WO2019223386A1 - 显示基板、显示面板、触控显示装置及其制作方法 - Google Patents

显示基板、显示面板、触控显示装置及其制作方法 Download PDF

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Publication number
WO2019223386A1
WO2019223386A1 PCT/CN2019/076431 CN2019076431W WO2019223386A1 WO 2019223386 A1 WO2019223386 A1 WO 2019223386A1 CN 2019076431 W CN2019076431 W CN 2019076431W WO 2019223386 A1 WO2019223386 A1 WO 2019223386A1
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WIPO (PCT)
Prior art keywords
display
touch
area
panel
display panel
Prior art date
Application number
PCT/CN2019/076431
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English (en)
French (fr)
Inventor
罗鸿强
吴建君
张光均
赵海瑞
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/610,840 priority Critical patent/US10996779B2/en
Publication of WO2019223386A1 publication Critical patent/WO2019223386A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13338—Input devices, e.g. touch panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133528—Polarisers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/868—Arrangements for polarized light emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/87—Arrangements for heating or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a display substrate, a display panel, a touch display device, and a manufacturing method thereof.
  • the external touch display device is an external touch screen that is attached to the outside of the display panel.
  • a display panel and a chip-on-film (Chip, Flex, or Chip) provided with a driver IC are required.
  • Film (COF for short) is bound to Main Flexible Circuit (Printed Circuit, MFPC for short), and the touch panel is combined with a Touch Flexible Circuit Board (Touch Flexible Circuit with Touch IC). (TFPC) binding, then, attach the touch panel to the display panel, and finally, bind the main flexible circuit board to the touch flexible circuit board. It can be seen that the binding process requires multiple bindings, and the binding process is complicated.
  • An embodiment of the present disclosure provides a display substrate, including: a display area; a non-display area located on the periphery of the display area; a signal line provided in the display area; A plurality of first part first binding pins bound to the flexible circuit board; a plurality of second part first binding pins disposed in the non-display area for binding with the flexible circuit board; and setting A plurality of second binding pins in the non-display area for binding with the touch panel.
  • the second binding pins are in one-to-one correspondence with the first binding pins of the first part.
  • the display substrate is a flexible display substrate
  • the non-display area includes a bending area and a non-bending area connected to the bending area; relative to the bending area, the non-bending area Close to the display area; the first part of the first binding pin and the second part of the first binding pin are disposed in the bending area.
  • the second binding pin is disposed in the non-bent area.
  • the present disclosure also provides a display panel including the above display substrate.
  • the present disclosure also provides a touch display device, including the above display panel and a touch panel attached to the display panel; wherein the touch electrodes on the touch panel and a display substrate of the display panel The second binding pin is connected.
  • the touch display device further includes:
  • the touch signal integrated circuit communicates with the touch on the touch panel through the first binding pin and the second binding pin of the first part of the display substrate of the display panel.
  • the electrodes are connected.
  • the flexible circuit board includes a flip-chip film and a main flexible circuit board, the driving integrated circuit is disposed on the flip-chip film, and the touch integrated circuit is disposed on the main flexible circuit board.
  • the flexible circuit board is at least partially bent to a side of the display panel away from the touch panel.
  • the touch display device further includes at least one of the following:
  • a heat dissipation film is disposed on a side of the display panel remote from the touch panel;
  • a polarizer disposed on a side of the touch panel remote from the display panel;
  • the package cover is disposed on a side of the touch panel remote from the display panel.
  • the display panel is a flexible display panel
  • the non-display area includes a bending area and a non-bending area connected to the bending area; relative to the bending area, the non-bending area A display area close to the display panel; the touch display device further includes:
  • a laminating adhesive is used to fix the bent area on a side of the display panel away from the touch panel.
  • the present disclosure also provides a method for manufacturing a touch display device, including:
  • a display panel includes a display substrate.
  • the display substrate includes: a display area and a non-display area located outside the display area.
  • a plurality of first portions and first bindings are provided in the non-display area. Pins, a plurality of second binding pins of the second portion, and a plurality of second binding pins of the second portion; the first binding pins of the second portion are connected to a signal line provided in the display area; the second portion
  • the binding pins are in one-to-one correspondence with the first binding pins of the first part;
  • the display panel is bound to a flexible circuit board through the first binding pin of the first part and the first binding pin of the second part, and a driving integrated circuit and touch integration are provided on the flexible circuit board.
  • the display panel is bonded to the touch panel, and the display panel is bound to the touch panel through the second binding pin.
  • the display panel is a flexible display panel
  • the non-display area includes a bent area
  • the display panel is guided by the first binding pin of the first portion and the first binding pin of the second portion.
  • the method before the step of bending and fixing the bent area toward a side of the display panel away from the touch panel, the method further includes:
  • the step of bending and fixing the bent area toward a side of the display panel away from the touch panel includes:
  • the bending region is fixed on a side of the display panel away from the touch panel by using a glue.
  • the first binding pin of the first portion and the first binding pin of the second portion are disposed in the bending region.
  • the non-display area further includes a non-bend area connected to the bend area; relative to the bend area, the non-bend area is close to the display area; the second binding pin It is disposed in the non-bent area.
  • FIG. 1 is a top view of a display panel bound to a flip-chip film and a main flexible circuit board in the related art
  • FIG. 2 is a side view of a display panel bound to a flip-chip film and a main flexible circuit board in the related art
  • FIG. 3 is a side view of a touch display device including a display panel and a touch panel in the related art bound to a flip-chip film and a main flexible circuit board;
  • FIG. 4 is a schematic top view of a display substrate according to an embodiment of the present disclosure.
  • FIG. 5 is a top view of a touch display device according to an embodiment of the present disclosure.
  • FIG. 6 is a side view of a display panel and a flexible circuit board bound in a touch display device according to an embodiment of the present disclosure
  • FIG. 7 is a side view of a touch display device according to an embodiment of the present disclosure.
  • FIG. 8 is a schematic flowchart of a manufacturing method of a touch display device according to an embodiment of the present disclosure
  • FIG. 9 is a schematic flowchart of a method for manufacturing a touch display device according to another embodiment of the present disclosure.
  • FIG. 10 is a schematic flowchart of a manufacturing method of a touch display device according to another embodiment of the present disclosure.
  • FIG. 1 is a top view of a display panel in the related art bound with a flip-chip film and a main flexible circuit board.
  • FIG. 2 is a display panel in the related art Side view of a circuit board binding.
  • FIG. 3 is a side view of a related art touch display device including a display panel and a touch panel bound to a flip-chip film and a main flexible circuit board.
