KR102002002B1 - Manufacturing Method of Transfer Printed Circuit Board Using Temporary Bonding and De-bonding Adhesives - Google Patents

Abstract

The transfer circuit board according to the present invention forms a conductive pattern layer with a conductive paste or conductive ink on a temporarily fixed adhesive material, temporarily fixes an electronic device on the conductive pattern, and then forms a flexible substrate or a rigid substrate having the conductive pattern and the electronic device embedded therein. After molding and separating from the temporarily fixed adhesive material, by stacking the outer protective layer, the number of insulating layers is reduced, thereby reducing the thickness of the multilayer transfer circuit board, and in the case of a flexible circuit board, the flexibility is improved.
In addition, the distance between the electronic device and the wiring pattern is reduced, thereby improving the RLC characteristics of the substrate. In addition, by directly printing and laminating the conductive paste or the conductive ink, the reliability of the joint is improved, the interlayer alignment state can be maintained at a high level in the multilayer substrate, and the process is simplified because no additional process associated with the via hole is required.

Description

Manufacturing Method of Transfer Printed Circuit Board Using Temporary Bonding and De-bonding Adhesives

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a transfer circuit board, in which a circuit pattern is formed in advance by a printing method, transferred to a substrate, and completed fabrication.

The contents described in this section merely provide background information on the present embodiment and do not constitute a prior art.

To reduce the size and improve the performance of electronic devices such as mobile phones, small mobile terminals, digital cameras, etc., rigid circuit boards or flexible circuit boards used in these electronic devices have increased demand for higher wiring density and thickness reduction. Doing.

Flexible printed circuit boards are thin bendable circuit boards that can be used in various electronic devices. The thinner the flexible circuit board, the better the flexibility and the easier the design of high density three-dimensional mounting.

In particular, there is an increasing trend toward embedding unpackaged chip electronic devices in a wafer state into a flexible circuit board to realize high density and miniaturization of a system. Conventionally, after patterning an inner layer core substrate, a chip is bonded to the core substrate. A multilayer flexible circuit board is manufactured by bonding an insulating layer and a copper foil layer thereon and forming a via hole and a wiring pattern of a pattern layer for electrical connection of each pattern layer. In this case, the planarity of the upper layer is lowered due to the thickness of the chip, and the copper foil layer bonding process using the thermocompression method has a disadvantage in that the possibility of chip damage is increased because heat is also applied to the chip.

The present invention is to attach a temporarily fixed adhesive material layer on a temporary base substrate, and printed a conductive pattern layer with a conductive paste or conductive ink directly on the temporary fixed adhesive material layer, and temporarily fixed the electronic device thereon, molding the resin Thereafter, a method of manufacturing a circuit board of a transfer method which separates from a temporarily fixed adhesive material layer is disclosed. As the circuit board is manufactured by transferring the pre-formed electronic device and the conductive pattern layer to the flexible board or the hard board, there is no need to solder the electronic device, and it is possible to manufacture while maintaining a high level of interlayer alignment. The main purpose is to provide a manufacturing process that reduces the process, particularly in the case of a flexible circuit board, and improves the productivity and quality of the thin and short circuit board, such as improved flexibility.

In order to solve the above problems, the transfer circuit board according to an embodiment of the present invention, at least one electronic device including at least one electrode pad; Outer protective layer; A first conductive pattern layer laminated on the outer protective layer; At least one electrode pad including at least one electrode pad, the at least one electrode pad being electrically connected to the first conductive pattern layer; And a circuit board to fill at least a portion of the first conductive pattern layer and the electronic device, including at least one set to form a single-layer transfer circuit board and sequentially stacked between the outer protective layer and the first conductive pattern layer. Conductive pattern layer; And an insulating layer including one or more via holes for electrically connecting the upper layer and the lower layer to form a multi-layer transfer circuit board, wherein the lower surface of the circuit board is included in the same plane as the lower surface of the first conductive pattern layer. It is done.

In addition, a conductive bridge may be disposed in the via hole and connect the first conductive pattern layer and the conductive pattern layer.

