TWI777055B - 蒸鍍遮罩、附有框架之蒸鍍遮罩、蒸鍍遮罩準備體、蒸鍍遮罩之製造方法、有機半導體元件之製造方法、有機ｅｌ顯示器之製造方法及圖案之形成方法 - Google Patents

蒸鍍遮罩、附有框架之蒸鍍遮罩、蒸鍍遮罩準備體、蒸鍍遮罩之製造方法、有機半導體元件之製造方法、有機ｅｌ顯示器之製造方法及圖案之形成方法 Download PDF

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Publication number
TWI777055B
TWI777055B TW108110610A TW108110610A TWI777055B TW I777055 B TWI777055 B TW I777055B TW 108110610 A TW108110610 A TW 108110610A TW 108110610 A TW108110610 A TW 108110610A TW I777055 B TWI777055 B TW I777055B
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TW
Taiwan
Prior art keywords
vapor deposition
resin
mask
metal layer
deposition mask
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TW108110610A
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English (en)
Chinese (zh)
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TW202003884A (zh
Inventor
川崎博司
小幡勝也
曽根康子
廣部吉紀
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日商大日本印刷股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
TW108110610A 2018-04-19 2019-03-27 蒸鍍遮罩、附有框架之蒸鍍遮罩、蒸鍍遮罩準備體、蒸鍍遮罩之製造方法、有機半導體元件之製造方法、有機ｅｌ顯示器之製造方法及圖案之形成方法 TWI777055B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018080690A JP6658790B2 (ja) 2018-04-19 2018-04-19 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、有機ｅｌディスプレイの製造方法、及びパターンの形成方法
JP2018-080690 2018-04-19

Publications (2)

Publication Number Publication Date
TW202003884A TW202003884A (zh) 2020-01-16
TWI777055B true TWI777055B (zh) 2022-09-11

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TW108110610A TWI777055B (zh) 2018-04-19 2019-03-27 蒸鍍遮罩、附有框架之蒸鍍遮罩、蒸鍍遮罩準備體、蒸鍍遮罩之製造方法、有機半導體元件之製造方法、有機ｅｌ顯示器之製造方法及圖案之形成方法

