WO2020151481A1 - 摄像模组、摄像模组的组装方法以及电子设备 - Google Patents

摄像模组、摄像模组的组装方法以及电子设备 Download PDF

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Publication number
WO2020151481A1
WO2020151481A1 PCT/CN2020/070335 CN2020070335W WO2020151481A1 WO 2020151481 A1 WO2020151481 A1 WO 2020151481A1 CN 2020070335 W CN2020070335 W CN 2020070335W WO 2020151481 A1 WO2020151481 A1 WO 2020151481A1
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WIPO (PCT)
Prior art keywords
mounting wall
camera module
lens
circuit board
base
Prior art date
Application number
PCT/CN2020/070335
Other languages
English (en)
French (fr)
Inventor
赵波杰
王启
袁栋立
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201910053978.7A external-priority patent/CN109743482A/zh
Priority claimed from CN201920097602.1U external-priority patent/CN209562655U/zh
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Publication of WO2020151481A1 publication Critical patent/WO2020151481A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof

Definitions

  • the invention relates to a camera module, an assembly method of the camera module, and electronic equipment.
  • the camera module is an important component of smart electronic devices.
  • the screens of smart electronic devices are increasingly becoming “full-screen”. Therefore, the non-display area of the front panel of the electronic device is greatly compressed. Therefore, how to build in the smaller and smaller "forehead" Camera modules have become an issue that the industry needs to consider urgently.
  • FIG. 1 shows a camera module A in the prior art.
  • the camera module A includes a circuit board A1, a photosensitive chip A2, a lens A3, and a lens holder A4.
  • the photosensitive chip A2 is arranged on the circuit board A1 and the lens A3 is installed on the lens holder.
  • the lens holder A4 is bonded to the circuit board A1 with glue C.
  • glue C glue C
  • the lens holder A4 is connected to the circuit board A1.
  • the lens holder A4 and the circuit board A1 there are certain requirements for the bonding width of the lens holder A4, that is, the lens holder A4 needs to have a certain thickness to meet the requirements for its bonding width.
  • FIG. 3A shows a schematic diagram of an electronic device B with a camera module A
  • FIG. 3B is a partial enlarged view of FIG. 3A
  • the front of the electronic device B has a display area B1 and a non-display area B2.
  • the camera module A is arranged in the non-display area B2, and the non-display area B2 is at the edge of the front of the electronic device B. Reducing the width of the non-display area B2 can start from two aspects. On the one hand, the overall size of the camera module A is reduced, and on the other hand, the camera module A is placed as close to the edge of the electronic device B as possible.
  • the prior art is limited by the thickness of the lens holder A4, and it is difficult to further reduce the overall size, and the wall thickness of the lens holder A4 also restricts the lens from further approaching the edge of the electronic device B.
  • the purpose of the present invention is to provide a camera module, which when applied to an electronic device, is beneficial for the electronic device to obtain a higher display ratio.
  • Another object of the present invention is to provide a method for assembling the aforementioned camera module.
  • Another object of the present invention is to provide an electronic device including the above-mentioned camera module.
  • a camera module which includes a first assembly component, a second assembly component, a photosensitive chip, and a lens on the light-incoming path of the photosensitive chip, the lens being mounted on the first assembly Component, the photosensitive chip is provided in the second assembly component, the peripheral edge of the first assembly component has a support portion extending in the direction of the second assembly component, and the support portion includes a first mounting wall and a second Mounting wall, the support portion is provided on the second assembly part, the second mounting wall and the second assembly part are connected by an adhesive, the first mounting wall and the second assembly part The space is sealed, and the connection width between the first installation wall and the second assembly component is smaller than the connection width between the second installation wall and the second assembly component.
  • the second mounting wall is U-shaped, the first mounting wall is a "one" shape, and the first mounting wall and the second mounting wall surround the supporting portion.
  • first mounting wall and the second assembly part are sealed by sealing glue, and the sealing glue extends to the side wall of the second assembly part.
  • the camera module further includes a filter
  • the first assembly part or the second assembly part is provided with a platform for mounting the filter, and the platform holds the filter Between the lens and the photosensitive chip, the platform has a light through hole, and the filter is opposite to the light through hole.
  • the lens includes at least one lens with a free-form surface, and the lens with a free-form surface offsets the imaging area of the lens with respect to the geometric center axis of the lens, so that the imaging area of the lens is The photosensitive chip corresponds.
  • the image side surface of the lens closest to the photosensitive chip on the lens is a free-form surface.
  • the thickness of the first mounting wall is smaller than the thickness of the second mounting wall; or, the first mounting wall is incompletely provided on the second assembly part, so that the camera module The side is stepped.
  • the first assembly component is a mirror holder
  • the second assembly component is a circuit board
  • the support portion extends from the peripheral edge of the mirror holder to the circuit board, and the support portion is connected to the circuit board.
  • the upper surface of the circuit board is opposite, and the thickness of the first mounting wall is smaller than the thickness of the second mounting wall.
  • the geometric center axis of the lens is offset from the geometric center axis of the outer frame of the first assembly component to the first mounting wall.
  • the width of one side of the circuit board is smaller than the width of the other three sides, and no electronic components are arranged on the side with the smallest width of the circuit board, or the circuit board
  • the number of electronic components on the smallest side of the board is less than the number of electronic components on each other side.
  • the geometric center axis of the light through hole is offset relative to the geometric center axis of the outer frame of the first assembly component to the first mounting wall, so that the light transmission area of the photosensitive chip is offset with
  • the offset of the lens is adapted; or, the filter is provided with an off-center light shielding layer, and the geometric center axis of the light-transmitting area in the light shielding layer is relative to the geometric center axis of the filter
  • the first mounting wall is offset so that the offset of the light-transmitting area of the photosensitive chip is adapted to the offset of the lens.
  • the first assembly component is a lens holder
  • the second assembly component includes a circuit board and a base provided on the circuit board
  • the photosensitive chip is provided on the circuit board
  • the width of one side of the circuit board is smaller than the width of the other three sides, and no electronic components are arranged on the side with the smallest width of the circuit board, or the circuit board
  • the number of electronic components on the smallest side of the board is less than the number of electronic components on each other side.
  • the peripheral edge of the base has a base support portion extending in the direction of the circuit board, the base support portion includes a first mounting wall of the base and a second mounting wall of the base, the first mounting wall of the base and the The connection width of the circuit board is smaller than the connection width of the second mounting wall of the base and the circuit board, the second mounting wall of the base and the circuit board are connected by an adhesive, and the first mounting wall of the base is connected to the circuit board. The gap between the circuit boards is sealed.
  • first mounting wall and the first mounting wall of the base are on the same side of the camera module.
  • the second mounting wall of the base is U-shaped
  • the first mounting wall of the base is in the shape of "one”
  • the second mounting wall of the base and the first mounting wall of the base surround the base supporting portion.
  • an electronic device including the aforementioned camera module of the present invention.
  • the electronic device further includes a frame, and the first mounting wall is disposed close to the frame.
  • the side surface of the frame is arc-shaped, and the first mounting wall is close to the arc-shaped side surface of the frame.
  • a method for assembling the aforementioned camera module includes the following steps:
  • Adhesives are provided on three sides of a surface of the second assembly part;
  • the second mounting wall of the support portion of the first assembly component is disposed on the adhesive of the second assembly component, and the first mounting wall and the second assembly component are not bonded One side of the agent corresponds;
  • the gap between the first mounting wall and the second assembly part is sealed by oblique dispensing.
  • the overall size of the camera module of the present invention is smaller, or when the camera module of the present invention is applied to an electronic device, the lens can be made closer to the edge of the electronic device, thereby helping to reduce the non-disturbance of the camera module.
  • the size of the display area allows electronic devices to obtain a higher display ratio.
  • Fig. 1 is a schematic diagram of a camera module in the prior art
  • Figure 2 shows the arrangement of glue on the circuit board when the circuit board of the camera module is connected to the lens base in the prior art
  • Figure 3A is a schematic diagram of an electronic device in the prior art
  • FIG. 3B is a partial enlarged view of FIG. 3A, showing a camera module on an electronic device in the prior art
  • FIG. 4 is a schematic diagram of the first embodiment of the camera module of the present invention.
  • Figure 5 is a partial schematic diagram of an embodiment of the electronic device of the present invention.
  • FIG. 6 is a partial schematic diagram of another embodiment of the electronic device of the present invention.
