WO2018219302A1 - 搬运装置及其搬运方法 - Google Patents

搬运装置及其搬运方法 Download PDF

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Publication number
WO2018219302A1
WO2018219302A1 PCT/CN2018/089071 CN2018089071W WO2018219302A1 WO 2018219302 A1 WO2018219302 A1 WO 2018219302A1 CN 2018089071 W CN2018089071 W CN 2018089071W WO 2018219302 A1 WO2018219302 A1 WO 2018219302A1
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WO
WIPO (PCT)
Prior art keywords
carrying
transported
handling device
station
wafer cassette
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Application number
PCT/CN2018/089071
Other languages
English (en)
French (fr)
Inventor
张玉地
甄静
Original Assignee
上海微电子装备（集团）股份有限公司
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Publication date
Application filed by 上海微电子装备（集团）股份有限公司 filed Critical 上海微电子装备（集团）股份有限公司
Priority to KR1020197036771A priority Critical patent/KR20200007897A/ko
Priority to JP2019566157A priority patent/JP2020523780A/ja
Priority to US16/618,314 priority patent/US20200118864A1/en
Publication of WO2018219302A1 publication Critical patent/WO2018219302A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Definitions

  • the present invention relates to the field of semiconductor manufacturing, and in particular to a handling device and a method of transporting the same.
  • FIG. 1 is a schematic view showing a high-position arrangement of a mechanical arm of a handling device
  • FIG. 2 is a distribution diagram of a center of gravity of the mechanical arm shown in FIG. 1
  • FIG. 3 is a schematic view showing a low-position arrangement of a mechanical arm of another handling device.
  • the robot arm 103 is mounted above the wafer loading position, and the plurality of wafer cassettes 101 are vertically arranged vertically.
  • the robot arm 103 is provided with a robot 102 at the end thereof, and the robot 102 is horizontally raised from the wafer cassette 101.
  • the handle or the top flange of the wafer cassette 101 enables pick-and-place of the wafer cassette 101; however, the center of gravity of the robot arm 103 is relatively high, which tends to cause the handling device to tip over while the handling device is subjected to the maximum payload of the robot arm 103. Restricted, overload self-protection is easy to occur when grabbing a 12-inch full-loading cassette.
  • the center of gravity distribution of the robot arm 103 of FIG. 1 is as shown in FIG.
  • the abscissa is the displacement of the center of gravity of the arm, the unit is mm, and the ordinate is the height of the center of gravity of the arm from the ground in millimeters; the arm grabs the wafer
  • the position of the center of gravity of the arm is the point B in the figure.
  • the center of gravity of the arm moves between points A and B as shown in the figure, or at point B. Move between the point C and C.
  • the robot arm 203 is mounted on the lower side of the wafer cassette loading position, and the plurality of wafer cassettes 201 are vertically arranged vertically. Specifically, the robot arm 203 is provided with a robot 202 at the end thereof, and the robot 202 grabs the wafer cassette 201.
  • the top flange realizes the pick-and-place of the wafer cassette 201; the movement path of the robot arm 203 of the conveying device is long, and the trajectory is complicated.
  • the above-mentioned handling method can only transport a maximum of two wafer cassettes in a single operation, and the overall carrying capacity is small, and as the 12-inch wafer cassette is widely used in production, the requirements for the handling device are also increasing. Therefore, it is necessary to develop a conveying device capable of satisfying a small space, a large volume, a uniform trajectory, and high efficiency, and a conveying method thereof.
  • the present invention provides a handling device comprising a movable transport mechanism; a carrying platform having a bearing surface parallel to a horizontal plane for carrying an object to be transported, the bearing surface having a defined circumferential direction a carrying station for placing the object to be transported, the center of the carrying platform is provided with a through hole; a grasping mechanism for grasping and placing the object to be transported, the grabbing A mechanism is coupled to the transport mechanism through the through hole; and a drive mechanism for driving the carrier to rotate horizontally on the transport mechanism.
  • the transport mechanism comprises an automatic guided trolley.
  • the transport mechanism further includes a carrying frame with moving casters, the carrying frame is sleeved on the automatic guiding trolley for carrying the carrying platform, the driving mechanism and the grasping mechanism .
  • the carrying platform is a disc-shaped structure.
  • the carrying station is provided with a positioning mechanism that is matched with the object to be transported.
  • the driving mechanism includes a transmission mechanism and a driving motor connected to the transmission mechanism, the transmission mechanism is connected to the loading platform; the transmission mechanism is configured to drive the bearing under the driving of the driving motor The table rotates.
  • the transmission mechanism includes a driving gear and a driven gear, and the driving gear is coupled to a driving shaft of the driving motor, and the bearing gear is fixed on the driven gear.
  • the manner in which the driving gear meshes with the driven gear includes contact engagement or meshing through a chain.
  • the carrying device further includes a control mechanism coupled to the transport mechanism, the grasping mechanism, and the driving mechanism, the control mechanism is configured to control the rotation of the carrying platform, the movement of the transport mechanism, and The working state of the grasping mechanism.
  • control mechanism includes a sensor, the sensor is installed at an end of the grasping mechanism, and the sensor is configured to determine a loading condition of the object to be transported on a corresponding carrying station, and the control mechanism is configured according to the The loading condition controls the rotation of the carrier.
  • the object to be transported is a wafer cassette.
  • the present invention also provides a carrying method using the carrying device, comprising: moving the transport mechanism to an object storage; the driving mechanism drives the carrying platform to rotate horizontally, so that the carrying station loaded with the object to be transported rotates to face Positioning the object storage location; the grasping mechanism grabs the object to be transported from the load-bearing station and transports it to the object storage place; repeats the above steps, and sequentially waits for the plurality of load-bearing stations The transported object is transported to the object storage location.
