JP6658790B2 - 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、有機elディスプレイの製造方法、及びパターンの形成方法 - Google Patents

蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、有機elディスプレイの製造方法、及びパターンの形成方法 Download PDF

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JP6658790B2
JP6658790B2 JP2018080690A JP2018080690A JP6658790B2 JP 6658790 B2 JP6658790 B2 JP 6658790B2 JP 2018080690 A JP2018080690 A JP 2018080690A JP 2018080690 A JP2018080690 A JP 2018080690A JP 6658790 B2 JP6658790 B2 JP 6658790B2
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Prior art keywords
resin
mask
metal layer
vapor deposition
linear expansion
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JP2018080690A
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Japanese (ja)
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JP2019189888A5 (enExample
JP2019189888A (ja
Inventor
博司 川崎
博司 川崎
小幡 勝也
勝也 小幡
康子 曽根
康子 曽根
吉紀 廣部
吉紀 廣部
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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Priority to JP2018080690A priority Critical patent/JP6658790B2/ja
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to PCT/JP2019/011768 priority patent/WO2019202902A1/ja
Priority to US17/042,297 priority patent/US20210013415A1/en
Priority to CN202210638781.1A priority patent/CN115110027B/zh
Priority to KR1020207026033A priority patent/KR102728020B1/ko
Priority to CN201980019365.XA priority patent/CN111886357B/zh
Priority to TW108110610A priority patent/TWI777055B/zh
Publication of JP2019189888A publication Critical patent/JP2019189888A/ja
Publication of JP2019189888A5 publication Critical patent/JP2019189888A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
JP2018080690A 2018-04-19 2018-04-19 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、有機elディスプレイの製造方法、及びパターンの形成方法 Active JP6658790B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2018080690A JP6658790B2 (ja) 2018-04-19 2018-04-19 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、有機elディスプレイの製造方法、及びパターンの形成方法
US17/042,297 US20210013415A1 (en) 2018-04-19 2019-03-20 Vapor deposition mask, frame-equipped vapor deposition mask, vapor deposition mask preparation body, method of manufacturing vapor deposition mask, method of manufacturing organic semiconductor element, method of manufacturing organic el display, and method of forming pattern
CN202210638781.1A CN115110027B (zh) 2018-04-19 2019-03-20 一种蒸镀掩模及其制造方法
KR1020207026033A KR102728020B1 (ko) 2018-04-19 2019-03-20 증착 마스크, 프레임 부착 증착 마스크, 증착 마스크 준비체, 증착 마스크의 제조 방법, 유기 반도체 소자의 제조 방법, 유기 el 디스플레이의 제조 방법, 및 패턴의 형성 방법
PCT/JP2019/011768 WO2019202902A1 (ja) 2018-04-19 2019-03-20 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、有機elディスプレイの製造方法、及びパターンの形成方法
CN201980019365.XA CN111886357B (zh) 2018-04-19 2019-03-20 一种蒸镀掩模及其制造方法
TW108110610A TWI777055B (zh) 2018-04-19 2019-03-27 蒸鍍遮罩、附有框架之蒸鍍遮罩、蒸鍍遮罩準備體、蒸鍍遮罩之製造方法、有機半導體元件之製造方法、有機el顯示器之製造方法及圖案之形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018080690A JP6658790B2 (ja) 2018-04-19 2018-04-19 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、有機elディスプレイの製造方法、及びパターンの形成方法

Related Child Applications (1)

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JP2020018853A Division JP7120262B2 (ja) 2020-02-06 2020-02-06 蒸着マスク準備体の製造方法、フレーム付き蒸着マスク準備体の製造方法、及びフレーム付き蒸着マスク準備体

Publications (3)

Publication Number Publication Date
JP2019189888A JP2019189888A (ja) 2019-10-31
JP2019189888A5 JP2019189888A5 (enExample) 2020-01-23
JP6658790B2 true JP6658790B2 (ja) 2020-03-04

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Country Status (6)

Country Link
US (1) US20210013415A1 (enExample)
JP (1) JP6658790B2 (enExample)
KR (1) KR102728020B1 (enExample)
CN (2) CN111886357B (enExample)
TW (1) TWI777055B (enExample)
WO (1) WO2019202902A1 (enExample)

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KR20210091382A (ko) * 2020-01-13 2021-07-22 삼성디스플레이 주식회사 마스크, 이의 제조 방법, 및 표시 패널 제조 방법
KR102868771B1 (ko) 2020-10-28 2025-10-13 삼성디스플레이 주식회사 마스크 프레임 및 이를 포함하는 증착 장치
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TWI866357B (zh) * 2023-07-26 2024-12-11 達運精密工業股份有限公司 金屬遮罩檢測方法、金屬遮罩的張網方法和蒸鍍治具的製造方法

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Also Published As

Publication number Publication date
TW202003884A (zh) 2020-01-16
CN115110027B (zh) 2024-01-02
TWI777055B (zh) 2022-09-11
KR20200144091A (ko) 2020-12-28
KR102728020B1 (ko) 2024-11-07
WO2019202902A1 (ja) 2019-10-24
CN111886357B (zh) 2022-06-21
JP2019189888A (ja) 2019-10-31
CN115110027A (zh) 2022-09-27
CN111886357A (zh) 2020-11-03
US20210013415A1 (en) 2021-01-14

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