Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
  • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J7/00—Adhesives in the form of films or foils
  • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
  • C09J7/29—Laminated material
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
  • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
  • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Definitions

• the present invention relates to a substrate film for dicing, which is adhered and fixed to a semiconductor wafer when the semiconductor wafer is diced into chips.
• An object of the present invention is to provide a substrate film for dicing having high heat recovery and excellent rack recovery.
• Another object of the present invention is to provide a substrate film for dicing which is uniformly stretched even when expanding is performed under low temperature conditions.
• the present invention is also favorable even if the expand is performed under low temperature conditions (-15 to 5 ° C.) and high speed conditions.
• An object of the present invention is to provide a substrate film for dicing which is stretched.
• a sheet (a dicing film including a substrate film for dicing) in which a product being processed remains after an expanding step. At that time, if the slack remains in the sheet, it tends to lead to problems such as that the product can not be stored well in a rack, the products collide with each other, and a defect occurs.
• the rack is a name used in the industry, and is also called a zipper or a case.
• heat shrinkage and restoration technology This is a thing of shrinking the part by heating the slack part which arose by the expanding process, and eliminating slack (a thing with a high restoration rate by heat contraction).
• the dicing film expands well and the semiconductor wafer and the die bond layer are cut well (divided) Is required.
• the present inventor has intensively studied to solve the above-mentioned problems.
• a substrate film for dicing includes a structure in which the following surface layer / intermediate layer / backing layer is laminated in order, and a polyurethane resin is used for the intermediate layer, so that a sheet after the expanding step (dicing film including substrate film for dicing) It has been found that the sagging is well eliminated by the heat shrink technology (heat shrinkage technology).
• the dicing base film of the above-mentioned substrate film is uniformly stretched even when the expansion is carried out under low temperature conditions. It was found that the dicing film was well stretched even when the above-mentioned substrate film for dicing was expanded under high-speed conditions in addition to low-temperature conditions.
• Item 1 It is a base film for dicing including the structure laminated
• Item 2 The base film for dicing according to the above item 1, wherein the surface layer and / or the back layer is a single layer or a multilayer.
• the polyethylene-based resin is branched low density polyethylene (LDPE), linear low density polyethylene (LLDPE), ethylene-vinyl acetate copolymer (EVA), ethylene-methyl acrylate copolymer (EMA), ethylene- At least one resin selected from the group consisting of ethyl acrylate copolymer, ethylene-butyl acrylate copolymer, ethylene-methyl methacrylate copolymer (EMMA), ethylene-methacrylic acid copolymer (EMAA), and ionomer resin 3.
• LDPE low density polyethylene
• LLDPE linear low density polyethylene
• EVA ethylene-vinyl acetate copolymer
• EMA ethylene-methyl acrylate copolymer
• EMMA ethylene-methyl methacrylate copolymer
• EMMA ethylene-methacrylic acid copolymer
• ionomer resin ionomer resin
• Item 4 The substrate film for dicing according to any one of Items 1 to 3, wherein the polyurethane resin is a thermoplastic polyurethane resin (TPU).
• TPU thermoplastic polyurethane resin
• Item 5 A dicing film wherein an adhesive layer and a die bond layer are provided in this order on the surface side of the substrate film for dicing according to any one of Items 1 to 4.
• the substrate film for dicing of the present invention By using the substrate film for dicing of the present invention, collection of used dicing films into a rack can be performed more quickly and easily. That is, the substrate film for dicing of the present invention has high heat recovery, that is, it exhibits good heat shrinkability and is excellent in rack recovery.
• the dicing film is uniformly stretched even when expanding is performed under low temperature conditions.
• the dicing film may be expanded even under low temperature conditions and high speed conditions. Stretches well.
• the present invention relates to a substrate film for dicing.
• the present invention relates to a dicing film in which an adhesive layer and a die bonding layer are provided in this order on a substrate film for dicing.
• Substrate film for dicing is It is characterized by including the composition laminated in order of surface / middle class / back layer.
• the surface layer and / or the back layer be a single layer or a multilayer.
• the surface layer is made of a resin composition containing a polyethylene resin.
• branched low density polyethylene LDPE
• linear low density polyethylene LLDPE
• ethylene-vinyl acetate copolymer EVA
• EMA ethylene-methyl acrylate copolymer
• EMMA ethylene-methyl methacrylate copolymer
• EMMA ethylene-methacrylic acid copolymer
• ionomer resin ionomer resin
• the surface layer is excellent in the expandability of the substrate film for dicing, that is, the tensile properties of the substrate, by being made of the resin composition containing at least one of these components.