  • the present invention also provides another carrying method using the carrying device, comprising: moving the transport mechanism to an object storage; the driving mechanism drives the carrying platform to rotate horizontally, so that the loading station of the object to be transported is to be loaded Rotating to a position facing the storage place of the object; the grasping mechanism grabs the object to be transported and places it on the carrying station; repeats the above steps, sequentially transports the object to be transported and places the plurality of bearers At the station.
  • the object to be transported is a wafer cassette
  • the carrying station is provided with a wafer cassette identifier recognizer for identifying an identifier on the wafer cassette
  • the carrying device transports a target wafer cassette to the object And determining, at the storage location, the loading station of the target wafer cassette according to the information fed back by the wafer cassette identifier identifier, and driving the loading platform to rotate horizontally by the driving mechanism, and carrying the target wafer
  • the load station of the box is rotated to a position facing the storage of the object.
  • the present invention provides a carrying device and a method for transporting the same, wherein a plurality of carrying stations are circumferentially disposed on a bearing surface of the carrying platform, and the plurality of carrying stations are used for placing objects to be transported, and driving mechanism driving Rotating the carrier, rotating the station where the handling object to be transported is rotated to the target pick-and-place area, and the picking mechanism is connected to the transport mechanism through a through hole in the center of the carrying platform, such setting
  • the grasping mechanism can move the trajectory of the object to be transported in the target pick-and-place area each time, thereby improving the handling efficiency of the handling device.
  • the grasping mechanism has a short path, a simple movement track, and does not need to add a large number of trajectory routes to avoid interference, and has simple control, high transportation efficiency, and can transport more than two times in a single operation.
  • the wafer cassette has a large carrying capacity.
  • FIG. 1 is a schematic view showing a mechanical arm of a conventional handling device in a high position
  • Figure 2 is a graph showing the distribution of the center of gravity of the robot arm shown in Figure 1;
  • FIG. 3 is a schematic view showing a mechanical arm of another conventional handling device in a low position
  • FIG. 4 is a schematic structural view of a carrying device loaded with a wafer cassette according to an embodiment of the present invention
  • FIG. 5 is a schematic structural view of the handling device of FIG. 4 in the process of unloading or loading a wafer cassette
  • FIG. 6 is a schematic structural diagram of a carrying device loaded with a wafer cassette according to another embodiment of the present invention.
  • Fig. 7 is a plan view showing the carrier device of Fig. 6 when the stage is not mounted.
  • 310-control box 311-positioning column; 401-first shelf position; 402-second shelf position;
  • FIG. 4 is a schematic structural diagram of a handling device 100 according to an embodiment of the present invention.
  • the handling device 100 includes a movable transportation mechanism 10 , a grasping mechanism 40 , a loading platform 20 , and a driving mechanism 30 .
  • the driving mechanism 30 is configured to drive the loading platform 20 to horizontally rotate on the transportation mechanism 10; the loading platform 20 has a bearing surface parallel to a horizontal plane, and the bearing surface is disposed in a circumferential direction.
  • a loading station for placing the wafer cassette 304, the center of the loading platform 20 is provided with a through hole; the grasping mechanism 40 is used for taking and placing the wafer cassette 304, and The gripping mechanism 40 is connected to the transport mechanism 10 through the through hole.
  • the driving mechanism 30 drives the loading platform 20 to rotate horizontally, rotates a station that needs to perform the pick-and-place operation to a target pick-and-place area, and the grasping mechanism 40 picks up and places the same in the target pick-and-place area. Wafer box 304.
  • a plurality of carrying stations are circumferentially disposed on a bearing surface of the carrying platform, and the plurality of carrying stations are used for placing objects to be transported, and the driving mechanism drives the carrying table to rotate, which will be required
  • the station where the transported object is transported is rotated to the target pick-and-place area, and the pick-up mechanism is connected to the transport mechanism through a through hole at the center of the stage, such that the grasping mechanism is grasped each time
  • the movement trajectory can be the same, thereby improving the handling efficiency of the handling device.
  • the transport mechanism 10 includes an automatic guided trolley 302 and a carrying frame with moving casters, and the carrying frame is sleeved on the automatic guided trolley 302 (AVG for short) for carrying the carrying platform 20,
  • the driving mechanism 30 and the grasping mechanism 40 further include a caster 301 mounted on the self-guided trolley 302, and the self-guided trolley 302 can be moved by the caster 301.
  • the drive mechanism 30 includes a transmission mechanism 308 and a drive motor 309.
  • the transmission mechanism 308 is coupled to the drive motor 309 and the carrier 20, respectively.
  • the transmission mechanism 308 is configured to drive the carrier 20 to rotate under the driving of the drive motor 309.
  • the grasping mechanism 40 includes a support frame 305 and a robot 306, and the robot hand 306 is disposed at the end of the mechanical arm 307.
  • the handling device 100 can also include an electrical box 310 that is mounted within the electrical box 310.
  • the robot is provided with a sensor for acquiring the parking state of the workstation at the position of the first station 405 shown in FIG. 5, and for parking the parking space at each shelf position on the shelf. State, after which the state of rotation of the carrier is controlled.
  • the transporter 302 is moved under the support of the casters 301 to reach the target shelf position.
  • the casters 301 are preferably four, and the four casters 301 are disposed at the bottom of the transport vehicle 302 and are arranged side by side.
  • the four casters 301 are more advantageous for stable movement of the transport vehicle 302.
  • the carrier 20 is a disk-shaped structure, and the through hole is preferably a circular hole.
  • the bearing surface of the carrying platform is provided with a plurality of sets of carrying stations, each set of carrying stations comprises a plurality of carrying stations arranged on the same arc, and the plurality of sets of the working positions are arranged in different arcs
  • the movement trajectory can be the same when the gripping mechanism grabs the wafer cassette on the same arc.
  • the number of the stations is preferably four, and four of the carrying stations are symmetrically distributed, and the setting of the plurality of carrying stations enables the handling device 100 to be more effectively utilized, specifically
  • the number of the carrying stations is set according to actual needs, so as to improve the single handling amount, improve the handling efficiency, and the manner of the stations being symmetrically distributed, so that the transport vehicle 302 is more stable during the movement.
