WO2019207632A1 - 半導体ウエハへの保護テープの貼付装置及び貼り付け方法 - Google Patents

半導体ウエハへの保護テープの貼付装置及び貼り付け方法 Download PDF

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Publication number
WO2019207632A1
WO2019207632A1 PCT/JP2018/016533 JP2018016533W WO2019207632A1 WO 2019207632 A1 WO2019207632 A1 WO 2019207632A1 JP 2018016533 W JP2018016533 W JP 2018016533W WO 2019207632 A1 WO2019207632 A1 WO 2019207632A1
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WIPO (PCT)
Prior art keywords
protective tape
wafer
tape
protective
semiconductor wafer
Prior art date
Application number
PCT/JP2018/016533
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English (en)
French (fr)
Japanese (ja)
Inventor
カール ハインツ プリワッサ
謙 池端
良典 柿沼
陽介 石松
Original Assignee
ディスコ ハイテック ヨーロッパ ゲーエムベーハー
株式会社タカトリ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by ディスコ ハイテック ヨーロッパ ゲーエムベーハー, 株式会社タカトリ filed Critical ディスコ ハイテック ヨーロッパ ゲーエムベーハー
Priority to SG11202010427SA priority Critical patent/SG11202010427SA/en
Priority to JP2020515332A priority patent/JP7287630B2/ja
Priority to PCT/JP2018/016533 priority patent/WO2019207632A1/ja
Priority to CN201880092682.XA priority patent/CN112020768A/zh
Priority to US17/049,381 priority patent/US11935768B2/en
Priority to KR1020207032073A priority patent/KR102555601B1/ko
Priority to DE112018007513.3T priority patent/DE112018007513T5/de
Priority to TW108113405A priority patent/TWI820117B/zh
Publication of WO2019207632A1 publication Critical patent/WO2019207632A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B32B37/1292—Application of adhesive selectively, e.g. in stripes, in patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Definitions

  • the present invention relates to a pasting apparatus and a pasting method for satisfactorily pasting a protective tape on a semiconductor wafer.
  • wafer In the process of manufacturing a semiconductor chip, after forming a circuit having irregularities on the surface of a semiconductor wafer (hereinafter simply referred to as “wafer”), the surface on which the circuit is formed is requested due to the recent demand for miniaturization of the semiconductor chip. It is common practice to thin the wafer by grinding the opposite back surface. When the wafer is thinned, a protective tape is attached to the surface of the wafer to protect the circuit forming portion.
  • a protective tape pre-cut according to the shape of the wafer is preliminarily attached to the belt-like base material, and the sticking roller rotating while pressing the protective tape while peeling the protective tape from the belt-like base material,
  • a method has been proposed in which a protective tape is attached to the surface, and then the protective tape is pressed against the surface of the wafer with an application roller (see, for example, Patent Document 2).
  • This protective tape has a protective layer having a smaller diameter than that of the protective tape and covering the bump wafer unevenness on the surface to be bonded to the bump wafer, and the bump wafer unevenness is protected by the protective layer.
  • This protective tape is generally supplied by being temporarily attached to a belt-like substrate (release tape).
  • release tape a belt-like substrate
  • the protective tape will be damaged easily, and the protective tape will not be applied neatly to the bump wafer.
  • residual stress is generated on the protective tape, and when the back surface of the wafer with the protective tape is ground and thinned, the wafer is warped or damaged by the residual stress of the protective tape.
  • the present invention has been made to solve the above-described problems, and provides an attaching apparatus and an attaching method for attaching an adequate protective tape to a bump wafer.
  • the sticking device of the present invention that solves the above-described problems is a sticking device for sticking a protective tape to a semiconductor wafer.
  • the sticking table that supports the semiconductor wafer and the protective tape can be held, and the held protective tape.
  • At least a tape holder for pressing the protective tape from above, and the pressing member is formed by laminating a protective layer having an outer diameter smaller than the outer diameter of the semiconductor wafer.
  • a protective layer outer periphery pressing member that presses a peripheral portion of the protective layer of the protective tape and attaches the protective tape to the semiconductor wafer.
  • the sticking table is provided so as to be movable up and down inside the lower chamber, and the pressing member is vertically arranged inside the upper chamber forming the lower chamber and the vacuum chamber. It is provided so that it can reciprocate.
  • a frame base for supporting a dicing frame on which the semiconductor wafer is mounted is provided around the sticking table in the lower chamber, and the protective tape is provided on the dicing frame.
  • the pressing member is further provided with a tape outer periphery pressing member that presses an outer peripheral edge portion of the protective tape and affixes the pressing member to the dicing frame.
  • the pressing member further includes an elastic member that supports the outer periphery presser of the tape so that it can be displaced in the vertical direction.
  • the sticking apparatus is characterized by further comprising a heating table for heating the semiconductor wafer mounted on the dicing frame.
  • the sticking method of the present invention that solves the above-described problems is a sticking method for sticking a protective tape to a semiconductor wafer, a supplying step of supplying the protective tape onto the semiconductor wafer, and a pressing for pressing the protective tape from above And in the pressing step, a peripheral portion of the protective layer of the protective tape on which a protective layer having an outer diameter smaller than the outer diameter of the semiconductor wafer is stacked is pressed and attached to the semiconductor wafer. It is characterized by that.
  • the protective tape in the supplying step, is provided on a dicing frame that is disposed so as to surround the semiconductor wafer and on which the semiconductor wafer is mounted, and in the pressing step The outer peripheral edge of the protective tape is further pressed and attached to the dicing frame.
  • the attaching method according to a preferred embodiment of the present invention is characterized by further comprising a heating step of heating the semiconductor wafer mounted on the dicing frame.
  • the periphery of the protective layer of the protective tape is bonded to the outer peripheral edge of the wafer by pressing the protective layer outer periphery of the pressing member.
  • the protective tape can be neatly attached to the wafer without wrinkling the protective tape. Therefore, the protective layer of the protective tape can be satisfactorily adhered to the irregularities of the circuit forming portion of the wafer.
  • the circuit forming portion of the wafer since the circuit forming portion of the wafer is not pressed, the unevenness of the wafer can be prevented from being damaged, and the protective tape is pulled when being attached to the wafer as in the pasting roller of the prior art. Therefore, it is possible to prevent the residual stress from being generated in the protective tape attached to the wafer. Therefore, when the back surface of the wafer is ground and thinned, it is possible to prevent the wafer from being warped or damaged by the residual stress of the protective tape.
  • the protective tape can be satisfactorily applied to the bump wafer.
  • FIG. 1st alignment apparatus It is explanatory drawing explaining the imaging operation by the imaging means of a 1st alignment apparatus. It is a front view which shows schematic structure of a 2nd alignment apparatus.
  • the present invention relates to a sticking apparatus and a sticking method for sticking a protective tape to a semiconductor wafer (hereinafter simply referred to as a “wafer”).
  • a protective tape having a protective layer is used as a wafer (particularly a bump wafer) without using a sticking roller. It is intended to be adhered to the surface.
