WO2020093728A1 - 一种连接器及制作方法 - Google Patents

一种连接器及制作方法 Download PDF

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Publication number
WO2020093728A1
WO2020093728A1 PCT/CN2019/095935 CN2019095935W WO2020093728A1 WO 2020093728 A1 WO2020093728 A1 WO 2020093728A1 CN 2019095935 W CN2019095935 W CN 2019095935W WO 2020093728 A1 WO2020093728 A1 WO 2020093728A1
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WIPO (PCT)
Prior art keywords
conductive
connection hole
flexible copper
conductive layer
conductive medium
Prior art date
Application number
PCT/CN2019/095935
Other languages
English (en)
French (fr)
Inventor
苏陟
Original Assignee
广州方邦电子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 广州方邦电子股份有限公司 filed Critical 广州方邦电子股份有限公司
Priority to KR1020217017706A priority Critical patent/KR20210080559A/ko
Priority to US17/285,154 priority patent/US11962112B2/en
Priority to JP2021525197A priority patent/JP7375011B2/ja
Publication of WO2020093728A1 publication Critical patent/WO2020093728A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/6485—Electrostatic discharge protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Definitions

  • the invention relates to the technical field of electrical connectors, in particular to a connector and a manufacturing method.
  • Conductive adhesive is a kind of adhesive with certain conductivity after curing or drying. It can connect a variety of conductive materials together, so as to form an electrical path between the connected materials. In the electronics industry, conductive adhesive has become an indispensable new material. However, the conductive adhesive still has the following problems:
  • the electrical connection performance is unstable. Due to the influence of stress, climate and other factors, the volume or shape of the base of the conductive adhesive is prone to gradual or sudden changes, so that the stacking state of the conductive particles inside it is easy to change, which makes the conductive adhesive and the circuit
  • the conduction effect of the ground layer of the board is not ideal, and the static charge accumulated on the circuit board cannot be well derived, so that the static charge is accumulated on the circuit board to form an interference source, which affects the signal transmission.
  • the present invention provides a connector and a manufacturing method.
  • the connector is used for installation and connection of a circuit board. Advantages, and its manufacturing method is simple and easy to implement.
  • the present invention provides a connector including an insulator, a first conductive layer provided on one surface of the insulator, and a second conductive layer provided on the other surface of the insulator, the insulator is further provided with There is a conductive medium connecting the first conductive layer and the second conductive layer, and the surface of the first conductive layer or / and the second conductive layer is provided with a protrusion.
  • the convex portion is in a regular or irregular solid geometry.
  • the shape of the protruding portion is pointed, inverted cone, granular, dendritic, columnar or block-shaped.
  • the height of the raised portion is 1 to 30 ⁇ m.
  • two or more protrusions are provided on the surface of the first conductive layer and / or the second conductive layer, and the shapes of the protrusions are the same or different.
  • the sizes of the protrusions are the same or different, and two or more protrusions are distributed continuously or discontinuously on the surface of the first conductive layer or / and the second conductive layer.
  • the surface of the first conductive layer or / and the second conductive layer is a rough surface.
  • the surfaces of the first conductive layer or / and the second conductive layer are flat.
  • the material of the protrusion is one or a combination of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver.
  • an adhesive film layer is provided on the convex portion, and the convex portion is hidden in the adhesive film layer or penetrates the adhesive film layer and is exposed.
  • the insulator is provided with a connection hole connecting the first conductive layer and the second conductive layer, and the conductive medium is provided in the connection hole.
  • the conductive medium fills the connection hole, or the conductive medium is attached to the hole wall of the connection hole and forms a conductive hole.
  • the insulator is provided with two or more connection holes.
  • the material of the insulator is polyimide, thermoplastic polyimide, modified epoxy resin, modified acrylic resin, polyethylene terephthalate, polybutylene terephthalate Ester, polyethylene, polyethylene naphthalate, polystyrene, polyvinyl chloride, polysulfone, polyphenylene sulfide, polyether ether ketone, polyphenylene ether, polytetrafluoroethylene, liquid crystal polymer, polyethylene A combination of one or more diureides.
  • the first conductive layer and the second conductive layer are provided on two opposite sides of the insulator, and the protrusions are plated protrusions.
  • the convex portion is hidden in the adhesive film layer, and the thickness of the adhesive film layer is less than the average value of the height of the convex portion itself.
  • the invention also provides a method for manufacturing a connector, including the following steps:
  • a conductive medium is formed in the connection hole to make the connection hole conductive, and at the same time, a protrusion is formed on the surface of the copper foil on at least one side of the flexible copper clad laminate.
  • connection holes for connecting the copper foils on both sides of the flexible copper clad plate.
  • forming a conductive medium in the connection hole and forming the protrusion on the surface of the copper foil on at least one side of the flexible copper clad plate specifically include:
  • a thin layer of conductive medium is deposited on the hole wall of the connection hole through chemical reaction, and then one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. are used to increase the wall of the hole
  • the thickness of the conductive medium is such that conductive holes are formed, and at the same time, the protrusions are formed on the surface of the copper foil on at least one side of the flexible copper clad laminate.
  • connection hole is filled, and at the same time, the protrusion is formed on the surface of the copper foil on at least one side of the flexible copper clad laminate.
  • the method further includes the step of: An adhesive film layer is formed on the copper foil surface of the flexible copper clad laminate, which specifically includes:
  • the adhesive film layer is directly coated on the surface of the copper foil of the flexible copper clad laminate provided with the protrusions.
  • the invention also provides a second method for manufacturing a connector, including the following steps:
  • connection hole Form a conductive medium in the connection hole to make the connection hole conductive
  • a protrusion is formed on the surface of the copper foil on at least one side of the flexible copper clad laminate.
  • connection holes for connecting the copper foils on both sides of the flexible copper clad plate.
  • forming the conductive medium in the connection hole specifically includes:
  • a thin layer of conductive medium is deposited on the hole wall of the connection hole through chemical reaction, and then one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. are used to increase the wall of the hole.
  • electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. are used to increase the wall of the hole.
  • connection hole first deposit a thin layer of conductive medium on the wall of the connection hole through chemical reaction, and then use one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. to make the conductive medium Fill the connection hole.
  • one or more of electroplating, electroless plating, physical vapor deposition, chemical vapor deposition and the like are used to form the surface of the copper foil on at least one side of the flexible copper clad laminate The protrusion is formed.
  • the method further includes the step of: An adhesive film layer is formed on the copper foil surface of the flexible copper clad laminate, which specifically includes:
  • the adhesive film layer is directly coated on the surface of the copper foil of the flexible copper clad laminate provided with the protrusions.
  • the present invention also provides a third method of manufacturing the connector, including the following steps:
  • a protrusion is formed on the surface of the copper foil on at least one side of the flexible copper clad laminate
  • a conductive medium is formed in the connection hole to make the connection hole conductive.
  • one or more of electroplating, electroless plating, physical vapor deposition, chemical vapor deposition and the like are used to form the surface of the copper foil on at least one side of the flexible copper clad laminate The protrusion is formed.
  • connection holes for connecting the copper foils on both sides of the flexible copper clad plate.
  • forming the conductive medium in the connection hole specifically includes:
  • a thin layer of conductive medium is deposited on the hole wall of the connection hole through chemical reaction, and then one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. are used to increase the wall of the hole.
  • electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. are used to increase the wall of the hole.
  • connection hole first deposit a thin layer of conductive medium on the wall of the connection hole through chemical reaction, and then use one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. to make the conductive medium Fill the connection hole.
