WO2019105033A1 - Procédé de fabrication de carte de circuit intégré à composant, et carte de circuit intégré à composant - Google Patents

Procédé de fabrication de carte de circuit intégré à composant, et carte de circuit intégré à composant Download PDF

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Publication number
WO2019105033A1
WO2019105033A1 PCT/CN2018/093632 CN2018093632W WO2019105033A1 WO 2019105033 A1 WO2019105033 A1 WO 2019105033A1 CN 2018093632 W CN2018093632 W CN 2018093632W WO 2019105033 A1 WO2019105033 A1 WO 2019105033A1
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WO
WIPO (PCT)
Prior art keywords
hole
circuit board
sub
insulating layer
layer
Prior art date
Application number
PCT/CN2018/093632
Other languages
English (en)
Chinese (zh)
Inventor
李娟�
陈丽琴
李艳国
Original Assignee
广州兴森快捷电路科技有限公司
深圳市兴森快捷电路科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 广州兴森快捷电路科技有限公司, 深圳市兴森快捷电路科技股份有限公司 filed Critical 广州兴森快捷电路科技有限公司
Publication of WO2019105033A1 publication Critical patent/WO2019105033A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive

Definitions

  • the present invention relates to the field of circuit board processing technology, and in particular, to a method for fabricating a buried component circuit board and a buried component circuit board.
  • the present invention overcomes the deficiencies of the prior art, and provides a method for fabricating a buried component circuit board and a buried component circuit board with better reliability.
  • a method for fabricating a buried component circuit board comprising a first sub-board and a second sub-board, the first sub-board comprising a pre-fabricated layer, the pre-formed layer being disposed on the first sub-board
  • the outermost layer, the second sub-board includes a first insulating layer, and the first insulating layer is disposed at an outermost layer of the second sub-board, and includes the following steps:
  • a second insulating layer is disposed on the processed prefabricated layer, and a first through hole is formed at a position corresponding to the pad on the second insulating layer, and the conductive material is filled in the first through hole;
  • the component is mounted on the first sub-board, and the pin of the component protrudes into the first through hole;
  • the first daughterboard is pressed against the second daughterboard.
  • a second insulating layer is disposed on the prefabricated layer, a first through hole is opened and a conductive adhesive material is filled, and the component is mounted on the first sub-board, so that the component leads are inserted into the first In a through hole, a groove matching the component is further formed on the first insulating layer, and the first sub-board is pressed with the second sub-board.
  • the pin of the component protrudes into the first through hole, and the component can be fully adhered to the second insulating layer, and the pin can be electrically connected to the pad through the conductive adhesive material, and the component is connected.
  • the cooperation between the component and the second sub-board is also relatively tight.
  • the circuit board made of the first sub-board, the component and the second sub-board is closely matched, there is no void, and the inside of the circuit board is not easy to retain liquid, which does not affect the operation of the circuit board, so that the manufactured circuit board is Good reliability.
  • a second insulating layer is disposed on the processed prefabricated layer, a first through hole is opened at a position corresponding to the pad on the second insulating layer, and the first through hole is filled with a conductive adhesive material, specifically Includes the following steps:
  • the second insulating layer and the insulating film are sequentially disposed on the processed pre-formed layer by heating and pressing.
  • the temperature ranges from 80 ° C to 155 ° C and the pressure ranges from 15 kg/cm 2 to 23 kg/cm 2 .
  • the duration of the above heating and pressurization is 2 minutes to 6 minutes.
  • the second insulating layer is a prepreg
  • the insulating film is a PET film.
  • the conductive adhesive material is a conductive resin.
  • the apertures of the first through hole and the second through hole gradually increase in a direction away from the first sub-board.
  • a buried component circuit board produced by the method of fabricating a buried component circuit board according to any of the above.
  • FIG. 1 is a schematic flow chart 1 of a method for fabricating a buried component circuit board according to an embodiment of the present invention
  • Figure 2 is a schematic view showing the manufacturing steps of Figure 1;
  • FIG. 3 is a schematic flow chart 2 of a method for fabricating a buried component circuit board according to an embodiment of the present invention
  • FIG. 4 is a schematic view showing the manufacturing steps of FIG. 3.
  • first daughter board, 110 prefabricated layer, 111, pad, 120, second insulating layer, 121, first through hole, 130, conductive adhesive material, 140, isolation film, 141, second through hole, 200, second sub-board, 210, first insulating layer, 300, components.
  • first and second in the present invention do not represent a specific number and order, but are merely used for distinguishing names.
  • the embedded component circuit board includes a first sub-board 100 and a second sub-board 200.
  • the first sub-board 100 includes a pre-fabricated layer 110, and the pre-fabricated layer 110 is provided.
  • the second sub-board 200 includes a first insulating layer 210, and the first insulating layer 210 is disposed on the outermost layer of the second sub-board 200, and is embedded.
  • the manufacturing method of the component circuit board includes the following steps:
  • a second insulating layer 120 is disposed on the processed pre-formed layer 110, and a first via hole 121 is formed at a position corresponding to the pad 111 on the second insulating layer 120, and the first via hole 121 is filled with a conductive adhesive.
  • the component 300 is mounted on the first sub-board 100, and the pin of the component 300 extends into the first through hole 121;
  • a groove matching the component 300 is formed on the first insulating layer 210, and the first sub-board 100 and the second sub-board 200 are pressed together.
  • the method for fabricating the embedded component circuit board includes disposing a second insulating layer 120 on the pre-formed layer 110, opening a first via hole 121 and filling the conductive adhesive material 130, and mounting the component 300 and the first sub-board 100 to make the component
  • the pin of the 300 is inserted into the first through hole 121, and a groove matching the component 300 is formed on the first insulating layer 210, and is pressed by the first sub-board 100 and the second sub-board 200.
  • the pin of the component 300 extends into the first through hole 121, and the component 300 can be fully adhered to the second insulating layer 120, and the lead can pass through the conductive adhesive material 130 and the pad 111.
  • the component 300 is tightly coupled with the first sub-board 100, and when the second sub-board 200 is pressed against the first sub-board 100, since the second sub-board 200 is provided with a groove matching the component 300, the component The cooperation between the 300 and the second sub-board 200 is also relatively tight.
  • the circuit board made by the first sub-board 100, the component 300, and the second sub-board 200 has a tight internal structure, and there is no void, and the inside of the circuit board is not easy to retain liquid. It will not affect the operation of the board, and the reliability of the board produced is better.
  • the first sub-board 100 includes at least two prefabricated layers 110, wherein the two prefabricated layers 110 are a first circuit layer and a second circuit layer, respectively, a first circuit layer and a second circuit layer.