  • FIG. 7 is a partial schematic diagram of another embodiment of the electronic device of the present invention.
  • FIG. 8 is a schematic diagram of a second embodiment of the camera module of the present invention.
  • FIG. 9 is a schematic diagram of a third embodiment of the camera module of the present invention.
  • Figure 10 shows a preferred embodiment of the lens of the present invention
  • Figure 11 shows another preferred embodiment of the lens of the present invention.
  • Figure 12 shows how the adhesive is arranged on the second assembly part when the first assembly part and the second assembly part of the camera module of the present invention are connected;
  • FIG. 13 shows a schematic diagram of the second mounting wall and the second assembly part of the camera module of the present invention after being bonded by an adhesive
  • 1 (including 1a, 1b, 1c), camera module; 100, first assembly part; 110, support part; 111, first mounting wall; 112, second mounting wall; 101, mirror holder; 200, Second assembly part; 201, circuit board; 202, base; 212, base support part; 2121, the first mounting wall of the base; 2122, the second mounting wall of the base; 300, photosensitive chip; 400, lens; 500, filter 501.
  • Platform 8. Adhesive; 9. Frame.
  • orientation words such as the terms “center”, “horizontal”, “longitudinal”, “length”, “width”, “thickness”, “upper”, “lower” , “Front”, “rear”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inner”, “outer”, “clockwise”, “counterclockwise”
  • orientation words such as the terms “center”, “horizontal”, “longitudinal”, “length”, “width”, “thickness”, “upper”, “lower” , “Front”, “rear”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inner”, “outer”, “clockwise”, “counterclockwise”
  • the indication orientation and position relationship are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the pointed device or element must have a specific orientation or a specific orientation.
  • the structure and operation should not be understood as limiting the specific
  • the present invention provides a camera module 1 (including 1a, 1b, 1c).
  • the camera module 1 includes a first assembly part 100, a second assembly part 200, and a photosensitive chip 300 And the lens 400 on the light entrance path of the photosensitive chip 300, the lens 400 is mounted on the first assembly part 100, and the photosensitive chip 300 is mounted on the second assembly part 200, wherein the peripheral edge of the first assembly part 100 has the second assembly part
  • the supporting portion 110 extending in the direction 200 includes a first mounting wall 111 and a second mounting wall 112. The supporting portion 110 is disposed on the second assembly component 200.
  • the second mounting wall 112 and the second assembly component 200 are bonded
  • the connection between the first installation wall 111 and the second assembly part 200 is sealed, and the connection width L1 of the first installation wall 111 and the second assembly part 200 is smaller than the connection width L2 of the second installation wall 112 and the second assembly part 200 .
  • first assembly part 100 may be a lens holder or a bracket including a lens holder
  • second assembly part 200 may be a circuit board or a bracket including a circuit board.
  • the specific embodiments of the first assembly part 100 and the second assembly part 200 are described in more detail below, but the first assembly part 100 and the second assembly part 200 are not limited to the several embodiments listed in the present invention .
  • connection width refers to the width of the portion where the first mounting wall 111 or the second mounting wall 112 is connected to the second assembly component 200 from the inside to the outside of the camera module 1.
  • the connection width between the first installation wall 111 or the second installation wall 112 and the second assembly part 200 is the same as the thickness of the first installation wall 111 or the second installation wall 112;
  • the connecting width of the first mounting wall 111 and the second assembly part 200 is the width of the opposite part of the first mounting wall 111 and the second assembly part 200, and the second mounting wall 112 is connected to the second assembly part 200.
  • the connection width of the component 200 is the same as the thickness of the second mounting wall 112.
  • the second mounting wall 112 and the second assembly component 200 are connected by an adhesive.
  • the adhesive needs to be pre-installed on the second assembly component 200.
  • the pre-installed adhesive needs to reserve a certain width. Therefore, the second installation wall 112
  • the connection width with the second assembly component 200 is not less than the minimum bonding width.
  • the first mounting wall 111 and the second assembly part 200 can be sealed by dispensing processes, so the bonding width can be ignored, that is, the first mounting wall 111 can be made narrower to make the first mounting wall 111
  • the connection width with the second assembly component 200 is smaller than the minimum bonding width.
  • the “minimum bonding width” mentioned in the present invention refers to the narrowest connection width required to realize a stable connection of two parts for a specific adhesive.
  • the glue used to bond the second mounting wall 112 and the second assembly component 200 and the sealing glue used to seal the gap between the first mounting wall 111 and the second assembly component 200 may be the same or different.
  • the sealing glue used to seal the gap between the first mounting wall 111 and the second assembly part 200 is glue with poor fluidity to prevent the sealing glue from flowing into the structure and contaminating internal components.
  • the sealing glue can extend to the side wall of the second assembly part 200 to improve the sealing effect, as shown in the partial enlarged view of FIG. 8 or FIG. 9 As shown in the partial enlarged view of, the sealing glue extending to the side wall of the second assembly part 200 is also beneficial to improve the bonding strength between the first assembly part 100 and the second assembly part 200 to a certain extent.
  • first mounting wall 111 and the second assembly part 200 can also be closely attached to achieve the seal between the first mounting wall 111 and the second assembly part 200. In this case, there is no need to consider adhesion. The problem of width.
  • the second mounting wall 112 is U-shaped, the first mounting wall 111 is a "one" shape, and the second mounting wall 112 is connected to the first mounting wall 112.
  • the wall 111 surrounds and forms a supporting portion 110.
  • the cross section of the support part 110 is quadrangular, in order to improve the connection stability of the first assembly part 100 and the second assembly part 200, the three side walls of the support part 110 constitute the second installation wall 112, and one part of the support part 110 The side wall constitutes the first mounting wall 111.
  • the shape of the cross section of the support portion 110 is not limited to the quadrilateral listed in the present invention, and may also be other polygons.
  • the camera module 1 further includes a filter 500.
  • the first assembly part 100 or the second assembly part 200 is provided with a platform 501 on which the filter 500 is mounted.
  • the platform 501 holds the filter 500 between the lens 400 and the photosensitive chip 300. between.
  • the platform 501 has a light-passing hole, and the filter 500 is opposite to the light-passing hole.
  • the filter 500 is used to filter the infrared light in the light and block part of the stray light that interferes with the imaging quality from entering the photosensitive chip 300.
  • connection width between the first mounting wall 111 and the second assembly component 200 is smaller than the connection width between the second mounting wall 112 and the second assembly component 200" in various ways.
  • the supporting portion 110 is opposite to the upper surface of the second assembly component 200, and the connection width between the first mounting wall 111 and the second assembly component 200 is reduced by reducing the thickness of the first mounting wall 111.
  • the connection width between the first mounting wall 111 and the second assembly component 200 is reduced by reducing the thickness of the first mounting wall 111.
  • the first assembly part 100 of the camera module 1a is a lens holder 101
  • the second assembly part 200 is a circuit board 201
  • the lens 400 is arranged in the lens holder 101
  • the photosensitive chip 300 is arranged on the circuit board 201
  • the supporting portion 110 extends from the peripheral edge of the lens holder 101 to the circuit board 201, and the supporting portion 110 is opposite to the upper surface of the circuit board 201.
  • the second mounting wall 112 of the supporting portion 110 is connected to the circuit board 201 by an adhesive.
  • the gap between the first mounting wall 111 of 110 and the circuit board 201 is sealed.
  • the thickness of the first mounting wall 111 is smaller than the thickness of the second mounting wall 112.
  • the geometric center axis a of the lens 400 is offset to the first mounting wall 111 relative to the geometric center axis b of the outer frame of the first assembly component 100.
  • the geometric central axis a of the lens 400 refers to the central axis of the lens 400 in the geometric structure; the geometric central axis b of the outer frame of the first assembly part 100 refers to the central axis in the geometric structure with the outer surface of the first assembly part 100 as the boundary .
  • the platform 501 on which the filter 500 is installed is provided in the lens holder 101.
  • the first assembly part 100 and the lens 400 can be implemented as an integrated lens.
  • the lens 400 is assembled in the lens holder 101 to form an integrated lens, and then assembled in the second assembly part 200.
  • the filter 500 may also be fixed to the lens holder 101 in advance.
  • the integrated lens further includes a driving part for achieving lens focusing, and the driving part may be implemented as a voice coil motor or the like.
  • the first mounting wall 111 of the supporting portion 110 is not completely disposed on the surface of the second assembly component 200, so that the side surface of the camera module 1 is stepped. That is, without increasing the size of the first assembly component 100, the first assembly component 100 is entirely offset to one side relative to the second assembly component 200.
