JP6658790B2 - 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、有機ｅｌディスプレイの製造方法、及びパターンの形成方法 - Google Patents

蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、有機ｅｌディスプレイの製造方法、及びパターンの形成方法 Download PDF

Info

Publication number
JP6658790B2
JP6658790B2 JP2018080690A JP2018080690A JP6658790B2 JP 6658790 B2 JP6658790 B2 JP 6658790B2 JP 2018080690 A JP2018080690 A JP 2018080690A JP 2018080690 A JP2018080690 A JP 2018080690A JP 6658790 B2 JP6658790 B2 JP 6658790B2
Authority
JP
Japan
Prior art keywords
resin
mask
metal layer
vapor deposition
linear expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018080690A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019189888A (ja
JP2019189888A5 (enExample
Inventor
博司 川崎
博司 川崎
小幡　勝也
勝也 小幡
康子 曽根
康子 曽根
吉紀 廣部
吉紀 廣部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2018080690A priority Critical patent/JP6658790B2/ja
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to KR1020207026033A priority patent/KR102728020B1/ko
Priority to US17/042,297 priority patent/US20210013415A1/en
Priority to CN202210638781.1A priority patent/CN115110027B/zh
Priority to CN201980019365.XA priority patent/CN111886357B/zh
Priority to PCT/JP2019/011768 priority patent/WO2019202902A1/ja
Priority to TW108110610A priority patent/TWI777055B/zh
Publication of JP2019189888A publication Critical patent/JP2019189888A/ja
Publication of JP2019189888A5 publication Critical patent/JP2019189888A5/ja
Application granted granted Critical
Publication of JP6658790B2 publication Critical patent/JP6658790B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
JP2018080690A 2018-04-19 2018-04-19 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、有機ｅｌディスプレイの製造方法、及びパターンの形成方法 Active JP6658790B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2018080690A JP6658790B2 (ja) 2018-04-19 2018-04-19 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、有機ｅｌディスプレイの製造方法、及びパターンの形成方法
US17/042,297 US20210013415A1 (en) 2018-04-19 2019-03-20 Vapor deposition mask, frame-equipped vapor deposition mask, vapor deposition mask preparation body, method of manufacturing vapor deposition mask, method of manufacturing organic semiconductor element, method of manufacturing organic el display, and method of forming pattern
CN202210638781.1A CN115110027B (zh) 2018-04-19 2019-03-20 一种蒸镀掩模及其制造方法
CN201980019365.XA CN111886357B (zh) 2018-04-19 2019-03-20 一种蒸镀掩模及其制造方法
KR1020207026033A KR102728020B1 (ko) 2018-04-19 2019-03-20 증착 마스크, 프레임 부착 증착 마스크, 증착 마스크 준비체, 증착 마스크의 제조 방법, 유기 반도체 소자의 제조 방법, 유기 el 디스플레이의 제조 방법, 및 패턴의 형성 방법
PCT/JP2019/011768 WO2019202902A1 (ja) 2018-04-19 2019-03-20 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、有機ｅｌディスプレイの製造方法、及びパターンの形成方法
TW108110610A TWI777055B (zh) 2018-04-19 2019-03-27 蒸鍍遮罩、附有框架之蒸鍍遮罩、蒸鍍遮罩準備體、蒸鍍遮罩之製造方法、有機半導體元件之製造方法、有機ｅｌ顯示器之製造方法及圖案之形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018080690A JP6658790B2 (ja) 2018-04-19 2018-04-19 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、有機ｅｌディスプレイの製造方法、及びパターンの形成方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020018853A Division JP7120262B2 (ja) 2020-02-06 2020-02-06 蒸着マスク準備体の製造方法、フレーム付き蒸着マスク準備体の製造方法、及びフレーム付き蒸着マスク準備体

Publications (3)

Publication Number Publication Date
JP2019189888A JP2019189888A (ja) 2019-10-31
JP2019189888A5 JP2019189888A5 (enExample) 2020-01-23
JP6658790B2 true JP6658790B2 (ja) 2020-03-04

Family

ID=68240226

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018080690A Active JP6658790B2 (ja) 2018-04-19 2018-04-19 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、有機ｅｌディスプレイの製造方法、及びパターンの形成方法

Country Status (6)

