JP2017045867A - Manufacturing method of component built-in wiring board, component built-in wiring board, and electronic component fixing tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a component built-in wiring board capable of simplifying a manufacture process, and the component built-in wiring board.SOLUTION: The manufacturing method includes: a taping step for sticking a surface of a thermosetting resin film 3 of an electronic component fixing tape 4 to a side of a core rear face of a core substrate 100 including a housing hole part 1 that is opened both on a core principal surface X1 and on a core rear face X2; a temporary electronic component fixing step for housing an electronic component 5 in the housing hole part and temporarily fixing a rear face of the electronic component to the thermosetting resin film; a filling and supplying step for filling a gap between an inner wall surface of the housing hole part and the electronic component with a thermosetting resin filler 6 and supplying the filler at such a degree that the core principal surface can be covered; a flattening and pressing step for performing heating, pressing and flattening at such a temperature that the thermosetting resin film and the resin filler are not hardened; and a hardening step for heating and hardening the thermosetting resin film and the resin filler.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method of manufacturing a wiring board with a built-in component in which an electronic component such as a capacitor is accommodated, a wiring board with a built-in component, and an electronic component fixing tape.

  In recent years, semiconductor integrated circuit elements (IC chips) used as computer microprocessors and the like have become increasingly faster and more functional, with an accompanying increase in the number of terminals and a tendency to narrow the pitch between terminals. . In general, a large number of terminals are densely arranged on the bottom surface of an IC chip, and such a terminal group is connected to a terminal group on the motherboard side in the form of a flip chip. However, it is difficult to connect the IC chip directly on the mother board because there is a large difference in the pitch between the terminals of the terminal group on the IC chip side and the terminal group on the mother board side. For this reason, a method is generally employed in which a package is prepared by mounting an IC chip on an IC chip mounting wiring board, and the package is mounted on a motherboard. In a wiring board for mounting an IC chip constituting this type of package, it has been proposed to provide a capacitor (also referred to as a “capacitor”) in order to reduce switching noise of the IC chip and stabilize the power supply voltage. . As an example, a wiring board in which capacitors are embedded in a core substrate made of a polymer material and a buildup layer is formed on the front surface and the back surface of the core substrate has been conventionally proposed (for example, see Patent Documents 1 and 2).

  An example of a method for manufacturing the conventional component built-in wiring board will be described below. First, as shown in FIG. 5 (A), a core substrate 500 made of a resin material having a plurality of accommodation holes 51 that are open on both the core main surface X1 and the core back surface X2 is prepared. Then, as shown in FIG. 5 (B), a taping step of attaching the adhesive tape 53 to the core back surface X2 side is performed, and the opening of the accommodation hole 51 on the core back surface X2 side is sealed in advance. Next, as shown in FIG. 5 (C), a housing step of housing electronic components 54 such as capacitors in each of the plurality of housing holes 51 is performed, and the back surface of each electronic component 54 is used as the adhesive surface of the adhesive tape 53. Paste and fix temporarily. Next, a film-like resin filler 55 is laminated, and as shown in FIG. 5D, the resin filler 55 is filled into the gap between the inner wall surface of the accommodation hole 51 and the side surface of the electronic component 54. Perform the process. And the 1st planarization press process pressed in a plate | board thickness direction is performed. Thereby, the resin filler 55 remaining on the core main surface X1 is flattened. Thereafter, as shown in FIG. 6A, a peeling process for peeling the adhesive tape 53 is performed. Then, as shown in FIG. 6B, a second flattening press step is performed in which a thermosetting resin film 56 is laminated on the core back surface X2 side and pressed in the plate thickness direction. As a result, part of the resin constituting the thermosetting resin film 56 is pushed into a gap such as between the wirings arranged on the core back surface X2 side, and the resin of the thermosetting resin film 56 remaining on the core back surface X2 is removed. Flatten. Then, as shown in FIG. 6C, a curing step is performed in which the thermosetting resin film 56 and the resin filler 55 are cured and contracted. Thereby, the filling resin filled in the accommodation hole 51 and the insulating layer covering both surfaces of the core substrate 500 are formed in an integrated state. Thereafter, as shown in FIG. 6D, outer layer patterns such as the upper wiring layer 57 and the filled via 58 are formed (see, for example, Patent Document 3).

  In addition, a liquid resin filler is used instead of the film-like resin filler described above. Further, the resin filler may be cured after the first flattening press step.

JP 2002-217544 A JP 2002-237683 A JP 2014-96446 A

  However, in the conventional method for manufacturing a wiring board with a built-in component as described above, it is necessary to perform a peeling process for peeling the adhesive tape after the first flattening press process, and then perform a second flattening press process. . Moreover, it was necessary to peel the bonded adhesive tape and then bond a thermosetting resin film for further forming an insulating layer. For this reason, there existed a problem that a manufacturing process became complicated.

  Then, this invention makes it a subject to provide the manufacturing method of the component built-in wiring board which can simplify a manufacturing process.