In addition, the circuit board is a flexible substrate made of a polyimide resin, characterized in that the flexible substrate is molded by molding from a polyacrylic acid (PAA) which is a polyimide precursor (precursor).

In addition, the flexible substrate is characterized in that made of PDMS (polydimethylsiloxane) resin.

The first insulating layer is made of any one of polyimide, polyester, polyethylene, polypropylene, polyvinyl chloride, polystyrene resin, and PDMS resin.

In addition, the manufacturing method of the multilayer transfer circuit board according to an embodiment of the present invention, the step of laminating a conductive pattern layer on a temporarily fixed adhesive material disposed on one surface of the base substrate; Stacking an insulating layer including at least one via hole on the conductive pattern layer; Filling the via hole with a conductive material; Depositing a first conductive pattern layer on the conductive material filled in the insulating layer and the via hole; Mounting an electronic device on the first conductive pattern layer, the electronic device including an electrode pad electrically connected to the first conductive pattern layer; Embedding the first conductive pattern layer and at least some electronic devices with a resin precursor; Curing the resin precursor to form a circuit board; Separating the part laminated on the temporarily fixed adhesive material from the temporarily fixed adhesive material; And laminating an outer protective layer on a lower surface of the conductive pattern layer.

In addition, the temporarily fixed adhesive material is characterized in that the material of the heat separation method that the adhesive force is reduced when heat is applied.

In addition, the temporarily fixed adhesive material is characterized in that the material of the UV irradiation separation method that the material is cured when the UV (ultraviolet light) irradiation cures the adhesion.

In addition, stacking the conductive pattern layer and the first conductive pattern layer; And filling the via hole with a conductive material. The method may include stacking the via hole by any one of inkjet printing, screen printing, and gravure printing using a conductive ink.

In addition, stacking the conductive pattern layer and the first conductive pattern layer; And filling the via hole with a conductive material. The method may include stacking a via hole by a direct printing method using a conductive paste.

In addition, the forming of the circuit board may include forming a polyimide by imidizing the polyimide precursor by any one of a chemical imidization method or an isocyanate method.

The present invention finally forms a conductive pattern layer directly on the separated temporary layer and attaches an electronic device thereon, thereby eliminating the need for soldering and reducing the number of insulating layers, thereby improving the flexibility of the flexible printed circuit board. In addition, since the distance between the electronic device and the conductive pattern is shortened, the RLC characteristic of the substrate is improved.

1 is a cross-sectional view illustrating a structure of a single-layer flexible printed circuit board according to an exemplary embodiment of the present invention.
2 is a cross-sectional view illustrating a structure of a two-layer flexible circuit board according to an exemplary embodiment of the present invention.
3 is a perspective view of a base substrate on which a temporarily fixed adhesive material layer is stacked according to an embodiment of the present invention.
4 is a perspective view illustrating a step of laminating a conductive pattern on a temporarily fixed adhesive material layer of a base substrate according to an embodiment of the present invention.
5 is a perspective view illustrating a step of mounting an electronic device on a conductive pattern according to an embodiment of the present invention.
6 is a perspective view illustrating a step of molding a flexible substrate on a temporarily fixed adhesive material layer on which an electronic device is mounted, according to an embodiment of the present invention.
7 is a perspective view showing a base substrate, a temporarily fixed adhesive material layer and a flexible substrate according to an embodiment of the present invention.
8 is a perspective view illustrating a flexible circuit board separated from a temporarily fixed adhesive material layer according to an embodiment of the present invention.

Hereinafter, some embodiments of the present invention will be described in detail through exemplary drawings. In adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are assigned to the same components as much as possible even though they are shown in different drawings. In addition, in describing the present invention, when it is determined that the detailed description of the related well-known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.

In addition, in describing the component of this invention, terms, such as 1st, 2nd, A, B, (a), (b), can be used. These terms are only for distinguishing the components from other components, and the nature, order or order of the components are not limited by the terms. Throughout the specification, when a part is said to include, 'include' a certain component, which means that it may further include other components, except to exclude other components unless otherwise stated. . In addition, as described in the specification. The terms 'unit' and 'module' refer to a unit that processes at least one function or operation, which may be implemented by hardware or software or a combination of hardware and software.

