WO2020031941A1 - 封止剤 - Google Patents
封止剤 Download PDFInfo
- Publication number
- WO2020031941A1 WO2020031941A1 PCT/JP2019/030652 JP2019030652W WO2020031941A1 WO 2020031941 A1 WO2020031941 A1 WO 2020031941A1 JP 2019030652 W JP2019030652 W JP 2019030652W WO 2020031941 A1 WO2020031941 A1 WO 2020031941A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sealant
- group
- compound
- resin
- cured product
- Prior art date
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- 239000000565 sealant Substances 0.000 title claims abstract description 95
- -1 oxetane compound Chemical class 0.000 claims abstract description 68
- 150000001875 compounds Chemical class 0.000 claims abstract description 59
- 239000004593 Epoxy Substances 0.000 claims abstract description 45
- 238000000034 method Methods 0.000 claims abstract description 29
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 43
- 125000002723 alicyclic group Chemical group 0.000 claims description 41
- 229920005989 resin Polymers 0.000 claims description 28
- 239000011347 resin Substances 0.000 claims description 28
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 13
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 13
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 13
- 239000003208 petroleum Substances 0.000 claims description 7
- 239000005011 phenolic resin Substances 0.000 claims description 7
- 150000003505 terpenes Chemical class 0.000 claims description 6
- 235000007586 terpenes Nutrition 0.000 claims description 6
- 238000005401 electroluminescence Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000001186 cumulative effect Effects 0.000 abstract 1
- 238000007789 sealing Methods 0.000 description 54
- 239000003795 chemical substances by application Substances 0.000 description 48
- 125000004432 carbon atom Chemical group C* 0.000 description 24
- 239000003822 epoxy resin Substances 0.000 description 17
- 229920000647 polyepoxide Polymers 0.000 description 17
- 239000003505 polymerization initiator Substances 0.000 description 17
- 238000010538 cationic polymerization reaction Methods 0.000 description 16
- 125000003118 aryl group Chemical group 0.000 description 13
- 239000010410 layer Substances 0.000 description 13
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 12
- 150000001925 cycloalkenes Chemical class 0.000 description 12
- 239000000178 monomer Substances 0.000 description 11
- 238000002834 transmittance Methods 0.000 description 8
- 238000001723 curing Methods 0.000 description 7
- 125000003700 epoxy group Chemical group 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- OGMSGZZPTQNTIK-UHFFFAOYSA-N 1-methyl-2-prop-1-en-2-ylbenzene Chemical compound CC(=C)C1=CC=CC=C1C OGMSGZZPTQNTIK-UHFFFAOYSA-N 0.000 description 5
- 239000006087 Silane Coupling Agent Substances 0.000 description 5
- 125000002947 alkylene group Chemical group 0.000 description 5
- 125000005647 linker group Chemical group 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- GRWFGVWFFZKLTI-IUCAKERBSA-N (-)-α-pinene Chemical compound CC1=CC[C@@H]2C(C)(C)[C@H]1C2 GRWFGVWFFZKLTI-IUCAKERBSA-N 0.000 description 4
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 4
- BIDWUUDRRVHZLQ-UHFFFAOYSA-N 3-ethyl-3-(2-ethylhexoxymethyl)oxetane Chemical compound CCCCC(CC)COCC1(CC)COC1 BIDWUUDRRVHZLQ-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 4
- 150000001298 alcohols Chemical class 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 125000004185 ester group Chemical group 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 150000002430 hydrocarbons Chemical group 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229920001568 phenolic resin Polymers 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 125000003368 amide group Chemical group 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 3
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 3
- 238000012663 cationic photopolymerization Methods 0.000 description 3
- ZWAJLVLEBYIOTI-UHFFFAOYSA-N cyclohexene oxide Chemical group C1CCCC2OC21 ZWAJLVLEBYIOTI-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 125000001033 ether group Chemical group 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 125000003566 oxetanyl group Chemical group 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- WTARULDDTDQWMU-RKDXNWHRSA-N (+)-β-pinene Chemical compound C1[C@H]2C(C)(C)[C@@H]1CCC2=C WTARULDDTDQWMU-RKDXNWHRSA-N 0.000 description 2
- WTARULDDTDQWMU-IUCAKERBSA-N (-)-Nopinene Natural products C1[C@@H]2C(C)(C)[C@H]1CCC2=C WTARULDDTDQWMU-IUCAKERBSA-N 0.000 description 2
- 125000005838 1,3-cyclopentylene group Chemical group [H]C1([H])C([H])([H])C([H])([*:2])C([H])([H])C1([H])[*:1] 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 2
- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- KSMGAOMUPSQGTB-UHFFFAOYSA-N 9,10-dibutoxyanthracene Chemical compound C1=CC=C2C(OCCCC)=C(C=CC=C3)C3=C(OCCCC)C2=C1 KSMGAOMUPSQGTB-UHFFFAOYSA-N 0.000 description 2
- GJNKQJAJXSUJBO-UHFFFAOYSA-N 9,10-diethoxyanthracene Chemical compound C1=CC=C2C(OCC)=C(C=CC=C3)C3=C(OCC)C2=C1 GJNKQJAJXSUJBO-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- 125000005118 N-alkylcarbamoyl group Chemical group 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- WTARULDDTDQWMU-UHFFFAOYSA-N Pseudopinene Natural products C1C2C(C)(C)C1CCC2=C WTARULDDTDQWMU-UHFFFAOYSA-N 0.000 description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003377 acid catalyst Substances 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 2
- 125000004448 alkyl carbonyl group Chemical group 0.000 description 2
- XCPQUQHBVVXMRQ-UHFFFAOYSA-N alpha-Fenchene Natural products C1CC2C(=C)CC1C2(C)C XCPQUQHBVVXMRQ-UHFFFAOYSA-N 0.000 description 2
- MVNCAPSFBDBCGF-UHFFFAOYSA-N alpha-pinene Natural products CC1=CCC23C1CC2C3(C)C MVNCAPSFBDBCGF-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 229930006722 beta-pinene Natural products 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 125000005587 carbonate group Chemical group 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- FWFSEYBSWVRWGL-UHFFFAOYSA-N cyclohexene oxide Natural products O=C1CCCC=C1 FWFSEYBSWVRWGL-UHFFFAOYSA-N 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- 239000012954 diazonium Substances 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 125000003709 fluoroalkyl group Chemical group 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- 125000002541 furyl group Chemical group 0.000 description 2
