WO2020094101A1 - 摄像头模组及其制作方法、终端 - Google Patents

摄像头模组及其制作方法、终端 Download PDF

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Publication number
WO2020094101A1
WO2020094101A1 PCT/CN2019/116373 CN2019116373W WO2020094101A1 WO 2020094101 A1 WO2020094101 A1 WO 2020094101A1 CN 2019116373 W CN2019116373 W CN 2019116373W WO 2020094101 A1 WO2020094101 A1 WO 2020094101A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
camera module
bracket
open side
module according
Prior art date
Application number
PCT/CN2019/116373
Other languages
English (en)
French (fr)
Inventor
邓爱国
许杨柳
金元斌
颜欢欢
Original Assignee
昆山丘钛微电子科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 昆山丘钛微电子科技有限公司 filed Critical 昆山丘钛微电子科技有限公司
Priority to US17/292,460 priority Critical patent/US11902641B2/en
Publication of WO2020094101A1 publication Critical patent/WO2020094101A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof

Definitions

  • the present disclosure relates to the technical field of cameras, and in particular, to a camera module, a manufacturing method thereof, and a terminal.
  • the terminal With the popularity of the terminal, users are increasingly demanding the types of functions and performance of the terminal, such as audio function, camera function, camera function and storage function have become essential functions of the terminal. Moreover, as the user's dependence on the terminal increases, the requirements for the terminal's comfort, portability and user experience are also increasing. For example, while requiring the terminal to reduce the size and improve the thin and light performance, the display screen of the terminal is also required to be as large as possible in order to improve the look and feel when viewing, which requires further increasing the screen-to-body ratio of the display screen of the terminal.
  • the purpose of the present disclosure is to provide a camera module, its manufacturing method, and terminal, which can increase the screen ratio of the terminal.
  • An aspect of an embodiment of the present disclosure provides a camera module, including: a circuit board including a first end in a first horizontal direction and a second end parallel to and opposite to the first end, the circuit The board has a first surface and a second surface facing away from the first surface in the vertical direction; a photosensitive chip is provided on the first surface of the circuit board, and the photosensitive chip includes a photosensitive area and a non-contact surrounding the photosensitive area Photosensitive area; a bracket, which is arranged on the first surface of the circuit board and surrounds the periphery of the photosensitive chip, the bracket includes several sides, wherein at least one side of the bracket is an open side There is a receiving space between the surface of the open side facing the circuit board and the first surface of the circuit board; a sealant is filled in the receiving space.
  • the bracket is an integrally formed bracket, and the horizontal thickness of the open side of the bracket is smaller than the thickness of the remaining sides.
  • the bracket further includes a protruding portion, the protruding portion faces the line from the open side
  • the position of the end of the board extends toward the side of the photosensitive chip, and the receiving space is formed between the surface of the protrusion facing the circuit board and the first surface of the circuit board.
  • the bracket further includes a stopper portion, the stopper portion extends from an end of the protruding portion closer to the photosensitive chip side
  • the photosensitive chip extends, and a free end of the stop portion extending toward the photosensitive chip is in contact with a non-photosensitive area of the photosensitive chip.
  • the protruding portion is formed on the open side and the side parallel to and opposite to the open side, and the camera module further includes a filter, so The filter is mounted on the surface of the protrusion away from the circuit board. .
  • the bracket further includes a side wall that extends away from the circuit board from an end of the protrusion away from the photosensitive chip.
  • the bracket further includes a side wall and a support portion, the support portion and the first side of the circuit board The surface is in contact with and fixed, and the side wall is connected to an end of the support portion away from the first surface of the circuit board.
  • the bracket includes four sides connected in sequence end to end, and the open side includes a side located at the first end of the circuit board.
  • one or more sides connected to the open side in the bracket are open sides.
  • all four sides of the bracket have the protrusions.
  • all four sides of the bracket have the side walls.
  • the side wall and the protrusion of the open side are formed by integral molding.
  • the side of the bracket other than the open side is integrally formed with the side wall, the protrusion, and the support.
  • the receiving space is defined by at least the open side, the first surface of the circuit board and the chip surrounding the enclosure, and the receiving space is formed in a horizontal direction away from the side where the chip is located Open.
  • the manufacturing method includes the following steps: providing a motherboard, the motherboard includes a plurality of circuit boards, and each of the circuit boards includes a first horizontal direction A first end on the top and a second end that is parallel and opposite to the first end; a photosensitive chip is installed at a corresponding position on each of the circuit boards; a peripheral of the photosensitive chip on each of the circuit boards A bracket is installed at the corresponding position, at least one side of the bracket is an open side, and the surface of the open side facing the circuit board is the same as the first surface of the circuit board facing the open side There is a receiving space between them; forming a sealing body filled with the sealing body; performing a cutting operation to form a single camera module semi-finished product.
  • the motherboard includes a plurality of circuit board groups arranged in a matrix.
  • each of the circuit board groups includes two of the circuit boards.
  • the first ends of the two circuit boards of each of the circuit board groups on the mother board are disposed adjacent to each other without a gap.
  • installing a bracket at a corresponding position on the periphery of the photosensitive chip on each of the circuit boards includes: configuring the sides of the bracket at the first end of each of the circuit boards Is an open side, such that the open side at the first end of each circuit board is positioned adjacent to the open side at the first end of the other circuit board; A gap between the two open sides provided to communicate with the receiving space is reserved, and a dispensing opening is formed; the forming of the sealant includes: injecting glue into the dispensing opening to fill the receiving space To cure the glue.
  • the encapsulant is formed by curing by hot pressing glue or photosensitive glue.
  • a terminal including a display screen, including the above-mentioned camera module, and the side of the camera module containing the sealant is close to the upper edge of the display screen.
  • At least one side of the bracket is configured as an open side.
  • a space between the surface of the open side facing the circuit board and the first surface of the circuit board has a receiving space, and the sealing body is filled in the receiving space to support Function
  • the embodiments of the present disclosure reuse the space position of the non-photosensitive area of the photosensitive chip and the resistive capacitor device provided on the circuit board as much as possible, to avoid additional occupation of the non-photosensitive area of the photosensitive chip on the circuit board and the resistance and capacitive device
  • the need to provide support for space improves space utilization and reduces the width of the open side of the camera module bracket.
  • the camera module can be brought closer to the edge of the terminal and the screen
  • the opening of the camera is also closer to the edge of the screen, thereby improving the screen ratio of the terminal and improving the user's perception and experience.
  • FIG. 1 is a schematic structural diagram of a camera module provided by an embodiment of the present disclosure
  • FIG. 2 is a schematic cross-sectional structure diagram of the camera module shown in FIG. 1;
  • FIG. 3 is a schematic structural diagram of a bracket provided by an embodiment of the present disclosure.
  • FIG. 4 is a schematic cross-sectional view of the bracket structure shown in FIG. 3;
  • FIG. 5 is a flowchart of a method for manufacturing a camera module provided by an embodiment of the present disclosure
  • FIG. 6 is a schematic diagram of a motherboard provided by an embodiment of the present disclosure.
  • FIG. 7 is a schematic diagram of a circuit board group provided by an embodiment of the present disclosure.
  • FIG. 8 is a schematic cross-sectional view of the circuit board group shown in FIG. 7 in an undispensed state
  • FIG. 9 is a cross-sectional view of the circuit board assembly shown in FIG. 7 after forming a sealant
  • FIG. 10 is a schematic diagram of a terminal provided by an embodiment of the present disclosure.
  • Icons 01-motherboard; 10-circuit board; 100-circuit board group; 101-first end; 102-second end; 11-first surface; 12-second surface; 20-photosensitive chip; 30-bracket 31-side wall; 311-first side; 312-second side; 313-third side; 314-fourth side; 32-projection; 33-support; 34-stop ; 40-sealing gel; 50-filter; W1-thickness of open side; W2-thickness of other side.
  • horizontal and vertical do not mean that the components are absolutely horizontal or overhanging, but may be slightly inclined.
  • horizontal only means that its direction is more horizontal than “vertical”, it does not mean that the structure must be completely horizontal, but it can be slightly inclined.
  • connection should be understood in a broad sense, for example, it may be a fixed connection, It can also be a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the connection between two components.
  • setup for example, it may be a fixed connection, It can also be a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the connection between two components.
  • FIGS. 1 and 2 including a circuit board 10.
  • the circuit board 10 may include a first end 101 in a first horizontal direction along the extending direction of the circuit board 10 and a second end 102 that is parallel and opposite to the first end 101, and the circuit board 10 is The vertical direction has a first surface 11 and a second surface 12 facing away from the first surface 11 in a vertical direction.
  • the camera module may further include a photosensitive chip 20 disposed on the first surface 11 of the circuit board 10.
  • the photosensitive chip 20 may include a photosensitive area and a non-photosensitive area surrounding the photosensitive area.
  • the camera module may further include a bracket 30 disposed on the first surface 11 of the circuit board 10 and surrounding the photosensitive chip 20, wherein at least one side of the bracket 30 is an open side and the open side A receiving space is provided between the side surface facing the circuit board 10 and the first surface 11 of the circuit board 10, and the sealing body 40 is filled in the receiving space.
