轴线向水平方向两侧延伸，以形成子内腔，所述子内腔用于使所述第一无机层30与所述第二无机层40在所述内凹部2012的内腔20122中断开。
其中，掩膜版在形成第一无机层30以及第二无机层40时，是竖直向下形成的，因此，若是没有子内腔，形成的第一无机层30以及第二无机层40会在内凹部2012的内腔20122中连续，造成切割时裂纹的延伸。因此，设置的子内腔20122可以避免连续形成，以使形成的第一无机层30以及第二无机层40会在内凹部2012的内腔20122中断开。
在一些实施例中，内腔20122底部会沉积有少许第一无机层30以及第二无机层40，第二无机层40沉积在第一无机层30上。
在一些实施例中，如图4所示，图4为本申请实施例提供的显示面板的又一结构示意图。内凹部2012呈十字结构，或者其他结构，这里不作限定。
在一些实施例中，如图2以及图5所示，图5为本申请实施例提供的显示面板的再一结构示意图。所述内凹部2012的内腔20122的底部在水平方向上的长度W4大于所述内凹部2012的开口20121在水平方向上的开口长度W3。
可以理解，内腔20122的底部在水平方向上的长度W4大于开口20121在水平方向上的开口长度W3。这种结构可以在不设置子内腔的情况下去做，也可达到使第一无机层30以及第二无机层40在内凹部2012内断开的效果。
在一些实施例中，所述第一柔性层20与所述第一无机层30之间还设置有薄膜晶体管50以及发光器件60，所述薄膜晶体管50部分覆盖所述第一柔性层20，所述发光器件60设置在所述薄膜晶体管50上。
在一些实施例中，所述第一无机层30与所述第二无机层40之间设置有一有机封装层70。
其中，第一无机层30以及第二无机层40可采用化学气相沉积（Chemical Vapor Deposition，CVD）形成。其竖直方向的厚度一般小于1.5μm。有机封装层70可采用喷墨打印（Ink Jet Printing，IJP）制成。
在一些实施例中，所述基板10包括：第二柔性层101以及设置在所述第二柔性层101上的隔离层102。
其中，第一柔性层20以及第二柔性层101可选用耐高温的有机材料，如利用聚酰亚胺旋涂或刮涂等方式制作而成，也可以由其它耐高温的有机材料制成，这里不做限定。隔离层102可以为氧化硅无机隔离层。
在一些实施例中，如图6及图7所示，图6为本申请实施例提供的由多个显示面板组成的母板的俯视图，图7为本申请实施例提供的制作显示面板的掩膜版。所述第一无机层30以及所述第二无机层40由掩膜版300制作而成，所述掩膜版300由内部镂空的金属板301以及部分遮挡所述显示面板100的绑定部110的遮挡条302焊接形成。
在实际生产中，是在母板2000上形成多个相同的显示面板100，然后再去切割成单一的显示面板100，而图7的掩膜版300用于掩膜该母板2000中的每一个显示面板100，因为显示面板100存在裂纹阻挡结构201，因此掩膜版300不需遮挡非显示面板100的全部区域，只需部分遮挡显示面板100的绑定部110即可。
本申请实施例提供的显示面板，包括：从下至上依次层叠设置的基板10、第一柔性层20、第一无机层30、第二无机层40；其中，在所述第一柔性层20上设置有裂纹阻挡结构201，所述裂纹阻挡结构201包括切割部2011以及位于所述切割部2011两侧的内凹部2012，所述内凹部2012包括开口20121以及自所述开口20121向所述第一柔性层30内部延伸的内腔20122，所述第一无机层30以及所述第二无机层40在所述内凹部2012的开口20121处断开，在所述切割部2011切割所述显示面板100时，所述内凹部2012用于阻止所述第一无机层30以及所述第二无机层40的裂纹向裂纹阻挡结构201的两侧延伸。从而降低了封装失败的风险，并且由于裂纹阻挡结构的存在，制作显示面板的掩膜版也无需过多遮挡，降低制作工艺复杂程度以及制作成本，提高掩膜版的使用寿命。
为了进一步描述本申请，下面从显示面板的制作方法的方向进行描述。
提供一基板，在所述基板上放置多个模具，并在所述基板上制作第一柔性层，所述多个模具用于制备裂纹阻挡结构；
在所述第一柔性层固化之前取出所述多个模具；
在固化后的第一柔性层上设置有部分覆盖所述第一柔性层的薄膜晶体管；
在所述薄膜晶体管上形成发光器件得到待封装的发光面板；
对所述待封装的发光面板进行封装处理，得到显示面板。