  • a sticking apparatus of the present invention can hold a sticking table that supports a wafer, a protective tape that can hold the protective tape, and supply the held protective tape onto the wafer. And a pressing member that presses the peripheral portion of the protective layer of the protective tape on which the protective layer having an outer diameter smaller than the outer diameter of the wafer is laminated and is attached to the wafer. It is characterized by having a presser.
  • the characteristics of the sticking device of the present invention are mainly described in the tape sticking part F of the following embodiment of the present invention.
  • embodiments of the present invention will be described with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described in the accompanying drawings. It should be noted that the thicknesses of the wafer W, the dicing frame DF, the protective tape PT, the base material BM, the protective layer PL, and the pressure-sensitive adhesive layer AL are exaggerated for easy understanding.
  • FIG. 1 is a plan view schematically showing the overall configuration of the sticking device 1 according to the present embodiment.
  • the affixing device 1 includes a tape peeling part A for peeling the protective tape PT temporarily attached to the base material BM from the base material BM, a tape alignment part B for positioning the protective tape PT, and a wafer supply for storing a plurality of wafers W.
  • Part C wafer alignment part D for positioning the wafer W
  • frame supply part E for storing a plurality of dicing frames DF
  • a protective tape PT attached to the wafer W and the wafer W dicing frame through the protective tape PT
  • a tape application unit F to be mounted on the DF a heating unit G for heating the wafer W mounted on the dicing frame DF, and a frame storage unit H for storing the dicing frame DF after heating the wafer W are provided.
  • the pasting device 1 performs various operations in each unit, controls various devices that transport the protective tape PT, the wafer W, the dicing frame DF, and the like between the respective units, And a control device (not shown) for processing received signals and data, which are provided on the machine base 100.
  • the control device can be constituted by a computer that includes, for example, a microcomputer, a memory, an HDD, and the like, and is provided with processing capability by software.
  • a tape transport mechanism 2 and a tape transport unit 3 are provided in order to peel off the protective tape PT temporarily attached to the base material BM from the base material BM.
  • a peeling mechanism 4 are provided in order to peel off the protective tape PT temporarily attached to the base material BM from the base material BM.
  • the tape transport mechanism 2 transports the protective tape PT temporarily attached to the base material BM to the peeling position.
  • the tape transport mechanism 2 includes a base material BM supply roll 20 to which the protective tape PT is temporarily attached, a base material BM recovery roll 21 from which the protective tape PT has been peeled, and a plurality of guide rollers 22 for guiding the base material BM. It consists of and.
  • the supply roll 20 supports the base material BM wound in a roll shape.
  • the collection roll 21 winds up the base material BM.
  • the base material BM is fed out from the supply roll 20 and conveyed by the rotation of the collection roll 21.
  • the base material BM is, for example, a PET film or mount that has been subjected to a release treatment, and is fed out from the supply roll 20 and conveyed in a belt-like state.
  • a plurality of protective tapes PT precut in a circular shape are arranged at predetermined intervals along the transport direction.
  • the protective tape PT is formed so that its outer diameter is larger than the outer diameter of the wafer W.
  • the protective tape PT is provided with a circular protective layer PL having an outer diameter smaller than the outer diameter of the wafer W (for example, about 2 mm smaller than the outer diameter of the wafer W) on one surface.
  • An adhesive layer AL is provided around the PL.
  • the protective layer PL is softened by heating and adheres to the unevenness of the wafer W. Therefore, the wafer W is ground flat when the back surface of the wafer W is ground in the next step. Further, when the protective layer PL is peeled off from the wafer W that has undergone a processing step such as back grinding, it can be peeled cleanly without any adhesive residue. Further, a part of the outer peripheral side of the protective tape PT is affixed to the outer peripheral edge part outside the circuit forming part of the wafer W via the adhesive layer AL, and the circuit forming part of the wafer W is covered with the protective layer PL. It is protected by being touched.
  • the tape transport unit 3 includes a tape holder 30 that can hold the protective tape PT, and a holder movement that moves the tape holder 30 onto the protective tape PT transported to the peeling position. And a mechanism 31.
  • the tape holder 30 holds the protective tape PT transported to the peeling position by the tape transport mechanism 2 from the surface side.
  • the tape holder 30 is held by adsorbing the protective tape PT, and, for example, as shown in FIGS. 7 and 8, a porous adsorbing member 301 is fixed to the fixing member 300. It is.
  • a vacuum pump (not shown) such as a vacuum pump is connected to the adsorption member 301, and the protective tape PT can be adsorbed and held on the surface thereof.
  • the suction member 301 has an outer diameter that is substantially the same (same or slightly larger) as that of the protective tape PT, and holds the entire surface of the protective tape PT by suction.
  • the holding body moving mechanism 31 includes a first vertical movement mechanism 310 that reciprocates the tape holding body 30 in the Z direction (vertical direction) along the vertical direction, and the tape holding body 30.
  • a reciprocating mechanism (hereinafter referred to as “first reciprocating mechanism”) 320 that reciprocates in the X direction (front-rear direction) along the horizontal plane, and a Y direction (which is referred to as “first reciprocating mechanism”) 320 along the horizontal plane and orthogonal to the X direction (A reciprocating mechanism (hereinafter referred to as “second reciprocating mechanism”) 330 that reciprocates in the left-right direction).
  • the first vertical movement mechanism 310 moves the tape holder 30 in the vertical direction between a peeling position (see FIG. 6) that holds the protective tape PT and a separation position (see FIG. 5) above the peeling position. Move.
  • the first vertical movement mechanism 310 is not particularly limited as long as it moves the tape holder 30 in the vertical direction.
  • the first vertical movement mechanism 310 of the present embodiment includes a ball screw that drives the reciprocating movement of the tape holding body 30 and a guide mechanism that guides the reciprocating movement of the tape holding body 30. These are provided on the support frame 317.
  • the ball screw includes a screw shaft 311, a nut member 312, a ball (not shown), and the like, and the nut member 312 is connected to the tape holder 30 via a connection member 313.
  • This ball screw uses the motor 314 as a drive source, converts the forward / reverse rotation of the motor 314 into a reciprocating linear motion in the screw shaft direction, and moves the tape holder 30 in the vertical direction.
  • the guide mechanism includes a pair of left and right guide rails 315 extending in the vertical direction and a pair of left and right sliders 316 slidably attached to the corresponding guide rails 315.
  • the pair of guide rails 315 and the slider 316 are disposed so as to sandwich the ball screw therebetween.
  • the pair of sliders 316 are provided on the vertical portion of the connection member 313, and the pair of guide rails 315 are provided on the support frame 317.
  • the guide mechanism assists the tape holder 30 to move straight in the Z direction (vertical direction) by sliding the corresponding guide rail 315 by each slider 316.
  • the first reciprocating mechanism 320 reciprocates the tape holder 30 in the X direction as shown in FIGS.