In order to solve the above problems, a method of manufacturing a component-embedded wiring board according to the present invention is provided on the core back surface side of a core substrate having one or a plurality of receiving holes that are open on both the core main surface and the core back surface. A taping step of affixing the thermosetting resin film surface of an electronic component fixing tape having an adhesive tape and an uncured thermosetting resin film having an adhesive property, and accommodating the electronic component in the accommodation hole, An electronic component temporary fixing step in which the back surface of the electronic component is attached to the thermosetting resin film and temporarily fixed, and a thermosetting resin filler is provided in the gap between the inner wall surface of the housing hole and the electronic component. A filling and supplying step for filling and supplying the core main surface to the extent that it can be covered, and heating and pressurizing at a temperature at which the thermosetting resin film and the resin filler are not cured A flattening press step for flattening the surface of the thermosetting resin film on the pressure-sensitive adhesive tape side and the surface of the resin filler, a peeling step for peeling the pressure-sensitive adhesive tape, and the thermosetting resin film. And a curing step of heat curing the resin filler.

  Moreover, in order to solve the above-mentioned subject, the manufacturing method of the component built-in wiring board which concerns on this invention is the said core back surface of the core board which has one or more accommodation hole parts opened in both a core main surface and a core back surface A taping step of attaching the thermosetting resin film surface of an electronic component fixing tape having a release film and an uncured and adhesive thermosetting resin film on the side, and housing the electronic component in the housing hole The electronic component temporary fixing step of temporarily attaching the back surface of the electronic component to the thermosetting resin film and fixing the thermosetting resin filler between the inner wall surface of the housing hole and the electronic component A filling and supplying step for filling the gap and supplying the core main surface so as to cover the core, and heating at a temperature at which the thermosetting resin film and the resin filler are not cured. By applying pressure to the surface of the release film side of the thermosetting resin film and the surface of the resin filler, respectively, a release process for peeling the release film, and the thermosetting And a curing step of heating and curing the resin film and the resin filler.

  In the method of manufacturing the component built-in wiring board, the resin filler is in an uncured film shape, and the filling and supplying step is performed by laminating the resin filler on the core main surface, and then the resin filler is cured. It is preferable to carry out by heating and pressurizing at a temperature that does not occur.

  In the method for manufacturing the component built-in wiring board, the resin filler may be in a liquid state.

  Further, the method of manufacturing a component-embedded wiring board according to the present invention includes an adhesive tape and an uncured tape on the core back surface side of the core substrate having one or a plurality of receiving holes that are opened on both the core main surface and the core back surface. A taping step of attaching the thermosetting resin film surface of the electronic component fixing tape having an adhesive thermosetting resin film, and housing the electronic component in the housing hole, An electronic component temporary fixing step for temporarily fixing the adhesive to the thermosetting resin film; a filling step for filling the gap between the inner wall surface of the housing hole and the electronic component with a thermosetting resin filler; Supply step of supplying an uncured thermosetting resin film for core main surface side to the core main surface side, and the thermosetting resin film, the resin filler, and the thermosetting resin film for core main surface side are cured Do A flattening press step for flattening the surface of the thermosetting resin film and the surface of the thermosetting resin film for the main surface of the tree core by heating and pressurizing at a temperature without And a peeling step of peeling off the adhesive tape, and a curing step of heat-curing the thermosetting resin film, the resin filler and the thermosetting resin film for the core main surface side.

  Further, the method for manufacturing a component built-in wiring board according to the present invention includes a release film and an uncured film on the core back surface side of the core substrate having one or a plurality of receiving holes that are open on both the core main surface and the core back surface. A taping step of attaching the thermosetting resin film surface of the electronic component fixing tape having an adhesive thermosetting resin film, and housing the electronic component in the housing hole, An electronic component temporary fixing step for temporarily fixing the adhesive to the thermosetting resin film; a filling step for filling the gap between the inner wall surface of the housing hole and the electronic component with a thermosetting resin filler; Supply step of supplying an uncured thermosetting resin film for core main surface side to the core main surface side, and the thermosetting resin film, the resin filler, and the thermosetting resin film for core main surface side are cured You A flattening press step of flattening the surface of the release film side of the thermosetting resin film and the surface of the thermosetting resin film for the core main surface side by heating and pressurizing at a temperature that does not occur The peeling process which peels the said peeling film, The hardening process which heat-hardens the said thermosetting resin film, the said resin filler, and the said thermosetting resin film for core main surface sides is characterized by the above-mentioned.

  Moreover, in the said manufacturing method of the component built-in wiring board, it is preferable that the softening temperature of the said thermosetting resin film is higher than the softening temperature of the said resin filler.

  In the method for manufacturing a wiring board with a built-in component, it is preferable that the pressure-sensitive adhesive tape has a stimulus-curable pressure-sensitive adhesive layer that is cured by stimulation.

  The component built-in wiring board according to the present invention is manufactured by any one of the above-described component built-in wiring boards.

