WO2018211683A1 - 電子モジュール、接続体の製造方法及び電子モジュールの製造方法 - Google Patents

電子モジュール、接続体の製造方法及び電子モジュールの製造方法 Download PDF

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Publication number
WO2018211683A1
WO2018211683A1 PCT/JP2017/018823 JP2017018823W WO2018211683A1 WO 2018211683 A1 WO2018211683 A1 WO 2018211683A1 JP 2017018823 W JP2017018823 W JP 2017018823W WO 2018211683 A1 WO2018211683 A1 WO 2018211683A1
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WIPO (PCT)
Prior art keywords
connection body
groove
electronic element
conductive adhesive
inclined surface
Prior art date
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PCT/JP2017/018823
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English (en)
French (fr)
Inventor
康亮 池田
理 松嵜
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新電元工業株式会社
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Publication date
Application filed by 新電元工業株式会社 filed Critical 新電元工業株式会社
Priority to PCT/JP2017/018823 priority Critical patent/WO2018211683A1/ja
Priority to JP2018509862A priority patent/JP6402281B1/ja
Priority to US15/782,011 priority patent/US11437340B2/en
Priority to CN201780005098.1A priority patent/CN109314087B/zh
Priority to TW107114881A priority patent/TWI669804B/zh
Priority to NL2020928A priority patent/NL2020928B1/en
Publication of WO2018211683A1 publication Critical patent/WO2018211683A1/ja

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Definitions

  • the present invention relates to an electronic module having a connection body, a method for manufacturing the connection body, and a method for manufacturing the electronic module.
  • connection body is provided on one side (for example, the front surface side) of the electronic element (first electronic element), and another electronic device is connected to the one side of the connection body via a conductive adhesive such as solder. It is conceivable to provide an element (second electronic element).
  • connection body Since such a connection body is provided on one side of the first electronic element, the balance may be lost. When the connection body loses the balance in this way, the conductive adhesive may flow out from the surface on one side of the connection body.
  • the present invention provides an electronic module capable of preventing the conductive adhesive from flowing out and preventing the heat generated from the electronic elements from being generated by separating the electronic elements from each other.
  • An electronic module comprises: A first electronic element; A first connection body provided on one side of the first electronic element, the first connection body having a first pillar portion extending on the other side, and a first groove portion provided on a surface on one side , A second electronic element provided on one side of the first connection body via a conductive adhesive provided on the inner periphery of the first groove, With The first connection body may have a first recess at a position corresponding to the first pillar portion on one side.
  • the surface on the one side of the first connector has a first inclined surface and a first flat surface provided on the outer periphery of the first inclined surface,
  • the first groove may be provided at a boundary between the first inclined surface and the first flat surface.
  • the surface on the one side of the first connector has a first inclined surface and a first flat surface provided on the outer periphery of the first inclined surface,
  • the first groove may be provided on the first flat surface.
  • the surface on the one side of the first connector has a first inclined surface and a first flat surface provided on the outer periphery of the first inclined surface,
  • the first groove may be provided on the first inclined surface.
  • the angle formed by the first inclined surface and the inner peripheral surface of the first groove is the angle formed by the first inclined surface and the outer peripheral surface of the first groove. It may be smaller in comparison.
  • a method for manufacturing a connection body includes: Placing the conductor plate on a mold having a mold recess; and The conductor plate is pressed toward the mold to form a first column portion corresponding to the mold recess on the other side of the conductor plate, and on one side of the conductor plate, the first column portion Forming a first recess at a corresponding position; A step of forming a first groove on a surface of one side of the conductor plate by pressing a member having a protruding portion on one side of the conductor plate; May be provided.
  • An electronic module manufacturing method includes: Placing the connection body described above on the first electronic element; Placing the second electronic element on the connection body via a conductive adhesive; With The conductive adhesive may be provided on the inner periphery of the first groove portion.
  • the first connecting body adopts an aspect having the first column part
  • the first electronic element and the second electronic element can be separated to a certain extent, and heat can be released. it can.
  • adopted when a conductive adhesive fuse
  • FIG. 1 is a longitudinal sectional view of an electronic module that can be used in the first embodiment of the present invention.
  • FIG. 2 is a plan view of an electronic module that can be used in the first embodiment of the present invention.
  • FIG. 3A is a longitudinal sectional view of a first connection body that can be used in the first embodiment of the present invention, and FIG. 3B is used in the first embodiment of the present invention. It is a longitudinal cross-sectional view of another possible first connection body.
  • FIG. 4A is a longitudinal sectional view of a second connection body that can be used in the first embodiment of the present invention, and FIG. 4B is used in the first embodiment of the present invention. It is a longitudinal cross-sectional view of another possible second connection body.
  • FIG. 5 is a longitudinal sectional view of a first connection body that can be used in the first embodiment of the present invention, and is a longitudinal sectional view exaggeratingly showing a first recess.
  • FIG. 6 is a longitudinal sectional view of a second connection body that can be used in the first embodiment of the present invention, and is a longitudinal sectional view exaggeratingly showing a second recess.
  • FIG. 7 is an electronic module that can be used in the first embodiment of the present invention, and is a longitudinal sectional view taken along a section different from that of FIG.
  • FIGS. 8A to 8C are longitudinal sectional views showing the manufacturing steps of the first connection body and the second connection body that can be used in the first embodiment of the present invention.
  • FIGS. 9A to 9E are longitudinal sectional views showing the manufacturing steps of the chip module that can be used in the first embodiment of the present invention.