  • the camera module 1 is especially suitable for electronic equipment with an arc-shaped side frame. The stepped side of the camera module 1 can better fit the arc-shaped frame, improve the space utilization of the electronic device frame, and at the same time facilitate the lens 400 Near the edge of electronic equipment.
  • the camera module 1 is arranged in an electronic device, and the electronic device has a frame 9 with an arc-shaped side, and the camera module 1 is arranged close to the frame 9.
  • the first assembly part 100 of the camera module 1 is a lens holder 101
  • the second assembly part 200 includes a circuit board 201 and a base 202 arranged on the circuit board 201.
  • the photosensitive chip 300 is arranged on the circuit board 201, and the lens 400 is arranged on the mirror. Block 101.
  • the supporting portion 110 extends from the peripheral edge of the mirror base 101 to the base 202, the second mounting wall 112 of the supporting portion 110 and the base 202 are connected by an adhesive, and the gap between the first mounting wall 111 of the supporting portion 110 and the base 202 is covered. seal.
  • the first mounting wall 111 is not completely disposed on the base 202, so that the connection width between the first mounting wall 111 and the base 202 is smaller than the connection width between the second mounting wall 112 and the base 202, and the side surface of the camera module 1b is stepped.
  • the peripheral edge of the base 202 has a base support portion 212 extending in the direction of the circuit board 201.
  • the base support portion 212 includes a base first mounting wall 2121 and a base second mounting wall 2122.
  • the base first mounting wall 2121 and the circuit board 201 The connection width of the base is smaller than the connection width of the second mounting wall 2122 of the base and the circuit board 201.
  • the second mounting wall 2122 of the base and the circuit board 201 are connected by an adhesive, and the gap between the first mounting wall 2121 of the base and the circuit board 201 is sealed .
  • connection width between the first mounting wall 2121 of the base and the circuit board 201 is smaller than the connection width between the second mounting wall 2122 of the base and the circuit board 201.
  • the base support portion 212 is all set on the surface of the circuit board 201, and the connection width between the first mounting wall 2121 of the base and the circuit board 201 is reduced by reducing the thickness of the first mounting wall 2121 of the base. It is beneficial to reduce the size of the base 202.
  • Another way is: as shown in FIG. 9, the first mounting wall 2121 of the base of the base supporting portion 212 is not completely disposed on the surface of the circuit board 201, so that the side surface of the second assembly part 200 is stepped.
  • the side of the camera module 1 can better fit the arc-shaped frame, which improves the space utilization rate of the frame and at the same time facilitates the lens 400 to be closer to the edge of the electronic device.
  • the first mounting wall 111 of the lens holder 101 and the base first mounting wall 2121 of the base 202 are on the same side of the camera module 1.
  • the second mounting wall 2122 of the base is U-shaped
  • the first mounting wall 2121 of the base is a “one” shape
  • the second mounting wall 2122 of the base and the first mounting wall 2121 surround the base supporting portion 212.
  • the platform 501 on which the filter 500 is installed is provided on the base 202.
  • the first assembling part 100 of the camera module 1 includes a base and a lens holder arranged on the base
  • the second assembling part 200 includes a circuit board
  • the photosensitive chip 300 is arranged on the circuit board
  • the lens 400 is arranged in the lens holder.
  • the supporting portion 110 extends from the peripheral edge of the base toward the circuit board, the second mounting wall 112 of the supporting portion 110 is connected to the circuit board by an adhesive, and the first mounting wall 111 of the supporting portion 110 is connected to the circuit board. The gap between the plates is sealed.
  • the first mounting wall 111 is not completely disposed on the circuit board, so that the side surface of the camera module 1 is stepped.
  • the lens holder and the base of the first assembly part 100 may also be offset to one side, so that the side surface of the first assembly part 100 is stepped.
  • one side of the circuit board may become narrow, that is, one of the areas outside the photosensitive chip 300 on the circuit board
  • the width of the side is smaller than the width of the other three sides. No or fewer electronic components are installed on the side with the smallest width.
  • “less electronic components” refers to the number of electronic components on the side with the smallest width Less than the number of electronic components on the other side.
  • Another embodiment is that the surface of the first mounting wall 111 of the supporting portion 110 and the second assembly part 200 are not opposite, that is, the offset of the first assembly part 100 relative to the second assembly part 200 is greater than that of the first mounting wall 111 thickness.
  • Those skilled in the art can use glue or other methods to seal the gap between the first mounting wall 111 and the second assembly component 200.
  • connection width between the first mounting wall 111 and the second assembly component 200 is smaller than the connection width between the second mounting wall 112 and the second assembly component 200
  • connection width between the second mounting wall 112 and the second assembly component 200 is not an exhaustive list, and other ways that can be easily conceived by those skilled in the art All are within the protection scope of the present invention.
  • the relative position of the lens 400 and the photosensitive chip 300 may change. If the photosensitive chip 300 is still arranged on the second assembly part 200 according to the position of the prior art, the optical axis of the lens 400 may not coincide with the optical axis of the photosensitive chip 300, that is, the photosensitive area of the photosensitive chip 300 cannot be completely aligned with The imaging area of the lens 400 corresponds to that, so that a part of the photosensitive area of the photosensitive chip 300 cannot receive light.
  • the photosensitive area of the photosensitive chip 300 completely corresponds to the imaging area of the lens 400, as shown in FIG.
  • one side of the circuit board may become narrow, that is, the width of one side in the area outside the photosensitive chip 300 on the circuit board is smaller than the width of the other three sides.
  • No or fewer electronic components are installed on the side with the smallest width.
  • “less electronic components are provided” means that the number of electronic components on the side with the smallest width is less than the number of electronic components on the other sides.
  • the optical axis of the lens 400 is offset relative to its geometric central axis to compensate for the deviation of the geometric central axis a of the lens 400 relative to the photosensitive chip 300.
  • the advantage is that it can reduce the redesign of the camera module structure.
  • the lens 400 includes at least one free-form surface lens 401.
  • the free-form surface lens 401 offsets the imaging area of the lens 400 with respect to the geometric center axis of the lens 400, thereby ensuring that the photosensitive area of the photosensitive chip 300 is completely aligned with the lens 400.
  • Corresponding to the imaging area Those skilled in the art can understand that by optically designing the diopters of different areas of the free-form surface lens 401, the imaging area of the lens 400 at the height of the image plane can be shifted to correspond to the photosensitive chip 300.
  • At least one surface of the free-form lens 401 is a free-form surface, that is, the free-form lens 401 can have a free-form surface on the image side, a free-form surface on the object side, or a free-form surface on both the image side and the object side. Surface.
  • the lens 400 may include only one free-form surface lens 401, or may include a plurality of free-form surface lenses 401.
  • the respective curved lenses 401 may be arranged adjacently or at intervals, and the respective curved lenses 401 may be the same or different.
  • the image side surface of the lens on the lens 400 closest to the photosensitive chip 300 is a free-form surface.
  • the light transmission area of the filter 500 also needs to correspond to the imaging area of the lens 400 or the position of the photosensitive area of the photosensitive chip 300. Therefore, in some embodiments, the position of the light-transmitting area of the filter 500 also needs to be adjusted accordingly.
  • changing the position of the light-passing hole on the platform 501 to adapt the light-transmitting area of the filter 500 to the offset of the photosensitive chip 300 and the lens 400 can make the platform 501 close to the first mounting wall 111
  • the width is smaller than the width of the platform 501 near the second mounting wall 112, so that the geometric center axis of the light through hole is offset from the geometric center axis of the outer frame of the first assembly component 100 to the side of the first mounting wall 111.
  • the coating position of the light-shielding layer on the filter 500 is changed to form an eccentric light-transmitting area on the filter 500, so that the filter
  • the light-transmitting area of the light sheet 500 is adapted to the offset of the photosensitive chip 300 and the lens 400, that is, the light-shielding layer is coated on the filter 500.
  • the light-shielding layer is eccentrically arranged on the The filter 500 is such that the geometric center axis of the light-transmitting area in the light shielding layer is offset relative to the geometric center axis of the filter 500 to the side of the first mounting wall 111.
  • a light-shielding layer is usually provided at the edge of the filter 500, and the light-shielding layer does not allow light to pass through.
  • the purpose of the light-shielding layer is to reduce stray light from entering the photosensitive chip 300. Therefore, it is possible to change the light-shielding layer.