本申请实施例提供的显示面板的制作方法，应用于显示设备中，该显示面板包括：从下至上依次层叠设置的基板、第一柔性层、第一无机层、第二无机层；其中，在所述第一柔性层上设置有裂纹阻挡结构，所述裂纹阻挡结构包括切割部以及位于所述切割部两侧的内凹部，所述内凹部包括开口以及自所述开口向所述第一柔性层内部延伸的内腔，所述第一无机层以及所述第二无机层在所述内凹部的开口处断开，在所述切割部切割所述显示面板时，所述内凹部用于阻止所述第一无机层以及所述第二无机层的裂纹向裂纹阻挡结构的两侧延伸。从而降低了封装失败的风险，并且由于裂纹阻挡结构的存在，制作显示面板的掩膜版也无需过多遮挡，降低制作工艺复杂程度以及制作成本，提高掩膜版的使用寿命。
本申请实施例还提供一种制作上述显示面板100的掩膜版300，所述掩膜版300用于制作所述显示面板100的第一无机层30以及第二无机层40，包括：
一内部镂空的金属板301以及多条遮挡条302，所述多条遮挡条302中每一遮挡条302的两端焊接在所述金属板301的金属边上。
在一些实施例中，所述多条遮挡条302垂直于与所述多条遮挡条302中每一遮挡条302两端焊接的所述金属边，所述遮挡条302用于制作所述显示面板100时，所述第一无机层30以及第二无机层40部分遮挡所述显示面板的绑定部110以露出所述绑定部110的绑定位1101。
在一些实施例中，所述多条遮挡条302相互平行设置。
本申请实施例提供的掩膜版300，用于制作所述显示面板100的第一无机层30以及第二无机层40，包括：一内部镂空的金属板301以及多条遮挡条302，所述多条遮挡条302中每一遮挡条302的两端焊接在所述金属板301的金属边上。简化了掩膜版的结构，降低的制作难度及成本，也同时降低了掩膜版的精准度以及遮挡的要求，提高了掩膜版的使用寿命。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。
以上对本申请实施例所提供的一种显示面板、掩膜版以及显示设备进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (20)

  1. 一种显示面板，其包括：
    从下至上依次层叠设置的基板、第一柔性层、第一无机层、第二无机层；其中，
    在所述第一柔性层上设置有裂纹阻挡结构，所述裂纹阻挡结构包括切割部以及位于所述切割部两侧的内凹部，所述内凹部包括开口以及自所述开口向所述第一柔性层内部延伸的内腔，所述第一无机层以及所述第二无机层在所述内凹部的开口处断开，在所述切割部切割所述显示面板时，所述内凹部用于阻止所述第一无机层以及所述第二无机层的裂纹向裂纹阻挡结构的两侧延伸。
  2. 如权利要求1所述的显示面板，其中所述内凹部的开口远离所述切割部的一侧到所述切割部的长度大于偏离长度与作用长度之和，所述偏离长度为切割所述切割部的偏离长度，所述作用长度为切割所述切割部产生的热影响在水平方向上的作用长度。
  3. 如权利要求2所述的显示面板，其中所述内凹部的开口在水平方向上的开口长度大于所述第一无机层的竖直厚度与所述第二无机层的竖直厚度之和，以使所述第一无机层与所述第二无机层流入所述内凹部的内腔中。
  4. 如权利要求3所述的显示面板，其中所述内凹部的内腔的竖直长度大于所述第一无机层的竖直厚度与所述第二无机层的竖直厚度之和。
  5. 如权利要求1所述的显示面板，其中所述内凹部的竖直长度小于所述第一柔性层的竖直厚度。
  6. 如权利要求1所述的显示面板，其中所述内凹部的内腔的侧壁相对于所述内凹部的中轴线向水平方向两侧延伸，以形成子内腔，所述子内腔用于使所述第一无机层与所述第二无机层在所述内凹部的内腔中断开。
  7. 如权利要求1所述的显示面板，其中所述内凹部的内腔的底部在水平方向上的长度大于所述内凹部的开口在水平方向上的开口长度。
  8. 如权利要求1所述的显示面板，其中所述第一柔性层与所述第一无机层之间还设置有薄膜晶体管以及发光器件，所述薄膜晶体管部分覆盖所述第一柔性层，所述发光器件设置在所述薄膜晶体管上。
  9. 如权利要求1所述的显示面板，其中所述第一无机层与所述第二无机层之间设置有一有机封装层。
  10. 如权利要求1所述的显示面板，其中所述基板包括：第二柔性层以及设置在所述第二柔性层上的隔离层。
  11. 如权利要求1所述的显示面板，其中所述第一无机层以及所述第二无机层由掩膜版制作而成，所述掩膜版由内部镂空的金属板以及部分遮挡所述显示面板的绑定部的遮挡条焊接形成。