  • FIG. 10 is a longitudinal sectional view of a first connection body that can be used in the second embodiment of the present invention, and is a longitudinal sectional view exaggeratingly showing a first recess.
  • FIG. 11 is a longitudinal sectional view of a second connection body that can be used in the second embodiment of the present invention, and is a longitudinal sectional view exaggeratingly showing a second recess.
  • FIG. 12 (a) to 12 (c) are longitudinal sectional views showing a manufacturing process of the first connection body and the second connection body that can be used in the second embodiment of the present invention. It is the longitudinal cross-sectional view which exaggerated and showed one recessed part, the 2nd pillar part, the 2nd recessed part, etc.
  • FIG. 13 is a longitudinal cross-sectional view of the 1st connection body which can be used in the 3rd Embodiment of this invention, and is the longitudinal cross-sectional view which exaggerated and showed the 1st recessed part.
  • FIG. 14 is a longitudinal sectional view of a second connection body that can be used in the third embodiment of the present invention, and is a longitudinal sectional view exaggeratingly showing a second recess.
  • FIG. 15 (a) to 15 (c) are longitudinal sectional views showing manufacturing steps of the first connection body and the second connection body that can be used in the third embodiment of the present invention. It is the longitudinal cross-sectional view which exaggerated and showed one recessed part, the 2nd pillar part, the 2nd recessed part, etc.
  • FIG. 16 is a plan view of an electronic module that can be used in the fourth embodiment of the present invention.
  • FIG. 17 is a longitudinal sectional view of an electronic module that can be used in the fifth embodiment of the present invention.
  • FIG. 18 is a perspective view of an electronic module that can be used in the sixth embodiment of the present invention.
  • FIG. 19 is a plan view of an electronic module that can be used in the sixth embodiment of the present invention.
  • FIG. 20 is a side view of an electronic module that can be used in the sixth embodiment of the present invention.
  • first direction the left and right direction
  • second direction the front and back direction of the paper surface
  • third direction the front and back direction of the paper surface
  • plane direction the in-plane direction including the second direction and the third direction
  • plane view when viewed from one side, it is referred to as “plan view”.
  • the electronic module of the present embodiment may have a first electronic unit and a second electronic unit.
  • the first electronic unit is provided on a first substrate 11, a plurality of first conductor layers 12 provided on one side of the first substrate 11, and one side of the first conductor layer 12.
  • the first electronic element 13 may be included.
  • the first electronic element 13 may be a switching element or a control element.
  • the first electronic element 13 may be a MOSFET, an IGBT, or the like.
  • Each of the first electronic element 13 and the second electronic element 23 described later may be composed of a semiconductor element, and the semiconductor material may be silicon, silicon carbide, gallium nitride, or the like.
  • the other surface of the first electronic element 13 may be connected to the first conductor layer 12 via a conductive adhesive such as solder.
  • the first connection body 60 may be provided on one side of the first electronic element 13.
  • the first connection body 60 may be connected to one surface of the first electronic element 13 via a conductive adhesive such as solder.
  • a second electronic unit may be provided on one side of the first connection body 60.
  • the second electronic unit may have a second electronic element 23 provided on one side of the first connection body 60.
  • the second electronic unit may include a second substrate 21 and a second conductor layer 22 provided on the other side of the second substrate 21.
  • a second connection body 70 may be provided on the other side of the second conductor layer 22.
  • the second electronic element 23 may be provided on the second conductor layer 22, unlike the embodiment shown in FIG. 1.
  • the second connection body 70 may be connected to one surface of the second electronic element 23 and the other surface of the second conductor layer 22 via a conductive adhesive such as solder.
  • the second electronic element 23 may be a switching element or a control element.
  • the second electronic element 23 may be a MOSFET, an IGBT, or the like.
  • the first connection body 60 may include a first head portion 61 and a first column portion 62 extending from the first head portion 61 to the other side.
  • the second connector 70 may include a second head portion 71 and a second column portion 72 extending from the second head portion 71 to the other side.
  • the first connection body 60 may have a substantially T-shaped cross section, and the second connection body 70 may have a substantially T-shaped cross section.
  • a first groove portion 64 may be provided on one surface of the first head portion 61.
  • the first groove portion 64 is provided on the outer periphery of the first column portion 62 in plan view (surface direction), but may be provided on a part of the outer periphery of the first column portion 62. It may be provided all around the periphery.
  • a conductive adhesive such as solder may be provided on the one side surface of the first head portion 61 and on the inner periphery of the first groove portion 64, and the second electronic element is connected via the conductive adhesive. It may be provided.
  • the cross section of the first groove portion 64 may be rectangular as shown in FIG. 3B, or may be triangular as shown in FIG.
  • the triangle shape may be a right triangle or an isosceles triangle.
  • a second groove portion 74 may be provided on one surface of the second head portion 71.
  • the second groove part 74 may be provided on a part of the outer periphery of the second column part 72 in a plan view, or may be provided on the entire outer periphery of the second column part 72.
  • a conductive adhesive such as solder may be provided on one side surface of the second head portion 71 and inside the peripheral edge of the second groove portion 74, and the second head portion 71 is interposed via the conductive adhesive.
  • the one side surface and the second conductor layer 22 may be connected.
  • the cross section of the second groove portion 74 may be rectangular as shown in FIG. 4B, or may be triangular as shown in FIG.
  • the triangle shape may be a right triangle or an isosceles triangle.
  • one surface of the first head portion 61 may have a first recess 67 at a position corresponding to the first column portion 62, and the first groove portion 64 is a peripheral edge of the first recess 67. It may be provided in the part. In addition, it is not restricted to such an aspect, The 1st groove part 64 may be provided in the outer periphery of the 1st recessed part 67 like 2nd Embodiment mentioned later, 3rd implementation. Like the form, the 1st groove part 64 may be provided in the periphery inner periphery of the 1st recessed part 67.
