WO2020093729A1 - 一种柔性连接器及制作方法 - Google Patents

一种柔性连接器及制作方法 Download PDF

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Publication number
WO2020093729A1
WO2020093729A1 PCT/CN2019/095936 CN2019095936W WO2020093729A1 WO 2020093729 A1 WO2020093729 A1 WO 2020093729A1 CN 2019095936 W CN2019095936 W CN 2019095936W WO 2020093729 A1 WO2020093729 A1 WO 2020093729A1
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WO
WIPO (PCT)
Prior art keywords
flexible
conductive
electrical conductor
connection hole
electrical conductors
Prior art date
Application number
PCT/CN2019/095936
Other languages
English (en)
French (fr)
Inventor
苏陟
Original Assignee
广州方邦电子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 广州方邦电子股份有限公司 filed Critical 广州方邦电子股份有限公司
Priority to US17/285,177 priority Critical patent/US11848508B2/en
Priority to KR1020217017424A priority patent/KR102663524B1/ko
Priority to JP2021525198A priority patent/JP7387732B2/ja
Publication of WO2020093729A1 publication Critical patent/WO2020093729A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending

Definitions

  • the invention relates to the technical field of electrical connectors, in particular to a flexible connector and a manufacturing method.
  • soldering BGA
  • conductive adhesive connection a connection between electronic components such as chips and circuit boards.
  • welding has the advantage of reliable connection, it also has the disadvantage of not being able to be disassembled repeatedly. If there is an operation error in the welding process or poor conductivity after welding, the soldered electronic components can only consume more resources for rework Or directly scrapped, resulting in waste of materials and increased costs; although the conductive adhesive connection is easier to implement than welding, and easy to rework and repair, but due to some problems with the conductive adhesive itself, as well as weather, aging, stress and strain and other external Influenced by factors, the conductive performance of the conductive adhesive is not stable enough. Therefore, the electronic components connected by the conductive adhesive are prone to circuit interruption or signal distortion.
  • the connector is mainly composed of an insulator and electrical conductors provided on both sides of the insulator. There is a conductive medium connecting the conductors on both sides.
  • the connector is clamped between two circuit boards and fastened, and the conductor is bonded to the pad on the circuit board to achieve circuit conduction.
  • the conductor is usually provided with a copper-plated elastic arm, but the arrangement of the elastic arm also brings some new problems:
  • the difficulty of making the connector is increased, and multiple manufacturing processes are added, such as the welding of the elastic arm, copper plating, etc., and the manufacturing cost of the connector is also increased;
  • the second is that after the connector is disassembled many times, the elastic arm is prone to fatigue damage or even directly broken, which shortens the service life of the connector;
  • the copper plating on the surface of the elastic arm is easy to fall off with the deformation of the elastic arm, which affects the conductivity of the connector;
  • the bounce amplitude of each elastic arm on the connector cannot be unified, and it is easy for some elastic arms to contact the circuit board, and some elastic arms are not in contact with the circuit board, making it difficult to ensure the conductivity of the connector.
  • the present invention provides a flexible connector and a manufacturing method thereof. It has advantages such as good electrical conductivity, and its manufacturing method is simple and easy to realize.
  • the present invention provides a flexible connector including an insulator, one side surface of the insulator is provided with a plurality of first conductors, and the other side surface of the insulator is provided with a plurality of second conductors, the insulator A conductive medium connecting the first electrical conductor and the second electrical conductor is also provided on the surface, and a protrusion is provided on the surface of the first electrical conductor or / and the second electrical conductor.
  • the raised portion is in a regular or irregular solid geometric shape.
  • the shape of the protrusion is pointed, inverted cone, granular, dendritic, columnar or block-shaped.
  • the height of the protrusion is 1 to 30 ⁇ m.
  • two or more protrusions are provided on the surface of the first electrical conductor and / or the second electrical conductor, and the shapes of the protrusions are the same or different.
  • the sizes of the protrusions are the same or different, and two or more protrusions are continuously or discontinuously distributed on the surfaces of the first electrical conductor and / or the second electrical conductor.
  • the surface of the first electrical conductor or / and the second electrical conductor is a rough surface.
  • the surfaces of the first electrical conductor or / and the second electrical conductor are flat.
  • the material of the protrusion is one or a combination of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver.
  • At least one surface of the insulator or / and the raised portion is provided with a glue film layer, the raised portion is hidden in the glue film layer or penetrates the glue film layer and is exposed come out.
  • the insulator is provided with a connection hole connecting the first conductor and the second conductor, and the conductive medium is provided in the connection hole.
  • the conductive medium fills the connection hole, or the conductive medium is attached to the hole wall of the connection hole and forms a conductive hole.
  • the first electrical conductors are set to two or more, and each of the first electrical conductors is independent of each other, and the second electrical conductors are set to two or more, and each of the first The two electrical conductors are independent of each other.
  • the number of the second electrical conductors is equal to the number of the first electrical conductors, and each of the first electrical conductors passes through the conductive medium in the connection hole and the second electrical conductors one by one. Corresponding connection.
  • the number of the first electrical conductors is greater than the number of the second electrical conductors, and at least two of the first electrical conductors respectively pass through the conductive medium in different connection holes and the same one
  • the second electrical conductors are connected, and the remaining first electrical conductors are connected to the remaining second electrical conductors in a one-to-one correspondence with the conductive media in different connection holes.
  • the number of the first electrical conductors is less than the number of the second electrical conductors, and at least two of the second electrical conductors respectively pass through different conductive media in the connecting holes and the same one
  • the first electrical conductors are connected, and the remaining second electrical conductors are connected to the remaining first electrical conductors in a one-to-one correspondence with the conductive media in different connection holes.
  • At least two of the first electrical conductors are respectively connected to the same second electrical conductor through the conductive media in different connection holes, and at least two of the second electrical conductors are respectively different
  • the conductive medium in the connection hole is connected to the same first conductive body.
  • At least two of the first electrical conductors in a part of the first electrical conductors respectively pass through the conductive medium in different connection holes and a part of the same electrical conductors in the second electrical conductors
  • Two electrical conductors are connected, and at least two of the second electrical conductors in another part of the second electrical conductor pass through different conductive mediums in the connection holes and another part of the same one of the first electrical conductors
  • the first electrical conductors are connected, and the remaining first electrical conductors are connected to the remaining second electrical conductors in a one-to-one correspondence with the conductive media in different connection holes.
  • connection holes are provided between the first electrical conductor and the second electrical conductor connected thereto.
  • the material of the insulator is polyimide, thermoplastic polyimide, modified epoxy resin, modified acrylic resin, polyethylene terephthalate, polybutylene terephthalate Ester, polyethylene, polyethylene naphthalate, polystyrene, polyvinyl chloride, polysulfone, polyphenylene sulfide, polyether ether ketone, polyphenylene ether, polytetrafluoroethylene, liquid crystal polymer, polyethylene A combination of one or more diureides.
  • the insulator is a flexible insulator
  • the first conductor and the second conductor are provided on two opposite sides of the insulator
  • the protrusion is a plated protrusion
  • the convex portion is hidden in the adhesive film layer, and the thickness of the adhesive film layer is less than the average value of the height of the convex portion itself.
  • the invention also provides a method for manufacturing a flexible connector, including the following steps:
  • the flexible copper-clad laminate including an insulator and copper foils provided on opposite surfaces of the insulator;
  • a conductive medium is formed in the connection hole to make the connection hole conductive, and at the same time, a protrusion is formed on the surface of the copper foil on at least one side of the flexible copper clad laminate;
  • a first conductor and a second conductor are etched on both sides of the flexible copper clad laminate, respectively.
  • connection holes for connecting the copper foils on both sides of the flexible copper clad laminate.
  • forming a conductive medium in the connection hole and forming the protrusion on the surface of the copper foil on at least one side of the flexible copper clad laminate specifically include:
  • a thin layer of conductive medium is deposited on the hole wall of the connection hole through chemical reaction, and then one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. are used to increase the wall of the hole
  • electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. are used to increase the wall of the hole
  • the protrusions are formed on the surface of the copper foil on at least one side of the flexible copper clad laminate
  • connection hole is filled, and at the same time, the protrusion is formed on the surface of the copper foil on at least one side of the flexible copper clad laminate.
  • the method further includes the step of: An adhesive film layer is formed on at least one surface of the copper clad laminate, which specifically includes:
  • the invention also provides a second method for manufacturing a flexible connector, including the following steps:
  • the flexible copper-clad laminate including an insulator and copper foils provided on opposite surfaces of the insulator;
  • connection hole Form a conductive medium in the connection hole to make the connection hole conductive
  • a protrusion is formed on the surface of the first electrical conductor or / and the second electrical conductor.
  • the connecting holes for connecting the copper foils on both sides are formed on the flexible copper clad plate by mechanical drilling, laser drilling or punching.
  • forming a conductive medium in the connection hole specifically includes:
  • a thin layer of conductive medium is deposited on the hole wall of the connection hole through chemical reaction, and then one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. are used to increase the wall of the hole.
  • electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. are used to increase the wall of the hole.
  • connection hole first deposit a thin layer of conductive medium on the wall of the connection hole through chemical reaction, and then use one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. to make the conductive medium Fill the connection hole.
  • one or more of electroplating, electroless plating, physical vapor deposition, chemical vapor deposition, etc. are used in the first conductor or / and The protrusions are formed on the surface of the electrical conductor.
