WO2020258890A1 - 显示面板、显示装置及显示面板的制造方法 - Google Patents

显示面板、显示装置及显示面板的制造方法 Download PDF

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Publication number
WO2020258890A1
WO2020258890A1 PCT/CN2020/075545 CN2020075545W WO2020258890A1 WO 2020258890 A1 WO2020258890 A1 WO 2020258890A1 CN 2020075545 W CN2020075545 W CN 2020075545W WO 2020258890 A1 WO2020258890 A1 WO 2020258890A1
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WIPO (PCT)
Prior art keywords
substrate
display panel
display area
layer
driving device
Prior art date
Application number
PCT/CN2020/075545
Other languages
English (en)
French (fr)
Inventor
陆静茹
王向前
Original Assignee
昆山国显光电有限公司
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Filing date
Publication date
Application filed by 昆山国显光电有限公司 filed Critical 昆山国显光电有限公司
Priority to JP2021549078A priority Critical patent/JP7271694B2/ja
Priority to EP20832646.2A priority patent/EP3989290A4/en
Priority to KR1020217023281A priority patent/KR102626029B1/ko
Publication of WO2020258890A1 publication Critical patent/WO2020258890A1/zh
Priority to US17/363,563 priority patent/US20210384285A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/127—Active-matrix OLED [AMOLED] displays comprising two substrates, e.g. display comprising OLED array and TFT driving circuitry on different substrates
    • H10K59/1275—Electrical connections of the two substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • This application relates to the technical field of display devices, and in particular to a display panel, a display device, and a manufacturing method of the display panel.
  • a display panel with a traditional structure usually includes a display area and a non-display area located on the periphery of the display area.
  • the non-display area is used to arrange and bind flexible circuits.
  • the existence of flexible circuits will occupy more non-display space, which is not conducive to narrow bezels. the design of.
  • an embodiment of the present application provides a display panel having a display area and a non-display area located on the periphery of the display area.
  • the display panel includes: an array substrate, including a first substrate and a second substrate that are stacked, and the second substrate It is a flexible substrate.
  • the second substrate includes a first extension portion and a second extension portion.
  • the first extension portion is located in the display area.
  • the second extension portion extends from the first extension portion to the second extension portion through the non-display area in a direction away from the first extension portion. Outside a substrate, the second extension portion is provided with a connection circuit for electrically connecting with external devices; a packaging cover plate is located on the side of the second substrate away from the first substrate to package the array substrate.
  • the display panel can solve the problem that the frame of the display panel is too wide.
  • the display panel includes an array substrate and a packaging cover plate, and the packaging cover plate provides protection for the array substrate.
  • the array substrate includes a first substrate and a second substrate that are stacked, the second substrate is a flexible substrate, and the second extension of the second substrate extends out of the first substrate, so that the second substrate can be bent and arranged.
  • the second extension portion has a connection circuit for electrically connecting with external devices, so the array substrate can be connected to an external controller or the like through the second extension portion. When the second extension portion is bent to the back of the first substrate, the circuit binding space on the display panel can be saved, thereby achieving the purpose of narrow frame.
  • an embodiment of the present application also provides a display device including the above-mentioned display panel.
  • an embodiment of the present application also provides a method for manufacturing a display panel.
  • the display panel includes a display area and a non-display area provided on at least one side of the display area.
  • the method includes:
  • a second substrate is formed on the first substrate, the second substrate is a flexible substrate, the second substrate includes a first extension portion and a second extension portion, the first extension portion is located in the display area, and the second extension portion is provided with a connection circuit;
  • a packaging cover is provided on the side of the second substrate away from the first substrate to package the second substrate and the first substrate.
  • FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of another display panel based on the embodiment shown in FIG. 1 of the present application;
  • FIG. 3 is a schematic structural diagram of another display panel based on the embodiment shown in FIG. 1 of the present application;
  • Figure 4 is a schematic diagram of the structure at I-I in Figure 3;
  • FIG. 5 is a schematic structural diagram of another display panel based on the embodiment shown in FIG. 1 of the present application;
  • FIG. 6 is a schematic diagram of the structure at II-II in FIG. 5;
  • FIG. 7 is a schematic structural diagram of another display panel based on the embodiment shown in FIG. 1 of the present application.
  • FIG. 8 is a schematic flowchart of a method for manufacturing a display panel provided by an embodiment of the present application.
  • FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the application.
  • the display panel has a display area and a non-display area located on the periphery of the display area.
  • the display panel includes: an array substrate 100 including an array substrate 100 along a first direction (in FIG. The Z direction) of the first substrate 110 and the second substrate 120 are stacked, the second substrate 120 is a flexible substrate, the second substrate 120 includes a first extension portion 121 and a second extension portion 122, the first extension portion 121 is located in the display area
  • the second extension portion 122 extends from the first extension portion 121 to the outside of the first substrate 110 via the non-display area in a direction away from the first extension portion 121.
  • the second extension portion 122 is provided with a connection circuit 124 for electrical connection with external devices. , So that the array substrate 100 can be electrically connected to external devices through the second extension 122; the packaging cover 200 is located on the side of the second substrate 120 away from the first substrate 110 to package the array substrate 100.
  • the dotted line in the figure shows the display area AA area and the non-display area BB area.
  • the dotted line does not constitute a limitation on the structure of the display panel.
  • the dotted line is to show the dividing point between the AA area and the BB area.
