KR20190011843A - Manufacturing Method of Transfer Printed Circuit Board Using Temporary Bonding and De-bonding Adhesives - Google Patents

Abstract

According to the present invention, a transfer circuit board can reduce the thickness of a multi-layered transfer circuit board and improve bending for a soft printed board by forming a conductive pattern layer on a temporary bonding adhesive material with conductive paste or conductive ink, temporarily fixing an electronic device on the conductive pattern, forming a soft board or a hard board in which the electronic device and the conductive pattern are embedded thereafter, and stacking an external protection layer after separating from the temporarily fixed adhesive material. In addition, RLC characteristics of a board are improved by reducing a distance between the electronic device and a wire pattern. Furthermore, by directly printing the conductive paste or the conductive ink to stack, the reliability of a bonding unit can be improved, an interlayer alignment state in a multi-layered board can be maintained at a high level, and a process can be simplified without requiring an additional process related to a via hole.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method for manufacturing a transfer circuit board using a temporary fixing adhesive material,

The present invention relates to a method of manufacturing a transfer circuit substrate in which a circuit pattern is formed by a printing method in advance and transferred to a substrate to complete the fabrication.

The contents described in this section merely provide background information on the present embodiment and do not constitute the prior art.

Rigid circuit boards or flexible circuit boards used in these electronic devices for size reduction and performance enhancement of electronic devices such as mobile phones, handheld mobile terminals, digital cameras and the like have been increasingly demanded for higher wire density and thickness reduction .

Flexible printed circuit boards are thin foldable circuit boards that can be used in a variety of electronic devices. The thinner the flexible circuit board, the better the bendability and the higher density three-dimensional mounting design becomes easier.

Particularly, there is an increasing tendency to embody semiconductor electronic devices into a flexible circuit board to realize high-density and miniaturization of a semiconductor device. Conventionally, after patterning the inner layer core substrate, the chip is bonded to the core substrate. A multilayer flexible circuit board is manufactured by bonding an insulating layer and a copper foil layer thereon and forming wiring patterns of via holes and pattern layers for electrical connection of the respective pattern layers. In this case, the planarity of the upper layer is lowered due to the thickness of the chip, and the process of bonding the copper foil layer using the thermocompression bonding method has a disadvantage of increasing the possibility of chip damage because heat is applied to the chip.

In the present invention, a temporary fixing adhesive layer is attached on a temporary base substrate, a conductive pattern is printed directly on the temporary fixing adhesive layer using a conductive paste or a conductive ink, an electronic element is fixed on the conductive pattern, A method of manufacturing a circuit board of a transfer type in which a circuit board is separated from a temporary fixed adhesive material layer. There is no need to solder an electronic element by manufacturing a circuit board by transferring a previously formed electronic element and a conductive pattern layer to a flexible substrate or a rigid board, and it is possible to manufacture the interlayer alignment state at a high level, And the manufacturing process for improving the productivity and quality of the light-weight short circuit substrate, such as improving the flexibility in the case of the flexible circuit board, is the main purpose.

According to an aspect of the present invention, there is provided a transfer circuit board comprising: at least one electronic device including at least one electrode pad; An outer protective layer; A first conductive pattern layer laminated on the outer protective layer; At least one electronic pad including at least one electrode pad and at least one electrode pad electrically connected to the first conductive pattern layer; And a circuit board for embedding at least a part of the first conductive pattern layer and the electronic device, wherein the at least one set of the first conductive pattern layer and the second conductive pattern layer are stacked in this order, A conductive pattern layer; And an insulating layer including at least one via hole for electrically connecting the upper layer and the lower layer, wherein the lower surface of the circuit board is included in the same plane as the lower surface of the first conductive pattern layer .

And a conductive bridge disposed in the via hole and connecting the first conductive pattern layer and the conductive pattern layer.

In addition, the circuit board is a flexible substrate made of polyimide resin, and the flexible substrate is molded from polyacrylic acid (PAA), which is a polyimide precursor.

Further, the flexible substrate is characterized by being made of PDMS (polydimethylsiloxane) resin.

The first insulating layer is characterized by being made of one of polyimide, polyester, polyethylene, polypropylene, polyvinyl chloride, polystyrene resin and PDMS resin.