  • the first layer and the bottom layer of the first sub-board 100 are respectively disposed, and the pre-fabricated layer 110 is processed to form the pads 111 corresponding to the pins of the component 300, and specifically includes the following steps:
  • a conductive via is formed in the first sub-board 100 at a position corresponding to the pin of the component 300, and the first circuit layer and the second circuit layer are processed to form a pad 111 corresponding to the conductive via.
  • the first sub-board 100 further includes at least one prepreg, wherein one prepreg is disposed between the first circuit layer and the second circuit layer.
  • a conductive blind hole or a conductive buried hole or the like may be formed on the first sub-board 100, and the opening of the conductive blind hole or the conductive buried hole is disposed on the first circuit layer, and the first circuit layer is processed to form and The conductive blind hole or the conductive buried hole is matched with the pad 111.
  • the prefabricated layer 110 is a conductive layer
  • the conductive layer may be a conductive material such as copper or tin.
  • the second insulating layer 120 may be disposed on both the first circuit layer and the second circuit layer and the same process may be performed.
  • the embedded component circuit board further includes a third sub-board, the third sub-board includes a third insulating layer, and the third insulating layer is disposed at an outermost layer of the third sub-board, and the first sub-board 100 and the first The two sub-boards 200 are pressed together, and specifically include the following steps:
  • the first sub-board 100, the second sub-board 200 and the third sub-board are pressed together, wherein the first insulating layer 210 is adhered to the second insulating layer 120, and the other side of the first sub-board 100 is attached to the third insulating layer. Hehe.
  • the first insulating layer 210 is a prepreg.
  • the second insulating layer 120 is disposed on the processed pre-formed layer 110, and the first via hole 121 is opened at a position corresponding to the pad 111 on the second insulating layer 120.
  • Filling the first through hole 121 with the conductive adhesive material 130 includes the following steps:
  • the second insulating layer 120 can be prevented from being contaminated by liquid or processing waste during the operation such as opening, and the conductive adhesive can be prevented when filling the conductive adhesive material 130.
  • the material 130 contaminates the surface of the second insulating layer 120, which can improve the reliability of the fabricated circuit board, and at the same time ensure that the subsequent bonding between the first sub-board 100 and the second sub-board 200 is more tight, and further, the conductive is filled.
  • the conductive adhesive material 130 can also be prevented from entering between the second insulating layer 120 and the isolation film 140.
  • the aperture of the first through hole 121 is smaller than or equal to the aperture of the second through hole 141.
  • the conductive adhesive material 130 can be further prevented from contaminating the surface of the second insulating layer 120.
  • a hole is formed in the second insulating layer 120 and the isolation film 140 at a position corresponding to the pad 111 by laser opening. High processing accuracy and short processing time. In addition, according to the actual situation, it is also possible to open holes by means of machining.
  • the conductive adhesive material 130 is a conductive resin.
  • the conductive resin can conduct electricity while sufficiently filling the first through holes 121 to ensure that there are no bubbles or voids around the pins of the element 300.
  • the conductive resin plug hole may be used.
  • the second insulating layer 120 and the insulating film 140 are sequentially disposed on the processed pre-formed layer 110 by heating and pressurizing.
  • the second insulating layer 120 and the isolation film 140 can be attached to the first sub-board 100 by heating and pressing, and the first sub-board 100, the second insulating layer 120, and the isolation film 140 are fixed.
  • the adhesion is convenient for subsequent processing, and the position between the layers is relatively stable, which can improve the processing precision.
  • the temperature ranges from 80 ° C to 155 ° C and the pressure ranges from 15 kg/cm 2 to 23 kg/cm 2 .
  • the temperature range a certain adhesive force exists between the first sub-board 100, the second insulating layer 120, and the isolation film 140, and the adhesive force is not excessively large, so that the isolation film 140 can be removed later.
  • the temperature ranges from 100 ° C to 135 ° C, and the pressure ranges from 17 kg/cm 2 to 21 kg/cm 2 .
  • the duration of the above heating and pressurization is 2 minutes to 6 minutes. By further limiting the time of warming and pressurization, it is also ensured that adhesion is present while facilitating subsequent removal of the insulating film 140.
  • the duration of the above heating and pressurization is from 3 minutes to 5 minutes.
  • the method further includes the following steps:
  • the barrier film 140 is preheated.
  • the adhesion between the insulating film 140 and the second insulating layer 120 is increased, which may cause the insulating film 140 to be removed.
  • the second insulating layer 120 preheats the insulating film 140 to reduce the adhesion between the insulating film 140 and the second insulating layer 120, and the effect is better when the insulating film 140 is removed. Further, the insulating film 140 is provided.
  • the conductive adhesive material 130 in the first through hole 121 and the second through hole 141 may be heated at the same time to volatilize the volatile substances in the conductive adhesive material 130 to prevent the volatile substances from affecting the reliability of the circuit board. .
  • the first sub-board 100 and the second sub-board 200 are pressed together by sintering.
  • the first sub-board 100 and the second sub-board 200 can be better combined by sintering, and the conductive adhesive material 130 can be turned on better, and the performance of the fabricated circuit board can be improved.
  • the second insulating layer 120 is a prepreg, and the insulating film 140 is a PET film.
  • the second insulating layer 120 is consistent with the material of the insulating layer of the second sub-board 200, so that the bonding of the first sub-board 100 and the second sub-board 200 is facilitated, and the second insulating layer 120 of the PET film is better.
  • the protection is carried out, and the surface of the PET film is relatively smooth, which is advantageous for removing the PET film by tearing.
  • the apertures of the first through hole 121 and the second through hole 141 gradually increase in a direction away from the first sub-board 100 . At this time, it is ensured that the conductive adhesive material 130 sufficiently fills the first through hole 121 and the second through hole 141.
  • the depth of the first through hole 121 is greater than or equal to the length of the pin of the component 300. At this time, when the component 300 is mounted, since the pin of the component 300 can completely protrude into the first through hole 121, it can be ensured. The component 300 is sufficiently bonded to the second insulating layer 120.
  • the buried component circuit board is fabricated using the method of fabricating the embedded component circuit board as described above.
  • the embedded component circuit board since the component 300 is tightly integrated with the first sub-board 100 and the second sub-board 200, there is no void, and the working state of the embedded component circuit board is not affected, so that the embedded component circuit board is reliable. Good sex.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