  • FIG. “The first concave portion 67 is provided at a position corresponding to the first column portion 62” when the first concave portion 67 is provided at the position where the first column portion 62 is provided when viewed along the first direction. It means that it is provided.
  • the one side surface of the first connection body 60 may have a first inclined surface 68 and a first flat surface 69 provided on the outer periphery of the first inclined surface 68.
  • the first groove portion 64 may be provided at the boundary between the first inclined surface 68 and the first flat surface 69.
  • the first flat surface 69 does not necessarily extend completely along the surface direction.
  • the first flat surface 69 in the present embodiment is a surface that is located at the outer periphery of the first inclined surface 68 and has a smaller inclination angle with respect to the surface including the second direction and the third direction than the first inclined surface 68. It means that.
  • the first inclined surface 68 is included in the first recess 67, and the peripheral edge of the first recess 67 corresponds to the boundary between the first inclined surface 68 and the first flat surface 69. Further, the fact that the first groove portion 64 is provided at the “boundary” between the first inclined surface 68 and the first flat surface 69 suffices if a part of the first groove portion 64 is located at the boundary, as shown in FIG. As shown in FIG. 8C, most of the first groove 64 may be positioned on the first inclined surface 68. Alternatively, even if most of the first groove 64 is positioned on the first flat surface 69. Good.
  • one surface of the second head portion 71 may have a second recess 77 at a position corresponding to the second column portion 72, and the second groove portion 74 is a peripheral edge of the second recess 77. It may be provided in the part. In addition, it is not restricted to such an aspect, The 2nd groove part 74 may be provided in the outer periphery of the periphery of the 2nd recessed part 77 like 2nd Embodiment mentioned later, 3rd implementation. Like the form, the 2nd groove part 74 may be provided in the peripheral inward of the 2nd recessed part 77.
  • FIG. “The second concave portion 77 is provided at a position corresponding to the second column portion 72” when the second concave portion 77 is provided at the position where the second column portion 72 is provided when viewed along the first direction. It means that it is provided.
  • the one side surface of the second connection body 70 may have a second inclined surface 78 and a second flat surface 79 provided on the outer periphery of the second inclined surface 78.
  • the second groove 74 may be provided at the boundary between the second inclined surface 78 and the second flat surface 79.
  • the second flat surface 79 does not necessarily extend completely along the surface direction.
  • the second flat surface 79 in the present embodiment is a surface that is located on the outer periphery of the second inclined surface 78 and has a smaller inclination angle with respect to the surface including the second direction and the third direction than the second inclined surface 78. It means that.
  • the second inclined surface 78 is included in the second recess 77, and the peripheral edge of the second recess 77 corresponds to the boundary between the second inclined surface 78 and the second flat surface 79.
  • the second groove 74 is provided at the “boundary” between the second inclined surface 78 and the second flat surface 79 as long as a part of the second groove 74 is located at the boundary, as shown in FIG. In this way, most of the second groove 74 may be located on the second inclined surface 78, or even if most of the second groove 74 is located on the second flat surface 79 as shown in FIG. Good.
  • a third connection body 80 may be provided on one side of the second electronic element 23.
  • the third connection body 80 may have a third head portion 81 and a third column portion 82 extending from the third head portion 81 to the other side.
  • the third connector 80 may be connected to the other surface of the second conductor layer 22 and the one surface of the second electronic element 23 via a conductive adhesive such as solder.
  • the vertical cross section which has the 3rd pillar part 82 does not become a substantially T shape, and you may utilize the general connector 85 (refer FIG. 18).
  • the first electronic element 13 may be exposed outward from the first head portion 61 in plan view.
  • the first electronic element 13 is a switching element such as a MOSFET
  • the first gate terminal 13g and the like may be provided in a portion exposed from the outside.
  • the second electronic element 23 is a switching element such as a MOSFET
  • a second gate terminal 23g or the like may be provided on one surface.
  • the first electronic element 13 shown in FIG. 2 has a first gate terminal 13g and a first source terminal 13s on one side
  • the second electronic element 23 has a second gate terminal 23g and a first source terminal 13s on one side. Two source terminals 23s are provided.
  • the second connection body 70 is connected to the second source terminal 23s of the second electronic element 23 via a conductive adhesive
  • the third connection body 80 is conductive to the second gate terminal 23g of the second electronic element 23. It may be connected via an adhesive.
  • the 1st connection body 60 may connect the 1st source terminal 13s of the 1st electronic element 13, and the 2nd drain terminal provided in the other side of the 2nd electronic element 23 via a conductive adhesive.
  • the first drain terminal provided on the other side of the first electronic element 13 may be connected to the first conductor layer 12 via a conductive adhesive.
  • the first gate terminal 13g of the first electronic element 13 is connected to a fourth connector 95 (for example, a connector, see FIG. 19) via a conductive adhesive, and the fourth connector 95 is connected via a conductive adhesive. May be connected to the first conductor layer 12.
  • the second electronic element 23 placed on the first connection body 60 is a control element having low heat generation
  • the electronic element 13 may be a switching element
  • the first electronic element 13 may be a control element having low heat generation
  • the electronic module includes the first electronic element 13, the second electronic element 23, the first connection body 60, the second connection body 70, the third connection body 80, the fourth connection body 95, the first conductor layer 12, and the second conductor layer.