  The electronic component fixing tape according to the present invention includes an adhesive tape and a thermosetting resin film that is uncured and has adhesiveness, and has a single accommodation hole that opens on both the core main surface and the core back surface. A taping step of attaching the thermosetting resin film surface to the core back surface side of the core substrate having one or a plurality, and housing the electronic component in the housing hole, and the back surface of the electronic component to the thermosetting resin film The electronic component temporary fixing step of pasting and temporarily fixing, and filling the gap between the inner wall surface of the housing hole and the electronic component with a thermosetting resin filler, and covering the core main surface The pressure-sensitive adhesive tape of the thermosetting resin film is heated and pressurized at a temperature at which the thermosetting resin film and the resin filler are not cured. A flattening press step for flattening the surface on the side and the surface of the resin filler, a peeling step for peeling the adhesive tape, and a curing step for heat curing the thermosetting resin film and the resin filler. It is used for the manufacturing method of the component built-in wiring board containing.

  In addition, the electronic component fixing tape according to the present invention has a release film and an uncured and thermosetting resin film having adhesiveness, and has a single accommodation hole that opens on both the core main surface and the core back surface. A taping step of attaching the thermosetting resin film surface to the core back surface side of the core substrate having one or a plurality, and housing the electronic component in the housing hole, and the back surface of the electronic component to the thermosetting resin film The electronic component temporary fixing step of pasting and temporarily fixing, and filling the gap between the inner wall surface of the housing hole and the electronic component with a thermosetting resin filler, and covering the core main surface The filling and supplying step of supplying to the extent, and heating and pressurizing at a temperature at which the thermosetting resin film and the resin filler are not cured, thereby releasing the thermosetting resin film. A flattening press step for flattening the surface of the lum side and the surface of the resin filler; a peeling step for peeling the release film; and a curing step for heat curing the thermosetting resin film and the resin filler. It is used for the manufacturing method of the component built-in wiring board containing this.

  According to the present invention, the manufacturing process of the component built-in wiring board can be simplified.

It is sectional drawing for demonstrating the manufacturing method of the component built-in wiring board which concerns on embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the component built-in wiring board which concerns on embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the component built-in wiring board which concerns on other embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the component built-in wiring board which concerns on other embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the conventional component built-in wiring board. It is sectional drawing for demonstrating the manufacturing method of the conventional component built-in wiring board.

  Hereinafter, embodiments of the present invention will be described in detail.

  1 and 2 are cross-sectional views for explaining a method of manufacturing a component built-in wiring board according to an embodiment of the present invention. The manufacturing method of the component built-in wiring board according to the present embodiment includes a preparation step of preparing a core substrate 100 having one or a plurality of receiving hole portions 1 opened on both the core main surface X1 and the core back surface X2, and the core substrate 100. A taping step of attaching the thermosetting resin film 3 side surface of the electronic component fixing tape 4 having the adhesive tape 2 and the uncured and thermosetting resin film 3 having adhesiveness to the back surface side of the electronic component 5; The electronic component temporary fixing step of pasting the back surface of the resin to the thermosetting resin film 3 and temporarily fixing, and filling the gap between the inner wall surface of the accommodation hole 1 and the electronic component 5 with the thermosetting resin filler 6 A filling and supplying step for supplying the core main surface X1 to such an extent that the core main surface X1 can be covered; a flattening press step for flattening the surface of the thermosetting resin film 3 on the pressure-sensitive adhesive tape 2 side and the surface of the resin filler 6; It has a peeling step of peeling the-loop 2, a curing step of heating and curing the thermosetting resin film 3 and the resin filler 6, the outer layer forming step of forming an outer layer. Hereinafter, each step will be described in detail.

(Preparation process)
First, as shown in FIG. 1A, a core substrate 100 to be used in a method for manufacturing a component built-in wiring board according to an embodiment of the present invention is prepared. The core substrate 100 has one or a plurality of accommodation holes 1 that are open on both the core main surface X1 and the core back surface X2. The accommodation hole 1 accommodates the electronic component 5. Such a core substrate 100 can be obtained by forming a through hole having a predetermined shape such as a rectangular shape in a top view in a predetermined region of the base material. The accommodation hole 1 can be formed by laser processing that irradiates a portion that becomes the outline of the accommodation hole 1 with laser light.

  In addition, wiring patterns 7 are provided on both surfaces of the base material of the core substrate 100, respectively. The core substrate 100 is not limited to the wiring pattern 7 on the surface, and may be a laminated substrate in which an internal wiring pattern (not shown) is formed inside. However, neither the wiring pattern 7 nor the internal wiring pattern exists within the region where the accommodation hole 1 is to be formed. In addition, a filling through hole 8 is formed at a predetermined position of the base material of the core substrate 100. The filled through hole 8 is for establishing electrical connection between the wiring patterns 7.

