WO2020036228A1 - 間仕切用パネル、間仕切壁および部屋構造 - Google Patents
間仕切用パネル、間仕切壁および部屋構造 Download PDFInfo
- Publication number
- WO2020036228A1 WO2020036228A1 PCT/JP2019/032175 JP2019032175W WO2020036228A1 WO 2020036228 A1 WO2020036228 A1 WO 2020036228A1 JP 2019032175 W JP2019032175 W JP 2019032175W WO 2020036228 A1 WO2020036228 A1 WO 2020036228A1
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- WIPO (PCT)
- Prior art keywords
- board layer
- inorganic
- partition
- organic heat
- heat insulating
- Prior art date
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Images
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B2/00—Walls, e.g. partitions, for buildings; Wall construction with regard to insulation; Connections specially adapted to walls
- E04B2/74—Removable non-load-bearing partitions; Partitions with a free upper edge
- E04B2/7401—Removable non-load-bearing partitions; Partitions with a free upper edge assembled using panels without a frame or supporting posts, with or without upper or lower edge locating rails
- E04B2/7403—Removable non-load-bearing partitions; Partitions with a free upper edge assembled using panels without a frame or supporting posts, with or without upper or lower edge locating rails with special measures for sound or thermal insulation including fire protection
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/62—Insulation or other protection; Elements or use of specified material therefor
- E04B1/92—Protection against other undesired influences or dangers
- E04B1/94—Protection against other undesired influences or dangers against fire
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/62—Insulation or other protection; Elements or use of specified material therefor
- E04B1/92—Protection against other undesired influences or dangers
- E04B1/94—Protection against other undesired influences or dangers against fire
- E04B1/941—Building elements specially adapted therefor
- E04B1/942—Building elements specially adapted therefor slab-shaped
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B2/00—Walls, e.g. partitions, for buildings; Wall construction with regard to insulation; Connections specially adapted to walls
- E04B2/74—Removable non-load-bearing partitions; Partitions with a free upper edge
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B2/00—Walls, e.g. partitions, for buildings; Wall construction with regard to insulation; Connections specially adapted to walls
- E04B2/74—Removable non-load-bearing partitions; Partitions with a free upper edge
- E04B2/82—Removable non-load-bearing partitions; Partitions with a free upper edge characterised by the manner in which edges are connected to the building; Means therefor; Special details of easily-removable partitions as far as related to the connection with other parts of the building
Definitions
- the present invention relates to a partition panel, a partition wall, and a room structure.
- Patent Document 3 proposes a heat-insulating fire-resistant sandwich panel in which an organic heat-insulating board layer and an inorganic board layer are laminated and bonded between a front material and a back material made of a metal material.
- an object of the present invention is to provide a partition panel having both high fire resistance and heat insulation, and a partition wall and a room structure using the panel in a long length.
- the inorganic board layer is composed of a plurality of inorganic boards adjacent to each other in the in-plane direction, and the plurality of inorganic boards are connected to each other by an outer surface direction, an in-plane direction, or an out-of-plane direction and a surface.
- the partition panel according to any one of [1] to [6], wherein the partition panel is fixed to each other with respect to inward movement.
- a vertical partition wall spanned between floors of a building and fixed at upper and lower ends thereof, A partition wall, wherein a plurality of partition panels according to any one of [1] to [9] are arranged adjacent to each other in the width direction.
- partition panel The upper and lower ends of the partition panel are restrained in the out-of-plane direction of the partition panel by mounting members fixed to the frame of the building.
- the partition wall according to any one of [10] to [12], wherein the partition wall is fixed by being fastened to the front surface material and the back surface material so as not to penetrate a board layer.
- the present invention it is possible to provide a partition panel having both high fire resistance and heat insulation, and a partition wall and a room structure using the panel in a long length.
- FIG. 1A shows an overall view of an example of a partition panel according to the present invention
- FIG. 1B shows a part of a cross-sectional view in the width direction.
- the partitioning panel 1 shown in FIG. 1A includes a front material 11 and a back material 12 made of a metal material, and two organic heat insulating board layers 13 and 14 disposed between the front material 11 and the back material 12. And an inorganic board layer 15 sandwiched between the two organic heat insulating board layers 13 and 14.
- thermosetting resin As the thermosetting resin, a polyurethane resin, an isocyanurate resin, a phenol resin, or the like can be used. Above all, it is preferable to use a phenol resin as the thermosetting resin because of its high flame retardancy, and it is more preferable to select a resin having expandability when heated and carbonized.
- a polyester nonwoven fabric, a polypropylene nonwoven fabric, an aluminum foil, a nonflammable processed paper, a combination of these materials, and the like can be used.