- LCWMKIHBLJLORW-UHFFFAOYSA-N gamma-carene Natural products C1CC(=C)CC2C(C)(C)C21 LCWMKIHBLJLORW-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 2
- 239000003595 mist Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- GRWFGVWFFZKLTI-UHFFFAOYSA-N rac-alpha-Pinene Natural products CC1=CCC2C(C)(C)C1C2 GRWFGVWFFZKLTI-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229960001755 resorcinol Drugs 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 125000004434 sulfur atom Chemical group 0.000 description 2
- QPCMKVGYDGXROK-UHFFFAOYSA-N (10-octanoyloxyanthracen-9-yl) octanoate Chemical compound C(CCCCCCC)(=O)OC=1C2=CC=CC=C2C(=C2C=CC=CC=12)OC(CCCCCCC)=O QPCMKVGYDGXROK-UHFFFAOYSA-N 0.000 description 1
- VLTYTTRXESKBKI-UHFFFAOYSA-N (2,4-dichlorophenyl)-phenylmethanone Chemical compound ClC1=CC(Cl)=CC=C1C(=O)C1=CC=CC=C1 VLTYTTRXESKBKI-UHFFFAOYSA-N 0.000 description 1
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 1
- RSHKWPIEJYAPCL-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1(CC)COC1 RSHKWPIEJYAPCL-UHFFFAOYSA-N 0.000 description 1
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- 125000005837 1,2-cyclopentylene group Chemical group [H]C1([H])C([H])([H])C([H])([*:1])C([H])([*:2])C1([H])[H] 0.000 description 1
- 125000004955 1,4-cyclohexylene group Chemical group [H]C1([H])C([H])([H])C([H])([*:1])C([H])([H])C([H])([H])C1([H])[*:2] 0.000 description 1
- LRTOHSLOFCWHRF-UHFFFAOYSA-N 1-methyl-1h-indene Chemical compound C1=CC=C2C(C)C=CC2=C1 LRTOHSLOFCWHRF-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- DVSDTPMZVLDKRT-UHFFFAOYSA-N 2-[2-[(3-ethyloxetan-3-yl)methoxy]butoxy]ethanol Chemical compound OCCOCC(CC)OCC1(CC)COC1 DVSDTPMZVLDKRT-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- WYYQKWASBLTRIW-UHFFFAOYSA-N 2-trimethoxysilylbenzoic acid Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1C(O)=O WYYQKWASBLTRIW-UHFFFAOYSA-N 0.000 description 1
- FVGDNYRHKDREFL-UHFFFAOYSA-N 3-ethyl-3-(1-phenoxyethoxymethyl)oxetane Chemical compound C=1C=CC=CC=1OC(C)OCC1(CC)COC1 FVGDNYRHKDREFL-UHFFFAOYSA-N 0.000 description 1
- PWGAXPBJOGFFMY-UHFFFAOYSA-N 3-ethyl-3-(2-methylpropoxymethoxymethyl)oxetane Chemical compound CC(C)COCOCC1(CC)COC1 PWGAXPBJOGFFMY-UHFFFAOYSA-N 0.000 description 1
- JCBNYALMACLNBI-UHFFFAOYSA-N 3-ethyl-3-[(3-fluorophenyl)methoxymethyl]oxetane Chemical compound FC1=CC(=CC=C1)COCC1(COC1)CC JCBNYALMACLNBI-UHFFFAOYSA-N 0.000 description 1
- PENKVNGNXDMJKV-UHFFFAOYSA-N 3-ethyl-3-[(4-methoxyphenyl)methoxymethyl]oxetane Chemical compound C=1C=C(OC)C=CC=1COCC1(CC)COC1 PENKVNGNXDMJKV-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- WOCGGVRGNIEDSZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical compound C=1C=C(O)C(CC=C)=CC=1C(C)(C)C1=CC=C(O)C(CC=C)=C1 WOCGGVRGNIEDSZ-UHFFFAOYSA-N 0.000 description 1
- GJEZBVHHZQAEDB-UHFFFAOYSA-N 6-oxabicyclo[3.1.0]hexane Chemical compound C1CCC2OC21 GJEZBVHHZQAEDB-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- MPWHGSRLHAMDLG-UHFFFAOYSA-N C(C)C1(OCC1)CCCCCC Chemical compound C(C)C1(OCC1)CCCCCC MPWHGSRLHAMDLG-UHFFFAOYSA-N 0.000 description 1
- CFXPUPHOOWUQRH-UHFFFAOYSA-N C(C1)C2OC2CC1C1CC2OC2CC1 Chemical compound C(C1)C2OC2CC1C1CC2OC2CC1 CFXPUPHOOWUQRH-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- QPJVMBTYPHYUOC-UHFFFAOYSA-N Methyl benzoate Natural products COC(=O)C1=CC=CC=C1 QPJVMBTYPHYUOC-UHFFFAOYSA-N 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910018286 SbF 6 Inorganic materials 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- QROGIFZRVHSFLM-QHHAFSJGSA-N [(e)-prop-1-enyl]benzene Chemical compound C\C=C\C1=CC=CC=C1 QROGIFZRVHSFLM-QHHAFSJGSA-N 0.000 description 1
- DBHQYYNDKZDVTN-UHFFFAOYSA-N [4-(4-methylphenyl)sulfanylphenyl]-phenylmethanone Chemical compound C1=CC(C)=CC=C1SC1=CC=C(C(=O)C=2C=CC=CC=2)C=C1 DBHQYYNDKZDVTN-UHFFFAOYSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229920006271 aliphatic hydrocarbon resin Polymers 0.000 description 1
- 125000005529 alkyleneoxy group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 150000001450 anions Chemical group 0.000 description 1
- 229920006272 aromatic hydrocarbon resin Polymers 0.000 description 1
- 125000000732 arylene group Chemical group 0.000 description 1
- CIZVQWNPBGYCGK-UHFFFAOYSA-N benzenediazonium Chemical compound N#[N+]C1=CC=CC=C1 CIZVQWNPBGYCGK-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- UENWRTRMUIOCKN-UHFFFAOYSA-N benzyl thiol Chemical class SCC1=CC=CC=C1 UENWRTRMUIOCKN-UHFFFAOYSA-N 0.000 description 1
- AENNXXRRACDJAY-UHFFFAOYSA-N bis(2-dodecylphenyl)iodanium Chemical compound CCCCCCCCCCCCC1=CC=CC=C1[I+]C1=CC=CC=C1CCCCCCCCCCCC AENNXXRRACDJAY-UHFFFAOYSA-N 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000005708 carbonyloxy group Chemical group [*:2]OC([*:1])=O 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 125000002993 cycloalkylene group Chemical group 0.000 description 1
- 125000004956 cyclohexylene group Chemical group 0.000 description 1
- PWAPCRSSMCLZHG-UHFFFAOYSA-N cyclopentylidene Chemical group [C]1CCCC1 PWAPCRSSMCLZHG-UHFFFAOYSA-N 0.000 description 1
- 229940105990 diglycerin Drugs 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- OZLBDYMWFAHSOQ-UHFFFAOYSA-N diphenyliodanium Chemical compound C=1C=CC=CC=1[I+]C1=CC=CC=C1 OZLBDYMWFAHSOQ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229940095102 methyl benzoate Drugs 0.000 description 1
- ZCIJAGHWGVCOHJ-UHFFFAOYSA-N naphthalene phenol Chemical compound C1(=CC=CC=C1)O.C1(=CC=CC=C1)O.C1=CC=CC2=CC=CC=C12.C1(=CC=CC=C1)O ZCIJAGHWGVCOHJ-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 239000012812 sealant material Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000003784 tall oil Substances 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 125000001544 thienyl group Chemical group 0.000 description 1
- 125000000101 thioether group Chemical group 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1525—Four-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
Definitions
- the present invention relates to a sealant.
- an organic electroluminescence element hereinafter, referred to as an organic EL element
- the display element is generally easily deteriorated by moisture or oxygen in the atmosphere. Therefore, in various display devices, the display element is generally sealed (sealed) with a sealing layer. Further, a sealing agent is also used for sealing various elements such as a solar cell element and a semiconductor element.