  • the method further includes the step of: forming the flexible copper clad laminate A glue film layer is formed on at least one side of the surface, specifically including:
  • the present invention also provides a third method for manufacturing a flexible connector, including the following steps:
  • the flexible copper-clad laminate including an insulator and copper foils provided on opposite surfaces of the insulator;
  • a protrusion is formed on the surface of the copper foil on at least one side of the flexible copper clad laminate
  • connection hole Form a conductive medium in the connection hole to make the connection hole conductive
  • a first conductor and a second conductor are etched on both sides of the flexible copper clad laminate, respectively.
  • one or more of electroplating, electroless plating, physical vapor deposition, chemical vapor deposition, etc. are used, and the copper foil on at least one side of the flexible copper clad laminate The surface forms the raised portion.
  • connection holes for connecting the copper foils on both sides of the flexible copper clad laminate.
  • forming a conductive medium in the connection hole specifically includes:
  • a thin layer of conductive medium is deposited on the hole wall of the connection hole through chemical reaction, and then one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. are used to increase the wall of the hole.
  • electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. are used to increase the wall of the hole.
  • connection hole first deposit a thin layer of conductive medium on the wall of the connection hole through chemical reaction, and then use one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. to make the conductive medium Fill the connection hole.
  • the protrusions and the copper foil are etched on both sides of the flexible copper clad plate respectively to form several first conductors with protrusions on the surface and several After the second electrical conductor having a convex portion on the surface, the method further includes the steps of: forming an adhesive film layer on at least one surface of the flexible copper clad laminate, specifically including:
  • the flexible connector provided by the embodiment of the present invention includes an insulator.
  • a plurality of first conductors are provided on one surface of the insulator, and a plurality of second conductors are provided on the other surface of the insulator.
  • the insulator is also provided with a connection between the first conductor and The conductive medium of the second electrical conductor, the surface of the first electrical conductor or / and the second electrical conductor is provided with a protrusion.
  • the flexible connector provided by the embodiment of the present invention is clamped between two circuit boards, and the first electrical conductor and the second electrical conductor are respectively attached to the pads on the two circuit boards.
  • the flexible connector provided by the embodiment of the present invention can not only realize the repeated disassembly and assembly of the circuit board, but also facilitate the circuit
  • the maintenance of the board reduces the manufacturing cost of electronic products, and can also realize the precise alignment connection of the two circuit boards, and improve the assembly accuracy.
  • the protrusion can increase the contact area of the conductor (ie, the elastic arm) and the pad, making the flexible connector and the solder The contact between the disks is more sufficient, so that problems such as circuit interruption or signal distortion can be avoided; at the same time, the protrusion can also increase the friction between the flexible connector and the circuit board, thus tightening the flexible connector During the process, for example, when tightening the bolt, the misalignment between the protrusion and the pad is not easy, which ensures the reliability of the electrical connection between the flexible connector and the pad; in addition, because the size of the protrusion is small and the arrangement is very Tight, so that the protrusions are not easy to break and the deformation amplitude is more uniform.
  • the flexible connector provided by the embodiment of the present invention when the flexible connector provided by the embodiment of the present invention is pressed against the circuit board, there will be no problem of poor contact between some connectors and the pad. Compared with a connector provided with an elastic arm, the flexible connector provided by the embodiment of the present invention has better contact effect and more reliable conductive performance.
  • the invention also provides the manufacturing method of the above flexible connector, which has the advantages of simple operation and easy realization.
  • FIG. 1 is a schematic diagram of a cross-sectional structure of a flexible connector according to Embodiment 1 of the present invention
  • FIG. 2 is an enlarged view of the area I in FIG. 1;
  • FIG. 3 is a partial view of the first conductor of the present invention when the surface is flat;
  • Example 4 is a section view of a flexible connector of Example 1 of the present invention partially magnified 400 times under a metallurgical microscope (1);
  • FIG. 5 is a partial cross-sectional view of the flexible connector of the first embodiment of the present invention when magnified 400 times under a metallurgical microscope (2);
  • FIG. 6 is a partial cross-sectional view of the flexible connector of the first embodiment of the present invention when magnified 400 times under a metallurgical microscope (3);
  • FIG. 7 is a partial cross-sectional view of the flexible connector of the first embodiment of the present invention when magnified 400 times under a metallurgical microscope (four);
  • Example 8 is a partial cross-sectional view of the flexible connector of Example 1 of the present invention when magnified 400 times under a metallurgical microscope (5);
  • FIG. 9 is a partial cross-sectional view of the flexible connector of the first embodiment of the present invention when magnified 100 times under a metallurgical microscope (6);
  • FIG. 10 is a schematic diagram of a cross-sectional structure when the connection hole of the first embodiment of the present invention is filled with a conductive medium;
  • FIG. 11 is a schematic cross-sectional view of the structure of the first electrical conductor and the second electrical conductor of the first embodiment of the present invention when the second electrical connection is used;
  • FIG. 12 is a schematic diagram of a cross-sectional structure when the third electrical connection form is adopted between the first electrical conductor and the second electrical conductor in Embodiment 1 of the present invention
  • FIG. 13 is a schematic cross-sectional structure diagram of a first electrical conductor and a second electrical conductor according to Embodiment 1 of the present invention when a fourth electrical connection is used;
  • FIG. 14 is a schematic diagram of a cross-sectional structure when a fifth electrical connection form is adopted between a first electrical conductor and a second electrical conductor in Embodiment 1 of the present invention
  • FIG. 15 is a schematic diagram of a cross-sectional structure of a flexible connector according to Embodiment 2 of the present invention.
  • Insulator 11, first conductor, 12, second conductor, 13, conductive medium, 14, protrusion, 15, conductive hole, 16, adhesive film layer.
  • an embodiment of the present invention provides a flexible connector, which mainly includes an insulator 10, a plurality of first conductors 11 are provided on one surface of the insulator 10, and a plurality of second conductors are provided on the other surface of the insulator 10
  • the body 12 and the insulator 10 are further provided with a conductive medium 13 connecting the first conductor 11 and the second conductor 12.
  • the surfaces of the first conductor 11 and the second conductor 12 are provided with protrusions 14.
  • the insulator 10 is a flexible insulator, the first conductor 11 and the second conductor 12 are provided on two opposite sides of the insulator 10, and the protrusion 14 is a plated protrusion.
  • the flexible connector provided by the embodiment of the present invention is clamped between two circuit boards, and the first electrical conductor 11 and the second electrical conductor 12 are respectively connected to the pads on the two circuit boards Fit together to achieve circuit conduction between the two circuit boards. Therefore, compared with the traditional soldering and bonding, the flexible connector provided by the embodiment of the present invention can not only realize repeated disassembly and assembly of the circuit board, It is convenient for the maintenance of circuit boards, reduces the manufacturing cost of electronic products, and can also realize the precise alignment connection of two circuit boards, and improve the assembly accuracy.
  • the protrusion 14 can increase the contact area of the first conductor 11 and the second conductor 12 with the pad, so that The contact between the first electrical conductor 11 and the second electrical conductor 12 and the pad is more sufficient, so that problems such as circuit interruption or signal distortion can be avoided; at the same time, the protrusion 14 can also increase the first electrical conductor 11 and The friction between the second electrical conductor 12 and the circuit board, therefore, during the fastening process of the flexible connector, for example, when tightening the bolt, the first electrical conductor 11 and the second electrical conductor 12 are less likely to be misaligned with the pad, The reliability of the electrical connection between the first electrical conductor 11 and the second electrical conductor 12 and the pad is ensured; in addition, due to the small size of the protrusions 14 and the very close arrangement, the protrusions 14 are not easily broken and The deformation amplitude is relatively uniform, so that when the flexible connector provided by the
  • the convex portion 14 has a regular or irregular three-dimensional geometric shape, such as a sharp corner shape, an inverted cone shape, a granular shape, a dendritic shape, a column shape, a block shape, etc., and, regardless of What is the shape, the height h of the convex portion 14 is 1 to 30 ⁇ m, of which 2.5 to 15 ⁇ m is the most preferable range.
  • each protrusion 14 may have the same or different shape, and each protrusion
  • the size of the 14 may also be the same or different, that is to say, the shape of the two or more protrusions 14 may be one of sharp-angled, inverted cone-shaped, granular, dendritic, columnar, and block-shaped One or more, and the size of two or more protrusions 14 of the same shape may be different.
  • the above dimensions include the above-mentioned self height and the length of the protrusion 14 parallel to the side surface of the insulator 10.
  • two or more protrusions 14 are continuously or discontinuously distributed on the surfaces of the first electrical conductor 11 and the second electrical conductor 12, for example, when the shape of the two or more protrusions 14 When the shape is sharp and continuous, it can form a regular, periodic dentate three-dimensional pattern, or an irregular, disordered dentate three-dimensional pattern. Of course, here is just one of the cases. Combinations of other shapes in are also within the scope of protection of this application, which are not listed here.
  • the surfaces of the first electrical conductor 11 and the second electrical conductor 12 may be flat or rough. It should be noted that the flat surface and the rough surface mentioned here refer to the surfaces of the first electrical conductor 11 and the second electrical conductor 12 where the protrusion 14 is located, that is, the reference surface where the protrusion 14 is located, rather than the two A plane formed by two or more protrusions 14.
  • the surfaces of the first electrical conductor 11 and the second electrical conductor 12 are rough surfaces, they include concave portions and convex portions, and the convex portions 14 may be distributed in the concave portions or the convex portions, and any of the convex portions
  • the sum of the height H and the height h of the convex portion 14 located on the convex portion may also be 1 to 30 ⁇ m.
  • the height h of the convex portion 14 provided on the convex portion may be 1 to 30 ⁇ m.