  • the carrying station is provided with a positioning mechanism matched with the object to be transported, and the positioning mechanism may be a positioning post 311 for positioning the wafer cassette 304 and cooperating with the positioning post.
  • a slot on the wafer cassette; the number of the positioning posts 311 is plural, and the plurality of positioning posts are not in a straight line, and preferably, the number of positioning posts on each of the stations
  • the three positioning posts constitute a regular polygon such as a regular triangle distribution. This arrangement of positioning the column enables the wafer cassette to be better fixed and is less likely to fall off.
  • the number of slots corresponds to the number of positioning posts.
  • the transmission mechanism 308 includes a driven gear and a driving gear that meshes with the driven gear, and the driving gear is coupled to a driving shaft of the driving motor 309, and the driven gear is fixed thereon.
  • the carrying platform 20 is mounted on an outer ring of the driven gear, and the driven gear is mounted on the transport vehicle 302.
  • the head end of the mechanical arm 307 is mounted with a support frame 305.
  • the support frame 305 is mounted on the table surface of the transport vehicle 302 through the through hole, and the support frame 305 is preferably mounted on the front surface.
  • the transport vehicle 302 In the center of the transport table 302, in the process of grasping the wafer cassette 304 by the grasping mechanism 40, the transport vehicle 302 is more stable and is less prone to overturning.
  • the mechanical arm 307 is coupled to the support frame 302 and is grasped by the drive mechanism 30.
  • FIG. 6 is a schematic structural diagram of a carrying device 200 loaded with a wafer cassette 304 according to another embodiment of the present invention
  • FIG. 7 is a schematic view of the handling device 200 shown in FIG. Top view of the platform.
  • the driving gear and the driven gear are connected and meshed by a chain 501.
  • the driving gear is coupled to the driving shaft of the driving motor 309, and the carrier 20 is fixed to the driven gear, that is, the driving motor 309 drives the driving gear to rotate, and the driving gear is driven by the chain 501.
  • the driven gear rotates such that the driven gear drives the carriage on it to rotate.
  • the process of loading or unloading the wafer cassette by the handling device 200 is specifically referred to the above embodiment, and will not be described here.
  • the present embodiment provides another structure of the transmission mechanism 308, which can flexibly select the form of the transmission mechanism according to production requirements, so that the handling device can better meet the needs of production.
  • the handling device 100 and the handling device 200 further include a control mechanism coupled to the transportation mechanism 10, the grasping mechanism 40, and the driving mechanism 30, the control mechanism for controlling the The carriage 20 is rotated, the transport mechanism 10 is moved, and the operating state of the gripping mechanism 40.
  • the control mechanism includes a sensor mounted on an end of the mechanical arm, the sensor is configured to acquire a parking state of a corresponding carrying station, and the control mechanism controls the rotation of the carrying platform according to the parking state status.
  • the control mechanism may be a control box 310, and the control box 310 may be a PCL controller or a host computer controller, etc., and those skilled in the art should know how to implement based on the disclosure of the present invention.
  • the control box 310 controls the gripping mechanism 40 to grab the wafer cassette.
  • the handling devices provided by the present invention include, but are not limited to, handling of 8 inch silicon and 12 inch silicon.
  • FIG. 5 is a schematic structural view of the transport device 100 shown in FIG. 4 when unloading or loading a wafer cassette.
  • the portion involved in the unloading or loading process includes a first shelf position 401, a second shelf position 402, a third shelf position 403, a fourth shelf position 404, a first load station 405, and a second A load station 406, a third load station 407, and a fourth station 408.
  • the present invention includes, but is not limited to, four stations, and may be specifically set according to actual production needs. The specific implementation process of the handling device 100 for unloading and loading the wafer cassette will be described below with reference to FIGS. 4 and 5.
  • the process of unloading the wafer cassette by the handling device 100 is:
  • Step 1 The control box 310 controls the transportation mechanism 10 to move to the first shelf position 401;
  • Step 2 The control box 310 determines whether the first loading station 405 is placed with the wafer cassette according to the collected information, and determines whether the grasping mechanism 40 is in a normal state; if yes, the control box 310 controls the The grasping mechanism 40 is activated;
  • Step 3 After the startup, the grasping mechanism 30 grabs the wafer cassette at the first loading station 405 and places the wafer cassette at the first shelf position 401.
  • the driving mechanism 30 drives the loading platform 20 to rotate.
  • the control box 310 determines the state of the second load-bearing work station 406 again according to the collected information, in this manner, until a certain bearer is determined. If there is a wafer cassette in the station, the operation of unloading the wafer cassette is continued; if the control box 310 determines that all the stations are not provided with the wafer cassette according to the collected information, the control box 310 performs an abnormal alarm.
  • control box 310 again controls the transport mechanism 10 to reach the next shelf position, and again, performs the steps 2 to 3, according to the execution process.
  • the purpose of unloading the wafer cassettes to different shelf positions is to achieve the purpose of unloading all the wafer cassettes on the handling device 100 to the target shelves.
  • control box 310 collects parking information of all the stations to determine whether all the wafer cassettes have been unloaded; if all the wafer cassettes are completed When the unloading has been completed, the handling device 100 is in a standby state and waits for the next task to be performed.
  • the carrying station is provided with a wafer cassette identification identifier for identifying an identifier on the wafer cassette.
  • the control box 310 is determined according to the information fed back by the wafer cassette identification identifier.
  • the target wafer cassette is located at a loading station, and determines whether the carrying station is at the first carrying station 405. Otherwise, the driving mechanism is driven to drive the carrying table to rotate horizontally, and the target wafer is carried. The load station of the cassette is rotated to the first load station 405.