- the organic heat-insulating board layers 13 and 14 When bonding the organic heat-insulating board layers 13 and 14 to the inorganic board layer 15 via the surface material, make sure that the organic heat-insulating board layers 13 and 14 do not fall off the surface of the inorganic board layer 15 for a long time during the fire resistance test. It is important. Therefore, it is most advantageous in terms of fire resistance to use non-combustible face materials and heat-resistant adhesives.However, since these are all expensive, even when organic face materials are used as long as fire resistance is not impaired. Good.
- polyester nonwoven fabrics are preferable because they have performances that combine price, heat resistance, and moisture permeability.
- the organic heat insulating board layers 13 and 14 can be appropriately set according to the design of the partition panel 1. As shown in FIG. 2A, the organic heat insulating board layers 13 and 14 can be configured by arranging a plurality of organic heat insulating boards 13 b (14 b) in the length direction. To match the length. Further, the organic heat insulating board layers 13 and 14 can be configured by arranging a plurality of organic heat insulating boards 13b (14b) in the width direction, and the width exceeding the width of the panel 1 can be cut to match the width. . As described above, the organic heat insulating board layers 13 and 14 can be constituted by a plurality of organic heat insulating boards 13b (14b) adjacent in the in-plane direction.
- the organic adhesive becomes The adjacent organic heat insulating board 13b (with 14) enters the gap and is firmly fixed, so that the strength performance of the panel 1 can be improved.
- the organic heat insulating board 13b (14b) is thin, it is possible to obtain a strength which is not much different from the case where an adhesive is applied to the entire surface of the fore edge and bonded.
- the organic heat insulating board 13b (14b) is composed of the above-described resin foam and surface material, and the small openings of the adjacent organic heat insulating boards 13b (14b) are bonded, an adhesive is applied to the small surface to apply the organic heat insulating board.
- the boards 13b (14b) are pressed together.
- the resin foam portion is compressed because it has elasticity, whereas the face material has no elasticity, so that the face material near the fore-edge surface becomes excessive, and the adhesion of the fore-edge surface is reduced.
- the adhesiveness between the organic heat insulating boards 13b (14b) decreases.
- the resin foam 13d has elasticity, by pressing the organic heat insulating boards 13b (14b) together, the flatness of the fore-edge surface itself and the dimensional error due to the removal of the corners are absorbed. be able to.
- the front surface material 11 (the back surface material 12) and the organic heat insulating board layer 13 (14) are adhered by an organic adhesive.
- the organic adhesive burns at about 250 to 400 ° C. to lose the adhesiveness, and the surface material 11 (the back material 12) and the organic heat insulating board The layer 13 (14) can be peeled off favorably.
- the organic heat-insulating board layers 13 and 14, the inorganic board layer 15, and the backing material 12 do not follow the deformation of the surface material 11, and these may be greatly deformed and cracked, or peeling between materials or inside the material may occur.
- Such a material can be prevented from being generated, the integrity and flatness of these materials can be maintained, and fire resistance can be exhibited.
- the organic adhesive is not particularly limited as long as the surface material 11 (the back surface material 12) burns in the early stage of heating and loses its function as an adhesive.
- organic adhesives include urethane resin (main component: urethane resin, solvent: esters, ketones), epoxy resin (main component: epoxy resin (main component), modified polyamine (curing agent), modified polythiol, Solvents: esters, ketones, alcohols, vinyl acetate resin (main component: vinyl acetate resin, solvent: alcohols, esters, ketones), and modified silicones can be used. Above all, it is preferable to use a urethane resin-based or epoxy resin-based adhesive as the organic adhesive because it is suitable for use at low temperatures.
- the inorganic board layer 15 is an important layer for exhibiting fire resistance as a panel, and can be made of lightweight cellular concrete, gypsum board, scallop board, or the like.
- the inorganic board layer 15 is preferably made of lightweight cellular concrete.
- Light-weight aerated concrete is preferably of a specific gravity of about 0.5, which is reinforced with a metal mat or metal lath (steel wire mesh) that has been cured at high temperature and high pressure and the inside of which has been specially treated for rust prevention, and a specific gravity of about 0.35.
- the heat insulating property and the lightness are further excellent and preferred.
- metal laths and reinforced mats can be easily disposed inside lightweight aerated concrete due to the characteristics of the manufacturing method.
- the dimensions of the inorganic board layer 15 can be appropriately set according to the design of the partition panel 1. As shown in FIG. 2C, the inorganic board layer 15 can be configured by arranging a plurality of inorganic boards 15a in the length direction, and the length exceeding the length of the panel 1 can be cut to match the length. it can. Further, the inorganic board layer 15 can be configured by arranging a plurality of inorganic boards 15a in the width direction, and the width exceeding the width of the panel 1 can be cut and the width can be adjusted. As described above, the inorganic board layer 15 can be composed of a plurality of inorganic boards 15a adjacent in the in-plane direction.