  12. 一种制作显示面板的掩膜版，其特征在于，所述掩膜版用于制作所述显示面板的第一无机层以及第二无机层，包括：
    一内部镂空的金属板以及多条遮挡条，所述多条遮挡条中每一遮挡条的两端焊接在所述金属板的金属边上。
  13. 如权利要求12所述的掩膜版，其中所述多条遮挡条垂直于与所述多条遮挡条中每一遮挡条两端焊接的所述金属边，所述遮挡条用于制作所述显示面板时，所述第一无机层以及第二无机层部分遮挡所述显示面板的绑定部以露出所述绑定部的绑定位。
  14. 如权利要求13所述的掩膜版，其中所述多条遮挡条相互平行设置。
  15. 一种显示设备，其包括壳体以及显示面板，所述显示面板设置在所述壳体上，所述显示面板包括：
    从下至上依次层叠设置的基板、第一柔性层、第一无机层、第二无机层；其中，
    在所述第一柔性层上设置有裂纹阻挡结构，所述裂纹阻挡结构包括切割部以及位于所述切割部两侧的内凹部，所述内凹部包括开口以及自所述开口向所述第一柔性层内部延伸的内腔，所述第一无机层以及所述第二无机层在所述内凹部的开口处断开，在所述切割部切割所述显示面板时，所述内凹部用于阻止所述第一无机层以及所述第二无机层的裂纹向裂纹阻挡结构的两侧延伸，其中，所述内凹部的开口远离所述切割部的一侧到所述切割部的长度大于偏离长度与作用长度之和，所述偏离长度为切割所述切割部的偏离长度，所述作用长度为切割所述切割部产生的热影响在水平方向上的作用长度，所述内凹部的竖直长度小于所述第一柔性层的竖直厚度。
  16. 如权利要求15所述的显示设备，其中所述内凹部的开口在水平方向上的开口长度大于所述第一无机层的竖直厚度与所述第二无机层的竖直厚度之和，以使所述第一无机层与所述第二无机层流入所述内凹部的内腔中。
  17. 如权利要求16所述的显示设备，所述内凹部的内腔的竖直长度大于所述第一无机层的竖直厚度与所述第二无机层的竖直厚度之和。
  18. 如权利要求15所述的显示设备，所述内凹部的内腔的侧壁相对于所述内凹部的中轴线向水平方向两侧延伸，以形成子内腔，所述子内腔用于使所述第一无机层与所述第二无机层在所述内凹部的内腔中断开。
  19. 如权利要求15所述的显示设备，所述内凹部的内腔的底部在水平方向上的长度大于所述内凹部的开口在水平方向上的开口长度。
  20. 如权利要求15所述的显示设备，所述第一柔性层与所述第一无机层之间还设置有薄膜晶体管以及发光器件，所述薄膜晶体管部分覆盖所述第一柔性层，所述发光器件设置在所述薄膜晶体管上。
PCT/CN2019/077628 2018-12-06 2019-03-11 显示面板、掩膜版以及显示设备 Ceased WO2020113836A1 (zh)

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Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110071121B (zh) * 2019-04-17 2020-09-08 武汉华星光电半导体显示技术有限公司 显示面板及显示装置
CN110335961A (zh) * 2019-06-19 2019-10-15 武汉华星光电半导体显示技术有限公司 发光面板及显示装置
CN110473983B (zh) * 2019-07-31 2021-04-27 武汉华星光电半导体显示技术有限公司 显示面板母板和显示面板母板的制备方法
CN110400891B (zh) * 2019-08-30 2022-06-24 武汉天马微电子有限公司 一种显示面板、显示面板的制作方法以及显示装置
CN110600516B (zh) * 2019-09-10 2020-10-16 武汉华星光电半导体显示技术有限公司 一种显示面板、显示模组以及显示装置
KR102742772B1 (ko) * 2020-02-13 2024-12-13 삼성디스플레이 주식회사 표시 장치
CN111326559B (zh) 2020-02-28 2023-09-29 武汉华星光电半导体显示技术有限公司 一种显示面板及显示装置
CN111384138A (zh) * 2020-03-18 2020-07-07 Oppo广东移动通信有限公司 显示屏和电子设备
CN111725437B (zh) * 2020-06-11 2022-02-22 武汉华星光电半导体显示技术有限公司 显示面板的切割方法及显示装置