  • the first conductor layer 12 may be connected to a terminal portion (not shown), and the distal end side of the terminal portion may be exposed to the outside of the sealing portion 90 so that it can be connected to an external device.
  • first electronic element 13, the second electronic element 23, the first connection body 60, the second connection body 70, the third connection body 80, and the fourth connection body 95 may constitute a chip module.
  • the chip module having the first electronic element 13, the second electronic element 23, the first connection body 60, the second connection body 70, the third connection body 80, and the fourth connection body 95 is connected to the first conductor layer.
  • the electronic module may be manufactured by sealing between the first substrate 11 provided with 12 and the second substrate 21 provided with the second conductor layer 22 and then sealing with the sealing portion 90.
  • the first substrate 11 and the second substrate 21 a ceramic substrate, an insulating resin layer, or the like can be adopted.
  • a material mainly composed of Ag or Cu can be used.
  • a metal such as Cu can be used.
  • the bonding between the terminal portion and the conductor layers 12 and 22 is not limited to a mode in which a conductive adhesive such as solder is used, but laser welding may be used or ultrasonic bonding may be used.
  • the conductor plate 300 is placed on a mold 400 having a mold recess 410 (first placing step, see FIG. 8A).
  • the conductor plate 300 is pressed against the mold 400 by a pressing member or the like to form the first column portion 62 corresponding to the mold recess 410 on the other side of the conductor plate 300 (first column portion forming step, (Refer FIG.8 (b)).
  • first column portion forming step (Refer FIG.8 (b)).
  • the conductor plate 300 bends to the mold recess 410 side, and the first recess 67 is formed at a position corresponding to the first column portion 62 on one side of the conductor plate 300.
  • 8B and 8C exaggerate the bending state of the conductor plate 300.
  • the first groove portion 64 is formed on the one side surface of the conductor plate 300 by pressing the pressing member 450 having the protruding portion 460 against one side of the conductor plate 300 (first groove portion forming step, FIG. )reference).
  • first groove portion forming step, FIG. first groove portion forming step, FIG.
  • the step of forming the first flat surface 69 and the step of forming the first groove portion 64 may be performed separately.
  • the first flat surface 69 may be formed by a pressing member, and then the first groove portion 64 may be formed by pressing a member such as the protruding portion 460, or conversely, the first groove portion 64 is formed.
  • the first flat surface 69 may be formed later.
  • the conductor plate 300 is placed on a die having a die recess 410 (see a second placement step, see FIG. 8A).
  • the conductor plate 300 is pressed toward the mold to form the second pillar portion 72 corresponding to the mold recess 410 on the other side of the conductor plate 300 (second pillar portion forming step, FIG. 8B). reference).
  • the conductor plate 300 bends to the mold recess 410 side, and a second recess 77 is formed at a position corresponding to the second column portion 72 on one side of the conductor plate 300.
  • 8B and 8C exaggerate the bending state of the conductor plate 300.
  • the second groove portion 74 is formed on the one side surface of the conductor plate 300 (second groove portion forming step, FIG. )reference).
  • the bending of the conductor plate 300 toward the mold concave portion 410 is corrected, the shape is close to flat, and the second flat surface 79 is formed.
  • the step of forming the second flat surface 79 and the step of forming the second groove 74 may be performed separately.
  • the second flat surface 79 may be formed by a pressing member, and then the second groove portion 74 may be formed by pressing a member such as the protruding portion 460, or conversely, the second groove portion 74 is formed.
  • the second flat surface 79 may be formed later.
  • the first electronic element 13 is arranged on the first jig 500 (first electronic element arrangement step, see FIG. 9A).
  • the first connection body 60 is arranged on the first electronic element 13 via a conductive adhesive such as solder (refer to the first connection body arrangement step, FIG. 9B). Note that FIG. 9 does not show a conductive adhesive such as solder.
  • the second electronic element 23 is disposed on the first connecting body 60 via a conductive adhesive (see the second electronic element disposing step, FIG. 9C). Note that the conductive adhesive on the first connection body 60 is disposed on the inner periphery of the first groove portion 64 of the first electronic element 13.
  • the second connector 70 is placed on the second jig 550 (second electronic element placement step, see FIG. 9D).
  • the second jig 550 may have a plurality of jig recesses 560 at positions where the second connector 70 is disposed.
  • the height of the jig recess 560 may correspond to the height of the chip module. Note that the height of the jig recess 560 corresponds to the height of the chip module because the height of the chip module is not less than the overall design thickness considering the thickness of the conductive adhesive. It means that 560 has.
  • the second connector 550 is inverted in a state where the second connector 70 is adsorbed to the second jig 550 using a suction member or the like, and the second connector 550 is connected to the second electronic element 23 via a conductive adhesive. 70 is placed (inversion placing process, see FIG. 9E).
  • the conductive adhesive is cured (curing process). In this way, a chip module having the first electronic element 13 and the second electronic element 23 is manufactured.
  • a chip module is placed between the first substrate 11 and the second substrate 21.
  • the electronic module of this Embodiment is manufactured by inject
  • the first groove portion 64 is provided on one side of the first head portion 61, when the conductive adhesive is melted, the first groove portion 64 Can be prevented from spreading outward.
  • the conductor plate 300 bends when the first pillar portion 62 is formed. As shown in FIG. One groove portion 64 is formed.
  • the first concave portion 67 and the first flat surface 69 are formed with the first groove portion 64 as a boundary.
  • the conductive adhesive can be retained in the first recess 67 when the conductive adhesive is melted, and the first flat surface 69 can be reliably provided outside the periphery.
  • it is beneficial in that the thickness of the conductive adhesive can be secured by fastening the conductive adhesive in the first recess 67.