  • the second substrate 120 may be made of any suitable material.
  • the second substrate 120 may be made of one or more materials of silicone rubber, urethane elastomer, and acrylic elastomer.
  • the display panel includes an array substrate 100 and a packaging cover 200, and the packaging cover 200 provides protection to the array substrate 100.
  • the array substrate 100 includes a first substrate 110 and a second substrate 120 that are stacked.
  • the second substrate 120 is a flexible substrate, and the second extension 122 of the second substrate 120 extends outside the first substrate 110 so that the second substrate 120 can Bend settings.
  • the second extension portion 122 has a connection circuit 124 for electrically connecting with external devices, so the array substrate 100 can be connected to external devices such as a controller through the second extension portion 122.
  • the portion of the second extension 122 protruding from the first substrate 110 may have any suitable shape.
  • the second extension 122 includes a connecting section 122a connected to the first extension 121 and a bending section 122b bent along the direction close to the first substrate 110 by the connecting section 122a, that is, the second The extension 122 includes a connecting section 122a connected to the first extension 121 and a bending section 122b bent and arranged by the connecting section 122a in a direction away from the packaging cover 200 and toward the display area AA, and the bending section 122b is away from the connecting section 122a
  • the free end of is provided with a control circuit 130.
  • the bending section 122b is a portion of the second extension portion 122 extending from the first substrate 110.
  • the control circuit 130 can be arranged at any suitable position.
  • the control circuit 130 may be disposed on the side of the free end away from the first substrate 110, or the control circuit 130 may be located between the free end and the first substrate 110, that is, the control circuit 130 may be located on the side of the free end close to the first substrate 110.
  • the second extension 122 includes a bending section 122b, the bending section 122b is bent, and the free end of the bending section 122b is connected to the control circuit 130, so that the control circuit 130 can be connected through the bending section 122b To the back of the first substrate 110, thereby saving binding space and achieving the purpose of narrow frame.
  • the control circuit 130 may be implemented by any suitable control circuit, for example, a COF (Chip On Film) circuit.
  • the display panel manufactured by the embodiment of the present application instead of bending the entire array substrate 100, only a part of the second substrate 120 is bent.
  • the bending part is thin, which is convenient for bending processing, and the degree of bending can be appropriately increased, and the distance between the free end after bending and the first substrate 110 can be reduced, so that the display panel is thinner.
  • the connecting circuit 124 can be arranged on the second extension portion 122 in various ways.
  • the connecting circuit 124 is arranged on the surface of the second extension portion 122 close to the first substrate 110.
  • the connecting end of the connecting circuit 124 is exposed on the surface of the second extended portion 122 close to the first substrate 110.
  • the control circuit 130 may be disposed on the second extended portion 122 near the first substrate 110. surface. Therefore, when the second extension portion 122 is bent and arranged, the control circuit 130 can be arranged between the free end and the first substrate 110.
  • the first substrate 110 may be any suitable form of substrate, and the package cover 200 may be any suitable form of cover.
  • the first substrate 110 may be a flexible substrate or a rigid substrate, and the package cover 200 may be a rigid cover or a flexible cover.
  • the first substrate 110 is a rigid substrate
  • the package cover 200 is a rigid cover
  • an adhesive layer 300 is further provided between the package cover 200 and the second substrate 120 to make the second substrate 120
  • the adhesive layer 300 is connected to the package cover 200.
  • the bonding layer 300 can be arranged in various ways, for example, the bonding layer 300 is an optical adhesive layer.
  • the bent section 122b of the second substrate 120 is arranged beyond the first substrate 110, even if the first substrate 110 is set as a rigid substrate, it will not affect the second extension 122 of the second substrate 120. Bending can also achieve the purpose of narrow frame.
  • the packaging cover 200 is a rigid cover, and the flexible second substrate 120 is adhered to the packaging cover 200 through the adhesive layer 300 at this time.
  • the display panel is a rigid display panel, and the rigid first substrate 110 is connected to the packaging cover 200 through the flexible second substrate 120 and the adhesive layer 300, without Frit packaging, that is, without glass glue packaging, It can further save the side space of the panel and achieve the purpose of narrow frame.
  • the first substrate 110 may be made of any suitable material.
  • the first substrate 110 is glass or the like.
  • the packaging cover 200 may be made of any suitable material.
  • the package cover 200 is a glass cover.
  • the display panel further includes a pixel layer 400 and a driving device layer 500 arranged corresponding to the display area.
  • the driving device of the driving device layer 500 and the connection circuit 124 are connected to each other, so that the driving device is connected to the connection circuit 124 through the connection circuit 124.
  • External device connection refers to a pixel definition layer for setting red, green and blue sub-pixels
  • the driving device layer 500 refers to a TFT device layer for setting driving devices.
  • the pixel layer 400 and the driving device layer 500 may be located at any suitable positions. In some optional embodiments, the pixel layer 400 and the driving device layer 500 may be located on the first substrate 110 or the second substrate 120 at the same time, or the pixel layer 400 may be located on the second substrate 120 and the driving device layer 500 may be located on the first substrate 110.
  • the second substrate 120 is further provided with an encapsulation layer 123 on a side away from the first substrate 110, and the second substrate 120 is bonded to each other through the encapsulation layer 123 and the adhesive layer 300.
  • the encapsulation layer 123 By providing the encapsulation layer 123, the sub-pixels of the protection pixel layer 400 can work normally.
