WO2019202902A1 - 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、有機ｅｌディスプレイの製造方法、及びパターンの形成方法 - Google Patents

蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、有機ｅｌディスプレイの製造方法、及びパターンの形成方法 Download PDF

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Publication number
WO2019202902A1
WO2019202902A1 PCT/JP2019/011768 JP2019011768W WO2019202902A1 WO 2019202902 A1 WO2019202902 A1 WO 2019202902A1 JP 2019011768 W JP2019011768 W JP 2019011768W WO 2019202902 A1 WO2019202902 A1 WO 2019202902A1
Authority
WO
WIPO (PCT)
Prior art keywords
vapor deposition
resin
metal layer
mask
deposition mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2019/011768
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
博司 川崎
小幡　勝也
康子 曽根
吉紀 廣部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to US17/042,297 priority Critical patent/US20210013415A1/en
Priority to CN202210638781.1A priority patent/CN115110027B/zh
Priority to CN201980019365.XA priority patent/CN111886357B/zh
Priority to KR1020207026033A priority patent/KR102728020B1/ko
Publication of WO2019202902A1 publication Critical patent/WO2019202902A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • the resin material may be a cured product of a polyimide resin.
  • the vapor deposition mask satisfies the relationship of the following formula (3). 0.55 ⁇ ((total area of region A and region B) / area of region B) ⁇ 1.45 Formula (3)
  • ((total of A region and B region) (Area) / Area of the B region) is a value larger than 1.
  • a metal portion constituting the metal layer 10, that is, a portion other than the through hole 15 of one metal layer may be provided along the outer edge of the vapor deposition mask 100 as shown in FIG. 8, and as shown in FIG.
  • the size of the metal layer 10 may be made smaller than the resin mask 20 to expose the outer peripheral portion of the resin mask 20. Further, the size of the metal layer 10 may be made larger than that of the resin mask 20, and a part of the metal portion may protrude outward in the horizontal direction or in the vertical direction of the resin mask. In any case, the size of the through hole 15 of one metal layer is configured to be smaller than the size of the resin mask 20.
  • the vapor deposition mask 100 of the third embodiment when the vapor deposition mask 100 of the third embodiment is viewed in plan from the resin mask 20 side, when the resin mask 20 exhibits a rectangle having a long side and a short side, You may arrange
  • the shape of the metal layer may be a band shape having a predetermined angle with respect to the long side of the resin mask.
  • the quadrilateral is not limited to a rectangle, and may be a trapezoid or a parallelogram, for example. Other quadrilaterals may be used.
  • the shape of the resin mask 20 in plan view may be a shape other than the quadrilateral.
  • the shape and arrangement of the metal layer 10 described in the present specification can be applied as appropriate to the resin mask 20 having a shape other than the quadrangular shape when the resin mask 20 is planarized.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
PCT/JP2019/011768 2018-04-19 2019-03-20 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、有機ｅｌディスプレイの製造方法、及びパターンの形成方法 Ceased WO2019202902A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US17/042,297 US20210013415A1 (en) 2018-04-19 2019-03-20 Vapor deposition mask, frame-equipped vapor deposition mask, vapor deposition mask preparation body, method of manufacturing vapor deposition mask, method of manufacturing organic semiconductor element, method of manufacturing organic el display, and method of forming pattern
CN202210638781.1A CN115110027B (zh) 2018-04-19 2019-03-20 一种蒸镀掩模及其制造方法
CN201980019365.XA CN111886357B (zh) 2018-04-19 2019-03-20 一种蒸镀掩模及其制造方法
KR1020207026033A KR102728020B1 (ko) 2018-04-19 2019-03-20 증착 마스크, 프레임 부착 증착 마스크, 증착 마스크 준비체, 증착 마스크의 제조 방법, 유기 반도체 소자의 제조 방법, 유기 el 디스플레이의 제조 방법, 및 패턴의 형성 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018080690A JP6658790B2 (ja) 2018-04-19 2018-04-19 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、有機ｅｌディスプレイの製造方法、及びパターンの形成方法
JP2018-080690 2018-04-19

Publications (1)

Publication Number Publication Date
WO2019202902A1 true WO2019202902A1 (ja) 2019-10-24

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Application Number Title Priority Date Filing Date
PCT/JP2019/011768 Ceased WO2019202902A1 (ja) 2018-04-19 2019-03-20 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、有機ｅｌディスプレイの製造方法、及びパターンの形成方法

Country Status (6)

Country Link
US (1) US20210013415A1 (enExample)
JP (1) JP6658790B2 (enExample)
KR (1) KR102728020B1 (enExample)
CN (2) CN115110027B (enExample)
TW (1) TWI777055B (enExample)
WO (1) WO2019202902A1 (enExample)

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CN111088474B (zh) * 2020-01-03 2022-07-05 京东方科技集团股份有限公司 一种掩膜板及其制作方法
KR20210091382A (ko) * 2020-01-13 2021-07-22 삼성디스플레이 주식회사 마스크, 이의 제조 방법, 및 표시 패널 제조 방법
KR102868771B1 (ko) * 2020-10-28 2025-10-13 삼성디스플레이 주식회사 마스크 프레임 및 이를 포함하는 증착 장치
TWD215838S (zh) 2021-05-07 2021-12-01 景美科技股份有限公司 框架之部分
TWI777614B (zh) * 2021-06-11 2022-09-11 達運精密工業股份有限公司 金屬遮罩及其製造方法

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Also Published As

Publication number Publication date
KR102728020B1 (ko) 2024-11-07
CN111886357A (zh) 2020-11-03
KR20200144091A (ko) 2020-12-28
JP2019189888A (ja) 2019-10-31
TWI777055B (zh) 2022-09-11
CN111886357B (zh) 2022-06-21
CN115110027B (zh) 2024-01-02
US20210013415A1 (en) 2021-01-14
JP6658790B2 (ja) 2020-03-04
TW202003884A (zh) 2020-01-16
CN115110027A (zh) 2022-09-27

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