  • the second electronic element 23 can be arranged along the surface direction on the first flat surface 69, and the second electronic element 23 from the first connection body 60 can be arranged. It is also useful in that it is difficult to apply stress.
  • the first groove portion 64 adopts an aspect in which the first groove portion 64 is provided on the entire outer periphery of the first pillar portion 62 in a plan view (surface direction), the outer periphery outwards when the conductive adhesive is melted. It can prevent more reliably that a conductive adhesive flows out.
  • the 1st connection body 60 has the 1st pillar part 62
  • the 1st electronic element 13 and the 2nd electronic element 23 can be spaced apart to a certain extent, and heat can be released. It is also beneficial in terms.
  • the first concave portion 67 can also be formed by forming such a first column portion 62. As a result, the molten conductive adhesive stays in the first recess 67, which is advantageous in that the molten conductive adhesive can be prevented from flowing out of the periphery.
  • the second connection body 70 is the same as the first connection body 60.
  • the conductor plate 300 is bent when the second column portion 72 is formed.
  • the second groove portion is corrected when the bending is corrected.
  • 74 is formed.
  • the second recess 77 and the second flat surface 79 are formed with the second groove 74 as a boundary.
  • the second connecting body 70 adopts an aspect having the second column portion 72 extending from the second head portion 71 to the other side, a space can be provided on one side of the second electronic element 23, It is possible to prevent heat generated from the second electronic element 23 from being generated.
  • the second concave portion 77 can also be formed by forming such a second column portion 72. As a result, the molten conductive adhesive stays in the second recess 77, which is advantageous in that the molten conductive adhesive can be prevented from flowing out of the periphery.
  • the second groove portion 74 is provided on the entire outer periphery of the second pillar portion 72 in a plan view (surface direction), when the conductive adhesive is melted, the outer periphery is outward. It can prevent more reliably that a conductive adhesive flows out.
  • the angle formed between the surface of the first groove 64 and the surface of the first recess 67 is set to about 90 degrees. Since the surface tension of the conductive adhesive can be increased, the conductive adhesive can hardly flow into the first recess 67.
  • the angle formed between the surface of the second groove 74 and the surface of the second recess 77 is about 90 degrees. Since the surface tension of the conductive adhesive can be increased, the conductive adhesive can hardly flow into the second recess 77.
  • the first groove portion 64 when the cross section of the first groove portion 64 is triangular, the first groove portion 64 can be formed relatively easily, and the first flat surface 69 can be easily formed. Useful in terms.
  • the cross section of the second groove portion 74 when the cross section of the second groove portion 74 is triangular as shown in FIG. 4A, the second groove portion 74 can be formed relatively easily, and the second flat surface 79 is also formed. It is useful in that it is easy to do.
  • the first flat surface 69 When the first flat surface 69 is inclined so as to be separated to one side with respect to the surface including the second direction and the third direction toward the outer periphery, the first flat surface It is advantageous in that the melted conductive adhesive can be prevented from flowing out of the peripheral edge of the first connection body 60 even by the inclination of 69.
  • the second flat surface 79 is inclined so as to be separated to one side with respect to the surface including the second direction and the third direction as going outward from the peripheral edge, This is advantageous in that the melted conductive adhesive can be prevented from flowing out of the peripheral edge of the second connection body 70 even by the inclination of the two flat surfaces 79.
  • the first groove portion 64 is provided at the boundary between the first inclined surface 68 and the first flat surface 69, and the second groove portion 74 includes the second inclined surface 78 and the second flat surface 79.
  • the first groove portion 64 is provided on the outer periphery of the first recess portion 67, and the first groove portion 64 is provided.
  • the second groove portion 74 is provided on the outer periphery of the second concave portion 77, and the second groove portion 74 is provided on the second flat surface 79.
  • the first groove portion 64 is provided on the first flat surface 69 and the second groove portion 74 is provided on the second flat surface 79, as shown in the first embodiment.
  • the protrusion 460 is positioned further outward from the periphery of the periphery of the mold recess 410 (see FIG. 12C).
  • the first groove portion 64 is provided on the outer periphery of the first recess 67 and the first groove portion 64 is provided on the first flat surface 69 as in the present embodiment, Even if the conductive adhesive flows out to the outer periphery of the first recess 67 while preventing the conductive adhesive melted by the recess 67 from spreading to the outer periphery, the first groove 64 causes the conductive adhesive to flow out. This is beneficial in that it can be prevented from spreading outward from the periphery.
  • the second concave portion 77 is melted. Even if the conductive adhesive flows out to the outer periphery of the second recess 77 while preventing the conductive adhesive from spreading outward to the periphery, the conductive adhesive spreads outward from the periphery by the second groove 74. This is beneficial in that it can be prevented.
  • the first groove portion 64 is provided on the first inclined surface 68 and the second groove portion 74 is formed on the second inclined surface 78. Is provided. About another structure, all the aspects demonstrated by said each embodiment are employable. The members described in the above embodiments will be described using the same reference numerals.
  • the conductive adhesive itself can be prevented from flowing out from the first concave portion 67.
  • the second groove portion 74 is provided on the second inclined surface 78, it is advantageous in that the conductive adhesive itself can be prevented from flowing out from the second recess 77.
  • the angle ⁇ 1 formed by the first inclined surface 68 and the inner peripheral surface of the first groove portion 64 is the first inclined surface 68 and the first groove portion 64. It may be reduced as compared with the angle beta 1 to a surface of the outer peripheral side is formed. In this case, the angle formed between the first inclined surface 68 and the inner peripheral surface of the first groove portion 64 can be reduced, and the surface tension of the conductive adhesive can be increased. Therefore, the conductive adhesive can be made difficult to flow into the first groove portion 64, and as a result, the conductive adhesive can be prevented from spreading outward from the periphery.