  • the conveyance direction of the base material BM is directed in the X direction
  • the first reciprocating mechanism 320 reciprocates the tape holding body 30 in the conveyance direction of the base material BM, so that the tape holding body 30 is moved.
  • the first reciprocating mechanism 320 is not particularly limited as long as it reciprocates the tape holder 30 in the X direction.
  • the first reciprocating mechanism 320 of this embodiment includes a rail 321 provided in the horizontal portion of the connection member 313 and extending in the X direction, and a slider 322 connected to the support member 32 and slidably attached to the rail 321.
  • the tape holder 30 can be reciprocated in the X direction along the rail 321 via the slider 322 by a driving source (not shown).
  • the second reciprocating mechanism 330 reciprocates the tape holder 30 in the Y direction orthogonal to the X direction, as shown in FIGS.
  • the Y direction intersects with the conveying direction of the base material BM, and the second reciprocating mechanism 330 moves the tape holding body 30 back and forth in the Y direction to move the tape holding body 30 on the peeling position.
  • the second reciprocating mechanism 330 reciprocates the tape holder 30 in the Y direction, and conveys the tape holder 30 from the tape peeling part A to the tape alignment part B and the tape applying part F in this order.
  • the second reciprocating mechanism 330 is not particularly limited as long as it reciprocates the tape holder 30 in the Y direction.
  • the second reciprocating mechanism 330 of this embodiment includes a pair of upper and lower rails 331 extending in the Y direction, and a pair of upper and lower sliders 332 slidably attached to the corresponding rails 331, and the pair of sliders 332.
  • a support member 333 fixed to a support frame 317 and a pair of rails 331 are provided on a side plate 101 erected on the machine base 100.
  • the tape holder 30 can reciprocate in the Y direction along a rail 331 via a slider 332 by a driving source (not shown).
  • the peeling mechanism 4 peels the base material BM from the protective tape PT held by the tape holder 30 of the tape transport unit 3, and includes a peeling plate 40 and a peeling plate 40. And a peeling plate moving mechanism 41 that reciprocates in the direction of conveyance of the base material BM.
  • the peeling plate 40 has a sharp edge at the tip, and the base material BM on which the protective tape PT is temporarily attached passes over the peeling plate 40 and is then rapidly folded at the tip edge of the peeling plate 40.
  • the peeling plate 40 is supported on a pair of left and right support plates 42.
  • a pair of front and rear guide rollers 43 are rotatably mounted between the pair of support plates 42, and the base material BM folded back at the leading edge of the peeling plate 40 is guided by the pair of guide rollers 43. After that, it is wound around the collection roll 21 through a plurality of guide rollers 22.
  • the peeling plate moving mechanism 41 moves the peeling plate 40 at the peeling position in the direction opposite to the conveyance direction of the base material BM, thereby protecting the tape holding body 30.
  • the base material BM is peeled from the tape PT.
  • the peeling plate moving mechanism 41 is not particularly limited as long as it moves the peeling plate 40 back and forth in the conveyance direction of the base material BM.
  • the peeling plate moving mechanism 41 of the present embodiment includes a ball screw that drives the reciprocating movement of the peeling plate 40 and a guide mechanism that guides the reciprocating movement of the peeling plate 40.
  • the ball screw includes a screw shaft 410, a nut member 411, a ball (not shown), and the like, and the nut member 411 is connected to a support plate 42 that supports the peeling plate 40 via a connection member 412. .
  • the ball screw uses the motor 413 as a drive source, converts the forward / reverse rotation of the motor 413 into a reciprocating linear motion in the screw axis direction, and reciprocates the peeling plate 40 in the X direction.
  • the guide mechanism includes a pair of left and right guide rails 414 extending in the X direction, and a pair of left and right sliders 415 slidably attached to the corresponding guide rails 414.
  • the pair of guide rails 414 and the slider 415 are arranged so as to sandwich the peeling plate 40 therebetween, the pair of sliders 415 are provided on the corresponding support plate 42, and the pair of guide rails 414 are mounted on the machine base 100.
  • a pair of side plates 102 are provided so as to face each other with a gap therebetween.
  • the guide mechanism assists the separation plate 40 to reciprocate straight in the X direction by sliding the guide rail 414 corresponding to each slider 415.
  • the entire surface of the protective tape PT conveyed to the peeling position by the tape conveying mechanism 2 is held by the tape holder 30, and the protective mechanism PT is held by the tape holder 30 in the whole state.
  • the tape holder 30 holding the protective tape PT is sequentially conveyed to the tape alignment part B and the tape applying part F by the holder moving mechanism 31.
  • the tape alignment unit B is provided with a first alignment device 5 for positioning the protective tape PT conveyed from the tape peeling unit A while being held by the tape holder 30. It has been.
  • the first alignment device 5 detects the outer peripheral edge portion of the protective layer PL of the protective tape PT and positions the protective tape PT.
  • the first alignment device 5 includes an imaging unit 50 that images the outer peripheral edge of the protective layer PL, and an illumination unit that irradiates the outer peripheral edge of the protective layer PL imaged by the imaging unit 50. 51 and an imaging means moving mechanism 52 that reciprocates the imaging means 50 in the X direction along the horizontal plane and in the Y direction orthogonal to the X direction.
  • the imaging means 50 is, for example, a CCD camera or a C-MOS camera.
  • the imaging means 50 captures images at a plurality of locations (preferably four locations) on the outer peripheral edge of the protective layer PL, so that the plurality of imaging means 50 are respectively provided at a plurality of concentric circles corresponding to the outer peripheral edge of the protective layer PL.
  • the imaging means 50 will output the image data to a control apparatus (not shown), if the some image of the outer peripheral part of the protective layer PL is imaged.
  • the image pickup means 50 is supported by a vertical rail 54 erected on a support base 53 via an elevating member 55.
  • the elevating member 55 is moved up and down using a cylinder or the like. It can be moved up and down by moving in the direction (Z direction).
  • the illumination means 51 is supported by a guide 56 erected on a support base 53 so as to be movable up and down using an appropriate drive means (not shown).
  • the illumination unit 51 includes a light emitting unit 510 such as a light emitting diode as a light source, and the light emitting unit 510 is fixed in a light guide member 511.
  • the illumination means 51 is ring illumination that irradiates light in a ring shape, and is configured by arranging a plurality of light emitting portions 510 in a circumferential shape.
  • the imaging unit moving mechanism 52 includes a reciprocating mechanism (hereinafter referred to as “third reciprocating mechanism”) 520 that reciprocates the imaging unit 50 in the X direction along the horizontal plane, and the imaging unit 50. And a reciprocating mechanism (hereinafter referred to as “fourth reciprocating mechanism”) 530 that reciprocates along the horizontal plane in the Y direction perpendicular to the X direction.
  • third reciprocating mechanism a reciprocating mechanism that reciprocates the imaging unit 50 in the X direction along the horizontal plane
  • fourth reciprocating mechanism hereinafter referred to as “fourth reciprocating mechanism”
  • the third reciprocating mechanism 520 is not particularly limited as long as it can reciprocate the imaging means 50 in the X direction.