  • the sum of the height H of the convex portion and the height h of the convex portion 14 located on the convex portion More than 1 to 30 ⁇ m, which can further enhance the electrical connection performance of the flexible connector.
  • the material of the protrusion 14 is one or a combination of copper, nickel, lead, chromium, molybdenum, zinc, tin, gold, and silver.
  • the protrusion 14 may be a single component, namely one of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, silver, or may be copper, nickel, tin, lead, chromium, One of molybdenum, zinc, gold, and silver is the main body, and then one or more of electroplating, electroless plating, physical vapor deposition, chemical vapor deposition, etc., one or more metals other than the main body or Various types are formed on the surface of the main body, thereby forming the convex portion 14 of the composite material.
  • the protrusion 14 is preferably composed of copper, and one or more metals of nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver are formed on the composite material of the copper surface. This is because The convex portion 14 made of only copper is easily oxidized or abraded, and nickel, tin, gold, and silver formed on the copper surface can improve the corrosion resistance and abrasion resistance of the convex portion 14, thereby further improving the electrical conductivity of the connector Performance, extend the life of the connector.
  • the insulator 10 is provided with a connection hole connecting the first conductor 11 and the second conductor 12.
  • the conductive medium 13 is attached to the hole wall of the connection hole and forms a conductive hole 15.
  • the conductive hole 15 may be The hole can also be a buried hole or a blind hole.
  • the operator can also choose to fill the entire connection hole with the conductive medium 13, that is, the conductive hole 15 is not formed. The purpose of this is to prevent the etching liquid from entering the conductive In the hole 15, the conductive medium 13 is protected from being etched.
  • the first electrical conductor 11 is set to two or more, and each first electrical conductor 11 is independent of each other.
  • the second electrical conductor 12 is also set to two or more, and The second electric conductors 12 are independent of each other.
  • connection types between the first electrical conductor 11 and the second electrical conductor 12 there are the following connection types between the first electrical conductor 11 and the second electrical conductor 12:
  • each first electric conductor 11 passes through the conductive medium 13 and each second electric conductor 12 in different connection holes One-to-one correspondence;
  • the number of the first electrical conductors 11 is greater than the number of the second electrical conductors 12, at least two of the first electrical conductors 11 are connected to the same first The two electrical conductors 12 are connected, and the remaining first electrical conductors 11 are connected to the remaining second electrical conductors 12 in a one-to-one correspondence with the conductive media 13 in different connection holes;
  • the number of the first electrical conductors 11 is less than the number of the second electrical conductors 12, at least two second electrical conductors 12 are respectively connected to the same One electrical conductor 11 is connected, and the remaining second electrical conductors 12 are connected to the remaining first electrical conductors 11 in a one-to-one correspondence with the conductive media 13 in different connection holes;
  • At least two first electrical conductors 11 are respectively connected to the same second electrical conductor 12 through conductive media 13 in different connection holes, and at least two second electrical conductors 12 respectively pass through The conductive medium 13 in different connection holes is connected to the same first electrical conductor 11;
  • At least two of the first electrical conductors 11 in a part of the first electrical conductors respectively pass through the conductive medium 13 in different connection holes and a part of the same in the second electrical conductors
  • the second electrical conductors 12 are connected, and at least two of the second electrical conductors 12 in another part of the second electrical conductor are electrically connected to the same first electrical conductor in another part of the first electrical conductor through conductive media in different connection holes.
  • the bodies 11 are connected, and the remaining first electrical conductors 11 are connected to the remaining second electrical conductors 12 in a one-to-one correspondence with the conductive media 13 in different connection holes.
  • connection hole is provided with a conductive medium 13 to further improve the conductive performance of the flexible connector.
  • the material of the insulator 10 is polyimide, thermoplastic polyimide, modified epoxy resin, modified acrylic resin, polyethylene terephthalate, polybutylene terephthalate , Polyethylene, polyethylene naphthalate, polystyrene, polyvinyl chloride, polysulfone, polyphenylene sulfide, polyether ether ketone, polyphenylene ether, polytetrafluoroethylene, liquid crystal polymer, polyethylene A combination of one or more of ureides.
  • the insulator 10 may be a single component, that is, one of the above-mentioned various insulating materials, or may be a composite of any of the above-mentioned various insulating materials.
  • the insulator 10 has a certain amount of deformation.
  • the bump 14 that first contacts the pad will be compressed backwards, resulting in a relatively low bump
  • the portion 14 can also be in contact with the pad to ensure that a reliable electrical connection is formed between the first conductor 11 and the second conductor 12 and the pad.
  • the conductive medium 13 in the embodiment of the present invention is preferably copper.
  • other materials with good conductive properties such as tin, silver, gold, graphite, copper paste, silver paste, solder paste, and carbon nanotubes, can also be used.
  • the flexible connector provided by the embodiment of the present invention is different from the flexible connector provided by the first embodiment in that the convex portion 14 is provided with an adhesive film layer 16.
  • the convex portion 14 is hidden in the adhesive film layer 16 or penetrates the adhesive film layer 16 and is exposed.
  • the thickness of the adhesive film layer 16 is less than the height of the convex portion 14 itself average value.
  • the connection between the flexible connector and the circuit board is more stable, and it is not easy to loosen and disconnect;
  • the adhesive film layer 16 has fluidity, the convex portion 14 that has not penetrated the adhesive film layer 16 before, at this time, all or part of it penetrates the adhesive film layer 16 and has penetrated before
  • the raised portions 14 of the adhesive film layer 16 are in contact with the pads on the circuit board, so that a reliable electrical connection is formed between the first electrical conductor 11 and / or the second electrical conductor 12 and the pad, ensuring the flexibility
  • the connector still has good electrical conductivity during bonding.
  • the adhesive film layer 16 in the embodiment of the present invention is directly formed on the entire surface of the flexible connector. Therefore, in addition to the protruding portion 14, the first electrical conductor 11 provided with the protruding portion 14 or / The adhesive film layer 16 is also formed on the surface of the insulator 10 where the second conductor 12 is located.
  • the adhesive film layer 16 is preferably a pressure-sensitive adhesive or a thermoplastic adhesive.
  • the adhesive film layer 16 may also be a thermosetting adhesive.
  • the other specific structures of the embodiments of the present invention are the same as those in the first embodiment, and the corresponding principles and technical effects are also consistent, which will not be repeated here.
  • An embodiment of the present invention provides a method for manufacturing a flexible connector, including the following steps:
  • Step 1 Manufacturing a flexible copper-clad plate, the flexible copper-clad plate includes an insulator and copper foil disposed on two opposite surfaces of the insulator;
  • Step 2 Use mechanical drilling, laser drilling or punching to form connecting holes on the flexible copper clad plate to connect the copper foils on both sides;
  • Step three a conductive medium 13 is formed in the connection hole to make the connection hole conductive, and at the same time, a protrusion 14 is formed on the surface of the copper foil on at least one side of the flexible copper clad laminate;
  • Step 4 Etching the first conductor 11 and the second conductor 12 on both sides of the flexible copper clad board respectively;
  • Step 5 Form an adhesive film layer 16 on at least one surface of the flexible copper clad laminate.
  • step three forming the conductive medium 13 in the connection hole and forming the protrusion 14 on the surface of the copper foil on at least one side of the flexible copper clad laminate specifically include:
  • a thin layer of conductive medium 13 is deposited on the hole wall of the connection hole through chemical reaction, and then one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. are used to increase the conductivity on the hole wall
  • the thickness of the medium 13 and the formation of the conductive hole 15, and at the same time, the convex portion 14 is formed on the surface of the copper foil on at least one side of the flexible copper clad laminate;
  • connection holes are filled, and at the same time, the protrusions 14 are formed on the surface of the copper foil on at least one side of the flexible copper clad laminate.
  • the above “thin conductive medium” refers to the process of forming the conductive medium 13 is the process of metallizing the hole in the prior art relative to the subsequent setting of the conductive medium.
  • the thickness of the thin conductive medium 13 formed first can be referred to The existing technology will not be repeated here.
  • step three one or more of electroplating, electroless plating, physical vapor deposition, chemical vapor deposition, etc. are used to form the protrusion 14 on the surface of the copper foil on at least one side of the flexible copper clad laminate
  • the height of the raised portion 14 can be controlled by controlling the size of the current density.
  • the height of the protrusion can be adjusted by controlling the operating conditions.
  • step five provided by the embodiment of the present invention forming the adhesive film layer 16 on at least one surface of the flexible copper clad laminate specifically includes:
  • the adhesive film layer 16 is directly coated on at least one surface of the flexible copper clad laminate.
  • An embodiment of the present invention provides a method for manufacturing a flexible connector, including the following steps:
  • Step 1 Manufacturing a flexible copper-clad plate, the flexible copper-clad plate includes an insulator and copper foil disposed on two opposite surfaces of the insulator;
  • Step 2 Use mechanical drilling, laser drilling or punching to form connecting holes on the flexible copper clad plate to connect the copper foils on both sides;
  • Step 3 forming a conductive medium 13 in the connection hole to make the connection hole conductive;
  • Step 4 Etching copper foil on both sides of the flexible copper clad laminate to form a number of first conductors 11 and a number of second conductors 12, the specific method is the same as the description in step 4 of Embodiment 3, and will not be repeated here Repeat
  • Step 5 Use one or more of electroplating, electroless plating, physical vapor deposition, chemical vapor deposition, etc. to form protrusions 14 on the surface of the first electrical conductor 11 or / and the second electrical conductor 12;
  • Step 6 The adhesive film layer 16 is formed on at least one surface of the flexible copper clad laminate.
  • the specific method is the same as the description in step 5 of Embodiment 3, and details are not described here.
