WO2019058860A1 - 表面処理装置および表面処理方法 - Google Patents

表面処理装置および表面処理方法 Download PDF

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Publication number
WO2019058860A1
WO2019058860A1 PCT/JP2018/031065 JP2018031065W WO2019058860A1 WO 2019058860 A1 WO2019058860 A1 WO 2019058860A1 JP 2018031065 W JP2018031065 W JP 2018031065W WO 2019058860 A1 WO2019058860 A1 WO 2019058860A1
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WIPO (PCT)
Prior art keywords
surface treatment
treatment
treated
liquid
injection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/031065
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English (en)
French (fr)
Japanese (ja)
Inventor
朋士 奥田
大輔 松山
立花　眞司
雅之 内海
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Original Assignee
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uemera Kogyo Co Ltd, C Uyemura and Co Ltd filed Critical Uemera Kogyo Co Ltd
Priority to CN201880059714.6A priority Critical patent/CN111094635A/zh
Priority to KR1020207010776A priority patent/KR102401901B1/ko
Priority to SG11202002497QA priority patent/SG11202002497QA/en
Priority to EP18858558.2A priority patent/EP3686320A4/en
Priority to US16/648,086 priority patent/US11389818B2/en
Publication of WO2019058860A1 publication Critical patent/WO2019058860A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B3/00—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements
    • B05B3/02—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
    • B05C3/02—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
    • B05C3/04—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material with special provision for agitating the work or the liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/18—Processes for applying liquids or other fluent materials performed by dipping
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C23C18/163—Supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1642—Substrates other than metallic, e.g. inorganic or organic or non-conductive semiconductor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/08—Rinsing

Definitions

  • the present invention relates to an apparatus and method for surface treating an object such as a printed circuit board, a semiconductor, or a wafer.
  • an object such as a printed circuit board, a semiconductor, or a wafer.
  • desmear treatment for removing resin residue and the like attached during machining from the object to be treated
  • pretreatment for subjecting the object to be treated to a predetermined treatment.
  • the meaning includes post-processing after predetermined processing, and cleaning processing performed before and after each processing as necessary.
  • a printed circuit board, a semiconductor, a wafer and the like are obtained by subjecting an object to be processed to a desired machining process and the like, and then performing a desmear process and a coating process such as plating.
  • pretreatment and post-treatment may be performed as needed, and washing treatment may be performed.
  • Each of these treatments is performed in a state where the object to be treated is charged into the treatment tank and at least a part or all of the object to be treated is immersed in the liquid.
  • Patent Document 1 is known as a technique for electroplating a plate-like work such as a printed board.
  • Patent Document 1 The technology of Patent Document 1 is proposed by the present applicant earlier, and a surface treatment apparatus or a plating tank is provided with a jetting means for jetting a plating treatment solution toward the object to improve the quality of the plating treatment. It is described that it provides in.
  • Via holes are formed on the surface of a printed circuit board, semiconductor, wafer, etc. to which various processes are applied, in order to cope with high integration of semiconductor devices.
  • the diameter of via holes and the width of trenches tend to decrease.
  • the ratio of the depth to the diameter of the via hole (depth / diameter of the via hole) and the ratio of the depth to the width of the trench (depth / width of the via hole) tend to be large. Therefore, even if the surface of a printed circuit board, a semiconductor, a wafer or the like is treated, the treatment liquid or the washing solution may not sufficiently penetrate into the via hole or the inside of the trench, resulting in uneven processing.
  • the present invention has been made focusing on the above circumstances, and an object thereof is to provide a surface treatment apparatus and a surface treatment method capable of improving the quality of surface treatment when subjecting an object to be surface treated. It is.
  • the first surface treatment apparatus capable of solving the above-mentioned problems is an apparatus for subjecting an object to be treated, at least a part of which is immersed in the liquid, to a surface treatment It has an injection part which injects treatment liquid towards the treated surface of a thing, and the injection part is provided opposite to the treated thing, and is parallel to the treated surface of the treated thing At least at least among an injection unit rotating means for rotating the injection unit in a plane, and an object rotating means for rotating the object in a plane perpendicular to the injection direction of the processing liquid injected from the injection unit. It is characterized in that it has one.
  • the injection unit is rotated at an average rotation speed of 100 to 3000 mm / min. Further, it is preferable that at least one of the object to be treated or the injection portion is rotated with a circle equivalent diameter of 20 to 200 mm.
  • the above-mentioned subject is an apparatus which performs surface treatment to a processed object which is at least partially immersed in a liquid, and the apparatus has an injection unit which jets the processing liquid toward the processed surface of the processed object.
  • the problem can also be solved by a second surface treatment apparatus having fixing means for fixing the object to be processed to be inclined with respect to the liquid surface, and injection part rotating means for rotating the injection part.
  • the second surface treatment apparatus may further include an inclination unit that inclines the injection unit such that the treatment surface of the object to be processed and the ejection direction of the treatment liquid ejected from the injection unit are perpendicular to each other. preferable.
  • the above-mentioned subject is an apparatus which performs surface treatment to a processed object which is at least partially immersed in a liquid, and the apparatus has an injection unit which jets the processing liquid toward the processed surface of the processed object.
  • a third surface treatment apparatus having a jetting unit rotating means provided so as to face the object to be treated and having the jetting unit rotate about an axis parallel to the surface to be treated; Can also be solved.
  • the spray unit is rotated at an average rotation speed of 100 to 3000 mm / min. Further, it is preferable that the injection unit is rotated at an equivalent circle diameter of 20 to 200 mm.
  • the jetting unit jets the treatment liquid at an average flow velocity of 1 to 30 m / sec.
  • the surface treatment apparatus is for extracting the treatment liquid from the treatment tank onto the circulation path for extracting the treatment liquid from the treatment tank of the surface treatment apparatus and supplying the treatment liquid to the injection unit, and the circulation path.
  • it further comprises a pump.
  • the plating bath temperature is preferably 20 to 50.degree.
  • the average current density is preferably 1 to 30 A / dm 2 .
  • the injection portion preferably has an injection hole diameter of 1 to 5 mm.
  • the injection holes of the injection unit preferably have an average distance between adjacent injection holes of 5 to 150 mm.
  • the distance between the injection hole of the injection unit and the object is preferably 10 to 100 mm.
  • the direction of the injection unit is preferably -70 degrees to +70 degrees when the angle in the injection direction of the treatment liquid injected from the injection unit is 0 degree in the horizontal direction.
  • the first surface treatment method according to the present invention which has solved the above-mentioned problems, is a method of subjecting an object which is at least partially immersed in a liquid to a surface treatment, wherein the object to be treated is treated from the jet portion.
  • the spray unit is provided to face the object to be treated, and the spray unit is rotated in a plane parallel to the surface to be treated of the object to be treated.
  • the present invention is summarized in that the object to be treated is rotated in a plane perpendicular to the jetting direction of the treatment liquid jetted from the jetting unit, or at least one of them is performed.
  • the first surface treatment method it is preferable to rotate at least one of the object to be treated and the injection portion at an average rotation speed of 100 to 3000 mm / min. Further, it is preferable that at least one of the object to be treated or the injection portion is rotated with a circle equivalent diameter of 20 to 200 mm.