  • Step 11 The control box 310 controls the transportation mechanism 10 to move to the first shelf position 401;
  • Step 21 The control box 310 determines whether the first loading station 405 is in an empty state according to the collected information, and determines whether the grasping mechanism 40 is in a normal state; if yes, the control box 310 controls the grasping mechanism. 40 start;
  • Step 31 The grasping mechanism 40 grabs the wafer cassette from the first shelf 401, and places the wafer cassette at the first loading station 405;
  • the driving mechanism 30 drives the loading platform 20 to rotate.
  • the second load station 406 is rotated to the position of the first load station 405, and then the control box 310 determines the parking state of the second load station 406 again according to the collected information, in this way, until a certain judgment is made
  • the control box 310 determines that all the carrying stations are not vacant (ie, fully loaded) according to the collected information, the control mechanism performs an abnormal alarm.
  • control box 310 After performing the steps 11 to 31, the control box 310 again controls the transport mechanism 10 to reach the next shelf position, and again, performs the steps 21 to 31, according to the execution process.
  • the loading of the wafer cassettes on the shelves to different carrying stations enables the loading of all the wafer cassettes on the shelves to the designated carrying station.
  • control box 310 collects parking information of all the carrying stations, and determines whether all the carrying stations have been loaded, if all the carriers When the bit has been loaded, the handling device 100 is in a standby state and waits for the next task to be executed.
  • an operator can direct a control program to the control box 310 to cause the control box 310 to control other mechanisms to automatically load or unload the wafer cassette in accordance with predetermined instructions.
  • the first loading station 401 is in a loading state, that is, the first loading station 401 is loaded with a wafer cassette; the grasping mechanism 40 is in a normal state. That is, before the operation of the grasping mechanism 40, the control mechanism performs state monitoring on the grasping mechanism 40. If the relevant working parameters of the grasping mechanism 40 are detected to be normal, the predetermined steps are continued, if the detection is performed. When the gripping mechanism 40 is in a fault state, an alarm is issued.
  • the carrying device provided by the embodiment and the carrying method thereof are provided, wherein at least one set of carrying stations on the same arc is disposed on the bearing surface of the rotatable carrying platform, and each carrying station can be placed in a wafer cassette, and The head end of the robot arm of the grasping mechanism is also connected to the transport mechanism through the through hole on the bearing surface, such that the movement arm of the wafer box at the corresponding carrying station can be the same every time the mechanical arm grabs the same, thereby improving the movement.