  • the angle ⁇ 2 formed by the second inclined surface 78 and the inner peripheral surface of the second groove portion 74 is the first inclined surface 68 and the second groove portion. It becomes smaller than the angle formed by the outer peripheral surface of 74. In this case, the angle formed between the second inclined surface 78 and the inner peripheral surface of the second groove 74 can be reduced, and the surface tension of the conductive adhesive can be increased. Therefore, the conductive adhesive can be made difficult to flow into the second groove portion 74, which is also advantageous in that the conductive adhesive can be prevented from spreading outward to the periphery.
  • first flat surface 69 or first inclined surface 68 one side surface of the first head portion 61 and the inner peripheral side of the first groove portion 64 are provided.
  • the angle formed by the surface may be smaller than the angle formed by the surface on one side of the first head portion 61 and the surface on the outer peripheral side of the first groove portion 64.
  • an angle formed by one surface (second flat surface 79 or second inclined surface 78) of the second head portion 71 and the inner peripheral surface of the second groove portion 74 is one side of the second head portion 71.
  • the angle formed by the outer peripheral surface of the second groove 74 may be smaller.
  • the relationship between the 1st groove part 64 in the 1st connection body 60, the 1st inclined surface 68, and the 1st flat surface 69, and the 2nd groove part 74 and the 2nd inclined surface 78 in the 2nd connection body 70 are shown.
  • the relationship with the second flat surface 79 has been described using the same mode, but is not limited thereto.
  • the first connection body 60 is the aspect described in the first embodiment
  • the second connection body 70 may be the aspect described in the second embodiment or the third embodiment. Good.
  • the 2nd connection body 70 is the aspect demonstrated in 1st Embodiment, even if the 1st connection body 60 is the aspect demonstrated in 2nd Embodiment or 3rd Embodiment. Good.
  • the first connection body 60 having a substantially T-shaped cross section is used.
  • the first connection body 60 of the present embodiment has a first head portion 61.
  • the support 65 is in contact with the first conductor layer 12 or the first substrate 11.
  • All the aspects demonstrated by said each embodiment are employable.
  • the members described in the above embodiments will be described using the same reference numerals.
  • the second electronic element is mounted when the second electronic element 23 is mounted or after the second electronic element 23 is mounted. It is possible to prevent the first connecting body 60 from being inclined by the weight of 23. Moreover, heat dissipation can be improved because the support part 65 contacts the 1st board
  • the some support part 65 is provided like this Embodiment, it is beneficial at the point which can provide the 1st connection body 60 more stably and can implement
  • Each of the support portions 65 may have support base end portions 69 (69a to 69d) that extend in the surface direction and come into contact with the first substrate 11 or the first conductor layer 12. Further, it is not necessary to provide the support base end portion 69 in each of the plurality of support portions 65, the support base end portion 69 is provided in a part of the plurality of support portions 65, and the support base end portion 69 is provided in the remaining portion. It may not be provided.
  • the first connection body 60 can be arranged on the first substrate 11 or the first conductor layer 12 in a more balanced manner. Since the contact area with the 1st board
  • Each of the support parts 65 may contact the first conductor layer 12.
  • the first conductor layer 12 connected to the support portion 65 is not electrically connected to the other first conductor layer 12, second conductor layer 22, first electronic element 13, and second electronic element 23.
  • the first head portion 61 has a first flat surface 69 on the outer periphery as shown in FIGS. 5, 10, and 13. Is beneficial.
  • the support portion 65 and the first conductor layer 12 or the first substrate 11 may not be reliably brought into contact with each other. There is sex.
  • the support portion 65 and the first conductor layer 12 or the first substrate 11 can be reliably brought into contact with each other. It is advantageous in that the effect of improving the stability and the effect of improving the heat dissipation realized by the support portion 65 can be enhanced. From this point of view, it is preferable that the inclination angle with respect to the surface direction of the first flat surface 69 is small, and the inclination angle with respect to the surface direction of the first flat surface 69 is, for example, 3 degrees or less.
  • providing the first groove portion 64 is advantageous in that the first flat surface 69 can be reliably extended along the surface direction.
  • the inclination angle with respect to the surface direction of the first flat surface 69 is more reliable. It is beneficial in that it can be made smaller.
  • the 1st groove part 64 is provided in the 1st flat surface 69 like 2nd Embodiment, the inclination
  • Each of the support portions 65 extends in the height direction (first direction) from the end portion of the surface direction support portion 166 and the surface direction support portion 166 (166a-166d) extending in the surface direction from the first head portion 61. It may have a height direction support portion 165 (165a-165d) (see also a sixth embodiment described later).
  • the surface direction support portion 166 means a portion having a length in the width direction shorter than that of the first head portion 61.
  • the support part 65 does not have the surface direction support part 166 but may have only the height direction support part 165 extending in the height direction (first direction) from the first head part 61.
  • the second connecting body 70 having the second pillar portion 72 having a substantially T-shaped cross section has been described.
  • the present embodiment as shown in FIG. 70 has an extending portion 75 (75a, 75b) extending from the second head portion 71 to the other side.
  • extending portion 75 75a, 75b
  • all the aspects demonstrated by each embodiment mentioned above are employable.
  • the members described in the above embodiments will be described using the same reference numerals.