  After such a core substrate 100 is prepared, the wiring pattern 7 formed on the surface of the core substrate 100 may be roughened. Thereby, the adhesiveness of the insulating layer and wiring pattern 7 formed after this can be improved. Specifically, the core substrate 100 is immersed in a sulfuric acid-hydrogen peroxide soft etchant. What is necessary is just to carry out on the conditions normally used as processing conditions, using what is marketed as a surface roughening agent for copper etc. as a soft etching agent.

(Taping process)
Subsequently, as shown in FIG. 1 (B), an electronic component fixing tape 4 having an adhesive tape 2 and an uncured thermosetting resin film 3 having adhesiveness on the core back surface X2 side of the core substrate 100 is provided. Lamination is performed so that the surface of the thermosetting resin film 3 is on the core back surface X2 side. Thereby, the opening surface of the accommodation hole part 1 will be in the state obstruct | occluded by the electronic component fixing tape 4 in one surface. That is, the electronic component fixing tape 4 forms the bottom surface of the accommodation hole 1, and the thermosetting resin film 3 is exposed in the accommodation hole 1. Lamination is preferably performed at room temperature, but may be performed while heating.

  The thermosetting resin film 3 of the electronic component fixing tape 4 temporarily fixes the electronic component 5 in an uncured state, and then fixes the electronic component 5 together with the filling resin 12 in a cured state. The upper interlayer insulating layer 14 is formed on the core back surface X2 side.

  The thermosetting resin film 3 is not particularly limited as long as it has adhesiveness at room temperature and is suitable as an insulating layer after heat curing. For example, an epoxy resin or other thermosetting resin formed into a film and uncured can be used. Particularly preferred is a semi-cured state called B stage.

  The adhesive tape 2 of the electronic component fixing tape 4 is for covering or supporting the thermosetting resin film 3 having tackiness. As the adhesive tape 2, the adhesive tape 2 in which the adhesive layer 10 is provided on the base film 9 can be used.

  The base film 9 is, for example, a polyester film such as a polyethylene terephthalate film, a polytetrafluoroethylene film, a polyethylene film, a polypropylene film, a polymethylpentene film, a polyolefin film such as a polyvinyl acetate film, a polyvinyl chloride film, or a polyimide film. And may have a multilayer structure.

  The pressure-sensitive adhesive layer 10 is preferably made of a stimulus-curing pressure-sensitive adhesive that is cured by stimulation and has reduced adhesive strength. Such a stimulus curable pressure-sensitive adhesive is not particularly limited. For example, a rubber-based pressure-sensitive adhesive, an acrylic-based pressure-sensitive adhesive, a styrene / conjugated diene block copolymer-based pressure-sensitive adhesive, and a silicone-based pressure-sensitive adhesive. Etc. as a base resin, a photo-curing pressure-sensitive adhesive in which a crosslinking component composed of a polyfunctional oligomer or a polyfunctional monomer and an ultraviolet polymerization initiator are blended, a thermosetting pressure-sensitive adhesive in which a crosslinking component and a thermal polymerization initiator are blended, etc. Can be mentioned.

In this embodiment, the electronic component fixing tape 4 having the adhesive tape 2 and the uncured thermosetting resin film 3 having adhesiveness is used, but the release film is used instead of the adhesive tape 2. It is also possible to use an electronic component fixing tape having a thermosetting resin film 3. Examples of the constituent material for the release film include synthetic resin films such as polyethylene, polypropylene, polyethylene terephthalate, crystalline fluororesin, amorphous fluororesin, and silicone resin. These can be used alone or in combination of two or more. Also good.
The surface of the release film may be subjected to release treatment such as silicone treatment, long-chain alkyl treatment, and fluorine treatment as necessary in order to enhance the peelability from the thermosetting resin film 3.

(Electronic parts temporary fixing process)
Thereafter, as shown in FIG. 1C, the electronic component 5 is accommodated in the accommodating hole 1, and the back surface of the electronic component 5 is attached to the thermosetting resin film 3 and temporarily fixed. Accordingly, it is possible to prevent the electronic component 5 from being displaced or tilted by the resin filling pressure.

  In this embodiment, the electronic component 5 is a multi-layer ceramic capacitor. Hereinafter referred to as MLCC5. The MLCC 5 has a rectangular flat plate shape as a whole. The MLCC 5 has regions whose surfaces are covered with the electrodes 11 at both ends in the longitudinal direction. The electrode 11 is a conducting electrode connected to the inner conductor of the MLCC 5.

  In this embodiment, although MLCC5 was illustrated as the electronic component 5, various electronic components provided with connection terminals, such as a semiconductor chip, a resistive element, and an inductor element, can be used. In addition, a plurality of electronic components 5 may be arranged in one accommodation hole 1 of the core substrate 100.

(Filling supply process)
Next, as shown in FIG. 1D, an uncured film-like resin filler 6 is laminated on the main surface of the core substrate 100. As the film-like resin filler 6, an epoxy resin or other thermosetting resin that is uncured can be used. Particularly preferred is a semi-cured state called B stage. Moreover, what does not contain glass cloth (heart material) is preferable. In the present embodiment, the softening temperature of the thermosetting resin film 3 of the electronic component fixing tape 4 is higher than the softening temperature of the resin filler 6. In addition, it is desirable to perform this lamination in a reduced pressure atmosphere.

