WO2019105033A1

WO2019105033A1 - Fabricating method for component embedded circuit board, and component embedded circuit board

Info

Publication number: WO2019105033A1
Application number: PCT/CN2018/093632
Authority: WO
Inventors: 李娟�; 陈丽琴; 李艳国
Original assignee: 广州兴森快捷电路科技有限公司; 深圳市兴森快捷电路科技股份有限公司
Priority date: 2017-11-30
Filing date: 2018-06-29
Publication date: 2019-06-06
Also published as: CN107949166B; CN107949166A

Abstract

A fabricating method for a component embedded circuit board, and a component embedded circuit board. The fabricating method for a component embedded circuit board comprises the following steps: processing a prefabricated layer to form solder pads arranged corresponding to pins of a component; providing a second insulating layer on the processed prefabricated layer, forming first through holes at portions corresponding to the solder pads on the second insulating layer, and filling the first through holes with a conductive adhesive material; attaching the component to a first daughter board, the pins of the component being plugged into the first through holes; providing, on a first insulating layer, a groove matched with the component; and press-fitting the first daughter board and a second daughter board.

Description

Method for manufacturing buried component circuit board and embedded component circuit board

Technical field

The present invention relates to the field of circuit board processing technology, and in particular, to a method for fabricating a buried component circuit board and a buried component circuit board.

Background technique

With the miniaturization and multi-functionality of electronic products, the requirements for electronic components and circuit boards are becoming higher and higher, and mounting components on circuit boards cannot meet the requirements.

In order to solve the above problems, a process of embedding electronic components inside the circuit board has appeared, and the size of the manufactured circuit board can be effectively controlled. However, there is a cavity inside the circuit board of the conventional embedded electronic component, and other substances remain in the cavity. , affect the reliability of the board when working.

Summary of the invention

Based on this, the present invention overcomes the deficiencies of the prior art, and provides a method for fabricating a buried component circuit board and a buried component circuit board with better reliability.

Its technical solutions are as follows:

A method for fabricating a buried component circuit board, the embedded component circuit board comprising a first sub-board and a second sub-board, the first sub-board comprising a pre-fabricated layer, the pre-formed layer being disposed on the first sub-board The outermost layer, the second sub-board includes a first insulating layer, and the first insulating layer is disposed at an outermost layer of the second sub-board, and includes the following steps:

Processing the prefabricated layer to form a pad corresponding to the pin of the component;

a second insulating layer is disposed on the processed prefabricated layer, and a first through hole is formed at a position corresponding to the pad on the second insulating layer, and the conductive material is filled in the first through hole;

The component is mounted on the first sub-board, and the pin of the component protrudes into the first through hole;

Forming a groove matching the component on the first insulating layer;

The first daughterboard is pressed against the second daughterboard.

In the method for fabricating the embedded component circuit board, a second insulating layer is disposed on the prefabricated layer, a first through hole is opened and a conductive adhesive material is filled, and the component is mounted on the first sub-board, so that the component leads are inserted into the first In a through hole, a groove matching the component is further formed on the first insulating layer, and the first sub-board is pressed with the second sub-board. In the circuit board manufactured by the above method, the pin of the component protrudes into the first through hole, and the component can be fully adhered to the second insulating layer, and the pin can be electrically connected to the pad through the conductive adhesive material, and the component is connected. When the first sub-board is tightly fitted and the second sub-board is pressed against the first sub-board, since the second sub-board is provided with a groove matching the component, the cooperation between the component and the second sub-board is also relatively tight. When the circuit board made of the first sub-board, the component and the second sub-board is closely matched, there is no void, and the inside of the circuit board is not easy to retain liquid, which does not affect the operation of the circuit board, so that the manufactured circuit board is Good reliability.