  • the display panel 50 includes a display area 10 and a non-display area 20 located on the periphery of the display area 10. A plurality of binding pins 21 are disposed in the non-display area 20.
  • the display panel 50 When performing the bonding process, first, the display panel 50 needs to be bonded to a flip-chip film (COF) 30 provided with a driver IC 31 and a main flexible circuit board (MFPC) 40. Please refer to FIG. 1 and FIG. FIG. 2; Binding the touch panel 60 to a touch flexible circuit board (TFPC) 70 provided with a touch IC 71; then, attaching the touch panel 60 to the display panel 50, and finally, The main flexible circuit board 40 is bound to the touch flexible circuit board 70, please refer to FIG. 3. It can be seen that in the above binding process, multiple bindings are required, and the binding process is complicated.
  • COF flip-chip film
  • MFPC main flexible circuit board
  • An embodiment of the present disclosure provides a display substrate including a display area 100 and The non-display area 200 is provided with a plurality of first binding pins 201 and a plurality of second binding pins 202.
  • the first binding pin 201 is used for binding with a flexible circuit board, and part of the first binding pin 201 is connected to a signal line (not shown) provided in the display area 100, so that The signal line can communicate with a driver integrated circuit (Driver IC) on the flexible circuit board through the first binding pin 201.
  • the driving integrated circuit is used to provide a driving signal for display to the display substrate.
  • the driving signal may include a gate scan signal and a data signal.
  • some of the first binding pins 201 are connected to signal lines in the display area 100 through signal line leads 203 provided in the non-display area 200.
  • the signal lines may include gate lines and Data lines, etc.
  • the second binding pins 202 are used for binding with the touch panel, and the second binding pins 202 are connected one-to-one with the other part of the first binding pins 201 so that the touch panel
  • the upper touch electrode can communicate with a touch integrated circuit (Touch IC) on the flexible circuit board through the second binding pin 202 and the first binding pin 201.
  • the touch integrated circuit is used to provide a touch signal to the touch panel.
  • the touch electrodes on the touch panel can be connected to the second binding pin 202 through a touch electrode lead or the like, thereby enabling the touch electrodes on the touch panel to pass through the first
  • the two binding pins 202 and the first binding pin 201 are in communication with a touch integrated circuit (Touch IC) on the flexible circuit board.
  • Touch IC touch integrated circuit
  • a second binding pin 202 for binding with the touch panel is added to the display substrate, the second binding pin 202 is connected to the first binding pin 201, and the first binding lead
  • the pin 201 is used for binding with a flexible circuit board, and a driving integrated circuit and a touch integrated circuit are simultaneously provided on the flexible circuit board.
  • the touch panel can be directly bonded to the display panel with the display substrate through the second binding pin 202, and the first binding guide through the display substrate Pin 201 communicates with the touch integrated circuit on the flexible circuit board.
  • the touch panel does not need to be separately bound to the touch flexible circuit board.
  • the touch control provided with the touch integrated circuit in the binding process in the related technology is reduced.
  • the step of binding the flexible circuit board to the main flexible circuit board simplifies the bonding process.
  • the display substrate in the embodiment of the present disclosure may be a flexible display substrate that can be bent, or a rigid display substrate that cannot be bent.
  • the base substrate of the display substrate is made of a flexible material, such as resin.
  • the base substrate of the display substrate is made of a rigid material, such as glass.
  • the non-display area 200 may include a bent area 210 and a non-bent area 220.
  • the bending area 210 may be bent toward the back side (non-display side) of the display panel, so that the flexible circuit board bound to the display panel is bent to the back side of the display panel, thereby achieving a narrow frame.
  • the bending region 210 is generally disposed on a lower frame of the display panel.
  • the first binding pin 201 is disposed in the bending area 210, so that the width of the non-bending area 220 can be reduced, and a narrow frame can be further realized.
  • the second binding pin 202 is disposed in the non-bent area 220. Since the second binding pin 202 needs to be bound to the touch panel, if the second binding pin 202 is bound to the touch panel, The binding pin 202 is disposed in the bending region 210, which will inevitably increase the thickness of the bending region 210 and affect the bending. Therefore, setting the second binding pin 202 in the non-bending region 220 can avoid bending. The thickness of the region 210 is too large, which affects the problem of bending.
  • the display substrate in the embodiments of the present disclosure may be a liquid crystal display substrate, an organic light emitting diode (OLED) display substrate, or other types of display substrates.
  • OLED organic light emitting diode
  • the display substrate in the embodiments of the present disclosure is generally an array substrate.
  • An embodiment of the present disclosure further provides a display panel including the display substrate in any of the above embodiments.
  • the display panel in the embodiment of the present disclosure may be a liquid crystal display panel, an organic light emitting diode display panel, or other types of display panels.
  • the liquid crystal display panel may include an opposite substrate (usually a color filter substrate) in addition to the display substrate (usually an array substrate) in the above embodiments. And a liquid crystal layer sandwiched between the display substrate and the opposite substrate.
  • an opposite substrate usually a color filter substrate
  • the display substrate usually an array substrate
  • the organic light emitting diode display panel may include a package substrate and the like in addition to the display substrate (usually an array substrate) in the above embodiments.
  • An embodiment of the present disclosure further provides a touch display device, which includes the display panel in the above embodiment and a touch panel attached to the display panel.
  • a side of the touch panel having a touch electrode faces the display panel, so that the touch electrode can be connected to the display panel.
  • the second binding pin is connected.
  • the touch display device in the embodiment of the present disclosure may further include: a flexible circuit board provided with a driving integrated circuit and a touch integrated circuit, and the flexible circuit board passes a plurality of first integrated circuits on the display panel.
  • a binding pin is bound to the display panel, the driving integrated circuit is in communication with a signal line on the display panel through a portion of the first binding pin, and the touch integrated circuit is connected through another portion of the The first binding pin and the second binding pin are in communication with a touch electrode on the touch panel.
  • the flexible circuit board includes: a chip-on-film (Flex, Chip, On-Film, or COF) and a main flexible circuit board (Main Flexible Printed Circuit, MFPC)
  • the driving integrated circuit is disposed on the flip-chip film, and the touch integrated circuit is disposed on the main flexible circuit board.
  • the flexible circuit board is at least partially bent to a side of the display panel away from the touch panel (that is, a back side of the display panel).
  • the display panel may be a flexible display panel, the display panel includes a display area and a non-display area, and the non-display area further includes a bent area, and the first binding pin is provided at In the bending area, after the display panel is bound to the flexible circuit board through the first binding pin, the bending area can be bent toward the back side (non-display side) of the display panel, so that The flexible circuit board bound to the display panel is bent to the back side of the display panel.