According to another aspect of the present invention, there is provided a method of manufacturing a multilayer transfer circuit board, including: laminating a conductive pattern layer on a temporarily fixed adhesive material disposed on one side of a base substrate; Stacking an insulating layer including at least one via hole on the conductive pattern layer; Filling the via hole with a conductive material; Depositing a first conductive pattern layer on the conductive material filled in the insulating layer and the via hole; Mounting an electronic device including an electrode pad electrically connected to the first conductive pattern layer on the first conductive pattern layer; Embedding the first conductive pattern layer and at least a part of the electronic element with a resin precursor; Forming a circuit board by curing the resin precursor; Separating the laminated portion from the temporary fixed adhesive material on the temporarily fixed adhesive material; And laminating an outer protective layer on the lower surface of the conductive pattern layer.

Further, the temporarily fixing adhesive material is characterized by being a material of a heat separation method in which the adhesive force is reduced when heat is applied.

Further, the temporarily fixing adhesive material is characterized by being a UV irradiation separation type material in which the material is cured when the UV (ultraviolet light) is irradiated to decrease the adhesive force.

The method may further include: laminating the conductive pattern layer and the first conductive pattern layer; And filling the via hole with a conductive material is characterized in that the conductive ink is deposited by a printing method such as inkjet printing, screen printing, and gravure printing using a conductive ink.

The method may further include: laminating the conductive pattern layer and the first conductive pattern layer; And filling the via hole with a conductive material is characterized in that the conductive paste is deposited by a direct printing method.

Further, the step of molding the circuit board includes a step of forming a polyimide by imidizing the polyimide precursor by any one of a chemical imidization method and an isocyanate method.

In the present invention, finally, a conductive pattern layer is directly formed on a separate temporary layer, and an electronic element is attached thereon, so that soldering is not required, and the number of insulating layers is reduced, thereby improving the flexibility of the flexible circuit board. In addition, the distance between the electronic device and the conductive pattern is reduced, thereby improving the RLC characteristics of the substrate.

1 is a cross-sectional view illustrating a structure of a single layer flexible printed circuit board according to an embodiment of the present invention.
2 is a cross-sectional view illustrating the structure of a two-layer flexible printed circuit board according to an embodiment of the present invention.
3 is a perspective view of a base substrate on which a temporarily fixing adhesive material layer according to an embodiment of the present invention is laminated.
4 is a perspective view illustrating a step of laminating a conductive pattern on a temporarily fixed adhesive material layer of a base substrate according to an embodiment of the present invention.
5 is a perspective view showing a step of mounting an electronic device on a conductive pattern according to an embodiment of the present invention.
6 is a perspective view illustrating a step of molding a flexible substrate on a temporarily fixed adhesive material layer on which an electronic device according to an embodiment of the present invention is mounted.
7 is a perspective view illustrating a base substrate, a temporarily fixed adhesive material layer, and a flexible substrate according to an embodiment of the present invention.
8 is a perspective view showing a state where a flexible circuit board according to an embodiment of the present invention is separated from a temporary fixing adhesive material layer.

Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. It should be noted that, in adding reference numerals to the constituent elements of the drawings, the same constituent elements are denoted by the same reference symbols as possible even if they are shown in different drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

In describing the components of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are intended to distinguish the constituent elements from other constituent elements, and the terms do not limit the nature, order or order of the constituent elements. Throughout the specification, when an element is referred to as being "comprising" or "comprising", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise . In addition, '... Quot ;, " module ", and " module " refer to a unit that processes at least one function or operation, and may be implemented by hardware or software or a combination of hardware and software.

In addition, although the present invention is described based on a flexible circuit board, the flexible substrate and the rigid substrate are different from each other only in the kind of resin used, and the process is the same, so that a hard circuit board should be considered to be included in the scope of the present invention.

1 is a cross-sectional view illustrating a structure of a single layer flexible printed circuit board according to an embodiment of the present invention.

1, a single-layer flexible circuit board using temporary bonding and de-bonding (TBDB) according to an embodiment of the present invention includes a flexible substrate 40, An IC chip 30, a first conductive pattern layer 50, and an external protection layer.