- the inorganic board layer 15 is composed of a plurality of inorganic boards 15a
- the small faces of the plurality of inorganic boards 15a are bonded to each other with a fire-resistant adhesive, or a thermally expandable sheet is provided between the small faces of the plurality of inorganic boards 15a. It is possible to load materials, fix the plurality of inorganic boards 15a to each other with respect to the movement in the out-of-plane direction, the in-plane direction, or the out-of-plane direction and the in-plane direction by connecting metal fittings, or use these means together. preferable.
- the amount of the applied adhesive is the surface material 11 (12). and is preferably 100 ⁇ 300g / m 2 between the organic insulation board layer 13 (14), the organic insulation board layers 13, 14 mutual is preferably 100 ⁇ 300g / m 2, the organic insulation board layer 13 (14)
- the space between the inorganic board layer 15 and the inorganic board layer 15 is preferably 200 to 500 g / m 2 .
- the primer By applying the primer, not only the same adhesive strength can be obtained even if the amount of the adhesive applied is reduced by that amount, but also the labor of cleaning dust and the like on the surface of the inorganic board layer 15 can be eliminated, and the inorganic board It is possible to make the layer 15 less susceptible to the effect of the water content and to reduce the variation in the adhesive strength. Furthermore, the overall material costs associated with bonding can be reduced.
- the thickness of the inorganic board layer 15 is relatively small, when the inorganic board layer 15 and the organic heat insulating board layers 13 and 14 are adhered to each other using an adhesive as described above, when the board is placed in a high-temperature environment due to a fire or the like. May not be able to maintain adhesion. In such a case, if the organic heat-insulating board layer 14 and the inorganic board layer 15 on the non-heating side are mechanically fixed, even after the adhesion between the organic heat-insulating board layer 14 and the inorganic board layer 15 on the non-heating side is broken. In addition, the fire resistance can be maintained without the inorganic board layer 15 falling off immediately.
- the organic heat insulating board layer 13 and the inorganic board layer 15 are used as the heating side.
- the heating side becomes the non-heating side. Also need to be mechanically fixed.
- the area of the cross section orthogonal to the axial direction of the head of the anchor material A is important, but in order to support its own weight acting in the vertical direction, the axial cross section of the anchor material A must be
- the area in contact with the organic heat insulating board layer 13 (14) is important. In this case, it is preferable to use a shaft having a diameter of about 5 to 8 ⁇ .
- the screw V it can be considered in the same way as the above-mentioned anchor material A, but if the portion arranged on the organic heat insulating board layer 13 (14) is left linear without providing a screw, the vertical direction Is more preferable. Further, it is preferable that the shape of the head of the screw V be not only an area perpendicular to the axial direction but also a flat head or a pan shape so as to increase the sectional area in the axial direction.
- the organic heat insulating board layer 13 (14) has a single-layer structure, that is, when only one organic heat insulating board layer 13 (14) is used on one side of the inorganic board layer 15, It is necessary to slightly sink the entire head so as not to come into contact with the back material 12, but in this case, it is more preferable that the screw V sinks together with the face material as a flat head.
- the thermally expandable sheet material 21 is filled between the small faces of the inorganic board layer 15.
- the screw head and the back material 12 may be bonded with an adhesive. Vertical displacement and rotation are less likely to occur, and the vertical proof stress is improved.
- the pressing at the time of bonding the back material 12 and the organic heat insulating board layer 14 causes deformation of the organic heat insulating board layer 14 due to the pressing pressure, the amount by which the screw head is submerged is determined in consideration of this. It is preferable to decide.
- a pan-head screw having a shaft diameter of about 4 to 7 ⁇ , a head diameter of about 9 to 15 ⁇ , and a head thickness of about 4 to 9mm. It is preferable to use one having a diameter of 4 to 6 ⁇ , a head diameter of 9 to 15 ⁇ , and a head angle of about 30 to 60 °.
- the anchor material A and the screw V are hit from both the surface material 11 side and the back material 12 side, but are preferably hit at a distance of 1.5 times or more the thickness of the inorganic board layer so that they do not interfere with each other. It is more preferable to hit at least two times apart. Note that the use of the screw V does not cause damage due to the impact on the inorganic board layer 15 at the time of driving, and is preferable when it is desired to reduce the interval between the anchor material A and the screw V.
- the means for the partition wall constituted by the partition panel 1 (see the partition wall 2 according to the present invention shown in FIGS. 4A and 4B) to pass the fire resistance test by heating for 1 hour and trailing for 3 hours. explain.