  • the open side may refer to the outermost side of the side of the bracket 30 away from the photosensitive chip 20 and the first surface 11 of the circuit board 10 when the bracket 30 is mounted on the first surface 11 of the circuit board 10 There is no complete contact, but a certain space is formed with the first surface 11 of the circuit board 10, such a side may be referred to as an open side.
  • the circuit board 10 may also be referred to as a printed circuit board, an integrated circuit board, or a PCB circuit board 10, and may be a circuit board manufactured by integrating electronic components and electrical connection structures on a substrate through layout design.
  • the circuit board 10 can realize the electrical connection function of various circuits and components. Normally, the corresponding circuit connection relationship can be realized by attaching and arranging corresponding components on the circuit board 10 where the circuit connection has been made.
  • the circuit board 10 may be substantially rectangular on the horizontal plane. In the present disclosure, for ease of description, the circuit board 10 is divided into a first end 101 and a second end 102 in the first horizontal direction.
  • the first end 101 may refer to a circuit board assembled in a camera module 10
  • the side close to the upper edge of the screen of the mobile terminal and the second end 102 may be the side parallel to and opposite to the first end 101, that is, the side away from the upper edge of the screen of the mobile terminal .
  • the photosensitive chip 20 may be disposed on the first surface 11 of the circuit board 10 and electrically connected to the circuit structure on the circuit board 10. It should be noted that the first surface 11 of the circuit board 10 may further be provided with resistors and capacitors, and these resistors and capacitors are located between the photosensitive chip 20 and the bracket 30.
  • the photosensitive chip 20 may also be referred to as an image sensor.
  • CMOS Complementary Metal Oxide Semiconductor
  • the bracket 30 may be an integrally formed bracket, and in the horizontal direction, the thickness W1 of the open side of the bracket 30 is smaller than the thickness W2 of the other sides of the bracket 30, thereby enabling the embodiment of the present disclosure
  • the camera module is closer to the side of the screen of the mobile terminal, thereby increasing the screen ratio of the mobile terminal.
  • the receiving space is defined by at least the open side, the first surface of the circuit board and the chip surrounding the enclosure, and the receiving space is formed in a horizontal direction away from the side where the chip is located Open.
  • the bracket 30 may be disposed on the first surface 11 of the circuit board 10.
  • the bracket 30 may include a first side 311 disposed in the first horizontal direction and a second side 312 parallel to and opposite to the first side 311.
  • the bracket 30 may further include a third side 313 disposed in the second horizontal direction while connecting the first side 311 and the second side 312, and disposed in the second horizontal direction, parallel to the third side 313 and The fourth side 314 opposite to the third side 313. That is, the first side 311, the third side 313, the second side 312, and the fourth side 314 of the bracket 30 may be sequentially connected end to end to form a frame-like structure.
  • the bracket 30 may be wound around the photosensitive chip 20 and configured to support components such as the filter 50 and the lens.
  • the middle opening of the frame-like structure of the bracket 30 may correspond to the photosensitive region of the photosensitive chip 20.
  • the side of the bracket 30 located at the first end 101 of the circuit board 10 may be named the first side 311 of the bracket 30, but it is not limited to this, and the bracket may also be The side of 30 at the first end 101 of the circuit board 10 is named the second or third side of the bracket 30 and so on.
  • the first side 311 of the bracket 30 at the first end 101 of the circuit board 10 may be an open side.
  • the outermost part of the first side 311 away from the photosensitive chip 20 does not completely contact the first surface 11 of the circuit board 10 but the first surface 11 of the circuit board 10 A certain space is formed between them, therefore, the first side 311 may be an open side.
  • the bracket 30 may include a protrusion 32 that may extend from the surface of the bracket 30 facing the circuit board 10 toward the side where the photosensitive chip 20 is located, on the open side (first side At 311), the surface of the protruding portion 32 facing the circuit board 10 forms a receiving space together with the first surface 11 of the circuit board 10.
  • the bracket 30 may include several sides.
  • the bracket 30 may include four sides, wherein all four sides of the bracket 30 may have protrusions 32, of course, it is not limited thereto, and in other embodiments
  • the protrusion 32 may be provided only on the open side, or only on the open side and the side parallel and opposite to the open side, or may not even be provided.
  • the bracket 30 may further include a side wall 31.
  • the side wall 31 extends away from the circuit board 10 from the end of the protrusion 32 away from the photosensitive chip 20, that is, the side wall 31 is located away from the photosensitive chip of the protrusion 32
  • the protrusion 32 is located inside the side wall 31 with respect to the stem chip 20 and extends toward the side where the photosensitive chip 20 is located.
  • the protrusion 32 and the side wall 31 combine to form an "L" shaped step as The filter 50 provides support.
  • all four sides of the bracket 30 may have side walls 31, of course, it is not limited thereto, and in other embodiments, the side walls 31 may be provided only on the open sides, or only open The side and the side parallel to and opposite to the open side are provided with side walls 31, or the side walls 31 may not even be provided.
  • the bracket 30 may further include a support portion 33.
  • the first end of the support portion 33 facing the circuit board 10 in the vertical direction may be in contact with and fixed with the first surface 11 of the circuit board 10 to provide support for the bracket 30.
  • the second end of the support portion 33 opposite to the first end may be connected to the lower end of the side wall 31 away from the photosensitive chip, that is, the support portion 33 is located below the side wall 31 and the protrusion 32, and one end of the support portion 33 is connected to the side wall 31
  • the other end is mounted on the first surface 11 of the circuit board 10, thereby providing support for the support bracket 30 and the filter 50.
  • the sealant 40 may be filled on the surface of the protruding portion 32 of the open side (first side 311) of the bracket 30 facing the circuit board 10 and the circuit board 10
  • the first surface is formed together in the receiving space.
  • the sealant 40 may be located on the side of the side wall 31 and the protrusion 32 facing the circuit board 10, and one end of the sealant 40 may be connected to the side wall 31 And the protruding portion 32, the other end can be mounted on the circuit board 10 to provide the same supporting effect as the supporting portion 33 without the need to provide the supporting portion 33 on the open side, so that the thickness W1 of the open side is smaller than the other sides
  • the thickness W2 when the camera module of the embodiment of the present disclosure is applied to a mobile terminal, can effectively reduce the distance between the open side of the camera module of the embodiment of the present disclosure and the edge of the terminal screen, thereby making the camera module and camera opening more Close to the edge of the terminal screen, thereby increasing the screen ratio of the terminal and improving the user's perception and experience.
  • the bracket 30 may be integrally formed, and the material thereof may be, for example, one or more of ABS plastic, PPS plastic, and PS plastic. That is, in the embodiment of the present disclosure, the open side (first side 311) of the bracket 30 may be integrally formed with the side wall 31 and the protrusion 32, the surface of the protrusion 32 facing the circuit board 10 and the circuit The first surface 11 of the board 10 forms a receiving space together, and the sealant 40 can fill the receiving space to play a supporting role; and the remaining three sides of the bracket 30 can be integrally formed with a side wall 31, a protrusion 32, and a support 33, The supporting portion 33 plays a supporting role.
  • the setting method of the encapsulant 40 may be formed after the glue is dispensed and then cured.
  • the restrictions on the location and width of the encapsulant 40 are all formed after the glue is cured. Sealant 40 with a fixed shape.
  • the camera module of the embodiment of the present disclosure can be optionally used as a front camera.
  • the camera module of the embodiment of the present disclosure can be provided on the display screen side of the terminal, in order to minimize Occupy the screen display area, thereby increasing the screen area ratio of the entire front of the terminal.
  • the first end 101 of the front camera can be set as close as possible to the upper edge of the display screen, and the camera module of the embodiment of the present disclosure reduces the number of lines
  • the thickness of the side of the bracket 30 at the position of the first end 101 of the board 10 (the thickness of the open side W1), so that the camera module of the embodiment of the present disclosure can be closer to the edge above the terminal screen, thereby improving the screen occupation of the terminal ratio.
  • the fluidity of the glue can be utilized, and the glue can flow to the non-photosensitive area of the photosensitive chip 20 and the resistive capacitive device on the circuit board 10 after the application, in the non-photosensitive area and the resistive capacitive device
  • the area is cured to form an encapsulant 40 to play a supporting role, that is, the embodiment of the present disclosure adopts the design of the encapsulant 40 to provide a supporting function, which can reuse the non-photosensitive area of the photosensitive chip 20 and the resistance capacitor device provided on the circuit board 10
  • the space position avoids the need to additionally occupy the non-photosensitive area of the photosensitive chip 20 on the circuit board 10 and the space outside the resistive capacitor device to provide the support portion 33, thereby improving the space utilization rate and reducing the camera module on the circuit board 10
  • the thickness of the side of the bracket 30 of the first end 101 (the thickness of the open side W1), when the camera module is installed on the terminal, the camera module can be closer to the upper edge of the terminal screen,
  • the bracket 30 may further include a stop portion 34 from the end of the protruding portion 32 on the side close to the photosensitive chip 20 toward the photosensitive chip 20 Extension, that is, one end of the stop portion 34 is connected to the end of the protruding portion 32 close to the photosensitive chip 20, and the other end (free end) of the stop portion 34 may be installed in the non-photosensitive area of the photosensitive chip 20.