  • step three provided by the embodiment of the present invention forming the conductive medium 13 in the connection hole specifically includes:
  • a thin layer of conductive medium 13 is deposited on the hole wall of the connection hole through chemical reaction, and then one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. are used to increase the conductivity on the hole wall
  • electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. are used to increase the conductivity on the hole wall
  • connection hole first deposit a thin layer of conductive medium 13 on the wall of the connection hole through chemical reaction, and then use one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. to make the conductive medium 13 Fill the connection hole.
  • the above “thin conductive medium” refers to the process of forming the conductive medium 13 is the process of metallizing the hole in the prior art relative to the subsequent setting of the conductive medium.
  • the thickness of the thin conductive medium 13 formed first can be referred to The existing technology will not be repeated here.
  • An embodiment of the present invention provides a method for manufacturing a flexible connector, including the following steps:
  • Step 1 Manufacturing a flexible copper-clad plate, the flexible copper-clad plate includes an insulator and copper foil disposed on two opposite surfaces of the insulator;
  • Step 2 Use one or more of electroplating, electroless plating, physical vapor deposition, chemical vapor deposition, etc. to form the protrusion 14 on the surface of the copper foil on at least one side of the flexible copper clad laminate;
  • Step 3 Use mechanical drilling, laser drilling or punching to form connecting holes on the flexible copper clad plate to connect the copper foils on both sides;
  • Step four forming a conductive medium 13 in the connection hole to make the connection hole conductive
  • Step 5 The first conductor 11 and the second conductor 12 are etched and formed respectively on the surfaces of both sides of the flexible copper clad laminate.
  • the specific method is the same as that described in step 4 of Embodiment 3, and details are not repeated here;
  • Step 6 The adhesive film layer 16 is formed on at least one surface of the flexible copper clad laminate.
  • the specific method is the same as the description in step 5 of Embodiment 3, and details are not described here.
  • step four provided by the embodiment of the present invention forming the conductive medium 13 in the connection hole specifically includes:
  • a thin layer of conductive medium 13 is deposited on the hole wall of the connection hole through chemical reaction, and then one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. are used to increase the conductivity on the hole wall
  • electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. are used to increase the conductivity on the hole wall
  • connection hole first deposit a thin layer of conductive medium 13 on the wall of the connection hole through chemical reaction, and then use one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. to make the conductive medium 13 Fill the connection hole.
  • the above “thin conductive medium” refers to the process of forming the conductive medium 13 is the process of metallizing the hole in the prior art relative to the subsequent setting of the conductive medium.
  • the thickness of the thin conductive medium 13 formed first can be referred to The existing technology will not be repeated here.
  • the present invention provides a flexible connector, including an insulator 10, a plurality of first conductors 11 are provided on one surface of the insulator 10, and a plurality of second conductors 12 are provided on the other side surface of the insulator 10, the insulator 10 A conductive medium 13 connecting the first electrical conductor 11 and the second electrical conductor 12 is also provided on the surface.
  • the surfaces of the first electrical conductor 11 and the second electrical conductor 12 are provided with protrusions 14.
  • the flexible connector has good conductivity, long service life, high reliability, low manufacturing cost, and can be repeatedly disassembled and assembled.
  • the present invention also provides the manufacturing method of the above flexible connector, which has the advantages of simple operation and easy implementation.