  • the above-mentioned subject is a method of performing surface treatment on a treatment subject which is at least a part of which is immersed in the liquid, and in the case of jetting the treatment liquid toward the treatment target surface of the treatment subject from the jetting unit,
  • the problem can also be solved by a second surface treatment method in which the object is inclined with respect to the liquid surface and the injection unit is rotated.
  • the jetting unit be inclined such that the treatment surface of the object to be treated and the jetting direction of the treatment liquid jetted from the jetting unit are perpendicular.
  • the above-mentioned subject is a method of performing surface treatment on an object to be treated, at least a part of which is immersed in the liquid, in which the injection portion sprays the treatment liquid toward the surface to be treated of the object.
  • This problem can also be solved by a third surface treatment method in which the object to be treated is provided opposite to the object to be treated, and the injection unit is rotated about an axis parallel to the surface to be treated.
  • the spray unit is rotated at an average rotation speed of 100 to 3000 mm / min. Further, it is preferable that the injection unit is rotated at an equivalent circle diameter of 20 to 200 mm.
  • the treatment liquid be jetted from the jet unit at an average flow velocity of 1 to 30 m / sec.
  • At least two of the objects to be processed may be prepared, and the surface to be processed of the objects to be processed may be disposed outside the processing tank.
  • the to-be-processed object may have a recessed part in surface layer.
  • the workpiece having the recess may be, for example, a printed circuit board, a semiconductor, or a wafer.
  • the surface treatment may be electrolytic plating or electroless plating.
  • the plating bath temperature is preferably 20 to 50.degree.
  • the average current density is preferably 1 to 30 A / dm 2 .
  • the angle in the jetting direction of the processing liquid jetted from the jetting unit is preferably ⁇ 70 degrees to +70 degrees, where the horizontal direction is 0 degrees.
  • the treatment liquid in performing surface treatment on the object to be treated, is injected toward the object to be treated from the injection unit provided facing the object to be treated, and at least the injection portion or the object to be treated I'm rotating one.
  • the direction of the treatment liquid injected onto the surface of the object to be treated changes in various ways, so that the treatment unevenness can be reduced and the surface treatment quality can be improved.
  • FIG. 1 is a schematic view showing a configuration example of a first surface treatment apparatus according to the present invention.
  • FIG. 2A is a side view of the injection means 21 shown in FIG. 1
  • FIG. 2B is a view showing the injection means 21 shown in FIG. (C) of 2 is a figure which showed the injection means 21 shown to (a) from the B direction.
  • FIG. 3 is a perspective view showing a connected state of the frame 33 and the motor 35.
  • FIG. 4 is a schematic view showing another configuration example of the first surface treatment apparatus according to the present invention.
  • FIG. 5 is a schematic view showing another configuration example of the first surface treatment apparatus according to the present invention.
  • FIG. 6 is a cross-sectional view showing the first surface treatment apparatus shown in FIG. 5 from the A direction.
  • FIG. 7 is a schematic view showing a configuration example of a second surface treatment apparatus according to the present invention.
  • FIG. 8 is a schematic view showing another configuration example of the second surface treatment apparatus according to the present invention.
  • FIG. 9 is a schematic view showing a configuration example of a third surface treatment apparatus according to the present invention.
  • FIG. 10 is a schematic view for explaining an injection unit rotating means for rotating the injection unit in a plane parallel to the processing surface of the object to be processed.
  • FIG. 11 is a schematic view for explaining the procedure for applying surface treatment to the object to be treated 2 using the surface treatment apparatus having the spray unit rotating means 31 shown in FIG.
  • FIG. 12 is a schematic view for explaining the procedure for applying surface treatment to the object 2 using the surface treatment apparatus having the object rotating means 61 shown in FIG.
  • FIG. 13 is a schematic view for explaining another procedure for subjecting the workpiece 2 to surface treatment using the surface treatment apparatus having the jet part rotating means 31 shown in FIG.
  • All of the first to third surface treatment methods of the present invention are methods of subjecting an object to be treated which is at least partially immersed in a liquid to a surface to be treated of the object to be treated from the jet portion. It is common in that the processing solution is being jetted.
  • the spray unit when the treatment liquid is sprayed from the spray unit toward the surface of the object to be treated, the spray unit is provided to face the object to be treated, and
  • the injection unit is rotated in a plane parallel to the processing surface of the object to be processed, or the object is rotated in a plane perpendicular to the ejection direction of the processing liquid ejected from the injection unit. It is characterized in that it makes it do or at least one of them.
  • the treatment object when the treatment liquid is jetted from the jetting unit toward the treatment surface of the treatment object, the treatment object is inclined with respect to the liquid surface, and the jetting unit is There is a feature in the place to rotate.
  • the position and the direction in which the treatment liquid injected from the injection unit comes in contact with the object to be processed change, so the treatment liquid contacts the object to be treated from various directions.
  • air bubbles attached to the surface of the object to be treated and air bubbles attached to the depressions and through holes formed on the surface of the object to be treated are easily removed and discharged. Become.
  • the treatment liquid uniformly contacts the surface of the object to be treated the treatment unevenness can be reduced and the surface treatment quality can be improved.
  • the jetting unit be inclined such that the surface to be treated of the object to be treated and the jetting direction of the treatment liquid jetted from the jetting unit are perpendicular.
  • the jetting unit when the treatment liquid is jetted from the jetting unit toward the treatment surface of the treatment target, the jetting unit is provided to face the treatment target, and the treatment target is provided
  • the injection unit is rotated about an axis parallel to the surface. The position and direction in which the processing liquid jetted from the jet unit contacts the workpiece by rotating the jet unit facing the object to be treated and rotating the jet unit around an axis parallel to the surface to be treated. Because of the fluctuation, the treatment liquid comes in contact with the object from various directions. As a result, since the treatment liquid uniformly contacts the surface of the object to be treated, the treatment unevenness can be reduced and the surface treatment quality can be improved.
  • the jetting unit and the object to be treated is rotated, and in the second and third surface treatment methods, the jetting unit is rotated.
  • Surface treatment quality can be improved.
  • the surface treatment method according to the present invention at least a part of the object to be treated is immersed in the liquid, and the treatment liquid is jetted from the jetting unit onto the object to be treated.
  • composition of the liquid for immersing the object to be treated and the composition of the treatment liquid to be sprayed from the spray unit may be the same or different.
  • the to-be-processed object should just be at least one part immersed in the liquid in a processing tank, and the whole may be immersed. Moreover, the state in which a part is immersed in the liquid in a processing tank, and the state in which all are immersed may be repeated periodically or at random, as for the said to-be-processed object.
  • the injection unit is provided toward the surface to be processed of the object to be processed, and an injection hole for injecting a treatment liquid is provided at the tip of the injection unit.
  • the injection holes will be described in detail later.
  • the jetting unit In the first surface treatment method, at least one of the jetting unit and the object to be treated is rotated, and in the second and third surface treatment methods, the jetting unit is rotated.
  • the rotation direction of the object to be treated or the injection unit is not particularly limited, and may be clockwise (forward direction) or counterclockwise (inversion direction). Also, clockwise and counterclockwise may be repeated periodically or randomly.
  • the rotation conditions of the object to be treated or the injection unit are not particularly limited, but preferable conditions are as follows.