  • the method further includes the step of forming an adhesive film layer on the surface of the copper foil of the flexible copper-clad plate provided with the protrusion , Including:
  • the adhesive film layer is directly coated on the surface of the copper foil of the flexible copper clad laminate provided with the protrusions.
  • the connector provided by the embodiment of the present invention includes an insulator, a first conductive layer provided on one side surface of the insulator, and a second conductive layer provided on the other side surface of the insulator.
  • the insulator is further provided with a connection between the first conductive layer and the second conductive layer.
  • the conductive medium of the layer, the surface of the first conductive layer or / and the second conductive layer is provided with protrusions.
  • the connector provided by the embodiment of the present invention can be clamped between two circuit boards or between the circuit board and the ground metal plate, and the conductive layer is bonded to the circuit board or the ground metal plate, In this way, circuit conduction is realized, so that compared with traditional soldering and bonding, the connector can not only realize repeated disassembly of the circuit board, facilitate circuit board maintenance, reduce the manufacturing cost of electronic products, but also realize At the same time as effective electrical connection, the installation reliability of the circuit board is guaranteed.
  • the protrusion can ensure that the conductive layer forms an effective electrical connection with the ground layer and the ground metal plate of the circuit board, thereby The connector can effectively discharge the static charge accumulated on the circuit board to avoid the static charge gathering on the circuit board to form an interference source and affect the signal transmission.
  • the invention also provides the manufacturing method of the above connector, which has the advantages of simple operation and easy realization.
  • FIG. 1 is a schematic cross-sectional structure diagram of a connector according to Embodiment 1 of the present invention.
  • FIG. 2 is an enlarged view of the area I in FIG. 1;
  • FIG. 3 is a partial view of the surface of the first conductive layer according to Embodiment 1 of the present invention when it is flat;
  • Example 4 is a section view of a part of the connector of Example 1 of the present invention when magnified 400 times under a metallurgical microscope (1);
  • Example 5 is a section view of a part of the connector of Example 1 of the present invention when magnified 400 times under a metallurgical microscope (2);
  • FIG. 6 is a section view of a part of the connector of Embodiment 1 of the present invention when magnified 400 times under a metallurgical microscope (3);
  • FIG. 7 is a section view of a part of the connector of the first embodiment of the present invention when magnified 400 times under a metallurgical microscope (four);
  • Example 8 is a section view of a part of the connector of Example 1 of the present invention when magnified 400 times under a metallurgical microscope (5);
  • FIG. 9 is a schematic cross-sectional structural view of a connection hole filled with a conductive medium according to Embodiment 1 of the present invention.
  • FIG. 10 is a schematic cross-sectional structure diagram of a connector according to Embodiment 2 of the present invention.
  • Insulator 11, first conductive layer, 12, second conductive layer, 13, conductive medium, 14, protrusion, 15, conductive hole, 16, adhesive film layer.
  • an embodiment of the present invention provides a connector, which mainly includes an insulator 10, a first conductive layer 11 provided on one side surface of the insulator 10, and a second conductive layer 12 provided on the other side surface of the insulator 10,
  • the insulator 10 is also provided with a conductive medium 13 connecting the first conductive layer 11 and the second conductive layer 12.
  • the surfaces of the first conductive layer 11 and the second conductive layer 12 are provided with protrusions 14.
  • the first conductive layer 11 and the second conductive layer 12 are disposed on two opposite sides of the insulator 10, and the protrusion 14 is a plated protrusion
  • the connector provided by the embodiment of the present invention can be clamped between two circuit boards or between the circuit board and the ground metal plate, and the first conductive layer 11 and the second conductive layer 12 are respectively connected to The circuit boards or grounded metal plates are bonded together to achieve circuit conduction between the two circuit boards or between the circuit boards and the grounded metal plates. Therefore, compared with traditional soldering and bonding, the connector can not only The repeated assembly and disassembly of the circuit board facilitates the maintenance of the circuit board, reduces the manufacturing cost of electronic products, and can ensure the installation reliability of the circuit board while achieving effective electrical connection.
  • the convex portion 14 is a plated convex portion which has greater hardness than the conductive adhesive of the prior art, so It can ensure that the first conductive layer 11 and the second conductive layer 12 form an effective electrical connection with the ground layer and the ground metal plate of the circuit board, respectively, so that the connector can effectively discharge the static charge accumulated on the circuit board, avoiding Static charges accumulate on the circuit board to form interference sources that affect signal transmission.
  • the convex portion 14 has a regular or irregular three-dimensional geometric shape, such as a sharp corner shape, an inverted cone shape, a granular shape, a dendritic shape, a column shape, a block shape, etc., and, regardless What is the shape, the height h of the convex portion 14 is 1 to 30 ⁇ m, of which 2.5 to 15 ⁇ m is the most preferable range.
  • each protrusion 14 may have the same or different shape, and each protrusion
  • the size of the 14 may also be the same or different, that is to say, the shape of the two or more protrusions 14 may be one of sharp-angled, inverted cone-shaped, granular, dendritic, columnar, and block-shaped One or more, and the size of two or more protrusions 14 of the same shape may be different.
  • the above dimensions include the above-mentioned self height and the length of the protrusion 14 parallel to the side surface of the insulator 10.
  • two or more protrusions 14 are continuously or discontinuously distributed on the surfaces of the first conductive layer 11 and the second conductive layer 12, for example, when the shape of the two or more protrusions 14 When the shape is sharp and continuous, it can form a regular, periodic dentate three-dimensional pattern, or an irregular, disordered dentate three-dimensional pattern. Of course, here is just one of the cases. Combinations of other shapes in are also within the scope of protection of this application, which are not listed here.
  • the surfaces of the first conductive layer 11 and the second conductive layer 12 may be flat or rough. It should be noted that the flat surface and the rough surface mentioned here refer to the surfaces of the first conductive layer 11 and the second conductive layer 12 where the protrusion 14 is located, that is, the reference plane where the protrusion 14 is located, rather than A plane formed by two or more protrusions 14.
  • the surfaces of the first conductive layer 11 and the second conductive layer 12 are rough surfaces, they include concave portions and convex portions, and the convex portions 14 may be distributed in the concave portions or the convex portions, and any of the convex portions
  • the sum of the height H and the height h of the convex portion 14 located on the convex portion may also be 1 to 30 ⁇ m.
  • the height h of the convex portion 14 provided on the convex portion may be 1 to 30 ⁇ m.
  • the sum of the height H of the convex portion and the height h of the convex portion 14 located on the convex portion More than 1 to 30 ⁇ m, which can further enhance the electrical connection performance of the connector.
  • the material of the protrusion 14 is one or a combination of copper, nickel, lead, chromium, molybdenum, zinc, tin, gold, and silver.
  • the protrusion 14 may be a single component, namely one of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, silver, or may be copper, nickel, tin, lead, chromium, One of molybdenum, zinc, gold, and silver is the main body, and then one or more of electroplating, electroless plating, physical vapor deposition, chemical vapor deposition, etc., one or more metals other than the main body or Various types are formed on the surface of the main body, thereby forming the convex portion 14 of the composite material.
  • the protrusion 14 is preferably composed of copper, and one or more metals of nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver are formed on the composite material of the copper surface. This is because The convex portion 14 made of only copper is easily oxidized or abraded, and nickel, tin, gold, and silver formed on the copper surface can improve the corrosion resistance and abrasion resistance of the convex portion 14, thereby further improving the electrical conductivity of the connector Performance, extend the life of the connector.
  • the insulator 10 is provided with a connecting hole connecting the first conductive layer 11 and the second conductive layer 12.
  • the conductive medium 13 is attached to the hole wall of the connecting hole and forms a conductive hole 15.