  • the outer side of the stopper 34 (the side away from the photosensitive chip 20 in the horizontal direction), the surface of the protrusion 32 facing the circuit board 10 and The first surface 11 of the circuit board 10 can be combined together to form a receiving space, and the sealing body 40 is filled in the receiving space.
  • the side wall 31 provided on the upper side of the protrusion 32 may have a limit to the filter 50
  • the action can restrict the movement of the filter 50 in the horizontal direction.
  • the range enclosed by the surrounding side walls 31 may match the outer circumference of the filter 50 to limit the movable range of the filter 50 on the protrusion 32.
  • a gap is provided between the edge of the filter 50 and the side wall 31 of the bracket 30.
  • the size and size should be matched within the installable error range, so as to achieve the limiting effect of the side wall 31, thereby limiting the relative horizontality of the filter 50 in the horizontal direction Due to the movement of the protrusion 32, a compact and stable camera module is obtained.
  • the stopper 34 can block the sealant 40 from flowing to a space other than the multiplexing space of the photosensitive chip 20 when it is not cured, especially blocking the glue to the photosensitive
  • the further flow of the area significantly reduces the possibility that the glue will contaminate the photosensitive area of the photosensitive chip 20.
  • the stopper 34 may be provided on the non-photosensitive area of the photosensitive chip 20 close to the photosensitive area, so that the non-photosensitive area of the photosensitive chip 20 can be fully utilized to form the encapsulant 40, thereby multiplexing the settings on the circuit board 10
  • the non-photosensitive area of the photosensitive chip 20 and the spatial location of the resistive capacitive device may be provided on the non-photosensitive area of the photosensitive chip 20 close to the photosensitive area, so that the non-photosensitive area of the photosensitive chip 20 can be fully utilized to form the encapsulant 40, thereby multiplexing the settings on the circuit board 10
  • the non-photosensitive area of the photosensitive chip 20 and the spatial location of the resistive capacitive device may be provided on the non-photosensitive area of the photosensitive chip 20 close to the photosensitive area, so that the non-photosensitive area of the photosensitive chip 20 can be fully utilized to form the encapsulant 40, thereby multiplexing the settings on the circuit board 10
  • the non-photosensitive area of the photosensitive chip 20 and the space position of the resistive capacitor device provided on the circuit board 10 are multiplexed, the non-photosensitive area and the resistance of the photosensitive chip 20 on the circuit board 10 are not additionally occupied
  • the need to provide the support portion 33 in the space other than the capacitive device improves the space utilization, so that the thickness W1 of the open side of the bracket 30 at the first end 101 of the circuit board 10 is less than the thickness W2 of the other sides of the bracket 30 Specifically, for example, in the embodiment of the present disclosure, as shown in FIG.
  • the thickness of the first side 311 of the bracket 30 may be smaller than the other sides of the bracket 30 (second side 312, the third side 313 and the fourth side 314) thickness W2, therefore, when the camera module is installed on the terminal, the camera module can be closer to the upper edge of the terminal screen, so that the camera opening on the screen is also Closer to the upper edge, thereby increasing the screen ratio of the terminal.
  • the first side 311 of the bracket 30 and the side adjacent to the first side 311 may be open sides, and the sealing body 40 It is possible to fill not only the first side 311 of the bracket 30 at the first end 101 of the circuit board 10 but also the receiving space formed by the surface of the first side 311 of the bracket 30 facing the circuit board 10 and the first surface 11 of the circuit board 10,
  • the encapsulant 40 may also be located on the side of the bracket 30 adjacent to the first side 311, such as the third side 313 or the fourth side 314, and filled in the third side 313 or the fourth side 314 of the bracket 30.
  • only the third side 313 or the fourth side 314 of the bracket 30 may be provided as open sides, and the sealant 40 is filled on the surface of the open side of the bracket 30 facing the circuit board 10 and the circuit
  • the accommodating space formed by the first surface of the board 10 together can reduce the width of the open side in the first horizontal direction, and further reduce the structure of the camera module.
  • the encapsulant 40 can be formed by curing hot pressing glue or photosensitive glue.
  • the sealant 40 can be formed by curing a hot-pressed adhesive.
  • the hot-pressed adhesive can be a single-layer hot vulcanized adhesive, which has good adhesion to various metals or difficult-to-stick materials.
  • the curing method of hot-pressed adhesive is usually dried at room temperature and allowed to stand.
  • For the adhesion of difficult-to-stick metal it can be baked at 80 ° C for 5 minutes and then vulcanized and bonded, which can ensure a better bonding effect.
  • the encapsulant 40 can also be formed by curing photosensitive adhesive.
  • Photosensitive adhesive also known as Ultraviolet Rays (abbreviated as UV adhesive)
  • UV adhesive Ultraviolet Rays
  • UV adhesive is an adhesive cured by ultraviolet light. It can be cured and positioned in a few seconds, greatly improving the efficiency of pasting, and the cured photoresist has a long service life.
  • the photosensitive adhesive layer can also be cured by natural light irradiation, and curing by ultraviolet light takes shorter time and higher efficiency than curing by natural light.
  • Another aspect of an embodiment of the present disclosure provides a method for manufacturing a camera module. As shown in FIG. 5, the method may include the following steps:
  • the mother board 01 may include a plurality of circuit boards 10, and the circuit board 10 may include a first end 101 in a first horizontal direction and a first end 101 parallel to and opposite to the first end 101. ⁇ ⁇ 102 ⁇ 102.
  • the motherboard 01 may include a plurality of circuit board groups 100 arranged in a matrix, for example, and each circuit board group 100 may include two circuit boards 10, each Each circuit board 10 may include a first end 101 in a first horizontal direction and a second end 102 that is parallel and oppositely disposed away from the first end 101, and the first end 101 of each circuit board 10 may be The first end 101 is adjacently arranged.
  • a plurality of circuit board groups 100 are formed on the motherboard 01 to form a matrix, for example.
  • a plurality of circuit board groups 100 in the form of a matrix may be printed directly at a predetermined position of the motherboard 01 by printing, or a plurality of circuit board groups 100 may be placed in a matrix form by placing Formed motherboard 01.
  • the number of the circuit board group 100 can be set according to actual production needs, which is not specifically limited in the embodiments of the present disclosure.
  • N groups of circuit board groups 100 are provided on the mother board 01.
  • only eight groups are shown in FIG.
  • each circuit board group 100 The first end 101 of one of the circuit boards 10 may be adjacent to the first end 101 of the other circuit board 10.
  • N groups of circuit board groups 100 may be arranged in an array to form a mother board 01.
  • the abutment specifically refers to the complete connection between the first ends 101 of the two circuit boards 10, and there is no gap between them.
  • a plurality of circuit board groups 100 are printed directly at a predetermined position of the mother board 01 by printing, there may be no space between the first ends 101 of the two circuit boards 10 of the circuit board group 100 during the printing process
  • the multiple circuit board groups 100 are placed to form the mother board 01 by way of placement, there can be no gap between the first ends 101 of the two circuit boards 10 of the circuit board group 100 during the placement process.
  • the circuit board 10 may be arranged in such a manner that the "head” abuts the “head” and the “tail” abuts the “tail”, of course, in practice, a certain gap may be reserved between the tail and the tail.
  • a photosensitive chip 20 may be installed at a corresponding position of each circuit board 10 on the mother board 01 by, for example, a die bonding process (Die Bound); that is, a corresponding one is provided on each circuit board 10
  • Die Bound die bonding process
  • the photosensitive chip 20 is used for making camera modules respectively.
  • the manufacturing of the camera module may require other process steps, such as wire bonding (W / B) and cleaning processes after the die bonding. It should be noted that these steps do not involve the disclosure
  • W / B wire bonding
  • cleaning processes after the die bonding
  • bracket 30 Install a bracket 30 at a corresponding position on the periphery of the photosensitive chip 20 of each circuit board 10, at least one side of the bracket 30 may be an open side, and the surface of the open side facing the circuit board 10 is the same as the circuit board 10 There is a receiving space between the first surfaces facing the open side.
  • a bracket 30 is installed at a corresponding position on the periphery of the photosensitive chip 20 of each circuit board 10.
  • the pre-made bracket 30 may be installed on the circuit board 10
  • the bracket 30 (Holder Mount, H / M) process can be used to install the pre-made bracket 30 on the circuit board 10.
  • the pre-made bracket 30 may include a first side 311 disposed in the first horizontal direction and a second side parallel to and opposite to the first side 311 312.
  • the bracket 30 may further include a third side 313 disposed in the second horizontal direction while connecting the first side 311 and the second side 312, and disposed in the second horizontal direction, parallel to the third side 313 and
  • the fourth side 314 opposite to the third side 313, that is, the first side 311, the third side 313, the second side 312, and the fourth side 314 of the bracket 30 may be sequentially connected end to end to form a frame ⁇ ⁇ Shaped structure.