  • the extending portion 75 since the extending portion 75 is provided, heat from the second electronic element 23 can be efficiently radiated, and a high heat radiating effect can also be realized by the second connection body 70. . Moreover, when the some extension part 75 is provided like this Embodiment, it is beneficial at the point which can implement
  • Each of the extended portions 75 may abut on the first conductor layer 12.
  • the first conductor layer 12 connected to the extending portion 75 may not be electrically connected to the other first conductor layer 12, the second conductor layer 22, the first electronic element 13, and the second electronic element 23. Good.
  • Each of the extended portions 75 may have extended base end portions 79 (79a, 79b) that extend in the surface direction and come into contact with the first substrate 11 or the first conductor layer 12. Further, it is not necessary to provide the extended base end portion 79 in each of the plurality of extending portions 75, and the extended base end portion 79 is provided in a part of the plurality of extending portions 75 and extends to the remaining portion. The base end 79 may not be provided.
  • the second connecting body 70 can be arranged on the first substrate 11 or the first conductor layer 12 in a more balanced manner, and the extended proximal end portion Since the contact area with the first substrate 11 or the first conductor layer 12 can be increased by 79, the heat dissipation effect can be enhanced.
  • the second head portion 71 has a second flat surface 79 on the outer periphery as shown in FIGS. 6, 11, and 14. It is beneficial. When the second head portion 71 is inclined along the first direction outside the peripheral edge, the extended portion 75 and the first conductor layer 12 or the first substrate 11 cannot be reliably brought into contact with each other. there is a possibility. On the other hand, when the second head portion 71 has the second flat surface 79 at the outer peripheral edge, the extending portion 75 and the first conductor layer 12 or the first substrate 11 can be reliably brought into contact with each other. This is advantageous in that the effect of improving the stability and the effect of improving the heat dissipation realized by the extending portion 75 can be enhanced. From this viewpoint, it is preferable that the inclination angle with respect to the surface direction of the second flat surface 79 is small, and the inclination angle with respect to the surface direction of the second flat surface 79 is, for example, 3 degrees or less.
  • providing the second groove 74 is advantageous in that the second flat surface 79 can be reliably extended along the surface direction.
  • the inclination angle with respect to the surface direction of the second flat surface 79 is more reliable. It is beneficial in that it can be made smaller.
  • the second groove portion 74 is provided on the second flat surface 79 as in the second embodiment, the inclination angle with respect to the surface direction is more surely smaller than the second groove portion 74 at the outer peripheral edge. It is beneficial in that it can be done.
  • a repulsive force that pushes the second substrate 21 back to one side by the second connecting body 70 can be applied.
  • a force is applied to the first substrate 11 and the second substrate 21 to be warped or distorted by the application of heat, but the second connection body 70 having the extended portions 75 (particularly, a plurality of extended portions 75) is used. This is advantageous in that warpage and distortion of the first substrate 11 and the second substrate 21 can be prevented.
  • the extending portion 75 of the present embodiment has a height direction extending portion 175 (175a, 175b) extending from the second head portion 71 in the height direction (first direction).
  • both the support portion 65 and the extension portion 75 may be employed.
  • a mode in which three support portions 65 and three extension portions 75 are used will be described as an example.