  • the conductive hole 15 may be The hole can also be a buried hole or a blind hole.
  • the operator may also choose to fill the entire connection hole with the conductive medium 13, that is, the conductive hole 15 is not formed.
  • two or more connection holes may be provided between the first conductive layer 11 and the second conductive layer 12, and each connection hole is provided with a conductive medium 13 to further improve the conductive performance of the connector .
  • the material of the insulator 10 is polyimide, thermoplastic polyimide, modified epoxy resin, modified acrylic resin, polyethylene terephthalate, polybutylene terephthalate , Polyethylene, polyethylene naphthalate, polystyrene, polyvinyl chloride, polysulfone, polyphenylene sulfide, polyether ether ketone, polyphenylene ether, polytetrafluoroethylene, liquid crystal polymer, polyethylene A combination of one or more of ureides.
  • the insulator 10 may be a single component, that is, one of the above-mentioned various insulating materials, or may be a composite of any of the above-mentioned various insulating materials.
  • the insulator 10 has a certain amount of deformation.
  • the bump 14 that first contacts the circuit board will be compressed backwards, so that the relatively low bump 14 can also Contact with the circuit board to ensure that a reliable electrical connection is formed between the first conductive layer 11 and the second conductive layer 12 and the circuit board.
  • the connector provided by the embodiment of the present invention may also be provided with protrusions 14 only on the surface of the first conductive layer 11 or the second conductive layer 12, but during use, To improve the effect of electrical conduction, those skilled in the art must affix the first conductive layer 11 or the second conductive layer 12 provided with the protrusion 14 to the circuit board, so as to effectively ensure the discharge of static charge.
  • the conductive medium 13 in the embodiment of the present invention is preferably copper.
  • other materials with good conductive properties such as tin, silver, gold, graphite, copper paste, silver paste, solder paste, and carbon nanotubes, can also be used.
  • the connector structure shown in FIG. 4 includes an insulator, a first conductive layer provided on one side surface of the insulator, and a second conductive layer provided on the other side surface of the insulator, and the surfaces of the first conductive layer and the second conductive layer are both A protrusion is provided, and a connecting hole connecting the first conductive layer and the second conductive layer is also provided on the insulator, and the conductive medium is attached to the hole wall of the connecting hole to form a conductive hole.
  • FIG. 5 shows a connector of another structure. The difference between FIG. 5 and FIG. 4 is that: FIG. 5 is a case where the conductive medium fills the connection hole.
  • Fig. 6 shows a connector of another structure. The difference from Fig. 5 is the shape of the connection hole. Fig. 5 shows the size of the upper part and the smaller one, and Fig. 6 shows more uniformity from top to bottom.
  • Fig. 7 shows a connector of yet another structure, which differs from Fig. 6 in that: 1) the shape of the protrusion, which is achieved by controlling the magnitude of the current when the protrusion is formed by electroplating; 2 ) The conductive medium is not completely filled with connection holes, and there are gaps in the upper and lower openings.
  • Example 2
  • the connector provided by the embodiment of the present invention is different from the connector provided by the first embodiment in that the convex portion 14 is provided with an adhesive film layer 16, for each convex portion 14 , Which is hidden in the adhesive film layer 16 or penetrates the adhesive film layer 16 and is exposed, when the convex portion 14 is hidden in the adhesive film layer 16, the thickness of the adhesive film layer 16 is less than the average value of the height of the convex portion 14 itself .
  • the connection between the connector and the circuit board is more stable, and it is not easy to loosen and disengage;
  • the adhesive film layer 16 has fluidity, the protrusion 14 that has not penetrated the adhesive film layer 16 before, at this time, all or part of it penetrates the adhesive film layer 16 and has penetrated the adhesive film before
  • the protrusions 14 of the layer 16 are in contact with the circuit board together, so that a reliable electrical connection is formed between the first conductive layer 11 and / or the second conductive layer 12 and the circuit board, ensuring that the connector is still bonded Has good electrical conductivity.
  • the adhesive film layer 16 may be a non-conductive adhesive adhesive, such as a pressure-sensitive adhesive, a thermoplastic adhesive, or a thermosetting adhesive, or may be a conductive adhesive containing conductive particles.
  • a non-conductive adhesive adhesive such as a pressure-sensitive adhesive, a thermoplastic adhesive, or a thermosetting adhesive
  • a conductive adhesive containing conductive particles may be a non-conductive adhesive adhesive, such as a pressure-sensitive adhesive, a thermoplastic adhesive, or a thermosetting adhesive.
  • the following describes the manufacturing method of the connector by using a flexible copper-clad board as a substrate for making a connector as an example.
  • the copper foil of the flexible copper-clad board is used as the first conductive layer and the second conductive layer of the connector. You can replace the copper foil with other materials and use the following manufacturing methods to make connectors of different materials.
  • An embodiment of the present invention provides a method for manufacturing a connector, including the following steps:
  • Step 1 Manufacturing a flexible copper-clad plate, the flexible copper-clad plate includes an insulator and copper foil disposed on two opposite surfaces of the insulator;
  • Step 2 Use mechanical drilling, laser drilling or punching to form connecting holes on the flexible copper clad plate to connect the copper foils on both sides;
  • Step three a conductive medium 13 is formed in the connection hole to make the connection hole conductive, and at the same time, a protrusion 14 is formed on the surface of the copper foil on at least one side of the flexible copper clad laminate;
  • Step 4 Form an adhesive film layer 16 on the surface of the copper foil of the flexible copper clad laminate forming the protrusions 14.
  • step three forming the conductive medium 13 in the connection hole and forming the protrusion 14 on the surface of the copper foil on at least one side of the flexible copper clad laminate specifically include:
  • a thin layer of conductive medium 13 is deposited on the hole wall of the connection hole through chemical reaction, and then one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. are used to increase the conductivity on the hole wall
  • the thickness of the medium 13 and the formation of the conductive hole 15, and at the same time, the convex portion 14 is formed on the surface of the copper foil on at least one side of the flexible copper clad laminate;
  • connection holes are filled, and at the same time, the protrusions 14 are formed on the surface of the copper foil on at least one side of the flexible copper clad laminate.
  • thin conductive medium refers to the process of forming the conductive medium 13 is the process of metallizing the hole in the prior art relative to the subsequent setting of the conductive medium.
  • the thickness of the thin conductive medium 13 formed first can be referred to The existing technology will not be repeated here.
  • forming the adhesive film layer 16 on the surface of the copper foil of the flexible copper clad laminate forming the protrusion 14 specifically includes:
  • the adhesive film layer 16 is directly coated on the surface of the copper foil of the flexible copper clad laminate forming the protrusions 14.
  • An embodiment of the present invention provides a method for manufacturing a connector, including the following steps:
  • Step 1 Manufacture a flexible copper clad laminate, which includes an insulator and copper foils provided on two opposite surfaces of the insulator;
  • Step 2 Use mechanical drilling, laser drilling or punching to form connecting holes on the flexible copper clad plate to connect the copper foils on both sides;
  • Step 3 forming a conductive medium 13 in the connection hole to make the connection hole conductive;
  • Step four one or more of electroplating, electroless plating, physical vapor deposition, chemical vapor deposition, etc. are used to form a protrusion 14 on the surface of the copper foil on at least one side of the flexible copper clad laminate;
  • Step 5 Form an adhesive film layer 16 on the surface of the copper foil of the flexible copper clad laminate forming the protrusions 14, wherein the specific methods of Step 1, Step 2, and Step 5 are consistent with the descriptions in the steps corresponding to Example 3, here No longer.