- the partition wall 2 is heated from the side of the surface material 11, the surface material 11 is greatly deformed in the early stage of heating, and the organic heat insulating board layer 13 on the heating side disappears after being carbonized during the heating time of one hour. Thereafter, it is necessary to prevent the penetration of flame or heat without breaking the positional relationship of the three layers of the inorganic board layer 15, the non-heating side organic heat insulating board layer 14, and the backing material 12 to the last.
- the upper mounting member 24c and the lower mounting member 25c a stainless steel plate or a hot-dip galvanized steel plate is used, and is designed in consideration of an assumed seismic force and deformation due to heat at the time of a fire.
- the lower mounting member 25c has a thickness of 2 to 6 mm, a cross section of about 40 to 100 mm in the vertical direction, and a cross section of about 30 to 60 mm in the horizontal direction. Often used.
- the lengths of the upper mounting material 24c and the lower mounting material 25c are designed according to the construction method, but are about 1.8 to 5.4 m on one side during construction, and 0.1 mm on the other side. It is convenient to use a piece having a length of up to about 0.9 m, since it is possible to construct a long one first and then hold the short one so as not to fall down.
- the hole of the upper attachment material 24c through which the upper fastening material 24a penetrates must not have a large play in the vertical direction, and may have a round hole or a long diameter. Is preferably about 10 to 20 mm.
- the through hole of the lower fastening member 25a provided in the lower mounting member 25c may be a round hole, but the major diameter should be about 20 to 40 mm in order to absorb the displacement generated in the wall material due to the above-mentioned vertical weight. Is preferred.
- one organic heat insulating board layer 13 is disposed on both sides of the inorganic board layer 15, and when fixing the organic heat insulating board layers 13 and 14 to the inorganic board layer 15, an anchor is used.
- the heads of the material A and the screw V come into contact with the front surface material 11 and the back surface material 12 made of a metal material. Therefore, it is preferable to provide concave portions for accommodating the heads of the anchor material A and the screw V on the surface of the organic heat insulating board layers 13 and 14 on the surface material 11 and the back material 12 side.
- the concave portion is provided in advance. No need.
- the heat-expandable sheet material 21 does not necessarily need to be loaded over the entire thickness of the inorganic board layer 15, and is determined in consideration of the assumed gap between the inorganic board layers 15 and the expansion coefficient of the heat-expandable sheet material 21.
- the thickness is preferably 1 to 3 mm, and the width is preferably about 15 to 50 mm.
- a sealing material 28 is cast at joints between the panels 1.
- a lower portion of the partition wall 2 is fixed to the floor slab 23 via a lower attachment member 25c by a lower fastening member 25a and a lower anchor member 25b.
- the upper part of the partition wall 2 is similarly fixed to the floor slab 22 via an upper attachment member 24c by an upper fastening member 24a and an upper anchor member 24b.
- the joint between the partition wall 2 and the floor slab 22 is filled with an upper joint material 26, and the joint between the partition wall 2 and the floor slab 23 is filled with a lower joint material 27. .
- the upper anchor member 24b and the lower anchor member 25b those that withstand the inertial force of about 1 G that acts during an earthquake, which is the design load of a normal partition wall, are generally selected.
- the required number of concrete anchor members having a length of about 30 to 70 mm are arranged according to the proof stress that can be borne.
- the same material as the thermally expandable sheet material used for the joint when a plurality of the inorganic board layers 15 are arranged can be used. .
- FIG. 6 shows an example of the joint structure between the panels 1.
- the front surface material 11 (the back surface material 12) is bent once along the side wall that partitions the concave portion 13 a (14 a) of the organic heat insulating board layer 13 (14), and the first bent portion is formed.
- 11a and 12a are formed, and a sealing material 28 is filled between the adjacent first bent portions 11a.
- the front surface material 11 (the back surface material 12) is bent twice along the side wall and the bottom surface that define the concave portion 13a (14a) of the organic heat insulating board layer 13 (14).
- First bent portions 11a and 12a and second bent portions 11b and 12b are formed.
- the second bent portion 11b (12b) does not need to be formed over the entire length of the panel 1.
- the second bent portion 11b (12b) is fixed to the first bent portions 11a and 12a at intervals of about 300 to 1500 mm by a method such as riveting or welding. May be.
- the portions of the front surface material 11 (the back surface material 12) to be laminated with each other are connected by screws V at intervals of about 300 to 1500 mm, and the sealing material 28 is filled between the adjacent first bent portions 11a. .