  • installing a bracket 30 at a corresponding position on the periphery of the photosensitive chip 20 on each circuit board 10 may include: configuring the side of the bracket 30 at the first end 101 of each circuit board 10 to be an open side Side, so that the open side of the bracket 30 at the first end 101 of each circuit board 10 is disposed adjacent to the open side of the bracket 30 at the first end 101 of the other circuit board 10.
  • the bracket 30 may be disposed on the first side 311 and the side adjacent to the first side 311, such as the third side 313 or the fourth side 314.
  • the third side 313 or the fourth side 314 of the bracket 30 may be configured as an open side, only when only the third side 313 or the fourth side 314 is configured as an open side It is necessary to arrange the third side 313 or the fourth side 314 on each circuit board 10 adjacent to the third side 313 or the fourth side 314 on the other circuit board 10.
  • bracket 30 is installed, and a certain interval 60 communicating with the receiving space may be reserved between two adjacent open sides to form a dispensing opening.
  • a certain interval 60 communicating with the receiving space is reserved between the two adjacent open sides, and forming a dispensing opening specifically refers to the first end 101 of the two circuit boards 10, for example, in this embodiment,
  • the partial side walls 31 of the first side 311 of the two brackets 30 may not be completely in contact, and a certain interval 60 is reserved as a dispensing opening; or, the bracket 30 does not include the side walls
  • a certain interval 60 communicating with the receiving space is reserved between the sides of the bracket 30 to form a dispensing opening.
  • the protrusions 32 of the first sides 311 of the two brackets 30 There may not be full contact between them, and a certain interval 60 is reserved as a dispensing opening.
  • the size of the interval 60 is not specifically limited in the embodiments of the present disclosure, and those skilled in the art can make specific settings according to actual production needs, as long as the space can be dispensed through the opening through the opening.
  • the pre-made bracket 30 may be a serial bracket 30 including a plurality of brackets 30, and is installed on the motherboard 01 through a single H / M process, for example, as shown in FIG. 7, in the circuit board group 100 At the first end 101 where the two circuit boards 10 are adjacent to each other, part of the side walls 31 of the first side 311 of the two brackets 30 can be connected to each other, thereby forming a serial bracket 30 of a plurality of brackets 30;
  • the bracket 30 may also be a separate stand-alone bracket 30 mounted on each circuit board 10 through multiple H / M processes.
  • the embodiments of the present disclosure are not limited to this, as long as a bracket 30 is finally installed at a corresponding position of each circuit board 10.
  • the forming of the sealant 40 in this step may specifically include pouring glue into the dispensing opening, filling the receiving space, and curing the glue to form the sealant 40.
  • the equipment used for the dispensing operation is not specifically limited.
  • the glue is dispensed through the dispensing opening to the receiving space penetrating through the opening.
  • the dispensing time can be determined by calculating the glue amount and the flow time, which can not only ensure that the glue quantity meets the needs, but also It is ensured that the colloid does not flow to the photosensitive area of the photosensitive chip 20 before curing.
  • the glue can be cured to form the encapsulant 40 to provide as much support strength as possible in a limited space.
  • the holder 30 may further include a stop portion 34 from the protruding portion 32 close to the photosensitive chip 20
  • the end portion extends toward the photosensitive chip 20, and one end of the stop portion 34 is connected to the end of the protruding portion 32 close to the photosensitive chip 20.
  • the other end (free end) of the stop portion 34 may be the same as the non-photosensitive area of the photosensitive chip 20 contact. More specifically, the stopper 34 may be mounted on the non-photosensitive area on the photosensitive chip 20 side close to the photosensitive area.
  • the outer side of the stopper 34 (the side away from the photosensitive chip 20 in the horizontal direction) and the surface of the protrusion 32 facing the circuit board 10 and the first surface 11 of the circuit board 10 may be formed together
  • glue can flow into the receiving space through the dispensing opening.