  • step three provided by the embodiment of the present invention forming the conductive medium 13 in the connection hole specifically includes:
  • a thin layer of conductive medium 13 is deposited on the hole wall of the connection hole through chemical reaction, and then one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. are used to increase the conductivity on the hole wall
  • electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. are used to increase the conductivity on the hole wall
  • connection hole first deposit a thin layer of conductive medium 13 on the wall of the connection hole through chemical reaction, and then use one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. to make the conductive medium 13 Fill the connection hole.
  • step 4 one or more of electroplating, electroless plating, physical vapor deposition, chemical vapor deposition, etc. are used to form the protrusions 14 on the surface of the copper foil on at least one side of the flexible copper clad laminate.
  • the height of the raised portion 14 can be controlled by controlling the size of the current density.
  • the height of the protrusion can be adjusted by controlling the operating conditions.
  • An embodiment of the present invention provides a method for manufacturing a connector, including the following steps:
  • Step 1 Manufacture a flexible copper clad laminate, which includes an insulator and copper foils provided on two opposite surfaces of the insulator;
  • Step 2 Use one or more of electroplating, electroless plating, physical vapor deposition, chemical vapor deposition, etc. to form the protrusion 14 on the surface of the copper foil on at least one side of the flexible copper clad laminate;
  • Step 3 Use mechanical drilling, laser drilling or punching to form connecting holes on the flexible copper clad plate to connect the copper foils on both sides;
  • Step four forming a conductive medium 13 in the connection hole to make the connection hole conductive
  • Step 5 The adhesive film layer 16 is formed on the surface of the copper foil of the flexible copper clad laminate forming the protrusion 14, the specific method is the same as that described in Embodiment 3, and will not be repeated here.
  • step four provided by the embodiment of the present invention forming the conductive medium 13 in the connection hole specifically includes:
  • a thin layer of conductive medium 13 is deposited on the hole wall of the connection hole through chemical reaction, and then one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. are used to increase the conductivity on the hole wall
  • electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. are used to increase the conductivity on the hole wall
  • connection hole first deposit a thin layer of conductive medium 13 on the wall of the connection hole through chemical reaction, and then use one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. to make the conductive medium 13 Fill the connection hole.
  • the copper foils on both sides of the flexible copper clad laminates in the third, fourth, and fifth embodiments are the first conductive layer 11 and the second conductive layer 12 in the first embodiment.
  • the present invention provides a connector including an insulator 10, a first conductive layer 11 provided on one surface of the insulator 10, and a second conductive layer 12 provided on the other surface of the insulator 10.
  • the insulator 10 is further provided with There is a conductive medium 13 connecting the first conductive layer 11 and the second conductive layer 12, and the surface of the first conductive layer 11 or / and the second conductive layer 12 is provided with a protrusion 14.