  • the third reciprocating mechanism 520 of the present embodiment includes a ball screw that drives the reciprocating movement of the imaging unit 50 in the X direction and a guide mechanism that guides the reciprocating movement of the imaging unit 50 in the X direction.
  • the ball screw includes a screw shaft 521, a nut member 522, a ball (not shown), and the like, and the nut member 522 is connected to a support base 53 that supports the imaging unit 50 via a connection member 523. .
  • This ball screw uses a motor (not shown) as a drive source, converts forward / reverse rotation of the motor into a reciprocating linear motion in the screw shaft direction, and reciprocates the imaging means 50 in the X direction.
  • the guide mechanism includes a pair of left and right guide rails 524 extending in the X direction and a pair of left and right sliders 525 slidably attached to the corresponding guide rails 524.
  • the pair of guide rails 524 and the slider 525 are disposed so as to sandwich the ball screw therebetween.
  • Each slider 525 is provided on the connection member 523, and each guide rail 524 is provided on a support plate 526 extending in the Y direction.
  • the guide mechanism assists the imaging means 50 to reciprocate straight in the X direction by sliding the guide rail 524 corresponding to each slider 525.
  • the fourth reciprocating mechanism 530 is not particularly limited as long as it can reciprocate the imaging means 50 in the Y direction.
  • the fourth reciprocating mechanism 530 of this embodiment includes a ball screw that drives the reciprocating movement of the imaging unit 50 in the Y direction, and a guide mechanism that guides the reciprocating movement of the imaging unit 50 in the Y direction.
  • the ball screw includes a screw shaft 531, a nut member 532, a ball (not shown), and the like.
  • the nut member 532 is attached to a support base 53 that supports the imaging unit 50 via a support plate 526 and a connection member 523. It is connected.
  • This ball screw uses the motor 533 as a drive source, converts the forward / reverse rotation of the motor 533 into a reciprocating linear motion in the screw shaft direction, and reciprocates the imaging means 50 in the Y direction.
  • the guide mechanism includes a pair of left and right guide rails 534 that extend in the Y direction, and a plurality of pairs of left and right sliders 535 that are slidably attached to the corresponding guide rails 534.
  • the pair of guide rails 534 and the slider 535 are arranged so as to sandwich the ball screw therebetween.
  • Each slider 535 is provided on a support plate 526, and each guide rail 534 is provided on a support frame 536 extending in the Y direction.
  • the guide mechanism assists the imaging means 50 to reciprocate straight in the Y direction by sliding the guide rail 534 corresponding to each slider 535.
  • the imaging means 50 images a plurality of locations on the outer peripheral edge of the protective layer PL
  • the control device processes the image data acquired from the imaging means 50
  • the center position of the protective layer PL is calculated by obtaining positional information of a plurality of locations on the outer peripheral edge of the protective layer PL.
  • the control device compares the center position of the protective layer PL with a preset reference position of the center of the protective layer PL, and based on the amount of positional deviation between the center position and the reference position
  • the position of the tape holder 30 is corrected in the X direction and the Y direction, and the center of the protective layer PL is aligned with the reference position.
  • the positioned protective tape PT is conveyed to the tape applying unit F by the holding body moving mechanism 31 while being held by the tape holding body 30.
  • the wafer supply unit C is provided with a storage cassette 10 that can store a plurality of wafers W in a stacked state.
  • the storage cassette 10 can be lifted and lowered using a lifting mechanism (not shown) such as an elevator mechanism.
  • a lifting mechanism such as an elevator mechanism.
  • the storage cassette 10 is moved up and down, and a plurality of wafers W are sequentially supplied to the first wafer transfer mechanism 7.
  • the first wafer transfer mechanism 7 is a robot arm in this embodiment, and includes a multi-joint arm 70 and a hand 71 provided at the tip of the arm 70.
  • a plurality of links 72 are pivotably connected, and a proximal end link 72 is pivotally connected to a shaft 73.
  • the hand 71 is a suction-type hand that can hold the wafer W by suction.
  • the hand 71 is configured to suck the surface of the wafer W and hold the wafer W, but sucks an outer peripheral portion where the pattern on the surface of the wafer W is not formed.
  • the first wafer transfer mechanism 7 sequentially takes out the wafers W one by one from the wafer supply unit C by the hand 71, and then the wafer W held by the hand 71 by the expansion and contraction and rotation of the arm 70 is performed. Transport and supply to F in order.
  • a non-contact type hand that can hold the wafer W in a non-contact manner may be used.
  • the wafer alignment section D is provided with a second alignment device 8 for positioning the wafer W transferred by the first wafer transfer mechanism 7.
  • the second alignment apparatus 8 detects the outer peripheral edge of the wafer W and positions the wafer W.
  • the second alignment apparatus 8 includes a rotary table 80 having a smaller diameter than the wafer W, a rotary drive mechanism 81 that rotates the rotary table 80, and the rotary table 80 in the X direction along the horizontal plane.
  • a table moving mechanism 82 that reciprocates in the Y direction orthogonal to the X direction, illumination means 83 that irradiates red light from one surface side (lower side in the illustrated example) of the wafer W toward the wafer W,
  • An image pickup means 84 for picking up an image of the wafer W is provided on the direction side (upper side in the illustrated example).
  • the rotary table 80 places and holds the wafer W on the upper surface thereof. In this embodiment, the rotary table 80 holds the wafer W by sucking it.
  • the rotary table 80 is rotatably supported on the support frame 801 via the rotary shaft 800.
  • Rotational drive mechanism 81 is not particularly limited as long as it rotates rotary table 80.
  • the rotation drive mechanism 81 of this embodiment includes a motor 810 serving as a drive source, a drive pulley 811 connected to the motor 810, a driven pulley 812 fixed to the rotation shaft 800, and a drive pulley 811 and a driven pulley 812. A belt 813 stretched between them is provided, and these are provided on a support frame 801.
  • the table moving mechanism 82 includes a reciprocating mechanism (hereinafter referred to as “fifth reciprocating mechanism”) 820 that reciprocates the rotary table 80 in the X direction along the horizontal plane, and the rotary table 80 along the horizontal plane and in the X direction. And a reciprocating mechanism (hereinafter referred to as “sixth reciprocating mechanism”) 830 that reciprocates in the orthogonal Y direction.
  • the fifth reciprocating mechanism 820 is not particularly limited as long as it can reciprocate the rotary table 80 in the X direction.
  • the fifth reciprocating mechanism 820 of this embodiment includes a ball screw that drives reciprocating movement of the rotary table 80 in the X direction and a guide mechanism that guides reciprocating movement of the rotating table 80 in the X direction.
  • the ball screw includes a screw shaft 821, a nut member 822, a ball (not shown), and the like, and the nut member 822 is connected to a support frame 801 that supports the rotary table 80.