  • the setting of the stopper 34 can block the flow of the glue, prevent the glue from further flowing to the photosensitive area of the photosensitive chip 20 before curing, and reduce the possibility of the glue polluting the photosensitive area of the photosensitive chip 20, thereby maximizing the use of the photosensitive chip Non-photosensitive area.
  • the dispensing opening can be set to have a larger size, and only need to cut off the excess part in the subsequent cutting step.
  • two pre-cut lines as shown by vertical solid lines in FIG. 9 may be provided, and cut twice in a subsequent cutting operation to cut off excess parts.
  • a single semi-finished product of the camera module is formed.
  • the reason why it is called a semi-finished camera module is because the lens and other components have not been installed on a single camera module. After performing the lens installation operation and the installation process of other components, the finished camera module is finally formed.
  • the operation mode of cutting and separating is not specifically limited.
  • the cutting may be performed twice in the direction shown by the solid line in FIG. The part in between is removed to form two semi-finished camera modules.
  • a terminal is provided.
  • the terminal is, for example, a mobile phone.
  • the terminal may include the above-mentioned camera module, where the camera module includes an encapsulant 40 The side can be close to the edge of the display screen.
  • the space position of the non-photosensitive area of the photosensitive chip 20 and the resistive capacitor device provided on the circuit board 10 can be reused as much as possible, avoiding additional occupation of the circuit board
  • the need to provide the support portion 33 in the non-photosensitive area of the photosensitive chip 20 and the space outside the resistive capacitor device on the 10 increases the space utilization and reduces the support of the camera module at the first end 101 of the circuit board 10 Side width, when the camera module is installed on the terminal, the camera module can be closer to the upper edge of the terminal screen, and the camera opening on the screen is also closer to the upper edge, thereby increasing the screen ratio of the terminal and improving the user Look and feel and experience.
  • the camera module provided by the embodiment of the present disclosure avoids the need for taking up extra space by providing a bracket with an open side and a sealant, improves space utilization, reduces the width of the open side, and further reduces the size of the camera module Structure, the camera module is closer to the edge of the terminal screen, which improves the screen ratio of the terminal and improves the user's perception and experience.

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Abstract

本公开提供一种摄像头模组及其制作方法、终端，涉及摄像头技术领域，摄像头模组能够提高终端的屏占比。摄像头模组包括线路板，线路板包括第一水平方向上的第一端和与第一端相对的第二端，线路板具有第一表面和背离第一表面的第二表面；感光芯片，设置于线路板的第一表面，感光芯片包括感光区域和围绕感光区域四周的非感光区域；支架，设置于线路板的第一表面上并围设在感光芯片的四周，其中，所述支架至少一个侧边为开放侧边，所述开放侧边的面向线路板的表面同所述线路板的第一表面之间具有收容空间，封胶体，填充于所述收容空间。本公开提供的摄像模组提高了空间利用率，减小了摄像头模组支架开放侧边的宽度，最终提高终端的屏占比，提高用户观感和使用体验。

Description

摄像头模组及其制作方法、终端
相关申请的交叉引用
本公开要求于2018年11月09日提交中国专利局的申请号为CN201811336125.6、名称为“摄像头模组及其制作方法、终端”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本公开涉及摄像头技术领域，具体而言，涉及一种摄像头模组及其制作方法、终端。
背景技术
随着科技的发展进步，通信技术得到了飞速发展和长足的进步，而随着通信技术的提高，智能电子产品的普及提高到了一个前所未有的高度，越来越多的智能终端或移动终端成为人们生活中不可或缺的一部分，如智能手机、智能电视和电脑等。
在终端普及的同时，用户对终端所具备的功能种类和性能要求越来越高，如音频功能、拍照功能、摄像功能和存储功能都已经成为终端的必备功能。而且，随着用户对终端的依赖性提高，对终端的使用舒适度、便携性以及用户体验的要求也越来越高。例如，在要求终端减小尺寸、提高轻薄性能的同时，还要求终端的显示屏幕尽可能大，以便提高观看时的观感，这就需要进一步提高终端显示屏幕的屏占比。
发明内容
本公开的目的在于提供一种摄像头模组及其制作方法、终端，能够提高终端的屏占比。
本公开的实施例例如可以通过如下方式来实现：
本公开实施例的一方面，提供一种摄像头模组，包括：线路板，包括在第一水平方向上的第一端和与所述第一端平行且相对设置的第二端，所述线路板在竖直方向上具有第一表面和背离所述第一表面的第二表面；感光芯片，设置于所述线路板的第一表面，所述感光芯片包括感光区域和围绕感光区域四周的非感光区域；支架，设置于所述线路板的第一表面上并围设在所述感光芯片的四周，所述支架包括若干个侧边，其中，所述支架的至少一个侧边为开放侧边，所述开放侧边的面向所述线路板的表面同所述线路板的第一表面之间具有收容空间；封胶体，填充于所述收容空间。
在本公开的一个实施例中，所述支架为一体成型支架，所述支架开放侧边的水平方向厚度小于其余侧边的厚度。
在本公开的一个实施例中，至少在所述开放侧边，至少在所述开放侧边，所述支架还包括凸出部，所述凸出部自所述开放侧边的面向所述线路板的端部位置朝向所述感光芯片所在侧延伸，所述凸出部的面向所述线路板的表面与所述线路板的第一表面之间形成 所述收容空间。
在本公开的一个实施例中，至少在所述开放侧边，所述支架还包括止挡部，所述止挡部自所述凸出部的靠近所述感光芯片一侧的端部起向所述感光芯片延伸，所述止挡部的向所述感光芯片延伸的自由端同所述感光芯片的非感光区域接触。
在本公开的一个实施例中，所述开放侧边以及与所述开放侧边平行且相对设置的侧边上形成有所述凸出部，所述摄像头模组还包括一滤光片，所述滤光片安装于所述凸出部的远离所述线路板的表面。。
在本公开的一个实施例中，至少在所述开放侧边，所述支架还包括侧壁，所述侧壁自所述凸出部的远离感光芯片的端部起远离所述线路板延伸。
在本公开的一个实施例中，对于除所述开放侧边之外的所述支架的其他侧边，所述支架还包括侧壁和支撑部，所述支撑部与所述线路板的第一表面接触并固定，所述侧壁与所述支撑部远离所述线路板的第一表面的一端相连。
在本公开的一个实施例中，所述支架包括首尾顺次连接的四个侧边，所述开放侧边包括位于所述线路板的第一端处的侧边。
在本公开的一个实施例中，所述支架中与所述开放侧边相连的一个或多个侧边为开放侧边。
在本公开的一个实施例中，所述支架的四个侧边均具有所述凸出部。
在本公开的一个实施例中，所述支架的四个侧边均具有所述侧壁。
在本公开的一个实施例中，所述开放侧边的侧壁和凸出部通过一体成型形成。
在本公开的一个实施例中，所述开放侧边以外的所述支架的侧边一体成型有所述侧壁、所述凸出部和所述支撑部。