- a bond breaker 29 is provided outside the surface of the second bent portion 11b (12b) to prevent the sealing material 28 from bonding on three sides. It is also possible to use a foamed resin backup material in place of the bond breaker 29, but these materials have a property of shrinking around 180 + atmospheric temperature, which is the specified value of the back surface temperature in the fire resistance test. Care must be taken because there is a possibility that the sealing may be cut off from the bottom side of the ceiling on the side opposite to the heating and the fire resistance may be reduced.
- FIG. 6C shows a preferred embodiment of the joint structure shown in FIG. 6B.
- both of the second bent portions 11b and 12b of one of the adjacent partition panels are connected to the organic heat insulating board layers 13 and 14. Located on the side.
- the second bent portion 11bi of the surface material 11 of 1a of the adjacent partition panels 1a and 1b is arranged on the organic heat insulating board layer 13 side.
- the second bent portion 11bo of the other adjacent partitioning panel 1b is arranged on the screw V side.
- the second bent portion 12bo of the back material 12 of the partition panel 1a is disposed on the screw V side, and the second bent portion 12bi of the other partition panel 1b is disposed on the organic heat insulating board layer 14 side.
- FIG. 7 shows an example of a room structure according to the present invention.
- the inside of a building composed of a roof 31, a floor 32 and an outer wall 33 is partitioned by the above-described partition wall 2 according to the present invention, and a high position is provided at an intermediate position of the partition wall 2.
- the ceiling material 34a (35a), the partition wall 2, the ceiling material 34a (35a), the wall material 34c (35c), and the floor material 34b (35b) are connected to at least one of the partition walls 2.
- the room 34 (35) is partitioned by a floor member 34b (35b) and a wall member 34c (35c) having high heat insulation, and a partition wall 2 and a ceiling member 34a (35a).
- the room 34 (35) is, for example, a refrigerator-freezer.
- the partition wall 2 having both high heat insulation and high heat resistance constitutes a part of the wall of the room 34 (35).
- the wall member 34c (35c) there is no gap between the wall member 34c (35c) and the partition wall 2 as in the conventional room structure 30.
- dew condensation hardly occurs on the partition wall 2, and damage caused by mold and insects can be suppressed.
- the partition wall 2 includes an inorganic board layer 15 having a relatively high thermal conductivity. It is arranged at the center of the wall 2 (partitioning panel 1), and the organic heat insulation board layers 13 and 14 having relatively low thermal conductivity are arranged outside. Therefore, the amount of heat transmitted through the surface layer of the panel that passes through the inside and outside of the room 34 (35) is reduced, and a thermal bridge is unlikely to occur.
- the partition wall in which the organic heat insulating board layers 13 and 14 and the inorganic board layer 15 are exchanged as shown in FIG. 9B is used, the vicinity of the surface layer portion is made of a material that easily conducts heat. Therefore, a thermal bridge larger than the structure of FIG. 9A is generated.
- FIG. 1 A partition panel 1 according to the present invention was produced.
- two coated galvalume steel plates (registered trademark) as the front surface material 11 and the back surface material 12 (dimensions: 3200 mm ⁇ 890 mm, four-circle 10 mm width bent portions, thickness: 0.4 mm), organic heat insulating board layers 13 and 14 Sheets (Neoma foam (registered trademark) manufactured by Asahi Kasei Building Materials Co., Ltd., dimensions: 1820 mm ⁇ 900 mm, thickness 32.5 mm, density: 40 kg / m 3 ), lightweight foam concrete as the inorganic board layer 15
- Each of the sheets power board NEXT manufactured by Asahi Kasei Building Materials Co., Ltd., dimensions: 1820 mm ⁇ 606 mm, thickness: 36 mm, density: 350 kg / m 3 ) was prepared.
- a painted galvalume steel plate (registered trademark), a phenol foam plate, lightweight cellular concrete, a phenol foam plate, and a painted galvalume steel plate (registered trademark) are laminated in this order using a urethane-based adhesive (KU570 manufactured by Konishi Co., Ltd.). Glued.
- the amount of the adhesive to be applied is 150 to 200 g / m 2 between the coated galvalume steel plate (registered trademark) and the phenol foam plate, and 200 to 300 g / m 2 between the lightweight cellular concrete and the phenol foam plate. It was carried out overnight of curing in the state multiplied by the press of m 2. Thus, the partition panel 1 was obtained.
- the carbonized organic heat insulating board layer 13 gradually dropped off from the surface of the inorganic board layer 15.
- the exposed surface of the inorganic board layer 15 was directly affected by heat and dehydration proceeded, and a crack C was generated on the surface of the inorganic board layer 15 as shown in FIG.