  • the ball screw uses the motor 823 as a drive source, converts the forward / reverse rotation of the motor 823 into a reciprocating linear motion in the screw shaft direction, and reciprocates the rotary table 80 in the X direction.
  • the guide mechanism includes a guide rail 824 extending in the X direction and a pair of sliders 825 slidably attached to the guide rail 824.
  • Each slider 525 is provided on the support frame 801, and the guide rail 824 is provided on the support base 802.
  • the guide mechanism assists the rotary table 80 to reciprocate straight in the X direction by sliding the guide rail 824 corresponding to each slider 825.
  • the sixth reciprocating mechanism 830 is not particularly limited as long as it can reciprocate the rotary table 80 in the Y direction.
  • the sixth reciprocating mechanism 830 of this embodiment includes a ball screw that drives the reciprocating movement of the rotary table 80 in the Y direction, and a guide mechanism that guides the reciprocating movement of the rotating table 80 in the Y direction.
  • the ball screw includes a screw shaft 831, a nut member 832, a ball (not shown), and the like, and the nut member 832 is connected to a support frame 801 that supports the rotary table 80 via a support base 802.
  • the ball screw uses the motor 833 as a drive source, converts the forward / reverse rotation of the motor 833 into a reciprocating linear motion in the screw shaft direction, and reciprocates the rotary table 80 in the Y direction.
  • the guide mechanism includes a guide rail 834 that extends in the Y direction, and a pair of sliders 835 that are slidably attached to the guide rail 834. Each slider 835 is provided on the support base 802, and the guide rail 834 is provided on the support base 803.
  • the guide mechanism assists the rotary table 80 to reciprocate straight in the Y direction by sliding the guide rail 834 corresponding to each slider 835.
  • the illumination means 83 is supported at a position below the rotary table 80 by a support plate 804.
  • the illumination unit 83 has an outer shape larger than that of the wafer W, and irradiates red light in a ring shape.
  • the wavelength range of the irradiated red light is about 580 nm to 680 nm, and it is preferable to use red light having a peak wavelength of 630 nm.
  • red light is blocked by the wafer W regardless of the material of the wafer W, so that the light receiving state of the red light by the imaging means 84 is confirmed.
  • the illumination unit 83 includes a light emitting unit (not shown) such as a red light emitting diode as a light source, and is configured by arranging a plurality of light emitting units in a circumferential shape.
  • the imaging means 84 is, for example, a CCD camera or a C-MOS camera.
  • the image pickup means 84 is disposed on the rotation shaft 800 of the turntable 80 in order to image the entire outer peripheral edge of the wafer W.
  • the imaging unit 84 includes an optical filter 840.
  • the optical filter 840 has a characteristic of transmitting only the red light without transmitting the light other than the wavelength region of the red light irradiated on the wafer W by the illumination unit 83 out of the visible light incident on the imaging unit 84.
  • an optical filter that blocks light having a wavelength of 600 nm or less can be preferably used.
  • the imaging means 84 images the outer peripheral edge of the wafer W and outputs the image signal to a control device (not shown).
  • the outer peripheral edge of the wafer W is imaged and controlled by the imaging means 84 while rotating the wafer W by the rotary table 80 and irradiating red light from the illumination means 83 toward the wafer W.
  • the imaging means 84 By processing the image data acquired from the imaging means 84 by an apparatus (not shown), the outer peripheral edge of the wafer W is detected and the center position of the wafer W is calculated.
  • a control device (not shown) compares the center position of the wafer W with a preset reference position of the center of the wafer W, and the table moving mechanism 82 based on the amount of positional deviation between the center position and the reference position.
  • the position of the rotary table 80 is corrected in the X direction and the Y direction, and the center of the wafer W is aligned with the reference position.
  • the wafer W that has been positioned is transferred to the tape applying unit F by the first wafer transfer mechanism 7.
  • the frame supply unit E is provided with a storage cassette 11 that can store a plurality of dicing frames DF in a stacked state.
  • the storage cassette 11 can raise and lower each dicing frame DF using an elevating mechanism (not shown) such as an elevator mechanism.
  • the frame supply unit E is configured to supply a plurality of dicing frames DF to the first transfer arm 9A sequentially by raising and lowering the dicing frame DF every time the dicing frame DF is taken out by the first transfer arm 9A.
  • the dicing frame DF is preferably positioned in advance by an appropriate positioning means.
  • the first transfer arm 9A can reciprocate between the frame supply unit E and the tape applying unit F by a drive source (not shown) along a rail 103 extending in the Y direction.
  • the rail 103 is laid on the machine base 100.
  • the first transfer arm 9A can hold the dicing frame DF by suction, and includes a suction portion 90 such as a plurality of suction pads.
  • the first transport arm 9A sequentially takes out the dicing frames DF one by one from the frame supply unit E by the suction unit 90, and then transports and supplies them to the tape applying unit F.
  • a vacuum chamber is attached to the tape application portion F in order to apply the protective tape PT to the wafer W in a reduced pressure state and mount the wafer W on the dicing frame DF via the protective tape PT.
  • the vacuum chamber 6 includes a sticking table 60 that supports the wafer W, a frame base 61 that supports a dicing frame DF on which the wafer W is mounted, and a tape holder 30.
  • a pressing member 62 that presses the protective tape PT supplied onto the wafer W from above is provided.
  • the vacuum chamber 6 includes a lower chamber 6B fixed on the machine base 100 and an upper chamber 6A provided on the lower chamber 6B so as to be movable up and down, and is formed by combining the upper chamber 6A and the lower chamber 6B. Is done.
  • the sticking table 60 and the frame base 61 are provided inside the lower chamber 6B, and the pressing member 62 is provided inside the upper chamber 6A.
  • the upper chamber 6A is supported by a support plate 63 through a plurality of guide members 64 so as to be vertically movable.
  • a cylinder shaft 650 of an elevating cylinder 65 provided on the support plate 63 is connected to the upper chamber 6A.
  • the elevating cylinder 65 is driven, the upper chamber 6A is connected to the lower chamber 6B and a lower position. It moves in the vertical direction between the separated position above the chamber 6B.
  • a vacuum adapter 66 is connected to the upper chamber 6A, and the vacuum adapter 66 is connected to a decompression pump such as a vacuum pump (not shown).
  • a decompression pump such as a vacuum pump (not shown).
  • the vacuum chamber 6 can be evacuated by exhausting from the vacuum adapter 66. Further, the reduced pressure state in the vacuum chamber 6 can be released by introducing the atmosphere from the vacuum adapter 66.
  • an inert gas atmosphere can be obtained by introducing an inert gas such as argon or nitrogen into the vacuum chamber 6.
  • the sticking table 60 is provided with a porous adsorbing member 600 on the upper surface thereof as shown in FIGS.
  • the suction member 600 is connected to a decompression pump such as a vacuum pump, and can hold the wafer W by suction on its upper surface.
  • the wafer W is placed on the pasting table 60 by the first wafer transfer mechanism 7.