- an element such as an organic EL element may be surface-sealed by a cured product of a sealing agent containing a curable resin.
- the sealant has generally been applied (printed) by a screen printing method.
- it is required to flatten or thin the cured product of the sealing agent (hereinafter, also referred to as “sealing layer”). Therefore, application of a sealant by an inkjet method has been studied. When applying a sealant with an ink jet device, it is required that the sealant can be stably discharged from a nozzle.
- Patent Document 1 a resin composition containing a benzylsulfonium salt and an aromatic epoxy resin or an oxetane resin as a surface sealing agent for an organic EL element has been proposed (for example, Patent Document 1).
- Patent Document 1 it was difficult to apply the surface sealing agent described in Patent Document 1 stably from an ink jet device.
- the display element sealed by the sealing layer is arranged close to a sensor such as a touch panel.
- a sensor such as a touch panel.
- the present invention has been made in view of the above circumstances, and has as its object to provide a sealant suitable for application by an inkjet method.
- the present invention provides the following sealants.
- It contains (A) an alicyclic epoxy compound and (B) an oxetane compound, has a viscosity of 10 to 30 mPa ⁇ s measured at 25 ° C. and 20 rpm by an E-type viscometer, and has a wavelength of 395 nm.
- the sealant according to [1] further comprising (C) a tackifier.
- a sealant suitable for application by an inkjet method can be provided.
- the sealant of the present invention is a sealant for surface-sealing various elements such as a display element, a solar cell element, and a semiconductor element, and for sealing a liquid crystal of a liquid crystal display element.
- the sealing agent contains (A) an alicyclic epoxy compound and (B) an oxetane compound. However, components other than these may be included as needed, and for example, (C) a tackifier, (D) a cationic polymerization initiator, and (E) various additives may be included.
- the sealing agent contains the alicyclic epoxy compound (A)
- the viscosity is easily reduced, and the curability of the sealing agent is further increased.
- the sealing agent contains the oxetane compound (B)
- the dielectric constant of the cured product tends to be low.
- the amount of the (B) oxetane compound is excessive, the viscosity of the sealant may be excessively low. Therefore, in the present invention, the viscosity measured by an E-type viscometer at 25 ° C.
- the UV-LED having a wavelength of 395 nm is cured at an illuminance of 1000 mW / cm 2 and an integrated light amount of 1500 mJ / cm 2 .
- the alicyclic epoxy compound (A) and the oxetane compound (B) are combined so that the dielectric constant of the cured product at a frequency of 100 kHz is 3.0 or less.
- a sealing agent it is possible to form a sealing layer having high flatness and a small thickness by an inkjet method.
- sealant of the present invention is particularly suitable for application by an ink-jet method, but the application method is not limited to the ink-jet method, and can be applied by a dispenser, screen printing, spin coating, or the like. .
- Alicyclic epoxy compound (A) The alicyclic epoxy compound is not particularly limited as long as it has at least one alicyclic hydrocarbon structure and at least one epoxy group in the molecule.
- the alicyclic epoxy compound (A) is preferably a liquid compound at 25 ° C., and preferably has a viscosity of 10 to 500 mPa ⁇ s measured at 25 ° C. and 20 rpm with an E-type viscometer. , And more preferably 30 to 300 mPa ⁇ s.
- the viscosity of the (A) alicyclic epoxy compound is within the above range, the viscosity of the sealing agent tends to fall within the above range, and it is easy to apply the ink stably by the inkjet method.
- the molecular weight or weight average molecular weight of the alicyclic epoxy compound is preferably from 100 to 790, more preferably from 140 to 500, and even more preferably from 180 to 400.
- the weight average molecular weight is a value (in terms of polystyrene) measured by gel permeation chromatography (GPC).
- GPC gel permeation chromatography
- the alicyclic epoxy compound may have only one epoxy group in the molecule, but has two or more epoxy groups from the viewpoint of enhancing the curability of the sealing agent. Is preferred.
- the epoxy equivalent of the alicyclic epoxy compound is preferably from 50 to 500 g / eq, more preferably from 70 to 250 g / eq.
- the curability of the sealing agent tends to be improved.
- the oxygen permeability and moisture permeability of the cured product tend to be low.
- the alicyclic epoxy compound (A) preferably has an oxygen atom content represented by the following formula (1) of 15% or more and 30% or less.
- Oxygen atom content (%) total mass of oxygen atoms in one molecule / weight average molecular weight ⁇ 100 (1)
- the oxygen atom content of the (A) alicyclic epoxy compound is 30% or less, the dielectric constant of the cured product of the sealing agent tends to be low.
- the oxygen atom content is preferably 25% or less, more preferably 20% or less.
- the total mass of oxygen atoms in one molecule of the alicyclic epoxy compound can be determined by specifying the structure of the alicyclic epoxy compound by a GC-MS method, an NMR method, or the like, and determining the number of oxygen atoms in one molecule of the compound. Can be calculated by multiplying by the number of oxygen atoms.
- the oxygen atom content of the alicyclic epoxy compound is obtained by applying the total mass of the obtained oxygen atoms and the weight average molecular weight measured by the above-described GPC method to the above-described formula (1). Can be calculated.
- the oxygen atom content of the (A) alicyclic epoxy compound may be, for example, the number of epoxy groups in the molecule or a group having an oxygen atom (eg, -CO- (carbonyl group), -O-CO-O- (carbonate). Group), -COO- (carbonyloxy group or ester group), -O- (ether group), -CONH- (amide group) and the like. That is, in order to reduce the oxygen atom content, it is preferable to reduce the number of groups having an oxygen atom in one molecule.
- the alicyclic epoxy compound include a compound having a cycloalkene oxide structure such as an epoxycyclohexane structure and a compound in which an epoxy group is bonded to a cyclic aliphatic hydrocarbon directly or via a hydrocarbon group or the like. included.
- the sealant may contain only one kind of the alicyclic epoxy compound (A) or two or more kinds thereof.
- the alicyclic epoxy compound is particularly preferably a compound having a cycloalkene oxide structure.
- the curability of the sealant is likely to increase.
- the cycloalkene oxide structure is a structure obtained by epoxidizing a cycloalkene with an oxidizing agent such as a peroxide, and is an epoxy group composed of two adjacent carbon atoms and an oxygen atom constituting an aliphatic ring. is there.
- oxidizing agent such as a peroxide
- examples of cycloalkene oxide include cyclohexene oxide and cyclopentene oxide, and cyclohexene oxide is particularly preferred.
- the number of cycloalkene oxide structures in one molecule of the alicyclic epoxy compound (A) having a cycloalkene oxide structure may be one, or may be two or more. From the viewpoint of enhancing the transparency, heat resistance, light resistance, and the like of the cured product, the number of cycloalkene oxide structures in one molecule is preferably two or more.
- Examples of alicyclic epoxy compounds having a cycloalkene oxide structure include compounds represented by the following general formula (A-1).
- X in the general formula (A-1) is a single bond or a linking group.
- X is selected so that the weight average molecular weight and the oxygen atom content of the compound represented by the general formula (A-1) satisfy the above ranges.