Further, a second insulating layer is disposed on the processed prefabricated layer, a first through hole is opened at a position corresponding to the pad on the second insulating layer, and the first through hole is filled with a conductive adhesive material, specifically Includes the following steps:

Forming a second insulating layer and a layer of insulating film on the pre-formed layer after processing;

Opening a hole at a position corresponding to the pad on the second insulating layer and the isolation film to form the first through hole on the second insulating layer and the second through hole on the isolation film, the first through hole and the second through hole Hole connection

Filling the first through hole and the second through hole with a conductive adhesive material;

Remove the barrier film.

Further, in the above step, the second insulating layer and the insulating film are sequentially disposed on the processed pre-formed layer by heating and pressing.

Further, in the above method of heating and pressurizing, the temperature ranges from 80 ° C to 155 ° C and the pressure ranges from 15 kg/cm ² to 23 kg/cm ² .

Further, the duration of the above heating and pressurization is 2 minutes to 6 minutes.

Further, before the removing the isolation film, the following steps are further included:

Preheat the barrier film.

Further, the second insulating layer is a prepreg, and the insulating film is a PET film.

Further, the conductive adhesive material is a conductive resin.

Further, the apertures of the first through hole and the second through hole gradually increase in a direction away from the first sub-board.

A buried component circuit board produced by the method of fabricating a buried component circuit board according to any of the above.

In the above-mentioned embedded component circuit board, since the components are closely combined with the first sub-board and the second sub-board, there is no void, and the working state of the embedded component circuit board is not affected, so that the reliability of the embedded component circuit board is good. .

DRAWINGS

1 is a schematic flow chart 1 of a method for fabricating a buried component circuit board according to an embodiment of the present invention;

Figure 2 is a schematic view showing the manufacturing steps of Figure 1;

3 is a schematic flow chart 2 of a method for fabricating a buried component circuit board according to an embodiment of the present invention;

4 is a schematic view showing the manufacturing steps of FIG. 3.

Description of the reference signs:

100, first daughter board, 110, prefabricated layer, 111, pad, 120, second insulating layer, 121, first through hole, 130, conductive adhesive material, 140, isolation film, 141, second through hole, 200, second sub-board, 210, first insulating layer, 300, components.

Detailed ways

In order to facilitate the understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Preferred embodiments of the invention are given in the drawings. However, the invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be more fully understood.

It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or the element can be present. When an element is considered to be "connected" to another element, it can be directly connected to the other element or. The terms "vertical", "horizontal", "left", "right", and the like, as used herein, are for the purpose of illustration and are not intended to be the only embodiment.

All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. The terminology used in the description of the present invention is for the purpose of describing particular embodiments and is not intended to limit the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

The terms "first" and "second" in the present invention do not represent a specific number and order, but are merely used for distinguishing names.

In an embodiment, as shown in FIG. 1 and FIG. 2, the embedded component circuit board includes a first sub-board 100 and a second sub-board 200. The first sub-board 100 includes a pre-fabricated layer 110, and the pre-fabricated layer 110 is provided. In the outermost layer of the first sub-board 100, the second sub-board 200 includes a first insulating layer 210, and the first insulating layer 210 is disposed on the outermost layer of the second sub-board 200, and is embedded. The manufacturing method of the component circuit board includes the following steps:

S10, processing the prefabricated layer 110, forming a pad 111 corresponding to the pin of the component 300;

S20, a second insulating layer 120 is disposed on the processed pre-formed layer 110, and a first via hole 121 is formed at a position corresponding to the pad 111 on the second insulating layer 120, and the first via hole 121 is filled with a conductive adhesive. Material 130;

S30, the component 300 is mounted on the first sub-board 100, and the pin of the component 300 extends into the first through hole 121;

S40, a groove matching the component 300 is formed on the first insulating layer 210, and the first sub-board 100 and the second sub-board 200 are pressed together.