  • the handling efficiency of the handling device is provided, wherein at least one set of carrying stations on the same arc is disposed on the bearing surface of the rotatable carrying platform, and each carrying station can be placed in a wafer cassette, and The head end of the robot arm of the grasping mechanism is also connected to the transport mechanism through the through hole on the bearing surface, such that the movement arm of the wafer box at the corresponding carrying station can be the same every time the mechanical arm grabs the same, thereby improving the movement.
  • the handling efficiency of the handling device
  • a plurality of carrying stations are arranged circumferentially on the bearing surface of the carrying platform, and the plurality of carrying stations are used for placing objects to be transported, and the driving mechanism drives the carrying table to rotate, and the handling needs to be carried.
  • the station where the object is located is rotated to the target pick-and-place area, and the gripping mechanism is connected to the transport mechanism through a through hole in the center of the carrying platform, such that the gripping mechanism is located at each grab
  • the handling efficiency of the handling device is improved.
  • the path of the grasping mechanism is short, the movement track is simple, and the speed of the arm does not suddenly increase, and there is no need to add a large number of track routes to avoid interference, and the control is simple.
  • the handling efficiency is high, and more than two wafer cassettes can be transported in a single operation, and the overall carrying capacity is large.
  • the grasping mechanism is installed at the center of the table top of the transport platform of the transport vehicle, so that the picking mechanism is more stable during the process of grasping the wafer cassette, and is not easy to turn over and overturn.

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Abstract

本发明提供一种搬运装置及其搬运方法，所述搬运装置包括可移动的运输机构；承载台，具有一个与水平面平行的承载面，用于承载待搬运物体，所述承载面上周向定义有多个承载工位，所述承载工位用于放置所述待搬运物体，所述承载台的中心设有通孔；抓取机构，用于抓取、放置所述待搬运物体，所述抓取机构穿过所述通孔与所述运输机构连接；以及驱动机构，用于驱动所述承载台在所述运输机构上水平转动。本发明提供的搬运装置及其搬运方法，使得抓取机构在每次抓取目标取放区的承载工位上的待搬运物体时，其运动轨迹能够相同，从而提升了搬运装置的搬运效率。

Description

搬运装置及其搬运方法 技术领域
本发明涉及半导体制造领域，具体涉及一种搬运装置及其搬运方法。
背景技术
目前，全球范围内的一些半导体制造厂房普遍采用搬运装置来搬运晶圆盒，以代替传统的人工搬运。尤其对于8寸晶圆盒的搬运技术已日臻成熟，但针对12寸晶圆盒的搬运装置还不常见。现有的搬运装置多是通过带有机械臂的自动导引运输车(Automated Guided Vehicle，简称AGV)，移动到指定位置，再根据视觉测量结果控制机械臂对晶圆盒进行取放操作。
图1为一种搬运装置之机械臂高位布置的示意图，图2为图1所示机械臂的重心分布曲线图，图3为另一种搬运装置之机械臂低位布置的示意图。图1中，机械臂103安装在晶圆盒装载位置的上方，多个晶圆盒101上下垂直布置；具体的，机械臂103的末端设置有机械手102，机械手102水平端起晶圆盒101两边的把手或晶圆盒101顶部法兰，实现对晶圆盒101的取放；但是，机械臂103的重心位置较高，容易使搬运装置发生倾覆，同时搬运装置受机械臂103的最大有效载荷限制，在抓取12寸满载晶圆盒时易发生超载自保护。图1的机械臂103的重心分布如图2所示，横坐标是机械臂的重心位移，单位是毫米，纵坐标是机械臂的重心距地面的高度，单位是毫米；机械臂抓取晶圆盒并抬高时，机械臂重心的位置为图中的B点，随着机械臂的左右摆动，机械臂的重心也如图中所示在A点和B点之间移动，或在B点与C点之间移动。