  • the object to be treated or the injection unit be rotated at an average rotational speed of 100 to 3000 mm / min. If the average rotation speed is less than 100 mm / min, the effect of improving surface treatment quality by rotation can not be sufficiently obtained.
  • the average rotation speed is more preferably 150 mm / min or more, still more preferably 200 mm / min or more. However, when the average rotation speed exceeds 3000 mm / min, the solution in the treatment tank is agitated too much, the flow velocity of the treatment solution on the object to be treated becomes too high, and the reaction of surface treatment is not promoted. The quality may rather deteriorate.
  • the average rotation speed is more preferably 2500 mm / min or less, still more preferably 2000 mm / min or less, particularly preferably 1500 mm / min or less, most preferably 1000 mm / min or less.
  • the rotational speed may be relatively increased, and at the later stage, the rotational speed may be relatively reduced.
  • the treatment liquid reaches the back of the via hole or trench by increasing the rotation speed at the initial stage of the surface treatment, and the treatment liquid contacts the front side of the via hole or trench by decreasing the rotation speed. It can be done uniformly.
  • the rotational speed may be increased, and may be decreased with the passage of time.
  • the rotational speed may be relatively reduced, and at the later stage, the rotational speed may be relatively increased.
  • the rotational speed of the object to be treated or the injection unit be relatively large at the initial stage, and be relatively small at the late stage.
  • the above-mentioned initial stage of surface treatment means a time including at least 1/3 time with respect to the whole treatment time for spraying the treatment liquid to the treatment object, and the latter stage of the surface treatment means the treatment liquid to the treatment object It means the time including at least 1/3 time with respect to the whole processing time to inject.
  • the size when rotating the object to be treated or the injection unit is preferably a circle equivalent diameter of 20 to 200 mm (rotation radius of 10 to 100 mm). If the equivalent circle diameter is less than 20 mm, the effect of improving surface treatment quality by rotation can not be sufficiently obtained.
  • the equivalent circle diameter is more preferably 30 mm or more, still more preferably 40 mm or more. However, if the equivalent circle diameter exceeds 200 mm, the effect of improving surface treatment quality by rotation is saturated.
  • the equivalent circle diameter is more preferably 150 mm or less, still more preferably 100 mm or less.
  • the rotation locus when rotating the object to be treated or the injection unit is not particularly limited, and examples thereof include a true circle, an ellipse, a triangle, a square, a polygon, and the like, and two or more may be combined. For example, it can be rotated to draw a figure of eight.
  • At least one of the object to be treated or the injection unit may be rotated, and both may be rotated.
  • the treatment liquid By rotating both the object and the spray unit, the treatment liquid easily contacts the surface to be treated of the object, so surface treatment is promoted and the surface treatment quality is improved.
  • both In the case of rotating both the object and the injection portion, both may be rotated in the same direction, or one may be rotated clockwise and the other may be rotated counterclockwise.
  • the conditions for rotating both the object and the injection part can appropriately adjust the average rotation speed, the circle equivalent diameter, the rotation locus and the like within the above-mentioned range for each of the object and the injection part.
  • the object to be treated or the injection unit may be rocked while rotating the object to be treated or the injection unit.
  • the rotating workpiece can be reciprocated and rocked while rotating the workpiece.
  • the swinging direction is, for example, a horizontal direction with respect to the liquid surface, a vertical direction with respect to the liquid surface, or the like, and can be reciprocated in a linear direction.
  • one of the object to be treated or the injection unit may be rotated and the other may be swung.
  • the object to be processed may be rotated, and the injection unit may be reciprocated in the horizontal direction to swing.
  • the swinging direction is, for example, a horizontal direction with respect to the liquid surface, a vertical direction with respect to the liquid surface, or the like, and can be reciprocated in a linear direction.
  • the injection unit may be rocked while being rotated.
  • the swinging direction is, for example, a horizontal direction with respect to the liquid surface, a vertical direction with respect to the liquid surface, or the like, and can be reciprocated in a linear direction.
  • the swing conditions of the object to be treated or the injection unit are not particularly limited, but preferable conditions are as follows.
  • the moving distance of one way when reciprocating the processing object or the jetting unit and swinging it is preferably, for example, 5 to 500 mm. Even if the movement distance is too short or too long, the efficiency with which the treatment liquid comes in contact with the object to be treated is lowered, so it is difficult to obtain the effect of improving the surface treatment quality by the swing.
  • the movement distance is more preferably 10 mm or more, still more preferably 30 mm or more, more preferably 450 mm or less, and still more preferably 400 mm or less.
  • the time required for one reciprocation for oscillating is preferably, for example, 1 to 600 seconds. If the time is too short, the object to be treated or the jet part vibrates, and the reaction on the object to be treated hardly progresses, so that it is difficult to obtain the effect of improving the surface treatment quality by the rocking. In addition, if the time is too long, the treatment object or the jetting portion hardly swings, so that the efficiency with which the treatment liquid comes in contact with the treatment object is reduced, and it is difficult to obtain the surface treatment quality improvement effect.
  • the time required for one reciprocation is more preferably 30 seconds or more, still more preferably 60 seconds or more, more preferably 550 seconds or less, and still more preferably 500 seconds or less.
  • the treatment liquid is jetted from the jetting unit toward the surface of the object to be treated, and the preferable range of the average flow velocity of the treatment liquid jetted from the jetting unit is It is street.
  • the average flow velocity of the treatment liquid jetted from the jet unit is preferably 1 to 30 m / sec. If the average flow velocity is less than 1 m / sec, the effect of improving the surface treatment quality by the injection of the treatment liquid can not be sufficiently obtained.
  • the average flow velocity is more preferably 3 m / s or more, further preferably 5 m / s or more. However, when the average flow velocity exceeds 30 m / sec, the surface of the object to be treated may be damaged, and the surface treatment quality may be deteriorated.
  • the average flow velocity is more preferably 25 m / s or less, still more preferably 20 m / s or less.
  • the flow rate of the treatment liquid may be appropriately changed so that the average flow rate satisfies the above range.
  • the flow rate of the treatment liquid may be relatively increased, and at the later stage, the flow rate of the treatment liquid may be relatively decreased.
  • the flow rate of the treatment liquid may be increased initially and may be decreased as time passes.
  • the flow rate of the treatment liquid may be relatively reduced at the initial stage of the surface treatment, and the flow rate of the treatment liquid may be relatively increased at the later stage.
  • the flow rate of the treatment liquid may be relatively large at the initial stage and be relatively small at the late stage.
  • the treatment liquid may be jetted continuously from the jet unit or may be jetted intermittently. Intermittent injection increases the chance of the treatment liquid contacting the surface of the object to be treated, thereby promoting surface treatment. When making it inject intermittently, you may make it inject regularly, and you may make it inject randomly.
  • the objects to be treated be placed back-to-back in the treatment tank so that the treated surfaces of the objects are outside. That is, at least two of the objects to be treated may be prepared, and the surface treatment may be performed with the surface to be treated of the object to be treated placed outside in the treatment tank.
  • the surface property of the above-mentioned treated surface is not particularly limited, and may be smooth or may have a recess in the surface layer.
  • the treatment liquid can permeate to the back of the recess and the surface treatment can be performed uniformly.