  • the flexible circuit board (such as a flip-chip film) may also be directly bent, and a part of the flexible circuit board may be bent to the back side of the display panel.
  • the display panel may be a flexible display panel or a rigid display panel.
  • the touch display device includes:
  • a display panel comprising a display substrate, the display substrate comprising: a display area and a non-display area located outside the display area; the non-display area is provided with a plurality of first binding pins and a plurality of Second binding pins; part of the first binding pins are connected to signal lines provided in the display area; the second binding pins are one by one with another part of the first binding pins Correspondingly connected; the display panel is a flexible display panel, the non-display area includes a bent area and a non-bent area, the first binding pin is disposed in the bent area, and the second binding The pins are disposed in the non-bent area;
  • a touch panel is attached to the display panel, and the touch panel is bound to the display panel through the second binding pin;
  • a flexible circuit board includes a flip-chip film and a main flexible circuit board.
  • a drive integrated circuit is provided on the flip-chip film.
  • a touch control integrated circuit is provided on the main flexible circuit board.
  • the flip-chip film passes through the first The binding pins are bound to the display panel, and the flexible circuit board is bent to a side of the display panel away from the touch panel.
  • the touch display device in the embodiment of the present disclosure may be a liquid crystal display device, an organic light emitting diode display device, or another type of display device.
  • FIG. 5 is a top view of a touch display device according to an embodiment of the present disclosure
  • FIG. 6 is a side view of a display panel and a flexible circuit board in the touch display device according to an embodiment of the present disclosure
  • 7 is a side view of a touch display device according to an embodiment of the present disclosure.
  • the touch display device includes a display panel 500, a touch panel 600, and a flexible circuit board bound to the display panel 500.
  • the display panel 500 includes a display substrate including a display area and a non-display area.
  • a first binding pin 201 is provided in the non-display area for binding with a flexible circuit board.
  • a non-display area is further provided with The second binding pin 202 is used for binding with the touch panel 600.
  • the touch panel 600 is attached to the display side of the display panel 500 through an optical adhesive (OCA) 703.
  • OCA optical adhesive
  • the touch panel 600 includes a touch substrate 601 and a touch electrode 602 disposed on the touch substrate 601.
  • the touch electrode 602 faces the display.
  • the panel 500 is provided so as to be able to be connected to the second binding pin 202.
  • the flexible circuit board includes: a flip-chip film 300 and a main flexible circuit board 400.
  • the flip-chip film 300 is provided with a driving integrated circuit 301
  • the main flexible circuit board 400 is provided with a touch integrated circuit 401.
  • the driving integrated circuit 301 communicates with the signal lines in the display area of the display panel 500 through a part of the first binding pin 201; the touch integrated circuit 401 uses another part of the first binding pin 201 and the second binding pin 202 Is in communication with the touch electrode 602 on the touch panel 600.
  • a second binding pin 202 for binding with the touch panel 600 is added to the display panel 500, the second binding pin 202 is connected to the first binding pin 201, and the first binding
  • the fixed pin 201 is used for binding with a flexible circuit board, and a driving integrated circuit and a touch integrated circuit are simultaneously provided on the flexible circuit board.
  • the display panel 500 in the embodiment of the present disclosure is a flexible display panel. Please refer to FIG. 7.
  • the display panel 500 in the embodiment of the present disclosure includes a bent area, and the bent area may be toward the back of the display panel 500
  • the non-display side is bent so that the flexible circuit board (the flip-chip film 300 and the main flexible circuit board 400) is located on the back side of the display panel 500.
  • the bent area is located on a lower frame of the touch display device.
  • the width of the lower frame 800 of the touch display device is equal to a, where a is the width from the display area (Panel AA) of the display panel 500 to the panel bending point (Panel Bending Point).
  • the display panel 50 of the touch display device in the related art also includes a bending area, which can be bent toward the back side (non-display side) of the display panel 50 so that the main flexible circuit board 40 is located on the display panel.
  • the touch flexible circuit board 70 can also be bent toward the back side of the display panel 50 so that the touch flexible circuit board 70 is located on the back side of the display panel 50.
  • the bent area is located on a lower frame of the touch display device. It can be seen from FIG.
  • the width of the lower frame 80 of the touch display device is equal to a + b, where a is the width of the display area of the display panel (Panel AA) to the display panel bending point (Panel Bending Point), b is the width from the bending point of the display panel to the bending point of the touch flexible circuit board 70, usually b ⁇ 0.3 mm.
  • a is the width of the display area of the display panel (Panel AA) to the display panel bending point (Panel Bending Point)
  • b is the width from the bending point of the display panel to the bending point of the touch flexible circuit board 70, usually b ⁇ 0.3 mm.
  • the bending area needs to complete two layers of bending (the bending of the main flexible circuit board 40 and the bending of the touch flexible circuit board 70).
  • the width of the bending area is large, which is not conducive to ultra-narrow The implementation of the border.
  • the touch panel 600 in the embodiment of the present disclosure can be directly bound to the display panel 500, the display panel 500 is integrated with the main flexible circuit board 400.
  • the touch integrated circuit 401 is connected, so only one layer of bending is needed in the bending area, so that the width of the bending area becomes smaller (compared to FIG. 3, reducing b), which is beneficial to the realization of ultra-narrow bezels. .
  • the laminating adhesive 701 is used to fix the bent display panel 500 to the back side of the display panel 500.
  • the laminating adhesive 701 may be foam.
  • a heat dissipation film (SCF) 702 which is disposed on a side of the display panel 500 away from the touch panel, and is configured to dissipate heat from the display panel 500;
  • a polarizer 704 is disposed on a side of the touch panel 600 remote from the display panel 500;
  • the package cover 705 is disposed on a side of the touch panel 600 remote from the display panel 500.
  • the package cover 705 is usually a glass cover.
  • FIG. 8 is a schematic flowchart of a manufacturing method of a touch display device according to an embodiment of the present disclosure.
  • the manufacturing method includes:
  • Step S11 A display panel is provided.
  • the display panel includes a display substrate.
  • the display substrate includes a display area and a non-display area located on the periphery of the display area.
  • a plurality of first bindings are provided in the non-display area.
  • a fixed pin and a plurality of second binding pins; part of the first binding pin is connected to a signal line provided in the display area; the second binding pin is connected to another part of the first binding pin One-to-one corresponding connection of fixed pins;
  • Step S12 Binding the display panel to a flexible circuit board through the first binding pin, where the flexible circuit board includes a driving integrated circuit and a touch integrated circuit;
  • Step S13 bonding the display panel to the touch panel, and binding the display panel to the touch panel through the second binding pin.