2 is a cross-sectional view illustrating the structure of a two-layer flexible printed circuit board according to an embodiment of the present invention.

2, a two-layer flexible printed circuit board according to an embodiment of the present invention includes a flexible substrate 40, an electronic device 30, a first conductive pattern layer 50, a first insulation layer 60, A via hole 62, a second conductive pattern layer 70, and an outer protective layer 80. [

A flexible circuit board according to an embodiment of the present invention is formed by stacking on a TBDB layer 20 of a base substrate 10 attached to one side of a TBDB 20 and separating from the TBDB layer 20, (80) are laminated to complete the fabrication.

The electronic device 30 includes an active device such as a chip type electronic device, an SMD (surface mount device) device, a BGA (ball gate array) device, and a resistor, an inductor, and a capacitor And the like.

The base substrate 10 may be made of polymer resin or glass, and may be any material as long as it is less deformed by temperature, has a flatness and parallelism, and is free from warping during the manufacturing process. During the manufacturing process, the base substrate 10 includes a TBDB 20 layer on one side of which the adhesion is decreased by heating or UV irradiation.

The first insulating layer 60 may be made of a polyimide resin, but not limited thereto. The first insulating layer 60 may be any polymer material such as PDMS, which is generally used as an insulating layer material in a printed circuit board. The first insulating layer 60 may be a sheet in which a via hole 62 for electrically connecting the first conductive pattern layer 50 and the second conductive pattern layer 70 is formed in advance by laser processing, One side of the insulating layer 60 may include an adhesive layer for adhering to the first conductive pattern layer 50.

The via hole 62 may be formed in the first conductive pattern layer 50 and the second conductive pattern layer 70 by the conductive bridge 72 formed by filling the conductive paste or the conductive ink in the process of laminating the second conductive pattern layer 70. [ And can be electrically connected at the via hole 62.

On the final conductive pattern layer (the first conductive pattern layer 50 in one embodiment), the electronic element 30 is temporarily fixed and mounted by a conductive paste or conductive ink. The flexible substrate 40 is formed by surrounding the final conductive pattern layer and the electronic device 30, molding, and then curing.

When the molding of the flexible substrate 40 is completed, the flexible circuit board is completed by separating the flexible substrate 40 from the TBDB layer 20 and laminating the outer protection layer 80 on the first conductive pattern layer 50. The outer protective layer 80 may be made of, for example, a silicone elastomer.

A manufacturing process of a flexible circuit board according to an embodiment of the present invention will be described with reference to the case where the conductive pattern layer is a single layer.

(1) Attach the TBDB layer 20 onto the base substrate 10 supporting the upper substrate elements during the process.

(2) The first conductive pattern layer 50 is formed on the TBDB layer 20. The first conductive pattern layer 50 uses a printing method using a conductive paste or a conductive ink.

(3) The electronic element 30 is mounted on the first conductive pattern layer 50. At this time, the first conductive pattern layer 50 is in a dried state, and a conductive paste or a conductive ink is further applied to the electrode pad 32 of the electronic element 30 to electrically connect the electrode pad 32 And can contribute to the settlement.

(4) A mold frame (not shown) is provided on the substrate on which the electronic device 30 is mounted, and the flexible substrate material is filled and cured to form the flexible substrate 40. In the case of forming a rigid circuit board rather than a flexible circuit board, the rigid substrate 40 'may be formed by filling and hardening the material for the rigid substrate, or the rigid substrate may be adhered on the adhesive layer.

(5) At the end of curing of the soft substrate 40, the TBDB layer 20 is separated by heating to a temperature at which the adhesion of the TBDB layer 20 is reduced. When the TBDB of the UV irradiation separation system is used, the TBDB layer 20 can be separated by transmitting the ultraviolet rays through the base substrate 10.

(6) Finally, the outer protective layer 80 is formed on the first conductive pattern layer 50 which is separately exposed to complete the flexible circuit board.