  • the recess means an opening formed in the surface layer of the portion to be treated, and includes a via hole and a trench.
  • the via holes may be through holes or non-through holes in the thickness direction of the object to be treated.
  • Examples of the object to be processed having the recess include a printed circuit board, a semiconductor, and a wafer.
  • Examples of the wafer include a wafer level chip size package and a fan out wafer level package.
  • the surface treatment in addition to coating treatment for subjecting the object to be treated to plating, etc., desmear treatment for removing resin residue and the like attached during machining from the object to be treated, and before subjecting the object to be subjected to predetermined treatment. It also means that the treatment, the post-treatment after the predetermined treatment, the washing treatment to be performed before and after each treatment, and the like.
  • the coating treatment may be plating treatment, and specifically, electrolytic plating treatment or electroless plating treatment may be used.
  • Preferred conditions for the plating process are as follows.
  • the temperature of the plating bath in the plating process is preferably, for example, 20 to 50.degree. If the temperature of the plating bath is too low, it is difficult for the plating process to proceed. On the other hand, if the temperature of the plating bath is too high, uneven plating tends to occur, and the surface treatment quality is rather degraded.
  • the plating bath temperature is more preferably 23 ° C. or more, still more preferably 25 ° C. or more, more preferably 45 ° C. or less, still more preferably 40 ° C. or less.
  • the average current density of the electrolytic plating treatment is preferably, for example, 1 to 30 A / dm 2 . If the average current density is too low, the electrolytic plating process is difficult to proceed. On the other hand, if the average current density is too large, electrolytic plating unevenness is likely to occur, and the surface treatment quality is rather degraded.
  • the average current density is more preferably 3 A / dm 2 or more, still more preferably 5 A / dm 2 or more, more preferably 25 A / dm 2 or less, still more preferably 20 A / dm 2 or less.
  • the first surface treatment apparatus of the present invention is an apparatus for subjecting an object to be treated which is at least partially immersed in a liquid, and the apparatus directs the treatment liquid to the surface of the object to be treated. It has the injection part which injects, and the said injection part is provided facing the said to-be-processed object. And, an injection part rotating means for rotating the injection part in a plane parallel to the processing surface of the object to be processed, and a plane perpendicular to the injection direction of the processing liquid injected from the injection part
  • the present invention is characterized in that it has at least one of the object rotating means for rotating the object.
  • first surface treatment apparatus of the present invention A specific aspect of the first surface treatment apparatus of the present invention will be described using the drawings.
  • first surface treatment apparatus for electrolytic plating treatment on a printed circuit board will be described, the first surface treatment apparatus of the present invention is not limited to this.
  • FIG. 1 is a schematic view showing a configuration example of a first surface treatment apparatus according to the present invention, which has an injection part rotating means for rotating an injection part in a plane parallel to a processing surface of an object to be processed. doing.
  • the liquid 3 is stored in the treatment tank 1, and the entire object 2 is immersed in the liquid 3.
  • 3a indicates the level of the processing solution.
  • the transport means 4 is a means for taking the object 2 into and out of the treatment tank 1.
  • the workpiece 2 is held by the transport means 4 using the jig 5.
  • the jig guide 6 holds the jig 5.
  • the anode 7 is provided in the vicinity of the wall surface of the processing tank 1.
  • the jetting unit 21 is a unit that jets the processing liquid, and is a unit that sprays the processing liquid toward the surface 2 a of the object to be processed 2.
  • the injection unit 22 is provided in the injection unit 21, and the injection unit 22 faces the surface 2 a of the object 2 to be processed.
  • the injection unit 22 may be hereinafter referred to as a sparger.
  • the injection unit 22 is in communication with the sparger pipe 23.
  • the injection means 21 will be described in more detail with reference to FIG.
  • FIG. 2 is a side view of the injection means 21, and is the same view as the injection means 21 shown in FIG. (B) of FIG. 2 is a view showing the injection means 21 shown in (a) from the A direction, and (c) of FIG. 2 shows the injection means 21 shown in (a) from the B direction FIG.
  • a plurality of injection holes 24 are provided in the injection unit 22, and the injection holes 24 face the surface 2 a of the object 2 to be processed.
  • the distance between the injection hole 24 and the processing surface 2a of the object 2 to be processed is preferably 10 to 100 mm, for example. If the distance is too small, the surface of the object may be damaged by the force of the treatment liquid, and if the distance is too large, it is necessary to increase the flow velocity of the treatment liquid to be jetted from the jetting unit. Become.
  • the above distance is more preferably 15 mm or more, further preferably 20 mm or more, more preferably 90 mm or less, and still more preferably 80 mm or less.
  • the number in particular of the injection parts 22 is not limited,
  • size of the 1st surface treatment apparatus Can be determined in consideration of
  • the number of the injection holes 24 shown in (b) of FIG. 2 is not particularly limited, and the type of surface treatment method, conditions of surface treatment, the size of the first surface treatment apparatus (in particular, the jetting unit 22), etc. It should just be provided.
  • the circulation path 8 is a path for circulating the liquid 3, and is a path for extracting the liquid 3 from the treatment tank 1 and feeding the liquid 3 to the injection unit 22 through the sparger pipe 23 provided in the injection unit 21.
  • the circulation path 8 is provided with a pump 9 for extracting the liquid 3 from the processing tank 1 and a filter 10 for removing solid content contained in the liquid 3.
  • the circulation path 8 does not need to provide and when not providing the circulation path 8, a process liquid is supplied to the injection means 21 from the path which is not shown in figure. At the same time, it is preferable to discharge the excess liquid 3 in the processing tank 1 from a path not shown.
  • the injection means 21 is attached to the injection part rotation means 31, and the injection part 22 is configured to rotate in a plane parallel to the processing surface 2a of the object 2 to be processed. That is, the injection means 21 is held by the pipe support 32, and the pipe support 32 and the frame 33 are connected via the bracket 34.
  • FIG. 1 A perspective view showing a connection state of the frame 33 and the motor 35 is shown in FIG.
  • FIG. 3 A perspective view showing a connection state of the frame 33 and the motor 35 is shown in FIG.
  • reference numerals without parentheses shown in FIG. 3 and reference numerals with parentheses indicate the same components.
  • the frame 33 is connected to the motor 35 through shafts 36a to 36e, timing pulleys 37a to 37e, and timing belts 38a to 38c.
  • the rotational power of the motor 35 is transmitted to the frame 33 through the shaft, timing pulleys, and timing belt, so that the injection unit 22 is configured to process the processing surface 2 a of the processing object 2.
  • the rotational power of the motor 35 is transmitted to the frame 33 through the shaft, timing pulleys, and timing belt, so that the injection unit 22 is configured to process the processing surface 2 a of the processing object 2.
  • a bearing 40, a frame 40 for holding the motor 35 and the like, a movable pedestal 41 for moving the frame 40, and a rail 42 for moving the movable pedestal 41 are provided.
  • the distance between the jet portion 22 and the processing surface 2 a of the processing object 2 can be varied.
  • the treatment liquid can be uniformly brought into contact with the surface of the object to be treated, and the surface treatment quality is improved.
  • the fluctuation range of the distance between the jet portion 22 and the surface 2a to be treated is not particularly limited, but is preferably 10 to 100 mm, for example. When the fluctuation range is too small or too large, it is difficult to obtain the effect of improving the surface treatment quality by moving the object to be treated.