  • the display panel is a flexible display panel
  • the non-display area includes a bent area. After the display panel is bound to the flexible circuit board through a first binding pin, Including: bending and fixing the bent area toward a side of the display panel away from the touch panel, so that the flexible circuit board is located at a side of the display panel away from the touch panel .
  • a method for manufacturing a touch display device includes:
  • Step S21 A display panel is provided.
  • the display panel includes a display substrate.
  • the display substrate includes a display area and a non-display area located on the periphery of the display area.
  • a plurality of first bindings are provided in the non-display area.
  • the fixed pins are connected one-to-one correspondingly;
  • the display panel is a flexible display panel,
  • the non-display area includes a bent area and a non-bent area, and the first binding pin is disposed in the bent area.
  • the second binding pin is disposed in the non-bent area;
  • Step S22 Binding the display panel to a flexible circuit board through the first binding pin.
  • the flexible circuit board includes a flip-chip film and a main flexible circuit board, and the flip-chip film is provided with a driving integrated circuit.
  • a touch integrated circuit is provided on the main flexible circuit board, and the flip-chip film is bound to the display panel through the first binding pin;
  • Step S23 bonding the display panel to the touch panel, and binding the display panel to the touch panel through the second binding pin;
  • Step S24 Bend and fix the bent area toward a side of the display panel away from the touch panel, so that the flexible circuit board is located at a side of the display panel away from the touch panel. side.
  • FIG. 10 is a schematic flowchart of a method for manufacturing a touch display device according to another embodiment of the present disclosure. The method may include the following steps:
  • Step S31 forming a display panel 500.
  • the display panel 500 includes a display substrate.
  • the display substrate includes a display area 100 and a non-display area 200.
  • the non-display area 200 is provided with a first binding pin 201 and a second binding.
  • Fixed pin (Touch Panel Bonding Pin) 202, the second binding pin 202 and a part of the first binding pin 201 are connected one by one;
  • Step S32 Binding the display panel 500 to the flip-chip film 300 and the main flexible circuit board 400 through a part of the first bonding pin 201 (also referred to as a second part of the first bonding pin), and the flip-chip film A driving integrated circuit 301 is provided on 300, and a touch integrated circuit 401 is provided on the main flexible circuit board 400;
  • Step S33 bonding the display panel 500 and the touch panel 600 through the optical glue 703, and the touch electrodes 602 on the touch panel 600 face the display panel 500 during bonding;
  • Step S34 Binding the display panel 500 and the touch panel 600 through the second binding pin 202, so that the touch electrode 602 on the touch panel 600 can pass the second binding pin 202 and the first part A binding pin 201 is in communication with the touch integrated circuit 401 on the FPC400;