  • the connector has the advantages of repeated disassembly and assembly, and good electrical conductivity.
  • the present invention also provides the manufacturing method of the above connector, which has the advantages of simple operation and easy implementation.
  • first, second, etc. are used in the present invention to describe various information, but the information should not be limited to these terms, and these terms are only used to distinguish the same type of information from each other.
  • first information may also be referred to as “second” information
  • second information may also be referred to as “first” information.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

一种连接器及该连接器的制作方法，该连接器包括绝缘体（10）、设于绝缘体（10）一侧表面的第一导电层（11）、设于绝缘体（10）另一侧表面的第二导电层（12），绝缘体（10）上还设有连接第一导电层（11）与第二导电层（12）的导电介质（13），第一导电层（11）或/和第二导电层（12）的表面设有凸起部（14）。跟现有技术相比，该连接器具有可反复拆装，导电性能好，操作简单，易于实现等优点。

Description

一种连接器及制作方法 技术领域
本发明涉及电连接器技术领域，尤其涉及一种连接器及制作方法。
背景技术
导电胶是一种固化或干燥后具有一定导电性的胶粘剂。它可以将多种导电材料连接在一起，使被连接材料间形成电的通路。在电子行业中,导电胶已成为了一种必不可少的新材料。但是，导电胶仍然存在以下几个问题：
一、若为保证电连接，设置导电胶中的粒子太多、胶少，则粘接性能不能保证，容易脱落；若为保证粘接性能，设置的粒子太少、胶多，则电阻较大，电气连接性能不好。
二、电连接性能不稳定，因受到应力、气候等因素的影响，导电胶的基体体积或形状容易发生渐变或突变，使得其内部的导电粒子的堆砌状态易发生变化，从而使得导电胶与线路板的接地层的导通效果不理想，进而不能较好地将聚集于线路板上的静电荷导出，从而使得静电荷在线路板上聚集形成干扰源，影响信号的传输。
发明内容
为解决上述技术问题，即导电胶的电连接性能不稳定的技术问题，本发明提供一种连接器及制作方法，该连接器用于线路板的安装连接，具有可反复拆装，导电性能好等优点，并且，其制作方法简单，易于实现。
基于此，本发明提供了一种连接器，包括绝缘体、设于所述绝缘体一侧表面的第一导电层、设于所述绝缘体另一侧表面的第二导电层，所述绝缘体上还设有连接所述第一导电层与所述第二导电层的导电介质，所述第一导电层或/和所述第二导电层的表面设有凸起部。
作为优选方案，所述凸起部为规则或不规则的立体几何状。
作为优选方案，所述凸起部的形状为尖角状、倒锥状、颗粒状、树枝状、柱状或块状。
作为优选方案，所述凸起部的自身高度为1至30μm。
作为优选方案，所述第一导电层或/和所述第二导电层的表面设有两个或两个以上的所述凸起部，各所述凸起部的形状相同或不同，各所述凸起部的尺寸相同或不同，且两个或两个以上的所述凸起部在所述第一导电层或/和所述第二导电层的表面连续或不连续地分布。
作为优选方案，所述第一导电层或/和所述第二导电层的表面为粗糙面。
作为优选方案，所述第一导电层或/和所述第二导电层的表面为平整面。
作为优选方案，所述凸起部的材质为铜、镍、锡、铅、铬、钼、锌、金、银中的一种或多种的组合。
作为优选方案，所述凸起部上设有胶膜层，所述凸起部隐藏于所述胶膜层内或穿透所述胶膜层并暴露出来。
作为优选方案，所述绝缘体上设有连接所述第一导电层与所述第二导电层的连接孔，所述导电介质设于所述连接孔内。
作为优选方案，所述导电介质填充满所述连接孔，或所述导电介质附着于所述连接孔的孔壁上并形成导电孔。
作为优选方案，所述绝缘体上设有两个或两个以上的所述连接孔。
作为优选方案，所述绝缘体的材质为聚酰亚胺、热塑性聚酰亚胺、改性环氧树脂、改性丙烯酸树脂、聚对苯二甲酸乙二醇酯、聚对苯二甲酸丁二醇酯、聚乙烯、聚萘二甲酸乙二醇酯、聚苯烯、聚氯乙烯、聚砜、聚苯硫醚、聚醚醚酮、聚苯醚、聚四氟乙烯、液晶聚合物、聚乙二酰脲中的一种或多种的组合。
作为优选方案，所述第一导电层和所述第二导电层设置在所述绝缘体的相对的两个所述侧面上，所述凸起部为镀覆凸起部。
作为优选方案，所述凸起部隐藏于所述胶膜层内，所述胶膜层的厚度小于所述凸起部的自身高度的平均值。
本发明还提供了一种连接器的制作方法，包括以下步骤：
制作挠性覆铜板，挠性覆铜板包括绝缘体和设置在绝缘体相对两个表面的铜箔；
在挠性覆铜板上形成连接孔；
在连接孔内形成导电介质，使连接孔具有导电性，与此同时，在挠性覆铜板至少一侧的铜箔的表面形成凸起部。
进一步地，在上述连接器的制作方法当中，采用机械钻孔、激光钻孔或冲压的方式，在所述挠性覆铜板上形成连接两侧铜箔的所述连接孔。
进一步地，在上述连接器的制作方法当中，在所述连接孔内形成导电介质以及在所述挠性覆铜板至少一侧的铜箔的表面形成所述凸起部具体包括：
先通过化学反应，在所述连接孔的孔壁上沉积一层薄的导电介质，再采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，增加孔壁上导电介质的厚度并形成导电孔，与此同时，在所述挠性覆铜板至少一侧的铜箔的表面形成所述凸起部。
或者先通过化学反应，在所述连接孔的孔壁上沉积一层薄的导电介质，再采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，使导电介质填充满所述连接孔，与此同时，在所述挠性覆铜板至少一侧的铜箔的表面形成所述凸起部。
进一步地，在上述连接器的制作方法当中，在所述挠性覆铜板至少一侧的铜箔的表面形成所述凸起部之后，还包括步骤：在设置有所述凸起部的所述挠性覆铜板的铜箔表面形成胶膜层，具体包括：
在离型膜上涂布所述胶膜层，然后通过离型膜将所述胶膜层压合转移至设置有所述凸起部的所述挠性覆铜板的铜箔表面；
或者直接在设置有所述凸起部的所述挠性覆铜板的铜箔表面涂布所述胶膜层。
本发明还提供了第二种连接器的制作方法，包括以下步骤：
制作挠性覆铜板，挠性覆铜板包括绝缘体和设置在绝缘体相对两个表面的铜箔；
在挠性覆铜板上形成连接孔；
在连接孔内形成导电介质，使连接孔具有导电性；
在挠性覆铜板至少一侧的铜箔的表面形成凸起部。
进一步地，在上述连接器的制作方法当中，采用机械钻孔、激光钻孔或冲压的方式，在所述挠性覆铜板上形成连接两侧铜箔的所述连接孔。
进一步地，在上述连接器的制作方法当中，在所述连接孔内形成导电介质具体包括：
先通过化学反应，在所述连接孔的孔壁上沉积一层薄的导电介质，再采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，增加孔壁上导电介质的厚度并形成导电孔；
或者先通过化学反应，在所述连接孔的孔壁上沉积一层薄的导电介质，再采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，使导电介质填充满所述连接孔。
进一步地，在上述连接器的制作方法当中，采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，在所述挠性覆铜板至少一侧的铜箔的表面形成所述凸起部。
进一步地，在上述连接器的制作方法当中，在所述挠性覆铜板至少一侧的铜箔的表面形成所述凸起部之后，还包括步骤：在设置有所述凸起部的所述挠性覆铜板的铜箔表面形成胶膜层，具体包括：