Fig. 1 discloses a single-layer flexible circuit board. Fig. 2 discloses a two-layer flexible circuit board. When forming the additional conductive pattern layer, the conductive pattern layer and the insulating layer can be repeatedly laminated. On the final conductive pattern layer, the electronic element 30 is temporarily fixed and mounted by conductive paste or conductive ink. The flexible substrate 40 surrounds the final conductive pattern layer and the electronic device 30 and is formed by molding with a flexible substrate material. The flexible circuit board is completed by separating the hardened soft substrate 40 from the TBDB layer 20 and laminating the outer protective layer 80 on the separation surface.

In the case where the conductive pattern layers are multilayered, the first insulating layer 60 in the form of a bonded sheet having the via hole 62 region formed in advance after the formation of the second conductive pattern layer 70 is bonded, The area of the via hole 62 is filled with a conductive paste or a conductive ink so that the pattern of the second conductive pattern layer 70 and the pattern of the first conductive pattern layer 50 are electrically . In describing an embodiment of the present invention, it is defined that the case where the number is low is disposed close to the electronic device 30 when referring to the first and second cases for convenience.

The manufacturing method of the flexible circuit board according to the embodiment of the present invention is characterized in that the TBDB 20 is used and the insulation layer is omitted between the final pattern layer and the electronic device 30 to improve the bendability. Further, a conductive pattern is formed by the conductive paste or the conductive ink, and electrical connection is made with the electronic element 30, so that a soldering process is not required. In addition, since the base substrate 10 is fixed until the outer protective layer 80 is formed, the interlayer alignment state can be maintained at a high level and the manufacturing time is shortened.

3 is a perspective view of a base substrate on which a temporarily fixing adhesive material layer according to an embodiment of the present invention is laminated.

Referring to FIG. 3, the base substrate 10 is disposed such that the TBDB 20 is attached on one side and the TBDB 20 is on the top.

The TBDB 20 can be separated by any of the direct separation, heat separation, and UV irradiation separation methods. When the TBDB 20 of the heat separation type is used, the base substrate 10 is preferably a material having a high dimensional accuracy in accordance with a change in temperature. When the UV irradiation separation type TBDB 20 is used, it is preferable that the base substrate 10 is made of a material capable of UV transmission.

The direct separation method uses an acrylic-based pressure-sensitive adhesive having an adhesive strength of 100 g / 25 mm or less. It can be used in the case of a small flexible circuit board in which the conductive pattern is simple and the number of the electronic elements 30 is small. When the adhesive layer is separated, the separation may be facilitated by additionally applying heat.

The heat separation method uses a pressure-sensitive adhesive for imparting tackiness and a heat-peelable pressure-sensitive adhesive layer containing heat-expandable microspheres for imparting heat releasability. The heat-peelable pressure-sensitive adhesive layer preferably has a thickness of 15 to 40 탆. When the heat-peelable pressure-sensitive adhesive layer is heated for peeling off the substrate, the thermally expandable microspheres are expanded to decrease the contact area with the adherend. For example, when the substrate is heated on a hot plate at a temperature of 100 占 폚 for 1 minute or at a temperature of 180 占 폚 for about 0.2 second, the adhesive strength rapidly decreases and the soft substrate 40 and the first conductive pattern layer 50 are peeled from the TBDB 20 .

The UV irradiation separation method uses an adhesive material which is cured by UV, and has a high adhesive force before curing. However, when UV is irradiated, the material is cured and the adhesive force is reduced to less than 10% from 300 g / 25 mm to 20 g / 25 mm Property. The flexible substrate 40 and the first conductive pattern layer 50 are peeled from the TBDB 20 by irradiating UV light from the base substrate 10 side.

4 is a perspective view illustrating a step of laminating a conductive pattern on a temporarily fixed adhesive material layer of a base substrate according to an embodiment of the present invention.

Referring to FIG. 4, a first conductive pattern layer 50 is formed on the TBDB layer 20. The electrode wiring pattern of the first conductive pattern layer 50 can be formed by one of direct printing using a conductive paste, inkjet printing using a conductive ink, screen printing, and gravure printing.