  • Step S35 attach the polarizer 704 to the touch panel 600;
  • Step S36 attaching the packaging cover 705 to the polarizer 704;
  • Step S37 attach the heat dissipation film 702 to a side of the display panel 500 far from the touch panel 600;
  • Step S38 attach the adhesive 701 to the heat dissipation film 702;
  • Step S39 Bend the bent area of the display panel 500 to the side of the display panel 500 away from the touch panel 600, and fix the display panel 500 to a side of the display panel 500 away from the touch panel 600 with adhesive side.

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Abstract

本公开提供一种显示基板、显示面板、触控显示装置及其制作方法，该显示基板包括显示区域、非显示区域、设置在所述显示区域内的信号线、设置在非显示区域内的、用于与柔性电路板绑定的多个第一部分第一绑定引脚、多个第二部分第一绑定引脚和设置在所述非显示区域内的、用于与触控面板绑定的多个第二绑定引脚。所述第二部分第一绑定引脚与信号线连接；第二绑定引脚与所述第一部分第一绑定引脚一一对应连接。

Description

显示基板、显示面板、触控显示装置及其制作方法
相关申请的交叉引用
本申请主张在2018年5月25日在中国提交的中国专利申请号No.201810516544.1的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及显示技术领域，尤其涉及一种显示基板、显示面板、触控显示装置及其制作方法。
背景技术
外挂式触控显示装置，是将外挂式触控屏贴覆在显示面板的外侧。相关技术中，在进行外挂式触控显示装置的绑定(bonding)工艺时，首先，需要将显示面板与设置有驱动集成电路(Driver IC)的覆晶薄膜(Chip On Flex，or，Chip On Film，简称COF)和主柔性电路板(Main Flexible Printed Circuit，简称MFPC)绑定，将触控面板与设置有触控集成电路(Touch IC)的触控柔性电路板(Touch Flexible Printed Circuit，简称TFPC)绑定，然后，将触控面板与显示面板贴合，最后，将主柔性电路板与触控柔性电路板绑定。可以看出，绑定工艺中，需要进行多次绑定，绑定过程复杂。
发明内容
本公开实施例提供一种显示基板，包括：显示区域；位于所述显示区域外围的非显示区域；设置在所述显示区域内的信号线；设置在所述非显示区域内的、用于与柔性电路板绑定的多个第一部分第一绑定引脚；设置在所述非显示区域内的、用于与柔性电路板绑定的多个第二部分第一绑定引脚；和设置在所述非显示区域内的、用于与触控面板绑定的多个第二绑定引脚。所述第二绑定引脚与第一部分第一绑定引脚一一对应连接。
可选地，所述显示基板为柔性显示基板，所述非显示区域包括弯折区域和与所述弯折区域连接的非弯折区域；相对于所述弯折区域，所述非弯折区 域靠近所述显示区域；所述第一部分第一绑定引脚和所述第二部分第一绑定引脚设置于所述弯折区域内。
可选地，所述第二绑定引脚设置于所述非弯折区域内。
本公开还提供一种显示面板，包括上述显示基板。
本公开还提供一种触控显示装置，包括上述显示面板以及贴覆在所述显示面板上的触控面板；其中，所述触控面板上的触控电极与所述显示面板的显示基板中的第二绑定引脚连接。
可选地，所述触控显示装置还包括：
柔性电路板，所述柔性电路板上设置有驱动集成电路和触控集成电路，所述驱动集成电路通过所述显示面板的显示基板中的第二部分第一绑定引脚与所述显示面板上的信号线连通，所述触控集成电路通过所述显示面板的显示基板中的第一部分第一绑定引脚以及所述第二绑定引脚，与所述触控面板上的触控电极连通。
可选地，所述柔性电路板包括：覆晶薄膜和主柔性电路板，所述驱动集成电路设置于所述覆晶薄膜上，所述触控集成电路设置于所述主柔性电路板上。
可选地，所述柔性电路板至少部分被弯折至所述显示面板的远离所述触控面板的一侧。
可选地，所述触控显示装置还包括以下至少之一：
散热膜，设置于所述显示面板的远离所述触控面板的一侧；
偏光片，设置于所述触控面板的远离所述显示面板的一侧；
封装盖板，设置于所述触控面板的远离所述显示面板的一侧。
可选地，所述显示面板为柔性显示面板，所述非显示区域包括弯折区域和与所述弯折区域连接的非弯折区域；相对于所述弯折区域，所述非弯折区域靠近所述显示面板的显示区域；所述触控显示装置还包括：
贴合胶，用于将所述弯折区域固定在所述显示面板的远离所述触控面板的一侧。
本公开还提供一种触控显示装置的制作方法，包括：
提供一显示面板，所述显示面板包括一显示基板，所述显示基板包括： 显示区域和位于所述显示区域外围的非显示区域，所述非显示区域内设置有多个第一部分第一绑定引脚、多个第二部分第一绑定引脚多个第二绑定引脚；所述第二部分第一绑定引脚与所述显示区域内设置的信号线连接；所述第二绑定引脚与第一一部分第一绑定引脚一一对应连接；
将所述显示面板通过所述第一部分第一绑定引脚和所述第二部分第一绑定引脚与柔性电路板绑定，所述柔性电路板上设置有驱动集成电路和触控集成电路；
将所述显示面板与触控面板贴合，将所述显示面板通过所述第二绑定引脚与所述触控面板绑定。
可选地，所述显示面板为柔性显示面板，所述非显示区域包括弯折区域，将所述显示面板通过所述第一部分第一绑定引脚和所述第二部分第一绑定引脚与柔性电路板绑定之后还包括：
将所述弯折区域朝向所述显示面板的远离所述触控面板的一侧进行弯折并固定，使得所述柔性电路板位于所述显示面板的远离所述触控面板的一侧。
可选地，所述将所述弯折区域朝向所述显示面板的远离所述触控面板的一侧进行弯折并固定的步骤之前，还包括：
将偏光片贴覆至触控面板上；
将封装盖板贴覆至所述偏光片上；
将散热膜贴合至所述显示面板的远离所述触控面板的一侧；
将贴合胶贴合至所述散热膜上；
其中，所述将所述弯折区域朝向所述显示面板的远离所述触控面板的一侧进行弯折并固定的步骤包括：
利用贴合胶将所述弯折区域固定在所述显示面板的远离所述触控面板的一侧。
其中，所述第一部分第一绑定引脚和所述第二部分第一绑定引脚设置于所述弯折区域内。