  • the position is set to adjust the position of the light-transmitting area of the filter 500.
  • the present invention also provides an electronic device. As shown in FIG. 5 or 6 or 7, the electronic device includes the aforementioned camera module 1 and a frame 9, and the camera module 1 is arranged close to the frame 9.
  • the overall size of the camera module 1 is reduced by reducing the thickness of the first assembly part 100 of the camera module 1, so that the front side of the electronic device can be more Large display area.
  • the camera module 1 is stepped on the side close to the arc-shaped side of the frame 9, so that the camera module 1 can be set closer to the edge of the frame 9, thereby It is beneficial to reduce the size of the non-display area on the electronic device. That is, the design of the module can make the module closer to the edge of the electronic device, so that the screen-to-body ratio of the electronic device is higher.
  • the front of the electronic device has a display area D1 and a non-display area F1, and the lens 400 of the camera module 1 is opposite to the non-display area F1.
  • the first mounting wall 111 of the first assembly part 100 of the camera module 1 is disposed close to the upper side or the lower side of the frame 9. Since the thickness of the first mounting wall 111 can be set to be smaller than the minimum bonding width, that is, compared with the prior art, the distance between the lens 400 and the upper or lower side of the frame 9 can be smaller, which is beneficial The distance between the edge of the display area D1 and the upper or lower side of the frame 9 is reduced.
  • the front of the electronic device has a display area D2 and a non-display area F2, and the lens 400 of the camera module 1 is opposite to the non-display area F2.
  • the first mounting wall 111 of the first assembly part 100 of the camera module 1 is arranged close to the left side or the right side of the frame 9. Since the thickness of the first mounting wall 111 can be set to be smaller than the minimum bonding width, that is, compared with the prior art, the distance between the lens 400 and the left or right side of the frame 9 can be smaller, which is beneficial The distance between the edge of the display area D2 and the left or right side of the frame 9 is reduced.
  • the side surface of the frame 9 of the electronic device is arc-shaped
  • the front of the electronic device has a display area D3 and a non-display area F3
  • the lens 400 of the camera module 1 and the non-display area Area F3 is opposite.
  • the first mounting wall 111 of the support portion 110 of the first assembly part 100 of the camera module 1 is not completely set on the second assembly part 200, so that one side of the camera module 1 has a stepped shape.
  • the first mounting wall 111 is arranged close to the arc-shaped side surface of the frame 9, and the step-shaped side surface of the camera module 1 fits well with the arc-shaped frame 9.
  • the first assembly component 100 can be closer to the frame 9, that is, the distance between the lens 400 and the frame 9 can be smaller, which is beneficial to reduce the distance between the edge of the display area D3 and the frame 9.
  • the frame 9 of the electronic device is arc-shaped, the front of the electronic device has a display area and a non-display area, the lens 400 of the camera module 1 is opposite to the non-display area, and the camera module is shown in FIG. 9 .
  • the first mounting wall 111 of the supporting portion 110 of the first assembly component 100 of the camera module 1 is not completely disposed on the second assembly component 200, so that the first assembly component 100 and the second assembly component have a stepped shape on one side.
  • the base first mounting wall 2121 of the base supporting portion 212 of the base 202 of the second assembly component 200 is not completely provided on the circuit board 201, and the side surface of the second assembly component 200 is also stepped.
  • the first mounting wall 111 and the first mounting wall 2121 of the base are arranged close to the frame 9, so that the double-layer stepped side surface of the camera module 1 is better matched with the curved frame 9.