  • the affixing table 60 can be moved up and down in the lower chamber 6B by the lifting mechanism 67 while supporting the wafer W.
  • the lifting mechanism 67 is not particularly limited as long as it lifts the sticking table 60 up and down.
  • the elevating mechanism 67 of the present embodiment includes a guide member 670 that supports the sticking table 60 so as to be movable up and down relative to the lower chamber 6B, and a support plate 671 to which the guide member 670 is fixed.
  • a ball screw including a screw shaft 672, a nut member 673, a ball (not shown), a motor 674 for driving the ball screw, a drive pulley 675 connected to the motor 674, and a screw shaft 672.
  • a driven pulley 676 and a belt 677 stretched between the driving pulley 675 and the driven pulley 676 are provided.
  • the support plate 671 is connected to the nut member 673, and the elevating mechanism 67 converts the forward / reverse rotation of the motor 674 into a reciprocating linear motion in the screw axis direction with a ball screw, and moves the sticking table 60 up and down.
  • the sticking table 60 is normally positioned below the frame base 61 with a predetermined interval.
  • the frame base 61 is positioned so as to surround the pasting table 60 outside the pasting table 60 as shown in FIGS.
  • the frame base 61 has an annular shape, and the affixing table 60 can pass through the opening of the frame base 61 when moving up and down.
  • the dicing frame DF is placed on the frame base 61 by the first transfer arm 9A and fixed by an appropriate fixing means (not shown). Further, the protective tape PT is supplied onto the wafer W by being placed on the dicing frame DF by the tape holder 30.
  • the pressing member 62 presses the periphery of the protective layer PL of the protective tape PT and attaches it to the wafer W in order to attach the protective tape PT to the wafer W and the dicing frame DF.
  • the protective layer outer periphery pressing member 620 has a ring shape, and has an outer diameter larger than the outer diameter of the protective layer PL of the protective tape PT.
  • the protective layer outer periphery presser 620 can be made of, for example, fluororubber or a rubber material whose surface is fluorinated.
  • the protective layer outer periphery presser 620 is held by the first holder 624.
  • the first holder 624 is fixed to the support disk 623, and a protective layer outer periphery presser 620 is fitted into an annular recess formed in a ring-shaped protrusion 625 provided on the outer peripheral edge.
  • the tape outer periphery presser 621 has a ring shape, and has an outer diameter that is substantially the same as the outer diameter of the protective tape PT.
  • the tape outer periphery presser 621 can be formed of, for example, a silicone resin.
  • the tape outer periphery presser 621 is held by the second holder 626.
  • the second holder 626 is made of an annular plate material, and a tape outer periphery presser 621 is fixed to an annular groove formed in the outer peripheral edge portion.
  • the second holder 626 is supported by a plurality of fixtures 627 fixed to the support disk 623 using an elastic member 622 such as a spring. Thereby, when the outer peripheral edge of the protective tape PT is pressed by the tape outer periphery pressing member 621 and attached to the dicing frame DF, the pressing force by the tape outer periphery pressing member 621 can be made constant.
  • the pressing member 62 can be moved up and down in the upper chamber 6 ⁇ / b> A by the second vertical movement mechanism 68.
  • the second vertical movement mechanism 68 is not particularly limited as long as it moves the pressing member 62 in the vertical direction.
  • the second vertical movement mechanism 68 of the present embodiment includes a guide member 680 that supports the pressing member 62 so as to be movable up and down with respect to the upper chamber 6A, an elevating plate 681 to which the guide member 680 is fixed, and the upper chamber 6A.
  • An elevating cylinder 682 provided with a cylinder shaft 683 connected to the elevating plate 681 and a guide mechanism including a plurality of guide rails 684 and a slider 685 for guiding the vertical movement of the pressing member 62 are provided.
  • the guide rail 684 is provided on the upper chamber 6A so as to extend in the vertical direction, and the slider 685 is provided on the elevating plate 681, and is slidably attached to the corresponding guide rail 684.
  • the second vertical movement mechanism 68 drives the vertical movement of the pressing member 62 by the lifting cylinder 682 and guides the vertical movement of the pressing member 62 by the guide mechanism.
  • the outer peripheral edge of the wafer W passes through the adhesive layer AL around the protective layer PL of the protective tape PT in a reduced pressure state in the vacuum chamber 6 by the protective layer outer periphery presser 620 of the pressing member 62.
  • the circuit forming part of the wafer W is covered with the protective layer PL, and the outer peripheral edge part of the protective tape PT is covered with the dicing frame DF via the adhesive layer AL by the tape outer peripheral presser 621 of the pressing member 62. Is attached to the dicing frame DF via the protective tape PT (see FIG. 21A). Then, the dicing frame DF after mounting the wafer W is transferred to the heating unit G by the second transfer arm 9B.
  • the second transfer arm 9 ⁇ / b> B can reciprocate between the tape applying portion F and the heating portion G by a driving source (not shown) along the rail 103 extending in the Y direction.
  • the second transfer arm 9B can hold the dicing frame DF by suction, and includes a suction portion 90 such as a plurality of suction pads similarly to the first transfer arm 9A.
  • the second transfer arm 9 ⁇ / b> B takes out the dicing frame DF after mounting the wafer W from the tape applying unit F by the suction unit 90, and then transfers and supplies the dicing frame DF to the heating unit G.
  • the heating unit G includes a heating table 12 that heats the dicing frame DF, an inversion arm 13 that holds the dicing frame DF and reverses the held dicing frame DF up and down, and a dicing frame after heating.
  • a transport table 14 for transporting the DF to the frame storage unit H is provided.
  • the heating table 12 has a dicing frame DF placed on the upper surface and can be fixed by an appropriate fixing means (not shown).
  • a circular convex portion 121 is provided in the central region, and the dicing frame DF is arranged such that the wafer W is positioned on the convex portion 121 as shown in FIG. And placed on the heating table 12 and fixed.
  • the heating table 12 includes a heater 120 inside, and the protective tape PT is heated by the heater 120.
  • the heating table 12 is supported by a table 122 having a space inside.
  • the table table 122 can travel on a pair of rails 104 laid on the machine table 100 and extending in the X direction via a pair of sliders 123.
  • the heating table 12 drives, for example, a motor 124 and a ball screw 125. As a source, it can reciprocate along the rail 104 in the X direction.
  • the reversing arm 13 can hold the dicing frame DF by suction, and includes a suction portion 130 such as a plurality of suction pads.
  • the reversing arm 13 is supported on the support frame 131 so as to be movable in the vertical direction by a driving source (not shown).
  • the support frame 131 can travel on a rail 105 laid on the machine base 100 and extending in the X direction via a slider (not shown), and the reversing arm 13 is driven by a drive source (for example, a motor and a ball screw) (not shown). , And can be reciprocated in the X direction along the rail 105.
  • a drive source for example, a motor and a ball screw
  • a motor 132 is connected to the reversing arm 13, and the reversing arm 13 rotates by driving of the motor 132.