- the inorganic board 15a only needs to be partially carbonized, and a partially carbonized portion P is also formed on the non-heating-side organic heat insulating board layer 14 as shown in FIG. This was enough for the fire resistance performance as a whole.
- the back surface temperature gradually increases after the start of heating, and does not reach 100 ° C. even after one hour from the start of heating.
- the temperature rises for a certain period of time, and rises to a maximum of about 120 ° C. After that, the temperature gradually decreased, and it was found that the temperature dropped to about 70 ° C. 3 hours after the heating was stopped.
- the backside temperature was maintained at a maximum below 180 ° C. + ambient temperature (25 ° C.), and the average temperature was below 140 ° C. + ambient temperature (25 ° C.).
- the present invention it is possible to provide a partition panel having high fire resistance and heat resistance, and a partition wall and a room structure using the panel in a long length.
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Abstract
Description
前記表面材と前記裏面材との間に配置された、複数枚の有機断熱ボード層と該複数枚の有機断熱ボード層との間に挟まれた無機ボード層とを有し、
前記複数枚の有機断熱ボード層のうちの前記表面材に隣接するものと前記表面材、および前記複数枚の有機断熱ボード層のうちの前記裏面材に隣接するものと前記裏面材とが、それぞれ有機系接着剤により接着されていることを特徴とする間仕切用パネル。
前記[1]~[9]のいずれか一項に記載の間仕切用パネルが複数枚幅方向に隣接して配置されてなることを特徴とする間仕切壁。
以下、図面を参照して本発明の実施形態について説明する。図1Aは、本発明による間仕切用パネルの一例の全体図を示しており、図1Bは幅方向断面図の一部を示している。図1Aに示した間仕切用パネル1は、金属材からなる表面材11および裏面材12と、表面材11と裏面材12との間に配置された、2枚の有機断熱ボード層13、14と該2枚の有機断熱ボード層13、14との間に挟まれた無機ボード層15とを有する。ここで、上記2枚の有機断熱ボード層の一方13と表面材11、および上記2枚の有機断熱ボード層の他方14と裏面材12とが、それぞれ有機系接着剤により接着されており、上記2枚の有機断熱ボード層13、14の各々を構成する樹脂が熱硬化性樹脂からなることを特徴とする。
表面材11および裏面材12は、加熱された際に有機断熱ボード層13、14から剥離して、加熱側に大きく膨張して変形するように構成されている。表面材11および裏面材12は金属材からなり、金属材をプレス成形、押出成形、ロール成形等によって所定の断面形状に形成したものを使用することができる。金属材としては、例えば、溶融55%アルミニウム-亜鉛めっき鋼板、溶融亜鉛めっき鋼板、塗装溶融55%アルミニウム-亜鉛めっき鋼板(塗装:ポリエステル系樹脂、アクリル系樹脂、シリコン系樹脂、アミノ・アルキド系樹脂、塩化ビニル系樹脂、フッ素系樹脂、エポキシ系樹脂、ウレタン系樹脂)、塗装溶融亜鉛めっき鋼板(塗装:ポリエステル系樹脂、アクリル系樹脂、シリコン系樹脂、アミノ・アルキド系樹脂、塩化ビニル系樹脂、フッ素系樹脂、エポキシ系樹脂、ウレタン系樹脂)、塗装ステンレス鋼板(塗装:ポリエステル系樹脂、アクリル系樹脂、シリコン系樹脂、アミノ・アルキド系樹脂、塩化ビニル系樹脂、フッ素系樹脂、エポキシ系樹脂、ウレタン系樹脂)、塩化ビニル樹脂フィルム張/金属板、高耐候性圧延鋼材(塗装:エポキシ系樹脂、ウレタン系樹脂)、両面ポリエステル樹脂系塗装/溶融アルミニウムめっき鋼板、フェライト系ステンレス鋼板、両面アクリル樹脂系塗装/亜鉛合金板などを用いることができる。なお、前記の金属板の塗装は表面だけでなく有機断熱ボードと接着される面にも施されることが一般的であり、この場合には接着剤の常温時の接着性と加熱時の初期の燃焼性の点から樹脂を選択し、ポリエステル樹脂、ウレタン樹脂およびアクリル樹脂などを用いることが好ましい。