  • the fluctuation range is more preferably 20 mm or more, still more preferably 30 mm or more, more preferably 90 mm or less, and still more preferably 80 mm or less.
  • the conditions for changing the distance between the jet portion 22 and the surface 2a to be processed are not particularly limited, and in the initial stage of surface treatment, the distance is shortened and the distance is increased toward the end of the surface treatment. It is also good.
  • the period for moving the movable pedestal 41 in the left-right direction with respect to the paper surface is not particularly limited, but the time required for one reciprocation is preferably, for example, 1 to 300 seconds. If the time required for the one reciprocation is too short or too long, it is difficult to obtain the surface treatment quality improvement effect by varying the distance between the jet portion 22 and the surface 2a to be treated.
  • the time required for the one reciprocation is more preferably 30 seconds or more, still more preferably 60 seconds or more, more preferably 250 seconds or less, and still more preferably 200 seconds or less.
  • FIG. 1 shows an example in which the movable pedestal 41 and the rail 42 are provided to move the motor 35 and the like, the movable pedestal 41 and the rail 42 are not provided when the motor 35 and the like are not moved. Good.
  • the number of injection part rotation means 31 is not limited to one, but two or more may be provided.
  • two to-be-processed objects 2 are prepared and disposed in the processing tank 1 with the to-be-processed surface 2a of the to-be-processed substance 2 outside. It can be arranged to rotate in a plane parallel to the surface to be treated.
  • the first surface treatment apparatus shown in FIG. 4 also shows an apparatus for performing electrolytic plating on the surface of the object 2 to be treated.
  • the liquid 3 is stored in the treatment tank 1 of FIG. 4, and the object 2 is immersed in the liquid 3.
  • the to-be-processed object 2 is conveyed to the processing tank 1 by the conveying means (not shown), and is inserted into the jig support 53 along the jig guide 54 provided on the jig support 53. It is immersed in the inside.
  • FIG. 4 two objects to be processed are disposed in the processing tank 1 with the surfaces to be processed 2a and 2b as the outer side, and the jet parts 22a and 22b are provided opposite to the surfaces to be processed 2a and 2b respectively. ing.
  • the jet parts 22a and 22b are in communication with the sparger pipes 23a and 23b respectively, and the sparger pipes 23a and 23b are fixed to the processing tank 1 by the fixtures 52a and 52b and the fixtures 55a and 55b.
  • the circulation path 8 for circulating the liquid 3 in the treatment tank 1 is provided.
  • the circulation route 8 is branched into a route 8a and a route 8b on the way, and the route 8a is connected to the sparger pipe 23a, and the route 8b is connected to the sparger pipe 23b.
  • the jig support 53 is attached to the object rotation means 61, and the object 2 is rotated in a plane perpendicular to the ejection direction of the treatment liquid ejected from the ejection units 22a and 22b. Is configured. That is, the object to be processed 2 is held by the jig support 53, and the jig support 53 and the frame 33 are connected by the bracket 34.
  • the jig support 53 When connecting the jig support 53 and the object rotating means 61, for example, the jig support 53 is attached instead of the pipe support 32 shown in FIG. 3, and the object 2 to be processed is attached instead of the sparger pipe 23. Should be attached.
  • the jig support 53 is provided with the jig guide 54 as described above, and the workpiece 2 attached to the jig 5 can be inserted into the jig support 53 along the jig guide 54.
  • the workpiece 2 has the rotational power of the motor 35 transmitted to the frame 33 through the shaft, the timing pulleys, and the timing belt, so that the processing direction of the processing liquid jetted from the jetting units 22a and 22b is obtained. Rotate in a vertical plane.
  • FIG. 4 shows a configuration example in which two object rotating means 61 are provided, the number of the object rotating means 61 is not limited to two, and may be one, three or more. You may provide.
  • FIG. 1 shows the first surface treatment apparatus provided with the spray unit rotating means for rotating the spray unit in a plane parallel to the surface to be treated of the object to be treated.
  • the 1st surface treatment apparatus provided with the to-be-processed object rotation means which rotates a to-be-processed object in the surface perpendicular
  • FIG. 5 is the same as the first surface treatment apparatus shown in FIG. 1 above, in which the injection unit rotates the injection unit in a plane parallel to the surface to be treated of the object to be treated.
  • the structural example of the 1st surface treatment apparatus provided with the rotation means is shown.
  • FIG. 6 is a cross-sectional view showing the first surface treatment apparatus shown in FIG. 5 from the A direction.
  • the first surface treatment apparatus shown in FIG. 1 and the first surface treatment apparatus shown in FIG. 5 coincide in that they have means for rotating the injection portion, and in FIG. While the injector rotating means is rotated by attaching the part rotating means to the frame 33 and transmitting the rotational power of the motor 35 to the frame 33, in FIG. And the vertical frame 106 is fixed to the base frame 101 using the shaft 36i, the pin 107, and the bearings 39a to 39d.
  • FIG. 5 and FIG. 6 will be described in detail.
  • the same reference numerals as in FIGS. 1 to 4 denote the same parts in FIG. Further, in FIGS. 5 and 6, a part of the members shown in FIGS. 1 to 4 is omitted.
  • An injection portion (spurger) in communication with the sparger pipe 23 faces the surface to be treated of the object 2 to be treated, and the sparger pipe 23 is attached to the vertical frame 106.
  • the vertical frames 106 are provided in a pair so as to sandwich the processing tank 1 and are connected by a horizontal frame 102.
  • a bearing 39 c and a bearing 39 d are fixed to the vertical frame 106.
  • Pins 107 are provided so as to pass through the bearings 39c and 39d, and both ends of the pins 107 are fixed at positions deviated from the central axes of the plates 105i and 105j, respectively.
  • an axis 36i and an axis 36j are respectively connected to the centers of the plate 105i and the plate 105j.
  • a bearing 39a and a bearing 39b are fixed to the base frame 101, and a shaft 36j passing through the center of the plate 105j is connected to the bearing 39b.
  • the shaft 36i passing through the center of the plate 105i is connected to the bearing 39a, and the end of the shaft 36i is connected to the coupling 104.
  • the coupling 104 is connected to the gearbox 103 by a shaft 36k.
  • the base frame 101 is U-shaped surrounding a part of the processing tank 1, and a bearing 39 is fixed to the base frame 101. Although four bearings 39 are shown in FIG. 5, the number of the bearings 39 is not limited to this.
  • a shaft 36h is connected to the gear box 103c separately from the shaft 36k, and an end of the shaft 36h is connected to the gear box 103c. Further, the shaft 36 h is fixed by a bearing 39.
  • the first surface treatment apparatus of the present invention is not limited to these configurations.
  • the injection unit is rotated in a plane parallel to the surface to be treated of the object to be treated, and the injection unit
  • the object to be treated may be rotated in a plane perpendicular to the ejection direction of the processing liquid to be treated, that is, both the injection portion and the object to be treated may be rotated.
  • the second surface treatment apparatus of the present invention is an apparatus for subjecting an object to be treated which is at least partially immersed in a liquid, and the apparatus directs the treatment liquid to the surface of the object to be treated. It has the injection part which injects. And it has the feature in having a fixing means which inclines and fixes the above-mentioned processed thing to a liquid surface, and a point which has an injection part rotation means which rotates the above-mentioned injection part.