In addition, the present invention is described on the basis of the flexible circuit board, but since the flexible substrate and the rigid substrate differ only in the type of resin used, the process is applied in the same, so the rigid circuit board should also be included in the scope of the present invention.

1 is a cross-sectional view illustrating a structure of a single-layer flexible printed circuit board according to an exemplary embodiment of the present invention.

Referring to FIG. 1, a single-layer flexible circuit board using a temporarily fixed adhesive material (TBDB: temporary bonding and de-bonding (TBDB) 20, hereinafter referred to as TBDB) according to an embodiment of the present invention may be a flexible substrate 40. , An electronic device (IC chip) 30, a first conductive pattern layer 50, and an outer protective layer.

2 is a cross-sectional view illustrating a structure of a two-layer flexible circuit board according to an exemplary embodiment of the present invention.

2, in the case of a two-layer flexible circuit board according to an exemplary embodiment of the present invention, the flexible substrate 40, the electronic device 30, the first conductive pattern layer 50, and the first insulating layer 60 may be used. , A via hole 62, a second conductive pattern layer 70, and an outer protective layer 80.

The flexible circuit board according to the exemplary embodiment of the present invention is formed by stacking the TBDB 20 on the TBDB layer 20 of the base substrate 10 attached to one surface, and separating the TBDB layer 20 from the outer protective layer. Production is completed by laminating 80.

The electronic device 30 is a wafer type chip electronic device having an electrode pad 32 formed on a bottom surface thereof, an active device such as a surface mount device (SMD) device, a ball gate array (BGA) device, and a resistor, an inductor, and a capacitor. Etc., a passive element may be included.

The base substrate 10 may be a polymer resin or glass, and any material may be used as long as there is little deformation due to temperature, flatness and parallelism, and no warpage during the manufacturing process. During the manufacturing process, the base substrate 10 includes a layer of TBDB 20 whose adhesion is reduced by heating or UV irradiation on one surface thereof.

The first insulating layer 60 may be made of a polyimide resin, but is not limited thereto. Any polymer material may be used as the insulating material in a printed circuit board such as PDMS. The first insulating layer 60 may be in the form of a sheet in which a via hole 62 for electrically connecting the first conductive pattern layer 50 and the second conductive pattern layer 70 is formed in advance by laser processing. One surface of the insulating layer 60 may include an adhesive layer for bonding to the first conductive pattern layer 50.

The via hole 62 is formed by the conductive bridge 72 formed by filling the conductive paste or the conductive ink in the process of stacking the second conductive pattern layer 70, and thus, the first conductive pattern layer 50 and the second conductive pattern layer 70. The via hole 62 may be electrically connected.

On the final conductive pattern layer (first conductive pattern layer 50 in one embodiment), the electronic device 30 is temporarily fixed and mounted by a conductive paste or conductive ink. The flexible substrate 40 is formed by wrapping and curing the final conductive pattern layer and the electronic device 30.

When the molding of the flexible substrate 40 is completed, the flexible circuit board is completed by separating from the TBDB layer 20 and laminating the external protective layer 80 on the first conductive pattern layer 50. The outer protective layer 80 may be made of, for example, a silicone elastomer material.

Based on the case where the conductive pattern layer is a single layer, the manufacturing process of the flexible circuit board according to the exemplary embodiment of the present invention is summarized as follows.

(1) Attach the TBDB layer 20 on the base substrate 10 supporting the upper substrate elements during the process.

(2) The first conductive pattern layer 50 is formed on the TBDB layer 20. The first conductive pattern layer 50 uses a printing method using a conductive paste or a conductive ink.

(3) The electronic device 30 is mounted on the first conductive pattern layer 50. In this case, the first conductive pattern layer 50 is in a dried state, and a conductive paste or conductive ink is additionally applied to a portion where the electrode pads 32 of the electronic device 30 are electrically connected to the electrode pads 32. Can contribute to temporary fixation.