图3中，机械臂203安装在晶圆盒装载位置下方一侧，多个晶圆盒201上下垂直布置；具体的，机械臂203的末端设置有机械手202，机械手202抓 取晶圆盒201的顶部法兰，实现对晶圆盒201的取放；该搬运装置的机械臂203的运动路径较长，轨迹复杂，在机械臂203运动到某一位置时，其速度会突然增大，易导致该搬运装置停机，同时机械手202在取放晶圆盒201的过程中为了避免机械臂203和框架(未图示)干涉，必须增加大量的轨迹路线来进行避让，降低了搬运效率。
上述搬运方式单次最多只能运输两个晶圆盒，整体运载量小，而且随着12寸晶圆盒在生产中的广泛运用，对其搬运装置的要求也越来越高。因此，有必要开发一种能够满足小空间、大运量、统一轨迹、高效率的搬运装置及其搬运方法。
发明内容
本发明的目的在于提供一种搬运装置和搬运方法，以解决现有技术中针对晶圆盒的搬运效率低、单次搬运量小以及稳定性低等问题中的一个或多个。
为实现上述目的，本发明提供了一种搬运装置，包括可移动的运输机构；承载台，具有一个与水平面平行的承载面，用于承载待搬运物体，所述承载面上周向定义有多个承载工位，所述承载工位用于放置所述待搬运物体，所述承载台的中心设有通孔；抓取机构，用于抓取、放置所述待搬运物体，所述抓取机构穿过所述通孔与所述运输机构连接；以及驱动机构，用于驱动所述承载台在所述运输机构上水平转动。
可选的，所述运输机构包括自动引导小车。
可选的，所述运输机构还包括带有移动脚轮的承载框架，所述承载框架套设在所述自动引导小车上，用于承载所述承载台、所述驱动机构及所述抓取机构。
可选的，所述承载台为圆盘状结构。
可选的，所述承载工位上设置有与所述待搬运物体匹配连接的定位机构。
可选的，所述驱动机构包括传动机构以及与所述传动机构连接的驱动电机，所述传动机构连接所述承载台；所述传动机构用于在所述驱动电机的驱动下带动所述承载台转动。
可选的，所述传动机构包括主动齿轮和从动齿轮，所述主动齿轮与所述驱动电机的驱动轴连接，所述从动齿轮上固定有所述承载台。
可选的，所述主动齿轮与所述从动齿轮的啮合方式包括接触啮合或通过链条啮合。
可选的，所述搬运装置还包括与所述运输机构、所述抓取机构以及所述驱动机构连接的控制机构，所述控制机构用于控制所述承载台转动、所述运输机构运动以及所述抓取机构的工作状态。
可选的，所述控制机构包括传感器，所述传感器安装于所述抓取机构的末端，所述传感器用于确定所述待搬运物体在对应承载工位上的装载情况，所述控制机构根据所述装载情况控制所述承载台的转动。
可选的，所述待搬运物体为晶圆盒。
本发明还提供一种使用所述搬运装置的搬运方法，包括：运输机构运动至物体存放处；所述驱动机构驱动所述承载台水平转动，使得装载有待搬运物体的承载工位转动至面向所述物体存放处的位置；所述抓取机构从所述承载工位上抓取所述待搬运物体并搬运至物体存放处；重复执行上述步骤，依次将所述多个承载工位上的待搬运物体搬运至所述物体存放处。
本发明还提供另一种使用所述搬运装置的搬运方法，包括：运输机构运动至物体存放处；所述驱动机构驱动所述承载台水平转动，使得待装载所述待搬运物体的承载工位转动至面向所述物体存放处的位置；所述抓取机构抓取待搬运物体并放置在所述承载工位上；重复执行上述步骤，将待搬运物体 依次搬运并放置在所述多个承载工位上。
可选的，所述待搬运物体是晶圆盒，所述承载工位上设有识别晶圆盒上标识符的晶圆盒标识识别器，所述搬运装置将一目标晶圆盒搬运至物体存放处时，根据所述晶圆盒标识识别器反馈的信息确定所述目标晶圆盒所在承载工位，并通过所述驱动机构驱动所述承载台水平转动，将承载有所述目标晶圆盒的承载工位转动至面向所述物体存放处的位置。
综上所述，本发明提供的搬运装置及其搬运方法，在承载台之承载面上周向设置多个承载工位，多个所述承载工位用于放置待搬运物体，驱动机构驱动所述承载台转动，将需要进行搬运的搬运物体所在的工位旋转至目标取放区，并且抓取机构穿过所述承载台之中心的通孔与所述运输机构连接，这样的设置，使得所述抓取机构在每次抓取位于所述目标取放区的待搬运物体时，其运动轨迹能够相同，从而提升了搬运装置的搬运效率。与多个工位上下布置相比，所述抓取机构的路径短，运动轨迹简单，而且无需增设大量的轨迹路线来避免干涉，控制简单，同时搬运效率高，且单次可以运输两个以上的晶圆盒，整体运载量大。
附图说明
图1为现有的一种搬运装置之机械臂处于高位布置的示意图；
图2为图1所示机械臂的重心分布曲线图；
图3为现有的另一种搬运装置之机械臂处于低位布置的示意图；
图4为本发明一实施例提供的搬运装置装载有晶圆盒的结构示意图；
图5为图4所述的搬运装置在卸载或装载晶圆盒过程的结构示意图；
图6为本发明另一实施例提供的搬运装置装载有晶圆盒的结构示意图；
图7为图6所述的搬运装置未安装承载台时的俯视图。
附图标记说明如下：
101、201-晶圆盒；102、202-机械手；103、203-机械臂；
10-运输机构；20-承载台；30-驱动机构；40-抓取机构；
301-脚轮；302-自动引导小车；304-晶圆盒；
305-支撑架；306-机械手；307-机械臂；308-传动机构；309-驱动电机；
310-控制箱；311-定位柱；401-第一货架位置；402-第二货架位置；
403-第三货架位置；404-第四货架位置；405-第一承载工位；
406-第二承载工位；407-第三承载工位；408-第四承载工位；501-链条。
具体实施方式
下面将结合示意图对本发明的具体实施方式进行更详细的描述。根据下列描述和权利要求书，本发明的优点和特征将更清楚。需说明的是，附图均采用非常简化的形式且均使用非精准的比例，仅用以方便、明晰地辅助说明本发明实施例的目的。
以下描述中，为了便于叙述，以搬运装置搬运晶圆盒作为示意，来详细说明本发明的搬运装置的结构以及工作过程。
图4为本发明一实施例提供的搬运装置100的结构示意图，如图4所示，所述搬运装置100包括可移动的运输机构10、抓取机构40、承载台20以及驱动机构30。
具体的，所述驱动机构30用于驱动所述承载台20在所述运输机构10上水平转动；所述承载台20具有一个与水平面平行的承载面，所述承载面上周向设置有多个承载工位，所述承载工位用于放置晶圆盒304，所述承载台20的中心设有通孔；所述抓取机构40用于取、放所述晶圆盒304，且所述抓取机构40穿过所述通孔与所述运输机构10连接。所述驱动机构30驱动所述承载台20水平转动，将需要进行取放的操作的工位旋转至一目标取放区，所述抓取机构40在所述目标取放区取、放所述晶圆盒304。
本实施例提供的搬运装置，在承载台之承载面上周向设置多个承载工位，多个所述承载工位用于放置待搬运物体，驱动机构驱动所述承载台转动，将需要进行搬运的搬运物体所在的工位旋转至目标取放区，并且抓取机构穿过所述承载台中心的通孔与所述运输机构连接，这样的设置，使得所述抓取机构在每次抓取位于所述目标取放区的待搬运物体时，其运动轨迹能够相同，从而提升了搬运装置的搬运效率。