  This lamination is performed by pressing the core substrate 100 and the like in the plate thickness direction using a known laminator (lamination device). Thereby, the resin filler 6 is softened and fluidized, and a part of the resin filler 6 is pushed into the gap between the inner wall surface of the accommodation hole 1 and the MLCC 5 as shown in FIG. Thus, the gap is filled with the filling resin 12. That is, the filling resin 12 is part of the resin that originally forms the film-like resin filler 6. Of the film-like resin filler 6, the portion remaining on the main surface of the core substrate 100 and the surface of the MLCC 5 without being pushed into the gap becomes the upper interlayer insulating layer 13 on the main surface side. Therefore, the filling resin 12 is connected to the upper interlayer insulating layer 13 without an interface.

  This laminate has a temperature at which the resin filler 6 is softened but the thermosetting resin film 3 is not softened, and the resin filler 6 and the thermosetting resin film 3 are not cured. Do at temperature. Therefore, since the thermosetting resin film 3 is not softened during the lamination, the bottom surface side of the MLCC 5 is stabilized, and when the filling resin 12 is filled, the tilt and misalignment of the MLCC 5 can be more reliably prevented. Can do. The “pressure and temperature at which the resin filler 6 and the thermosetting resin film 3 are not cured” means the pressure and temperature at which the resin filler 6 and the thermosetting resin film 3 are not completely cured. The pressure and temperature at which a part of the initiator reacts to cause a partial curing are included. Therefore, the resin filler 6 and the thermosetting resin film are intentionally added to the resin filler 6 and the thermosetting resin film 3 by a small amount of an initiator that causes curing at a low temperature (heating temperature at the time of the main lamination). 3 may be partially cured, and in this case, the MLCC 5 can be more reliably fixed.

(Flattening press process)
After the above laminator is pressed, the resin filler 6 and the thermosetting resin film 3 are softened using a known flattening press, and the resin filler 6 and the thermosetting resin film 3 are softened. Is pressed at a pressure and temperature that does not cure. Thereby, the thermosetting resin film 3 is softened and fluidized to follow the uneven surface such as the wiring pattern 7 on the core back surface X2. The thermosetting resin film 3 becomes the upper interlayer insulating layer 14 on the back side. By this flattening press, the surfaces of the upper interlayer insulating layer 13 on the main surface side and the upper interlayer insulating layer 14 on the back surface side are flattened. That is, as shown in FIG. 2B, the resin filler 6 and the thermosetting resin film 3 have a surface (thermosetting property) in a state where the filling resin 12 and the upper interlayer insulating layers 13 and 14 are integrally formed. In the resin film 3, the surface on the pressure-sensitive adhesive tape 2 side is flattened. In this flattening press, the MLCC 5 is substantially in the same position and in the same position. This is because the pressing pressure in the thickness direction performed during the flattening press is applied to both sides of the MLCC 5.

  In the present embodiment, the softening temperature of the thermosetting resin film 3 of the above-described electronic component fixing tape 4 is higher than the softening temperature of the resin filler 6. You may use the thing of temperature. In this case, in the filling and supplying step, the thermosetting resin film 3 is also softened and fluidized, and a part thereof is pushed into a gap such as between the bottom surface of the accommodation hole 1 and the electrode 11 of the MLCC 5. At this time, the MLCC 5 is substantially in the same position with the same posture. This is because the pressure of the press in the thickness direction performed at the time of lamination is applied to both surfaces of the MLCC 5.

(Peeling process)
Next, the adhesive tape 2 is peeled off. Since the adhesive force itself of the adhesive tape 2 is not so strong, the adhesive tape 2 can be easily peeled off from the core substrate 100. When the stimulus curable pressure-sensitive adhesive layer is used, the pressure-sensitive adhesive tape 2 is peeled off after applying an appropriate stimulus such as ultraviolet irradiation. At this time, the thermosetting resin film 3 and the MLCC 5 are not separated from the adhesive tape 2 but remain on the core substrate 100. Specifically, the constituent resin of the upper interlayer insulating layer 13 and the filling resin 12 is uncured, but has no fluidity at room temperature. Therefore, the MLCC 5 has the upper interlayer insulating layer 13 and the filling resin 12, thermosetting It is firmly held by the resin film 3.

(Curing process)
Next, a curing process is performed. That is, the core substrate 100 that has been subjected to the above-described planarization press is heated at a temperature higher than the temperature at the time of pressing in the planarization press to cure the thermosetting resin. As a result, the resin filler 6 and the thermosetting resin film 3 that are in contact with each other without being cured are cured simultaneously. For this reason, the upper interlayer insulating layers 13 and 14 and the filling resin 12 continuously form an insulating resin portion without an interface. In addition, this curing process fixes the posture of the MLCC 5 in the state shown in FIG.