其中，所述非显示区域还包括与所述弯折区域连接的非弯折区域；相对于所述弯折区域，所述非弯折区域靠近所述显示区域；所述第二绑定引脚设置于所述非弯折区域内。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对本公开实施例的描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1是相关技术中的显示面板与覆晶薄膜和主柔性电路板绑定的俯视图；
图2为相关技术中的显示面板与覆晶薄膜和主柔性电路板绑定的侧视图；
图3为相关技术中的包括显示面板和触控面板的触控显示装置与覆晶薄膜和主柔性电路板绑定的侧视图；
图4为本公开一实施例的显示基板的俯视示意图；
图5为本公开一实施例的触控显示装置的俯视图；
图6为本公开一实施例的触控显示装置中的显示面板与柔性电路板绑定的侧视图；
图7为本公开一实施例的触控显示装置的侧视图；
图8为本公开一实施例的触控显示装置的制作方法流程示意图；
图9为本公开另一实施例的触控显示装置的制作方法流程示意图；
图10为本公开又一实施例的触控显示装置的制作方法流程示意图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
请参考图1、图2和图3，图1是相关技术中的显示面板与覆晶薄膜和主柔性电路板绑定的俯视图，图2为相关技术中的显示面板与覆晶薄膜和主柔性电路板绑定的侧视图，图3为相关技术中的包括显示面板和触控面板的触控显示装置与覆晶薄膜和主柔性电路板绑定的侧视图。该显示面板50包括显示区域10和位于所述显示区域10外围的非显示区域20，所述非显示区域20 内设置有多个绑定引脚21。
在进行绑定工艺时，首先，需要将显示面板50与设置有驱动集成电路(Driver IC)31的覆晶薄膜(COF)30以及主柔性电路板(MFPC)40绑定，请参考图1和图2；将触控面板60与设置有触控集成电路(Touch IC)71的触控柔性电路板(TFPC)70绑定；然后，将触控面板60与显示面板50贴合，最后，将主柔性电路板40与触控柔性电路板70绑定，请参考图3。可以看出，上述绑定工艺中，需要进行多次绑定，绑定过程复杂。
为解决相关技术中的触控显示装置在绑定工艺中绑定过程复杂的问题，请参考图4，本公开实施例提供一种显示基板，包括显示区域100和位于所述显示区域100外围的非显示区域200，所述非显示区域200内设置有多个第一绑定引脚201和多个第二绑定引脚202。所述第一绑定引脚201用于与柔性电路板绑定，其中，部分所述第一绑定引脚201与所述显示区域100内设置的信号线(图未示出)连接，使得所述信号线能够通过第一绑定引脚201与所述柔性电路板上的驱动集成电路(Driver IC)连通。驱动集成电路用于向显示基板提供显示所用的驱动信号，驱动信号可以包括栅扫描信号和数据信号等。在图4所示的实施例中，部分所述第一绑定引脚201通过非显示区域200内设置的信号线引线203，与显示区域100中的信号线连接，信号线可以包括栅线和数据线等。所述第二绑定引脚202用于与触控面板绑定，所述第二绑定引脚202与另一部分所述第一绑定引脚201一一对应连接，使得所述触控面板上的触控电极能够通过所述第二绑定引脚202和第一绑定引脚201，与所述柔性电路板上的触控集成电路(Touch IC)连通。触控集成电路用于向触控面板提供触控信号。实际使用时，所述触控面板上的触控电极可以通过触控电极引线等与所述第二绑定引脚202连接，进而使得所述触控面板上的触控电极能够通过所述第二绑定引脚202和第一绑定引脚201与所述柔性电路板上的触控集成电路(Touch IC)连通。
本公开实施例中，在显示基板上增加用于与触控面板绑定的第二绑定引脚202，第二绑定引脚202与第一绑定引脚201连接，第一绑定引脚201用于与柔性电路板绑定，柔性电路板上同时设置有驱动集成电路和触控集成电路。当具有该显示基板的显示面板进行绑定工艺时，触控面板可以通过第二 绑定引脚202直接绑定在具有该显示基板的显示面板上，通过该显示基板上的第一绑定引脚201与柔性电路板上的触控集成电路连通，触控面板不需要单独与触控柔性电路板绑定，同时，减少了相关技术中的绑定工艺中设置有触控集成电路的触控柔性电路板与主柔性电路板绑定的步骤，简化了绑定工艺。
本公开实施例中的显示基板可以是可弯折的柔性显示基板，也可以是不可弯折的刚性显示基板。当显示基板为柔性显示基板时，显示基板的衬底基板采用柔性材料制成，例如树脂。当显示基板为刚性显示基板时，显示基板的衬底基板采用刚性材料制成，例如玻璃。
请参考图4，当本公开实施例中的显示基板为柔性显示基板时，所述非显示区域200可以包括弯折区域210和非弯折区域220，当具有该显示基板的显示面板完成绑定工艺之后，可以在弯折区域210向显示面板的背侧(非显示侧)弯折，使得与显示面板绑定的柔性电路板弯折至显示面板的背侧，从而实现窄边框。弯折区域210通常设置于显示面板的下边框。
本公开实施例中，可选地，所述第一绑定引脚201设置于所述弯折区域210内，从而可以减小非弯折区域220的宽度，进一步实现窄边框。
本公开实施例中，可选地，所述第二绑定引脚202设置于所述非弯折区域220内，由于第二绑定引脚202需要与触控面板绑定，如果将第二绑定引脚202设置于弯折区域210内，势必会增加弯折区域210的厚度，影响弯折，因而，将第二绑定引脚202设置于非弯折区域220内，可以避免弯折区域210的厚度过大，影响弯折的问题。
本公开实施例中的显示基板可以是液晶显示基板，也可以是有机发光二极管(OLED)显示基板，或者其他类型的显示基板。
本公开实施例中的显示基板通常为阵列基板。
本公开实施例还提供一种显示面板，包括上述任一实施例中的显示基板。
本公开实施例中的显示面板可以是液晶显示面板，也可以是有机发光二极管显示面板，或者其他类型的显示面板。
当本公开实施例的显示面板为液晶显示面板时，所述液晶显示面板除了包括上述实施例中的显示基板(通常为阵列基板)之外，还可以包括对向基 板(通常为彩膜基板)、以及夹设于所述显示基板和对向基板之间的液晶层。
当本公开实施例中的显示面板为有机发光二极管显示面板时，所述有机发光二极管显示面板除了包括上述实施例中的显示基板(通常为阵列基板)之外，还可以包括封装基板等。
本公开实施例还提供一种触控显示装置，包括上述实施例中的显示面板以及贴覆在所述显示面板上的触控面板。
需要说明的是，本公开实施例中，触控面板和显示面板贴合时，触控面板的具有触控电极的一侧面向所述显示面板，从而使得触控电极能够与所述显示面板上的第二绑定引脚连接。
本公开实施例中的触控显示装置还可以包括：柔性电路板，所述柔性电路板上设置有驱动集成电路和触控集成电路，所述柔性电路板通过所述显示面板上的多个第一绑定引脚与所述显示面板绑定，所述驱动集成电路通过部分所述第一绑定引脚与所述显示面板上的信号线连通，所述触控集成电路通过另一部分所述第一绑定引脚以及所述第二绑定引脚，与所述触控面板上的触控电极连通。
在本公开的一些可选实施例中，所述柔性电路板包括：覆晶薄膜(Chip On Flex，or，Chip On Film，简称COF)和主柔性电路板(Main Flexible Printed Circuit，简称MFPC)，所述驱动集成电路设置于所述覆晶薄膜上，所述触控集成电路设置于所述主柔性电路板上。
在本公开的一些可选实施例中，所述柔性电路板至少部分被弯折至所述显示面板的远离所述触控面板的一侧(即所述显示面板的背侧)。
在一些实施例中，所述显示面板可以是柔性显示面板，所述显示面板包括显示区域和非显示区域，所述非显示区域又包括弯折区域，所述第一绑定引脚设置于所述弯折区域内，显示面板通过所述第一绑定引脚与柔性电路板绑定后，可以将弯折区域向所述显示面板的背侧(非显示侧)弯折，使得与所述显示面板绑定的柔性电路板被弯折至所述显示面板的背侧。