  • the above “thin conductive medium” refers to the process of forming the conductive medium 13 is the process of metallizing the hole in the prior art relative to the subsequent setting of the conductive medium.
  • the thickness of the thin conductive medium 13 formed first can be referred to The existing technology will not be repeated here.
  • first, second, etc. are used in the present invention to describe various information, but the information should not be limited to these terms, and these terms are only used to distinguish the same type of information from each other.
  • first information may also be referred to as “second” information
  • second information may also be referred to as “first” information.

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Abstract

一种柔性连接器，包括绝缘体(10)，绝缘体(10)的一侧表面设有若干第一导电体(11)，绝缘体(10)的另一侧表面设有若干第二导电体(12)，绝缘体(10)上还设有连接第一导电体(11)与第二导电体(12)的导电介质(13)，第一导电体(11)和第二导电体(12)的表面设有凸起部(14)。该柔性连接器导电性能好，使用寿命长，可靠性高，制作成本低，并且可反复拆装。上述柔性连接器的制作方法，具有操作简单，易于实现等优点。

Description

一种柔性连接器及制作方法 技术领域
本发明涉及电连接器技术领域，尤其涉及一种柔性连接器及制作方法。
背景技术
在电子行业中，芯片、电路板等电子元件之间广泛采用的连接方式有焊接(BGA)、导电胶连接等。其中，焊接虽然具有连接可靠的优点，但同时也存在不能反复拆装的缺点，若焊接过程出现操作失误，或是焊接后出现导电不良等问题，焊接的电子元件就只能耗费更多资源返工或直接报废，从而造成材料浪费和成本提高；导电胶连接虽然相对于焊接而言更容易实施，且便于返工维修，但由于导电胶自身存在的一些问题，以及受气候、老化、应力应变等外部因素的影响，导电胶的导电性能不够稳定，因此，采用导电胶连接的电子元件之间容易出现电路中断或信号失真的问题。
为了避免上述连接方式所存在的缺陷，现有的电子元件之间采用了一种新的连接方式，即连接器连接，连接器主要由绝缘体以及设于绝缘体两侧的导电体构成，绝缘体上设有连接两侧导电体的导电介质。使用时，连接器夹于两块电路板之间并紧固，导电体与电路板上的焊盘相贴合，以实现电路导通。为了确保导电体与焊盘之间能够形成可靠的电连接，导电体上通常设有镀铜的弹性臂，但弹性臂的设置同时也带来了一些新的问题：
一是提高了连接器的制作难度，增加了多道制作工序，例如弹性臂的焊接、镀铜等，同时增加了连接器的制作成本；
二是在连接器多次拆装后，弹性臂容易出现疲劳损伤，甚至直接断裂，缩短了连接器的使用寿命；
三是弹性臂表面的镀铜随着弹性臂的变形容易脱落，影响连接器的导电性能；
四是连接器上各弹性臂的弹起幅度无法统一，容易出现部分弹性臂与电路板接触，而部分弹性臂未与电路板接触的状况，难以保证连接器的导电性能。
因此，设计一种导电性能优良，经久耐用，同时便于电子元件拆装的连接器很有必要。
发明内容
为解决上述技术问题，即现有的连接器电连接性能不可靠的技术问题，本发明提供一种柔性连接器及制作方法，该柔性连接器用于电路板的安装连接，具有可反复拆装，导电性能好等优点，并且，其制作方法简单，易于实现。
基于此，本发明提供了一种柔性连接器，包括绝缘体，所述绝缘体的一侧表面设有若干第一导电体，所述绝缘体的另一侧表面设有若干第二导电体，所述绝缘体上还设有连接所述第一导电体与所述第二导电体的导电介质，所述第一导电体或/和所述第二导电体的表面设有凸起部。
最为优选方案，所述凸起部为规则或不规则的立体几何状。
最为优选方案，所述凸起部的形状为尖角状、倒锥状、颗粒状、树枝状、柱状或块状。
最为优选方案，所述凸起部的自身高度为1至30μm。
最为优选方案，所述第一导电体或/和所述第二导电体的表面设有两个或两个以上的所述凸起部，各所述凸起部的形状相同或不同，各所述凸起部的尺寸相同或不同，且两个或两个以上的所述凸起部在所述第一导电体或/和所述第二导电体的表面连续或不连续地分布。
最为优选方案，所述第一导电体或/和所述第二导电体的表面为粗糙面。
最为优选方案，所述第一导电体或/和所述第二导电体的表面为平整面。
最为优选方案，所述凸起部的材质为铜、镍、锡、铅、铬、钼、锌、金、银中的一种或多种的组合。
最为优选方案，所述绝缘体的至少一侧表面或/和所述凸起部上设有胶膜层，所述凸起部隐藏于所述胶膜层内或穿透所述胶膜层并暴露出来。
最为优选方案，所述绝缘体上设有连接所述第一导电体与所述第二导电体的连接孔，所述导电介质设于所述连接孔内。
最为优选方案，所述导电介质填充满所述连接孔，或所述导电介质附着于所述连接孔的孔壁上并形成导电孔。
最为优选方案，所述第一导电体设为两个或两个以上，且各所述第一导电体相互独立，所述第二导电体设为两个或两个以上，且各所述第二导电体相互独立。
最为优选方案，所述第二导电体与所述第一导电体数量相等，各所述第一导电体分别通过不同所述连接孔内的所述导电介质与各所述第二导电体一一对应连接。
最为优选方案，所述第一导电体的数量多于所述第二导电体的数量，至少两个所述第一导电体分别通过不同所述连接孔内的所述导电介质与同一个所述第二导电体相连接，其余各所述第一导电体分别通过不同所述连接孔内的所述导电介质与其余各所述第二导电体一一对应连接。
最为优选方案，所述第一导电体的数量少于所述第二导电体的数量，至少两个所述第二导电体分别通过不同所述连接孔内的所述导电介质与同一个所述第一导电体相连接，其余各所述第二导电体分别通过不同所述连接孔内的所述导电介质与其余各所述第一导电体一一对应连接。
最为优选方案，至少两个所述第一导电体分别通过不同所述连接孔内的所述导电介质与同一个所述第二导电体相连接，至少两个所述第二导电体分别通过不同所述连接孔内的所述导电介质与同一个所述第一导电体相连接。
最为优选方案，一部分所述第一导电体中的至少两个所述第一导电体分别通过不同所述连接孔内的所述导电介质与一部分所述第二导电体中的同一个所述第二导电体相连接，另一部分所述第二导电体中至少两个所述第二导电体分别通过不同所述连接孔内的所述导电介质与另一部分所述第一导电体中的同一个所述第一导电体相连接，其余各所述第一导电体分别通过不同所述连接孔内的所述导电介质与其余各所述第二导电体一一对应连接。
最为优选方案，所述第一导电体和与其相连接的所述第二导电体之间设有两个或两个以上的所述连接孔。
最为优选方案，所述绝缘体的材质为聚酰亚胺、热塑性聚酰亚胺、改性环氧树脂、改性丙烯酸树脂、聚对苯二甲酸乙二醇酯、聚对苯二甲酸丁二醇酯、聚乙烯、聚萘二甲酸乙二醇酯、聚苯烯、聚氯乙烯、聚砜、聚苯硫醚、聚醚醚酮、聚苯醚、聚四氟乙烯、液晶聚合物、聚乙二酰脲中的一种或多种的组合。
进一步地，绝缘体为柔性绝缘体，所述第一导电体和所述第二导电体设置在所述绝缘体的相对的两个所述侧面上，所述凸起部为镀覆凸起部。
进一步地，凸起部隐藏于所述胶膜层内，所述胶膜层的厚度小于所述凸起部的自身高度的平均值。
本发明还提供了一种柔性连接器的制作方法，包括以下步骤：
制作挠性覆铜板，挠性覆铜板包括绝缘体和设置在所述绝缘体相对两个表面的铜箔；
在挠性覆铜板上形成连接孔；
在连接孔内形成导电介质，使连接孔具有导电性，与此同时，在挠性覆铜板至少一侧的铜箔的表面形成凸起部；
在挠性覆铜板的两侧分别蚀刻形成第一导电体和第二导电体。
进一步地，在上述柔性连接器的制作方法当中，采用机械钻孔、激光钻孔或冲压的方式，在所述挠性覆铜板上形成连接两侧铜箔的所述连接孔。
进一步地，在上述柔性连接器的制作方法当中，在所述连接孔内形成导电介质以及在所述挠性覆铜板至少一侧的铜箔的表面形成所述凸起部具体包括：
先通过化学反应，在所述连接孔的孔壁上沉积一层薄的导电介质，再采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，增加孔壁上导电介质的厚度并形成导电孔，与此同时，在所述挠性覆铜板至少一侧的铜箔的表面形成所述凸起部；
或者先通过化学反应，在所述连接孔的孔壁上沉积一层薄的导电介质，再采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，使导电介质填充满所述连接孔，与此同时，在所述挠性覆铜板至少一侧的铜箔的表面形成所述凸起部。
进一步地，在上述柔性连接器的制作方法当中，在所述挠性覆铜板的两侧分别蚀刻形成所述第一导电体和所述第二导电体之后，还包括步骤：在所述挠性覆铜板的至少一侧表面形成胶膜层，具体包括：
在离型膜上涂布所述胶膜层，然后通过离型膜将所述胶膜层压合转移至所述挠性覆铜板的至少一侧表面；
或者直接在所述挠性覆铜板的至少一侧表面涂布所述胶膜层。
本发明还提供了第二种柔性连接器的制作方法，包括以下步骤：
制作挠性覆铜板，挠性覆铜板包括绝缘体和设置在所述绝缘体相对两个表面的铜箔；
在挠性覆铜板上形成连接孔；
在连接孔内形成导电介质，使连接孔具有导电性；
在挠性覆铜板的两侧分别蚀刻铜箔形成若干个第一导电体和若干个第二导电体；
在第一导电体或/和第二导电体的表面形成凸起部。
进一步地，在上述柔性连接器的制作方法当中，采用机械钻孔、激光钻孔或冲压的方式，在所述挠性覆铜板上形成连接两侧铜箔的所述连接孔。
进一步地，在上述柔性连接器的制作方法当中，在所述连接孔内形成导电介质具体包括：
先通过化学反应，在所述连接孔的孔壁上沉积一层薄的导电介质，再采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，增加孔壁上导电介质的厚度并形成导电孔；
或者先通过化学反应，在所述连接孔的孔壁上沉积一层薄的导电介质，再采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，使导电介质填充满所述连接孔。
