JP6995544B2 - 表面処理装置および表面処理方法 - Google Patents

表面処理装置および表面処理方法 Download PDF

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Publication number
JP6995544B2
JP6995544B2 JP2017180414A JP2017180414A JP6995544B2 JP 6995544 B2 JP6995544 B2 JP 6995544B2 JP 2017180414 A JP2017180414 A JP 2017180414A JP 2017180414 A JP2017180414 A JP 2017180414A JP 6995544 B2 JP6995544 B2 JP 6995544B2
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JP
Japan
Prior art keywords
treated
surface treatment
injection
treatment
injection unit
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Application number
JP2017180414A
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English (en)
Japanese (ja)
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JP2019056137A (ja
JP2019056137A5 (enExample
Inventor
朋士 奥田
大輔 松山
眞司 立花
雅之 内海
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C Uyemura and Co Ltd
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C Uyemura and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority to JP2017180414A priority Critical patent/JP6995544B2/ja
Application filed by C Uyemura and Co Ltd filed Critical C Uyemura and Co Ltd
Priority to SG11202002497QA priority patent/SG11202002497QA/en
Priority to US16/648,086 priority patent/US11389818B2/en
Priority to EP18858558.2A priority patent/EP3686320A4/en
Priority to KR1020207010776A priority patent/KR102401901B1/ko
Priority to PCT/JP2018/031065 priority patent/WO2019058860A1/ja
Priority to CN201880059714.6A priority patent/CN111094635A/zh
Priority to TW107131845A priority patent/TWI745617B/zh
Publication of JP2019056137A publication Critical patent/JP2019056137A/ja
Publication of JP2019056137A5 publication Critical patent/JP2019056137A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B3/00—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements
    • B05B3/02—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/18—Processes for applying liquids or other fluent materials performed by dipping
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C23C18/163—Supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1642—Substrates other than metallic, e.g. inorganic or organic or non-conductive semiconductor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
    • B05C3/02—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
    • B05C3/04—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material with special provision for agitating the work or the liquid or other fluent material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/08—Rinsing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Chemical Treatment Of Metals (AREA)
JP2017180414A 2017-09-20 2017-09-20 表面処理装置および表面処理方法 Active JP6995544B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2017180414A JP6995544B2 (ja) 2017-09-20 2017-09-20 表面処理装置および表面処理方法
US16/648,086 US11389818B2 (en) 2017-09-20 2018-08-23 Surface treatment apparatus and surface treatment method
EP18858558.2A EP3686320A4 (en) 2017-09-20 2018-08-23 SURFACE TREATMENT DEVICE AND SURFACE TREATMENT METHOD
KR1020207010776A KR102401901B1 (ko) 2017-09-20 2018-08-23 표면 처리 장치 및 표면 처리 방법
SG11202002497QA SG11202002497QA (en) 2017-09-20 2018-08-23 Surface treatment apparatus and surface treatment method
PCT/JP2018/031065 WO2019058860A1 (ja) 2017-09-20 2018-08-23 表面処理装置および表面処理方法
CN201880059714.6A CN111094635A (zh) 2017-09-20 2018-08-23 表面处理装置及表面处理方法
TW107131845A TWI745617B (zh) 2017-09-20 2018-09-11 表面處理裝置及表面處理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017180414A JP6995544B2 (ja) 2017-09-20 2017-09-20 表面処理装置および表面処理方法

Publications (3)

Publication Number Publication Date
JP2019056137A JP2019056137A (ja) 2019-04-11
JP2019056137A5 JP2019056137A5 (enExample) 2020-10-08
JP6995544B2 true JP6995544B2 (ja) 2022-01-14

Family

ID=65811125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017180414A Active JP6995544B2 (ja) 2017-09-20 2017-09-20 表面処理装置および表面処理方法

Country Status (8)