  • the injection part shown in FIG. 7 is the same as FIG. 6 in that it rotates about an axis parallel to the liquid surface.
  • the workpiece 2 is inclined and fixed to the liquid surface by fixing means (not shown).
  • fixing means not shown.
  • the angle ⁇ between the surface to be treated of the object 2 and the liquid surface is preferably more than 0 degrees and less than 90 degrees, more preferably 20 degrees or more, still more preferably 40 degrees or more, more preferably 80 degrees or less More preferably, it is 60 degrees or less.
  • the angle ⁇ formed by the surface to be processed of the object 2 to be processed and the liquid surface may be, for example, more than 90 degrees and less than 180 degrees.
  • the angle ⁇ is more preferably 110 degrees or more, further preferably 130 degrees or more, more preferably 170 degrees or less, still more preferably 150 degrees or less.
  • the second surface treatment apparatus of the present invention is not limited to this.
  • the same parts as those in the above-described drawings are denoted by the same reference numerals to avoid redundant description.
  • the injection part shown in FIG. 8 is the same as FIGS. 6 and 7 in that it rotates about an axis parallel to the liquid surface. Moreover, in FIG. 8, it is the same as FIG. 7 in that the to-be-processed object 2 is inclined and fixed with respect to the liquid surface by the fixing means which is not shown in figure.
  • the injection unit 22 is inclined in the middle of the sparger pipe 23 so that the treatment surface of the object 2 to be processed and the injection direction of the treatment liquid injected from the injection unit 22 become perpendicular. It further comprises tilting means 25. By adjusting the angle of the inclination means 25, the inclination angle ⁇ 1 of the injection portion 22 with respect to the liquid surface can be adjusted.
  • the treatment liquid uniformly contacts the surface of the object 2 by making the inclination angle ⁇ of the surface to be treated of the object 2 with respect to the liquid surface the same as the angle ⁇ 1 of inclination of the jet portion 22 with respect to the liquid surface. Uneven processing can be reduced, and surface treatment quality can be further improved.
  • angles ⁇ and ⁇ 1 are preferably more than 0 degrees and less than 90 degrees, more preferably 20 degrees or more, still more preferably 40 degrees or more, more preferably 80 degrees or less, still more preferably 60 degrees or less.
  • the angles ⁇ and ⁇ 1 may be, for example, more than 90 degrees and less than 180 degrees.
  • the angle ⁇ is more preferably 110 degrees or more, further preferably 130 degrees or more, more preferably 170 degrees or less, still more preferably 150 degrees or less.
  • the shortest distance from the tip of the injection hole to the surface to be processed of the object 2 is preferably, for example, 10 to 100 mm. If the shortest distance is too small, the surface of the processing object may be damaged by the force of the treatment liquid, and if the shortest distance is too large, it is necessary to increase the flow velocity of the treatment liquid to be jetted from the jetting unit. Becomes larger.
  • the shortest distance is more preferably 15 mm or more, still more preferably 20 mm or more, more preferably 90 mm or less, and still more preferably 80 mm or less.
  • the third surface treatment apparatus of the present invention is an apparatus for subjecting an object to be treated which is at least partially immersed in a liquid, and the apparatus directs the treatment liquid to the surface of the object to be treated. It has the injection part which injects. And the said injection part is provided facing the said to-be-processed object, and is characterized by the point which has the injection part rotation means which rotates the said injection part centering on an axis parallel to the said to-be-processed surface.
  • the injection part shown in FIG. 9 is the same as FIGS. 6, 7 and 8 in that it rotates about an axis parallel to the liquid surface.
  • the surface to be treated of the object to be treated 2 is fixed parallel to the liquid surface by a fixing means (not shown), and the surface to be treated of the object to be treated 2 faces the jet portion There is. That is, in the third surface treatment apparatus, the sparger pipe 23 is provided in the horizontal frame 43, and the object 2 is disposed below the injection unit 22 of the sparger pipe 23, and the injection unit and the object to be processed The surface is parallel to the liquid surface.
  • the processing liquid jetted from the jet unit 22 is jetted downward in the vertical direction.
  • a treatment liquid jetted from the jet unit 22 is provided by providing the jet unit 22 so as to face the workpiece 2 and rotating the jet unit 22 about an axis parallel to the surface of the workpiece 2 to be treated. Since the position and the direction in which the workpiece 2 contacts the workpiece 2 change, the processing liquid contacts the workpiece 2 from various directions. As a result, since the treatment liquid contacts the surface of the object 2 uniformly, the treatment unevenness can be reduced and the surface treatment quality can be improved.
  • the shortest distance from the tip of the injection hole of the injection unit 22 to the surface to be processed of the object 2 is preferably 10 to 100 mm, for example. If the shortest distance is too small, the surface of the object 2 may be damaged by the force of the treatment liquid, and if the shortest distance is too large, it is necessary to increase the flow velocity of the treatment liquid to be jetted from the jet portion 22. Equipment load increases.
  • the shortest distance is more preferably 15 mm or more, still more preferably 20 mm or more, more preferably 90 mm or less, and still more preferably 80 mm or less.
  • an injection part rotating means may be provided to rotate the injection part in a plane parallel to the surface to be treated of the object to be treated.
  • the injection unit rotating means will be described in detail with reference to FIG. The same parts as those in the above-described drawings are denoted by the same reference numerals to avoid redundant description.
  • the vertical frame 44 is connected to the horizontal frame 43, and the sparger pipe 23 is connected to the vertical frame 44.
  • the sparger pipe 23 is provided with a supply port 45 for supplying the processing liquid to the sparger pipe 23.
  • the horizontal frame 43 is provided with timing pulleys 37f to 37i in addition to the vertical frame, and the timing pulleys 37f and 37g are timing belts 38d, and the timing pulleys 37g and 37h are timing belts 38e and 37f and timings.
  • the pulleys 37i are connected by timing belts 38f.
  • the timing pulley 37 f is also connected to the motor 35 by a belt.
  • the rotational power of the motor 35 is transmitted to the horizontal frame 43 via the timing pulley and the timing belt, and the horizontal frame 43 rotates in a plane parallel to the liquid surface.
  • the vertical frame 44 connected to the horizontal frame 43 also rotates, and the sparger pipe 23 also rotates.
  • the hole diameter of the injection holes 24 is not particularly limited, but is preferably, for example, 1 to 5 mm. If the hole diameter is too small, the force of the treatment liquid in contact with the treatment object becomes too strong, and the surface of the treatment object may be damaged. If the hole diameter is too large, the treatment portion is jetted from the jetting unit Equipment load increases.
  • the pore diameter is more preferably 1.3 mm or more, further preferably 1.5 mm or more, more preferably 4 mm or less, and still more preferably 3 mm or less.
  • the injection holes 24 preferably have an average distance of 5 to 150 mm between adjacent injection holes.
  • the average distance is more preferably 10 mm or more, still more preferably 30 mm or more, more preferably 130 mm or less, and still more preferably 100 mm or less.