• a polypropylene-based resin may be blended.
• the melt flow rate (MFR) at 190 ° C. of ethylene-vinyl acetate copolymer (EVA) may be about 30 g / 10 min or less, preferably about 20 g / 10 min or less, and more preferably about 15 g / 10 min or less Preferably, about 10 g / 10 minutes or less is more preferable.
• MFR of EVA is preferably about 0.1 g / 10 min or more, and more preferably about 0.3 g / 10 min or more, in order to facilitate extrusion of the resin.
• the density of EVA is preferably about 0.9 ⁇ 0.96g / cm 3, more preferably about 0.92 ⁇ 0.94g / cm 3.
• the melt flow rate (MFR) at 190 ° C. of the branched low density polyethylene (LDPE) is preferably about 10 g / 10 min or less, and more preferably about 6 g / 10 min or less.
• the density of LDPE is preferably about 0.9 ⁇ 0.94g / cm 3, more preferably about 0.91 ⁇ 0.93g / cm 3.
• the melt flow rate (MFR) at 190 ° C. of linear low density polyethylene (LLDPE) is preferably about 10 g / 10 min or less, and more preferably about 6 g / 10 min or less.
• the density of LLDPE is preferably about 0.9 ⁇ 0.94g / cm 3, more preferably about 0.91 ⁇ 0.93g / cm 3.
• melt flow rate is determined in accordance with ISO 1133, and the density is determined in accordance with ISO 1183-1: 2004.
• the surface layer may further contain an antistatic agent, if necessary.
• the antistatic agent that can be used in the surface layer can also be used in the surface layer.
• known surfactants such as anion type, cation type and nonionic type can be selected.
• nonionic agents such as PEEA resin and hydrophilic PO resin from the viewpoint of durability and durability. Surfactants are preferred.
• the content of the antistatic agent is preferably about 5 to 25% by weight, more preferably about 7 to 22% by weight, of the antistatic agent in the resin composition of the surface layer.
• the substrate film for dicing of the present invention in which the antistatic agent is contained in the above-mentioned range is preferable because the surface resistivity of the back surface thereof is about 10 7 to 10 12 ⁇ / ⁇ .
• An antiblocking agent may be further added to the surface layer.
• the addition of the antiblocking agent is preferable because blocking such as when the substrate film for dicing is rolled up is suppressed.
• As the antiblocking agent inorganic or organic fine particles can be exemplified.
• the back layer is made of a resin composition containing a polyethylene-based resin, as in the surface layer.
• a polyethylene-based resin used for the surface layer may be used, or a polyethylene-based resin different from the surface layer may be used.
• an antistatic agent or an antiblocking agent may be contained.
• the surface layer and / or the back layer may be a single layer or a multilayer.
• the substrate film for dicing of the present invention can be provided with a plurality of surface layers and / or back layers, if necessary.
• the surface layer and / or the back layer are composed of multiple layers, they are represented as surface layer-1, surface layer-2, surface layer-3, ... in order from the outermost layer side, and back layer-1 in reverse order from the back layer side. It is represented as layer-2, back layer-3,.
• the intermediate layer is made of a resin composition containing a polyurethane resin (PU).
• the PU is preferably a thermoplastic polyurethane resin (TPU).
• the middle layer which consists of a resin composition containing polyurethane system resin (PU) for a substrate film for dicing.
• the substrate film for dicing has an intermediate layer made of a resin composition containing a polyurethane resin (PU), low temperature conditions and high speed conditions, for example, when cutting (dividing) a semiconductor wafer and a die bond layer after stealth dicing. Even if the expansion is carried out in the above, the dicing film stretches well.
• PU polyurethane resin
• TPU thermoplastic polyurethane resin
• PU polyurethane resin
• TPU is obtained by reacting a polyisocyanate, a polyol and a chain extender, and comprises a soft segment produced by the reaction of a polyol and a polyisocyanate and a hard segment produced by the reaction of a chain extender and a polyisocyanate. Block copolymers.
• polyisocyanate examples include diphenylmethane diisocyanate, hexamethylene diisocyanate, tolidine diisocyanate, 1,5-naphthalene diisocyanate, isophorone diisocyanate, xylylene diisocyanate and the like.
• diphenylmethane diisocyanate and / or hexamethylene diisocyanate is preferred in view of the abrasion resistance of the thermoplastic polyurethane resin.
• polyester polyol examples include polytetramethylene ether glycol, polyester polyol, lactone polyester polyol and the like. Polyester polyols are obtained by the polycondensation reaction of dicarboxylic acids and diols.