进一步的，所述运输机构10包括自动引导小车302和带有移动脚轮的承载框架，所述承载框架套设在所述自动引导小车302(简称AVG)上，用于承载所述承载台20、驱动机构30及抓取机构40，所述运输机构10还包括安装于所述自引导小车302之上的脚轮301，所述自引导小车302可通过所述脚轮301运动。所述驱动机构30包括传动机构308以及驱动电机309，所述传动机构308分别连接驱动电机309和承载台20，所述传动机构308用于在驱动电机309的驱动下带动承载台20转动。
本实施例中，所述抓取机构40包括支撑架305以及机械手306，所述机械手306设置在机械臂307的末端。所述搬运装置100还可包括电气箱310，所述控制机构安装于电气箱310内。其中，所述机械手上设置有传感器，所述传感器用于获取处于图5所示的第一工位405所在位置的工位的停放状态，以及用于获取处于货架上的每一个货架位置的停放状态，之后，控制所述承载台的转动状态。
继续参阅图4，所述运输车302在所述脚轮301的支撑下移动，以到达目标货架位置。所述脚轮301优选为4个，4个脚轮301设置在运输车302的底部并前后并排设置。在此，4个所述脚轮301更有利于运输车302的稳定移动。
所述承载台20为圆盘状结构，且所述通孔优选为圆形孔。所述承载台的承载面上优选设置有多组承载工位，每组承载工位包括布置在同一个圆弧上的多个承载工位，且多组所述工位布置在不同的圆弧上，以使抓取机构抓取同一圆弧上的晶圆盒时运动轨迹可以相同。
针对一组承载工位，所述工位的数量优选为4个，且4个所述承载工位对称分布，多个承载工位的设置使所述搬运装置100得到更有效的利用，具体可根据实际需要设置所述承载工位的数量，以提升单次的搬运量，提升搬运效率，而且工位对称分布的方式，使所述运输车302在运动的过程中更加的稳定。
更进一步的，所述承载工位上设置有与所述待搬运物体匹配连接的定位机构，所述定位机构可以是用于定位晶圆盒304的定位柱311和与所述定位柱相配合的，且位于所述晶圆盒上的槽孔；所述定位柱311的数量为多个，且多个所述定位柱不在一条直线上，优选的，每个所述工位上的定位柱数量为三个，更优选的该三个定位柱构成正三角形分布等正多边形，这种设置定位柱的方式，使晶圆盒能够更好的被固定，不容易发生脱落。当然，所述槽孔的数量与所述定位柱的数量相一致。
在一个实施例中，前述传动机构308包括从动齿轮和与所述从动齿轮相啮合的主动齿轮，所述主动齿轮与前述驱动电机309的驱动轴连接，且所述从动齿轮上固定有所述承载台20，即所述驱动电机309驱动主动齿轮转动，所述主动齿轮驱动从动齿轮转动，从而所述从动齿轮驱动其上的承载台转动。具体的，所述承载台20安装于所述从动齿轮的外圈上，该从动齿轮安装于所述运输车302上。
本实施例中，所述机械臂307的头端安装有支撑架305，该支撑架305通过所述通孔安装于所述运输车302的台面上，优选的所述支撑架305安装于所述运输车302台面的中心，这种安装方式，在抓取机构40抓取晶圆盒304的过程中，使得运输车302更加稳定，不容易产生倾覆现象。所述机械臂307与所述支撑架302连接，并在所述驱动机构30的驱动下作抓取运动。
在另一实施例中，参见图6和图7，图6为本发明另一实施例提供的搬运装置200装载有晶圆盒304的结构示意图，图7为图6所示搬运装置200未安装承载台时的俯视图。
如图6和图7所示，与前述搬运装置100所区别的是，所述主动齿轮与所述从动齿轮之间通过链条501连接啮合。所述主动齿轮与前述驱动电机309的驱动轴连接，且所述从动齿轮上固定有所述承载台20，即所述驱动电机309驱动主动齿轮转动，所述主动齿轮通过所述链条501驱动所述从动齿轮转动，从而所述从动齿轮驱动其上的承载台转动。所述搬运装置200装载或卸载晶圆盒的过程具体参见上述实施例，此处不再具述。在此，本实施例提供了传动机构308的另一种结构，即可根据生产需要灵活选取所述传动机构的形式，使搬运装置更能适应生产的需要。
更进一步的，所述搬运装置100和所述搬运装置200还包括与所述运输机构10、所述抓取机构40以及所述驱动机构30连接的控制机构，所述控制机构用于控制所述承载台20转动、所述运输机构10运动以及所述抓取机构40的工作状态。所述控制机构包括传感器，所述传感器安装于所述机械臂的末端，所述传感器用于获取对应承载工位的停放状态，所述控制机构根据所述停放状态，控制所述承载台的转动状态。其中，所述控制机构可以是控制箱310，所述控制箱310可以是PCL控制器或上位机控制器等，本领域的技术人员在本发明公开的基础上，应当知晓如何实现。例如，所述控制箱310控制所述抓取机构40抓取晶圆盒。本发明提供的搬运装置包括但不限于对8寸硅和12寸硅的搬运。
图5为图4所示的搬运装置100在卸载或装载晶圆盒时的结构示意图。如图5所示，所述卸载或装载过程涉及到的部分包括第一货架位置401、第二货架位置402、第三货架位置403、第四货架位置404、第一承载工位405、第二承载工位406、第三承载工位407以及第四工位408。然而，本发明包括但不限于四个工位，具体可根据实际生产需要设置。下面结合图4和图5说明所述搬运装置100卸载和装载晶圆盒的具体实现过程。
所述搬运装置100卸载晶圆盒的过程为：
步骤1：控制箱310控制运输机构10运动至第一货架位置401处；
步骤2：所述控制箱310根据采集信息判断第一承载工位405是否放置有晶圆盒，同时判断所述抓取机构40是否处于正常状态；若均是，则所述控制箱310控制所述抓取机构40启动；
步骤3：启动后，所述抓取机构30抓取所述第一承载工位405处的晶圆盒，并将所述晶圆盒放置于所述第一货架位置401处。
其中，步骤2中，若所述控制箱310根据采集信息判断第一承载工位405处于空置状态(即未放置有晶圆盒)，则所述驱动机构30驱动所述承载台20旋转，使第二承载工位406旋转至所述第一承载工位405所在位置处，则所述控制箱310再次根据采集信息判断第二承载工位406的状态，按照这种方式，直至判断某一承载工位存在晶圆盒，则继续执行卸载晶圆盒的工作；若所述控制箱310根据采集信息，判断所有工位均未设置有晶圆盒时，则所述控制箱310进行异常报警。
在执行完成所述步骤1至所述步骤3之后，控制箱310再次控制所述运输机构10到达下一个货架位置处，再次的，执行所述步骤2至所述步骤3，按照这种执行过程，可实现将晶圆盒卸载到不同的货架位置上，从而实现了将搬运装置100上的所有晶圆盒卸载到目标货架上的目的。
进一步的，在将所述搬运装置100上的所有晶圆盒卸载到货架上以后，所述控制箱310采集所有工位的停放信息，确定所有晶圆盒是否已经卸载完成；若所有晶圆盒已完成卸载，则所述搬运装置100处于待机状态，并等待执行下一个任务。
在另一实施例中，所述承载工位上设有识别晶圆盒上标识符的晶圆盒标识识别器，步骤2中，控制箱310根据所述晶圆盒标识识别器反馈的信息确定所述目标晶圆盒所在承载工位，并判断所述承载工位是否在第一承载工位405处，否则控制所述驱动机构驱动所述承载台水平转动，将承载有所述目标晶圆盒的承载工位转动至所述第一承载工位405处。
接着，所述搬运装置100装载晶圆盒的过程为：
步骤11：控制箱310控制运输机构10运动至第一货架位置401处；