在离型膜上涂布所述胶膜层，然后通过离型膜将所述胶膜层压合转移至设置有所述凸起部的所述挠性覆铜板的铜箔表面；
或者直接在设置有所述凸起部的所述挠性覆铜板的铜箔表面涂布所述胶膜层。
本发明还提供了第三种连接器的制作方法，包括以下步骤：
制作挠性覆铜板，挠性覆铜板包括绝缘体和设置在绝缘体相对两个表面的铜箔；
在挠性覆铜板至少一侧的铜箔的表面形成凸起部；
在挠性覆铜板上形成连接孔；
在连接孔内形成导电介质，使连接孔具有导电性。
进一步地，在上述连接器的制作方法当中，采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，在所述挠性覆铜板至少一侧的铜箔的表面形成所述凸起部。
进一步地，在上述连接器的制作方法当中，采用机械钻孔、激光钻孔或冲压的方式，在所述挠性覆铜板上形成连接两侧铜箔的所述连接孔。
进一步地，在上述连接器的制作方法当中，在所述连接孔内形成导电介质具体包括：
先通过化学反应，在所述连接孔的孔壁上沉积一层薄的导电介质，再采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，增加孔壁上导电介质的厚度并形成导电孔；
或者先通过化学反应，在所述连接孔的孔壁上沉积一层薄的导电介质，再采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，使导电介质填充满所述连接孔。
进一步地，在上述连接器的制作方法当中，在所述连接孔内形成导电介质之后，还包括步骤：在设置有所述凸起部的所述挠性覆铜板的铜箔表面形成胶膜层，具体包括：
在离型膜上涂布所述胶膜层，然后通过离型膜将所述胶膜层压合转移至设置有所述凸起部的所述挠性覆铜板的铜箔表面；
或者直接在设置有所述凸起部的所述挠性覆铜板的铜箔表面涂布所述胶膜层。
实施本发明实施例，具有如下有益效果：
本发明实施例提供的连接器包括绝缘体、设于绝缘体一侧表面的第一导电层、设于绝缘体另一侧表面的第二导电层，绝缘体上还设有连接第一导电层与第二导电层的导电介质，第一导电层或/和第二导电层的表面设有凸起部。基于上述结构，一方面，本发明实施例提供的连接器可通过夹紧于两块线路板之间或线路板与接地金属板之间，并使导电层与线路板或接地金属板相贴合，以此来实现电路导通，从而，跟传统的焊接和粘接相比，该连接器不仅可实现线路板的反复拆装，便于线路板的维修，降低电子产品的制造成本，还能够在实现有效电连接的同时，保证线路板的安装可靠性。另一方面，当本发明实施例提供的连接器夹紧于线路板与接地金属板之间时，凸起部能够保证导电层与线路板的接地层和接地金属板形成有效的电连接，从而，该连接器能够将聚集于线路板上的静电荷有效地导出，避免静电荷在线路板上聚集形成干扰源而影响信号的传输。
本发明还提供了上述连接器的制作方法，具有操作简单，易于实现等优点。
附图说明
构成本申请的一部分的说明书附图用来提供对本发明的进一步理解，本发明的示意性实施例及其说明用于解释本发明，并不构成对本发明的不当限定。在附图中：
图1是本发明实施例一的连接器的横截面结构示意图；
图2是图1中I区域的放大视图；
图3是本发明实施例一的第一导电层表面为平整面时的局部视图；
图4是本发明实施例一的连接器的局部在金相显微镜下放大400倍时的切片图(一)；
图5是本发明实施例一的连接器的局部在金相显微镜下放大400倍时的切片图(二)；
图6是本发明实施例一的连接器的局部在金相显微镜下放大400倍时的切片图(三)；
图7是本发明实施例一的连接器的局部在金相显微镜下放大400倍时的切片图(四)；
图8是本发明实施例一的连接器的局部在金相显微镜下放大400倍时的切片图(五)；
图9是本发明实施例一的连接孔被导电介质填充满时的横截面结构示意图；
图10是本发明实施例二的连接器的横截面结构示意图。
附图标记说明：
10、绝缘体，11、第一导电层，12、第二导电层，13、导电介质，14、凸起部，15、导电孔，16、胶膜层。
具体实施方式
需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
实施例一
如图1所示，本发明实施例提供一种连接器，主要包括绝缘体10、设于绝缘体10一侧表面的第一导电层11、设于绝缘体10另一侧表面的第二导电层12，绝缘体10上还设有连接第一导电层11与第二导电层12的导电介质13，第一导电层11和第二导电层12的表面设有凸 起部14。上述第一导电层11和所述第二导电层12设置在绝缘体10的相对的两个侧面上，凸起部14为镀覆凸起部
基于上述结构，一方面，本发明实施例提供的连接器可通过夹紧于两块线路板之间或线路板与接地金属板之间，并使第一导电层11和第二导电层12分别与线路板或接地金属板相贴合，以此来实现两块线路板之间或线路板与接地金属板之间的电路导通，从而，跟传统的焊接和粘接相比，该连接器不仅可实现线路板的反复拆装，便于线路板的维修，降低电子产品的制造成本，还能够在实现有效电连接的同时，保证线路板的安装可靠性。另一方面，当本发明实施例提供的连接器夹紧于线路板与接地金属板之间时，凸起部14为镀覆凸起部相对于现有技术的导电胶其硬度更大，因此能够保证第一导电层11和第二导电层12分别与线路板的接地层和接地金属板形成有效的电连接，从而，该连接器能够将聚集于线路板上的静电荷有效地导出，避免静电荷在线路板上聚集形成干扰源而影响信号的传输。
具体地，如图1至图8所示，凸起部14为规则或不规则的立体几何状，例如尖角状、倒锥状、颗粒状、树枝状、柱状、块状等，并且，无论是何种形状，凸起部14的自身高度h为1至30μm，其中，2.5至15μm为最优选的范围。在此基础上，第一导电层11和第二导电层12的表面设有两个或两个以上的凸起部14，每个凸起部14的形状可以相同或不同，每个凸起部14的尺寸也可以相同或不同，也就是说，两个或两个以上的凸起部14的形状可以为尖角状、倒锥状、颗粒状、树枝状、柱状、块状中的一种或多种，并且，同样形状的两个或两个以上的凸起部14的尺寸可不尽相同，上述尺寸包括上述的自身高度以及与上述绝缘体10的侧面平行方向的凸起部14的长度。另外，两个或两个以上的凸起部14在第一导电层11和第二导电层12的表面连续或不连续地分布，例如，当两个或两个以上的凸起部14的形状为尖角状且连续分布时，可形成规则的、周期性的齿纹状立体图案，抑或是不规则的、无序的齿纹状立体图案，当然，这里只是列举了其中一种情况，上述中的其他形状的组合也均在本申请的保护范围内，在此就不一一列举。
可选地，如图2至图3所示，第一导电层11和第二导电层12的表面可以是平整面，也可以是粗糙面。需要说明的是，这里所说的平整面和粗糙面是指凸起部14所在的第一导电层11和第二导电层12的表面，也就是凸起部14所在的基准面，而不是两个或两个以上的凸起部14组成的平面。当第一导电层11和第二导电层12的表面是粗糙面时，其包括凹部和凸部，凸起部14既可以分布于凹部，也可以分布于凸部，并且，任一凸部的高度H与位于该凸部上凸起部14的自身高度h之和也可以为1至30μm。当然，也可是设在凸部上的凸起部14的自身高度h即为1至30μm，那么，此时凸部的高度H与位于该凸部上的凸起部14的自身高度h之和大于1至30μm，从而可进一步增强该连接器的电气连接性能。
可选地，凸起部14的材质为铜、镍、铅、铬、钼、锌、锡、金、银中的一种或多种的组合。具体而言，凸起部14可以是单一成分，即铜、镍、锡、铅、铬、钼、锌、金、银中的一种，也可以是以铜、镍、锡、铅、铬、钼、锌、金、银中的一种材质为主体，然后采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，将除主体以外的金属中的一种或多种形成于主体的表面，由此形成复合材质的凸起部14。在本实施例中，凸起部14优选 以铜为主体，镍、锡、铅、铬、钼、锌、金、银中的一种或多种金属形成于铜表面的复合材质，这是由于仅由铜构成的凸起部14容易被氧化或磨损，而形成于铜表面的镍、锡、金、银可提高凸起部14的耐腐蚀性和耐磨性，进而可提高连接器的导电性能，延长连接器的使用寿命。
如图1所示，绝缘体10上设有连接第一导电层11与第二导电层12的连接孔，导电介质13附着于连接孔的孔壁上并形成导电孔15，导电孔15可以为通孔，也可以为埋孔或盲孔。当然，如图9所示，在导电介质13的形成过程当中，操作人员也可以选择将整个连接孔填充满导电介质13，即不形成导电孔15。另外，第一导电层11与第二导电层12之间可设置两个或两个以上的连接孔，并且，每个连接孔内均设有导电介质13，以进一步提高该连接器的导电性能。