  • the first assembly component 100 can be closer to the frame 9, that is, the distance between the lens 400 and the frame 9 can be smaller, which is beneficial to reduce the distance between the edge of the display area D3 and the frame 9.
  • the present invention also provides a method for assembling the aforementioned camera module 1 (including 1a, 1b, and 1c), which includes the following steps:
  • the second mounting wall 112 of the support portion 110 of the first assembly part 100 is set on the adhesive 8 of the second assembly part 200, and the first mounting wall 111 and the second assembly part 200 are not provided with one of the adhesives.
  • a three-sided painting method is adopted. First, the three sides of the second assembling part 200 and the first assembling part 100 are connected by an adhesive to fix the first assembling part and The second assembly part, and then the gap on the other side is sealed by other means to avoid contamination of the camera module 1. There is no requirement for the connection width when sealing, so the thickness of the first mounting wall 111 of the first assembly part 100 is less than the minimum Bonding width.
  • step S4 adopts an oblique dispensing method to seal the gap between the first mounting wall 111 and the second assembly component 200.
  • a thermally curable or ultraviolet curable resin is used to seal the gap between the first mounting wall 111 and the second assembly component 200 in step S4.
  • the resin used to seal the gap in step S4 may be the same as the adhesive 8 or may be different.
  • the adhesive in step S1 is a thermally curable or ultraviolet curable resin.
  • the adhesive in step S1 is a thermally curable resin
  • step S3 the adhesive is cured by heating and baking.
  • the gap between the first mounting wall 111 and the second assembly component 200 Can be used as a vent during heating.
  • adhesive is arranged around the circuit board.
  • the surroundings are in contact with the adhesive, so there is no gap between the lens holder and the circuit board. It can be ventilated.
  • a vent hole needs to be provided on the lens holder. That is, the use of the assembly method of the present invention is also beneficial to simplify the structure of the lens holder.

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Abstract

本发明涉及摄像模组、摄像模组的装置方法以及电子设备。其中摄像模组包括第一组装部件、第二组装部件、感光芯片以及处于感光芯片进光路径上的镜头，镜头安装于第一组装部件，感光芯片设于第二组装部件，第一组装部件的四周边缘具有向第二组装部件方向延伸的支撑部，支撑部包括第一安装壁以及第二安装壁，支撑部设置于第二组装部件上，第二安装壁与第二组装部件通过粘接剂连接，第一安装壁与第二组装部件之间被密封，第一安装壁与第二组装部件的连接宽度小于第二安装壁与第二组装部件的连接宽度。本发明提供的摄像模组应用于电子设备时，有利于减少其占用的非显示区域的面积，为电子设备的正面设置更大的显示区域提供选择。

Description

摄像模组、摄像模组的组装方法以及电子设备 技术领域
本发明涉及摄像模组、摄像模组的组装方法以及电子设备。
背景技术
摄像模组是智能电子设备重要的部件，智能电子设备的屏幕日益趋向“全屏化”，因此电子设备前方面板的非显示区域被极大地压缩，因此如何在越来越小的“额头”内置入摄像模组成为行业亟需考虑的问题。
图1显示了现有技术中的摄像模组A，摄像模组A包括线路板A1、感光芯片A2、镜头A3以及镜座A4，感光芯片A2设置在线路板A1上，镜头A3安装在镜座A4上，镜座A4通过胶水C与线路板A1粘接。镜座A4与线路板A1粘接时，首先在线路板A1的四周设置胶水C，如图2所示，然后使镜座A4的底面与胶水C对齐放置在线路板A1上，然后使胶水C固化，从而镜座A4与线路板A1连接。采用这种方式连接镜座A4与线路板A1时，对镜座A4的粘接宽度有一定的要求，也即镜座A4需要具有一定的厚度以满足对其粘接宽度的要求。
图3A显示了具有摄像模组A的一电子设备B的示意图，图3B为图3A的局部放大图。电子设备B的正面具有显示区域B1以及非显示区域B2，摄像模组A设置在非显示区域B2，非显示区域B2处于电子设备B正面的边缘。减小非显示区域B2的宽度可以从两个方面入手，一方面减小摄像模组A的整体尺寸，另一方面是将摄像模组A尽可能地靠近电子设备B的边缘设置。现有技术受限于镜座A4的厚度，整体尺寸很难进一步缩小，而且镜座A4的壁厚也限制了镜头进一步靠近电子设备B的边缘。
发明内容
为了克服现有技术的不足，本发明的目的在于提供一种摄像模组，应用于电子设备时，有利于使电子设备获得更高的显示占比。
本发明的另一个目的在于提供一种上述摄像模组的组装方法。
本发明的另一个目的在于提供一种包括上述摄像模组的电子设备。
根据本发明的一个方面，提供一种摄像模组，包括第一组装部件、第二组装部件、感光芯片以及处于所述感光芯片进光路径上的镜头，所述镜头安装于所述第一组装部件，所述感光芯片设于所述第二组装部件，所述第一组装部件的四周边缘具有向所述第二组装部件方向延伸的支撑部，所述支撑部包括第一安装壁以及第二安装壁，所述支撑部设置于所述第二组装部件上，所述第二安装壁与所述第二组装部件通过粘接剂连接，所述第一安装壁与所述第二组装部件之间被密封，所述第一安装壁与所述第二组装部件的连接宽度小于所述第二安装壁与所述第二组装部件的连接宽度。
进一步地，所述第二安装壁呈U形，所述第一安装壁呈“一”字形，所述第一安装壁与所述第二安装壁围绕形成所述支撑部。
进一步地，所述第一安装壁与所述第二组装部件之间通过密封胶水密封，所述密封胶水延伸到所述第二组装部件的侧壁。
进一步地，所述摄像模组还包括滤光片，所述第一组装部件或所述第二组装部件上设有用于安装所述滤光片的平台，所述平台将所述滤光片保持在所述镜头与所述感光芯片之间，所述平台具有通光孔，所述滤光片与所述通光孔相对。
进一步地，所述镜头包括至少一具有自由曲面的透镜，所述具有自由曲面的透镜使得所述镜头的成像区域相对于所述镜头的几何中心轴偏移，从而使所述镜头的成像区域与所述感光芯片对应。
进一步地，所述镜头上最靠近所述感光芯片的一透镜的像侧表面为自由曲面。
根据一个方面，所述第一安装壁的厚度小于所述第二安装壁的厚度；或者，所述第一安装壁不完全地设于所述第二组装部件上，使得所述摄像模组的侧面形成台阶状。
根据另一个方面，所述第一组装部件为镜座，所述第二组装部件为线路板，所述支撑部从所述镜座的四周边缘向所述线路板延伸，所述支撑部与所述线路板的上表面相对，所述第一安装壁的厚度小于所述第二安装壁的厚度。
进一步地，所述镜头的几何中心轴相对于所述第一组装部件外框的几何中心轴向所述第一安装壁偏移。
进一步地，所述线路板在所述感光芯片之外的区域中，一侧的宽度小于其他三侧的宽度，在所述线路板宽度最小的一侧不设置电子元器件，或者在所述线路板宽度最小一侧上的电子元器件的数量少于其他每侧的电子元器件的数量。