(4) A mold mold (not shown) is installed on a substrate on which the electronic device 30 is mounted, and a flexible substrate material is filled and cured to form a flexible substrate 40. In the case of forming a rigid circuit board instead of the flexible circuit board, the hard board material may be filled and cured to form the hard board 40 ', or the hard board may be attached on the adhesive layer.

(5) When the curing of the flexible substrate 40 is finished, the TBDB layer 20 is separated by heating to a temperature at which the adhesive force of the TBDB layer 20 is reduced. In the case of using the TBDB of the UV irradiation separation method, the TBDB layer 20 can be separated by irradiating UV through the base substrate 10.

(6) The outer protective layer 80 is finally formed on the separated and exposed first conductive pattern layer 50 to complete the flexible circuit board.

1 illustrates a single layer flexible circuit board, and FIG. 2 illustrates a two layer flexible circuit board. When the additional conductive pattern layer is formed, the conductive pattern layer and the insulating layer may be repeatedly stacked. On the final conductive pattern layer, the electronic device 30 is temporarily fixed and mounted by a conductive paste or a conductive ink. The flexible substrate 40 surrounds the final conductive pattern layer and the electronic device 30 and is formed by molding a flexible substrate material. The flexible printed circuit board is completed by separating the hardened flexible board 40 from the TBDB layer 20 and stacking the outer protective layer 80 on the separated surface.

In the case where the conductive pattern layer is a multilayer, after forming the second conductive pattern layer 70, the first insulating layer 60 in the form of a bonding sheet in which the via hole 62 region is formed in advance is bonded to each other, and the upper portion of the first insulating layer 60 is formed. The first conductive pattern layer 50 is formed in the via hole 62, wherein the via hole 62 is filled with a conductive paste or conductive ink to electrically connect the pattern of the second conductive pattern layer 70 and the pattern of the first conductive pattern layer 50. Connect with In describing an embodiment of the present invention, the case where the number is low when the first and second are referred to for convenience is defined as being disposed close to the electronic device 30.

In the manufacturing method of the flexible printed circuit board according to the exemplary embodiment of the present invention, the TBDB 20 is used, and an insulating layer is omitted between the final pattern layer and the electronic device 30 to improve flexibility. In addition, a conductive pattern is formed by the conductive paste or the conductive ink and is electrically connected to the electronic device 30 so that a soldering process is not required. In addition, since the base substrate 10 is fixed until the outer protective layer 80 is formed, the interlayer alignment may be maintained at a high level, and manufacturing time may be shortened.

3 is a perspective view of a base substrate on which a temporarily fixed adhesive material layer is stacked according to an embodiment of the present invention.

Referring to FIG. 3, the base substrate 10 is disposed so that the TBDB 20 is attached to one surface thereof, and the TBDB 20 is upward.

The TBDB 20 may be separated by any one of direct separation, heat separation, and UV irradiation separation. When the heat separation type TBDB 20 is used, the base substrate 10 is preferably a material having high dimensional accuracy according to temperature change. When the TBDB 20 of the UV irradiation separation method is used, the base substrate 10 is preferably made of a material capable of UV transmission.

The direct separation method uses an acrylic adhesive having a low adhesive strength of 100 g / 25 mm or less. It can be used in the case of a small flexible circuit board having a simple conductive pattern and a small number of electronic elements 30. Separation may be facilitated by additionally applying heat during adhesion layer separation.

The heat separation method uses a heat-peelable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive for imparting adhesiveness and heat-expandable microspheres for imparting heat peelability. The heat-peelable pressure-sensitive adhesive layer preferably has a thickness of 15 to 40 μm, and when heated to peel the substrate, the thermally expandable microspheres are expanded to decrease the contact area with the adherend, thereby causing the adherend to peel off. For example, when the substrate is heated on a hot plate for 1 minute at 100 ° C. or at about 0.2 seconds at 180 ° C., the adhesive force rapidly decreases and the flexible substrate 40 and the first conductive pattern layer 50 are peeled from the TBDB 20. .