  • the driving device layer 500 may be disposed on the second substrate 120 or the first substrate 110.
  • the pixel layer 400 and the driving device layer 500 are both located on the second substrate 120, and the driving device layer 500 is located on the side of the pixel layer 400 facing the first substrate 110.
  • the side of the substrate 120 away from the first substrate 110 is provided with an encapsulation layer 123; the connecting pin 510 of the driving device extends from the display area to the non-display area, and is connected to the connection circuit 124 on the non-display area.
  • the pixel layer 400 and the driving device layer 500 are both located on the second substrate 120, and the first substrate 110 is a rigid substrate which can be used to improve the strength of the array substrate 100.
  • the driving device layer 500 is located on the second substrate 120, the driving device layer 500 is located in the first extension portion 121, and the connecting pin 510 of the drive device extends from the first extension portion 121 to the second extension portion 122, and extends in the second extension portion.
  • the portion 122 is connected to the connection circuit 124 with each other. That is, the connection pin 510 of the driving device extends from the display area to the non-display area, and is connected to the connection circuit 124 in the non-display area.
  • the driving device can be connected to an external device through the connection circuit 124, for example, the driving device can be connected to the control circuit 130 through the connection circuit 124.
  • the pixel layer 400 is located on the second substrate 120
  • the driving device layer 500 is located on the first substrate 110
  • the second substrate 120 is on a side facing away from the first substrate 110.
  • An encapsulation layer 123 is also provided.
  • the connecting pin 510 of the driving device is exposed from the first substrate 110 toward the first surface 111 of the second substrate 120 to be connected to the connecting circuit 124.
  • the pixel layer 400 and the driving device layer 500 are separately provided on the second substrate 120 and the first substrate 110.
  • the driving device layer 500 may be formed in the first substrate 110.
  • the second substrate 120 is formed, the pixel layer 400 is formed in the second substrate 120, and the pixel layer 400 and the driving device layer 500 Correspondence.
  • the driving device layer 500 can drive the pixel layer 400 for display.
  • the connecting pin 510 of the driving device is exposed from the first surface 111.
  • connection circuit 124 There are many ways to connect the driving device and the connecting circuit 124 to each other. As shown in FIGS. 3 and 4, the connecting end of the connecting circuit 124 is exposed on the surface of the second extended portion 122 close to the first substrate 110, and the connecting pins of the driving device 510 extends from the display area to the non-display area, and is exposed on the first surface 111 in the non-display area to be connected to the connection circuit 124.
  • the connecting end of the connecting circuit 124 is exposed on the surface of the second extension 122, and the driving device side connecting pin 510 is exposed on the first surface 111.
  • the connection circuit 124 and the driving device side are connected to each other.
  • the first extension portion 121 includes a wire layer 121a, the wire layer 121a and the connecting circuit 124 are connected to each other, and at least part of the wires of the wire layer 121a are exposed in the second
  • the substrate 120 faces the surface of the first substrate 110, and the connecting pins 510 of the driving device are exposed from the display area and connected to the wire layer 121a to connect to the connection circuit 124 through the wire layer 121a.
  • the first extension portion 121 includes a wire layer 121a, the wires of the wire layer 121a are exposed on the surface of the second substrate 120 facing the first substrate 110, and the connecting pins 510 are exposed from the display area so that the wires on the first substrate
  • the driving device can be connected to the wire layer 121a, and the wires of the wire layer 121a and the connection circuit 124 are connected to each other, so that the driving device can be connected to each other through the wire layer 121a and the connection circuit 124.
  • the driving device layer 500 includes gate lines extending in the second direction (X direction in FIG. 6) and data lines extending in the third direction (Y direction in FIG. 6).
  • the gate lines and data lines cross each other in the driving direction.
  • the device layer 500 has a grid shape.
  • the wire layer 121a can be arranged in any suitable manner. As shown in FIG. 6, in some optional embodiments, the wires of the wire layer 121a are grid-shaped, and the wires of the wire layer 121a overlap with the data lines and the gate lines.
  • the wires are directed from the second substrate 120 toward the first The surface of the substrate 110 is exposed, so that the wires are connected to the gate lines and/or data lines of each driving device.
  • the overlap of the wire and the gate line and the data line can reduce the distance between the wire and the data line and/or the gate line without affecting the normal display of the display panel.
  • the overlapping of the wires of the wire layer 121a with the data lines and the gate lines means that the wires of the wire layer 121a overlap with the data lines and the gate lines in the first direction in FIG. 1.
  • the wires of the wire layer 121a can be directly arranged on the surface of the wire layer 121a facing the first substrate 110 so that the connecting pins 510 of the first substrate 110 are exposed on the first surface 111 and connected to the wires.
  • the wires are located in the wire layer 121a, the wires are exposed from the wire layer 121a toward the surface of the first substrate 110, and the connecting pins 510 and the wires are butted with each other.
  • the transparency of the first extension 121 is greater than or equal to 60%, and the connecting circuit 124 is exposed on the surface of the second extension 122 facing the first substrate 110;
  • the first substrate 110 includes a first surface 111 facing the second substrate 120, a second surface 112 facing away from the second substrate 120, and a side surface 113 connecting the first surface 111 and the second surface 112;
  • the driving device layer 500 and the pixel layer 400 of the display panel Corresponding to the display area and located on the first substrate 110, the driving device layer 500 is located on the side of the pixel layer 400 away from the second substrate 120, and the connecting pins 510 of the driving device are exposed from the side surface 113 to connect with the connecting circuit 124.