(Outer layer forming process)
Thereafter, as shown in FIG. 2D, an outer layer wiring pattern 15 and the like are formed. In the example of FIG. 2D, the outer layer wiring pattern 15 is formed on the upper interlayer insulating layers 13 and 14. Via holes (not shown) that are electrically connected to the inner layer wiring pattern and via holes 16 that are electrically connected to the electrode 11 of the MLCC 5 are formed in the outer layer wiring pattern 15.

  Thereafter, the protective insulating layer 17 and the bumps 18 are formed in the final process. The electronic component built-in wiring board is completed by checking the performance of the parts and the insulation of each part by an electrical test.

  In the present embodiment, the resin filler 6 is an uncured film, but a liquid filler may be used. In this case, using a known dispenser, the resin filler 6 is supplied to such an extent that the gap between the inner wall surface of the accommodation hole 1 and the electronic component 5 can be filled and the core main surface X1 can be covered.

  Next, another embodiment of the present invention will be described. In addition, what attached | subjected the code | symbol same as the code | symbol in the above-mentioned embodiment has the structure similar to the above-mentioned embodiment.

  3 and 4 are cross-sectional views for explaining the method of manufacturing the component built-in wiring board according to the present embodiment. The manufacturing method of the component built-in wiring board according to the present embodiment includes a preparation step of preparing a core substrate 100 having one or a plurality of receiving hole portions 1 opened on both the core main surface X1 and the core back surface X2, and the core substrate 100. A taping step of attaching the thermosetting resin film 3 surface of the electronic component fixing tape 4 having the adhesive tape 2 and the uncured thermosetting resin film 3 having adhesiveness to the back surface side of the electronic component 5, and the back surface of the electronic component 5 An electronic component temporary fixing step in which the thermosetting resin film 19 is temporarily attached to the thermosetting resin film 3, and a filling step in which the thermosetting resin filler 19 is filled in the gap between the inner wall surface of the housing hole 1 and the electronic component 5; The supply process of supplying the uncured core main surface side thermosetting resin film 20 to the core main surface X1 side, the adhesive tape 2 side surface of the curable resin film, and the core main surface side thermosetting resin film 20 surfaces A flattening press step for flattening, a peeling step for peeling off the adhesive tape 2, a curing step for heating and curing the thermosetting resin film 3, the resin filler 19, and the thermosetting resin film 20 for the core main surface side, and And an outer layer forming step of forming the outer layer. Hereinafter, each step will be described.

(Preparation process)
First, as shown in FIG. 3A, a core substrate 100 used in the method for manufacturing a component built-in wiring board according to the embodiment of the present invention is prepared. The core substrate 100 has one or a plurality of accommodation holes 1 that are open on both the core main surface X1 and the core back surface X2. The core substrate 100 can be the same as the core substrate 100 used in the method for manufacturing a component built-in wiring substrate according to the above-described embodiment.

(Taping process)
Subsequently, as shown in FIG. 3B, the electronic component fixing tape 4 having the adhesive tape 2 and the uncured thermosetting resin film 3 having adhesiveness on the core back surface X2 side of the core substrate 100 is provided. Lamination is performed so that the surface of the thermosetting resin film 3 is on the core back surface X2 side. Thereby, the opening surface of the accommodation hole part 1 will be in the state obstruct | occluded by the electronic component fixing tape 4 in one surface. That is, the electronic component fixing tape 4 forms the bottom surface of the accommodation hole 1, and the thermosetting resin film 3 is exposed in the accommodation hole 1. The electronic component fixing tape 4 can be the same as the electronic component fixing tape 4 used in the method of manufacturing the component built-in wiring board according to the above-described embodiment.

(Electronic parts temporary fixing process)
Thereafter, as shown in FIG. 3C, the electronic component 5 is accommodated in the accommodation hole 1, and the back surface of the electronic component 5 is attached to the thermosetting resin film 3 and temporarily fixed. The electronic component 5 is the same as the electronic component 5 in the above-described embodiment.

(Filling process)
Next, as shown in FIG. 3D, the liquid resin filler 19 is filled in the gap between the side wall surface of the accommodation hole 1 and the MLCC 5. Filling can be performed by a known dispenser. In the present embodiment, it is sufficient that the inside of the accommodation hole 1 is filled with the resin filler 19, and it is not necessary to supply the resin filler 19 to the extent that the core main surface X1 is covered.

(Supply process)
Next, as shown in FIG. 4A, an uncured thermosetting resin film 20 for core main surface side is laminated on the core main surface X1 side. The core main surface side thermosetting resin film 20 is for forming the upper interlayer insulating layer 23 on the core main surface X1. The core main surface side thermosetting resin film 20 is not particularly limited as long as it is suitable as an insulating layer after heat curing. For example, an epoxy resin or other thermosetting resin formed into a film and uncured can be used. Particularly preferred is a semi-cured state called B stage.