By using a conductive paste or a conductive ink to form a pattern layer, it is advantageous in that it can form a simple and various pattern quickly compared to a complicated semiconductor etching process, and is advantageous for small quantity production of various kinds of products. In the case of a multilayer flexible substrate, the via hole 62 connected to the lower conductive pattern layer may be printed so as to be filled with conductive paste or conductive ink in the process of printing the upper conductive pattern layer, thereby simplifying the process. The conductive paste or conductive ink filled in the via hole 62 may be defined as a conductive bridge 72 for electrically connecting the upper conductive pattern layer and the lower conductive pattern layer.

On the other hand, when the conductive pattern layers are laminated by semiconductor etching and metal sputtering, the thickness of the pattern can not be locally thickened. Therefore, the via holes 62 should be electrically connected to adjacent conductive pattern layers through separate processes. The top edge of the stepped layer of the via hole 62 is a region having a high probability of disconnection when the via hole 62 is patterned. A separate step of electrolytically plating the via hole 62 after electroless plating and filling the via hole 62 with a conductor is required in advance.

According to one embodiment of the present invention, the via hole 62 is buried at the same time when the upper conductive pattern layer is printed and electrically connected to the lower conductive pattern layer.

5 is a perspective view showing a step of mounting an electronic device on a conductive pattern according to an embodiment of the present invention.

The electronic device 30 may be temporarily fixed on the first conductive pattern layer 50 by using a device such as a chip mounter (not shown). The first conductive pattern layer 50 is prepared in the basic dry state before the electronic element 30 is temporarily fixed. In one embodiment, for example, it is dried for about one hour, but it will be apparent to a person skilled in the art that the drying time can be shortened by various means. The first conductive pattern layer 50 can be prepared in a state in which the first conductive pattern layer 50 is not completely dried and the state in which the electronic element 30 is naturally fixed can be maintained. In another embodiment, the conductive paste or the conductive ink is further applied to the portion where the electrode pad 32 contacts and temporarily fixes the electronic element 30 before mounting the electronic element 30, thereby further ensuring the temporary fixing state.

6 is a perspective view illustrating a step of molding a flexible substrate on a temporarily fixed adhesive material layer on which an electronic device according to an embodiment of the present invention is mounted.

In FIG. 6, the molding frame surrounding the side surface of the base substrate and forming the molding region of the flexible substrate 40 is omitted for convenience.

6, the bottom surface of the electrode pad 32 of the electronic device 30 is in close contact with the first conductive pattern layer 50 and is temporarily fixed. The height of the mold frame may be higher than the maximum height of the electronic device 30. [ The material of the flexible substrate 40 to be molded on the TBDB layer 20 may be any one of polyimide, PDMS and silicone elastomer. However, if the flexible substrate 40 can be used as a material for the flexible circuit board such as flexibility, Available.

7 is a perspective view illustrating a base substrate, a temporarily fixed adhesive material layer, and a flexible substrate according to an embodiment of the present invention.

In one embodiment, the flexible substrate 40 is formed of a typical polyimide material as a material of the flexible circuit substrate. Polyimide has high adhesion and dimensional stability for stable microcircuit formation, and is excellent in acid and alkali resistance to etching and cleaning. Particularly, pyrolysis starts at a high temperature of 450 ° C or higher, and is a material having excellent heat resistance without melting point. Polyimide is obtained by imidizing polyacrylic acid (PAA), which is a precursor.

Representative imidization methods include chemical, thermal and isocynate methods. The chemical imidization method is a method of chemically imidizing the reaction using a dehydration catalyst such as acetic anhydride / pyridine to obtain a polyimide at a temperature of 100 ° C or less. The thermal imidation method is a method in which the PAA solution is heated to 150 to 200 캜 and thermally imidized. However, in the case of using the TBDB of the heat separation type in one embodiment according to the present invention, There are disadvantages. In the isocyanate method, diiocynate is used instead of diamine as a monomer in the PAA production step. When the monomer mixture is heated to a temperature of 120 ° C or more, CO ₂ gas is generated to obtain polyimide.

On the other hand, if a thermal imidization method is used to form the polyimide, the heating temperature of the PAA is high, and the fixing of the electronic device 30 of the TBDB layer 20 may become a problem. In addition, the same problem may occur in the case of the UV irradiation separation type pressure-sensitive adhesive as the adhesive strength decreases at 150 캜 or higher. Therefore, the thermal imidation process is inadequate during the molding process of polyimide.