UV irradiation separation method uses adhesive material that is cured by UV, and it has high adhesive strength before curing, but when UV is irradiated, the material is cured and the adhesive strength is reduced to less than 10% from 300 g / 25mm to 20 g / 25mm. Use nature. By irradiating UV from the base substrate 10 side, the flexible substrate 40 and the first conductive pattern layer 50 are peeled off from the TBDB 20.

4 is a perspective view illustrating a step of laminating a conductive pattern on a temporarily fixed adhesive material layer of a base substrate according to an embodiment of the present invention.

Referring to FIG. 4, a first conductive pattern layer 50 is formed on the TBDB layer 20. The electrode wiring pattern of the first conductive pattern layer 50 may be formed by one of direct printing using conductive paste, inkjet printing using conductive ink, screen printing, and gravure printing.

In forming the pattern layer, the use of a conductive paste or a conductive ink has advantages in that the process is simple and can quickly form various patterns, compared to a complicated semiconductor etching process, and is advantageous in producing small quantities of various products. In addition, in the case of the multilayer flexible substrate, the via hole 62 connected to the lower conductive pattern layer may be printed to be filled with the conductive paste or the conductive ink in the process of printing the upper conductive pattern layer, thereby simplifying the process. The conductive paste or conductive ink filled in the via hole 62 may be defined as a conductive bridge 72 that electrically connects the upper conductive pattern layer and the lower conductive pattern layer.

On the other hand, when the conductive pattern layer is laminated by semiconductor etching and metal sputtering, the thickness of the pattern cannot be locally thickened. For this reason, the via holes 62 must be electrically connected to adjacent conductive pattern layers through a separate process. In addition, the upper edge of the staircase layer of the via hole 62 is an area that is likely to be disconnected when the via hole 62 is patterned. A separate process of electroplating the via hole 62 after electroless plating and pre-filling the via hole 62 with a conductor is required.

According to an embodiment of the present invention, the via hole 62 is simultaneously buried and electrically connected to the lower conductive pattern layer when the upper conductive pattern layer is printed.

5 is a perspective view illustrating a step of mounting an electronic device on a conductive pattern according to an embodiment of the present invention.

The electronic device 30 may be temporarily fixed on the first conductive pattern layer 50 using equipment such as a chip mounter (not shown). Before the electronic device 30 is temporarily fixed, the first conductive pattern layer 50 is prepared in a basic dry state. In one embodiment, for example, it is dried for about an hour, but it will be apparent to those skilled in the art that the drying time can be shortened by various means. The first conductive pattern layer 50 may be prepared in a state that is not completely dry, and when the electronic device 30 is disposed, the state in which the first conductive pattern layer 50 is naturally fixed may be maintained. In another embodiment, the temporary fixing state can be more reliably ensured by additionally applying a conductive paste or conductive ink to a portion where the electrode pad 32 is in contact with and temporarily fixed before mounting the electronic device 30.

6 is a perspective view illustrating a step of molding a flexible substrate on a temporarily fixed adhesive material layer on which an electronic device is mounted, according to an embodiment of the present invention.

In FIG. 6, the molding frame surrounding the side surface of the base substrate to form the flexible substrate 40 forming region is omitted for convenience.

Referring to FIG. 6, the bottom surface of the electrode pad 32 of the electronic device 30 is in a state where the bottom surface is in close contact with the first conductive pattern layer 50. The height of the mold may be higher than the maximum height of the electronic device 30. The material of the flexible substrate 40 formed on the TBDB layer 20 may be any one of polyimide, PDMS, and silicone elastomer, but other materials may be used as long as the material can be used as a material for flexible circuit boards such as flexibility, insulation, and thermal conductivity. Can be used

7 is a perspective view showing a base substrate, a temporarily fixed adhesive material layer and a flexible substrate according to an embodiment of the present invention.

In one embodiment, the flexible substrate 40 is formed of a polyimide material representative of the flexible circuit board material. Polyimide has high adhesion and dimensional stability for stable microcircuit formation, and excellent chemical resistance against acids and alkalis required for etching and cleaning processes. In particular, the pyrolysis starts at a high temperature of 450 ℃ or more, it is a material excellent in heat resistance without a melting point. The polyimide is obtained by imidizing polyacrylic acid (PAA), which is a precursor.