有機断熱ボード層13、14は間仕切壁に断熱性を持たせるための層であり、有機断熱ボード層13、14は、無機ボード層15を厚くして裏面側の有機断熱ボード層14の温度が上昇しないようにしてさらに耐熱性の高いものであれば、材料は限定されない。こうした有機断熱ボード層を構成する樹脂としては、ポリイミド発泡体やPET樹脂発泡体などを用いることができる。ただし、無機ボード層15を極力薄くして軽量化を図る場合には、加熱側の無機ボード層15の被覆効果、非加熱側有機断熱ボード層14の耐熱性の点から、有機断熱ボード層13、14としては、構成する樹脂が熱硬化性樹脂からなる有機断熱ボード層を用いることが好ましい。これにより、表面材11(裏面材12)が加熱された際に、表面材11(裏面材12)と有機断熱ボード層13(14)とが剥離した後、有機断熱ボード層13(14)を無機ボード層15の表面に留めておくことができる。
上記熱硬化性樹脂としては、ポリウレタン樹脂、イソシアヌレート樹脂、フェノール樹脂などを用いることができる。中でも、高い難燃性を有することから、熱硬化性樹脂としてフェノール樹脂を用いることが好ましく、さらに加熱されて炭化する際に膨張性を有するものを選択するとなお好ましい。
また、有機断熱ボード層13、14は、予め表面材11、裏面材12および無機ボード層15を所定間隔の隙間をもって設置した後、当該隙間に有機樹脂材料を注入する方法で構成してもよい。この場合、上記有機樹脂材料を適切に選定すれば、その自己接着力により接着剤を兼用することができる。
本発明においては、表面材11(裏面材12)と有機断熱ボード層13(14)とが有機系接着剤により接着されていることが肝要である。これにより、表面材11(裏面材12)が加熱された際に、250~400℃程度で有機系接着剤が燃焼して接着性が失われ、表面材11(裏面材12)と有機断熱ボード層13(14)とを良好に剥離させることができる。その結果、有機断熱性ボード層13、14、無機ボード層15および裏面材12が表面材11の変形に追随することなく、これらに大きな変形、亀裂が入ったり、材料間もしくは材料内部の剥離が生じたりすることを防ぎ、これらの材料の一体性と平面性が維持され、耐火性を発揮することができる。
無機ボード層15は、パネルとしての耐火性を発揮するために重要な層であり、軽量気泡コンクリート、石膏ボード、ケイカル板などで構成することができる。中でも、無機ボード層15は、軽量気泡コンクリートで構成することが好ましい。軽量気泡コンクリートとしては、高温高圧養生され、内部を特殊防錆処理を施した鉄筋マットやメタルラス(スチール製の金網)で補強した比重0.5程度のものが好ましく、比重0.35程度のものが断熱性および軽量性がさらに優れ好ましい。また、軽量気泡コンクリートは、その製造方法の特徴から内部に容易にメタルラスや鉄筋マットを配置できる。
次に、本発明による間仕切壁について説明する。図4Aは、本発明による間仕切壁の好適な一例の全体図を示している。また、図4Bは、図4Aに示した間仕切壁の鉛直方向断面図を示している。この図に示した間仕切壁2は、建物の階間、すなわち床スラブ22、23との間に架け渡され、その上下端で固定される縦張りの間仕切壁である。間仕切壁2は、床スラブの他に、天井や床に配される耐火被覆された鉄骨梁などに固定してもよい。また、床面にも断熱材を配置する必要のある用途の場合には、該間仕切壁の両面に床スラブ面から断熱材を積み上げた後、該断熱材上にコンクリートを打設して床面として仕上げることも多い。間仕切壁2は、上述した本発明による間仕切用パネル1が複数枚幅方向に隣接して配置されている。
続いて、本発明による部屋構造について説明する。図7は本発明による部屋構造の一例を示している。この図に示した部屋構造3は、屋根31、床32および外壁33で構成された建物の内部が上述した本発明による間仕切壁2によって仕切られており、さらに当該間仕切壁2の中間位置に高断熱性の天井材34a(35a)が接続されることにより、少なくとも当該間仕切壁2の一方に、当該間仕切壁2と当該天井材34a(35a)および壁材34c(35c)、床材34b(35b)により仕切られた部屋34(35)を有している。そして、当該部屋34(35)は、高断熱性の床材34b(35b)および壁材34c(35c)と、間仕切壁2および天井材34a(35a)とで区画されている。上記部屋34(35)は、例えば冷凍冷蔵庫である。