(Flattening press process)
Thereafter, using a known flattening press, the resin filler 19, the thermosetting resin film 3 and the core main surface side thermosetting resin film 20 are softened at a temperature, and the thermosetting resin film 3 and The core main surface side thermosetting resin film 20 is pressed at a pressure or temperature that does not cure. Thereby, the thermosetting resin film 20 for core main surface side is softened and fluidized, followed by uneven surfaces such as the wiring pattern 7 of the core main surface X1, and the thermosetting resin film 3 is softened and fluidized. It is made to follow uneven surfaces, such as the wiring pattern 7 of the core back surface X2. The thermosetting resin film 20 for the core main surface side becomes the upper interlayer insulating layer 23 on the main surface side, and the thermosetting resin film 3 becomes the upper interlayer insulating layer 24 on the back surface side. By this flattening press, the surfaces of the upper interlayer insulating layer 23 on the main surface side and the upper interlayer insulating layer 24 on the back surface side are flattened. That is, as shown in FIG. 4 (B), the thermosetting resin film 3 and the core main surface side thermosetting resin film 20 are integrated with the filling resin 12 in the surface (thermosetting resin). In the film 3, the adhesive tape 2 side surface) is flattened.

(Peeling process)
Next, the adhesive tape 2 is peeled off. Since the adhesive force itself of the adhesive tape 2 is not so strong, the adhesive tape 2 can be easily peeled off from the core substrate 100. When the stimulus curable pressure-sensitive adhesive layer is used, the pressure-sensitive adhesive tape 2 is peeled off after applying an appropriate stimulus such as ultraviolet irradiation.

(Curing process)
Next, a curing process is performed. That is, the core substrate 100 that has been subjected to the above-described planarization press is heated at a temperature higher than the temperature at the time of pressing in the planarization press to cure the thermosetting resin. Thereby, the resin filler 19, the thermosetting resin film 3 and the core main surface side thermosetting resin film 20 that are in contact with each other without being cured are cured at the same time. Therefore, the upper interlayer insulating layer 23 and the filling resin 22 continuously form an insulating resin portion without an interface. Further, this curing process fixes the posture of the MLCC 5 in the state shown in FIG.

(Outer layer formation process, etc.)
Thereafter, as shown in FIG. 4D, the outer layer wiring pattern 15, the via hole (not shown), the protective insulating layer 17, the bump 18 and the like are formed in the same manner as the above-described embodiment.

  As described above, according to the method for manufacturing a component built-in wiring board of the present invention, the flattening press of the upper interlayer insulating layers 13 and 23 on the core main surface X1 side and the upper interlayer insulating layers 14 and 24 on the core back surface X2 side is performed. Since it can be performed simultaneously, the manufacturing process can be simplified. Moreover, since it is not necessary to bond the thermosetting resin film for forming the upper interlayer insulation layer of the core back surface X2 side after peeling off the adhesive tape 2, a manufacturing process can be simplified.

100: Core substrate 1: Housing hole part 2: Adhesive tape 3: Thermosetting resin film 4: Electronic component fixing tape 5: Electronic component (MLCC)
6, 19: Resin filler 9: Base film 10: Adhesive layer 20: Thermosetting resin film for core main surface side 13, 14, 23, 24: Upper interlayer insulating layer

Claims (11)