- the linking group is a divalent hydrocarbon group, carbonyl group, ether group (ether bond), thioether group (thioether bond), ester group (ester bond), carbonate group (carbonate bond), amide group (amide bond), or It can be a group in which a plurality of these are linked.
- Examples of the divalent hydrocarbon group include an alkylene group having 1 to 18 carbon atoms and a divalent alicyclic hydrocarbon group.
- Examples of the alkylene group having 1 to 18 carbon atoms include a methylene group, a methylmethylene group, a dimethylmethylene group, an ethylene group, a propylene group, and a trimethylene group.
- Examples of the divalent alicyclic hydrocarbon group include 1,2-cyclopentylene, 1,3-cyclopentylene, cyclopentylidene, 1,2-cyclohexylene, and 1,3-cyclopentylene.
- a divalent cycloalkylene group such as a cyclohexylene group, a 1,4-cyclohexylene group, and a cyclohexylidene group.
- X is preferably a single bond or a linking group having an oxygen atom.
- the linking group having an oxygen atom includes -CO- (carbonyl group), -O-CO-O- (carbonate group), -COO- (ester group), -O- (ether group), -CONH- (amide group) ), A group in which a plurality of these groups are linked, or a group in which one or more of these groups are linked to one or more of a divalent hydrocarbon group.
- X is particularly preferably a single bond.
- Examples of the (A) alicyclic epoxy compound having a cycloalkene oxide structure represented by the general formula (A-1) include the following compounds.
- 1 represents an integer of 1 to 10
- m represents an integer of 1 to 30.
- R represents an alkylene group having 1 to 8 carbon atoms (preferably an alkylene group having 1 to 3 carbon atoms such as a methylene group, an ethylene group, a propylene group, and an isopropylene group).
- n1 and n2 each represent an integer of 1 to 30.
- Examples of commercially available (A) alicyclic epoxy compounds having a cycloalkene oxide structure include Celloxide 2021P, Celloxide 2081, Celloxide 8000, Celloxide 8010 (manufactured by Daicel Corporation), and the like.
- the amount of the alicyclic epoxy compound is preferably from 10 to 70% by mass based on the total mass of the sealant.
- the amount of the (A) alicyclic epoxy compound is 10% by mass or more, the viscosity of the sealant becomes sufficiently low, and the curability of the sealant tends to be improved.
- the content is 70% by mass or less, the flexibility and adhesion of the obtained cured product are not easily impaired.
- the amount of the (B) oxetane compound is relatively large, and the dielectric constant tends to be low.
- the content of the alicyclic epoxy compound is more preferably from 10 to 50% by mass, and even more preferably from 10 to 40% by mass, based on the total mass of the sealing agent.
- the (B) oxetane compound may be any compound having an oxetanyl group, and preferably has a molecular weight or a weight average molecular weight of 180 or more. Further, it is preferable that the oxygen atom content represented by the above formula (1) is 15% or more and 30% or less.
- the oxetane compound (B) is preferably a liquid compound at 25 ° C., and the viscosity measured at 25 ° C. and 20 rpm with an E-type viscometer is preferably 1 to 500 mPa ⁇ s, and 1 to 500 mPa ⁇ s. More preferably, it is 300 mPa ⁇ s.
- the viscosity of the (B) oxetane compound is within the above range, the viscosity of the sealant easily falls within the above-mentioned range, and it becomes easy to apply the ink stably by the inkjet method.
- the weight average molecular weight of (B) the oxetane compound is preferably 190 or more, and more preferably 200 or more, from the viewpoint of suppressing volatilization of the (B) oxetane compound.
- the upper limit of the molecular weight or the weight average molecular weight may be such that the ejection property of the sealant when applied by the inkjet method is not impaired, and is preferably 400 or less, for example.
- the weight average molecular weight can be measured by the same method as described above.
- the oxygen atom content of the oxetane compound (B) represented by the above formula (1) is 30% or less, the dielectric constant of the cured product of the sealing agent tends to be low.
- the oxygen atom content is preferably 25% or less, more preferably 20% or less.
- the oxygen atom content of the oxetane compound is defined in the same manner as described above, and the measurement method can be the same.
- the oxygen atom content of the (B) oxetane compound can be adjusted by, for example, the number of oxetanyl groups in one molecule of the (B) oxetane compound, the number of oxygen atoms in a group bonded to the oxetanyl group, and the like.
- the oxetane compound is preferably a compound represented by the following general formula (B-1) or (B-2).
- the sealing agent may contain only one kind of the oxetane compound (B), or may contain two or more kinds.
- Y represents an oxygen atom, a sulfur atom, or a single bond. Among these, an oxygen atom is preferable.
- R 1a and R 1b each represent a fluorine atom, an alkyl group having 1 to 6 carbon atoms, a fluoroalkyl group having 1 to 6 carbon atoms, an allyl group, an aryl group having 6 to 18 carbon atoms, a furyl group, or an ethynyl group; Represents m and n each represent an integer of 1 or more and 5 or less. When a plurality of R 1a or R 1b are contained in one molecule, they may be the same or different. Further, adjacent R 1a or adjacent R 1b may form a ring structure.
- R 2a in the general formula (B-1) is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an aralkyl group having 7 to 18 carbon atoms, Represents an alkylcarbonyl group, an alkoxycarbonyl group having 2 to 6 carbon atoms, an N-alkylcarbamoyl group having 2 to 6 carbon atoms or a (meth) acryloyl group.
- R 2b in the general formula (B-2) represents a p-valent linking group, and p represents 2, 3 or 4.
- R 2b represents, for example, a linear or branched alkylene group having 1 to 12 carbon atoms, a linear or branched poly (alkyleneoxy) group, an arylene group, a siloxane bond, or a combination thereof.
- R 1a , R 1b , R 2a , and R 2b are selected such that the weight average molecular weight and the oxygen atom content satisfy the above ranges. Is preferred.
- the oxetane compound (B) is preferably a compound represented by the following general formula, from the viewpoint of reducing the dielectric constant of the cured product of the sealant and making the viscosity of the sealant appropriate.
- Y in the general formula (B-3) is an oxygen atom or a sulfur atom.
- R 1c represents a hydrogen atom, a fluorine atom, an alkyl group having 1 to 6 carbon atoms, a fluoroalkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 18 carbon atoms, a furyl group or a thienyl group.
- an alkyl group having 1 to 6 carbon atoms is preferable from the viewpoint of reducing the dielectric constant of a cured product of the sealing agent.
- R 2c represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an aralkyl group having 7 to 18 carbon atoms, an alkylcarbonyl group having 2 to 6 carbon atoms, It is an alkoxycarbonyl group, an N-alkylcarbamoyl group having 2 to 6 carbon atoms or a (meth) acryloyl group.
- an alkyl group having 1 to 10 carbon atoms is more preferable from the viewpoint of reducing the dielectric constant of a cured product of the sealant.