Country Link
US (1) US20210013415A1 (enExample)
JP (1) JP6658790B2 (enExample)
KR (1) KR102728020B1 (enExample)
CN (2) CN115110027B (enExample)
TW (1) TWI777055B (enExample)
WO (1) WO2019202902A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI777614B (zh) * 2021-06-11 2022-09-11 達運精密工業股份有限公司 金屬遮罩及其製造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111088474B (zh) * 2020-01-03 2022-07-05 京东方科技集团股份有限公司 一种掩膜板及其制作方法
KR20210091382A (ko) * 2020-01-13 2021-07-22 삼성디스플레이 주식회사 마스크, 이의 제조 방법, 및 표시 패널 제조 방법
KR102868771B1 (ko) * 2020-10-28 2025-10-13 삼성디스플레이 주식회사 마스크 프레임 및 이를 포함하는 증착 장치
TWD215838S (zh) 2021-05-07 2021-12-01 景美科技股份有限公司 框架之部分

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4916513A (en) * 1965-09-28 1990-04-10 Li Chou H Dielectrically isolated integrated circuit structure
JPS5288072U (enExample) 1975-12-25 1977-07-01
US5453293A (en) * 1991-07-17 1995-09-26 Beane; Alan F. Methods of manufacturing coated particles having desired values of intrinsic properties and methods of applying the coated particles to objects
SG115678A1 (en) * 2003-04-22 2005-10-28 Asml Netherlands Bv Substrate carrier and method for making a substrate carrier
JP2010232163A (ja) * 2009-03-03 2010-10-14 Fujifilm Corp 発光表示装置の製造方法、発光表示装置、及び発光ディスプレイ
US9108216B2 (en) * 2012-01-12 2015-08-18 Dai Nippon Printing Co., Ltd. Vapor deposition mask, method for producing vapor deposition mask device and method for producing organic semiconductor element
TWI725466B (zh) * 2013-03-26 2021-04-21 日商大日本印刷股份有限公司 蒸鍍遮罩、附框架的蒸鍍遮罩、蒸鍍遮罩之製造方法、蒸鍍遮罩準備體、圖案之形成方法、及有機半導體元件之製造方法
JP6142388B2 (ja) * 2013-04-09 2017-06-07 株式会社ブイ・テクノロジー 蒸着マスク及び蒸着マスクの製造方法
WO2014167989A1 (ja) * 2013-04-12 2014-10-16 大日本印刷株式会社 蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、及び有機半導体素子の製造方法
JP6078818B2 (ja) * 2013-07-02 2017-02-15 株式会社ブイ・テクノロジー 成膜マスク及び成膜マスクの製造方法
JP6168944B2 (ja) * 2013-09-20 2017-07-26 株式会社ブイ・テクノロジー 成膜マスク
JP6229483B2 (ja) * 2013-12-24 2017-11-15 コニカミノルタ株式会社 成膜用マスク、マスク成膜方法、および有機エレクトロルミネッセンス素子の製造方法
KR101842822B1 (ko) * 2014-03-25 2018-03-27 파나소닉 아이피 매니지먼트 가부시키가이샤 액상 수지 조성물, 경화물, 배선 구조체 및 이 배선 구조체를 이용한 실장체
JP6511908B2 (ja) * 2014-03-31 2019-05-15 大日本印刷株式会社 蒸着マスクの引張方法、フレーム付き蒸着マスクの製造方法、有機半導体素子の製造方法、及び引張装置
KR102188493B1 (ko) * 2014-04-25 2020-12-09 삼성전자주식회사 질화물 단결정 성장방법 및 질화물 반도체 소자 제조방법
CN110306156A (zh) * 2014-06-06 2019-10-08 大日本印刷株式会社 蒸镀掩模及其前体、以及有机半导体元件的制造方法
KR102382753B1 (ko) * 2014-06-06 2022-04-08 다이니폰 인사츠 가부시키가이샤 증착 마스크, 프레임을 갖는 증착 마스크, 증착 마스크 준비체, 및 유기 반도체 소자의 제조 방법
JP6394879B2 (ja) * 2014-09-30 2018-09-26 大日本印刷株式会社 蒸着マスク、蒸着マスク準備体、フレーム付き蒸着マスク、及び有機半導体素子の製造方法
CN107075658B (zh) * 2014-10-23 2019-02-19 夏普株式会社 蒸镀掩模的制造方法、蒸镀掩模、蒸镀装置、蒸镀方法
CN110117767A (zh) * 2015-07-17 2019-08-13 凸版印刷株式会社 金属掩模用基材及其制造方法、蒸镀用金属掩模及其制造方法
CN109072411B (zh) * 2016-02-10 2021-04-06 鸿海精密工业股份有限公司 蒸镀掩模的制造方法、蒸镀掩模及有机半导体元件的制造方法
WO2017163443A1 (ja) * 2016-03-23 2017-09-28 鴻海精密工業股▲ふん▼有限公司 蒸着マスク、蒸着マスクの製造方法および有機半導体素子の製造方法
JP2018066053A (ja) * 2016-10-21 2018-04-26 大日本印刷株式会社 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、及び有機ｅｌディスプレイの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI777614B (zh) * 2021-06-11 2022-09-11 達運精密工業股份有限公司 金屬遮罩及其製造方法