进一步地，所述通光孔的几何中心轴相对于所述第一组装部件外框的几何中心轴向所述第一安装壁偏移，以使得所述感光芯片的透光区域的偏移与所述镜头的偏移相适应；或者，所述滤光片上设有偏心的遮光层，所述遮光层之内的透光区域的几何中心轴相对于所述滤光片的几何中心轴向所述第一安装壁偏移，以使得所述感光芯片透光区域的偏移与所述镜头的偏移相适应。
根据另一个方面，所述第一组装部件为镜座，所述第二组装部件包括线路板以及设于所述线路板上的底座，所述感光芯片设于所述线路板，所述支撑部从所述镜座的四周边缘向所述底座延伸，所述第一安装壁不完全地设于所述底座上，从而所述摄像模组的侧面形成台阶状。
进一步地，所述线路板在所述感光芯片之外的区域中，一侧的宽度小于其他三侧的宽度，在所述线路板宽度最小的一侧不设置电子元器件，或者在所述线路板宽度最小一侧上的电子元器件的数量少于其他每侧的电子元器件的数量。
进一步地，所述底座的四周边缘具有向所述线路板方向延伸的底座支撑部，所述底座支撑部包括底座第一安装壁以及底座第二安装壁，所述底座第一安装壁与所述线路板的连接宽度小于所述底座第二安装壁与所述线路板的连接宽度，所述底座第二安装壁与所述线路板通过粘接剂连接，所述底座第一安装壁与所述线路板之间的缝隙被密封。
进一步地，所述第一安装壁与所述底座第一安装壁处于所述摄像模组的同一侧。
进一步地，所述底座第二安装壁呈U形，所述底座第一安装壁呈“一”字形，所述底座第二安装壁与所述底座第一安装壁围绕形成所述底座支撑部。
根据本发明的另一方面，提供一种电子设备，包括本发明的上述摄像模组。
进一步地，所述电子设备还包括边框，所述第一安装壁靠近所述边框设置。
进一步地，所述边框的侧面呈弧形，所述第一安装壁靠近所述边框的弧形侧面。
根据本发明的另一个方面，还提供上述摄像模组的组装方法，包括以下步骤：
S1.于所述第二组装部件一表面的三侧设置粘接剂；
S2.将所述第一组装部件的支撑部的第二安装壁设置在所述第二组装部件的所述粘接剂上，所述第一安装壁与所述第二组装部件未设置粘结剂的一侧对应；
S3.使所述粘接剂固化，从而所述第一组装部件与所述第二组装部件连接；
S4.密封所述第一安装壁与所述第二组装部件之间的缝隙。
进一步地，所述步骤S4中，采用倾斜点胶的方式密封所述第一安装壁与所述第二组装部件之间的缝隙。
相比现有技术：本发明的摄像模组的整体尺寸更小，或者本发明的摄像模组应用于电子设备时可以使镜头进一步靠近电子设备的边缘，从而有利于减小摄像模组的非显示区域的尺寸，使电子设备获得更高的显示占比。
附图说明
图1为现有技术的一个摄像模组的示意图；
图2显示了现有技术中，摄像模组的线路板与镜座连接时，胶水在线路板上的设置方式；
图3A为现有技术的一个电子设备的示意图；
图3B为图3A的局部放大图，显示了现有技术中电子设备上的摄像模组；
图4为本发明的摄像模组的第一个实施例的示意图；
图5为本发明的电子设备的一个实施例的部分示意图；
图6为本发明的电子设备的另一个实施例的部分示意图；
图7为本发明的电子设备的另一个实施例的部分示意图；
图8为本发明的摄像模组的第二个实施例的示意图；
图9为本发明的摄像模组的第三个实施例的示意图；
图10显示了本发明的镜头的一个优选实施例；
图11显示了本发明的镜头的另一个优选实施例；
图12显示了本发明的摄像模组的第一组装部件与第二组装部件连接时，粘接剂在第二组装部件上的设置方式；
图13显示了本发明的摄像模组的第二安装壁与第二组装部件通过粘接剂粘接后的示意图；
图中：1(包括1a、1b、1c)、摄像模组；100、第一组装部件；110、支撑部；111、第一安装壁；112、第二安装壁；101、镜座；200、第二组装部件；201、线路板；202、底座；212、底座支撑部；2121、底座第一安装壁；2122、底座第二安装壁；300、感光芯片；400、镜头；500、滤光片；501、平台；8、粘接剂；9、边框。
具体实施方式
下面，结合具体实施方式，对本发明做进一步描述，需要说明的是，在不相冲突的前提下，以下描述的各实施例之间或各技术特征之间可以任意组合形成新的实施例。
在本发明的描述中，需要说明的是，对于方位词，如有术语“中心”，“横向”、“纵向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示方位和位置关系为基于附图所示的方位或位置关系，仅是为了便于叙述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定方位构造和操作，不能理解为限制本发明的具体保护范围。
需要说明的是，本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的本申请的实施例。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过 程、方法、产品或设备固有的其它步骤或单元。
如图4或图8或图9所示，本发明提供一种摄像模组1(包括1a、1b、1c)，摄像模组1包括第一组装部件100、第二组装部件200、感光芯片300以及处于感光芯片300的进光路径上的镜头400，镜头400安装于第一组装部件100，感光芯片300安装于第二组装部件200，其中第一组装部件100的四周边缘具有向第二组装部件200方向延伸的支撑部110，支撑部110包括第一安装壁111以及第二安装壁112，支撑部110设置于第二组装部件200上，第二安装壁112与第二组装部件200通过粘接剂连接，第一安装壁111与第二组装部件200之间被密封，第一安装壁111与第二组装部件200的连接宽度L1小于第二安装壁112与第二组装部件200的连接宽度L2。
本领域的技术人员可以理解的是，第一组装部件100可以是镜座，也可以是包括镜座的支架；第二组装部件200可以是线路板，也可以是包括线路板的支架。关于第一组装部件100以及第二组装部件200的具体实施方式在后文中有更具体的描述，但是第一组装部件100以及第二组装部件200并不限于本发明所列举出的几种实施方式。
本发明所说的“连接宽度”是指第一安装壁111或第二安装壁112从摄像模组1的内部到外部的方向上与第二组装部件200相对连接部分的宽度。例如，在图4所示的实施例中，第一安装壁111或第二安装壁112与第二组装部件200的连接宽度与第一安装壁111或第二安装壁112厚度相同；在图8或图9所示的实施例中，第一安装壁111与第二组装部件200的连接宽度为第一安装壁111与第二组装部件200相对部分的宽度，第二安装壁112与第二组装部件200的连接宽度与第二安装壁112的厚度相同。
第二安装壁112与第二组装部件200通过粘接剂连接，粘接剂需要预先设 置在第二组装部件200上，预先设置的粘接剂需要预留一定的宽度，因此第二安装壁112与第二组装部件200的连接宽度不小于最小粘接宽度。第一安装壁111与第二组装部件200之间可采用点胶等工艺进行密封，因此可以不考虑粘接宽度的问题，也即可以将第一安装壁111做窄，使第一安装壁111与第二组装部件200的连接宽度小于最小粘接宽度。本领域的技术人员可以理解的是，本发明所说的“最小粘接宽度”是指：对于特定的粘接剂，实现两部件稳定连接所需的最窄的连接宽度。
值得一提的是，用于粘接第二安装壁112与第二组装部件200的胶水与用于密封第一安装壁111与第二组装部件200之间间隙的密封胶水可以相同也可以不同。优选地，用于密封第一安装壁111与第二组装部件200之间间隙的密封胶水采用流动性较差的胶水，以避免密封胶水流到结构内部污染内部器件。
在使用密封胶水密封第一安装壁111与第二组装部件200之间的间隙时，密封胶水可以延伸到第二组装部件200的侧壁以提高密封效果，如图8的局部放大图或图9的局部放大图所示，密封胶水延伸到第二组装部件200的侧壁在一定程度上也有利于提高第一组装部件100与第二组装部件200之间的粘接强度。
此外，也可以通过使第一安装壁111与第二组装部件200的端面紧密贴合，以实现第一安装壁111与第二组装部件200之间的密封，这种情况下也无需考虑粘接宽度的问题。
为提高第一组装部件100与第二组装部件200连接的稳定性，优选地，第二安装壁112呈U形，第一安装壁111呈“一”字形，第二安装壁112与第一安装壁111围绕形成支撑部110。例如，当支撑部110的横截面呈四边形时，为了提高第一组装部件100与第二组装部件200的连接稳定性，支撑部110的三 侧壁构成第二安装壁112，支撑部110的一侧壁构成第一安装壁111。当然，支撑部110横截面的形状不限于本发明列举的四边形，也可以是其他多边形。
摄像模组1还包括滤光片500，第一组装部件100或者第二组装部件200上设置有安装滤光片500的平台501，平台501将滤光片500保持在镜头400与感光芯片300之间。平台501具有通光孔，滤光片500与所述通光孔相对。滤光片500用于过滤光线中的红外光，并阻挡部分干扰成像质量的杂散光进入感光芯片300。
可通过多种方式实现“第一安装壁111与第二组装部件200的连接宽度小于第二安装壁112与第二组装部件200的连接宽度”。
其中一种实施方式为：支撑部110与第二组装部件200的上表面相对，通过减小第一安装壁111的壁厚来减小第一安装壁111与第二组装部件200的连接宽度。在不改变镜头400尺寸的前提下，通过减小第一组装部件100一侧(也即第一安装壁111)的壁厚，可以实现对第一组装部件100整体尺寸的减小，从而有利于摄像模组整体尺寸的减小。
如图4所示，摄像模组1a的第一组装部件100为镜座101，第二组装部件200为线路板201，镜头400设置在镜座101内，感光芯片300设置在线路板201上，支撑部110从镜座101的四周边缘向线路板201延伸，且支持部110与线路板201的上表面相对，支撑部110的第二安装壁112与线路板201通过粘接剂连接，支撑部110的第一安装壁111与线路板201之间的缝隙被密封。其中，第一安装壁111的厚度小于第二安装壁112的厚度。
镜头400的几何中心轴a相对于第一组装部件100外框的几何中心轴b向第一安装壁111偏移。镜头400的几何中心轴a是指镜头400在几何结构上的中心轴；第一组装部件100外框的几何中心轴b是指以第一组装部件100外侧面 为边界在几何结构上的中心轴。