  • the reversing arm 13 can receive the dicing frame DF transported by the second transport arm 9B from the second transport arm 9B when the suction unit 130 is turned upside down so as to face upward (see FIG. 22). . Then, after receiving the dicing frame DF from the second transfer arm 9B, the reversing arm 13 is rotated and the suction portion 130 is rotated up and down so that the protective tape PT is placed on the lower surface. In this state, it can be placed on the heating table 12 (see FIG. 23).
  • the transfer table 14 can place the dicing frame DF on the upper surface, and transfers the dicing frame DF heated by the heating unit G to the frame storage unit H.
  • the transfer table 14 is supported by a plurality of support columns 141 provided upright on the support base 140.
  • the transfer table 14 can travel on a pair of rails 106 laid on the machine base 100 and extending in the X direction via a pair of sliders 142 provided on the support base 140, for example, a motor 143 and a ball screw 144. Can be reciprocated along the rail 106 in the X direction. Further, the transfer table 14 can pass through the internal space of the table table 122.
  • the protective tape PT is heated by the heating table 12 at, for example, 100 ° C. for about 1 minute, so that the protective layer PL is softened as shown in FIG. Are embedded in the irregularities of the circuit forming portion of the wafer W and are brought into close contact with each other. Then, the dicing frame DF is transported to the frame storage unit H by the transport table 14.
  • the frame storage portion H is provided with a storage cassette 15 that can store a plurality of dicing frames DF in a stacked state.
  • the storage cassette 15 can be lifted and lowered using a lifting mechanism (not shown) such as an elevator mechanism.
  • the storage cassette 15 is moved up and down each time the dicing frame DF is stored, and a plurality of dicing frames DF are sequentially stored.
  • the frame storage portion H is provided with a pair of transport rails 16 connected to the storage cassette 15 and a frame pusher 17 that reciprocates along a rail 107 parallel to the transport rail 16. Yes.
  • the frame pusher 17 can travel on the rail 107 extending in the X direction laid on the machine base 100 via a slider 170, and along the rail 107 by a driving source (not shown) (for example, a motor and a ball screw). It can reciprocate in the X direction.
  • the frame pusher 17 is supported by a drive source (not shown) so as to be movable in the vertical direction.
  • the frame pusher 17 pushes the dicing frame DF on the transport table 14 that has moved near the transport rail 16 toward the storage cassette 15, so that the dicing frame DF is transported from the transport rail 16 to the storage cassette 15 and stored. .
  • the wafer W is taken out from the wafer supply unit C shown in FIG. 1 by the first wafer transfer mechanism 7 and then transferred to the wafer alignment unit D and placed on the rotary table 80.
  • the wafer alignment unit D aligns the wafer W.
  • the wafer W is rotated while being supported by the rotary table 80, and red light is irradiated from one side of the wafer W toward the wafer W by the illumination unit 83, and the other side of the wafer W is captured by the imaging unit 84.
  • the wafer W is imaged from.
  • the outer peripheral edge portion of the wafer W is detected based on the light receiving state of the red light by the imaging means 84, the center position of the wafer W is calculated, the position of the wafer W is adjusted, and the center of the wafer W is set to a predetermined value Position to the reference position.
  • the positioned wafer W is transferred from the rotary table 80 to the tape applying portion F by the first wafer transfer mechanism 7 and placed in a state of being positioned on the attaching table 60 in the lower chamber 6B as shown in FIG. , Fix.
  • the center position of the wafer W placed on the sticking table 60 coincides with the center position of a dicing frame DF placed on a frame base 61 described later.
  • the dicing frame DF is taken out from the frame supply section E shown in FIG. 1 by the first transport arm 9A, it is transported to the tape applying section F, and as shown in FIG. 13, the frame base 61 in the lower chamber 6B. Place and fix on top.
  • the tape peeling part A shown in FIG. 1 while transporting the protective tape PT temporarily attached to the base material BM by the tape conveyance mechanism 2 to the peeling position, it was conveyed to the peeling position as shown in FIG.
  • the tape holder 30 is moved onto the protective tape PT, and the protective tape PT is held by the tape holder 30.
  • the peeling plate 40 is moved to peel the base material BM from the protective tape PT held by the tape holder 30.
  • the protective tape PT peeled off from the base material BM is conveyed to the tape alignment unit B while being held by the tape holder 30.
  • the protective tape PT is aligned.
  • the imaging means 50 images a plurality of locations (preferably four locations) of the outer peripheral edge portion of the protective layer PL of the protective tape PT.
  • position information of a plurality of locations on the outer peripheral edge of the protective layer PL is calculated from the image data obtained by the imaging means 50, the center position of the protective layer PL is calculated, the position of the protective tape PT is adjusted, and the protective layer PL is calculated. Is positioned at a predetermined reference position. After that, as shown in FIG.
  • the positioned protective tape PT is conveyed to the tape applying portion F while being held by the tape holder 30, and is placed on the dicing frame DF in the lower chamber 6B as shown in FIG. Put.
  • the center position of the dicing frame DF placed on the frame base 61 coincides with the center position of the protective layer PL of the protective tape PT placed on the dicing frame DF.
  • the protective tape PT is affixed to the wafer W at the tape affixing portion F.
  • the upper chamber 6B is moved downward and united with the lower chamber 6B as shown in FIG. Form.
  • the sticking table 60 is raised to bring the wafer W into contact with the protective tape PT, and as shown in FIG. 62 is moved downward to press the protective tape PT from above.
  • the periphery of the protective layer PL of the protective tape PT is pressed by the protective layer outer periphery presser 620 of the pressing member 62, whereby the adhesive layer AL is bonded to the outer peripheral edge of the wafer W, and the pressing member 62
  • the protective tape PT is bonded to the dicing frame DF via the adhesive layer AL.
  • the circuit (unevenness) on the surface of the wafer W is covered by the protective layer PL, and the wafer W is mounted on the dicing frame DF via the protective tape PT.
  • the upper chamber 6B is moved upward to open the lower chamber 6B, and as shown in FIG.
  • the dicing frame DF is transported to the heating unit G by the second transport arm 9B.
  • the dicing frame DF after the wafer W is mounted is heated.
  • the dicing frame DF is received from the second transfer arm 9B by the reversing arm 13 in the state of being inverted upside down as shown in FIG. 22, and then the dicing frame DF is rotated by rotating the reversing arm 13 as shown in FIG. Is turned upside down and the dicing frame DF is placed on the heating table 12 with the protective tape PT on the lower surface.
  • the protective tape PT is heated by the heater 120 built in the heating table 12, thereby softening the protective layer PL and bringing the protective layer PL into close contact with the irregularities of the circuit forming portion of the wafer W.
  • the second transfer arm 9B is moved onto the dicing frame DF, the dicing frame DF is held by the second transfer arm 9B, and then lifted from the heating table 12, and the transfer table 14 is moved below the second transfer arm 9 ⁇ / b> B by replacing the heating table 12, and the dicing frame DF is placed on the transfer table 14. Then, as shown in FIG. 27, the dicing frame DF is transported to the frame storage portion H by the transport table 14.