Therefore, in view of the characteristics of the TBDB layer 20, it is preferable that the imidization method of the polyimide is one of the chemical imidization method and the isocyanate method. In both processes, it is desirable to use molds with open tops since it is necessary to secure an open surface for dehydration or release of CO ₂ gas in the imidization process.

It is also possible to increase the adhesion between the flexible substrate 40 to be lynated or molded and the first conductive pattern layer 50 and the electronic element 30 and to increase the adhesion between the electronic element 30 and the TBDB layer 20 by non- In order to prevent the occurrence of the area, the polyimide molding process preferably includes a vacuum degassing process.

On the other hand, when PDMS is used as the material of the flexible circuit board, the flexible substrate 40 can be hardened at a temperature considerably lower than the peeling temperature of the TBDB 20.

Since the flexible circuit board according to an embodiment of the present invention is formed by first printing the conductive pattern layer and then stacking the flexible substrate 40 on the flexible substrate 40 by molding, the flexible substrate 40 is first formed, The bonding strength between the conductive pattern layer and the flexible substrate 40 is higher than that in the case where the conductive pattern layer is formed on the conductive pattern layer 40 and high reliability can be provided even in an environment where frequent folding and spreading are repeated.

The soft substrate 40 may be further impregnated with particles of fine powder form such as AlO ₂ or SiO _{2 which} are nonconductive materials and have excellent thermal conductivity and through which the heat generated by the electronic device 30 can be efficiently transferred to the outside of the flexible circuit board And to diverge.

8 is a perspective view showing a state where a flexible circuit board according to an embodiment of the present invention is separated from a temporary fixing adhesive material layer.

After the hardening of the molding of the flexible substrate 40 of the polyimide material according to the embodiment of the present invention is completed, the molding frame is removed. Next, according to the heat separation method of the TBDB layer 20 according to an embodiment of the present invention, the base substrate 10 is heated on the hot plate at 100 ° C. for 1 minute or 180 ° C. for about 0.2 second, 20 and the molded flexible substrate 40 are separated. In the chemical imidization process, the process is completed at a temperature of 100 ° C or lower, and the soft substrate 40 is cured at a temperature lower than the separation temperature of the TBDB layer 20 of the heat separation type. The temperature can be further increased in the state where the heat of the flexible substrate 40 remains after the completion of the curing, thereby reducing the manufacturing cost and the manufacturing time. In the case of using the UV irradiation separation type TBDB 20, UV irradiation is performed on the base substrate 10 side to cure the TBDB layer 20, thereby lowering the adhesive force and separating the flexible substrate 40 formed from the TBDB 20 layer do.

In the case of the multilayered conductive pattern layer, the electronic element 30 is mounted after the insulating layer and the additional conductive pattern layer are laminated before the electronic element 30 is mounted. The first conductive pattern layer 50 is insulated by the first insulating layer 60. The first insulating layer 60 may be formed of any one material selected from the group consisting of polyimide, polyester, polyethylene, polypropylene, polyvinyl chloride, polystyrene resin and PDMS (Polydimethylsiloxane) Respectively. The first insulating layer 60 may be in the form of a laminated sheet and the via hole 62 region for electrically connecting the interlayer circuit patterns of the first conductive pattern layer 50 and the second conductive pattern layer 70 may be pre- Or may be formed by laser patterning. The bonding of the bonding sheet can be performed by a thermocompression bonding method.

In the embodiment according to the present invention, only the case of a single-layer and two-layer flexible circuit board is described, but the present invention is not limited thereto, and the case of a flexible circuit board in which three or more layers are stacked may also be included in the scope of the present invention . The multilayer flexible substrate having two or more layers can be manufactured by repeatedly laminating the intermediate insulating layer and the intermediate pattern layer before mounting the electronic element 30. [

Referring to FIG. 1 again, a flexible circuit board according to an embodiment of the present invention is finally formed by forming an external protection layer 80. The outer protective layer 80 may be made of any one of polyimide, polyester, polyethylene, polypropylene, polyvinyl chloride, polystyrene resin, and PDMS (polydimethylsiloxane).

In addition, an anisotropic conductive film (ACF: not shown) may be adhered to a part of the conductive pattern layer for electrical connection with the outside of the flexible circuit board.