Also Published As

Publication number Publication date
KR102728020B1 (ko) 2024-11-07
CN111886357A (zh) 2020-11-03
KR20200144091A (ko) 2020-12-28
WO2019202902A1 (ja) 2019-10-24
JP2019189888A (ja) 2019-10-31
TWI777055B (zh) 2022-09-11
CN111886357B (zh) 2022-06-21
CN115110027B (zh) 2024-01-02
US20210013415A1 (en) 2021-01-14
TW202003884A (zh) 2020-01-16
CN115110027A (zh) 2022-09-27

Similar Documents

Publication Publication Date Title
JP6658790B2 (ja) 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、有機ｅｌディスプレイの製造方法、及びパターンの形成方法
JP7024837B2 (ja) 蒸着マスクの製造方法、蒸着マスク準備体、フレーム付き蒸着マスク準備体、蒸着マスク、保護シート付き蒸着マスク、フレーム一体型の保護シート付き蒸着マスク、有機半導体素子の製造方法、及び有機ｅｌディスプレイの製造方法
CN105637113B (zh) 蒸镀掩模、带框架的蒸镀掩模及有机半导体元件的制造方法
US20190203338A1 (en) Vapor deposition mask, frame-equipped vapor deposition mask, method for producing organic semiconductor element, and method for producing organic el display
JP6642691B2 (ja) フレーム一体型の蒸着マスク、フレーム一体型の蒸着マスク準備体、蒸着パターン形成方法、有機半導体素子の製造方法、有機ｅｌディスプレイの製造方法
TWI588277B (zh) 成膜遮罩
JP6424521B2 (ja) 蒸着マスク、フレーム付き蒸着マスク、及び有機半導体素子の製造方法
TW202006794A (zh) 遮罩及其製造方法
JP2015092016A (ja) 蒸着マスク、蒸着マスクの製造方法、蒸着マスク準備体、フレーム付き蒸着マスク、及び有機半導体素子の製造方法
WO2017006821A1 (ja) 蒸着マスクの製造方法、蒸着マスク準備体、有機半導体素子の製造方法、有機ｅｌディスプレイの製造方法、及び蒸着マスク
JP6191711B2 (ja) 蒸着マスク、蒸着マスク装置、及び有機エレクトロルミネッセンス素子の製造方法
JP2015148002A (ja) 蒸着マスク、蒸着マスク準備体、及び有機半導体素子の製造方法
JP2020037742A (ja) 蒸着マスク、フレーム付き蒸着マスク、有機半導体素子の製造方法、及び蒸着マスクの製造方法
JP6347112B2 (ja) 蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、パターンの製造方法、フレーム付き蒸着マスク、及び有機半導体素子の製造方法
JP7120262B2 (ja) 蒸着マスク準備体の製造方法、フレーム付き蒸着マスク準備体の製造方法、及びフレーム付き蒸着マスク準備体
JP2018066053A (ja) 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、及び有機ｅｌディスプレイの製造方法
JP6879461B2 (ja) 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、有機半導体素子の製造方法、および有機ｅｌディスプレイの製造方法
JP7127281B2 (ja) 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、パターンの形成方法、蒸着マスクの製造方法、有機半導体素子の製造方法、及び有機ｅｌディスプレイの製造方法
JP7340160B2 (ja) 蒸着マスクの製造方法および蒸着マスク
JP6645534B2 (ja) フレーム付き蒸着マスク
JP2018059139A (ja) 蒸着マスクの製造方法、及び有機半導体素子の製造方法、並びに有機ｅｌディスプレイの製造方法
JP2017145509A (ja) 蒸着マスク、フレーム付き蒸着マスク、および有機エレクトロルミネッセンス素子の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20191202

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20191202

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20191202

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20191223

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200107

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200120

R150 Certificate of patent or registration of utility model

Ref document number: 6658790

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150