  • the pixel layer 400 and the driving device layer 500 are both disposed on the first substrate 110, and the second substrate 120 serves as an intermediate connection layer, so that the first substrate 110 can be connected to the first substrate 110 through the second substrate 120 and the adhesive layer 300.
  • Package cover 200 When the second substrate 120 is located on the side of the pixel layer 400 close to the encapsulation cover 200, the transparency of the first extension 121 on the second substrate 120 is greater than or equal to 60%, which does not affect the normal display of the display panel, and the pixel layer 400 The light can be exposed through the first extension part 121.
  • the connecting circuit 124 is exposed on the surface of the second extended portion 122 facing the first substrate 110, and the connecting pin 510 of the driving device is exposed from the side surface 113 so that the connecting pin 510 of the driving device can be connected to the connecting circuit 124 on the side surface 113.
  • the second embodiment of the present application also provides a display device including the display panel of any one of the first embodiments described above.
  • the display device can be of any suitable type.
  • the display device may be a mobile terminal, a mobile phone, a computer monitor, or a notebook monitor.
  • the display device of the embodiment of the present application includes the above-mentioned display panel
  • the display device of this embodiment has the beneficial effects of the display panel of any one of the above-mentioned embodiments, which will not be repeated here.
  • the third embodiment of the present application also provides a method for manufacturing a display panel.
  • the display panel is the display panel described in any of the first embodiments described above.
  • the method for manufacturing the display panel includes:
  • Step S1 Provide a first substrate.
  • the first substrate 110 may have any suitable characteristics.
  • the first substrate 110 may be a flexible substrate or a rigid substrate.
  • the first substrate 110 is a rigid substrate, which is convenient for subsequent parts to be vapor-deposited or printed on the rigid substrate.
  • Step S2 forming a second substrate on the first substrate.
  • the second substrate 120 is a flexible substrate.
  • the second substrate 120 includes a first extension portion 121 and a second extension portion 122.
  • the first extension portion 121 is located in the display area.
  • the second extension portion 122 is provided with a connection circuit 124 so that the display panel can pass through
  • the connection circuit 124 on the second extension 122 is connected to external devices.
  • the second substrate 120 can be formed on the first substrate 110 by evaporation or printing.