• diol used for producing the polyester polyol examples include ethanediol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol and the like. Or in combination.
• examples of the dicarboxylic acid used in the present invention include adipic acid and sebacic acid, and these are used alone or in combination.
• polytetramethylene ether glycol is preferable in that a thermoplastic polyurethane resin can obtain high impact resilience.
• the number average molecular weight of such a polyol is preferably 1,000 to 4,000, and it is particularly preferable that the number average molecular weight is 2,000 to 3,000.
• chain extender for example, aliphatic linear diol having 2 to 6 carbon atoms such as ethanediol, 1,4-butanediol, 1,6-hexanediol, 1,4-bis (hydroxyethoxy) Benzene and the like can be mentioned.
• Amines such as hexamethylenediamine, isophoronediamine, tolylenediamine, monoethanolamine and the like can also be used partially in combination.
• aliphatic straight chain diols having 2 to 6 carbon atoms are preferable in view of the abrasion resistance of the thermoplastic polyurethane resin.
• the density of the thermoplastic polyurethane resin is preferably about 1.1 ⁇ 1.5g / cm 3, more preferably about 1.1 ⁇ 1.3g / cm 3.
• thermoplastic polyurethane resin can manufacture said raw material using well-known methods, such as a one-shot method and a prepolymer method.
• Examples of PU include Pandex manufactured by D.I. C. Vesturopolymer Co., Ltd., and Milactolan manufactured by Japan Miractoran Co., Ltd.
• the intermediate layer may include (ii) a polyethylene-based resin in addition to the (i) PU described above.
• the polyethylene resin can be a resin usable in the surface layer.
• the same resin as the polyethylene-based resin used in the surface layer may be used for the intermediate layer, or a resin different from the polyethylene-based resin used in the surface layer may be used. It is preferable to use ethylene-methacrylic acid copolymer (EMAA) as the polyethylene resin together with the above-mentioned PU.
• EEMA ethylene-methacrylic acid copolymer
• the content of the polyethylene resin in the intermediate layer is preferably 0 to 80% by weight, and more preferably 0 to 70% by weight.
• the expandability of the substrate film for dicing that is, the tensile property is good.
• the substrate film for dicing of the present invention includes a configuration in which a surface layer / intermediate layer / back layer is laminated in order.
• the surface layer is a layer in contact with the wafer and in contact with the adhesive layer.
• the intermediate layer may form a layer (monolayer) with each resin alone, may form a layer (monolayer) with a mixture of resins, or may form a layer (multilayer) for each resin. good.
• the surface layer and / or the back layer is preferably a single layer or a multilayer.
• LDPE, EVA, etc. may form a layer (single layer) with each resin, or a layer (single layer) may be formed with a mixture of resins, and each layer (multilayer) You may form
• the total thickness of the substrate film for dicing of the present invention is preferably about 50 to 300 ⁇ m, more preferably about 70 to 200 ⁇ m, and still more preferably about 80 to 150 ⁇ m.
• the ratio of the thickness of the surface layer and the back layer is preferably about 4 to 80%, more preferably about 10 to 60%, with respect to the total thickness of the substrate film for dicing.
• the ratio of the thickness of the intermediate layer to the total thickness of the substrate film for dicing is preferably about 20 to 96%, and more preferably about 40 to 90%.
• the substrate film for dicing As a specific example of the substrate film for dicing, the case where the total thickness of the substrate film for dicing is about 60 to 100 ⁇ m will be described.
• the thickness of the surface layer and the back layer is preferably about 2 to 44 ⁇ m each, and more preferably about 10 to 38 ⁇ m each.
• each layer may be formed within the above thickness range as a total thickness.
• the thickness of the intermediate layer is preferably about 12 to 96 ⁇ m, and more preferably about 24 to 80 ⁇ m.
• each layer may be formed within the above thickness range as a total thickness.
• Example with 3 types and 5 layers (Surface-1 / Surface-2 / Intermediate / Back layer-2 / Back layer-1)
• the total thickness of the surface layer-1 and the surface layer-2 is in the range of the thickness of the surface layer
• the total thickness of the back layer-1 and the back layer-2 Is the range of the thickness of the back layer.
• the surface layer-1 and the surface layer-2 may use polyethylene resins of the same type, or different polyethylene resins.
• the back layer 1 and the back layer 2 may use polyethylene resins of the same type, or different polyethylene resins.
• the EVA used for the surface layer 2 and the back layer 2 has a vinyl group content (compared to the EVA used for the surface layer 1 and the back layer 1 It is preferable to use EVA having a high VA content).