进一步地，安装滤光片500的平台501设于镜座101内。
值得一提的是，在本发明中，第一组装部件100与镜头400可以被实施为一体式镜头，例如镜头400被组装于镜座101形成一体式镜头，再被组装于第二组装部件200，进一步，滤光片500亦可以被预先固定于镜座101。需要说明的是，模组被实施为自动调焦摄像模组时，所述一体式镜头还包括一驱动件，用以实现镜头对焦，所述驱动件可被实施为音圈马达等。
另一种实施方式为：支撑部110的第一安装壁111不完全设置在第二组装部件200的表面，从而摄像模组1的侧面形成台阶状。也即，在不增加第一组装部件100尺寸的情况下，将第一组装部件100相对于第二组装部件200整体地向一侧偏移。该摄像模组1尤其适用于侧面边框呈弧形的电子设备，摄像模组1台阶状的侧面能够更好地吻合弧形的边框，提高电子设备边框的空间利用率，同时有利于镜头400更靠近电子设备的边缘。
在图8或9所示的实施例中，摄像模组1被设置在电子设备之内，电子设备具有侧面呈弧形的边框9，摄像模组1靠近边框9设置。摄像模组1的第一组装部件100为镜座101，第二组装部件200包括线路板201以及设于线路板201上的底座202，感光芯片300设置在线路板201上，镜头400设置在镜座101内。支撑部110从镜座101的四周边缘向底座202延伸，支撑部110的第二安装壁112与底座202通过粘接剂连接，支撑部110的第一安装壁111与底座202之间的缝隙被密封。第一安装壁111不完全地设于底座202上，使得第一安装壁111与底座202的连接宽度小于第二安装壁112与底座202的连接宽度，摄像模组1b的侧面形成台阶状。
进一步地，底座202的四周边缘具有向线路板201方向延伸的底座支撑部 212，底座支撑部212包括底座第一安装壁2121以及底座第二安装壁2122，底座第一安装壁2121与线路板201的连接宽度小于底座第二安装壁2122与线路板201的连接宽度，底座第二安装壁2122与线路板201通过粘接剂连接，底座第一安装壁2121与线路板201之间的缝隙被密封。
实现底座第一安装壁2121与线路板201的连接宽度小于底座第二安装壁2122与线路板201的连接宽度的方式也有多种。其中一种方式为：底座支撑部212全部设置在线路板201表面上，通过减小底座第一安装壁2121的壁厚来减小底座第一安装壁2121与线路板201的连接宽度，这样有利于减小底座202的尺寸。另一种方式为：如图9所示，底座支撑部212的底座第一安装壁2121不完全设置在线路板201的表面，从而第二组装部件200的侧面形成台阶状，这样设计的优点在于摄像模组应用于侧面边框呈弧形的电子设备时，摄像模组1的侧面能够更好地吻合弧形的边框，提高边框的空间利用率，同时有利于镜头400更靠近电子设备的边缘。
优选地，镜座101的第一安装壁111与底座202的底座第一安装壁2121处于摄像模组1的同一侧。
在一些实施例中，底座第二安装壁2122呈U形，底座第一安装壁2121呈“一”字形，底座第二安装壁2122与底座第一安装壁2121围绕形成底座支撑部212。
在一些实施例中，安装滤光片500的平台501设于底座202上。
在另一实施例中，摄像模组1的第一组装部件100包括底座和设置在所述底座上的镜座，第二组装部件200包括线路板，感光芯片300设置在所述线路板上，镜头400设置在所述镜座内。支撑部110从所述底座的四周边缘向所述线路板延伸，支撑部110的第二安装壁112与所述线路板通过粘接剂连接，支撑部110的第一安装壁111与所述线路板之间的缝隙被密封。第一安装壁111 不完全地设于所述线路板上，从而摄像模组1的侧面形成台阶状。本领域的技术人员可以理解的是，其中第一组装部件100的镜座与底座之间也可以向一侧偏移设置，从而使第一组装部件100的侧面形成台阶状。
值得一提的是，当第一组装部件100不完全地设置在线路板上的时，可能会导致线路板的一侧变窄，也即，线路板上感光芯片300之外的区域中的一侧的宽度小于其他三侧的宽度，在该宽度最小的一侧不设置或少设置电子元器件，此处“少设置电子元器件”是指在该宽度最小的一侧的电子元器件的数量少于其他侧的电子元器件的数量。
再一种实施方式为：支撑部110的第一安装壁111与第二组装部件200的表面不相对，也即第一组装部件100相对于第二组装部件200的偏移量大于第一安装壁111的厚度。本领域的技术人员可以采用点胶或者其他方式密封第一安装壁111与第二组装部件200之间的空隙。
以上列举的实现“第一安装壁111与第二组装部件200的连接宽度小于第二安装壁112与第二组装部件200的连接宽度”的方式并非穷尽的列举，本领域技术容易想到的其他方式均在本发明的保护范围之内。
以上提供的几种实施方式中，在改变支撑部110一侧壁厚时，或者第一组装部件100相对于第二组装部件200偏心设置时，镜头400与感光芯片300的相对位置可能会发生改变，如果仍然按照现有技术的位置在第二组装部件200上设置感光芯片300，则可能使镜头400的光轴与感光芯片300的光轴不重合，也即感光芯片300的感光区无法全部与镜头400的成像区域对应，导致感光芯片300的一部分感光区无法接收到光线。
在一些实施例中，直接通过改变感光芯片300在第二组装部件200的线路板201上的安装位置，保证感光芯片300的感光区域完整地与镜头400的成像 区域对应，图10所示。当感光芯片300在线路板上的位置改变时，可能会导致线路板的一侧变窄，也即，线路板上感光芯片300之外的区域中的一侧的宽度小于其他三侧的宽度，在该宽度最小的一侧不设置或少设置电子元器件。此处“少设置电子元器件”是指在该宽度最小的一侧的电子元器件的数量少于其他侧的电子元器件的数量。
在另一些实施例中，在不改变感光芯片300安装位置的情况下，通过使镜头400的光轴相对于其几何中心轴发生偏移，以补偿镜头400几何中心轴a相对感光芯片300的偏移，如图11所示，其优点在于，可以减少对摄像模组结构的重新设计。该实施例中，镜头400包括至少一自由曲面透镜401，自由曲面透镜401使得镜头400的成像区域相对于镜头400的几何中心轴偏移，从而保证了感光芯片300的感光区域完整地与镜头400的成像区域对应。本领域的技术人员可以理解的是，通过光学设计自由曲面透镜401不同区域的屈光度，可以使镜头400在像面高度处的成像区域偏移至与感光芯片300对应。
自由曲面透镜401的至少一表面为自由曲面，也即自由曲面透镜401可以是像侧表面为自由曲面，也可以是物侧表面为自由曲面，还可以是像侧表面和物侧表面均为自由曲面。
镜头400可以只包括一个自由曲面透镜401，也可以包括多个自由曲面透镜401。当镜头400包括多个自由曲面透镜401时，各自由曲面透镜401可以相邻设置，也可以间隔地设置，而且各自由曲面透镜401可以相同也可以不相同。
为确保自由曲面透镜401对光学系统有最大的调节作用，在一些优选实施例中，镜头400上最靠近感光芯片300的一透镜的像侧表面为自由曲面。
当摄像模组还包括滤光片500时，滤光片500的透光区域也需要与镜头400的成像区域或者感光芯片300的感光区的位置对应。因此，有些实施例中，也 需要相应地调整滤光片500的透光区域的位置。
在一些实施例中，改变平台501上通光孔的位置，使滤光片500的透光区域与感光芯片300以及镜头400的偏移相适应，可以使平台501靠近第一安装壁111处的宽度小于平台501靠近第二安装壁112处的宽度，以使得所述通光孔的几何中心轴相对于第一组装部件100外框的几何中心轴向第一安装壁111一侧偏移。
在另一些实施例中，在不改变平台501上通光孔位置的情况下，改变滤光片500上遮光层的涂布位置，在滤光片500上形成偏心的透光区域，以使滤光片500的透光区域与感光芯片300以及镜头400的偏移相适应，也即，滤光片500上涂布遮光层，在一个实施例中，所述遮光层被偏心的设置于所述滤光片500，以使得所述遮光层之内的透光区域的几何中心轴相对于滤光片500的几何中心轴向第一安装壁111一侧偏移。
值得一提的是，现有技术中通常在滤光片500的边缘设置遮光层，遮光层不允许光线通过，设置遮光层的目的在于减少杂散光进入感光芯片300，因此可以通过改变遮光层的设置位置，来调整滤光片500的透光区域的位置。
本发明还提供一种电子设备，如图5或6或7所示，该电子设备包括前述摄像模组1以及边框9，摄像模组1靠近边框9设置。
通过使摄像模组1尽可能地靠近边框9设置，有利于电子设备的正面设置更大的显示区域。在一些实施例中，如图5或图6，是通过减小摄像模组1的第一组装部件100的厚度，实现摄像模组1整体尺寸的减小，从而使电子设备的正面可以设置更大的显示区域。在另一些实施例中，如图7所示，是通过使摄像模组1在靠近边框9弧形侧面的一侧形成台阶状，使摄像模组1可以更贴合边框9边缘设置，从而有利于减小电子设备上非显示区域的尺寸。即，所述模 组的设计可以使所述模组更加靠近所述电子设备边缘，使得电子设备屏占比更高。
在图5所示的实施例中，电子设备的正面具有显示区域D1和非显示区域F1，摄像模组1的镜头400与非显示区域F1相对。摄像模组1的第一组装部件100的第一安装壁111靠近边框9的上侧边或下侧边设置。由于第一安装壁111的厚度可以设置为小于最小粘结宽度，也即与现有技术相比，镜头400与边框9的上侧边或下侧边之间的距离可以更小，从而有利于减小显示区域D1的边缘到边框9上侧边或下侧边之间的距离。
在图6所示的实施例中，电子设备的正面具有显示区域D2和非显示区域F2，摄像模组1的镜头400与非显示区域F2相对。摄像模组1的第一组装部件100的第一安装壁111靠近边框9的左侧边或右侧边设置。由于第一安装壁111的厚度可以设置为小于最小粘结宽度，也即与现有技术相比，镜头400与边框9的左侧边或右侧边之间的距离可以更小，从而有利于减小显示区域D2的边缘到边框9左侧边或右侧边之间的距离。