According to one embodiment of the present invention, the conductive pattern layering method only describes a baking method using conductive paste or conductive ink, and the insulating layer discloses a method of joining sheets in which a via hole 62 region is formed in advance. However, in the method of fabricating the flexible circuit board using the temporary fixing adhesive according to the embodiment of the present invention, in the method of forming the conductive pattern layer and the insulating layer, a method of forming a via hole 62 by a conventional semiconductor etching process and laser processing It will be apparent to those skilled in the art that the present invention may be embodied.

The foregoing description is merely illustrative of the technical idea of the present embodiment, and various modifications and changes may be made to those skilled in the art without departing from the essential characteristics of the embodiments. Therefore, the present embodiments are to be construed as illustrative rather than restrictive, and the scope of the technical idea of the present embodiment is not limited by these embodiments. The scope of protection of the present embodiment should be construed according to the following claims, and all technical ideas within the scope of equivalents thereof should be construed as being included in the scope of the present invention.

Claims (11)

At least one electronic device comprising at least one electrode pad;
An outer protective layer;
A first conductive pattern layer laminated on the outer protective layer;
At least one electronic device including at least one electrode pad and at least one electrode pad electrically connected to the first conductive pattern layer; And
A circuit board for embedding at least a part of the first conductive pattern layer and the electronic element;
A single-layer transfer circuit board is formed,
At least one set of layers stacked in sequence between the outer protective layer and the first conductive pattern layer
A conductive pattern layer; And
An insulating layer including at least one via hole for electrically connecting the upper layer and the lower layer;
Forming a multi-layer transfer circuit substrate,
The lower surface of the circuit board is included in the same plane as the lower surface of the first conductive pattern layer
Wherein the substrate is a printed circuit board. The method according to claim 1,
And a conductive bridge disposed in the via hole and connecting the first conductive pattern layer and the conductive pattern layer. The method according to claim 1,
Wherein the circuit board is a flexible substrate made of polyimide resin,
Wherein the flexible substrate is molded from polyacrylic acid (PAA) as a polyimide precursor. The method of claim 3,
Wherein the flexible substrate is made of PDMS (polydimethylsiloxane) resin. The method according to claim 1,
Wherein the first insulating layer is made of a resin selected from the group consisting of polyimide, polyester, polyethylene, polypropylene, polyvinyl chloride, polystyrene resin and PDMS resin. Stacking a conductive pattern layer on the temporarily fixed adhesive material disposed on one side of the base substrate;
Stacking an insulating layer including at least one via hole on the conductive pattern layer;
Filling the via hole with a conductive material;
Depositing a first conductive pattern layer on the insulating layer and the conductive material filled in the via hole;
Mounting an electronic device including an electrode pad electrically connected to the first conductive pattern layer on the first conductive pattern layer;
Embedding the first conductive pattern layer and at least a part of the electronic element with a resin precursor;
Forming a circuit board by curing the resin precursor;
Separating the laminated portion on the temporarily fixed adhesive material from the temporarily fixed adhesive material; And
Laminating an outer protective layer on the lower surface of the conductive pattern layer;
Wherein the step of forming the transfer substrate comprises the steps of: The method according to claim 6,
Wherein the temporarily fixing adhesive material is a material of a heat separation type in which adhesive force is reduced when heat is applied. The method according to claim 6,
Wherein the temporarily fixing adhesive material is a material of a UV irradiation separation method in which the material is cured when the UV (ultraviolet light) is irradiated to decrease the adhesive force. The method according to claim 6,
Laminating the conductive pattern layer and the first conductive pattern layer; And filling the via hole with a conductive material
Wherein the electroconductive ink is laminated by a printing method such as ink jet printing, screen printing, and gravure printing using a conductive ink. The method according to claim 6,
Laminating the conductive pattern layer and the first conductive pattern layer; And filling the via hole with a conductive material
Wherein the conductive paste is deposited by a direct printing method using a conductive paste. The method according to claim 6,
Wherein forming the circuit board comprises:
Forming a polyimide by imidizing a polyimide precursor by any one of a chemical imidization method and an isocyanate method.

Images