  • the dicing frame DF on which the wafer W is mounted is stored in the storage cassette 15 from the transfer table 14 via the transfer rail 16 by the frame pusher 17.
  • the peripheral portion of the protective layer PL of the protective tape PT is removed from the wafer in the tape pasting portion F in the reduced pressure state by the protective layer outer periphery presser 620 of the pressing member 62. Affix to the outer peripheral edge of W.
  • the protective tape PT can be neatly adhered to the wafer W via the protective layer PL without generating bubbles or wrinkles in the protective tape PT or the protective layer PL.
  • the protective layer PL of the protective tape PT is softened by heating, thereby protecting the protective layer.
  • the protective layer PL can be satisfactorily adhered to the irregularities of the wafer W without bubbles or wrinkles.
  • the circuit forming portion of the wafer W is not pressed, the unevenness of the wafer W can be prevented from being damaged, and a protective tape can be applied to the wafer W when it is attached to the wafer W like a conventional application roller. Since the PT is not pulled, it is possible to prevent the residual stress from being generated in the protective tape PT attached to the wafer W. Therefore, when the back surface of the wafer W is ground and thinned, it is possible to prevent the wafer W from being warped or damaged by the residual stress of the protective tape PT.
  • the outer peripheral edge of the protective tape PT is stuck to the dicing frame DF by the tape outer periphery presser 621 of the pressing member 62 in the tape applying part F. Accordingly, the protective tape PT can be attached to the wafer W, and the wafer W can be mounted on the dicing frame DF via the protective tape PT, so that work efficiency can be improved and productivity can be improved.
  • an apparatus and a method for applying a protective tape to a semiconductor wafer that can favorably apply the protective tape PT to a wafer W (particularly, a bump wafer). It is.
  • the dicing frame DF heated by the heating unit G is conveyed to the frame storage unit H and stored in the storage cassette 15.
  • the heated dicing frame DF is transported to the tape cutting unit I shown in FIG. 1 by the transport table 14, and the protective tape PT attached to the dicing frame DF is applied along the outer shape of the wafer W using the cutter unit 18.
  • the wafer W with the protective tape PT separated from the dicing frame DF is transported by the second wafer transport mechanism 19 and stored in an unillustrated wafer storage unit or an empty part of the storage cassette 10. You may comprise. This will be specifically described below with reference to FIGS.
  • the dicing frame DF is received from the second transfer arm 9B by the reversing arm 13 in the state of being turned upside down.
  • the dicing frame DF is turned upside down by rotating the reversing arm 13, and the dicing frame DF is placed on the transfer table 14 with the wafer W on the lower surface (see FIG. 29).
  • the dicing frame DF is transported below the cutter unit 18 of the tape cutting unit I by the transport table 14.
  • the upper surface of the transfer table 14 is appropriately convex according to the thickness of the wafer W.
  • the cutter unit 18 is configured to move up and down between a cutting position for cutting the protective tape PT and a spaced position above the cutting position by a driving source (not shown).
  • the cutter unit 18 includes a cutter 180, a support plate 181 that supports the cutter 180, and a motor 182 that rotationally drives the cutter 180.
  • the cutter unit 18 is moved downward and the cutter 180 is rotated so that the protective tape PT is applied along the outer shape of the wafer W. Cut. Then, as shown in FIG. 32, the cutter unit 18 is moved upward and retracted to the separation position, and the second wafer transfer mechanism 19 is moved onto the transfer table 14.
  • the second wafer transfer mechanism 19 is configured to reciprocate in the Y direction between the tape cutting unit I and the wafer alignment unit D by a drive source (not shown).
  • the second wafer transfer mechanism 19 includes a suction hand 190 that can hold the wafer W by suction, for example, and a cylinder 191 that moves the suction hand 190 in the vertical direction.
  • the suction hand 190 is moved downward to attach the protective tape PT separated from the dicing frame DF on the transfer table 14
  • the wafer W is adsorbed.
  • the wafer W with the protective tape PT is transferred to the wafer alignment portion D by the suction hand 190 and placed on the rotary table 80.
  • the wafer W with the protective tape PT placed on the rotary table 80 is then transported and stored by the first wafer transport mechanism 7 to a wafer storage section (not shown) or an empty portion of the storage cassette 10.
  • the dicing frame DF from which the wafer W has been separated is transferred to the frame storage unit H by the transfer table 14 as shown in FIG. 34, and transferred from the transfer table 14 by the frame pusher 17 as shown in FIG. It is stored in the storage cassette 15 via the rail 16.
  • the bonding apparatus 1 having the above configuration is connected to a back surface grinding apparatus or the like so that the wafer W mounted on the dicing frame DF or the wafer W to which the protective tape PT is attached is directly supplied to the back surface grinding apparatus or the like. May be.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
PCT/JP2018/016533 2018-04-24 2018-04-24 半導体ウエハへの保護テープの貼付装置及び貼り付け方法 WO2019207632A1 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SG11202010427SA SG11202010427SA (en) 2018-04-24 2018-04-24 Device and method for attaching protective tape on semiconductor wafer
JP2020515332A JP7287630B2 (ja) 2018-04-24 2018-04-24 半導体ウエハへの保護テープの貼付装置及び貼り付け方法
PCT/JP2018/016533 WO2019207632A1 (ja) 2018-04-24 2018-04-24 半導体ウエハへの保護テープの貼付装置及び貼り付け方法
CN201880092682.XA CN112020768A (zh) 2018-04-24 2018-04-24 用于将保护胶带贴附在半导体晶片上的装置和方法
US17/049,381 US11935768B2 (en) 2018-04-24 2018-04-24 Device and method for attaching protective tape on semiconductor wafer
KR1020207032073A KR102555601B1 (ko) 2018-04-24 2018-04-24 반도체 웨이퍼의 보호 테이프 부착장치 및 부착방법
DE112018007513.3T DE112018007513T5 (de) 2018-04-24 2018-04-24 Vorrichtung und Verfahren zum Aufbringen eines Schutzbandes auf einem Halbleiterwafer
TW108113405A TWI820117B (zh) 2018-04-24 2019-04-17 對半導體晶圓貼附之保護膠帶的貼附裝置及貼附方法

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PCT/JP2018/016533 WO2019207632A1 (ja) 2018-04-24 2018-04-24 半導体ウエハへの保護テープの貼付装置及び貼り付け方法

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TWI820117B (zh) 2023-11-01
SG11202010427SA (en) 2020-11-27
KR20210003139A (ko) 2021-01-11
JP7287630B2 (ja) 2023-06-06
US11935768B2 (en) 2024-03-19
US20210249285A1 (en) 2021-08-12
CN112020768A (zh) 2020-12-01
KR102555601B1 (ko) 2023-07-18
DE112018007513T5 (de) 2021-03-11
TW201946208A (zh) 2019-12-01
JPWO2019207632A1 (ja) 2021-04-22

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