- Examples of the compound represented by the formula (B-3) include 3-ethyl-3-hydroxymethyloxetane, 3- (meth) allyloxymethyl-3-ethyloxetane, (3-ethyl-3-oxetanylmethoxy) ) Methylbenzene, 4-fluoro- [1- (3-ethyl-3-oxetanylmethoxy) methyl] benzene, 4-methoxy- [1- (3-ethyl-3-oxetanylmethoxy) methyl] benzene, [1- ( 3-ethyl-3-oxetanylmethoxy) ethyl] phenyl ether, isobutoxymethyl (3-ethyl-3-oxetanylmethyl) ether, isobornyloxyethyl (3-ethyl-3-oxetanylmethyl) ether, isobornyl (3- Ethyl-3-oxetanylmethyl)
- the amount of the oxetane compound is preferably 20 to 80% by mass based on the total mass of the sealing agent.
- the amount of the (B) oxetane compound is 20% by mass or more, the dielectric constant of the cured product of the sealant is easily reduced.
- the content is 80% by mass or less, the viscosity of the sealant tends to fall within a desired range.
- the content of the oxetane compound is more preferably from 25 to 80% by mass, even more preferably from 30 to 70% by mass, based on the total mass of the sealant.
- the sealant may contain (C) a tackifier.
- a tackifier is a kind selected from the group consisting of petroleum resins (aliphatic hydrocarbon resins, alicyclic hydrocarbon resins, aromatic hydrocarbon resins), terpene resins, phenolic resins, and rosin resins. Is preferred.
- the sealant may include only one kind of the tackifier (C), or may include two or more kinds of the tackifier.
- Examples of petroleum resins include C5 monomers or oligomers thereof obtained from pentene, pentadiene, isoprene, etc .; C9 monomers or oligomers thereof obtained from indene, methylindene, vinyltoluene, styrene, ⁇ -methylstyrene, ⁇ -methylstyrene, etc.
- a copolymer of a C5 monomer and a C9 monomer (C5-C9 copolymer resin); an alicyclic monomer obtained from cyclopentadiene, dicyclopentadiene or the like or a polymer thereof; an aromatic monomer such as isopropenyltoluene or a polymer thereof.
- a petroleum resin produced from dicyclopentadiene as a main raw material is preferable, and a petroleum resin produced from dicyclopentadiene as a main raw material and having an ester group in the molecule (for example, QTN1500, manufactured by Zeon Corporation) is preferred. It is particularly preferable from the viewpoint of compatibility with the resin.
- terpene resins include aromatic-modified terpene resins obtained by copolymerizing terpenes such as ⁇ -pinene resin, ⁇ -pinene resin, ⁇ -pinene monomer, and ⁇ -pinene monomer with aromatic monomers such as styrene. Resin included.
- phenolic resins include condensates of phenols and formaldehyde.
- examples of phenols include phenol, m-cresol, 3,5-xylenol, p-alkylphenol, resorcin and the like.
- examples of the phenolic resin include resol obtained by subjecting these phenols and formaldehyde to an addition reaction with an alkali catalyst, and novolak obtained by performing a condensation reaction with an acid catalyst.
- the phenol resin also includes a rosin phenol resin obtained by adding phenol to rosin with an acid catalyst and subjecting to thermal polymerization.
- rosin resins include gum rosin, wood rosin or tall oil rosin, stabilized rosin or polymerized rosin that has been disproportionated or hydrogenated using these rosins, and these rosins are maleic anhydride, maleic acid, fumaric acid, Modified rosin modified with (meth) acrylic acid, phenol, and the like, as well as esterified products thereof, and the like are included.
- the alcohol used to obtain the esterified product is preferably a polyhydric alcohol.
- polyhydric alcohols examples include dihydric alcohols such as ethylene glycol, diethylene glycol, propylene glycol, and neopentyl glycol; trihydric alcohols such as glycerin, trimethylolethane, and trimethylolpropane; tetrahydric alcohols such as pentaerythritol and diglycerin A hexahydric alcohol such as dipentaerythritol. At the time of esterification, these can be used alone or in combination of two or more.
- the content of the tackifier is preferably 1 to 30% by mass based on the total mass of the sealant. When the content of the tackifier (C) is within the above range, the viscosity of the cured product of the sealing agent tends to fall within a desired range. (C) The content of the tackifier is more preferably from 3 to 25% by mass, and even more preferably from 5 to 20% by mass, based on the total mass of the sealant.
- the sealant may further contain (D) a cationic polymerization initiator.
- the cationic polymerization initiator may be a photocationic polymerization initiator that generates an acid capable of initiating cationic polymerization by irradiation with light such as ultraviolet light, or a thermal cationic polymerization initiator that generates an acid by heating. Is also good.
- the sealant may include only the cationic photopolymerization initiator, may include only the thermal cationic polymerization initiator, or may include both. Further, the sealing agent may contain only one kind of the (D) cationic polymerization initiator, or may contain two or more kinds. However, it is preferable to reduce damage to the element due to heating, that is, to cure the sealant with light, and it is preferable to include at least one cationic photopolymerization initiator.
- Examples of the cationic photopolymerization initiator include an anion moiety of BF 4 ⁇ , (R f ) n PF 6-n (R f is an organic group, n is an integer of 1 to 5) , PF 6 ⁇ , SbF 6 ⁇ , or BX 4 - (X is a phenyl group substituted with at least two fluorine or trifluoromethyl group), aromatic sulfonium salts, aromatic iodonium salts, aromatic diazonium salts, aromatic ammonium salts and the like included.
- aromatic sulfonium salt examples include bis [4- (diphenylsulfonio) phenyl] sulfide bishexafluorophosphate, bis [4- (diphenylsulfonio) phenyl] sulfide bishexafluoroantimonate, bis [4- (diphenyl) Sulfonio) phenyl] sulfide bistetrafluoroborate, bis [4- (diphenylsulfonio) phenyl] sulfidetetrakis (pentafluorophenyl) borate, diphenyl-4- (phenylthio) phenylsulfonium hexafluorophosphate, diphenyl-4- (phenylthio ) Phenylsulfonium hexafluoroantimonate, diphenyl-4- (phenylthio) phenylsulfonium t
- aromatic iodonium salt examples include diphenyliodonium hexafluorophosphate, diphenyliodonium hexafluoroantimonate, diphenyliodonium tetrafluoroborate, diphenyliodonium tetrakis (pentafluorophenyl) borate, bis (dodecylphenyl) iodonium hexafluorophosphate, bis ( Dodecylphenyl) iodonium hexafluoroantimonate, bis (dodecylphenyl) iodonium tetrafluoroborate, bis (dodecylphenyl) iodonium tetrakis (pentafluorophenyl) borate, and the like.
- aromatic diazonium salt examples include phenyldiazonium hexafluorophosphate, phenyldiazonium hexafluoroantimonate, phenyldiazonium tetrafluoroborate, phenyldiazonium tetrakis (pentafluorophenyl) borate and the like.
- aromatic ammonium salt examples include 1-benzyl-2-cyanopyridinium hexafluorophosphate, 1-benzyl-2-cyanopyridinium hexafluoroantimonate and the like.
- photocationic polymerization initiators examples include Irgacure 250, Irgacure 270, Irgacure 290 (manufactured by BASF), CPI-100P, CPI-101A, CPI-200K, CPI-210S, CPI-310B, and CPI-400PG (Sanpro Corporation) SP-150, SP-170, SP-171, SP-056, SP-066, SP-130, SP-140, SP-601, SP-606, SP-701 (manufactured by ADEKA). .