Representative imidization methods include chemical and thermal methods and isocyanates. Chemical imidization method is a method of obtaining a chemical imidation reaction using a dehydration catalyst such as Acetic anhydride / pyridine to obtain a polyimide at a temperature of 100 ℃ or less. The thermal imidization method is a method of thermally imidating a PAA solution by heating it to 150-200 ° C., but the process is simple. There are disadvantages. The isocyanate method uses diiocynate as a monomer instead of diamine in the PAA preparation step. When the monomer mixture is heated to a temperature above 120 ° C., CO ₂ gas is generated to obtain polyimide.

On the other hand, when the thermal imidization method is used to mold the polyimide, the PAA heating temperature is high, and thus fixing the electronic device 30 of the TBDB layer 20 may be a problem. In addition, the same problem may occur because the adhesive force decreases at 150 ° C. or higher. Therefore, the thermal imidization method is not suitable in the molding process of polyimide.

Therefore, in consideration of the properties of the TBDB layer 20, it is preferable that the imidization method of the polyimide is one of chemical imidization method or isocyanate method. In both processes, it is preferable to use a mold having an open top shape, since it is necessary to secure an open surface through which dehydration or CO ₂ gas may be released during imidization.

In addition, the adhesion between the flexible substrate 40 and the first conductive pattern layer 50 and the electronic device 30 to be lined or molded is increased, and non-molding is caused by the gap bubbles between the electronic device 30 and the TBDB layer 20. In order to prevent the occurrence of the region, the polyimide molding process preferably includes a vacuum defoaming process.

On the other hand, when using PDMS as the flexible circuit board material, the flexible substrate 40 can be cured at a temperature considerably lower than the peeling temperature of the TBDB 20.

In the flexible printed circuit board according to the exemplary embodiment of the present invention, since the conductive pattern layer is first printed and then the flexible substrate 40 is laminated by molding, the flexible substrate 40 is first formed and then the conductive pattern layer is printed thereon. Adhesive strength between the conductive pattern layer and the flexible substrate 40 is higher than that of the case, and high reliability may be provided even in an environment where frequent folding and unfolding are repeated.

The flexible substrate 40 may be additionally impregnated with fine powder particles such as AlO ₂ or SiO ₂ , which are non-conductive materials and have excellent thermal conductivity, thereby effectively generating heat from the electronic device 30 to the outside of the flexible circuit board. Can be configured to diverge.

8 is a perspective view illustrating a flexible circuit board separated from a temporarily fixed adhesive material layer according to an embodiment of the present invention.

After curing of the molding of the flexible substrate 40 of the polyimide material according to the embodiment of the present invention is completed, the molding mold is removed. Then, according to the heat separation method of the TBDB layer 20 according to an embodiment of the present invention, the TBDB layer (by heating the base substrate 10 on a hot plate for 1 minute at 100 ℃ temperature or about 0.2 seconds at 180 ℃ temperature ( 20 and the molded flexible substrate 40 are separated. In the chemical imidization method, the process is finished at a temperature of 100 ° C. or less, and the flexible substrate 40 is cured in a state lower than the separation temperature of the TBDB layer 20 of the thermal separation method. After curing is completed, the temperature can be further increased in a state in which the heat of the flexible substrate 40 remains, and thus manufacturing cost and manufacturing time are shortened. When using the TBDB (20) of the UV irradiation separation method by lowering the adhesive force by curing the TBDB (20) layer by irradiating UV from the base substrate 10 side, the flexible substrate 40 is separated from the TBDB (20) layer do.

In the case of the multilayer conductive pattern layer, the electronic device 30 is mounted after the insulating layer and the additional conductive pattern layer are laminated in the step before the electronic device 30 is mounted. The first conductive pattern layer 50 is insulated by the first insulating layer 60. The first insulating layer 60 may be made of any one of polyimide, polyester, polyethylene, polypropylene, polyvinyl chloride, polystyrene resin, and PDMS (polydimethylsiloxane) material, and may be formed on the second conductive pattern layer 70. Are stacked on. The first insulating layer 60 may be in the form of a bonding sheet, and a region of the via hole 62 for electrically connecting the interlayer circuit patterns of the first conductive pattern layer 50 and the second conductive pattern layer 70 may be, for example, in advance. It may be formed by laser patterning. Bonding of the bonding sheet may be made by thermocompression bonding.