在本公开的一个实施例中，所述收容空间由至少所述开放侧边、电路板的第一表面及芯片共同围设界定形成，所述收容空间于水平方向沿远离芯片所在侧的方向成开口状。
本公开实施例的另一个方面，提供一种摄像头模组的制造方法，所述制造方法包括如下步骤：提供母板，母板包括多个线路板，每个所述线路板包括第一水平方向上的第一端和与所述第一端平行且相对设置的第二端；在每个所述线路板的对应位置处安装一感光芯片；在每个所述线路板上的感光芯片外围的对应位置处安装一支架，所述支架的至少一个侧边为开放侧边，所述开放侧边的面向所述线路板的表面同所述线路板的面向所述开放侧边的第一表面之间具有收容空间；形成封胶体，封胶体填充于所述收容空间；执行切割操作，形成单个摄像头模组半成品。
在本公开的一个实施例中，所述母板包括多个以矩阵形式排列的线路板组。
在本公开的一个实施例中，每个所述线路板组包括两个所述线路板。
在本公开的一个实施例中，母板上的每个所述线路板组的两个所述线路板的第一端之间邻接设置，没有空隙。
在本公开的一个实施例中，在每个所述线路板上的感光芯片外围的对应位置处安装一支架包括：将位于每个所述线路板第一端处的所述支架的侧边配置为开放侧边，使得位于每个所述线路板第一端处的所述开放侧边，与位于另一所述线路板第一端处的开放侧边邻接设置；安装所述支架，在邻接设置的两个所述开放侧边之间预留与所述收容空间连通的间隔，并形成点胶开口；所述形成封胶体包括：向所述点胶开口注入胶水，填充所述收容空间后，固化所述胶水。
在本公开的一个实施例中，所述封胶体通过热压胶或光敏胶固化形成。
本公开实施例的再一方面，提供一种终端，包括显示屏幕，包括上述的摄像头模组，所述摄像头模组含有封胶体的侧边靠近所述显示屏幕的上边缘。
本公开实施例的有益效果包括：
本公开实施例将支架的至少一侧边配置为开放侧边，开放侧边的面向线路板的表面同所述线路板的第一表面之间具有收容空间，封胶体填充于收容空间，起支撑作用，本公开实施例尽可能地复用了线路板上设置感光芯片的非感光区域和电阻电容器件的空间位置，避免了额外占用线路板上感光芯片的非感光区域以及电阻电容器件之外的空间来设置支撑部的需要，提高了空间利用率，减小了摄像头模组支架开放侧边的宽度，在将摄像模组安装于终端时，能够使摄像头模组更靠近终端边缘，使屏幕上的摄像头开口也更靠近屏幕边缘，从而提高终端的屏占比，提高用户观感和使用体验。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，应当理解，以下附图仅示出了本公开的某些实施例，因此不应被看作是对范围的限定，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他相关的附图。
图1为本公开实施例提供的摄像头模组的结构示意图；
图2为图1示意的摄像头模组的剖面结构示意图；
图3为本公开实施例提供的支架的结构示意图；
图4为图3示意的支架结构的剖面示意图；
图5为本公开实施例提供的摄像头模组的制造方法的流程图；
图6为本公开实施例提供的母板示意图；
图7为本公开实施例提供的线路板组的示意图；
图8为图7示意的线路板组未点胶状态的剖面示意图；
图9为图7示意的线路板组形成封胶体后的剖面图；
图10为本公开实施例提供的终端的示意图。
图标：01-母板；10-线路板；100-线路板组；101-第一端；102-第二端；11-第一表面；12-第二表面；20-感光芯片；30-支架；31-侧壁；311-第一侧边；312-第二侧边；313-第三侧边；314-第四侧边；32-凸出部；33-支撑部；34-止挡部；40-封胶体；50-滤光片；W1-开放侧边的厚度；W2-其他侧边的厚度。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。通常在此处附图中描述和示出的本公开实施例的组件可以以各种不同的配置来布置和设计。
因此，以下对在附图中提供的本公开的实施例的详细描述并非旨在限制要求保护的本公开的范围，而是仅仅表示本公开的选定实施例。基于本公开中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步定义和解释。
在本公开的描述中，需要说明的是，术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”和“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，或者是该发明产品使用时惯常摆放的方位或位置关系，仅是为了便于描述本公开和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本公开的限制。此外，术语“第一”、“第二”和“第三”等仅用于区分描述，而不能理解为指示或暗示相对重要性。
此外，术语“水平”和“竖直”等术语并不表示要求部件绝对水平或悬垂，而是可以稍微倾斜。如“水平”仅仅是指其方向相对“竖直”而言更加水平，并不是表示该结构一定要完全水平，而是可以稍微倾斜。
在本公开的描述中，还需要说明的是，除非另有明确的规定和限定，术语“设置”、“安装”、“相连”和“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本公开中的具体含义。
本公开实施例提供一种摄像头模组，请参照图1和图2，包括线路板10。具体地，线 路板10可以包括沿线路板10的延伸方向的第一水平方向上的第一端101和与第一端101平行且相对设置的第二端102，线路板10在与第一水平方向垂直的竖直方向上具有第一表面11和背离第一表面11的第二表面12。另外，该摄像头模组还可以包括感光芯片20，其设置于线路板10的第一表面11，感光芯片20可以包括感光区域和围绕在感光区域四周的非感光区域。另外，该摄像头模组还可以包括支架30，其设置于线路板10的第一表面11上并围设在感光芯片20的四周，其中，支架30的至少一个侧边为开放侧边，开放侧边的面向线路板10的表面同线路板10的第一表面11之间设置有收容空间，封胶体40填充于所述收容空间。
需要说明的是，所述开放侧边可以指将支架30安装在线路板10的第一表面11上时，支架30的远离感光芯片20的侧边的最外部与线路板10的第一表面11没有完全接触，而是与线路板10的第一表面11之间形成一定空间，这样的侧边可以被称为开放侧边。
线路板10又可以被称为印刷电路板、集成电路板或PCB线路板10，可以是通过版图设计，将电子元件及电气连接结构集成在基板上制作而成的电路板。线路板10能够实现多种线路和元器件的电连接功能。通常情况下，通过在已制作有电路连线的线路板10上对应位置处贴附设置相应的元器件，即可实现相应的电路连接关系。本公开实施例中，线路板10在水平面上可以大致呈长方形。在本公开中，为便于描述，将线路板10在第一水平方向上区分为第一端101和第二端102，具体地，第一端101可以是指组装在摄像头模组中的线路板10在安装入移动终端后，靠近移动终端的屏幕上边缘的一侧，而第二端102可以是与第一端101平行且相对设置的一侧，即远离移动终端的屏幕上边缘的一侧。
如图2所示，感光芯片20可以设置于线路板10的第一表面11上，并与线路板10上的电路结构电连接。需要说明的是，线路板10的第一表面11上还可以设置有电阻器和电容器，这些电阻器和电容器位于感光芯片20和支架30之间。感光芯片20又可以称为图像传感器，感光芯片20例如互补金属氧化物半导体(Complementary Metal Oxide Semiconductor，简称CMOS)芯片，包括用于感光的感光区域，以及在围绕感光区域的四周的非感光区域。示例性地，感光芯片20的非感光区域被配置用于设置感光芯片20的其他电路连接结构以及对感光区域起到保护的作用。
在本公开的一个实施例中，支架30可以为一体成型支架，并且在水平方向上，支架30的开放侧边的厚度W1小于支架30的其他侧边的厚度W2，从而能够使得本公开实施例的摄像头模组较靠近移动终端的屏幕侧边，进而提高移动终端的屏占比。
在本公开的一个实施例中，所述收容空间由至少所述开放侧边、电路板的第一表面及芯片共同围设界定形成，所述收容空间于水平方向沿远离芯片所在侧的方向成开口状。
在本公开一个实施例中，支架30可以设置于线路板10的第一表面11。具体地，如图3和图4所示，支架30可以包括设置在第一水平方向上的第一侧边311和与第一侧边311平行且相对设置的第二侧边312。支架30还可以包括设置在第二水平方向上，同时连接第一侧边311和第二侧边312的第三侧边313，以及设置在第二水平方向上，平行于第三侧边313且和第三侧边313相对的第四侧边314。也即，支架30的第一侧边311、第三侧边313、第二侧边312以及第四侧边314可以首尾顺次连接形成框状结构。支架30可以绕设在感光芯片20的四周，配置为支撑滤光片50和镜头等零部件。支架30的框状结构的中间开口部位可以对应感光芯片20的感光区域。本公开实施例中，示例性地，可以将支架30的位于线路板10的第一端101的侧边命名为支架30的第一侧边311，但并不以此为限，也可以将支架30的位于线路板10第一端101的侧边命名为支架30的第二或第三侧边等。
具体地，如图2至图4所示，支架30的位于线路板10第一端101的第一侧边311可以为开放侧边。具体地，将支架30安装于线路板10时，该第一侧边311的远离感光芯片20的最外部与线路板10的第一表面11没有完全接触而是与线路板10的第一表面11之间形成一定的空间，因此，该第一侧边311可以为开放侧边。在本公开实施例中，支架30可以包括凸出部32，该凸出部32可以自支架30的面向线路板10的表面朝向感光芯片20所在一侧延伸，在开放侧边(第一侧边311)处，凸出部32的面向线路板10的表面与线路板10的第一表面11一起形成收容空间。在本公开实施例中，支架30可以包括若干个侧边。在本公开另一实施例中支架30可以包括若四个侧边，其中，支架30的四个侧边均可以具有凸出部32，当然并不以此为限，在其他的实施例中也可以仅在开放侧边设置凸出部32，或仅在开放侧边以及与开放侧边平行且相对的侧边设置凸出部32，或者甚至可以不设置凸出部32。
在本公开实施例中，支架30还可以包括侧壁31。具体地，如图4所示，在竖直方向上侧壁31自凸出部32的远离感光芯片20的端部起远离线路板10延伸，即侧壁31位于凸出部32的远离感光芯片20的端部，相对于干管芯片20而言凸出部32位于侧壁31的内侧并朝感光芯片20所在侧延伸，凸出部32与侧壁31相结合形成“L”型的台阶为滤光片50提供支撑。在本公开实施例中，支架30的四个侧边均可以具有侧壁31，当然并不以此为限，在其他实施例中也可以仅在开放侧边设置侧壁31，或仅在开放侧边以及与开放侧边平行且相对的侧边设置侧壁31，或者甚至可以不设置侧壁31。