- Irgacure 270 Irgacure 270
- Irgacure 290 CPI-100P
- CPI-101A CPI-200K
- CPI-210S CPI-310B
- CPI-400PG CPI-400PG
- SP-150 SP-170
- SP-171 SP-056, SP-066, Sulfonium salts
- SP-601, SP-606 and SP-701 are preferred.
- the amount of the cationic polymerization initiator is preferably 0.1 to 10% by mass based on the total mass of the sealing agent.
- the amount of the (D) cationic polymerization initiator is 0.1% by mass or more, the curability of the sealant is easily increased, and when the amount is 10% by mass or less, coloring of the cured product of the sealant is easily suppressed.
- the amount of the cationic polymerization initiator is more preferably from 0.1 to 5% by mass, and even more preferably from 0.1 to 3% by mass, based on the total mass of the sealing agent.
- the sealant of the present invention may further contain other components other than those described above as long as the effects of the present invention are not impaired.
- examples of other components include an aromatic epoxy compound, a sensitizer, a silane coupling agent, a leveling agent, and the like.
- Examples of the aromatic epoxy compound include glycidyl ethers of alcohols containing aromatic rings (including polyhydric alcohols).
- Examples of the aromatic epoxy compound include bisphenol A epoxy resin, bisphenol E epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, bisphenol O epoxy resin, and 2,2′-diallyl bisphenol A epoxy resin. , Propylene oxide-added bisphenol A epoxy resin, resorcinol epoxy resin, biphenyl epoxy resin, sulfide epoxy resin, diphenyl ether epoxy resin, naphthalene epoxy resin, phenol novolak epoxy resin, orthocresol novolak epoxy resin, biphenyl novolak Epoxy resin, naphthalene phenol novolak type epoxy resin and the like.
- the sealant may contain only one kind of the aromatic epoxy compound, or two or more kinds thereof.
- the oxygen atom content and the weight average molecular weight of the aromatic epoxy compound are not particularly limited, from the viewpoint of reducing the volatility of the compound and the dielectric constant of the cured product of the encapsulant, the above formula (1) is used.
- the oxygen atom content is 10% or more and 30% or less, and the weight average molecular weight is 100 or more.
- the sealing agent contains a large amount of, for example, bisphenol A type epoxy resin or bisphenol F type epoxy resin, the viscosity tends to increase. Further, when the sealing agent contains a large amount of the aromatic epoxy resin, the cured product of the sealing agent tends to be colored. Therefore, the content of the aromatic epoxy resin is preferably adjusted to such an extent that the viscosity of the sealing agent and the coloring of the cured product are not affected.
- the sensitizer has a function of further improving the polymerization initiation efficiency of the above-mentioned (D) cationic polymerization initiator and further promoting the curing reaction of the sealant.
- the sensitizer include thioxanthone compounds such as 2,4-diethylthioxanthone, 2,2-dimethoxy-1,2-diphenylethan-1-one, benzophenone, 2,4-dichlorobenzophenone, o-benzoyl Methyl benzoate, 4,4'-bis (dimethylamino) benzophenone, 4-benzoyl-4'-methyldiphenylsulfide, 9,10-dibutoxyanthracene, 9,10-diethoxyanthracene, 9,10-bis (octa Noyloxy) anthracene and the like.
- the sealant may include only one type of sensitizer, or may include two or more types of sensitizers.
- the silane coupling agent enhances the adhesion between the sealing agent and the object to be sealed.
- the silane coupling agent can be a silane compound having a reactive group such as an epoxy group, a carboxyl group, a methacryloyl group, and an isocyanate group.
- silane compounds include trimethoxysilylbenzoic acid, ⁇ -methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, ⁇ -isocyanatopropyltriethoxysilane, ⁇ -glycidoxypropyl Trimethoxysilane, ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane and the like.
- the sealant may include only one type of silane coupling agent, or may include two or more types of silane coupling agents.
- the leveling agent improves the flatness of the sealant coating film.
- the leveling agent include silicone-based, acrylic-based, and fluorine-based ones.
- examples of commercially available leveling agents include BYK-340, BYK-345 (both manufactured by Big Chemie Japan), Surflon S-611 (manufactured by AGC Seimi Chemical Co., Ltd.), and the like.
- the sealant may include only one type of leveling agent, or may include two or more types of leveling agents.
- the total amount of other components is preferably 20% by mass or less based on the total mass of the sealant, from the viewpoint of suppressing volatilization of the sealant and reducing damage to the device, More preferably, it is 10% by mass or less.
- the viscosity of the sealant measured at 25 ° C. and 20 rpm with an E-type viscometer is 10 to 30 mPa ⁇ s, preferably 11 to 28 mPa ⁇ s, more preferably 11 to 25 mPa ⁇ s. preferable.
- the viscosity of the sealant is in the above range, the sealant is easily discharged from the inkjet device. Moreover, it does not spread excessively after application, and it is easy to form a cured product (sealing layer) having a desired thickness.
- the dielectric constant at a frequency of 100 kHz of a cured product obtained by curing a sealant with a UV-LED having a wavelength of 395 nm at an illuminance of 1000 mW / cm 2 and an integrated light amount of 1500 mJ / cm 2 is 3.0 or less, and 2.9 or less. It is preferably, and more preferably 2.8 or less.
- the cured product has a dielectric constant of 3.0 or less, for example, when the display device is sealed with the cured product (encapsulation layer), the cured product has sufficiently high insulation properties, and the display device and other members (For example, a sensor or the like) can be suppressed.
- the dielectric constant can be measured by an automatic equilibrium bridge method using LCR meter HP4284A (manufactured by Agilent Technologies).
- the dielectric constant of the cured product of the sealant can be adjusted by the oxygen content of the entire sealant, preferably 30% or less, more preferably 25% or less, and more preferably 20% or less. More preferably, The oxygen atom content of the entire sealant can be calculated as (total mass of oxygen atoms contained in the sealant / total mass of the sealant) ⁇ 100 (%). The total mass of oxygen atoms contained in the sealant can be calculated by calculating the content ratio of oxygen atoms by elemental analysis and multiplying by the atomic weight of oxygen atoms.
- the average value of the light transmittance at a wavelength of 380 to 800 nm is preferably 85% or more, more preferably 90% or more.
- the light-transmitting agent has good light transmittance, and thus is suitable as, for example, a surface sealing agent for an organic EL element.
- the average light transmittance can be measured as an average value of the light transmittance measured for each wavelength of 1 nm at a wavelength of 380 to 800 nm using, for example, an ultraviolet-visible spectrophotometer (manufactured by Shimadzu Corporation).
- a sealant is obtained by mixing the above-mentioned components and mixing them using a mixer such as a homodisper, a homomixer, a universal mixer, a planetary mixer, a kneader, or a three-roller. Can be. From the viewpoint of stably mixing the sealing agent, it is more preferable to mix (D) the cationic polymerization initiator after mixing components other than (D) the cationic polymerization initiator.
- sealant described above is suitable for sealing various elements such as an organic EL element, an LED element, a semiconductor element, and a solar cell element.
- the application is not limited to the surface sealing of the element, and it can be used, for example, as a liquid crystal sealant of a liquid crystal display device.
- it since it has excellent light transmittance, it is suitable as a surface sealing agent for a display element.