在另一些实施例中，如图7、8所示，电子设备的边框9的侧面呈弧形，电子设备的正面具有显示区域D3和非显示区域F3，摄像模组1的镜头400与非显示区域F3相对。如图8所示，摄像模组1的第一组装部件100的支撑部110的第一安装壁111不完全地设于第二组装部件200上，从而摄像模组1的一侧形状台阶状，第一安装壁111靠近边框9的弧形侧面设置，摄像模组1台阶状的侧面较好地与弧形的边框9吻合。相对于现有技术，第一组装部件100可以更靠近边框9，也即镜头400与边框9之间的距离可以更小，从而有利于减小显示区域D3的边缘到边框9之间的距离。
在另一些实施例中，电子设备的边框9呈弧形，电子设备的正面具有显示 区域和非显示区域，摄像模组1的镜头400与非显示区域相对，其中摄像模组如图9所示。摄像模组1的第一组装部件100的支撑部110的第一安装壁111不完全地设于第二组装部件200上，从而第一组装部件100与第二组装部件的一侧形状台阶状。第二组装部件200的底座202的底座支撑部212的底座第一安装壁2121不完全地设于线路板201上，第二组装部件200的侧面也形成台阶状。第一安装壁111以及底座第一安装壁2121靠近边框9设置，从而摄像模组1双层台阶状的侧面更好地与弧形的边框9吻合。相对于现有技术，第一组装部件100可以更靠近边框9，也即镜头400与边框9之间的距离可以更小，从而有利于减小显示区域D3的边缘到边框9之间的距离。
本发明还提供上述摄像模组1(包括1a、1b、1c)的组装方法，包括以下步骤：
S1，于第二组装部件200一表面的三侧设置粘接剂8，如图12所示；
S2，将第一组装部件100的支撑部110的第二安装壁112设置在第二组装部件200的粘接剂8上，第一安装壁111与第二组装部件200未设置粘结剂的一侧对应；
S3，使粘接剂8固化，从而第一组装部件100与第二组装部件200连接，此时第一组装部件100的支撑部110的第一安装壁111与第二组装部件200之间具有缝隙，如图13所示；
S4，密封第一安装壁111与第二组装部件200之间的缝隙。
在连接第一组装部件100与第二组装部件200时，采用三面画胶的方式，先将第二组装部件200的三侧与第一组装部件100通过粘结剂连接以固定第一组装部件与第二组装部件，然后另一侧的缝隙通过其他手段密封，避免摄像模组1内部被污染，密封时对连接宽度无要求，因此使得第一组装部件100的第 一安装壁111的厚度小于最小粘接宽度。
在一些实施例中，步骤S4采用倾斜点胶的方式密封第一安装壁111与第二组装部件200之间的缝隙。
在一些实施例中，步骤S4中采用可热固化或紫外固化的树脂密封第一安装壁111与第二组装部件200之间的缝隙。步骤S4中密封缝隙使用的树脂可以与粘接剂8相同，也可以不同。
在一些实施例中，步骤S1中的粘接剂为可热固化或紫外固化的树脂。当步骤S1中的粘接剂为可热固化的树脂时，步骤S3中，通过加热烘烤的方式使粘接剂固化，此时，第一安装壁111与第二组装部件200之间的缝隙可作为加热时的通气孔。现有技术中，镜座与线路板连接时，线路板的四周均设置粘接剂，镜座放置在线路板上时，四周均与粘接剂接触，因此镜座与线路板之间没有缝隙可以通气，为了避免加热烘烤时摄像模组内部的空气膨胀对器件产生影响，需要在镜座上设置通气孔。也即，采用本发明的组装方法还有利于简化镜座的结构。
上述实施方式仅为本发明的优选实施方式，不能以此来限定本发明保护的范围，本领域的技术人员在本发明的基础上所做的任何非实质性的变化及替换均属于本发明所要求保护的范围。

Claims (21)

  1. 一种摄像模组，包括第一组装部件(100)、第二组装部件(200)、感光芯片以及处于所述感光芯片进光路径上的镜头，所述镜头安装于所述第一组装部件(100)，所述感光芯片设于所述第二组装部件(200)，其特征在于，
    所述第一组装部件(100)的四周边缘具有向所述第二组装部件(200)方向延伸的支撑部(110)，所述支撑部(110)包括第一安装壁(111)以及第二安装壁(112)，所述支撑部(110)设置于所述第二组装部件(200)上，所述第二安装壁(112)与所述第二组装部件(200)通过粘接剂连接，所述第一安装壁(111)与所述第二组装部件(200)之间被密封，所述第一安装壁(111)与所述第二组装部件(200)的连接宽度小于所述第二安装壁(112)与所述第二组装部件(200)的连接宽度。
  2. 根据权利要求1所述的摄像模组，其特征在于，所述第二安装壁(112)呈U形，所述第一安装壁(111)呈“一”字形，所述第一安装壁(111)与所述第二安装壁(112)围绕形成所述支撑部(110)。
  3. 根据前述权利要求中任一项所述的摄像模组，其特征在于，所述第一安装壁(111)与所述第二组装部件(200)之间通过密封胶水密封，所述密封胶水延伸到所述第二组装部件(200)的侧壁。
  4. 根据前述权利要求中任一项所述的摄像模组，其特征在于，所述摄像模组还包括滤光片，所述第一组装部件(100)或所述第二组装部件(200)上设有用于安装所述滤光片的平台，所述平台将所述滤光片保持在所述镜头与所述感光芯片之间，所述平台具有通光孔，所述滤光片与所述通光孔相对。
  5. 根据前述权利要求中任一项所述的摄像模组，其特征在于，所述镜头包括至少一具有自由曲面的透镜，所述具有自由曲面的透镜使得所述镜头的成像 区域相对于所述镜头的几何中心轴偏移，从而使所述镜头的成像区域与所述感光芯片对应。
  6. 根据权利要求5所述的摄像模组，其特征在于，所述镜头上最靠近所述感光芯片的一透镜的像侧表面为自由曲面。
  7. 根据前述权利要求中任一项所述的摄像模组，其特征在于，
    所述第一安装壁(111)的厚度小于所述第二安装壁(112)的厚度；
    或者，所述第一安装壁(111)不完全地设于所述第二组装部件(200)上，使得所述摄像模组的侧面形成台阶状。
  8. 根据前述权利要求中任一项所述的摄像模组，其特征在于，所述第一组装部件(100)为镜座，所述第二组装部件(200)为线路板(201)，所述支撑部(110)从所述镜座的四周边缘向所述线路板(201)延伸，所述支撑部(110)与所述线路板(201)的上表面相对，所述第一安装壁(111)的厚度小于所述第二安装壁(112)的厚度。
  9. 根据权利要求8所述的摄像模组，其特征在于，所述镜头的几何中心轴相对于所述第一组装部件(100)外框的几何中心轴向所述第一安装壁(111)偏移。
  10. 根据权利要求9所述的摄像模组，其特征在于，所述线路板(201)在所述感光芯片之外的区域中，一侧的宽度小于其他三侧的宽度，在所述线路板(201)宽度最小的一侧不设置电子元器件，或者在所述线路板(201)宽度最小一侧上的电子元器件的数量少于其他侧的电子元器件的数量。
  11. 根据权利要求9所述的摄像模组，其特征在于，所述通光孔的几何中心 轴相对于所述第一组装部件(100)外框的几何中心轴向所述第一安装壁(111)偏移；或者，所述滤光片上设有偏心的遮光层，所述遮光层之内的透光区域的几何中心轴相对于所述滤光片的几何中心轴向所述第一安装壁(111)偏移。
  12. 根据权利要求1-7任一所述的摄像模组，其特征在于，所述第一组装部件(100)为镜座，所述第二组装部件(200)包括线路板(201)以及设于所述线路板(201)上的底座，所述感光芯片设于所述线路板(201)，所述支撑部(110)从所述镜座的四周边缘向所述底座延伸，所述第一安装壁(111)不完全地设于所述底座上，从而所述摄像模组的侧面形成台阶状。
  13. 根据权利要求12所述的摄像模组，其特征在于，所述线路板(201)在所述感光芯片之外的区域中，一侧的宽度小于其他三侧的宽度，在所述线路板(201)宽度最小的一侧不设置电子元器件，或者在所述线路板(201)宽度最小一侧上的电子元器件的数量少于其他侧的电子元器件的数量。
  14. 根据权利要求12所述的摄像模组，其特征在于，所述底座的四周边缘具有向所述线路板(201)方向延伸的底座支撑部(110)，所述底座支撑部(110)包括底座第一安装壁(111)以及底座第二安装壁(112)，所述底座第一安装壁(111)与所述线路板(201)的连接宽度小于所述底座第二安装壁(112)与所述线路板(201)的连接宽度，所述底座第二安装壁(112)与所述线路板(201)通过粘接剂连接，所述底座第一安装壁(111)与所述线路板(201)之间的缝隙被密封。
  15. 根据权利要求14所述的摄像模组，其特征在于，所述第一安装壁(111)与所述底座第一安装壁(111)处于所述摄像模组的同一侧。
  16. 根据权利要求14所述的摄像模组，其特征在于，所述底座第二安装壁 (112)呈U形，所述底座第一安装壁(111)呈“一”字形，所述底座第二安装壁(112)与所述底座第一安装壁(111)围绕形成所述底座支撑部(110)。
  17. 一种电子设备，其特征在于，包括如权利要求1-16任一所述的摄像模组。
  18. 根据权利要求17所述的电子设备，其特征在于，所述电子设备还包括边框，所述第一安装壁(111)靠近所述边框设置。
  19. 根据权利要求17或18所述的电子设备，其特征在于，所述边框的侧面呈弧形，所述第一安装壁(111)靠近所述边框的弧形侧面。
  20. 一种如权利要求1-16任一所述的摄像模组的组装方法，其特征在于，包括以下步骤：
    S1.于所述第二组装部件(200)一表面的三侧设置粘接剂；
    S2.将所述第一组装部件(100)的支撑部(110)的第二安装壁(112)设置在所述第二组装部件(200)的所述粘接剂上，所述第一安装壁(111)与所述第二组装部件(200)未设置粘结剂的一侧对应；
    S3.使所述粘接剂固化，从而所述第一组装部件(100)与所述第二组装部件(200)连接；
    S4.密封所述第一安装壁(111)与所述第二组装部件(200)之间的缝隙。
  21. 根据权利要求20所述的组装方法，其特征在于，所述步骤S4中，采用倾斜点胶的方式密封所述第一安装壁(111)与所述第二组装部件(200)之间的缝隙。
PCT/CN2020/070335 2019-01-21 2020-01-03 摄像模组、摄像模组的组装方法以及电子设备 WO2020151481A1 (zh)

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