可选地，绝缘体10的材质为聚酰亚胺、热塑性聚酰亚胺、改性环氧树脂、改性丙烯酸树脂、聚对苯二甲酸乙二醇酯、聚对苯二甲酸丁二醇酯、聚乙烯、聚萘二甲酸乙二醇酯、聚苯烯、聚氯乙烯、聚砜、聚苯硫醚、聚醚醚酮、聚苯醚、聚四氟乙烯、液晶聚合物、聚乙二酰脲中的一种或多种的组合。具体而言，绝缘体10可以是单一成分，即上述各种绝缘材质中的一种，也可以是由上述任意多种绝缘材质复合而成。基于此，绝缘体10具有一定的形变量，当连接器与线路板压合连接时，首先与线路板相接触的凸起部14会向后压缩，从而使得相对低一些的凸起部14也能够与线路板相接触，以保证第一导电层11和第二导电层12与线路板之间形成可靠的电连接。
需要说明的是，根据实际应用情况的不同，本发明实施例提供的连接器也可以仅第一导电层11或第二导电层12的表面设有凸起部14，但在使用过程中，出于改善电导通的效果本领域技术人员必然是将设有凸起部14的第一导电层11或第二导电层12与线路板相贴合，以有效保证静电荷的导出。另外，本发明实施例中的导电介质13优选铜，当然也可以选用其他具有良好导电性能的材料，例如锡、银、金、石墨、铜浆、银浆、锡膏、碳纳米管等。
图4示出的连接器结构包括了绝缘体、设于绝缘体一侧表面的第一导电层、设于绝缘体另一侧表面的第二导电层，且第一导电层和第二导电层的表面均设有凸起部，同时绝缘体上还设有连接第一导电层与第二导电层的连接孔，且导电介质附着于连接孔的孔壁上形成导电孔。
图5示出了另一种结构的连接器，图5与图4的区别在于：图5是导电介质填充满连接孔的情况。
图6示出了另一种结构的连接器，与图5的不同就是连接孔的形状，图5是上大下小，图6是从上到下都比较均匀。
图7示出了又一种结构的连接器，与图6的不同之处在于：1)凸起部的形状，这是由电镀形成凸起部时，可通过控制电流的大小而实现；2)导电介质未完全填充满连接孔，上下孔口均有缺口。实施例二
如图10所示，本发明实施例提供的连接器与实施例一提供的连接器相比，其区别在于，凸起部14上设有胶膜层16，对于每个凸起部14而言，其隐藏于胶膜层16内或穿透胶膜层16并暴露出来，当凸起部14隐藏于胶膜层16内，胶膜层16的厚度小于凸起部14的自身高度的平均值。基于此，当该连接器与线路板压合粘接时，得益于胶膜层16的粘接能力，连接器与线路板之间的连接更加稳固，不易松动和脱开；而在压合粘接过程当中，由于胶膜层16具有流动性，因此，之前未穿透胶膜层16的凸起部14，此时全都或部分穿透胶膜层16并且和之前就已经穿透胶膜层16的凸起部14一起与线路板相接触，从而使得第一导电层11或/和第二导电层12与线路板之间形成可靠的电连接，保证了该连接器在粘接时依然具有良好的导电性能。
优选地，在本发明实施例中，胶膜层16可为不导电的黏性胶，例如压敏胶、热塑性胶或热固性胶等，也可以是含有导电粒子的导电胶。除上述区别外，本发明实施例的其它具体结构与实施例一中的一致，相应的原理和技术效果也一致，此处不再赘述。
以下以挠性覆铜板为制作连接器的基体为例对上述连接器的制作方法进行说明，其中挠性覆铜板的铜箔作为连接器的第一导电层和第二导电层，本领域技术人员可以对铜箔替换为其它材料采用以下各制作方法制作不同材质的连接器。
实施例三
本发明实施例提供一种连接器的制作方法，包括以下步骤：
步骤一，制作挠性覆铜板，该挠性覆铜板包括绝缘体和设置在绝缘体相对两个表面的铜箔；
步骤二，采用机械钻孔、激光钻孔或冲压的方式，在挠性覆铜板上形成连接两侧铜箔的连接孔；
步骤三，在连接孔内形成导电介质13，使连接孔具有导电性，与此同时，在挠性覆铜板至少一侧的铜箔的表面形成凸起部14；
步骤四，在形成凸起部14的挠性覆铜板的铜箔表面形成胶膜层16。
在本发明实施例提供的步骤三当中，在连接孔内形成导电介质13以及在挠性覆铜板至少一侧的铜箔的表面形成凸起部14具体包括：
先通过化学反应，在连接孔的孔壁上沉积一层薄的导电介质13，再采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，增加孔壁上导电介质13的厚度并形成导电孔15，与此同时，在挠性覆铜板至少一侧的铜箔的表面形成凸起部14；
或者先通过化学反应，在连接孔的孔壁上沉积一层薄的导电介质13，再采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，使导电介质13填充满连接孔，与此同时，在挠性覆铜板至少一侧的铜箔的表面形成凸起部14。上述“薄的导电介质”是相对 于后续继续设置导电介质而言，上述形成导电介质13的过程即为现有技术中孔金属化的过程，其中先形成的薄的导电介质13的厚度可以参考现有技术，在此不再赘述。
在本发明实施例提供的步骤四当中，在形成凸起部14的挠性覆铜板的铜箔表面形成胶膜层16具体包括：
在离型膜上涂布胶膜层16，然后通过离型膜将胶膜层16压合转移至形成凸起部14的挠性覆铜板的铜箔表面；
或者直接在形成凸起部14的挠性覆铜板的铜箔表面涂布胶膜层16。
实施例四
本发明实施例提供一种连接器的制作方法，包括以下步骤：
步骤一，制作挠性覆铜板，挠性覆铜板包括绝缘体和设置在绝缘体相对两个表面的铜箔；
步骤二，采用机械钻孔、激光钻孔或冲压的方式，在挠性覆铜板上形成连接两侧铜箔的连接孔；
步骤三，在连接孔内形成导电介质13，使连接孔具有导电性；
步骤四，采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，在挠性覆铜板至少一侧的铜箔的表面形成凸起部14；
步骤五，在形成凸起部14的挠性覆铜板的铜箔表面形成胶膜层16，其中步骤一、步骤二、步骤五的具体方法与实施例三对应的步骤中的描述一致，此处不再赘述。
在本发明实施例提供的步骤三当中，在连接孔内形成导电介质13具体包括：
先通过化学反应，在连接孔的孔壁上沉积一层薄的导电介质13，再采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，增加孔壁上导电介质13的厚度并形成导电孔15；
或者先通过化学反应，在连接孔的孔壁上沉积一层薄的导电介质13，再采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，使导电介质13填充满连接孔。
且步骤四中，采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，在挠性覆铜板至少一侧的铜箔的表面形成凸起部14时，其中采用电镀时可以通过控制电流密度的大小控制所形成的凸起部14的自身高度，一般来讲，在其它条件相同时电流密度越大粗糙度越大即凸起部的自身高度越大，电流密度越小粗糙度越小即凸起部的自身高度越小。同理可以推断在连接孔内设置导电介质时，其电流密度可以相对较小，进而形成较为密实的导电介质13，提高导电的可靠性。采用其他方式时也可以通过操作条件的控制来调整凸起部的自身高度。
实施例五
本发明实施例提供一种连接器的制作方法，包括以下步骤：
步骤一，制作挠性覆铜板，挠性覆铜板包括绝缘体和设置在绝缘体相对两个表面的铜箔；
步骤二，采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，在挠性覆铜板至少一侧的铜箔的表面形成凸起部14；
步骤三，采用机械钻孔、激光钻孔或冲压的方式，在挠性覆铜板上形成连接两侧铜箔的连接孔；
步骤四，在连接孔内形成导电介质13，使连接孔具有导电性；
步骤五，在形成凸起部14的挠性覆铜板的铜箔表面形成胶膜层16，具体方法与实施例三中的描述一致，此处不再赘述。
在本发明实施例提供的步骤四当中，在连接孔内形成导电介质13具体包括：
先通过化学反应，在连接孔的孔壁上沉积一层薄的导电介质13，再采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，增加孔壁上导电介质13的厚度并形成导电孔15；
或者先通过化学反应，在连接孔的孔壁上沉积一层薄的导电介质13，再采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，使导电介质13填充满连接孔。
需要指出的是，上述实施例三、四、五中挠性覆铜板两侧的铜箔即为实施例一中的第一导电层11和第二导电层12。
综上，本发明提供了一种连接器，包括绝缘体10、设于绝缘体10一侧表面的第一导电层11、设于绝缘体10另一侧表面的第二导电层12，绝缘体10上还设有连接第一导电层11与第二导电层12的导电介质13，第一导电层11或/和第二导电层12的表面设有凸起部14。跟现有技术相比，该连接器具有可反复拆装，导电性能好等优点。