进一步地，在上述柔性连接器的制作方法当中，采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，在所述第一导电体或/和所述第二导电体的表面形成所述凸起部。
进一步地，在上述柔性连接器的制作方法当中，在所述第一导电体或/和所述第二导电体的表面形成所述凸起部之后，还包括步骤：在所述挠性覆铜板的至少一侧表面形成胶膜层，具体包括：
在离型膜上涂布所述胶膜层，然后通过离型膜将所述胶膜层压合转移至所述挠性覆铜板的至少一侧表面；
或者直接在所述挠性覆铜板的至少一侧表面涂布所述胶膜层。
本发明还提供了第三种柔性连接器的制作方法，包括以下步骤：
制作挠性覆铜板，所述挠性覆铜板包括绝缘体和设置在所述绝缘体相对两个表面的铜箔；
在挠性覆铜板至少一侧的铜箔的表面形成凸起部；
在挠性覆铜板上形成连接孔；
在连接孔内形成导电介质，使连接孔具有导电性；
在挠性覆铜板的两侧分别蚀刻形成第一导电体和第二导电体。
进一步地，在上述柔性连接器的制作方法当中，采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，在所述挠性覆铜板至少一侧的铜箔的表面形成所述凸起部。
进一步地，在上述柔性连接器的制作方法当中，采用机械钻孔、激光钻孔或冲压的方式，在所述挠性覆铜板上形成连接两侧铜箔的所述连接孔。
进一步地，在上述柔性连接器的制作方法当中，在所述连接孔内形成导电介质具体包括：
先通过化学反应，在所述连接孔的孔壁上沉积一层薄的导电介质，再采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，增加孔壁上导电介质的厚度并形成导电孔；
或者先通过化学反应，在所述连接孔的孔壁上沉积一层薄的导电介质，再采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，使导电介质填充满所述连接孔。
进一步地，在上述柔性连接器的制作方法当中，在挠性覆铜板的两侧分别蚀刻所述凸起部和所述铜箔，形成若干个表面具有凸起部的第一导电体和若干个表面具有凸起部的第二导电体之后，还包括步骤：在挠性覆铜板的至少一侧表面形成胶膜层，具体包括：
在离型膜上涂布所述胶膜层，然后通过离型膜将所述胶膜层压合转移至所述挠性覆铜板的至少一侧表面；
或者直接在所述挠性覆铜板的至少一侧表面涂布所述胶膜层。
实施本发明实施例，具有如下有益效果：
本发明实施例提供的柔性连接器包括绝缘体，绝缘体的一侧表面设有若干第一导电体，绝缘体的另一侧表面设有若干第二导电体，绝缘体上还设有连接第一导电体与第二导电体的导电介质，第一导电体或/和第二导电体的表面设有凸起部。基于上述结构，一方面，本发明实施例提供的柔性连接器通过夹紧于两块电路板之间，并将第一导电体和第二导电体分别与两块电路板上的焊盘相贴合，以此来实现两块电路板之间的电路导通，从而，跟传统的焊接和粘接相比，本发明实施例提供的柔性连接器不仅可实现电路板的反复拆装，便于电路板的 维修，降低电子产品的制造成本，还能够实现两块电路板的精准对位连接，提高组装精度。另一方面，与现有技术的柔性连接器采用弹性臂与焊盘相连的方式相比，凸起部能够增大导电体(即弹性臂)与焊盘的接触面积，使得柔性连接器与焊盘之间的接触更加充分，从而可避免出现电路中断或信号失真等问题；与此同时，凸起部还能够增加柔性连接器与电路板之间的摩擦力，因而在柔性连接器的紧固过程当中，例如拧紧螺栓时，凸起部与焊盘之间不易发生错位，保证了柔性连接器与焊盘之间电连接的可靠性；另外，由于凸起部的尺寸较小，并且排列非常紧密，致使各凸起部不易折断且形变幅度较为统一，从而，当本发明实施例提供的柔性连接器与电路板压合时不会出现部分连接器与焊盘接触不良的问题，因此，相较于设有弹性臂的连接器而言，本发明实施例提供的柔性连接器的接触效果更好，导电性能更加可靠。
本发明还提供了上述柔性连接器的制作方法，具有操作简单，易于实现等优点。
附图说明
构成本申请的一部分的说明书附图用来提供对本发明的进一步理解，本发明的示意性实施例及其说明用于解释本发明，并不构成对本发明的不当限定。在附图中：
图1是本发明实施例一的柔性连接器的横截面结构示意图；
图2是图1中I区域的放大视图；
图3是本发明实施例一的第一导电体表面为平整面时的局部视图；
图4是本发明实施例一的柔性连接器的局部在金相显微镜下放大400倍时的切片图(一)；
图5是本发明实施例一的柔性连接器的局部在金相显微镜下放大400倍时的切片图(二)；
图6是本发明实施例一的柔性连接器的局部在金相显微镜下放大400倍时的切片图(三)；
图7是本发明实施例一的柔性连接器的局部在金相显微镜下放大400倍时的切片图(四)；
图8是本发明实施例一的柔性连接器的局部在金相显微镜下放大400倍时的切片图(五)；
图9是本发明实施例一的柔性连接器的局部在金相显微镜下放大100倍时的切片图(六)；
图10是本发明实施例一的连接孔被导电介质填充满时的横截面结构示意图；
图11是本发明实施例一的第一导电体与第二导电体之间采用第二种电连接形式时的横截面结构示意图；
图12是本发明实施例一的第一导电体与第二导电体之间采用第三种电连接形式时的横截面结构示意图；
图13是本发明实施例一的第一导电体与第二导电体之间采用第四种电连接形式时的横截面结构示意图；
图14是本发明实施例一的第一导电体与第二导电体之间采用第五种电连接形式时的横截面结构示意图；
图15是本发明实施例二的柔性连接器的横截面结构示意图。
附图标记说明：
10、绝缘体，11、第一导电体，12、第二导电体，13、导电介质，14、凸起部，15、导电孔，16、胶膜层。
具体实施方式
需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
实施例一
如图1所示，本发明实施例提供一种柔性连接器，主要包括绝缘体10，绝缘体10的一侧表面设有若干第一导电体11，绝缘体10的另一侧表面设有若干第二导电体12，绝缘体10上还设有连接第一导电体11与第二导电体12的导电介质13，第一导电体11和第二导电体12的表面设有凸起部14。绝缘体10为柔性绝缘体，第一导电体11和第二导电体12设置在绝缘体10的相对的两个侧面上，凸起部14为镀覆凸起部。
基于上述结构，一方面，本发明实施例提供的柔性连接器通过夹紧于两块电路板之间，并将第一导电体11和第二导电体12分别与两块电路板上的焊盘相贴合，以此来实现两块电路板之间的电路导通，从而，跟传统的焊接和粘接相比，本发明实施例提供的柔性连接器不仅可实现电路板的反复拆装，便于电路板的维修，降低电子产品的制造成本，还能够实现两块电路板的精准对位连接，提高组装精度。另一方面，与现有技术的柔性连接器采用弹性臂与焊盘相连的方式相比，凸起部14能够增大第一导电体11和第二导电体12与焊盘的接触面积，使得第一导电体11和第二导电体12与焊盘之间的接触更加充分，从而可避免出现电路中断或信号失真等问题；与此同时，凸起部14还能够增加第一导电体11和第二导电体12与电路板之间的摩擦力，因而在柔性连接器的紧固过程当中，例如拧紧螺栓时，第一导电体11和第二导电体12与焊盘之间不易发生错位，保证了第一导电体11和第二导电体12与焊盘之间电连接的可靠性；另外，由于凸起部14的尺寸较小，并且排列非常紧密，致使各凸起部14不易折断且形变幅度较为统一，从而，当本发明实施例提供的柔性连接器与电路板压合时不会出现部分导电体与焊盘接触不良的问题，因此，相较于设有弹性臂的连接器而言，本发明实施例提供的柔性连接器的接触效果更好，导电性能更加可靠。
具体地，如图1至图9所示，凸起部14为规则或不规则的立体几何状，例如尖角状、倒锥状、颗粒状、树枝状、柱状、块状等，并且，无论是何种形状，凸起部14的自身高度h为1至30μm，其中，2.5至15μm为最优选的范围。在此基础上，第一导电体11和第二导电体12的表面设有两个或两个以上的凸起部14，每个凸起部14的形状可以相同或不同，每个凸起部14的尺寸也可以相同或不同，也就是说，两个或两个以上的凸起部14的形状可以为尖角状、倒锥状、颗粒状、树枝状、柱状、块状中的一种或多种，并且，同样形状的两个或两个以上的凸起部14的尺寸可不尽相同，上述尺寸包括上述的自身高度以及与上述绝缘体10的侧面平行方向的凸起部14的长度。另外，两个或两个以上的凸起部14在第一导电体11和第二导电体12的表面连续或不连续地分布，例如，当两个或两个以上的凸起部14的形状为尖角状且连续分布时，可形成规则的、周期性的齿纹状立体图案，抑或是不规则的、无序的齿纹状立体图案，当然，这里只是列举了其中一种情况，上述中的其他形状的组合也均在本申请的保护范围内，在此就不一一列举。
可选地，如图2至图3所示，第一导电体11和第二导电体12的表面可以是平整面，也可以是粗糙面。需要说明的是，这里所说的平整面和粗糙面是指凸起部14所在的第一导电体11和第二导电体12的表面，也就是凸起部14所在的基准面，而不是两个或两个以上的凸起部14组成的平面。当第一导电体11和第二导电体12的表面是粗糙面时，其包括凹部和凸部，凸起部14既可以分布于凹部，也可以分布于凸部，并且，任一凸部的高度H与位于该凸部上凸起部14的自身高度h之和也可以为1至30μm。当然，也可是设在凸部上的凸起部14的自身高度h即为1至30μm，那么，此时凸部的高度H与位于该凸部上的凸起部14的自身高度h之和大于1至30μm，从而可进一步增强该柔性连接器的电气连接性能。
可选地，凸起部14的材质为铜、镍、铅、铬、钼、锌、锡、金、银中的一种或多种的组合。具体而言，凸起部14可以是单一成分，即铜、镍、锡、铅、铬、钼、锌、金、银中的一种，也可以是以铜、镍、锡、铅、铬、钼、锌、金、银中的一种材质为主体，然后采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，将除主体以外的金属中的一种或多种形成于主体的表面，由此形成复合材质的凸起部14。在本实施例中，凸起部14优选以铜为主体，镍、锡、铅、铬、钼、锌、金、银中的一种或多种金属形成于铜表面的复合材质，这是由于仅由铜构成的凸起部14容易被氧化或磨损，而形成于铜表面的镍、锡、金、银可提高凸起部14的耐腐蚀性和耐磨性，进而可提高连接器的导电性能，延长连接器的使用寿命。
如图1所示，绝缘体10上设有连接第一导电体11与第二导电体12的连接孔，导电介质13附着于连接孔的孔壁上并形成导电孔15，导电孔15可以为通孔，也可以为埋孔或盲孔。当然，如图10所示，在导电介质13的形成过程当中，操作人员也可以选择将整个连接孔填充满导电介质13，即不形成导电孔15，这样做的目的在于能够避免蚀刻液进入导电孔15内，保护导电介质13不会被蚀刻。