  • Step S3 peeling at least part of the first substrate and the second substrate from the edge of the first substrate.
  • Step S4 Cut off the part of the first substrate that has been peeled off.
  • the peeled first substrate 110 is cut, so that the second extension portion 122 extends from the first extension portion 121 to the outside of the first substrate 110 through the non-display area in a direction away from the first extension portion 121.
  • Step S5 Set the package cover.
  • a packaging cover 200 is provided on a side of the second substrate 120 away from the first substrate 110 to encapsulate the second substrate 120 and the first substrate 110.
  • a flexible second substrate 120 is formed on the first substrate 110, and after the second substrate 120 is formed, part of the edge of the first substrate 110 is peeled off.
  • the second extension portion 122 is made to extend outside the first substrate 110, and a part of the second extension portion 122 that extends outside the first substrate 110 can be bent. Therefore, the external device connected by the connecting circuit 124 can be located on the back of the first substrate 110, which saves binding space and achieves the purpose of a narrow frame.
  • the entire array substrate 100 in the display panel manufactured by the embodiment of the present application instead of bending the entire array substrate 100 in the display panel manufactured by the embodiment of the present application, only a part of the second substrate 120 is bent.
  • the bending part is thin, which is convenient for bending processing, and the degree of bending can be appropriately increased, and the distance between the free end of the second extension portion 122 after bending and the first substrate 110 is reduced, so that the display panel is thinner.

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Abstract

本申请实施例提供一种显示面板、显示装置及显示面板的制造方法，显示面板，具有显示区域和位于显示区域周侧的非显示区域，显示面板包括：阵列基板，包括层叠设置的第一基板及第二基板，第二基板为柔性基板，第二基板包括第一延展部和第二延展部，第一延展部位于显示区域，第二延展部由第一延展部沿远离第一延展部的方向经由非显示区域延伸至第一基板外，第二延展部设置有连接电路，阵列基板通过第二延展部与外部器件电连接；封装盖板，位于第二基板背离第一基板的一侧，以封装阵列基板。当第二延展部弯折至第一基板的背面时，能够节省显示面板上的电路绑定空间，从而达到窄边框的目的。

Description

显示面板、显示装置及显示面板的制造方法
相关申请的交叉引用
本申请要求享有于2019年06月24日提交的名称为“显示面板、显示装置及显示面板的制造方法”的中国专利申请第201910548295.9号的优先权，该申请的全部内容通过引用并入本文中。
技术领域
本申请涉及显示设备技术领域，尤其涉及一种显示面板、显示装置及显示面板的制造方法。
背景技术
随着显示模组技术的不断更新，小尺寸面板正逐渐朝着轻薄化、高屏占比、超窄边框甚至无边框化发展。传统结构的显示面板通常包括显示区域及位于显示区域周侧的非显示区域，非显示区域用于排布和绑定柔性电路，柔性电路的存在会占用较多的非显示空间，不利于窄边框的设计。
因此，亟需一种能实现窄边框设计的显示面板、显示装置及显示面板的制造方法。
发明内容
一方面，本申请实施例提供了一种显示面板，具有显示区域和位于显示区域周侧的非显示区域，显示面板包括：阵列基板，包括层叠设置的第一基板及第二基板，第二基板为柔性基板，第二基板包括第一延展部和第二延展部，第一延展部位于显示区域，第二延展部由第一延展部沿远离第一延展部的方向经由非显示区域延伸至第一基板外，第二延展部设置有用于与外部器件电连接的连接电路；封装盖板，位于第二基板背离第一基板的一侧，以封装阵列基板。
根据本申请的显示面板能够解决显示面板边框过宽的问题。在本申请实施例提供的显示面板中，显示面板包括阵列基板和封装盖板，封装盖板向阵列基板提供保护。阵列基板包括层叠设置的第一基板和第二基板，第二基板为柔性基板，且第二基板的第二延展部伸出第一基板外，令第二基板能够弯折设置。第二延展部上具有用于与外部器件电连接的连接电路，因此阵列基板可以通过第二延展部与外部的控制器等连接。当第二延展部弯折至第一基板的背面时，能够节省显示面板上的电路绑定空间，从而达到窄边框的目的。