本発明による間仕切用パネル1を作製した。まず、表面材11および裏面材12としての塗装ガルバリウム鋼板(登録商標)を2枚(寸法:3200mm×890mm、四周10mm幅の折り曲げ部付き、厚み:0.4mm)、有機断熱ボード層13、14としてのフェノールフォーム板を4枚(旭化成建材株式会社製ネオマフォーム(登録商標)、寸法:1820mm×900mm、厚み32.5mm、密度:40kg/m3)、無機ボード層15としての軽量気泡コンクリートを3枚(旭化成建材株式会社製パワーボードNEXT、寸法:1820mm×606mm、厚み:36mm、密度350kg/m3)それぞれ用意した。
上述のように用意した発明例1について、建築基準方法に定める方法に則って、間仕切壁耐火1時間の試験を行った。以下、耐火試験における発明例1による間仕切壁2の挙動について説明する。
2,20 間仕切壁
3,30 部屋構造
11 表面材
11a,12a 第一折り曲げ部
11b,12b,11bi,11bo,12bi,12bo 第二折り曲げ部
12 裏面材
13,14 有機断熱ボード層
13a,14a 凹部
13b,14b 有機断熱ボード
13c,14c 面材
13d,14d 樹脂フォーム
15 無機ボード層
15a 無機ボード
16,17 接着剤層
21 熱膨張性シート材
22,23 床スラブ
24a 上部留付材
24b 上部アンカー材
24c 上部取付材
25a 下部留付材
25b 下部アンカー材
25c 下部取付材
26 上部目地材
27 下部目地材
28 シーリング材
29 ボンドブレーカー
31 屋根
32 床
33 外壁
34,35,36,37 部屋
34a,35a,36a,37a 天井材
34b,35b,36b,37b 床材
34c,35c,36c,37c 壁材
A アンカー材
C 亀裂
h アンカー材用長穴
P 部分的炭化部
V ビス
Claims (14)
- 金属材からなる表面材および裏面材と、
前記表面材と前記裏面材との間に配置された、複数枚の有機断熱ボード層と該複数枚の有機断熱ボード層との間に挟まれた無機ボード層とを有し、
前記複数枚の有機断熱ボード層のうちの前記表面材に隣接するものと前記表面材、および前記複数枚の有機断熱ボード層のうちの前記裏面材に隣接するものと前記裏面材とが、それぞれ有機系接着剤により接着されていることを特徴とする間仕切用パネル。 - 前記無機ボード層は軽量気泡コンクリートからなる、請求項1に記載の間仕切用パネル。
- 前記無機ボード層に不燃性の補強材を有する、請求項1または2に記載の間仕切用パネル。
- 前記複数枚の有機断熱ボード層のうちの前記無機ボード層に隣接するものと前記無機ボード層とが機械固定されている、請求項1~3のいずれか一項に記載の間仕切用パネル。
- 前記無機ボード層はその面内方向に隣接する複数枚の無機ボードで構成されており、前記複数枚の無機ボードの小口面が互いに耐火接着剤により接着されている、請求項1~4のいずれか一項に記載の間仕切用パネル。
- 前記無機ボード層はその面内方向に隣接する複数枚の無機ボードで構成されており、前記複数枚の無機ボードの小口面間に熱膨張性シート材が装填されている、請求項1~4のいずれか一項に記載の間仕切用パネル。
- 前記無機ボード層はその面内方向に隣接する複数枚の無機ボードで構成されており、前記複数枚の無機ボードが連結金具によって面外方向、面内方向、または面外方向および面内方向の動きに対して互いに固定されている、請求項1~6のいずれか一項に記載の間仕切用パネル。
- 前記複数枚の有機断熱ボード層の枚数は2枚である、請求項1~7のいずれか一項に記載の間仕切用パネル。
- 前記有機断熱ボード層の各々を構成する樹脂が熱硬化性樹脂からなる、請求項1~8のいずれか一項に記載の間仕切用パネル。
- 建物の階間に架け渡され、その上下端で固定される縦張りの間仕切壁であって、
請求項1~9のいずれか一項に記載の間仕切用パネルが複数枚幅方向に隣接して配置されてなることを特徴とする間仕切壁。 - 前記複数枚の間仕切用パネル間の目地に熱膨張性シート材が充填されている、請求項10に記載の間仕切壁。
- 互いに隣接する間仕切用パネルについて、前記表面材の幅方向端部および前記裏面材の幅方向端部同士がそれぞれ重ね合わされて連結されている、請求項10または11に記載の間仕切壁。
- 前記間仕切用パネルの上下端が前記建物の躯体に固定された取付材により前記間仕切用パネルの面外方向に拘束され、さらに留付材を、前記取付材の穴を介して前記無機ボード層を貫通しないように前記表面材および前記裏面材に締結することによって固定されている、請求項10~12のいずれか一項に記載の間仕切壁。
- 屋根、床および外壁で構成された建物の内部が請求項10~13のいずれか一項に記載の間仕切壁によって仕切られ、さらに当該間仕切壁の中間位置に高断熱性の天井材が接続されることにより、少なくとも当該間仕切壁の一方に、当該間仕切壁と当該天井材および壁材、床材により仕切られた部屋を有し、当該部屋は高断熱性の床材および壁材と、前記間仕切壁および前記天井材とで区画されていることを特徴とする部屋構造。
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