In an exemplary embodiment of the present invention, only the case of a single layer and a two layer flexible circuit board is described. However, the present invention is not limited thereto, and a flexible circuit board having three or more layers may be included in the scope of the present invention. . The multilayer flexible substrate of two or more layers may be manufactured by repeatedly laminating an intermediate insulating layer and an intermediate pattern layer before mounting the electronic device 30.

Referring back to FIG. 1, the flexible circuit board according to the exemplary embodiment of the present invention is completed by finally forming the outer protective layer 80. The outer protective layer 80 may be made of any one of polyimide, polyester, polyethylene, polypropylene, polyvinyl chloride, polystyrene resin, and PDMS (polydimethylsiloxane) material.

In addition, an anisotropic conductive film (ACF) may be attached to a portion of the conductive pattern layer for electrical connection with the outside of the flexible circuit board.

According to one embodiment of the present invention, the conductive pattern layer stacking method described only a printing method using a conductive paste or a conductive ink, and the insulating layer discloses a bonding method of a sheet in which a via hole 62 region is formed in advance. However, in the method of fabricating a flexible circuit board using the temporarily fixed adhesive according to an embodiment of the present invention, in the method of forming the conductive pattern layer and the insulating layer, the method of forming the via hole 62 by a conventional semiconductor etching process and laser processing is performed. It will also be apparent to those skilled in the art to which the present embodiment pertains.

The above description is merely illustrative of the technical idea of the present embodiment, and those skilled in the art to which the present embodiment belongs may make various modifications and changes without departing from the essential characteristics of the present embodiment. Therefore, the present embodiments are not intended to limit the technical idea of the present embodiment but to describe the present invention, and the scope of the technical idea of the present embodiment is not limited by these embodiments. The scope of protection of the present embodiment should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present embodiment.

Claims (11)

delete delete delete delete delete Stacking a conductive pattern layer on a temporarily fixed adhesive material disposed on one surface of a base substrate;
Stacking an insulating layer including at least one pre-formed via hole on the conductive pattern layer;
Filling the via hole with a conductive material;
Stacking a first conductive pattern layer on the insulating layer and the conductive material filled in the via hole;
Mounting an electronic device on the first conductive pattern layer, the electronic device including an electrode pad electrically connected to the first conductive pattern layer;
Filling the first conductive pattern layer and at least a portion of the electronic device with a resin precursor;
Curing the resin precursor to form a circuit board;
Separating the part laminated on the temporarily fixed adhesive material from the temporarily fixed adhesive material; And
Stacking an outer protective layer on a lower surface of the conductive pattern layer;
Method of manufacturing a transfer circuit board comprising a. The method of claim 6,
The temporarily fixed adhesive material is a method of manufacturing a transfer circuit board, characterized in that the material of the heat separation method that the adhesive force is reduced when applying heat. The method of claim 6,
The temporarily fixed adhesive material is a method of manufacturing a transfer circuit board, characterized in that the UV irradiation separation method material is cured by irradiating UV (ultraviolet light) to reduce the adhesion. The method of claim 6,
Stacking the conductive pattern layer and the first conductive pattern layer; And filling the via hole with a conductive material.
A method of manufacturing a transfer circuit board comprising a method of laminating by any one of inkjet printing, screen printing, and gravure printing using a conductive ink. The method of claim 6,
Stacking the conductive pattern layer and the first conductive pattern layer; And filling the via hole with a conductive material.
A method of manufacturing a transfer circuit board comprising a method of laminating by direct printing using a conductive paste. The method of claim 6,
Forming the circuit board,
A method for producing a transfer circuit board comprising the step of imidating a polyimide precursor by any one of chemical imidization method or isocyanate method to form polyimide.

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