另一方面，本申请实施例还提供了一种显示装置，包括上述的显示面板。
又一方面，本申请实施例还提供了一种显示面板的制造方法，显示面板包括显示区域和设置于显示区域至少一侧的非显示区域，方法包括：
提供第一基板；
在第一基板上形成第二基板，第二基板为柔性基板，第二基板包括第一延展部和第二延展部，第一延展部位于显示区域，第二延展部设置有连接电路；
从第一基板的边缘将至少部分第一基板和第二基板相互剥离；
对已剥离的部分第一基板进行切断处理，以使第二延展部由第一延展部沿远离第一延展部方向经由非显示区域延伸至第一基板外；
在第二基板远离第一基板的一侧设置封装盖板，以封装第二基板和第一基板。
附图说明
通过阅读以下参照附图对非限制性实施例所作的详细描述，本申请的其它特征、目的和优点将会变得更明显，其中，相同或相似的附图标记表示相同或相似的特征。
图1是本申请实施例提供的一种显示面板的结构示意图；
图2是本申请图1所示实施例基础上另一种显示面板的结构示意图；
图3是本申请图1所示实施例基础上另一种显示面板的结构示意图；
图4是图3中I-I处的结构示意图；
图5是本申请图1所示实施例基础上的另一种显示面板的结构示意图；
图6是图5中II-II处的结构示意图；
图7是本申请图1所示实施例基础上的另一种显示面板的结构示意图；
图8是本申请实施例提供的一种显示面板的制造方法的流程示意图。
具体实施方式
为了更好地理解本申请，下面结合图1至图8对根据本申请实施例的显示面板、显示装置及显示面板的制造方法进行详细描述。
图1为本申请实施例提供的一种显示面板的结构示意图，显示面板具有显示区域和位于显示区域周侧的非显示区域，显示面板包括：阵列基板100，包括沿第一方向(图1中的Z方向)层叠设置的第一基板110及第二基板120，第二基板120为柔性基板，第二基板120包括第一延展部121和第二延展部122，第一延展部121位于显示区域，第二延展部122由第一延展部121沿远离第一延展部121的方向经由非显示区域延伸至第一基板110外，第二延展部122设置有用于与外部器件电连接的连接电路124，使得阵列基板100能够通过第二延展部122与外部器件电连接；封装盖板200，位于第二基板120背离第一基板110的一侧，以封装阵列基板100。
图中以点划线示出显示区域AA区及非显示区域BB区，点划线并不构成对显示面板结构的限定，点划线是为了示出AA区和BB区的分界点。
第二基板120可由任何合适的材料制成。在一些实施例中，第二基板120可由硅橡胶、聚氨酯类弹性体、丙烯酸类弹性体中的一种或几种材料制成。
在本申请实施例的显示面板中，显示面板包括阵列基板100和封装盖板200，封装盖板200向阵列基板100提供保护。阵列基板100包括层叠 设置的第一基板110和第二基板120，第二基板120为柔性基板，且第二基板120的第二延展部122伸出第一基板110外，使得第二基板120能够弯折设置。第二延展部122上具有用于与外部器件电连接的连接电路124，因此阵列基板100可以通过第二延展部122与控制器等外部器件连接。当第二延展部122弯折至第一基板110的背面时，能够节省显示面板上的电路绑定空间，从而达到窄边框的目的。
第二延展部122伸出于第一基板110部分可以具有任何合适的形状。在一些可选的实施例中，第二延展部122包括和第一延展部121连接的连接段122a和由连接段122a沿靠近第一基板110方向弯折设置的弯折段122b，即第二延展部122包括和第一延展部121连接的连接段122a和由连接段122a沿背离封装盖板200的方向并朝向显示区域AA弯折设置的弯折段122b，弯折段122b远离连接段122a的自由端设置有控制电路130。弯折段122b为第二延展部122伸出于第一基板110的部分。控制电路130可设置在任何合适的位置。例如，控制电路130可以设置于自由端远离第一基板110的一侧，或者控制电路130位于自由端和第一基板110之间，即控制电路130位于自由端靠近第一基板110的一侧。
在这些实施例中，第二延展部122包括弯折段122b，弯折段122b弯折设置，且弯折段122b的自由端连接有控制电路130，使得控制电路130可以通过弯折段122b连接至第一基板110的背面，从而节省绑定空间，达到窄边框的目的。控制电路130可以由任何合适的控制电路来实现，例如可为COF(Chip On Film，覆晶薄膜)电路。
本申请实施例制造的显示面板不是将整个阵列基板100进行弯折，仅弯折了部分第二基板120。弯折部分较薄，便于弯折处理，且可以适当增大弯折程度，减小弯折后的自由端和第一基板110之间的距离，令显示面板更薄。
连接电路124在第二延展部122上的设置方式可有多种，例如连接电路124设置于第二延展部122靠近第一基板110的表面。此时连接电路124的连接端露出于第二延展部122靠近第一基板110的表面，控制电路130为了与连接电路124相连，控制电路130可以设置于第二延展部122 靠近第一基板110的表面。因此当第二延展部122弯折设置时，控制电路130可以设置于自由端和第一基板110之间。
第一基板110可以为任何合适形式的基板，封装盖板200可以为任何合适形式的盖板。例如，在一些可选的实施例中，第一基板110可以为柔性基板或硬性基板，封装盖板200可以为硬性盖板或柔性盖板。
在一些优选的实施例中，第一基板110为硬性基板，封装盖板200为硬性盖板，封装盖板200和第二基板120之间还设置有粘接层300，以使第二基板120通过粘接层300和封装盖板200连接。粘接层300的设置方式可有多种，例如粘接层300为光学胶层。
在这些实施例中，由于第二基板120的弯折段122b伸出于第一基板110设置，即使第一基板110设置为硬性基板，也不会影响第二基板120的第二延展部122的弯折，同样能够实现窄边框的目的。封装盖板200为硬性盖板，此时柔性的第二基板120通过粘接层300粘接于封装盖板200。在本实施例中，显示面板为硬性显示面板，且硬性的第一基板110通过柔性的第二基板120和粘接层300和封装盖板200连接，无需进行Frit封装，即无需玻璃胶封装，能够进一步节省面板的侧部空间，达到窄边框的目的。
第一基板110可以由任何合适的材料制成。例如第一基板110为玻璃等。封装盖板200可以由任何合适的材料制成。例如封装盖板200为玻璃盖板。
在上述任一实施例中，显示面板还包括对应于显示区域设置的像素层400和驱动器件层500，驱动器件层500的驱动器件与连接电路124相互连接，以使驱动器件通过连接电路124与外部器件连接。像素层400是指用于设定红绿蓝子像素的像素定义层，驱动器件层500是指用于设置驱动器件的TFT器件层。
像素层400和驱动器件层500可以位于任何合适的位置。在一些可选的实施例中，像素层400和驱动器件层500可以同时位于第一基板110或第二基板120，或者像素层400位于第二基板120，驱动器件层500位于第一基板110。