- the manufacturing method of the various devices may include 1) a step of preparing an element, and 2) a step of applying the above-described sealing agent on the element to seal the element, and other steps. May be included.
- an element is prepared.
- the elements are arranged on a substrate.
- the substrate may be a glass substrate or a resin substrate.
- the display device is preferably a resin substrate (resin film).
- the type of element is not particularly limited, and may be a semiconductor element or the like, but is preferably an element that converts electricity into light or converts light into electricity.
- Examples of such an element include an organic EL element, an LED element, a solar cell element, and the like.
- the element is preferably an organic EL element.
- the organic EL device usually includes a reflective pixel electrode layer, an organic EL layer, and a transparent counter electrode layer. Note that the organic EL element may further include another functional layer as needed.
- the above-mentioned sealant is applied by an ink-jet method so as to cover the elements arranged on the substrate.
- an ink-jet method By applying the above-mentioned sealant by an ink-jet method, a thin coating film having high flatness and high thickness can be formed at high speed.
- the sealing agent applied on the element is cured to obtain a cured product layer.
- the curing of the sealant is preferably light curing, and after the light curing, heat curing may be further performed.
- a known light source such as a xenon lamp or a carbon arc lamp can be used.
- the irradiation amount is not particularly limited as long as the sealing agent can be sufficiently cured. For example, light having a wavelength of 300 to 400 nm can be irradiated with an integrated light amount of 300 to 3000 mJ / m 2 .
- the heating temperature is preferably set to about 50 to 120 ° C. from the viewpoint of sufficiently curing without causing damage to the element.
- the thickness of the cured product layer (sealing layer) of the sealing agent may be a film capable of sufficiently sealing the element and a film having high flatness, and is, for example, preferably 1 to 20 ⁇ m, and more preferably 3 to 10 ⁇ m. Is more preferable.
- Sealant material Alicyclic epoxy compound ⁇ Celoxide CEL8010 (manufactured by Daicel, a compound represented by the following formula (estimated), oxygen atom content: 16.49%, molecular weight: 194)
- Oxetane compound OXT-212 (3-ethyl-3-[(2-ethylhexyloxy) methyl] oxetane (abbreviation: ethylhexyloxetane) manufactured by Toa Gosei Co., Ltd., oxygen atom content 14.04%, molecular weight 228)
- the obtained sealant was introduced into an ink jet cartridge DMC-11610 (manufactured by Fujifilm Dimatix). After setting the ink jet cartridge in an ink jet apparatus DMP-2831 (manufactured by Fuji Film Dimatix), and adjusting the ejection state, a cured aluminum sheet was deposited on a non-alkali glass substrate with a thickness of 100 nm. It was applied in a size of 5 cm ⁇ 5 cm so as to have a thickness of 10 ⁇ m.
- the obtained coating film was purged with nitrogen at room temperature (25 ° C.) for 1 minute, it was cured with a UV-LED having a wavelength of 395 nm at an illuminance of 1000 mW / cm 2 and an integrated light amount of 1500 mJ / cm 2 .
- a UV-LED having a wavelength of 395 nm at an illuminance of 1000 mW / cm 2 and an integrated light amount of 1500 mJ / cm 2 .
- aluminum was vapor-deposited on the inkjet-coated surface to a thickness of 100 nm, and the dielectric constant was measured at 100 kHz by an LCR meter HP4284A (manufactured by Agilent Technologies) using an automatic equilibrium bridge method.
- ⁇ dielectric constant ⁇ 3.00
- the dielectric constant is 3.0 or less, it is considered that interference of an electric field generated from the device and static electricity of the touch panel can be suppressed.
- the sealant of the present invention has a viscosity suitable for application by an inkjet method, and has a low dielectric constant. Therefore, it can be applied stably by the inkjet method. Further, when the display element is sealed with the sealing agent, the display element can be arranged close to a sensor or the like, and a thin display device or a display device with high design flexibility can be provided. Can be manufactured.
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Abstract
Description