在本公开实施例中，对于除开放侧边(第一侧边311)之外的其他侧边，支架30还可以包括支撑部33。具体地，如图2和图4所示，在竖直方向上支撑部33的面向线路板10的第一端可以同线路板10的第一表面11接触并固定，为支架30提供支撑。支撑部33的与第一端相反的第二端可以连接到侧壁31的远离感光芯片的下端，即支撑部33位于侧壁 31和凸出部32下方，支撑部33的一端连接侧壁31，另一端安装于线路板10的第一表面11上，由此为支撑支架30和滤光片50提供支撑。
在本公开实施例中，如图2和图4所示，封胶体40可以填充于支架30的开放侧边(第一侧边311)的凸出部32面向线路板10的表面和线路板10的第一表面一起形成的收容空间中。更加具体地，在支架30的开放侧边(第一侧边311)，封胶体40可以位于侧壁31和凸出部32面向线路板10的一侧，封胶体40的一端可以连接侧壁31和凸出部32，另一端可以安装于线路板10上，以提供与支撑部33相同的支撑作用，而无需在开放侧边设置支撑部33，从而使得开放侧边的厚度W1小于其他侧边的厚度W2，当本公开实施例的摄像头模组应用于移动终端时，能够有效缩减本公开实施例的摄像头模组的开放侧边与终端屏幕边缘的距离，进而使得摄像头模组以及摄像头开口更靠近终端屏幕边缘，从而提高终端的屏占比，提高用户观感和使用体验。
在本公开实施例中，支架30可以一体成型，其材质例如可以为ABS塑料、PPS塑料和PS塑料等其中的一种或几种。也就是说，在本公开实施例中，支架30的开放侧边(第一侧边311)可以一体成型有侧壁31和凸出部32，凸出部32的面向线路板10的表面和线路板10的第一表面11一起形成收容空间，封胶体40可以填充该收容空间，起支撑作用；而支架30的剩余三侧边可以一体成型有侧壁31、凸出部32和支撑部33，支撑部33起支撑作用。
具体地，封胶体40的设置方式可以为胶水点胶后进行固化处理形成，本公开实施例中对于封胶体40的设置位置和设置宽度等的限定，均指的是胶水固化处理后所形成的具有固定形状的封胶体40。
本公开实施例的摄像头模组可以可选地作为前置摄像头使用，为了实现移动终端的前端拍摄功能，将本公开实施例的摄像头模组可以设置在终端的显示屏幕侧，为了尽可能少地占用屏幕显示面积，从而提高屏幕在整个终端正面的面积占比，前置摄像头的第一端101可以尽可能地贴近显示屏幕的上边缘设置，而本公开实施例的摄像头模组缩减了位于线路板10的第一端101位置处的支架30的侧边厚度(开放侧边的厚度W1)，从而能够使得本公开实施例的摄像头模组更靠近终端屏幕上方的边缘，进而提高终端的屏占比。
具体地，在本公开实施例中，可以利用胶水的流动性，胶水在施加后可流动至感光芯片20的非感光区域以及线路板10上的电阻电容器件，在该非感光区域以及电阻电容器件所在区域固化形成封胶体40以起支撑作用，即本公开实施例采用封胶体40提供支撑作用的设计可以尽可能地复用线路板10上设置的感光芯片20的非感光区域和电阻电容器件的空间位置，避免了额外占用线路板10上感光芯片20的非感光区域以及电阻电容器件之外的空间来设置支撑部33的需要，从而提高了空间利用率，减小了摄像头模组在线路板10 第一端101的支架30的侧边厚度(开放侧边的厚度W1)，在将摄像模组安装于终端时，能够使摄像头模组更靠近终端屏幕上方的边缘，使屏幕上的摄像头开口也更靠近上方的边缘，从而整体上提高终端的屏占比。
在某些实施例中，可选的，如图4所示，支架30还可以包括止挡部34，止挡部34自凸出部32的靠近感光芯片20一侧的端部向感光芯片20延伸，即，止挡部34的一端连接凸出部32的靠近感光芯片20的端部，止挡部34的另一端(自由端)可以安装于感光芯片20的非感光区域。此时，在支架30的开放侧边(第一侧边311)处，止挡部34的外侧面(水平方向上远离感光芯片20的侧面)、凸出部32的面向线路板10的表面与线路板10的第一表面11结合可以一起形成一收容空间，封胶体40填充于该收容空间。
示例的，如图2所示，在凸出部32的远离线路板10的表面上设置滤光片50后，设置在凸出部32上侧的侧壁31可以对滤光片50具有限位作用，能够限制滤光片50在水平方向上的移动。示例的，环绕设置的侧壁31所围合的范围可以与滤光片50的外周尺寸相匹配，以限制滤光片50在凸出部32上的可移动范围。如图2所示，仅为了清楚表达摄像头模组中的各个零部件之间的位置关系，在滤光片50的边缘与支架30的侧壁31之间设置有空隙。但是，事实上，在实际操作中，二者之间应当在可安装的误差范围内实现大小和尺寸的对应，以便实现侧壁31的限位作用，从而限制滤光片50在水平方向上相对于凸出部32的移动，得到结构上紧凑且稳定的摄像头模组。
在本公开的实施例中，在支架30的开放侧边处，止挡部34能够阻挡封胶体40在未固化时向感光芯片20的复用空间之外的空间流动，尤其是阻挡胶水向感光区域的进一步流动，显著降低了胶水对感光芯片20的感光区域造成污染的可能性。
更加具体地，止挡部34可以设置于感光芯片20的靠近感光区域的非感光区域上，从而可以充分利用感光芯片20的非感光区域形成封胶体40，由此复用了线路板10上设置的感光芯片20的非感光区域和电阻电容器件的空间位置。
本公开上述实施例中，因为复用了线路板10上设置的感光芯片20的非感光区域和电阻电容器件的空间位置，从而避免了额外占用线路板10上感光芯片20的非感光区域以及电阻电容器件之外的空间来设置支撑部33的需要，提高了空间利用率，使得位于线路板10第一端101处的支架30的开放侧边的厚度W1小于支架30的其他侧边的厚度W2，具体地，例如在本公开的实施例中，如图2所示，支架30的第一侧边311的厚度(开放侧边的厚度W1)可以小于支架30的其他侧边(第二侧边312、第三侧边313以及第四侧边314)的厚度W2，因此，在将摄像模组安装于终端时，能够使摄像头模组更靠近终端屏幕上方的边缘，使屏幕上的摄像头开口也更靠近上方的边缘，从而提高终端的屏占比。
在本公开另一些实施例中，支架30的第一侧边311和与第一侧边311相邻的侧边例如 第三侧边313或第四侧边314可以为开放侧边，封胶体40可以不仅位于线路板10第一端101处的支架30的第一侧边311，填充于支架30的第一侧边311面向线路板10的表面和线路板10第一表面11形成的收容空间，封胶体40还可以位于支架30的与第一侧边311相邻的侧边例如第三侧边313或第四侧边314，填充于支架30的第三侧边313或第四侧边314与线路板10第一表面11形成的收容空间。当然在其他实施例中，也可以仅设置支架30的第三侧边313或第四侧边314为开放侧边，封胶体40填充于支架30的开放侧边的面向线路板10的表面和线路板10的第一表面一起形成的收容空间，从而能够减少开放侧边在第一水平方向上的侧边宽度，进一步地缩小摄像头模组的结构。
可选的，封胶体40可以由热压胶或光敏胶固化形成。
具体地，封胶体40可以由热压胶固化形成，热压胶可以是一种单层热硫化粘接剂，对各种金属或难粘材料的粘贴粘合效果较好。热压胶的固化方式，通常在室温下干燥静置即可，对于难粘金属的粘贴，可采用80℃烘烤5分钟左右后再硫化粘接的方式，能够保证较佳的粘接效果。
或者，封胶体40还可以为光敏胶固化形成。光敏胶又称紫外光固化胶(Ultraviolet Rays，简称UV胶)，是一种通过紫外光照固化的胶粘剂。可几秒钟固化定位，极大地提高粘贴工作效率，而且固化后的光敏胶使用寿命长。需要说明的是，光敏胶层也可通过自然光照射固化，通过紫外光固化相比于自然光固化的用时短，效率高。
本公开实施例的另一方面，提供一种摄像头模组的制造方法，如图5所示，可以包括如下步骤：
S101、提供母板01，母板01可以包括多个线路板10，所述线路板10可以包括在第一水平方向上的第一端101和与所述第一端101平行且相对设置的第二端102。
具体地，本公开的一个具体实施例，如图6所示，母板01可以包括多个例如以矩阵形式排列的线路板组100，每个线路板组100可以包括两个线路板10，每个线路板10可以包括第一水平方向上的第一端101和远离第一端101平行且相对设置的第二端102，每个线路板10的第一端101可以与另一线路板10的第一端101邻接设置。
在实际的制作过程中，首先，在母板01上设置例如以矩阵形式形成多个线路板组100。具体地，例如可以通过印刷方式直接在母板01的预设位置处印刷形成多个矩阵形式的线路板组100，也可以是通过摆放的方式摆放多个线路板组100以矩阵形式以形成母板01。其中，线路板组100的设置数量可以根据实际生产需要进行设定，本公开实施例中对此不做具体限定。示例的，如图6所示，在母板01上设置N组线路板组100，为图示方便，图6中仅示意出八组，共十六个线路板10，每一线路板组100中的一线路板10的第一端101可以与另一线路板10的第一端101邻接设置。可选地，N组线路板组100可以阵列排布， 形成母板01。其中，邻接具体是指两个线路板10的第一端101之间完整对接，中间没有空隙。示例性地，当通过印刷方式直接在母板01的预设位置处印刷多个线路板组100时，在印刷过程中可以使得线路板组100的两线路板10的第一端101之间没有空隙；当通过摆放的方式摆放多个线路板组100以形成母板01时，则在摆放过程中可以使得线路板组100的两线路板10的第一端101之间没有空隙。为了便于理解，若将线路板10的第一端101称为“头部”，与第一端101平行且相对设置的第二端102称为“尾部”的话，则在母板01中，线路板10可以以“头部”抵靠“头部”，“尾部”抵靠“尾部”的方式排列，当然在实际中，尾部与尾部之间可以预留一定的空隙。
S102、在每个线路板10的对应位置处安装一感光芯片20。
具体地，可通过例如粘晶工艺(Die bound；D/B)在母板01上的每个线路板10的对应位置处安装一感光芯片20，即在每一个线路板10上均对应设置一个感光芯片20，用于分别制作摄像头模组。
当然，制造摄像头模组还可以需要其他工艺步骤，例如在粘晶之后还会有打金线(wire bound，W/B)以及清洗等工艺，需要说明的是，这些步骤并不涉及本公开的发明点，且为本领域技术人员所熟知，在此不再一一详细描述。
S103、在每个线路板10的感光芯片20外围的对应位置处安装一支架30，支架30的至少一个侧边可以为开放侧边，所述开放侧边的面向线路板10的表面同线路板10面向开放侧边的第一表面之间具有收容空间。
在本步骤中，在每个线路板10的感光芯片20外围的对应位置处安装一支架30。具体地，可以将预先制作好的支架30安装在线路板10上
可通过粘支架30(Holder Mount，H/M)工艺，将预先制作好的支架30安装在线路板10上。具体地，如图3和图4所示，该预先制作好的支架30可以包括设置在第一水平方向上的第一侧边311和与第一侧边311平行且相对设置的第二侧边312。支架30还可以包括设置在第二水平方向上，同时连接第一侧边311和第二侧边312的第三侧边313，以及设置在第二水平方向上，平行于第三侧边313且和第三侧边313相对的第四侧边314，也即，支架30的第一侧边311、第三侧边313、第二侧边312以及第四侧边314可以首尾顺次连接形成框状结构。