The method for fabricating the embedded component circuit board includes disposing a second insulating layer 120 on the pre-formed layer 110, opening a first via hole 121 and filling the conductive adhesive material 130, and mounting the component 300 and the first sub-board 100 to make the component The pin of the 300 is inserted into the first through hole 121, and a groove matching the component 300 is formed on the first insulating layer 210, and is pressed by the first sub-board 100 and the second sub-board 200. In the circuit board manufactured by the above method, the pin of the component 300 extends into the first through hole 121, and the component 300 can be fully adhered to the second insulating layer 120, and the lead can pass through the conductive adhesive material 130 and the pad 111. Electrically connected, the component 300 is tightly coupled with the first sub-board 100, and when the second sub-board 200 is pressed against the first sub-board 100, since the second sub-board 200 is provided with a groove matching the component 300, the component The cooperation between the 300 and the second sub-board 200 is also relatively tight. At this time, the circuit board made by the first sub-board 100, the component 300, and the second sub-board 200 has a tight internal structure, and there is no void, and the inside of the circuit board is not easy to retain liquid. It will not affect the operation of the board, and the reliability of the board produced is better.

Optionally, as shown in FIG. 2, the first sub-board 100 includes at least two prefabricated layers 110, wherein the two prefabricated layers 110 are a first circuit layer and a second circuit layer, respectively, a first circuit layer and a second circuit layer. The first layer and the bottom layer of the first sub-board 100 are respectively disposed, and the pre-fabricated layer 110 is processed to form the pads 111 corresponding to the pins of the component 300, and specifically includes the following steps:

A conductive via is formed in the first sub-board 100 at a position corresponding to the pin of the component 300, and the first circuit layer and the second circuit layer are processed to form a pad 111 corresponding to the conductive via.

Optionally, the first sub-board 100 further includes at least one prepreg, wherein one prepreg is disposed between the first circuit layer and the second circuit layer.

In addition, a conductive blind hole or a conductive buried hole or the like may be formed on the first sub-board 100, and the opening of the conductive blind hole or the conductive buried hole is disposed on the first circuit layer, and the first circuit layer is processed to form and The conductive blind hole or the conductive buried hole is matched with the pad 111.

Specifically, the prefabricated layer 110 is a conductive layer, and the conductive layer may be a conductive material such as copper or tin.

Specifically, the second insulating layer 120 may be disposed on both the first circuit layer and the second circuit layer and the same process may be performed.

Specifically, the embedded component circuit board further includes a third sub-board, the third sub-board includes a third insulating layer, and the third insulating layer is disposed at an outermost layer of the third sub-board, and the first sub-board 100 and the first The two sub-boards 200 are pressed together, and specifically include the following steps:

The first sub-board 100, the second sub-board 200 and the third sub-board are pressed together, wherein the first insulating layer 210 is adhered to the second insulating layer 120, and the other side of the first sub-board 100 is attached to the third insulating layer. Hehe.

Specifically, the first insulating layer 210 is a prepreg.

Further, as shown in FIG. 3 and FIG. 4, the second insulating layer 120 is disposed on the processed pre-formed layer 110, and the first via hole 121 is opened at a position corresponding to the pad 111 on the second insulating layer 120. Filling the first through hole 121 with the conductive adhesive material 130 includes the following steps:

S21, the second insulating layer 120 and a layer of insulating film 140 are sequentially disposed on the processed prefabricated layer 110;

S22, opening a hole corresponding to the pad 111 on the second insulating layer 120 and the isolation film 140, forming the first through hole 121 on the second insulating layer 120 and the second through hole 141 on the isolation film 140 The first through hole 121 is in communication with the second through hole 141;

S23, filling the first through hole 121 and the second through hole 141 with a conductive adhesive material 130;

S24. The isolation film 140 is removed.

Through the above steps, by providing a layer of the insulating film 140, the second insulating layer 120 can be prevented from being contaminated by liquid or processing waste during the operation such as opening, and the conductive adhesive can be prevented when filling the conductive adhesive material 130. The material 130 contaminates the surface of the second insulating layer 120, which can improve the reliability of the fabricated circuit board, and at the same time ensure that the subsequent bonding between the first sub-board 100 and the second sub-board 200 is more tight, and further, the conductive is filled. When the adhesive material 130 is used, the conductive adhesive material 130 can also be prevented from entering between the second insulating layer 120 and the isolation film 140.