在本发明实施例中，第一导电体11设为两个或两个以上，且各第一导电体11相互独立，同样的，第二导电体12也设为两个或两个以上，且各第二导电体12相互独立。并且，第一导电体11与第二导电体12之间存在以下多种连接形式：
第一种——如图1所示，第二导电体12与第一导电体11数量相等，并且，各第一导电体11分别通过不同连接孔内的导电介质13与各第二导电体12一一对应连接；
第二种——如图11所示，第一导电体11的数量多于第二导电体12的数量，至少两个第一导电体11分别通过不同连接孔内的导电介质13与同一个第二导电体12相连接，其余各第一导电体11分别通过不同连接孔内的导电介质13与其余各第二导电体12一一对应连接；
第三种——如图12所示，第一导电体11的数量少于第二导电体12的数量，至少两个第二导电体12分别通过不同连接孔内的导电介质13与同一个第一导电体11相连接，其余各第二导电体12分别通过不同连接孔内的导电介质13与其余各第一导电体11一一对应连接；
第四种——如图13所示，至少两个第一导电体11分别通过不同连接孔内的导电介质13与同一个第二导电体12相连接，至少两个第二导电体12分别通过不同连接孔内的导电介质13与同一个第一导电体11相连接；
第五种——如图14所示，一部分所述第一导电体中的至少两个第一导电体11分别通过不同连接孔内的导电介质13与一部分所述第二导电体中的同一个第二导电体12相连接，另一部分所述第二导电体中至少两个第二导电体12分别通过不同连接孔内的导电介质与另一部分所述第一导电体中的同一个第一导电体11相连接，其余各第一导电体11分别通过不同连接孔内的导电介质13与其余各第二导电体12一一对应连接。
可选地，第一导电体11与第二导电体12之间无论采取上述哪种电连接形式，第一导电体11和与其相连接的第二导电体12之间均可设置两个或两个以上的连接孔，并且，每个连接孔内均设有导电介质13，以进一步提高该柔性连接器的导电性能。
可选地，绝缘体10的材质为聚酰亚胺、热塑性聚酰亚胺、改性环氧树脂、改性丙烯酸树脂、聚对苯二甲酸乙二醇酯、聚对苯二甲酸丁二醇酯、聚乙烯、聚萘二甲酸乙二醇酯、聚苯烯、聚氯乙烯、聚砜、聚苯硫醚、聚醚醚酮、聚苯醚、聚四氟乙烯、液晶聚合物、聚乙二酰脲中的一种或多种的组合。具体而言，绝缘体10可以是单一成分，即上述各种绝缘材质中的一种，也可以是由上述任意多种绝缘材质复合而成。基于此，绝缘体10具有一定的形变量，当柔性连接器夹紧于两块电路板之间时，首先与焊盘相接触的凸起部14会向后压缩，从而使得相对低一些的凸起部14也能够与焊盘相接触，以保证第一导电体11和第二导电体12与焊盘之间形成可靠的电连接。
需要说明的是，在本发明实施例中，根据实际应用情况的不同，也可仅第一导电体11或第二导电体12的表面设有凸起部14，该种方案所产生的技术效果与前述一致，此处不再赘述。另外，本发明实施例中的导电介质13优选铜，当然也可以选用其他具有良好导电性能的材料，例如锡、银、金、石墨、铜浆、银浆、锡膏、碳纳米管等。
实施例二
如图15所示，本发明实施例提供的柔性连接器与实施例一提供的柔性连接器相比，其区别在于，凸起部14上设有胶膜层16，对于每个凸起部14而言，其隐藏于胶膜层16内或穿透胶膜层16并暴露出来，当凸起部14隐藏于胶膜层16内，胶膜层16的厚度小于凸起部14的自身高度的平均值。基于此，当该柔性连接器与电路板压合粘接时，得益于胶膜层16的粘接能力，柔性连接器与电路板之间的连接更加稳固，不易松动和脱开；而在压合粘接过程当中，由于胶膜层16具有流动性，因此，之前未穿透胶膜层16的凸起部14，此时全都或部分穿透胶膜层16并且和之前就已经穿透胶膜层16的凸起部14一起与电路板上的焊盘相接触，从而使得第一导电体11或/和第二导电体12与焊盘之间形成可靠的电连接，保证了该柔性连接器在粘接时依然具有良好的导电性能。当然，为了简化工艺，本发明实施例中的胶膜层16是直接形成于柔性连接器的整个表面的，因此，除了凸起部14上，设有凸起部14的第一导电体11或/和第二导电体12所在的绝缘体10的表面也会形成胶膜层16。
优选地，在本发明实施例中，胶膜层16优选压敏胶或热塑性胶，但根据实际应用情况的不同，胶膜层16还可以选用热固性胶等。除上述区别外，本发明实施例的其它具体结构与实施例一中的一致，相应的原理和技术效果也一致，此处不再赘述。
实施例三
本发明实施例提供一种柔性连接器的制作方法，包括以下步骤：
步骤一，制作挠性覆铜板，该挠性覆铜板包括绝缘体和设置在绝缘体相对两个表面的铜箔；
步骤二，采用机械钻孔、激光钻孔或冲压的方式，在挠性覆铜板上形成连接两侧铜箔的连接孔；
步骤三，在连接孔内形成导电介质13，使连接孔具有导电性，与此同时，在挠性覆铜板至少一侧的铜箔的表面形成凸起部14；
步骤四，在挠性覆铜板的两侧表面分别蚀刻形成第一导电体11和第二导电体12；
步骤五，在挠性覆铜板的至少一侧表面形成胶膜层16。
在本发明实施例提供的步骤三当中，在连接孔内形成导电介质13以及在挠性覆铜板至少一侧的铜箔的表面形成凸起部14具体包括：
先通过化学反应，在连接孔的孔壁上沉积一层薄的导电介质13，再采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，增加孔壁上导电介质13的厚度并形成导电孔15，与此同时，在挠性覆铜板至少一侧的铜箔的表面形成凸起部14；
或者先通过化学反应，在连接孔的孔壁上沉积一层薄的导电介质13，再采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，使导电介质13填充满连接孔，与此同时，在挠性覆铜板至少一侧的铜箔的表面形成凸起部14。
上述“薄的导电介质”是相对于后续继续设置导电介质而言，上述形成导电介质13的过程即为现有技术中孔金属化的过程，其中先形成的薄的导电介质13的厚度可以参考现有技术，在此不再赘述。
且步骤三中，采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，在挠性覆铜板至少一侧的铜箔的表面形成凸起部14时，其中采用电镀时可以通过控制电流密度的大小控制所形成的凸起部14的自身高度，一般来讲，在其它条件相同时电流密度越大粗糙度越大即凸起部的自身高度越大，电流密度越小粗糙度越小即凸起部的自身高度越小。同理可以推断在连接孔内设置导电介质时，其电流密度可以相对较小，进而形成较为密实的导电介质13，提高导电的可靠性。采用其他方式时也可以通过操作条件的控制来调整凸起部的自身高度。
在本发明实施例提供的步骤五当中，在挠性覆铜板的至少一侧表面形成胶膜层16具体包括：
在离型膜上涂布胶膜层16，然后通过离型膜将胶膜层16压合转移至挠性覆铜板的至少一侧表面；
或者直接在挠性覆铜板的至少一侧表面涂布胶膜层16。
实施例四
本发明实施例提供一种柔性连接器的制作方法，包括以下步骤：
步骤一，制作挠性覆铜板，该挠性覆铜板包括绝缘体和设置在绝缘体相对两个表面的铜箔；
步骤二，采用机械钻孔、激光钻孔或冲压的方式，在挠性覆铜板上形成连接两侧铜箔的连接孔；
步骤三，在连接孔内形成导电介质13，使连接孔具有导电性；
步骤四，在挠性覆铜板的两侧分别蚀刻铜箔形成若干个第一导电体11和若干个第二导电体12，具体方法与实施例三的步骤四中的描述一致，此处不再赘述；
步骤五，采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，在第一导电体11或/和第二导电体12的表面形成凸起部14；
步骤六，在挠性覆铜板的至少一侧表面形成胶膜层16，具体方法与实施例三的步骤五中的描述一致，此处不再赘述。
在本发明实施例提供的步骤三当中，在连接孔内形成导电介质13具体包括：
先通过化学反应，在连接孔的孔壁上沉积一层薄的导电介质13，再采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，增加孔壁上导电介质13的厚度并形成导电孔15；
或者先通过化学反应，在连接孔的孔壁上沉积一层薄的导电介质13，再采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，使导电介质13填充满连接孔。
上述“薄的导电介质”是相对于后续继续设置导电介质而言，上述形成导电介质13的过程即为现有技术中孔金属化的过程，其中先形成的薄的导电介质13的厚度可以参考现有技术，在此不再赘述。
实施例五
本发明实施例提供一种柔性连接器的制作方法，包括以下步骤：
步骤一，制作挠性覆铜板，该挠性覆铜板包括绝缘体和设置在绝缘体相对两个表面的铜箔；
步骤二，采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，在挠性覆铜板至少一侧的铜箔的表面形成凸起部14；
步骤三，采用机械钻孔、激光钻孔或冲压的方式，在挠性覆铜板上形成连接两侧铜箔的连接孔；
步骤四，在连接孔内形成导电介质13，使连接孔具有导电性；
步骤五，在挠性覆铜板的两侧表面分别蚀刻形成第一导电体11和第二导电体12，具体方法与实施例三的步骤四中的描述一致，此处不再赘述；
步骤六，在挠性覆铜板的至少一侧表面形成胶膜层16，具体方法与实施例三的步骤五中的描述一致，此处不再赘述。
在本发明实施例提供的步骤四当中，在连接孔内形成导电介质13具体包括：
先通过化学反应，在连接孔的孔壁上沉积一层薄的导电介质13，再采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，增加孔壁上导电介质13的厚度并形成导电孔15；
或者先通过化学反应，在连接孔的孔壁上沉积一层薄的导电介质13，再采用电镀、化学镀、物理气相沉积、化学气相沉积等方式中的一种或多种，使导电介质13填充满连接孔。
上述“薄的导电介质”是相对于后续继续设置导电介质而言，上述形成导电介质13的过程即为现有技术中孔金属化的过程，其中先形成的薄的导电介质13的厚度可以参考现有技术，在此不再赘述。
综上，本发明提供了一种柔性连接器，包括绝缘体10，绝缘体10的一侧表面设有若干第一导电体11，绝缘体10的另一侧表面设有若干第二导电体12，绝缘体10上还设有连接第一导电体11与第二导电体12的导电介质13，第一导电体11和第二导电体12的表面设有凸起部14。跟现有技术相比，该柔性连接器导电性能好，使用寿命长，可靠性高，制作成本低，并且可反复拆装。
另外，本发明还提供了上述柔性连接器的制作方法，具有操作简单，易于实现等优点。
上述“薄的导电介质”是相对于后续继续设置导电介质而言，上述形成导电介质13的过程即为现有技术中孔金属化的过程，其中先形成的薄的导电介质13的厚度可以参考现有技术，在此不再赘述。