本步骤中，在每个线路板10上的感光芯片20外围的对应位置处安装一支架30可以包括：将位于每个线路板10的第一端101处的支架30的侧边配置为开放侧边，使得位于每个线路板10的第一端101处的支架30的开放侧边，与位于另一线路板10的第一端101处的支架30的开放侧边邻接设置。当然，并不以此为限，在其他实施例中也可以将支架30在第一侧边311和与第一侧边311相邻的侧边例如第三侧边313或第四侧边314配置为开 放侧边，或者可以仅将支架30的第三侧边313或第四侧边314配置为开放侧边，只是当仅将第三侧边313或第四侧边314配置为开放侧边时，需要将每个线路板10上的第三侧边313或第四侧边314与另一线路板10上的第三侧边313或第四侧边314邻接设置。
接下来安装支架30，可以在邻接的两开放侧边之间预留与所述收容空间连通的一定的间隔60，形成点胶开口。
其中，在邻接的两开放侧边之间预留与所述收容空间连通的一定的间隔60，形成点胶开口具体是指，在两线路板10的第一端101，例如本实施例中，如图7和图8所示，两支架30的第一侧边311的部分侧壁31之间可以没有完全接触，预留一定的间隔60作为点胶开口；或者，在支架30不包括侧壁31的其他实施例中，支架30的侧边之间预留与所述收容空间连通的一定的间隔60以形成点胶开口具体是指，两支架30的第一侧边311的凸出部32之间可以没有完全接触，预留一定的间隔60作为点胶开口。具体地，该间隔60的大小在本公开实施例中不做具体限定，本领域技术人员可以根据实际生产需要进行具体设置，只要保证能通过该开口向与该开口贯通的空间点胶即可。
需要说明的是，该预先制作的支架30可以是包括多个支架30的连版支架30，并且通过一次H/M工艺安装在母板01上，例如如图7所示，在线路板组100中两线路板10邻接设置的第一端101处，两支架30的第一侧边311的部分侧壁31之间可以互相连接，由此形成多个支架30的连版支架30；预先制作的支架30也可以是将单独的一个一个的分立的支架30分别通过多次H/M工艺分别安装在每个线路板10上。本公开实施例并不以此为限，只要最终实现在每个线路板10的对应位置处安装一支架30即可。
S104、形成封胶体40，该封胶体40填充于收容空间。
本步骤中形成封胶体40可以具体为向点胶开口注入胶水，填充收容空间后，固化所述胶水，从而形成封胶体40。具体地，本公开实施例中对于点胶操作使用的设备不作具体限定。首先，将胶水通过点胶开口向与该开口贯通的收容空间点胶，在实际的操作过程中，可通过计算胶量和流动时间确定点胶时间，既能保证胶量满足的需要，又能保证胶体在固化之前不至于流至感光芯片20的感光区域。然后，可以对胶水进行固化操作，以形成封胶体40，从而在有限的空间内提供尽可能大的支撑强度。
优选地，如图9所示，为了防止胶水在未固化之前流至感光芯片20的感光区域，支架30还可以包括止挡部34，止挡部34自凸出部32的靠近感光芯片20的端部起向感光芯片20延伸，止挡部34的一端连接于凸出部32的靠近感光芯片20的端部，止挡部34的另一端(自由端)可以同感光芯片20的非感光区域接触。更加具体地，止挡部34可以安装在感光芯片20靠近感光区域侧的非感光区域上。在支架30的开放侧边，止挡部34的外侧面(水平方向上远离感光芯片20的侧面)和凸出部32的面向线路板10的表面与线路板10 的第一表面11可以共同形成一收容空间，胶水可以藉由点胶开口流入上述收容空间。止挡部34的设置，能够阻挡胶水流动，避免胶水在固化前向感光芯片20感光区域的进一步流动，降低胶水对感光芯片20的感光区域造成污染的可能性，从而可以最大化利用感光芯片20的非感光区域。
点胶开口可以设置为具有较大尺寸，只需在后续切割的步骤将多余部分切除即可。如图9所示，可以设置两道预切割线(如图9中的竖直实线所示)，在后续的切割操作中切割两次以切除多余部分。
S105、执行切割操作，形成单个摄像头模组半成品。
在对母板01执行切割操作后，如图1所示，即形成了单个的摄像头模组的半成品。之所以称之为摄像头模组半成品，是因为还未在单个的摄像头模组上安装镜头等其他零部件。在执行镜头安装操作以及其他零部件的安装工序后，最终形成成品的摄像头模组。
需要说明的是，本公开实施例中对于切割分离的操作方式不作具体限定，例如，如图9所示，可以沿图9中实线所示的方向切割两次，以将两条切割线之间的部分去除，形成两个摄像头模组半成品。
本公开实施例的再一方面，提供一种终端，该终端例如为手机，如图10所示，该终端可以包括以上所述的摄像头模组，其中，所述摄像头模组含有封胶体40的侧边可以靠近显示屏幕的边缘。
以封胶体40作为线路板10第一端101的支撑部33，可以尽可能地复用线路板10上设置的感光芯片20的非感光区域和电阻电容器件的空间位置，避免了额外占用线路板10上感光芯片20的非感光区域以及电阻电容器件之外的空间来设置支撑部33的需要，提高了空间利用率，减小了摄像头模组在线路板10第一端101处的支架30的侧边宽度，在将摄像模组安装于终端时，能够使摄像头模组更靠近终端屏幕上方的边缘，使屏幕上的摄像头开口也更靠近上方的边缘，从而提高终端的屏占比，提高用户观感和使用体验。
上述对本公开实施例的摄像头模组及其制作方法的说明中，已经对于摄像头模组应用于终端的显示面作为前置摄像头的方式及有益效果进行了详细的说明，此处不再赘述。
以上所述仅为本公开的优选实施例而已，并不用于限制本公开，对于本领域的技术人员来说，本公开可以有各种更改和变化。凡在本公开的精神和原则之内，所作的任何修改、等同替换和改进等，均应包含在本公开的保护范围之内。
工业实用性
本公开实施例提供的摄像头模组通过设置具有开放侧边的支架以及封胶体，避免了占用额外空间的需要，提高了空间利用率，减小了开放侧边的宽度，进一步缩小摄像头模组的结构，摄像头模组更靠近终端屏幕的边缘，提高了终端的屏占比，提高用户观感和使用体验。

Claims (21)

  1. 一种摄像头模组，其特征在于，包括：
    线路板，包括在第一水平方向上的第一端和与所述第一端相对设置的第二端，所述线路板在竖直方向上具有第一表面和背离所述第一表面的第二表面；
    感光芯片，设置于所述线路板的第一表面，所述感光芯片包括感光区域和围绕感光区域四周的非感光区域；
    支架，设置于所述线路板的第一表面上并围设在所述感光芯片的四周，所述支架包括若干个侧边，其中，所述支架的至少一个侧边为开放侧边，所述开放侧边的面向所述线路板的表面同所述线路板的第一表面之间具有收容空间；
    封胶体，填充于所述收容空间。
  2. 根据权利要求1所述的摄像头模组，其特征在于，所述支架为一体成型支架，所述支架开放侧边的水平方向厚度小于其余侧边的厚度。
  3. 根据权利要求1-2中任一项所述的摄像头模组，其特征在于，至少在所述开放侧边，所述支架还包括凸出部，所述凸出部自所述开放侧边的面向所述线路板的端部位置朝向所述感光芯片所在侧延伸，所述凸出部的面向所述线路板的表面与所述线路板的第一表面之间形成所述收容空间。
  4. 根据权利要求1-3中任一项所述的摄像头模组，其特征在于，至少在所述开放侧边，所述支架还包括止挡部，所述止挡部自所述凸出部的靠近所述感光芯片一侧的端部起向所述感光芯片延伸，所述止挡部的向所述感光芯片延伸的自由端同所述感光芯片的非感光区域接触。
  5. 根据权利要求1-4中任一项所述的摄像头模组，其特征在于，所述开放侧边以及与所述开放侧边平行且相对设置的侧边上形成有所述凸出部，所述摄像头模组还包括一滤光片，所述滤光片安装于所述凸出部的远离所述线路板的表面。
  6. 根据权利要求1-5中任一项所述的摄像头模组，其特征在于，至少在所述开放侧边，所述支架还包括侧壁，所述侧壁自所述凸出部的远离感光芯片的端部起远离所述线路板延伸。
  7. 根据权利要求1-6中任一项所述的摄像头模组，其特征在于，对于除所述开放侧边之外的所述支架的其他侧边，所述支架还包括侧壁和支撑部，所述支撑部与所述线路板的第一表面接触并固定，所述侧壁与所述支撑部远离所述线路板的第一表面的一端相连。
  8. 根据权利要求1-7任中一项所述的摄像头模组，其特征在于，所述支架包括首尾 顺次连接的四个侧边，所述开放侧边包括位于所述线路板的第一端处的侧边。
  9. 根据权利要求8所述的摄像头模组，其特征在于，所述支架中与所述开放侧边相连的一个或多个侧边为开放侧边。
  10. 根据权利要求7-9中任一项所述的摄像头模组，其特征在于，所述支架的四个侧边均具有所述凸出部。
  11. 根据权利要求7-10中任一项所述的摄像头模组，其特征在于，所述支架的四个侧边均具有所述侧壁。
  12. 根据权利要求1-11中任一项所述的摄像头模组，其特征在于，所述开放侧边的侧壁和凸出部通过一体成型形成。
  13. 根据权利要求1-12中任一项所述的摄像头模组，其特征在于，所述开放侧边以外的所述支架的侧边一体成型有所述侧壁、所述凸出部和所述支撑部。
  14. 根据权利要求1-13中任一项所述的摄像头模组，其特征在于，所述收容空间由至少所述开放侧边、电路板的第一表面及芯片共同围设界定形成，所述收容空间于水平方向沿远离芯片所在侧的方向成开口状。
  15. 一种摄像头模组的制造方法，其特征在于，所述制造方法包括如下步骤：
    提供母板，母板包括多个线路板，每个所述线路板包括第一水平方向上的第一端和与所述第一端平行且相对设置的第二端；
    在每个所述线路板的对应位置处安装一感光芯片；
    在每个所述线路板上的感光芯片外围的对应位置处安装一支架，所述支架的至少一个侧边为开放侧边，所述开放侧边的面向所述线路板的表面同所述线路板的面向所述开放侧边的第一表面之间具有收容空间；
    形成封胶体，所述封胶体填充于所述收容空间；
    执行切割操作，形成单个摄像头模组半成品。
  16. 根据权利要求15所述的摄像头模组的制造方法，其特征在于，所述母板包括多个以矩阵形式排列的线路板组。
  17. 根据权利要求16所述的摄像头模组的制造方法，其特征在于，每个所述线路板组包括两个所述线路板。
  18. 根据权利要求16-17中任一项所述的摄像头模组的制造方法，其特征在于，母板上的每个所述线路板组的两个所述线路板的第一端之间邻接设置，没有空隙。
  19. 根据权利要求15-18中任一项所述的摄像头模组的制造方法，其特征在于，
    在每个所述线路板上的感光芯片外围的对应位置处安装一支架包括：
    将位于每个所述线路板第一端处的所述支架的侧边配置为开放侧边，使得位于每 个所述线路板第一端处的所述开放侧边，与位于另一所述线路板第一端处的开放侧边邻接设置；
    安装所述支架，在邻接设置的两个所述开放侧边之间预留与所述收容空间连通的间隔，并形成点胶开口；
    所述形成封胶体包括：
    向所述点胶开口注入胶水，填充所述收容空间后，固化所述胶水。
  20. 根据权利要求15-19所述的摄像头模组的制造方法，其特征在于，所述封胶体通过热压胶或光敏胶固化形成。
  21. 一种终端，包括显示屏幕，其特征在于，包括如权利要求1-13任一项所述的摄像头模组，所述摄像头模组含有封胶体的侧边靠近所述显示屏幕的上边缘设置。
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