Optionally, at the junction of the second insulating layer 120 and the isolation film 140, the aperture of the first through hole 121 is smaller than or equal to the aperture of the second through hole 141. At this time, the conductive adhesive material 130 can be further prevented from contaminating the surface of the second insulating layer 120.

Alternatively, a hole is formed in the second insulating layer 120 and the isolation film 140 at a position corresponding to the pad 111 by laser opening. High processing accuracy and short processing time. In addition, according to the actual situation, it is also possible to open holes by means of machining.

Further, the conductive adhesive material 130 is a conductive resin. The conductive resin can conduct electricity while sufficiently filling the first through holes 121 to ensure that there are no bubbles or voids around the pins of the element 300.

Specifically, when the first via hole 121 and the second via hole 141 are filled with a conductive resin, the conductive resin plug hole may be used.

Further, in the above step, the second insulating layer 120 and the insulating film 140 are sequentially disposed on the processed pre-formed layer 110 by heating and pressurizing. The second insulating layer 120 and the isolation film 140 can be attached to the first sub-board 100 by heating and pressing, and the first sub-board 100, the second insulating layer 120, and the isolation film 140 are fixed. The adhesion is convenient for subsequent processing, and the position between the layers is relatively stable, which can improve the processing precision.

Further, in the above method of heating and pressurizing, the temperature ranges from 80 ° C to 155 ° C and the pressure ranges from 15 kg/cm ² to 23 kg/cm ² . By limiting the temperature range, a certain adhesive force exists between the first sub-board 100, the second insulating layer 120, and the isolation film 140, and the adhesive force is not excessively large, so that the isolation film 140 can be removed later.

Specifically, in the above method of heating and pressurizing, the temperature ranges from 100 ° C to 135 ° C, and the pressure ranges from 17 kg/cm ² to 21 kg/cm ² .

Further, the duration of the above heating and pressurization is 2 minutes to 6 minutes. By further limiting the time of warming and pressurization, it is also ensured that adhesion is present while facilitating subsequent removal of the insulating film 140.

Specifically, the duration of the above heating and pressurization is from 3 minutes to 5 minutes.

Further, before the removing the isolation film 140, the method further includes the following steps:

The barrier film 140 is preheated.

When the insulating film 140 is cooled when the holes are formed in the insulating film 140 and the second insulating layer 120, the adhesion between the insulating film 140 and the second insulating layer 120 is increased, which may cause the insulating film 140 to be removed. The second insulating layer 120, for this purpose, preheats the insulating film 140 to reduce the adhesion between the insulating film 140 and the second insulating layer 120, and the effect is better when the insulating film 140 is removed. Further, the insulating film 140 is provided. When the preheating is performed, the conductive adhesive material 130 in the first through hole 121 and the second through hole 141 may be heated at the same time to volatilize the volatile substances in the conductive adhesive material 130 to prevent the volatile substances from affecting the reliability of the circuit board. .

Further, in the above step, the first sub-board 100 and the second sub-board 200 are pressed together by sintering. The first sub-board 100 and the second sub-board 200 can be better combined by sintering, and the conductive adhesive material 130 can be turned on better, and the performance of the fabricated circuit board can be improved.

Further, the second insulating layer 120 is a prepreg, and the insulating film 140 is a PET film. At this time, the second insulating layer 120 is consistent with the material of the insulating layer of the second sub-board 200, so that the bonding of the first sub-board 100 and the second sub-board 200 is facilitated, and the second insulating layer 120 of the PET film is better. The protection is carried out, and the surface of the PET film is relatively smooth, which is advantageous for removing the PET film by tearing.