当像素层400设置于第二基板120时，第二基板120背离第一基板110的一侧还设置有封装层123，第二基板120通过封装层123和粘接层300相互粘接。通过设置封装层123，保护像素层400的子像素能够正常工作。当像素层400设置于第二基板120时，驱动器件层500可以设置于第二基板120或第一基板110。
如图2所示，在一些可选的实施例中，像素层400和驱动器件层500均位于第二基板120，且驱动器件层500位于像素层400面向第一基板110的一侧，第二基板120背离第一基板110的一侧设置有封装层123；驱动器件的连接引脚510由显示区域延伸至非显示区域，并在非显示区域上与连接电路124相互连接。
在这些实施例中，像素层400和驱动器件层500均位于第二基板120，第一基板110为硬性基板能够用于提高阵列基板100的强度。当驱动器件层500位于第二基板120时，驱动器件层500位于第一延展部121内，驱动器件的连接引脚510由第一延展部121延伸至第二延展部122，并在第二延展部122内与连接电路124相互连接。即驱动器件的连接引脚510由显示区域延伸至非显示区域，并在非显示区域上与连接电路124相互连接。令驱动器件可以通过连接电路124与外部器件，例如驱动器件可以通过连接电路124与控制电路130连接。
如图3至图6所示，在另一些可选的实施例中，像素层400位于第二基板120，驱动器件层500位于第一基板110，第二基板120背离第一基板110的一侧还设置有封装层123。此时，驱动器件的连接引脚510由第一基板110朝向第二基板120的第一表面111露出，以与连接电路124相互连接。
在这些实施例中，像素层400和驱动器件层500分设于第二基板120和第一基板110。在形成第一基板110时可以将驱动器件层500形成于第一基板110内，在形成第二基板120时，将像素层400形成于第二基板120内，且像素层400和驱动器件层500相互对应。令驱动器件层500能够驱动像素层400进行显示。驱动器件的连接引脚510由第一表面111露出，在第一基板110和第二基板120相互对接时，令驱动器件和连接电路 124相互连接。
驱动器件和连接电路124相互连接的方式有多种，如图3和图4所示，连接电路124的连接端露出于第二延展部122靠近第一基板110的表面，驱动器件的连接引脚510由显示区域延伸至非显示区域，并在非显示区域露出于第一表面111，以与连接电路124相互连接。
在这些实施例中，连接电路124的连接端露出于第二延展部122的表面，驱动器件侧连接引脚510露出于第一表面111，在第一基板110上形成第二基板120时，可以实现连接电路124和驱动器件侧相互连接。
在另一些可选的实施例中，如图5和图6所示，第一延展部121包括导线层121a，导线层121a和连接电路124相互连接，至少部分导线层121a的导线露出于第二基板120面向第一基板110的表面，驱动器件的连接引脚510由显示区域露出并和导线层121a相互连接，以通过导线层121a连接于连接电路124。
在这些实施例中，第一延展部121包括导线层121a，导线层121a的导线露出于第二基板120面向第一基板110的表面，连接引脚510由显示区域露出，以使在第一基板110上形成第二基板120时，驱动器件能够与导线层121a相互连接，导线层121a的导线和连接电路124相互连接，从而令驱动器件可以通过导线层121a和连接电路124相互连接。
驱动器件层500包括沿第二方向(图6中的X方向)延伸的栅极线和沿第三方向(图6中的Y方向)延伸的数据线，栅极线和数据线相互交叉在驱动器件层500呈网格状。导线层121a可以为任何合适的设置方式。如图6所示，在一些可选的实施例中，导线层121a的导线呈网格状，且导线层121a的导线和数据线、栅极线相互重叠，导线由第二基板120朝向第一基板110的表面露出，从而令导线和每一个驱动器件的栅极线和/或数据线连接。导线和栅极线、数据线重叠能够减小导线和数据线和/或栅极线之间的距离，同时还不影响显示面板的正常显示。导线层121a的导线和数据线、栅极线相互重叠是指：导线层121a的导线和数据线、栅极线在图1中的第一方向上相互重叠。
导线层121a的导线的设置方式有多种，例如导线可以直接设置于导线 层121a朝向第一基板110的表面，令第一基板110的连接引脚510露出于第一表面111与导线连接。或者，导线位于导线层121a内，导线由导线层121a朝向第一基板110的表面露出，连接引脚510和导线相互对接。
在又一些可选的实施例中，如图7所示，第一延展部121的透明度大于或等于60％，连接电路124露出于第二延展部122面向第一基板110的表面；第一基板110包括面向第二基板120的第一表面111、背离第二基板120的第二表面112、及连接第一表面111和第二表面112的侧面113；显示面板的驱动器件层500和像素层400对应于显示区域设置并位于第一基板110，驱动器件层500位于像素层400远离第二基板120的一侧，驱动器件的连接引脚510由侧面113露出，以与连接电路124相互连接。
在这些实施例中，像素层400和驱动器件层500均设置于第一基板110，第二基板120作为一个中间连接层，令第一基板110可以通过第二基板120和粘接层300连接于封装盖板200。当第二基板120位于像素层400靠近封装盖板200的一侧时，第二基板120上第一延展部121的透明度大于或等于60％，从而不影响显示面板的正常显示，令像素层400的光能够透过第一延展部121露出。连接电路124露出于第二延展部122面向第一基板110的表面，驱动器件的连接引脚510由侧面113露出，令驱动器件的连接引脚510能够在侧面113与连接电路124相互连接。
本申请第二实施例还提供一种显示装置，包括上述任一第一实施例的显示面板。显示装置可以为任何合适的类型。例如显示装置可以为移动终端、手机、电脑显示器或笔记本显示器等。
由于本申请实施例的显示装置包括上述的显示面板，因此本实施例的显示装置具有上述任一实施例的显示面板的有益效果，在此不再赘述。
请一并参阅图8，本申请第三实施例还提供一种显示面板的制造方法，显示面板为上述任一第一实施例所述的显示面板，显示面板的制造方法包括：
步骤S1：提供第一基板。
第一基板110可以具有任何合适的特性。例如第一基板110可以为柔性基板或硬性基板。优选的，第一基板110为硬性基板，便于后续零部件 在硬性基板上蒸镀或印刷成型。
步骤S2：在第一基板上形成第二基板。
第二基板120为柔性基板，第二基板120包括第一延展部121和第二延展部122，第一延展部121位于显示区域，第二延展部122设置有连接电路124，令显示面板可以通过第二延展部122上的连接电路124与外部器件连接。可以选用蒸镀或印刷等方式在第一基板110上形成第二基板120。