• EVA having a VA content of about 5 to 15% by weight, and more preferably about 7 to 13% by weight.
• EVA having a VA content of about 15 to 33% by weight, and more preferably about 28 to 33% by weight.
• EVA having a high melt flow rate MFR
• MFR melt flow rate
• the MFR at 190 ° C. of EVA is preferably about 0.1 g / 10 minutes to 10 g / 10 minutes, and more preferably about 5 g / 10 minutes to 10 g / 10 minutes.
• MFR at 190 ° C. of EVA is preferably about 10 g / 10 minutes to 40 g / 10 minutes, and more preferably about 12 g / 10 minutes to 35 g / 10 minutes.
• the base film for dicing of the surface layer / intermediate layer / back layer can be produced by multi-layer coextrusion molding of the resin composition for the surface layer, the intermediate layer and the back layer.
• the resin composition for surface layer, the resin composition for intermediate layer, and the resin composition for back layer are manufactured by co-extrusion so as to be laminated in the order of surface layer / intermediate layer / back layer. Can.
• the resin composition for each surface layer and the back layer is charged into each extruder, for example, surface layer-1 / surface layer-2 / intermediate layer / back layer It can be manufactured by coextrusion so as to be laminated in the order of -2 / back layer-1.
• an antistatic agent can be further added to the resin composition constituting the surface layer. The same is true for the back layer.
• the resin for each layer described above is supplied to the screw extruder in this order, extruded from a multilayer T die at 180 to 240 ° C. into a film, and cooled while passing through a cooling roll at 30 to 70 ° C. It pulls away without stretching.
• the resin for each layer may be once obtained as pellets and then extruded as described above.
• substantially non-stretching refers to non-stretching or slight stretching to such an extent that the extension of the dicing film is not adversely affected. In general, it is sufficient that the film is pulled to such an extent that no sag occurs when taking up the film.
• the dicing film of the present invention can be produced according to known techniques.
• the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer is dissolved in a solvent such as an organic solvent, the solution is applied on a substrate film for dicing, and the solvent is removed to obtain a film of a substrate film / pressure-sensitive adhesive layer.
• a solvent such as an organic solvent
• the resin composition which comprises a die-bonding layer is dissolved in solvent, such as an organic solvent, it apply
• solvent such as an organic solvent
• a dicing film is produced by superimposing the pressure-sensitive adhesive layer and the die-bonding layer so as to face each other. Thereby, the film of the structure of a base film / adhesive layer / die-bonding layer can be obtained. At this stage, the die bonding layer is bonded to the semiconductor wafer and the adhesive layer in a weak (pseudo) bonding state.
• the divided semiconductor chip and die bonding layer are stacked on a predetermined package or semiconductor chip, heated to a temperature at which the die bonding layer is strongly bonded, and bonded.
• PE-1 to 9 Polyethylene resin 1 to 9 SEBS: Styrene-Butadiene Copolymer Hydrogen Additive (Styrene-Ethylene-Butylene-Styrene Copolymer)
• TPU Thermoplastic polyurethane (PU)
• Amorphous PO amorphous polyolefin LDPE: branched low density polyethylene
• EVA ethylene-vinyl acetate copolymer
• VA content vinyl acetate content ratio
• EMAA ethylene-methacrylic acid copolymer
• MAA content methacrylic acid content
• St content Styrene content ratio (content of vinyl aromatic hydrocarbon (St) component in vinyl aromatic hydrocarbon resin)
• the resin composition constituting each layer is introduced into the respective extruders adjusted to 220 ° C. and extruded by a 220 ° C. T die so as to be in the order of surface layer / interlayer / back layer, laminated at 30 ° C. Cooling water was co-extruded on a circulating chill roll to obtain a flat three-layer film.
• the resin composition constituting each layer is introduced into the respective extruders adjusted to 220 ° C., and in the order of surface layer-1 / surface layer-2 / intermediate layer / back layer-2 / back layer-1, 220
• the mixture was extruded through a T-die, laminated, and co-extruded on a chill roll circulating cooling water of 30 ° C. to obtain a flat five-layer film.
• the film was processed so that the distance between chucks was 40 mm with a width of 10 mm at a tensile speed of 200 mm / min in the MD direction (extrusion direction of film forming) and TD direction (width direction of film formed by film forming) SS curves (stress-strain curves) were obtained using film samples.
• the stress value at an elongation of 25% of the obtained SS curve was read.
• the ratio of the stress value at an elongation rate of 25% in the MD direction to the stress value at an elongation rate of 25% in the TD direction was determined as a modulus ratio (MD / TD).