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US (1) US20210013415A1 (enExample)
JP (1) JP6658790B2 (enExample)
KR (1) KR102728020B1 (enExample)
CN (2) CN115110027B (enExample)
TW (1) TWI777055B (enExample)
WO (1) WO2019202902A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111088474B (zh) * 2020-01-03 2022-07-05 京东方科技集团股份有限公司 一种掩膜板及其制作方法
KR20210091382A (ko) * 2020-01-13 2021-07-22 삼성디스플레이 주식회사 마스크, 이의 제조 방법, 및 표시 패널 제조 방법
KR102868771B1 (ko) * 2020-10-28 2025-10-13 삼성디스플레이 주식회사 마스크 프레임 및 이를 포함하는 증착 장치
TWD215838S (zh) 2021-05-07 2021-12-01 景美科技股份有限公司 框架之部分
TWI777614B (zh) * 2021-06-11 2022-09-11 達運精密工業股份有限公司 金屬遮罩及其製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201343943A (zh) * 2012-01-12 2013-11-01 Dainippon Printing Co Ltd 蒸鍍遮罩、蒸鍍遮罩裝置的製造方法及有機半導體元件的製造方法
JP2015120961A (ja) * 2013-12-24 2015-07-02 コニカミノルタ株式会社 成膜用マスク、マスク成膜方法、および有機エレクトロルミネッセンス素子の製造方法
TW201608045A (zh) * 2014-06-06 2016-03-01 Dainippon Printing Co Ltd 蒸鍍遮罩，附框架蒸鍍遮罩，蒸鍍遮罩預備體，及有機半導體元件之製造方法
TW201728770A (zh) * 2016-02-10 2017-08-16 鴻海精密工業股份有限公司 蒸鍍遮罩之製造方法、蒸鍍遮罩及有機半導體元件之製造方法
CN107075658A (zh) * 2014-10-23 2017-08-18 夏普株式会社 蒸镀掩模的制造方法、蒸镀掩模、蒸镀装置、蒸镀方法
TW201805451A (zh) * 2016-03-23 2018-02-16 鴻海精密工業股份有限公司 蒸鍍遮罩、蒸鍍遮罩之製造方法及有機半導體元件之製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4916513A (en) * 1965-09-28 1990-04-10 Li Chou H Dielectrically isolated integrated circuit structure
JPS5288072U (enExample) 1975-12-25 1977-07-01
US5453293A (en) * 1991-07-17 1995-09-26 Beane; Alan F. Methods of manufacturing coated particles having desired values of intrinsic properties and methods of applying the coated particles to objects
SG115678A1 (en) * 2003-04-22 2005-10-28 Asml Netherlands Bv Substrate carrier and method for making a substrate carrier
JP2010232163A (ja) * 2009-03-03 2010-10-14 Fujifilm Corp 発光表示装置の製造方法、発光表示装置、及び発光ディスプレイ
TWI725466B (zh) * 2013-03-26 2021-04-21 日商大日本印刷股份有限公司 蒸鍍遮罩、附框架的蒸鍍遮罩、蒸鍍遮罩之製造方法、蒸鍍遮罩準備體、圖案之形成方法、及有機半導體元件之製造方法
JP6142388B2 (ja) * 2013-04-09 2017-06-07 株式会社ブイ・テクノロジー 蒸着マスク及び蒸着マスクの製造方法
WO2014167989A1 (ja) * 2013-04-12 2014-10-16 大日本印刷株式会社 蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、及び有機半導体素子の製造方法
JP6078818B2 (ja) * 2013-07-02 2017-02-15 株式会社ブイ・テクノロジー 成膜マスク及び成膜マスクの製造方法
JP6168944B2 (ja) * 2013-09-20 2017-07-26 株式会社ブイ・テクノロジー 成膜マスク
KR101842822B1 (ko) * 2014-03-25 2018-03-27 파나소닉 아이피 매니지먼트 가부시키가이샤 액상 수지 조성물, 경화물, 배선 구조체 및 이 배선 구조체를 이용한 실장체
JP6511908B2 (ja) * 2014-03-31 2019-05-15 大日本印刷株式会社 蒸着マスクの引張方法、フレーム付き蒸着マスクの製造方法、有機半導体素子の製造方法、及び引張装置
KR102188493B1 (ko) * 2014-04-25 2020-12-09 삼성전자주식회사 질화물 단결정 성장방법 및 질화물 반도체 소자 제조방법
CN110306156A (zh) * 2014-06-06 2019-10-08 大日本印刷株式会社 蒸镀掩模及其前体、以及有机半导体元件的制造方法
JP6394879B2 (ja) * 2014-09-30 2018-09-26 大日本印刷株式会社 蒸着マスク、蒸着マスク準備体、フレーム付き蒸着マスク、及び有機半導体素子の製造方法
CN110117767A (zh) * 2015-07-17 2019-08-13 凸版印刷株式会社 金属掩模用基材及其制造方法、蒸镀用金属掩模及其制造方法
JP2018066053A (ja) * 2016-10-21 2018-04-26 大日本印刷株式会社 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、及び有機ｅｌディスプレイの製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201343943A (zh) * 2012-01-12 2013-11-01 Dainippon Printing Co Ltd 蒸鍍遮罩、蒸鍍遮罩裝置的製造方法及有機半導體元件的製造方法
JP2015120961A (ja) * 2013-12-24 2015-07-02 コニカミノルタ株式会社 成膜用マスク、マスク成膜方法、および有機エレクトロルミネッセンス素子の製造方法
TW201608045A (zh) * 2014-06-06 2016-03-01 Dainippon Printing Co Ltd 蒸鍍遮罩，附框架蒸鍍遮罩，蒸鍍遮罩預備體，及有機半導體元件之製造方法
CN107075658A (zh) * 2014-10-23 2017-08-18 夏普株式会社 蒸镀掩模的制造方法、蒸镀掩模、蒸镀装置、蒸镀方法
TW201728770A (zh) * 2016-02-10 2017-08-16 鴻海精密工業股份有限公司 蒸鍍遮罩之製造方法、蒸鍍遮罩及有機半導體元件之製造方法
TW201805451A (zh) * 2016-03-23 2018-02-16 鴻海精密工業股份有限公司 蒸鍍遮罩、蒸鍍遮罩之製造方法及有機半導體元件之製造方法

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Publication number Publication date
KR102728020B1 (ko) 2024-11-07
CN111886357A (zh) 2020-11-03
KR20200144091A (ko) 2020-12-28
WO2019202902A1 (ja) 2019-10-24
JP2019189888A (ja) 2019-10-31
CN111886357B (zh) 2022-06-21
CN115110027B (zh) 2024-01-02
US20210013415A1 (en) 2021-01-14
JP6658790B2 (ja) 2020-03-04
TW202003884A (zh) 2020-01-16
CN115110027A (zh) 2022-09-27

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