  • the injection holes 24 may be arranged in a rectangular grid, as shown in FIG. 2B, an orthorhombic grid, a hexagonal grid (sometimes referred to as a zigzag), or a square grid. And may be arranged in a parallel grid.
  • the jetting direction of the processing liquid jetted from the jetting holes 24 of the jetting unit 22 is not particularly limited, and when the horizontal direction is 0 degree, the jetting direction angle is, for example, in the range of -70 degrees to +70 degrees. preferable.
  • the angle in the injection direction is too large in the positive direction or in the negative direction, the treatment liquid jetted from the jet unit becomes difficult to contact the surface of the object to be treated, so the surface treatment quality improvement effect by jetting the treatment liquid is obtained. It is hard to be
  • the angle in the injection direction is more preferably ⁇ 50 degrees or more, still more preferably ⁇ 30 degrees or more, more preferably 50 degrees or less, and still more preferably 30 degrees or less.
  • the arrangement state of the injection holes 24 of the injection unit 22 is not particularly limited, and the angle may be adjusted so that the direction of all the injection holes 24 is horizontal, downward, or upward.
  • the angle may be adjusted so that the orientation of the injection holes 24 is horizontal, downward, or upward.
  • the direction may be adjusted for each of the injection holes 24.
  • the ratio of the area of the area of the injection means 21 where the injection holes 24 are provided to the area of the surface 2a of the object to be processed 2 is preferably, for example, 100 to 200%. If the ratio of the above area is too small, the treatment liquid jetted from the jet part is difficult to contact uniformly with the surface of the object to be treated, so it is difficult to obtain the effect of improving the surface treatment quality. On the other hand, even if the ratio of the area is increased, the effect of injecting the treatment liquid is saturated and wasted.
  • the ratio of the above area is more preferably 103% or more, further preferably 105% or more, more preferably 180% or less, and still more preferably 160% or less.
  • FIG. 11 is a schematic view for explaining the procedure for applying a surface treatment to the object to be treated 2 using the first surface treatment apparatus having the ejection part rotating means 31 shown in FIG.
  • the same parts as those in the above-described drawings are denoted by the same reference numerals to avoid redundant description.
  • FIG. 11 A bird's-eye view of the surface treatment equipment, and in (a) of FIG. 11, four (I to IV) first surface treatment apparatuses having the jet part rotating means 31 are arranged. .
  • a cross-sectional view of the first surface treatment apparatus shown in II of FIG. 11A from the direction A is shown in FIG. 11B.
  • the tanning tank 1 a is provided adjacent to the processing tank 1.
  • FIG. 11 although the structural example which provided the tanning tank 1a was shown, it is not necessary to provide the tanning tank 1a.
  • FIG. 11 is a conveyance apparatus which conveys the to-be-processed object 2, and can move on the rail 71 top.
  • the first surface treatment devices I to IV are disposed adjacent to the rails 71, and in (a) of FIG. 11, the transport device 4a and the first surface treatment device II are connected.
  • the workpiece 2 can be inserted into the first surface treatment apparatus II from the transfer device 4a or taken out of the first surface treatment device II into the transfer device 4a.
  • FIG. 11 shows a state in which the transfer device 4a and the first surface treatment device II are connected.
  • the workpiece 2 is held by the jig 5 on the transport device 4 a.
  • a state in which the object 2 is immersed in the liquid 3 stored in the treatment tank 1, and a state in which the object 2 inserted in the tanning tank 1a is partially immersed in the liquid 3 are dotted lines. It shows by.
  • the shutter 81a provided in the tanning tank 1a is lowered, and the processing object 2 attached to the transport device 4a is transported together with the jig 5 Slide horizontally to 4 and insert into the tanning tank 1a.
  • the shutter 81a is raised, and the liquid 3 is stored until the object 2 in the tanning tank 1a is immersed.
  • the shutter 81 b is lowered, and the jig 5 to which the object to be processed 2 is attached is slid into the processing tank 1.
  • the liquid 3 may be stored in advance in the treatment tank 1.
  • the shutter 81b When the object to be processed 2 is transferred into the processing tank 1, the shutter 81b may be raised, and the surface of the object to be processed 2 may be processed by the jetting unit rotating means 31 (not shown) in FIG. After the surface treatment of the object to be treated 2, the object to be treated 2 may be removed from the treatment tank 1 in the reverse procedure.
  • FIG. 12 is a schematic view for explaining the procedure for surface treatment of the object 2 using the first surface treatment apparatus having the object rotating means 61 shown in FIG.
  • the same parts as those in the above-described drawings are denoted by the same reference numerals to avoid redundant description.
  • FIG. 12 (a) is a bird's-eye view of the surface treatment equipment, and in FIG. 12 (a), four (I to IV) first surface treatment apparatuses having the object rotating means 61 are arranged. There is. In addition, a cross-sectional view of the first surface treatment apparatus shown in II of FIG. 12A from the A direction is shown in FIG. 12B.
  • FIG. 12 shows a state in which the transfer device 4a and the first surface treatment device II are connected.
  • the workpiece 2 is held by the jig 5 on the transport device 4 a.
  • a state in which the object 2 is immersed in the liquid 3 stored in the processing tank 1 is indicated by a dotted line.
  • the processing object 2 attached to the transfer device 4 a is slid horizontally to the upper side of the processing tank 1 together with the jig 5.
  • the workpiece 2 held by the jig 5 is dropped into the processing tank 1, and is loaded into the jig support 53 provided in the processing tank 1.
  • a jig guide 54 may be provided on the wall surface of the jig support 53, as shown in FIG.
  • the liquid 3 may be stored in advance in the treatment tank 1.
  • the surface of the object 2 is treated while rotating the object 2 by the object rotating means 61 (not shown in FIG. 12B). Good.
  • the object to be treated 2 may be removed from the treatment tank 1 in the reverse procedure.
  • FIG. 12 shows a configuration example in which one treatment tank is provided and the object 2 is dropped from above the treatment tank 1 and charged
  • the present invention is not limited to this. As shown in FIG. 11, even if the shutter is provided on the wall surface of the processing tank 1 and the object 2 is horizontally loaded into the processing tank 1 or if the hibernation tank 1 a is provided separately from the processing tank 1. Good.
  • FIG. 13 is a schematic view for explaining another procedure of subjecting the object 2 to surface treatment using the first surface treatment apparatus having the jet part rotating means 31 shown in FIG. 1 as in FIG.
  • two injection part rotation means 31 are provided.
  • the tanning tank 1a is not provided.
  • the processing surface of the processing object 2 is disposed so as to face outward, and the injection portions are provided to face the respective processing surfaces.
  • the injection unit rotates in a plane parallel to the processing surface of the workpiece 2.
  • the processing object 2 attached to the transfer device 4 a together with the jig 5 is the processing tank 1 Slide horizontally to the top of the.
  • the workpiece 2 held by the jig 5 can be dropped into the processing tank 1 and fixed by the jig guide 6 provided in the processing tank 1.
  • the liquid 3 may be stored in advance in the treatment tank 1.
  • the surface of the workpiece 2 may be treated while rotating the jetting unit by the jetting unit rotating means 31 (not shown in FIG. 13B).
  • the object to be treated 2 may be removed from the treatment tank 1 in the reverse procedure.
  • the surface treatment was performed on the surface to be treated of the object using the first surface treatment apparatus shown in FIG.