应当理解的是，本发明中采用术语“第一”、“第二”等来描述各种信息，但这些信息不应限于这些术语，这些术语仅用来将同一类型的信息彼此区分开。例如，在不脱离本发明范围的情况下，“第一”信息也可以被称为“第二”信息，类似的，“第二”信息也可以被称为“第一”信息。
以上所述是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和变形，这些改进和变形也视为本发明的保护范围。

Claims (32)

  1. 一种柔性连接器，其特征在于，包括绝缘体，所述绝缘体的一侧表面设有若干第一导电体，所述绝缘体的另一侧表面设有若干第二导电体，所述绝缘体上还设有连接所述第一导电体与所述第二导电体的导电介质，所述第一导电体或/和所述第二导电体的表面设有凸起部。
  2. 根据权利要求1所述的柔性连接器，其特征在于，所述凸起部为规则或不规则的立体几何状。
  3. 根据权利要求2所述的柔性连接器，其特征在于，所述凸起部的形状为尖角状、倒锥状、颗粒状、树枝状、柱状或块状。
  4. 根据权利要求1所述的柔性连接器，其特征在于，所述凸起部的自身高度为1至30μm。
  5. 根据权利要求1所述的柔性连接器，其特征在于，所述第一导电体或/和所述第二导电体的表面设有两个或两个以上的所述凸起部，各所述凸起部的形状相同或不同，各所述凸起部的尺寸相同或不同，且两个或两个以上的所述凸起部在所述第一导电体或/和所述第二导电体的表面连续或不连续地分布。
  6. 根据权利要求1所述的柔性连接器，其特征在于，所述第一导电体或/和所述第二导电体的表面为粗糙面或平整面。
  7. 根据权利要求1所述的柔性连接器，其特征在于，所述凸起部的材质为铜、镍、锡、铅、铬、钼、锌、金、银中的一种或多种的组合。
  8. 根据权利要求1所述的柔性连接器，其特征在于，所述绝缘体的至少一侧表面或/和所述凸起部上设有胶膜层，所述凸起部隐藏于所述胶膜层内或穿透所述胶膜层并暴露出来。
  9. 根据权利要求1所述的柔性连接器，其特征在于，所述绝缘体上设有连接所述第一导电体与所述第二导电体的连接孔，所述导电介质设于所述连接孔内。
  10. 据权利要求9所述的柔性连接器，其特征在于，所述导电介质填充满所述连接孔，或所述导电介质附着于所述连接孔的孔壁上并形成导电孔。
  11. 根据权利要求9所述的柔性连接器，其特征在于，所述第一导电体设为两个或两个以上，且各所述第一导电体相互独立，所述第二导电体设为两个或两个以上，且各所述第二导电体相互独立，所述第二导电体与所述第一导电体数量相等，各所述第一导电体分别通过不同所述连接孔内的所述导电介质与各所述第二导电体一一对应连接。
  12. 根据权利要求9所述的柔性连接器，其特征在于，所述第一导电体设为两个或两个以上，且各所述第一导电体相互独立，所述第二导电体设为两个或两个以上，且各所述第二导电体相互独立，所述第一导电体的数量多于所述第二导电体的数量，至少两个所述第一导电体分别通过不同所述连接孔内的所述导电介质与同一个所述第二导电体相连接，其余各所述第一导电体分别通过不同所述连接孔内的所述导电介质与其余各所述第二导电体一一对应连接。
  13. 根据权利要求9所述的柔性连接器，其特征在于，所述第一导电体设为两个以上，且各所述第一导电体相互独立，所述第二导电体设为两个以上，且各所述第二导电体相互独立，至少两个所述第一导电体分别通过不同所述连接孔内的所述导电介质与同一个所述第二导电体相连接，至少两个所述第二导电体分别通过不同所述连接孔内的所述导电介质与同一个所述第一导电体相连接。
  14. 根据权利要求9所述的柔性连接器，其特征在于，所述第一导电体设为两个以上，且各所述第一导电体相互独立，所述第二导电体设为两个以上，且各所述第二导电体相互独立，一部分所述第一导电体中的至少两个所述第一导电体分别通过不同所述连接孔内的所述导电介质与一部分所述第二导电体中的同一个所述第二导电体相连接，另一部分所述第二导电体中的至少两个所述第二导电体分别通过不同所述连接孔内的所述导电介质与另一部分所述第一导电体中的同一个所述第一导电体相连接，其余各所述第一导电体分别通过不同所述连接孔内的所述导电介质与其余各所述第二导电体一一对应连接。
  15. 根据权利要求9所述的柔性连接器，其特征在于，所述第一导电体和与其相连接的所述第二导电体之间设有两个或两个以上的所述连接孔。
  16. 根据权利要求1所述的柔性连接器，其特征在于，所述绝缘体的材质为聚酰亚胺、热塑性聚酰亚胺、改性环氧树脂、改性丙烯酸树脂、聚对苯二甲酸乙二醇酯、聚对苯二甲酸丁二醇酯、聚乙烯、聚萘二甲酸乙二醇酯、聚苯烯、聚氯乙烯、聚砜、聚苯硫醚、聚醚醚酮、聚苯醚、聚四氟乙烯、液晶聚合物、聚乙二酰脲中的一种或多种的组合。
  17. 根据权利要求1至16中任一项所述的柔性连接器，其特征在于，所述绝缘体为柔性绝缘体，所述第一导电体和所述第二导电体设置在所述绝缘体的相对的两个所述侧面上，所述凸起部为镀覆凸起部。
  18. 根据权利要求8所述的柔性连接器，其特征在于，所述凸起部隐藏于所述胶膜层内，所述胶膜层的厚度小于所述凸起部的自身高度的平均值。
  19. 一种柔性连接器的制作方法，其特征在于，包括以下步骤：
    制作挠性覆铜板，所述挠性覆铜板包括绝缘体和设置在所述绝缘体相对两个表面的铜箔；
    在所述挠性覆铜板上形成连接孔；
    在所述连接孔内形成导电介质，使所述连接孔具有导电性，与此同时，在所述挠性覆铜板至少一侧的所述铜箔的表面形成凸起部；
    在所述挠性覆铜板的两侧分别蚀刻形成第一导电体和第二导电体。
  20. 根据权利要求19所述的制作方法，其特征在于，采用机械钻孔、激光钻孔或冲压的方式，在所述挠性覆铜板上形成连接两侧铜箔的所述连接孔。
  21. 根据权利要求19所述的制作方法，其特征在于，在所述连接孔内形成所述导电介质以及在所述挠性覆铜板至少一侧的铜箔的表面形成所述凸起部具体包括：
    先通过化学反应，在所述连接孔的孔壁上沉积一层薄的导电介质，再采用电镀、化学镀、物理气相沉积、化学气相沉积方式中的一种或多种，增加所述孔壁上所述导电介质的厚度并形成导电孔，与此同时，在所述挠性覆铜板至少一侧的铜箔的表面形成所述凸起部；
    或者先通过化学反应，在所述连接孔的孔壁上沉积一层薄的导电介质，再采用电镀、化学镀、物理气相沉积、化学气相沉积方式中的一种或多种，使所述导电介质填充满所述连接孔，与此同时，在所述挠性覆铜板至少一侧的铜箔的表面形成所述凸起部。
  22. 根据权利要求19所述的制作方法，其特征在于，在所述挠性覆铜板的两侧分别蚀刻形成所述第一导电体和所述第二导电体之后，还包括步骤：在所述挠性覆铜板的至少一侧表面形成胶膜层，具体包括：
    在离型膜上涂布所述胶膜层，然后通过所述离型膜将所述胶膜层压合转移至所述挠性覆铜板的至少一侧表面；
    或者直接在所述挠性覆铜板的至少一侧表面涂布所述胶膜层。
  23. 一种柔性连接器的制作方法，其特征在于，包括以下步骤：
    制作挠性覆铜板，所述挠性覆铜板包括绝缘体和设置在所述绝缘体相对两个表面的铜箔；
    在所述挠性覆铜板上形成连接孔；
    在所述连接孔内形成导电介质，使所述连接孔具有导电性；
    在所述挠性覆铜板的两侧分别蚀刻铜箔形成若干个第一导电体和若干个第二导电体；
    在所述第一导电体或/和所述第二导电体的表面形成凸起部。
  24. 根据权利要求23所述的制作方法，其特征在于，采用机械钻孔、激光钻孔或冲压的方式，在所述挠性覆铜板上形成连接两侧铜箔的所述连接孔。
  25. 根据权利要求23所述的制作方法，其特征在于，在所述连接孔内形成导电介质具体包括：
    先通过化学反应，在所述连接孔的孔壁上沉积一层薄的所述导电介质，再采用电镀、化学镀、物理气相沉积、化学气相沉积方式中的一种或多种，增加所述孔壁上所述导电介质的厚度并形成导电孔；
    或者先通过化学反应，在所述连接孔的孔壁上沉积一层薄的导电介质，再采用电镀、化学镀、物理气相沉积、化学气相沉积方式中的一种或多种，使所述导电介质填充满所 述连接孔。
  26. 根据权利要求23所述的制作方法，其特征在于，采用电镀、化学镀、物理气相沉积、化学气相沉积方式中的一种或多种，在所述第一导电体或/和所述第二导电体的表面形成所述凸起部。
  27. 根据权利要求23所述的制作方法，其特征在于，在所述第一导电体或/和所述第二导电体的表面形成所述凸起部之后，还包括步骤：在所述挠性覆铜板的至少一侧表面形成胶膜层，具体包括：
    在离型膜上涂布所述胶膜层，然后通过所述离型膜将所述胶膜层压合转移至所述挠性覆铜板的至少一侧表面；
    或者直接在所述挠性覆铜板的至少一侧表面涂布所述胶膜层。
  28. 一种柔性连接器的制作方法，其特征在于，包括以下步骤：
    制作挠性覆铜板，所述挠性覆铜板包括绝缘体和设置在所述绝缘体相对两个表面的铜箔；
    在所述挠性覆铜板至少一侧的所述铜箔的表面形成凸起部；
    在所述挠性覆铜板上形成连接孔；
    在所述连接孔内形成导电介质，使所述连接孔具有导电性；
    在所述挠性覆铜板的两侧分别蚀刻形成第一导电体和第二导电体。
  29. 根据权利要求28所述的制作方法，其特征在于，采用电镀、化学镀、物理气相沉积、化学气相沉积方式中的一种或多种，在所述挠性覆铜板至少一侧的铜箔的表面形成所述凸起部。
  30. 根据权利要求28所述的制作方法，其特征在于，采用机械钻孔、激光钻孔或冲压的方式，在所述挠性覆铜板上形成连接两侧铜箔的所述连接孔。
  31. 根据权利要求28所述的制作方法，其特征在于，在所述连接孔内形成导电介质具体包括：
    先通过化学反应，在所述连接孔的孔壁上沉积一层薄的导电介质，再采用电镀、化学镀、物理气相沉积、化学气相沉积方式中的一种或多种，增加所述孔壁上所述导电介质的厚度并形成导电孔；
    或者先通过化学反应，在所述连接孔的孔壁上沉积一层薄的导电介质，再采用电镀、化学镀、物理气相沉积、化学气相沉积方式中的一种或多种，使所述导电介质填充满所述连接孔。
  32. 根据权利要求28所述的制作方法，其特征在于，在所述挠性覆铜板的两侧分别蚀刻形成第一导电体和第二导电体之后，还包括步骤：在挠性覆铜板的至少一侧表面形成胶膜层，具体包括：
    在离型膜上涂布所述胶膜层，然后通过所述离型膜将所述胶膜层压合转移至所述挠性覆铜板的至少一侧表面；
    或者直接在所述挠性覆铜板的至少一侧表面涂布所述胶膜层。
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