• the substrate film for dicing exhibits good uniform expandability (uniform Ex property) under low temperature conditions of -15 to 5 ° C.
• ⁇ Evaluation criteria> High-speed tensile test evaluation (mechanical properties)
• ⁇ The tensile elongation at break in the MD and TD directions is 120% or more.
• X The tensile elongation at break in the MD and TD directions is less than 120%.
• the tensile speed is set to 250 mm / sec and a tensile test is performed to evaluate the expandability under high speed conditions in addition to the low temperature conditions.
• a tensile test is performed to evaluate the expandability under high speed conditions in addition to the low temperature conditions.
• the tensile elongation at break in the MD and TD directions of the film is 120% or more, for example, after stealth dicing, when expanding under low temperature conditions (-15 to 5 ° C.) and high speed conditions, the film is good To stretch.
• the chuck After holding for 10 seconds with 200% elongation, the chuck was returned to the original position, the chuck was opened, and the sample was shrunk under the above condition 2.
• Recovery rate [%] ⁇ (120-L) / 80 ⁇ ⁇ 100 The recovery rate was measured in both the MD direction and the TD direction, and this was expressed as heat shrinkability (HS property).
• the substrate film for dicing exhibits good heat shrinkability (HS property) under an environment of 80 ° C.
• the substrate film for dicing exhibits good uniform heat shrinkability (uniform HS property) under the condition of 80 ° C.
• the dicing film of the substrate film for dicing (Examples 1 to 12) of the present invention was uniformly stretched even when expanding was performed under low temperature conditions.
• the value of the heat shrink property was a significantly large value as compared with the comparative example. That is, the substrate film for dicing of the present invention had better heat shrinkability.
• Example 2 The low temperature expandability (Ex property) was acceptable in both of the substrate films for dicing of the present invention (examples) and comparative examples.
• the substrate film for dicing of the present invention (Example) was excellent in low-temperature high-speed expandability (low-temperature high-speed Ex property) as compared with the comparative example.
• the dicing film shrinks its part by heating the slack part generated even after passing through the expanding step, and the slack is eliminated. can do.
• the dicing film (sheet) has a high recovery ratio due to heat shrinkage.
• the substrate film for dicing of the present invention By using the substrate film for dicing of the present invention, collection of used dicing films into a rack can be performed more quickly and easily. That is, the substrate film for dicing of the present invention has high heat recovery, and the dicing film is uniformly recovered. That is, heat shrinkability is exhibited well and rack recovery is excellent. Further, products using the substrate film for dicing of the present invention do not collide with each other, and no defect occurs.
• the expandability is good and the dicing film is uniformly stretched even when expanding is performed under low temperature conditions.
• the semiconductor wafer and the die bond layer are collectively cut well (split) in the expand performed under low temperature conditions.
• the substrate film for dicing of the present invention When the substrate film for dicing of the present invention is used, in particular, when stealth dicing, the semiconductor wafer and the die bond layer are cut (divided), expandability is achieved even when expand is performed under low temperature conditions and high speed conditions. Is good, and the dicing film stretches well.
• the substrate film for dicing of the present invention When the substrate film for dicing of the present invention is used, the semiconductor wafer and the die bond layer are collectively cut well (split) in the expand performed under the low temperature condition and the high speed condition.
• the miniaturization of the semiconductor product proceeds, and while the sheet is required to be expanded (expandability), the sheet becomes a sheet having higher expandability and shrinkage.

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• Engineering & Computer Science (AREA)
• Organic Chemistry (AREA)
• Chemical & Material Sciences (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Physics & Mathematics (AREA)
• Power Engineering (AREA)
• Dicing (AREA)
• Adhesive Tapes (AREA)
• Adhesives Or Adhesive Processes (AREA)
• Polishing Bodies And Polishing Tools (AREA)
• Wire Bonding (AREA)
• Laminated Bodies (AREA)

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• 2018
  • 2018-08-06 CN CN201880043105.1A patent/CN110800084A/zh active Pending
  • 2018-08-06 KR KR1020197036854A patent/KR20200045444A/ko active Application Filing
  • 2018-08-06 WO PCT/JP2018/029385 patent/WO2019039253A1/ja active Application Filing
  • 2018-08-06 KR KR1020237038440A patent/KR20230157537A/ko not_active Application Discontinuation
  • 2018-08-06 JP JP2019538045A patent/JP7421339B2/ja active Active
  • 2018-08-21 TW TW107129168A patent/TWI813582B/zh active
• 2023
  • 2023-10-24 JP JP2023182491A patent/JP2024008947A/ja active Pending

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