[1](A)脂環式エポキシ化合物と、(B)オキセタン化合物と、を含み、E型粘度計によって25℃、20rpmの条件で測定される粘度が10~30mPa・sであり、波長395nmのUV-LEDで照度1000mW/cm2、積算光量1500mJ/cm2で硬化させた硬化物の周波数100kHzにおける誘電率が3.0以下である、封止剤。
[2](C)粘着付与剤をさらに含む、[1]に記載の封止剤。
[4]前記(B)オキセタン化合物の下記式で表される酸素原子含有率が、20%以下である、[1]~[3]のいずれかに記載の封止剤。
酸素原子含有率(%)=1分子中の酸素原子の合計質量/重量平均分子量×100
[6]インクジェット法による塗布に用いられる、[1]~[5]のいずれかに記載の封止剤。
[7]前記表示素子が、有機エレクトロルミネッセンス素子である、[5]に記載の封止剤。
本発明の封止剤は、表示素子や太陽電池素子、半導体素子等の各種素子を面封止したり、液晶表示素子の液晶を封止したりするための封止剤である。当該封止剤は、(A)脂環式エポキシ化合物と、(B)オキセタン化合物とを含む。ただし、必要に応じてこれら以外の成分を含んでいてもよく、例えば、(C)粘着付与剤や、(D)カチオン重合開始剤、(E)各種添加剤等を含んでいてもよい。
(A)脂環式エポキシ化合物は、分子中に脂環式炭化水素構造およびエポキシ基をそれぞれ1つ以上有する化合物であれば特に制限されない。当該(A)脂環式エポキシ化合物は、25℃において液状の化合物であることが好ましく、E型粘度計で25℃、20rpmの条件で測定される粘度が10~500mPa・sであることが好ましく、30~300mPa・sであることがより好ましい。(A)脂環式エポキシ化合物の粘度が当該範囲であると、封止剤の粘度が上述の範囲に収まりやすく、インクジェット法により安定して塗布しやすくなる。
酸素原子含有率(%)=1分子中の酸素原子の合計質量/重量平均分子量×100・・・(1)
(B)オキセタン化合物は、オキセタニル基を有する化合物であればよいが、分子量もしくは重量平均分子量が180以上であることが好ましい。また、前述の式(1)で表される酸素原子含有率が15%以上30%以下であることが好ましい。
封止剤は、(C)粘着付与剤を含んでいてもよい。封止剤が(C)粘着付与剤を含むと、封止剤の硬化物の誘電率を大きく変化させることなく、封止剤の粘度を調整する(高める)ことができる。このような(C)粘着付与剤は、石油樹脂(脂肪族炭化水素樹脂、脂環式炭化水素樹脂、芳香族炭化水素樹脂)、テルペン樹脂、フェノール樹脂、およびロジン樹脂からなる群から選ばれる一種の樹脂であることが好ましい。封止剤は、(C)粘着付与剤を一種のみ含んでいてもよく、二種以上含んでいてもよい。
封止剤は、(D)カチオン重合開始剤をさらに含んでいてもよい。(D)カチオン重合開始剤は、紫外線などの光照射によりカチオン重合を開始可能な酸を発生する光カチオン重合開始剤であってもよく、加熱によって酸を発生する熱カチオン重合開始剤であってもよい。封止剤は、光カチオン重合開始剤のみを含んでいてもよく、熱カチオン重合開始剤のみを含んでいてもよく、両方を含んでいてもよい。また、封止剤は、(D)カチオン重合開始剤を一種のみ含んでいてもよく、二種以上含んでいてもよい。ただし加熱による素子へのダメージを低減する、すなわち光によって封止剤を硬化させることが好ましく、光カチオン重合開始剤を一種以上含むことが好ましい。
本発明の封止剤は、本発明の効果を損なわない範囲で、上述した以外の他の成分をさらに含んでいてもよい。他の成分の例には、芳香族エポキシ化合物、増感剤、シランカップリング剤、レベリング剤等が含まれる。
(粘度)
封止剤の、E型粘度計により25℃、20rpmで測定される粘度は、10~30mPa・sであり、11~28mPa・sであることが好ましく、11~25mPa・sであることがより好ましい。封止剤の粘度が上記範囲であると、封止剤をインクジェット装置から吐出しやすくなる。また、塗布後に過度に濡れ広がらず、所望の厚みの硬化物(封止層)を形成しやすくなる。
封止剤を、波長395nmのUV-LEDで照度1000mW/cm2、積算光量1500mJ/cm2で硬化させた硬化物の周波数100kHzにおける誘電率は、3.0以下であり、2.9以下であることが好ましく、2.8以下であることがさらに好ましい。硬化物の誘電率が3.0以下であると、当該硬化物(封止層)によって例えば表示素子を封止した際に、硬化物の絶縁性が十分に高く、表示素子と、他の部材(例えばセンサ等)との干渉を抑制できる。当該誘電率は、LCRメーターHP4284A(アジレント・テクノロジー社製)を用いて、自動平衡ブリッジ法により測定することができる。
封止剤の硬化物の、厚み10μmにおける光線透過率は、波長380~800nmにおける光線透過率の平均値は、85%以上であることが好ましく、90%以上であることがより好ましい。封止剤の硬化物の光線透過率が上記範囲であると、良好な光透過性を有するため、例えば有機EL素子の面封止剤として好適である。平均光線透過率は、例えば紫外可視分光光度計(SHIMADZU社製)を用いて、波長380~800nmにおいて波長1nm毎に測定した光線透過率の平均値として測定することができる。
封止剤は、上述の成分を混合し、例えばホモディスパー、ホモミキサー、万能ミキサー、プラネタリーミキサー、ニーダー、3本ロールなどの混合機を用いて混合して得ることができる。なお、封止剤を安定に混合する観点では、(D)カチオン重合開始剤以外の成分を混合した後、(D)カチオン重合開始剤を混合することがより好ましい。
上述の封止剤は、例えば、有機EL素子やLED素子、半導体素子、太陽電池素子等の各種素子の封止に好適である。ただし、その用途は、素子の面封止に限定されず、例えば液晶表示装置の液晶シール剤等としても用いることができる。また特に、光透過性に優れることから、表示素子用の面封止剤として好適である。
以下、上述の封止剤を用いて、各種素子を面封止する、各種装置の製造方法を説明する。ただし、上述の封止剤を用いた装置の製造方法は、当該方法に限定されない。当該各種装置の製造方法は、1)素子を準備する工程と、2)当該素子上に上述の封止剤を塗布し、素子を封止する工程と、を含んでいればよく、他の工程を含んでいてもよい。
・スチレン系オリゴマーA
イソプロぺニルトルエン(IPT)の単独重合体(スチレン系オリゴマー、重量平均分子量:1200、数平均分子量:800)
・スチレン系オリゴマーB
イソプロぺニルトルエン(IPT)の単独重合体(スチレン系オリゴマー、重量平均分子量:1600、数平均分子量:1100)
・KE-100 荒川化学工業社製、ロジン樹脂
・クイントンQTN1500 日本ゼオン社製、石油樹脂
・CPI-210S(サンアプロ社製、下記式で表されるジフェニル-4-(フェニルチオ)フェニルスルホニウムヘキサフルオロホスフェート)
・UVS-1331(川崎化成工業社製、アントラキュアー UVS-1331(下記式で表される9,10-ジブトキシアントラセン))
表1に示される組成となるように、(A)脂環式エポキシ化合物と、(B)オキセタン化合物と、(C)粘着付与剤と、(E)増感剤とをフラスコに入れ、混合した。得られた混合物に、表1に示される量の(D)カチオン重合開始剤を入れて、さらに混合した。その後、粉状物が見えなくなるまで攪拌し、封止剤を得た。なお、表1に示す各成分の組成に関する単位は、質量部である。
得られた封止剤の粘度および誘電率を以下のように評価した。
得られた封止剤の粘度を、E型粘度計(BROOKFIELD社製、LV-DV-II+)を用いて、25℃、20rpmで測定した。また、当該素子用封止剤の塗布中、もしくは塗布後の様子から、以下のように評価した。
〇:インクジェットヘッドを30℃に加熱して吐出した際にインクジェット装置から安定して塗布することができ、所望の厚みの硬化物を作製できた
×:インクジェットヘッドを30℃に加熱して吐出した際にインクジェットの吐出時にミストが発生した
得られた封止剤を、インクジェットカートリッジDMC-11610(富士フイルムDimatix社製)に導入した。そのインクジェットカートリッジをインクジェット装置DMP-2831(富士フイルムDimatix社製)にセットし、吐出状態の調整を行った後、無アルカリガラス上にアルミを100nmの厚みで蒸着した基板に、硬化後の厚みが10μmとなるように、5cm×5cmのサイズで塗布した。得られた塗膜を1分間、室温(25℃)で窒素パージした後、波長395nmのUV-LEDで照度1000mW/cm2、積算光量1500mJ/cm2で硬化させた。その後インクジェット塗布面にアルミを100nmの厚みで蒸着し、LCRメーターHP4284A(アジレント・テクノロジー社製)にて、自動平衡ブリッジ法により条件100kHzにて誘電率を測定した。
〇:誘電率≦3.00
×:誘電率>3.00
Claims (7)
- (A)脂環式エポキシ化合物と、
(B)オキセタン化合物と、
を含み、
E型粘度計によって25℃、20rpmの条件で測定される粘度が10~30mPa・sであり、
波長395nmのUV-LEDで照度1000mW/cm2、積算光量1500mJ/cm2で硬化させた硬化物の周波数100kHzにおける誘電率が3.0以下である、
封止剤。 - (C)粘着付与剤をさらに含む、
請求項1に記載の封止剤。 - 前記(C)粘着付与剤が、石油樹脂、テルペン樹脂、フェノール樹脂、およびロジン樹脂からなる群から選ばれる、少なくとも1つの樹脂である、
請求項2に記載の封止剤。 - 前記(B)オキセタン化合物の下記式で表される酸素原子含有率が、20%以下である、
請求項1~3のいずれか一項に記載の封止剤。
酸素原子含有率(%)=1分子中の酸素原子の合計質量/重量平均分子量×100 - 表示素子用である、
請求項1~4のいずれか一項に記載の封止剤。 - インクジェット法による塗布に用いられる、
請求項1~5のいずれか一項に記載の封止剤。 - 前記表示素子が、有機エレクトロルミネッセンス素子である、
請求項5に記載の封止剤。
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