CN112018045B (zh) * 2020-08-14 2022-11-04 武汉华星光电半导体显示技术有限公司 显示面板
CN112736093B (zh) * 2020-12-30 2022-10-04 武汉华星光电半导体显示技术有限公司 显示面板及显示装置
CN113471394B (zh) * 2021-05-27 2022-06-03 武汉天马微电子有限公司 显示面板的切割修边方法、显示面板及显示装置
CN113130618A (zh) * 2021-05-27 2021-07-16 武汉华星光电半导体显示技术有限公司 Oled显示面板
CN113555396B (zh) * 2021-07-08 2022-10-04 武汉华星光电半导体显示技术有限公司 一种显示面板
CN113937241B (zh) * 2021-10-15 2024-05-10 京东方科技集团股份有限公司 一种柔性显示基板、其制作方法及显示面板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6927085B2 (en) * 1999-02-05 2005-08-09 Alien Technology Corporation Web fabrication of devices
CN206069987U (zh) * 2016-09-19 2017-04-05 京东方科技集团股份有限公司 一种掩膜版、基板、显示面板和显示装置
CN107634071A (zh) * 2017-10-17 2018-01-26 京东方科技集团股份有限公司 显示基板母板及其制作方法、显示基板、显示装置
CN107910296A (zh) * 2017-12-08 2018-04-13 京东方科技集团股份有限公司 一种柔性显示面板母板及其切割方法、柔性显示面板、显示装置
CN108666347A (zh) * 2018-04-26 2018-10-16 上海天马微电子有限公司 显示面板及其制造方法、显示装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102548869B1 (ko) * 2016-06-10 2023-06-28 삼성디스플레이 주식회사 가요성 표시 장치 및 이의 제조 방법
CN106191769B (zh) * 2016-07-22 2018-08-03 京东方科技集团股份有限公司 一种掩膜版、基板、显示面板和显示装置
CN106783933B (zh) * 2016-12-30 2019-08-06 上海天马微电子有限公司 一种显示面板、装置以及制作方法
CN107359280B (zh) * 2017-07-11 2021-01-22 京东方科技集团股份有限公司 一种显示面板及其封装方法、制备方法、显示装置
CN107740065B (zh) * 2017-09-26 2020-03-31 京东方科技集团股份有限公司 一种掩模版及其成膜方法、成膜设备
CN108277473B (zh) * 2018-01-22 2020-05-01 京东方科技集团股份有限公司 一种掩膜装置、显示面板及其制作方法、显示装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6927085B2 (en) * 1999-02-05 2005-08-09 Alien Technology Corporation Web fabrication of devices
CN206069987U (zh) * 2016-09-19 2017-04-05 京东方科技集团股份有限公司 一种掩膜版、基板、显示面板和显示装置
CN107634071A (zh) * 2017-10-17 2018-01-26 京东方科技集团股份有限公司 显示基板母板及其制作方法、显示基板、显示装置
CN107910296A (zh) * 2017-12-08 2018-04-13 京东方科技集团股份有限公司 一种柔性显示面板母板及其切割方法、柔性显示面板、显示装置
CN108666347A (zh) * 2018-04-26 2018-10-16 上海天马微电子有限公司 显示面板及其制造方法、显示装置

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