在另外一些实施例中，将显示面板与柔性电路板绑定之后，也可以直接弯折柔性电路板(例如覆晶薄膜)，将柔性电路板的部分弯折至所述显示面板的背侧。该种情况下，显示面板可以是柔性显示面板，也可以是刚性显示面 板。
在本公开的一些可选实施例中，本公开实施例的触控显示装置包括：
显示面板，所述显示面板包括一显示基板，所述显示基板包括：显示区域和位于所述显示区域外围的非显示区域，所述非显示区域内设置有多个第一绑定引脚和多个第二绑定引脚；部分所述第一绑定引脚与所述显示区域内设置的信号线连接；所述第二绑定引脚与另一部分所述第一绑定引脚一一对应连接；所述显示面板为柔性显示面板，所述非显示区域包括弯折区域和非弯折区域，所述第一绑定引脚设置于所述弯折区域内，所述第二绑定引脚设置于所述非弯折区域内；
触控面板，贴覆在所述显示面板上，所述触摸面板通过所述第二绑定引脚与所述显示面板绑定；
柔性电路板，包括覆晶薄膜和主柔性电路板，所述覆晶薄膜上设置有驱动集成电路，所述主柔性电路板上设置有触控集成电路，所述覆晶薄膜通过所述第一绑定引脚与所述显示面板绑定，所述柔性电路板被弯折至所述显示面板的远离所述触控面板的一侧。
本公开实施例中的触控显示装置可以是液晶显示装置，也可以是有机发光二极管显示装置，或者，其他类型的显示装置。
请参考图5、图6和图7，图5为本公开实施例的触控显示装置的俯视图，图6为本公开实施例的触控显示装置中的显示面板与柔性电路板绑定的侧视图，图7为本公开实施例的触控显示装置的侧视图，该触控显示装置包括：显示面板500、触控面板600以及与显示面板500绑定的柔性电路板。
显示面板500包括一显示基板，该显示基板包括显示区域和非显示区域，非显示区域内设置有第一绑定引脚201，用于与柔性电路板绑定，同时非显示区域内还设置有第二绑定引脚202，用于与触控面板600绑定。
触控面板600通过光学胶(OCA)703贴合在显示面板500的显示侧，触控面板600包括触控基板601和设置于触控基板601上的触控电极602，触控电极602朝向显示面板500设置，从而能够与第二绑定引脚202连接。
柔性电路板包括：覆晶薄膜300和主柔性电路板400，覆晶薄膜300上设置有驱动集成电路301，主柔性电路板400上设置有触控集成电路401。驱 动集成电路301通过部分第一绑定引脚201，与显示面板500的显示区域内的信号线连通；触控集成电路401通过另一部分第一绑定引脚201和第二绑定引脚202，与触控面板600上的触控电极602连通。
本公开实施例中，在显示面板500上增加用于与触控面板600绑定的第二绑定引脚202，第二绑定引脚202与第一绑定引脚201连接，第一绑定引脚201用于与柔性电路板绑定，柔性电路板上同时设置有驱动集成电路和触控集成电路。当具有该显示面板500的触控显示装置进行绑定工艺时，触控面板600可以通过第二绑定引脚202直接绑定在具有该显示面板500上，通过第一绑定引脚201与柔性电路板上的触控集成电路401连通，触控面板600不需要单独与触控柔性电路板绑定，同时，减少了相关技术中的绑定工艺中设置有触控集成电路的触控柔性电路板与主柔性电路板绑定的步骤，简化了绑定工艺。
本公开实施例中的显示面板500为柔性显示面板，请参考图7，为了实现窄边框，本公开实施例中的显示面板500包括弯折区域，弯折区域可以向显示面板500的背侧(非显示侧)弯折，使得柔性电路板(覆晶薄膜300和主柔性电路板400)位于显示面板500的背侧。弯折区域位于触控显示装置的下边框。从图7中可以看出，触控显示装置的下边框800的宽度等于a，a为显示面板500的显示区域(Panel AA)到显示面板弯折点(Panel Bending Point)的宽度。
同时，请参考图3，相关技术中的触控显示装置的显示面板50也包括弯折区域，可以向显示面板50的背侧(非显示侧)弯折，使得主柔性电路板40位于显示面板50的背侧，同时，触控柔性电路板70也可以向显示面板50的背侧弯折，使得触控柔性电路板70位于显示面板50的背侧。弯折区域位于触控显示装置的下边框。从图3中可以看出，触控显示装置的下边框80的宽度等于a+b，其中，a为显示面板的显示区域(Panel AA)到显示面板弯折点(Panel Bending Point)的宽度，b为显示面板弯折点到触控柔性电路板70弯折点的宽度，通常b≥0.3mm。从图3中可以看出，弯折区域需要完成两层弯折(主柔性电路板40的弯折和触控柔性电路板70的弯折)，弯折区域的宽度较大，不利于超窄边框的实现。
与图3中所示的相关技术中的触控显示装置进行比较可知，由于本公开实施例中触控面板600可以直接与显示面板500绑定，通过显示面板500与集成在主柔性电路板400上的触控集成电路401连通，因而，在弯折区域只需要一层弯折，从而使得弯折区域的宽度变小(与图3比，减少了b)，从而有利于超窄边框的实现。
本公开实施例中的触控显示装置还可以包括以下至少之一：
贴合胶701，用于将弯折的显示面板500固定至所述显示面板500的背侧；贴合胶701可以采用泡棉胶(Foam)。
散热膜(SCF)702，设置于所述显示面板500的远离所述触控面板的一侧，用于为所述显示面板500散热；
偏光片704，设置于所述触控面板600的远离所述显示面板500的一侧；
封装盖板705，设置于所述触控面板600的远离所述显示面板500的一侧。封装盖板705通常为玻璃盖板。
请参考图8，图8为本公开一实施例的触控显示装置的制作方法的流程示意图，该制作方法包括：
步骤S11：提供一显示面板，所述显示面板包括一显示基板，所述显示基板包括：显示区域和位于所述显示区域外围的非显示区域，所述非显示区域内设置有多个第一绑定引脚和多个第二绑定引脚；部分所述第一绑定引脚与所述显示区域内设置的信号线连接；所述第二绑定引脚与另一部分所述第一绑定引脚一一对应连接；
步骤S12：将所述显示面板通过所述第一绑定引脚与柔性电路板绑定，所述柔性电路板包括驱动集成电路和触控集成电路；
步骤S13：将所述显示面板与触控面板贴合，将所述显示面板通过所述第二绑定引脚与所述触控面板绑定。
在本公开的一些可选实施例中，所述显示面板为柔性显示面板，所述非显示区域包括弯折区域，将所述显示面板通过第一绑定引脚与柔性电路板绑定之后还包括：将所述弯折区域朝向所述显示面板的远离所述触控面板的一侧进行弯折并固定，使得所述柔性电路板位于所述显示面板的远离所述触控面板的一侧。
在本公开的一些可选实施例中，请参考图9，本公开实施例的触控显示装置的制作方法包括：
步骤S21：提供一显示面板，所述显示面板包括一显示基板，所述显示基板包括：显示区域和位于所述显示区域外围的非显示区域，所述非显示区域内设置有多个第一绑定引脚和多个第二绑定引脚；部分所述第一绑定引脚与所述显示区域内设置的信号线连接；所述第二绑定引脚与另一部分所述第一绑定引脚一一对应连接；所述显示面板为柔性显示面板，所述非显示区域包括弯折区域和非弯折区域，所述第一绑定引脚设置于所述弯折区域内，所述第二绑定引脚设置于所述非弯折区域内；
步骤S22：将所述显示面板通过所述第一绑定引脚与柔性电路板绑定，所述柔性电路板包括覆晶薄膜和主柔性电路板，所述覆晶薄膜上设置有驱动集成电路，所述主柔性电路板上设置有触控集成电路，所述覆晶薄膜通过所述第一绑定引脚与所述显示面板绑定；