Country Link
US (1) US11389818B2 (enExample)
EP (1) EP3686320A4 (enExample)
JP (1) JP6995544B2 (enExample)
KR (1) KR102401901B1 (enExample)
CN (1) CN111094635A (enExample)
SG (1) SG11202002497QA (enExample)
TW (1) TWI745617B (enExample)
WO (1) WO2019058860A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4028582A1 (en) * 2019-09-12 2022-07-20 Atotech Deutschland GmbH & Co. KG Apparatus for wet processing of a planar workpiece, device for a cell of the apparatus and method of operating the apparatus
WO2021189181A1 (en) * 2020-03-23 2021-09-30 Acm Research (Shanghai) , Inc. Plating apparatus and plating method
CN111841967A (zh) * 2020-07-20 2020-10-30 昆山蕴鼎自动化科技有限公司 喷淋装置及电镀机
DE102023128618A1 (de) * 2023-10-18 2025-04-24 SAS Softec GmbH Abscheideanlage mit bewegten Düsen

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002266098A (ja) 2001-03-07 2002-09-18 Semiconductor Leading Edge Technologies Inc めっき装置、及び半導体装置の製造方法
JP2004359994A (ja) 2003-06-03 2004-12-24 Sumitomo Bakelite Co Ltd 電気めっき装置および電気めっき方法
JP2005097732A (ja) 2003-08-21 2005-04-14 Ebara Corp めっき装置
JP2010530029A (ja) 2007-06-06 2010-09-02 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング 板状製品の電気的処理用装置及び方法

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JPS592116Y2 (ja) * 1979-09-05 1984-01-20 松下電器産業株式会社 メッキ装置
JPS5642976A (en) 1979-09-17 1981-04-21 Toa Gosei Chem Ind Groundinggresistance reducing agent
US4304641A (en) * 1980-11-24 1981-12-08 International Business Machines Corporation Rotary electroplating cell with controlled current distribution
JPS62274093A (ja) * 1986-05-21 1987-11-28 Hitachi Cable Ltd 帯状体へのメツキ方法
US5421987A (en) * 1993-08-30 1995-06-06 Tzanavaras; George Precision high rate electroplating cell and method
US6685817B1 (en) 1995-05-26 2004-02-03 Formfactor, Inc. Method and apparatus for controlling plating over a face of a substrate
JPH11328749A (ja) * 1998-05-12 1999-11-30 Sony Disc Technology:Kk 原盤の電鋳装置と電鋳方法及びメタル原盤
US20040084318A1 (en) * 2002-11-05 2004-05-06 Uri Cohen Methods and apparatus for activating openings and for jets plating
WO2004081261A2 (en) 2003-03-11 2004-09-23 Ebara Corporation Plating apparatus
JP2006117966A (ja) * 2004-10-19 2006-05-11 Ebara Corp めっき装置及びめっき方法
JP5731917B2 (ja) 2011-06-30 2015-06-10 上村工業株式会社 表面処理装置およびめっき槽
JP6217312B2 (ja) * 2012-12-05 2017-10-25 アイシン精機株式会社 陽極酸化処理装置及び陽極酸化処理方法
KR101494175B1 (ko) * 2013-05-22 2015-02-17 (주)포인텍 도금조의 노즐 요동장치
EP3176288A1 (en) * 2015-12-03 2017-06-07 ATOTECH Deutschland GmbH Method for galvanic metal deposition
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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002266098A (ja) 2001-03-07 2002-09-18 Semiconductor Leading Edge Technologies Inc めっき装置、及び半導体装置の製造方法
JP2004359994A (ja) 2003-06-03 2004-12-24 Sumitomo Bakelite Co Ltd 電気めっき装置および電気めっき方法
JP2005097732A (ja) 2003-08-21 2005-04-14 Ebara Corp めっき装置
JP2010530029A (ja) 2007-06-06 2010-09-02 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング 板状製品の電気的処理用装置及び方法

Also Published As

Publication number Publication date
EP3686320A1 (en) 2020-07-29
KR102401901B1 (ko) 2022-05-24
JP2019056137A (ja) 2019-04-11
US11389818B2 (en) 2022-07-19
WO2019058860A1 (ja) 2019-03-28
TW201920775A (zh) 2019-06-01
CN111094635A (zh) 2020-05-01
SG11202002497QA (en) 2020-04-29
TWI745617B (zh) 2021-11-11
EP3686320A4 (en) 2021-09-22
US20200276608A1 (en) 2020-09-03
KR20200056409A (ko) 2020-05-22

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