另外，本发明还提供了上述连接器的制作方法，具有操作简单，易于实现等优点。
应当理解的是，本发明中采用术语“第一”、“第二”等来描述各种信息，但这些信息不应限于这些术语，这些术语仅用来将同一类型的信息彼此区分开。例如，在不脱离本发明范围的情况下，“第一”信息也可以被称为“第二”信息，类似的，“第二”信息也可以被称为“第一”信息。
以上所述是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和变形，这些改进和变形也视为本发明的保护范围。

Claims (29)

  1. 一种连接器，其特征在于，包括绝缘体、设于所述绝缘体一侧表面的第一导电层、设于所述绝缘体另一侧表面的第二导电层，所述绝缘体上还设有连接所述第一导电层与所述第二导电层的导电介质，所述第一导电层或/和所述第二导电层的表面设有凸起部。
  2. 根据权利要求1所述的连接器，其特征在于，所述凸起部为规则或不规则的立体几何状。
  3. 根据权利要求2所述的连接器，其特征在于，所述凸起部的形状为尖角状、倒锥状、颗粒状、树枝状、柱状或块状。
  4. 根据权利要求1所述的连接器，其特征在于，所述凸起部的自身高度为1至30μm。
  5. 根据权利要求1所述的连接器，其特征在于，所述第一导电层或/和所述第二导电层的表面设有两个或两个以上的所述凸起部，各所述凸起部的形状相同或不同，各所述凸起部的尺寸相同或不同，且两个或两个以上的所述凸起部在所述第一导电层或/和所述第二导电层的表面连续或不连续地分布。
  6. 根据权利要求1所述的连接器，其特征在于，所述第一导电层或/和所述第二导电层的表面为粗糙面。
  7. 根据权利要求1所述的连接器，其特征在于，所述第一导电层或/和所述第二导电层的表面为平整面。
  8. 根据权利要求1所述的连接器，其特征在于，所述凸起部的材质为铜、镍、锡、铅、铬、钼、锌、金、银中的一种或多种的组合。
  9. 根据权利要求1所述的连接器，其特征在于，所述凸起部上设有胶膜层，所述凸起部隐藏于所述胶膜层内或穿透所述胶膜层并暴露出来。
  10. 根据权利要求1所述的连接器，其特征在于，所述绝缘体上设有连接所述第一导电层与所述第二导电层的连接孔，所述导电介质设于所述连接孔内。
  11. 根据权利要求10所述的连接器，其特征在于，所述导电介质填充满所述连接孔，或所述导电介质附着于所述连接孔的孔壁上并形成导电孔。
  12. 根据权利要求10所述的连接器，其特征在于，所述绝缘体上设有两个或两个以上的所述连接孔。
  13. 根据权利要求1所述的连接器，其特征在于，所述绝缘体的材质为聚酰亚胺、热塑性聚酰亚胺、改性环氧树脂、改性丙烯酸树脂、聚对苯二甲酸乙二醇酯、聚对苯二甲酸丁二醇酯、聚乙烯、聚萘二甲酸乙二醇酯、聚苯烯、聚氯乙烯、聚砜、聚苯硫醚、聚醚醚酮、聚苯醚、聚四氟乙烯、液晶聚合物、聚乙二酰脲中的一种或多种的组合。
  14. 根据权利要求1至13中任一项所述的连接器，其特征在于，所述第一导电层和所述第二导电层设置在所述绝缘体的相对的两个所述侧面上，所述凸起部为镀覆凸起部。
  15. 根据权利要求9所述的连接器，其特征在于，所述凸起部隐藏于所述胶膜层内，所述胶膜层的厚度小于所述凸起部的自身高度的平均值。
  16. 一种连接器的制作方法，其特征在于，包括以下步骤：
    制作挠性覆铜板，所述挠性覆铜板包括绝缘体和设置在所述绝缘体相对两个表面的铜箔；
    在所述挠性覆铜板上形成连接孔；
    在所述连接孔内形成导电介质，使所述连接孔具有导电性，与此同时，在所述挠性覆铜板至少一侧的所述铜箔的表面形成凸起部。
  17. 根据权利要求16所述的制作方法，其特征在于，采用机械钻孔、激光钻孔或冲压的方式，在所述挠性覆铜板上形成连接两侧铜箔的所述连接孔。
  18. 根据权利要求16所述的制作方法，其特征在于，在所述连接孔内形成导电介质以及在所述挠性覆铜板至少一侧的所述铜箔的表面形成所述凸起部具体包括：
    先通过化学反应，在所述连接孔的孔壁上沉积一层薄的所述导电介质，再采用电镀、化学镀、物理气相沉积、化学气相沉积方式中的一种或多种，增加所述孔壁上所述导电介质的厚度并形成导电孔，与此同时，在所述挠性覆铜板至少一侧的铜箔的表面形成所述凸起部；
    或者先通过化学反应，在所述连接孔的孔壁上沉积一层薄的所述导电介质，再采用电镀、化学镀、物理气相沉积、化学气相沉积方式中的一种或多种，使所述导电介质填充满所述连接孔，与此同时，在所述挠性覆铜板至少一侧的铜箔的表面形成所述凸起部。
  19. 根据权利要求16所述的制作方法，其特征在于，在所述挠性覆铜板至少一侧的铜箔的表面形成所述凸起部之后，还包括步骤：在设置有所述凸起部的所述挠性覆铜板的铜箔表面形成胶膜层，具体包括：
    在离型膜上涂布所述胶膜层，然后通过所述离型膜将所述胶膜层压合转移至设置有所述凸起部的所述铜箔表面；
    或者直接在设置有所述凸起部的所述铜箔表面涂布所述胶膜层。
  20. 一种连接器的制作方法，其特征在于，包括以下步骤：
    制作挠性覆铜板，所述挠性覆铜板包括绝缘体和设置在所述绝缘体相对两个表面的铜箔；
    在所述挠性覆铜板上形成连接孔；
    在所述连接孔内形成导电介质，使所述连接孔具有导电性；
    在所述挠性覆铜板至少一侧的所述铜箔的表面形成凸起部。
  21. 根据权利要求20所述的制作方法，其特征在于，采用机械钻孔、激光钻孔或冲压的方式，在所述挠性覆铜板上形成连接两侧铜箔的所述连接孔。
  22. 根据权利要求20所述的制作方法，其特征在于，在所述连接孔内形成导电介质具体包括：
    先通过化学反应，在所述连接孔的孔壁上沉积一层薄的所述导电介质，再采用电镀、化学镀、物理气相沉积、化学气相沉积方式中的一种或多种，增加所述孔壁上所述导电介质的厚度并形成导电孔；
    或者先通过化学反应，在所述连接孔的孔壁上沉积一层薄的所述导电介质，再采用电镀、化学镀、物理气相沉积、化学气相沉积方式中的一种或多种，使所述导电介质填充满所述连接孔。
  23. 据权利要求20所述的制作方法，其特征在于，采用电镀、化学镀、物理气相沉积、化学气相沉积方式中的一种或多种，在所述挠性覆铜板至少一侧的铜箔的表面形成所述凸起部。
  24. 根据权利要求20所述的制作方法，其特征在于，在所述挠性覆铜板至少一侧的铜箔的表面形成所述凸起部之后，还包括步骤：在设置有所述凸起部的所述挠性覆铜板的铜箔表面形成胶膜层，具体包括：
    在离型膜上涂布所述胶膜层，然后通过所述离型膜将所述胶膜层压合转移至设置有所述凸起部的所述挠性覆铜板的铜箔表面；
    或者直接在设置有所述凸起部的所述挠性覆铜板的铜箔表面涂布所述胶膜层。
  25. 一种连接器的制作方法，其特征在于，包括以下步骤：
    制作挠性覆铜板，所述挠性覆铜板包括绝缘体和设置在所述绝缘体相对两个表面的铜箔；
    在挠性覆铜板至少一侧的铜箔的表面形成凸起部；
    在挠性覆铜板上形成连接孔；
    在连接孔内形成导电介质，使连接孔具有导电性。
  26. 根据权利要求25所述的制作方法，其特征在于，采用电镀、化学镀、物理气相沉积、化学气相沉积方式中的一种或多种，在所述挠性覆铜板至少一侧的铜箔的表面形成所述凸起部。
  27. 根据权利要求25所述的制作方法，其特征在于，采用机械钻孔、激光钻孔或冲压的方式，在所述挠性覆铜板上形成连接两侧铜箔的所述连接孔。
  28. 根据权利要求25所述的制作方法，其特征在于，在所述连接孔内形成导电介质具体包括：
    先通过化学反应，在所述连接孔的孔壁上沉积一层薄的所述导电介质，再采用电镀、 化学镀、物理气相沉积、化学气相沉积方式中的一种或多种，增加所述孔壁上所述导电介质的厚度并形成导电孔；
    或者先通过化学反应，在所述连接孔的孔壁上沉积一层薄的所述导电介质，再采用电镀、化学镀、物理气相沉积、化学气相沉积方式中的一种或多种，使所述导电介质填充满所述连接孔。
  29. 根据权利要求25所述的制作方法，其特征在于，在所述连接孔内形成导电介质之后，还包括步骤：在设置有所述凸起部的所述挠性覆铜板的铜箔表面形成胶膜层，具体包括：
    在离型膜上涂布所述胶膜层，然后通过所述离型膜将所述胶膜层压合转移至设置有所述凸起部的所述挠性覆铜板的铜箔表面；
    或者直接在设置有所述凸起部的所述挠性覆铜板的铜箔表面涂布所述胶膜层。
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