步骤S23：将所述显示面板与触控面板贴合，将所述显示面板通过所述第二绑定引脚与所述触控面板绑定；
步骤S24：将所述弯折区域朝向所述显示面板的远离所述触控面板的一侧进行弯折并固定，使得所述柔性电路板位于所述显示面板的远离所述触控面板的一侧。
请参考图5、图6、图7和图10，图10为本公开又一实施例的触控显示装置的制作方法的流程示意图，可以包括以下步骤：
步骤S31：形成显示面板(panel)500，显示面板500包括一显示基板，该显示基板包括显示区域100和非显示区域200，非显示区域200上设置有第一绑定引脚201和第二绑定引脚(Touch Panel Bonding Pin)202，第二绑定引脚202与部分第一绑定引脚201(也可称为第一部分第一绑定引脚)一一对应连接；
步骤S32：通过一部分第一绑定引脚201(也可称为第二部分第一绑定引脚)，将显示面板500与覆晶薄膜300和主柔性电路板400进行绑定，覆晶薄膜300上设置有驱动集成电路301，主柔性电路板400上设置有触控集成电路401；
步骤S33：将显示面板500与触控面板600通过光学胶703进行贴合，贴合时触控面板600上的触控电极602朝向显示面板500；
步骤S34：通过第二绑定引脚202，将显示面板500与触控面板600进行绑定，从而使得触控面板600上的触控电极602能够通过第二绑定引脚202和第一部分第一绑定引脚201，与FPC400上的触控集成电路401连通；
步骤S35：将偏光片704贴覆至触控面板600上；
步骤S36：将封装盖板705贴覆至偏光片704上；
步骤S37：将散热膜702贴合至显示面板500的远离所述触控面板600的一侧；
步骤S38：将贴合胶701贴合至散热膜702上；
步骤S39：将显示面板500的弯折区域弯折至显示面板500的远离所述触控面板600的一侧，并利用贴合胶701固定在显示面板500的远离所述触控面板600的一侧。
除非另作定义，本公开中使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也相应地改变。
以上所述是本公开的可选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本公开所述原理的前提下，还可以作出若干改进和润饰，这些改进和润饰也应视为本公开的保护范围。

Claims (16)

  1. 一种显示基板，包括:
    显示区域；
    位于所述显示区域外围的非显示区域；
    设置在所述显示区域内的信号线；
    设置在所述非显示区域内的、用于与柔性电路板绑定的多个第一部分第一绑定引脚；
    设置在所述非显示区域内的、用于与柔性电路板绑定的多个第二部分第一绑定引脚；和
    设置在所述非显示区域内的、用于与触控面板绑定的多个第二绑定引脚；
    其中，所述第二部分第一绑定引脚与所述信号线连接；
    所述第二绑定引脚与第一部分第一绑定引脚一一对应连接。
  2. 根据权利要求1所述的显示基板，其中，所述显示基板为柔性显示基板，所述非显示区域包括弯折区域和与所述弯折区域连接的非弯折区域；相对于所述弯折区域，所述非弯折区域靠近所述显示区域；所述第一部分第一绑定引脚和所述第二部分第一绑定引脚设置于所述弯折区域内。
  3. 根据权利要求2所述的显示基板，其中，所述第二绑定引脚设置于所述非弯折区域内。
  4. 一种显示面板，包括如权利要求1-3任一项所述的显示基板。
  5. 一种触控显示装置，包括如权利要求4所述的显示面板以及贴覆在所述显示面板上的触控面板；其中，所述触控面板上的触控电极与所述显示面板的显示基板中的第二绑定引脚连接。
  6. 根据权利要求5所述的触控显示装置，还包括：柔性电路板；
    其中，所述柔性电路板上设置有驱动集成电路和触控集成电路，所述驱动集成电路通过所述显示面板的显示基板中的第二部分第一绑定引脚与所述显示面板上的信号线连通；所述触控集成电路通过所述显示面板的显示基板中的第一部分第一绑定引脚以及所述第二绑定引脚与所述触控面板上的触控电极连通。
  7. 根据权利要求6所述的触控显示装置，其中，所述柔性电路板包括：覆晶薄膜和主柔性电路板，所述驱动集成电路设置于所述覆晶薄膜上，所述触控集成电路设置于所述主柔性电路板上。
  8. 根据权利要求6或7所述的触控显示装置，其中，所述柔性电路板至少部分被弯折至所述显示面板的远离所述触控面板的一侧。
  9. 根据权利要求5所述的触控显示装置，其中，还包括以下至少之一：
    散热膜，设置于所述显示面板的远离所述触控面板的一侧；
    偏光片，设置于所述触控面板的远离所述显示面板的一侧；
    封装盖板，设置于所述触控面板的远离所述显示面板的一侧。
  10. 根据权利要求5所述的触控显示装置，其中，所述显示面板为柔性显示面板，所述非显示区域包括弯折区域和与所述弯折区域连接的非弯折区域；相对于所述弯折区域，所述非弯折区域靠近所述显示面板的显示区域；所述触控显示装置还包括贴合胶；
    所述贴合胶将所述弯折区域固定在所述显示面板的远离所述触控面板的一侧。
  11. 一种触控显示装置的制作方法，包括：
    提供一显示面板，所述显示面板包括一显示基板，所述显示基板包括：显示区域和位于所述显示区域外围的非显示区域，所述非显示区域内设置有多个第一部分第一绑定引脚、多个第二部分第一绑定引脚和多个第二绑定引脚；所述第二部分第一绑定引脚与所述显示区域内设置的信号线连接；所述第二绑定引脚与第一部分第一绑定引脚一一对应连接；
    将所述显示面板通过所述第一部分第一绑定引脚和所述第二部分第一绑定引脚与柔性电路板绑定，所述柔性电路板上设置有驱动集成电路和触控集成电路；
    将所述显示面板与触控面板贴合，将所述显示面板通过所述第二绑定引脚与所述触控面板绑定。
  12. 根据权利要求11所述的触控显示装置的制作方法，其中，所述显示面板为柔性显示面板，所述非显示区域包括弯折区域，将所述显示面板通过所述第一部分第一绑定引脚和所述第二部分第一绑定引脚与柔性电路板绑定 之后还包括：
    将所述弯折区域朝向所述显示面板的远离所述触控面板的一侧进行弯折并固定，使得所述柔性电路板位于所述显示面板的远离所述触控面板的一侧。
  13. 根据权利要求12所述的触控显示装置的制作方法，其中，
    所述将所述弯折区域朝向所述显示面板的远离所述触控面板的一侧进行弯折并固定的步骤之前，还包括：
    将偏光片贴覆至触控面板上；
    将封装盖板贴覆至所述偏光片上；
    将散热膜贴合至所述显示面板的远离所述触控面板的一侧；
    将贴合胶贴合至所述散热膜上。
  14. 根据权利要求12所述的触控显示装置的制作方法，其中，所述将所述弯折区域朝向所述显示面板的远离所述触控面板的一侧进行弯折并固定的步骤包括：
    利用贴合胶将所述弯折区域固定在所述显示面板的远离所述触控面板的一侧。
  15. 根据权利要求12所述的触控显示装置的制作方法，其中，所述第一部分第一绑定引脚和所述第二部分第一绑定引脚设置于所述弯折区域内。
  16. 根据权利要求15所述的触控显示装置的制作方法，其中，所述非显示区域还包括与所述弯折区域连接的非弯折区域；相对于所述弯折区域，所述非弯折区域靠近所述显示区域；所述第二绑定引脚设置于所述非弯折区域内。
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