步骤S3：从第一基板的边缘将至少部分第一基板和第二基板相互剥离。
步骤S4：对已剥离的部分第一基板进行切断处理。
切断已剥离的第一基板110，令第二延展部122由第一延展部121沿远离第一延展部121方向经由非显示区域延伸至第一基板110外。
步骤S5：设置封装盖板。
在第二基板120远离第一基板110的一侧设置封装盖板200，以封装第二基板120和第一基板110。
在这些实施例中，在第一基板110上形成柔性的第二基板120，形成第二基板120后将部分边缘的第一基板110剥离。令第二延展部122伸出于第一基板110外，伸出于第一基板110外的部分第二延展部122能够弯折设置。因此连接电路124连接的外部器件能够位于第一基板110的背面，节省绑定空间，达到窄边框的目的。且本申请实施例制造的显示面板不是将整个阵列基板100进行弯折，仅弯折了部分第二基板120。弯折部分较薄，便于弯折处理，且可以适当增大弯折程度，减小弯折后的第二延展部122的自由端和第一基板110之间的距离，令显示面板更薄。
虽然已经参考优选实施例对本申请进行了描述，但在不脱离本申请的范围的情况下，可以对其进行各种改进并且可以用等效物替换其中的部件。尤其是，只要不存在结构冲突，各个实施例中所提到的各项技术特征均可以任意方式组合起来。本申请并不局限于文中公开的特定实施例，而是包括落入权利要求的范围内的所有技术方案。

Claims (17)

  1. 一种显示面板，具有显示区域和位于所述显示区域周侧的非显示区域，其中，所述显示面板包括：
    阵列基板，包括层叠设置的第一基板及第二基板，所述第二基板为柔性基板，所述第二基板包括第一延展部和第二延展部，所述第一延展部位于所述显示区域，所述第二延展部由所述第一延展部沿远离所述第一延展部的方向经由所述非显示区域延伸至所述第一基板外，所述第二延展部设置有用于与外部器件电连接的连接电路；
    封装盖板，位于所述第二基板背离所述第一基板的一侧，以封装所述阵列基板。
  2. 根据权利要求1所述的显示面板，其中，所述第一基板为硬性基板，所述封装盖板为硬性盖板，所述封装盖板和所述第二基板之间还设置有粘接层，以使所述第二基板通过所述粘接层和所述封装盖板连接。
  3. 根据权利要求2所述的显示面板，其中，
    所述显示面板的像素层对应于所述显示区域设置并位于所述第二基板，所述像素层背离所述第一基板的一侧还设置有封装层。
  4. 根据权利要求3所述的显示面板，其中，
    所述显示面板的驱动器件层对应于所述显示区域设置并位于所述第二基板或所述第一基板；
    所述驱动器件层的驱动器件与所述连接电路相互连接。
  5. 根据权利要求4所述的显示面板，其中，
    所述像素层和所述驱动器件层均位于所述第二基板，且所述驱动器件层位于所述像素层面向所述第一基板的一侧；
    所述驱动器件的连接引脚由所述显示区域延伸至所述非显示区域，并在所述非显示区域上与所述连接电路相互连接。
  6. 根据权利要求4所述的显示面板，其中，所述驱动器件层位于所述第一基板，所述驱动器件的连接引脚由所述第一基板朝向所述第二基板的第一表面露出，以与所述连接电路相互连接。
  7. 根据权利要求6所述的显示面板，其中，
    所述连接电路的连接端露出于所述第二延展部靠近所述第一基板的表面，所述驱动器件的连接引脚由所述显示区域延伸至所述非显示区域，并在所述非显示区域露出于所述第一表面，以与所述连接电路相互连接。
  8. 根据权利要求6所述的显示面板，其中，所述第一延展部包括导线层，所述导线层和所述连接电路相互连接，至少部分所述导线层的导线露出于所述第二基板面向所述第一基板的表面，所述驱动器件的连接引脚由所述显示区域露出并和所述导线层相互连接，以通过所述导线层连接于所述连接电路。
  9. 根据权利要求8所述的显示面板，其中，
    所述驱动器件层包括沿第二方向延伸的栅极线和沿第三方向延伸的数据线，所述栅极线和所述数据线呈网格状相互交叉在所述驱动器件层；
    所述导线层的导线呈网格状，且所述导线层的导线和所述数据线、所述栅极线相互重叠，所述导线由所述第二基板朝向所述第一基板的表面露出，以使所述导线和每一个所述驱动器件的所述栅极线和/或数据线连接。
  10. 根据权利要求9所述的显示面板，其中，所述导线设置于所述导线层朝向所述第一基板的表面。
  11. 根据权利要求9所述的显示面板，其中，所述导线位于所述导线层内，所述导线由所述导线层朝向所述第一基板的表面露出，所述连接引脚和所述导线相互对接。
  12. 根据权利要求2所述的显示面板，其中，
    所述第一延展部的透明度大于或等于60％，所述连接电路露出于所述第二延展部面向所述第一基板的表面；
    所述第一基板包括面向所述第二基板的第一表面、背离所述第二基板的第二表面、及连接所述第一表面和所述第二表面的侧面；
    所述显示面板的驱动器件层和像素层对应于所述显示区域设置并位于所述第一基板，所述驱动器件层位于所述像素层远离所述第二基板的一侧，所述驱动器件的连接引脚由所述侧面露出，以与所述连接电路相互连接。
  13. 根据权利要求1所述的显示面板，其中，所述第二延展部包括和所 述第一延展部连接的连接段和由所述连接段沿背离所述封装盖板的方向并朝向所述显示区域弯折设置的弯折段，所述弯折段远离所述连接段的自由端设置有控制电路。
  14. 根据权利要求13所述的显示面板，其中，所述控制电路设置于所述自由端远离所述第一基板的一侧。
  15. 根据权利要求13所述的显示面板，其中，所述控制电路位于所述自由端靠近所述第一基板的一侧。
  16. 一种显示装置，包括权利要求1至权利要求15任一项所述的显示面板。
  17. 一种显示面板的制造方法，所述显示面板包括显示区域和设置于所述显示区域至少一侧的非显示区域，其中，所述方法包括：
    提供第一基板；
    在所述第一基板上形成第二基板，所述第二基板为柔性基板，所述第二基板包括第一延展部和第二延展部，所述第一延展部位于所述显示区域，所述第二延展部设置有连接电路；
    从所述第一基板的边缘将至少部分所述第一基板和所述第二基板相互剥离；
    对已剥离的部分所述第一基板进行切断处理，以使所述第二延展部由所述第一延展部沿远离所述第一延展部方向经由所述非显示区域延伸至所述第一基板外；
    在所述第二基板远离所述第一基板的一侧设置封装盖板，以封装所述第二基板和所述第一基板。
PCT/CN2020/075545 2019-06-24 2020-02-17 显示面板、显示装置及显示面板的制造方法 WO2020258890A1 (zh)

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