CN115110027B - 一种蒸镀掩模及其制造方法 - Google Patents

一种蒸镀掩模及其制造方法 Download PDF

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Publication number
CN115110027B
CN115110027B CN202210638781.1A CN202210638781A CN115110027B CN 115110027 B CN115110027 B CN 115110027B CN 202210638781 A CN202210638781 A CN 202210638781A CN 115110027 B CN115110027 B CN 115110027B
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Prior art keywords
metal layer
resin
mask
vapor deposition
temperature
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Chinese (zh)
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CN115110027A (zh
Inventor
川崎博司
小幡胜也
曾根康子
广部吉纪
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
CN202210638781.1A 2018-04-19 2019-03-20 一种蒸镀掩模及其制造方法 Active CN115110027B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210638781.1A CN115110027B (zh) 2018-04-19 2019-03-20 一种蒸镀掩模及其制造方法

Applications Claiming Priority (5)

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JP2018080690A JP6658790B2 (ja) 2018-04-19 2018-04-19 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、有機ｅｌディスプレイの製造方法、及びパターンの形成方法
JP2018-080690 2018-04-19
CN202210638781.1A CN115110027B (zh) 2018-04-19 2019-03-20 一种蒸镀掩模及其制造方法
CN201980019365.XA CN111886357B (zh) 2018-04-19 2019-03-20 一种蒸镀掩模及其制造方法
PCT/JP2019/011768 WO2019202902A1 (ja) 2018-04-19 2019-03-20 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、有機ｅｌディスプレイの製造方法、及びパターンの形成方法

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CN115110027A CN115110027A (zh) 2022-09-27
CN115110027B true CN115110027B (zh) 2024-01-02

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JP (1) JP6658790B2 (enExample)
KR (1) KR102728020B1 (enExample)
CN (2) CN115110027B (enExample)
TW (1) TWI777055B (enExample)
WO (1) WO2019202902A1 (enExample)

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CN111088474B (zh) * 2020-01-03 2022-07-05 京东方科技集团股份有限公司 一种掩膜板及其制作方法
KR20210091382A (ko) * 2020-01-13 2021-07-22 삼성디스플레이 주식회사 마스크, 이의 제조 방법, 및 표시 패널 제조 방법
KR102868771B1 (ko) * 2020-10-28 2025-10-13 삼성디스플레이 주식회사 마스크 프레임 및 이를 포함하는 증착 장치
TWD215838S (zh) 2021-05-07 2021-12-01 景美科技股份有限公司 框架之部分
TWI777614B (zh) * 2021-06-11 2022-09-11 達運精密工業股份有限公司 金屬遮罩及其製造方法

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US4916513A (en) * 1965-09-28 1990-04-10 Li Chou H Dielectrically isolated integrated circuit structure
US5453293A (en) * 1991-07-17 1995-09-26 Beane; Alan F. Methods of manufacturing coated particles having desired values of intrinsic properties and methods of applying the coated particles to objects
JP2014201819A (ja) * 2013-04-09 2014-10-27 株式会社ブイ・テクノロジー 蒸着マスク及び蒸着マスクの製造方法
CN105358732A (zh) * 2013-07-02 2016-02-24 株式会社V技术 成膜掩模和成膜掩模的制造方法
WO2015041296A1 (ja) * 2013-09-20 2015-03-26 株式会社ブイ・テクノロジー 成膜マスク及びタッチパネル基板
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KR102728020B1 (ko) 2024-11-07
CN111886357A (zh) 2020-11-03
KR20200144091A (ko) 2020-12-28
WO2019202902A1 (ja) 2019-10-24
JP2019189888A (ja) 2019-10-31
TWI777055B (zh) 2022-09-11
CN111886357B (zh) 2022-06-21
US20210013415A1 (en) 2021-01-14
JP6658790B2 (ja) 2020-03-04
TW202003884A (zh) 2020-01-16
CN115110027A (zh) 2022-09-27

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