Further, as shown in FIG. 3 , the apertures of the first through hole 121 and the second through hole 141 gradually increase in a direction away from the first sub-board 100 . At this time, it is ensured that the conductive adhesive material 130 sufficiently fills the first through hole 121 and the second through hole 141.

Optionally, the depth of the first through hole 121 is greater than or equal to the length of the pin of the component 300. At this time, when the component 300 is mounted, since the pin of the component 300 can completely protrude into the first through hole 121, it can be ensured. The component 300 is sufficiently bonded to the second insulating layer 120.

In one embodiment, the buried component circuit board is fabricated using the method of fabricating the embedded component circuit board as described above.

In the above-mentioned embedded component circuit board, since the component 300 is tightly integrated with the first sub-board 100 and the second sub-board 200, there is no void, and the working state of the embedded component circuit board is not affected, so that the embedded component circuit board is reliable. Good sex.

The technical features of the above-described embodiments may be arbitrarily combined. For the sake of brevity of description, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be considered as the scope of this manual.

The above-described embodiments are merely illustrative of several embodiments of the present invention, and the description thereof is more specific and detailed, but is not to be construed as limiting the scope of the invention. It should be noted that a number of variations and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of the invention should be determined by the appended claims.

Claims

A method for fabricating a buried component circuit board, wherein the embedded component circuit board comprises a first sub-board and a second sub-board, the first sub-board comprising a pre-fabricated layer, the pre-fabricated layer being disposed on the An outermost layer of a sub-board, the second sub-board includes a first insulating layer, and the first insulating layer is disposed at an outermost layer of the second sub-board, and includes the following steps:

Processing the prefabricated layer to form a pad corresponding to the pin of the component;

a second insulating layer is disposed on the processed prefabricated layer, and a first through hole is formed at a position corresponding to the pad on the second insulating layer, and the conductive material is filled in the first through hole;

The component is mounted on the first sub-board, and the pin of the component protrudes into the first through hole;

A groove matching the component is formed on the first insulating layer, and the first sub-board is pressed against the second sub-board.
The method of fabricating a buried component circuit board according to claim 1, wherein the second insulating layer is disposed on the processed prefabricated layer, and the second insulating layer is opened at a position corresponding to the pad. a through hole, filled with a conductive adhesive material in the first through hole, specifically comprising the following steps:

Forming a second insulating layer and a layer of insulating film on the pre-formed layer after processing;

Opening a hole at a position corresponding to the pad on the second insulating layer and the isolation film to form the first through hole on the second insulating layer and the second through hole on the isolation film, the first through hole and the second through hole Hole connection

Filling the first through hole and the second through hole with a conductive adhesive material;

Remove the barrier film.
The method of fabricating a buried component circuit board according to claim 2, wherein in the step, the second insulating layer and the insulating film are sequentially disposed on the processed pre-formed layer by heating and pressurizing.
The method of fabricating a buried component circuit board according to claim 3, wherein in the heating and pressurizing mode, the temperature ranges from 80 ° C to 155 ° C, and the pressure ranges from 15 Kg/cm 2 to 23 Kg / Cm 2 .
The method of fabricating a buried device circuit board according to claim 3, wherein the duration of the heating and pressurization is from 2 minutes to 6 minutes.
The method of manufacturing a buried component circuit board according to claim 2, wherein before the removing the isolation film, the method further comprises the following steps:

Preheat the barrier film.
The method of fabricating a buried component circuit board according to any one of claims 2 to 6, wherein the second insulating layer is a prepreg, and the insulating film is a PET film.
The method of fabricating a buried component circuit board according to any one of claims 1 to 6, wherein the conductive adhesive material is a conductive resin.
The manufacturing method of the embedded component circuit board according to any one of claims 2 to 6, wherein the apertures of the first through hole and the second through hole are away from the first sub-board Gradually increase.
A buried component circuit board produced by the method of fabricating a buried component circuit board according to any one of claims 1-9.