L'invention concerne un procédé de fabrication d'une carte de circuit intégré à composant, et une carte de circuit intégré à composant. Le procédé de fabrication d'une carte de circuit intégré à composant comprend les étapes suivantes consistant à : traiter une couche préfabriquée pour former des plages de connexion agencées correspondant à des broches d'un composant ; fournir une seconde couche isolante sur la couche préfabriquée traitée, former des premiers trous traversants au niveau de parties correspondant aux plages de connexion sur la seconde couche isolante, et remplir les premiers trous traversants avec un matériau adhésif conducteur ; fixer le composant à une première carte fille, les broches du composant étant insérées dans les premiers trous traversants ; fournir, sur une première couche isolante, une rainure adaptée au composant ; et ajuster par pression la première carte fille et une seconde carte fille.
PCT/CN2018/093632 2017-11-30 2018-06-29 Procédé de fabrication de carte de circuit intégré à composant, et carte de circuit intégré à composant WO2019105033A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201711242258.2 2017-11-30
CN201711242258.2A CN107949166B (zh) 2017-11-30 2017-11-30 埋置元件电路板的制作方法及埋置元件电路板

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WO2019105033A1 true WO2019105033A1 (fr) 2019-06-06

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WO (1) WO2019105033A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107949166B (zh) * 2017-11-30 2020-04-14 广州兴森快捷电路科技有限公司 埋置元件电路板的制作方法及埋置元件电路板

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