步骤21：所述控制箱310根据采集信息判断第一承载工位405是否处于空置状态，同时判断抓取机构40是否处于正常状态；若均是，则所述控制箱310控制所述抓取机构40启动；
步骤31：所述抓取机构40从所述第一货架401处抓取晶圆盒，并将所述晶圆盒放置于所述第一承载工位405处；
其中，步骤21中，若所述控制箱310根据采集信息判断第一承载工位405处于非空置(即放置有晶圆盒)，则所述驱动机构30驱动所述承载台20旋转，使第二承载工位406旋转至所述第一承载工位405所在位置处，之后，所述控制箱310再次根据采集信息判断第二承载工位406的停放状态，按照这种方式，直至判断某一承载工位空置时，则继续执行装载晶圆盒的工作；若所述控制箱310根据采集信息，判断所有承载工位均非空置(即满载)，则所述控制机构进行异常报警。
在执行完成所述步骤11至所述步骤31之后，控制箱310再次控制所述运输机构10到达下一个货架位置处，再次的，执行所述步骤21至所述步骤31，按照这种执行过程，可实现将位于货架上的晶圆盒装载到不同的承载工位上，从而实现了将货架上的所有晶圆盒装载到指定承载工位上的目的。
进一步的，在将货架上的所有晶圆盒装载到所述搬运装置100上以后，所述控制箱310采集所有承载工位的停放信息，确定所有承载工位是否已经装载完成，若所有承载工位已经完成装载，则所述搬运装置100处于待机状态，并等待执行下一个任务。
在执行上述装载和卸载晶圆盒的步骤之前，操作人员可将控制程序导入所述控制箱310，以使该控制箱310按照预定的指令控制其他机构自动化装载或卸载晶圆盒。
上述装载和卸载晶圆盒的步骤中：所述第一承载工位401处于装载状态，即是所述第一承载工位401装载得有晶圆盒；所述抓取机构40处于正常状态， 即在所述抓取机构40工作之前，所述控制机构会对所述抓取机构40进行状态监测，若监测到所述抓取机构40之相关工作参数正常，则继续执行既定步骤，若检测到所述抓取机构40处于故障状态，则发出报警。
本实施例提供的搬运装置及其搬运方法，通过在可转动的承载台之承载面上设置至少一组位于同一圆弧上的承载工位，每个承载工位可放置一个晶圆盒，并还将抓取机构之机械臂的头端通过承载面上通孔与运输机构连接，这样的设置，使得机械臂每次抓取对应承载工位处晶圆盒的运动轨迹能够相同，从而提升了搬运装置的搬运效率。
综上所述，在承载台之承载面上周向设置多个承载工位，多个所述承载工位用于放置待搬运物体，驱动机构驱动所述承载台转动，将需要进行搬运的搬运物体所在的工位旋转至目标取放区，并且抓取机构穿过所述承载台之中心的通孔与所述运输机构连接，这样的设置，使得所述抓取机构在每次抓取位于所述目标取放区的待搬运物体时，其运动轨迹能够相同，从而提升了搬运装置的搬运效率。与多个承载工位上下布置相比，所述抓取机构的路径短，运动轨迹简单，且机械臂速度不会出现突然增大的问题，而且无需增设大量的轨迹路线来避免干涉，控制简单，同时搬运效率高，且单次可以运输两个以上的晶圆盒，整体运载量大。
此外，所述抓取机构安装于运输车之运输台的台面中心，使得抓取机构在抓取晶圆盒的过程中，所述搬运装置更加稳定，不容易翻身倾覆。
上述仅为本发明的优选实施例而已，并不对本发明起到任何限制作用。任何所属技术领域的技术人员，在不脱离本发明的技术方案的范围内，对本发明揭露的技术方案和技术内容做任何形式的等同替换或修改等变动，均属未脱离本发明的技术方案的内容，仍属于本发明的保护范围之内。

Claims (14)

  1. 一种搬运装置，其特征在于，包括：
    可移动的运输机构；
    承载台，具有一个与水平面平行的承载面，用于承载待搬运物体，所述承载面上周向定义有多个承载工位，所述承载工位用于放置所述待搬运物体，所述承载台的中心设有通孔；
    抓取机构，用于抓取、放置所述待搬运物体，所述抓取机构穿过所述通孔与所述运输机构连接；以及
    驱动机构，用于驱动所述承载台在所述运输机构上水平转动。
  2. 如权利要求1所述的搬运装置，其特征在于，所述运输机构包括自动引导小车。
  3. 如权利要求2所述的搬运装置，其特征在于，所述运输机构还包括带有移动脚轮的承载框架，所述承载框架套设在所述自动引导小车上，用于承载所述承载台、所述驱动机构及所述抓取机构。
  4. 如权利要求1所述的搬运装置，其特征在于，所述承载台为圆盘状结构。
  5. 如权利要求1所述的搬运装置，其特征在于，所述承载工位上设置有与所述待搬运物体匹配连接的定位机构。
  6. 如权利要求1所述的搬运装置，其特征在于，所述驱动机构包括传动机构以及与所述传动机构连接的驱动电机，所述传动机构连接所述承载台；所述传动机构用于在所述驱动电机的驱动下带动所述承载台转动。
  7. 如权利要求6所述的搬运装置，其特征在于，所述传动机构包括主动齿轮和从动齿轮，所述主动齿轮与所述驱动电机的驱动轴连接，所述从动齿轮上固定有所述承载台。
  8. 如权利要求6所述的搬运装置，其特征在于，所述主动齿轮与所述从 动齿轮的啮合方式包括接触啮合或通过链条啮合。
  9. 如权利要求1所述的搬运装置，其特征在于，所述搬运装置还包括与所述运输机构、所述抓取机构以及所述驱动机构连接的控制机构，所述控制机构用于控制所述承载台转动、所述运输机构运动以及所述抓取机构的工作状态。
  10. 如权利要求9所述的搬运装置，其特征在于，所述控制机构包括传感器，所述传感器安装于所述抓取机构的末端，所述传感器用于确定所述待搬运物体在对应承载工位上的装载情况，所述控制机构根据所述装载情况控制所述承载台的转动。
  11. 一种如权利要求1-10中任一项所述的搬运装置，其特征在于，所述待搬运物体为晶圆盒。
  12. 一种使用如权利要求1-10中任一项所述搬运装置的搬运方法，其特征在于，包括：
    运输机构运动至物体存放处；
    所述驱动机构驱动所述承载台水平转动，使得装载有待搬运物体的承载工位转动至面向所述物体存放处的位置；
    所述抓取机构从所述承载工位上抓取所述待搬运物体并搬运至物体存放处；以及
    重复执行上述步骤，以将所述多个承载工位上的待搬运物体依次搬运至所述物体存放处。
  13. 一种使用如权利要求1-10中任一项所述搬运装置的搬运方法，其特征在于，包括：
    运输机构运动至物体存放处；
    所述驱动机构驱动所述承载台水平转动，使得待装载所述待搬运物体的承载工位转动至面向所述物体存放处的位置；
    所述抓取机构抓取待搬运物体并放置在所述承载工位上；以及
    重复执行上述步骤，以将待搬运物体依次搬运并放置在所述多个承载工位上。
  14. 一种如权利要求12所述的搬运方法，其特征在于，所述待搬运物体是晶圆盒，所述承载工位上设有识别晶圆盒上标识符的晶圆盒标识识别器，所述搬运装置将一目标晶圆盒搬运至物体存放处时，根据所述晶圆盒标识识别器反馈的信息确定所述目标晶圆盒所在承载工位，并通过所述驱动机构驱动所述承载台水平转动，将承载有所述目标晶圆盒的承载工位转动至面向所述物体存放处的位置。
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