An electronic component having an adhesive tape and an uncured thermosetting resin film on the core back surface side of the core substrate having one or a plurality of receiving hole portions opened on both the core main surface and the core back surface A taping step of applying the thermosetting resin film surface of the fixing tape;
An electronic component temporary fixing step of storing an electronic component in the storage hole, and temporarily fixing the electronic component by attaching the back surface of the electronic component to the thermosetting resin film;
Filling and supplying a thermosetting resin filler into the gap between the inner wall surface of the accommodation hole and the electronic component and supplying the core main surface to the extent that the core main surface can be covered;
By heating and pressurizing at a temperature at which the thermosetting resin film and the resin filler are not cured, the surface of the thermosetting resin film on the adhesive tape side and the surface of the resin filler are each flattened. Flattening press process to
A peeling step for peeling the adhesive tape;
The manufacturing method of the component built-in wiring board characterized by including the hardening process which heat-hardens the said thermosetting resin film and the said resin filler. An electronic component having a release film and an uncured and thermosetting resin film on the core back surface side of the core substrate having one or a plurality of receiving holes that are open on both the core main surface and the core back surface A taping step of applying the thermosetting resin film surface of the fixing tape;
An electronic component temporary fixing step of storing an electronic component in the storage hole, and temporarily fixing the electronic component by attaching the back surface of the electronic component to the thermosetting resin film;
Filling and supplying a thermosetting resin filler into the gap between the inner wall surface of the accommodation hole and the electronic component and supplying the core main surface to the extent that the core main surface can be covered;
The surface of the release film side of the thermosetting resin film and the surface of the resin filler are each flattened by heating and pressing at a temperature at which the thermosetting resin film and the resin filler are not cured. Flattening press process to
A peeling step for peeling the release film;
The manufacturing method of the component built-in wiring board characterized by including the hardening process which heat-hardens the said thermosetting resin film and the said resin filler. The resin filler is an uncured film,
2. The filling and supplying step is performed by laminating the resin filler on the core main surface and then heating and pressurizing the resin filler at a temperature at which the resin filler does not harden. Item 3. A method of manufacturing a component built-in wiring board according to Item 2.   The method for manufacturing a component built-in wiring board according to claim 1, wherein the resin filler is liquid. An electronic component having an adhesive tape and an uncured thermosetting resin film on the core back surface side of the core substrate having one or a plurality of receiving hole portions opened on both the core main surface and the core back surface A taping step of applying the thermosetting resin film surface of the fixing tape;
An electronic component temporary fixing step of storing an electronic component in the storage hole, and temporarily fixing the electronic component by attaching the back surface of the electronic component to the thermosetting resin film;
A filling step of filling the gap between the inner wall surface of the housing hole and the electronic component with a thermosetting resin filler;
A supply step of supplying an uncured thermosetting resin film for the core main surface side to the core main surface side;
By heating and pressing at a temperature at which the thermosetting resin film, the resin filler and the thermosetting resin film for core main surface side are not cured, the pressure-sensitive adhesive tape side of the thermosetting resin film is A flattening press step of flattening the surface and the surface of the thermosetting resin film for the core main surface side,
A peeling step for peeling the adhesive tape;
A method of manufacturing a wiring board with a built-in component, comprising: a curing step of heat curing the thermosetting resin film, the resin filler, and the core main surface side thermosetting resin film. An electronic component having a release film and an uncured and thermosetting resin film on the core back surface side of the core substrate having one or a plurality of receiving holes that are open on both the core main surface and the core back surface A taping step of applying the thermosetting resin film surface of the fixing tape;
An electronic component temporary fixing step of storing an electronic component in the storage hole, and temporarily fixing the electronic component by attaching the back surface of the electronic component to the thermosetting resin film;
A filling step of filling the gap between the inner wall surface of the housing hole and the electronic component with a thermosetting resin filler;
A supply step of supplying an uncured thermosetting resin film for the core main surface side to the core main surface side;
The release film side of the thermosetting resin film is heated and pressed at a temperature at which the thermosetting resin film, the resin filler, and the thermosetting resin film for the core main surface side are not cured. And a flattening press step for flattening the surface of the core main surface side thermosetting resin film,
A peeling step for peeling the release film;
A method of manufacturing a wiring board with a built-in component, comprising: a curing step of heat curing the thermosetting resin film, the resin filler, and the core main surface side thermosetting resin film.   The method for manufacturing a wiring board with a built-in component according to any one of claims 1 to 6, wherein a softening temperature of the thermosetting resin film is higher than a softening temperature of the resin filler.   The method for manufacturing a wiring board with a built-in component according to claim 1, wherein the pressure-sensitive adhesive tape has a stimulus-curing pressure-sensitive adhesive layer that is cured by stimulation.   A component built-in wiring board manufactured by the method for manufacturing a component built-in wiring substrate according to any one of claims 1 to 8. It has an adhesive tape and a thermosetting resin film that is uncured and has adhesiveness,
A taping step of affixing the thermosetting resin film surface to the core back surface side of the core substrate having one or a plurality of accommodation holes that are open on both the core main surface and the core back surface;
An electronic component temporary fixing step of storing an electronic component in the storage hole, and temporarily fixing the electronic component by attaching the back surface of the electronic component to the thermosetting resin film;
Filling and supplying a thermosetting resin filler into the gap between the inner wall surface of the accommodation hole and the electronic component and supplying the core main surface to the extent that the core main surface can be covered;
By heating and pressurizing at a temperature at which the thermosetting resin film and the resin filler are not cured, the surface of the thermosetting resin film on the adhesive tape side and the surface of the resin filler are each flattened. Flattening press process to
A peeling step for peeling the adhesive tape;
An electronic component fixing tape characterized by being used in a method for manufacturing a component built-in wiring board including a curing step in which the thermosetting resin film and the resin filler are heated and cured. It has a release film and a thermosetting resin film that is uncured and sticky,
A taping step of affixing the thermosetting resin film surface to the core back surface side of the core substrate having one or a plurality of accommodation holes that are open on both the core main surface and the core back surface;
An electronic component temporary fixing step of storing an electronic component in the storage hole, and temporarily fixing the electronic component by attaching the back surface of the electronic component to the thermosetting resin film;
Filling and supplying a thermosetting resin filler into the gap between the inner wall surface of the accommodation hole and the electronic component and supplying the core main surface to the extent that the core main surface can be covered;
The surface of the release film side of the thermosetting resin film and the surface of the resin filler are each flattened by heating and pressing at a temperature at which the thermosetting resin film and the resin filler are not cured. Flattening press process to
A peeling step for peeling the release film;
An electronic component fixing tape characterized by being used in a method for manufacturing a component built-in wiring board including a curing step in which the thermosetting resin film and the resin filler are heated and cured.

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