  • electrolytic plating was performed as surface treatment using the pattern and the printed circuit board with a via hole.
  • a via hole is formed as a recess.
  • the equivalent circle diameter of the opening of the via hole is 40 ⁇ m.
  • the plating bath temperature at the time of electrolytic plating was 30 ° C., and the average current density was 10 A / dm 2 .
  • the treatment liquid was sprayed from the injection unit onto the surface to be treated of the object while rotating the injection unit in a plane parallel to the surface to be treated of the object to be treated.
  • the number of the injection parts is 10, the hole diameter of the injection holes provided in each injection part is 2 mm, and the average distance between adjacent injection holes is 50 mm (that is, the injection holes are 50 mm apart in the vertical and horizontal directions), and the plane of the injection holes.
  • the array was in the form of a rectangular grid.
  • the jetting direction of the treatment liquid jetted from the jetting holes was horizontal (0 degrees).
  • the ratio of the area of the area where the injection holes are provided to the area of the surface to be treated was 110%.
  • the distance between the injection hole and the surface to be treated was 35 mm.
  • the equivalent circle diameter when rotating the above-mentioned injection part was 75 mm (rotation radius is 37.5 mm), the rotation direction was a positive direction (clockwise), and the average rotation speed was 600 mm / min.
  • the average flow velocity of the treatment liquid injected from the injection unit was 10 m / sec.
  • the surface layer of the object to be treated was measured by cross-sectional observation, and it was observed whether or not the concave portions were plated, and the surface treatment quality was evaluated. As a result, plating was performed to the back of the recess, and the surface treatment quality was good.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Chemical Treatment Of Metals (AREA)
PCT/JP2018/031065 2017-09-20 2018-08-23 表面処理装置および表面処理方法 Ceased WO2019058860A1 (ja)

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CN201880059714.6A CN111094635A (zh) 2017-09-20 2018-08-23 表面处理装置及表面处理方法
KR1020207010776A KR102401901B1 (ko) 2017-09-20 2018-08-23 표면 처리 장치 및 표면 처리 방법
SG11202002497QA SG11202002497QA (en) 2017-09-20 2018-08-23 Surface treatment apparatus and surface treatment method
EP18858558.2A EP3686320A4 (en) 2017-09-20 2018-08-23 SURFACE TREATMENT DEVICE AND SURFACE TREATMENT METHOD
US16/648,086 US11389818B2 (en) 2017-09-20 2018-08-23 Surface treatment apparatus and surface treatment method

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025041882A (ja) * 2020-03-23 2025-03-26 エーシーエム リサーチ （シャンハイ） インコーポレーテッド めっき装置及びめっき方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4028582A1 (en) * 2019-09-12 2022-07-20 Atotech Deutschland GmbH & Co. KG Apparatus for wet processing of a planar workpiece, device for a cell of the apparatus and method of operating the apparatus
CN111841967A (zh) * 2020-07-20 2020-10-30 昆山蕴鼎自动化科技有限公司 喷淋装置及电镀机
DE102023128618A1 (de) * 2023-10-18 2025-04-24 SAS Softec GmbH Abscheideanlage mit bewegten Düsen

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5642976U (enExample) * 1979-09-05 1981-04-18
JPS62274093A (ja) * 1986-05-21 1987-11-28 Hitachi Cable Ltd 帯状体へのメツキ方法
JPH11328749A (ja) * 1998-05-12 1999-11-30 Sony Disc Technology:Kk 原盤の電鋳装置と電鋳方法及びメタル原盤
JP2004359994A (ja) * 2003-06-03 2004-12-24 Sumitomo Bakelite Co Ltd 電気めっき装置および電気めっき方法
JP2005097732A (ja) * 2003-08-21 2005-04-14 Ebara Corp めっき装置
JP2006117966A (ja) * 2004-10-19 2006-05-11 Ebara Corp めっき装置及びめっき方法
JP2010530029A (ja) * 2007-06-06 2010-09-02 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング 板状製品の電気的処理用装置及び方法
JP2013011004A (ja) 2011-06-30 2013-01-17 C Uyemura & Co Ltd 表面処理装置およびめっき槽
JP2017180414A (ja) 2016-03-31 2017-10-05 株式会社豊田自動織機 圧縮機

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1431022A (en) * 1921-03-02 1922-10-03 Jr Thomas H Mumford Agitating apparatus for tanks
JPS5642976A (en) 1979-09-17 1981-04-21 Toa Gosei Chem Ind Groundinggresistance reducing agent
US4304641A (en) * 1980-11-24 1981-12-08 International Business Machines Corporation Rotary electroplating cell with controlled current distribution
US5421987A (en) * 1993-08-30 1995-06-06 Tzanavaras; George Precision high rate electroplating cell and method
US6685817B1 (en) 1995-05-26 2004-02-03 Formfactor, Inc. Method and apparatus for controlling plating over a face of a substrate
JP3364485B2 (ja) * 2001-03-07 2003-01-08 株式会社半導体先端テクノロジーズ めっき装置、及び半導体装置の製造方法
US20040084318A1 (en) * 2002-11-05 2004-05-06 Uri Cohen Methods and apparatus for activating openings and for jets plating
US7875158B2 (en) 2003-03-11 2011-01-25 Ebara Corporation Plating apparatus
JP6217312B2 (ja) * 2012-12-05 2017-10-25 アイシン精機株式会社 陽極酸化処理装置及び陽極酸化処理方法
KR101494175B1 (ko) * 2013-05-22 2015-02-17 (주)포인텍 도금조의 노즐 요동장치
EP3176288A1 (en) * 2015-12-03 2017-06-07 ATOTECH Deutschland GmbH Method for galvanic metal deposition

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5642976U (enExample) * 1979-09-05 1981-04-18
JPS62274093A (ja) * 1986-05-21 1987-11-28 Hitachi Cable Ltd 帯状体へのメツキ方法
JPH11328749A (ja) * 1998-05-12 1999-11-30 Sony Disc Technology:Kk 原盤の電鋳装置と電鋳方法及びメタル原盤
JP2004359994A (ja) * 2003-06-03 2004-12-24 Sumitomo Bakelite Co Ltd 電気めっき装置および電気めっき方法
JP2005097732A (ja) * 2003-08-21 2005-04-14 Ebara Corp めっき装置
JP2006117966A (ja) * 2004-10-19 2006-05-11 Ebara Corp めっき装置及びめっき方法
JP2010530029A (ja) * 2007-06-06 2010-09-02 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング 板状製品の電気的処理用装置及び方法
JP2013011004A (ja) 2011-06-30 2013-01-17 C Uyemura & Co Ltd 表面処理装置およびめっき槽
JP2017180414A (ja) 2016-03-31 2017-10-05 株式会社豊田自動織機 圧縮機

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025041882A (ja) * 2020-03-23 2025-03-26 エーシーエム リサーチ （シャンハイ） インコーポレーテッド めっき装置及びめっき方法

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JP2019056137A (ja) 2019-04-11
KR102401901B1 (ko) 2022-05-24
KR20200056409A (ko) 2020-05-22
SG11202002497QA (en) 2020-04-29
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EP3686320A4 (en) 2021-09-22
TW201920775A (zh) 2019-06-01

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