  • all the aspects demonstrated by each embodiment mentioned above are employable.
  • the members described in the above embodiments will be described using the same reference numerals.
  • the extending portion 75 includes a surface direction extending portion 176 (176a-176c) extending in the surface direction from the second head portion 71 and a height direction from the surface direction extending portion 176 ( And a height extending portion 175 (175a-175c) extending in the first direction).
  • the surface direction extending portion 176 means a portion whose size in the width direction is smaller than that of the second head portion 71.
  • the first groove portion 64 is provided on one surface of the first connection body 60, but the second groove portion 74 is not provided in the second connection body 70.
  • the second connection part 70 is provided with the second groove part 74 on one surface, but the first connection part 60 is not provided with the first groove part 64. You can also.

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Abstract

電子モジュールは、第一電子素子１３と、前記第一電子素子１３の一方側に設けられた第一接続体６０であって、他方側に延びた第一柱部６２と、一方側の面に設けられた第一溝部６４とを有する第一接続体６０と、前記第一接続体６０の一方側であって、前記第一溝部６４の周縁内方に設けられた導電性接着剤を介して設けられた第二電子素子２３と、を有する。前記第一接続体６０は、一方側の前記第一柱部６２に対応した位置で第一凹部６７を有する。

Description

電子モジュール、接続体の製造方法及び電子モジュールの製造方法
　本発明は、接続体を有する電子モジュール、接続体の製造方法及び電子モジュールの製造方法に関する。
　複数の電子素子が封止樹脂内に設けられた電子モジュールが従来から知られている（例えば特開２０１４－４５１５７号参照）。このような電子モジュールに関して小型化することが望まれている。
　小型化する一つの手段として、電子素子を層状に積み重ねていく態様を採用することが考えられる。その際には、電子素子（第一電子素子）の一方側（例えばおもて面側）に接続体を設け、当該接続体の一方側にはんだ等の導電性接着剤を介して別の電子素子（第二電子素子）を設けることが考えられる。
　このような接続体は第一電子素子の一方側に設けられることから、そのバランスを崩す可能性がある。このように接続体がバランスを崩すと導電性接着剤が接続体の一方側の面から流れ出てしまうこともある。
　また、第一電子素子に設けられた接続体に、さらに第二電子素子を設ける態様を採用した場合には、熱が籠りやすくなることから、電子素子同士を離間させることが有益になる。
　本発明は、導電性接着剤が流れ出ることを防止でき、かつ、電子素子同士を離間させることで電子素子同士から発生する熱が籠ることを防止する電子モジュールを提供する。
　本発明による電子モジュールは、
　第一電子素子と、
　前記第一電子素子の一方側に設けられた第一接続体であって、他方側に延びた第一柱部と、一方側の面に設けられた第一溝部とを有する第一接続体と、
　前記第一接続体の一方側であって、前記第一溝部の周縁内方に設けられた導電性接着剤を介して設けられた第二電子素子と、
　を備え、
　前記第一接続体が、一方側の前記第一柱部に対応した位置に第一凹部を有してもよい。
　本発明による電子モジュールにおいて、
　前記第一接続体の前記一方側の面は、第一傾斜面と、前記第一傾斜面の周縁外方に設けられた第一平坦面とを有し、
　前記第一溝部は、前記第一傾斜面と前記第一平坦面との境界に設けられてもよい。
　本発明による電子モジュールにおいて、
　前記第一接続体の前記一方側の面は、第一傾斜面と、前記第一傾斜面の周縁外方に設けられた第一平坦面とを有し、
　前記第一溝部は、前記第一平坦面に設けられてもよい。
　本発明による電子モジュールにおいて、
　前記第一接続体の前記一方側の面は、第一傾斜面と、前記第一傾斜面の周縁外方に設けられた第一平坦面とを有し、
　前記第一溝部は、前記第一傾斜面に設けられてもよい。
　本発明による電子モジュールにおいて、
　縦断面で見たときに、前記第一傾斜面と前記第一溝部の内周側の面が形成する角度は、前記第一傾斜面と前記第一溝部の外周側の面が形成する角度と比較して小さくなってもよい。
　本発明による接続体の製造方法は、
　導体板を、金型凹部を有する金型に載置する工程と、
　前記導体板を前記金型に向かって押し付けて、前記金型凹部に対応した第一柱部を前記導体板の他方側に形成し、前記導体板の一方側であって前記第一柱部に対応した位置に第一凹部を形成する工程と、
　突出部を有する部材を前記導体板の一方側に押し付けることで、前記導体板の一方側の面に第一溝部を形成する工程と、
　を備えてもよい。
　本発明による電子モジュールの製造方法は、
　前述した接続体を第一電子素子に載置する工程と、
　第二電子素子を前記接続体に導電性接着剤を介して載置する工程と、
　を備え、
　前記導電性接着剤が前記第一溝部の周縁内方に設けられてもよい。
　本発明の一態様として、第一接続体が第一柱部を有する態様を採用した場合には、第一電子素子と第二電子素子とを一定程度離間させることができ、熱を逃がすことができる。また、第一ヘッド部の一方側の面に第一溝部が設けられる態様を採用した場合には、導電性接着剤が溶融したときに第一溝部よりも外方に広がることを防止できる。
図１は、本発明の第１の実施の形態で用いられうる電子モジュールの縦断面図である。 図２、本発明の第１の実施の形態で用いられうる電子モジュールの平面図である。 図３（ａ）は、本発明の第１の実施の形態で用いられうる第一接続体の縦断面図であり、図３（ｂ）は、本発明の第１の実施の形態で用いられうる別の第一接続体の縦断面図である。 図４（ａ）は、本発明の第１の実施の形態で用いられうる第二接続体の縦断面図であり、図４（ｂ）は、本発明の第１の実施の形態で用いられうる別の第二接続体の縦断面図である。 図５は、本発明の第１の実施の形態で用いられうる第一接続体の縦断面図であり、第一凹部を誇張して示した縦断面図である。 図６は、本発明の第１の実施の形態で用いられうる第二接続体の縦断面図であり、第二凹部を誇張して示した縦断面図である。 図７は、本発明の第１の実施の形態で用いられうる電子モジュールであり、図１とは異なる断面で切断した縦断面図である。 図８（ａ）－（ｃ）は本発明の第１の実施の形態で用いられうる第一接続体及び第二接続体の製造工程を示した縦断面図であり、第一柱部、第一凹部、第二柱部、第二凹部等を誇張して示した縦断面図である。 図９（ａ）－（ｅ）は本発明の第１の実施の形態で用いられうるチップモジュールの製造工程を示した縦断面図である。 図１０は、本発明の第２の実施の形態で用いられうる第一接続体の縦断面図であり、第一凹部を誇張して示した縦断面図である。 図１１は、本発明の第２の実施の形態で用いられうる第二接続体の縦断面図であり、第二凹部を誇張して示した縦断面図である。 図１２（ａ）－（ｃ）は本発明の第２の実施の形態で用いられうる第一接続体及び第二接続体の製造工程を示した縦断面図であり、第一柱部、第一凹部、第二柱部、第二凹部等を誇張して示した縦断面図である。 図１３は、本発明の第３の実施の形態で用いられうる第一接続体の縦断面図であり、第一凹部を誇張して示した縦断面図である。 図１４は、本発明の第３の実施の形態で用いられうる第二接続体の縦断面図であり、第二凹部を誇張して示した縦断面図である。 図１５（ａ）－（ｃ）は本発明の第３の実施の形態で用いられうる第一接続体及び第二接続体の製造工程を示した縦断面図であり、第一柱部、第一凹部、第二柱部、第二凹部等を誇張して示した縦断面図である。 図１６、本発明の第４の実施の形態で用いられうる電子モジュールの平面図である。 図１７は、本発明の第５の実施の形態で用いられうる電子モジュールの縦断面図である。 図１８は、本発明の第６の実施の形態で用いられうる電子モジュールの斜視図である。 図１９は、本発明の第６の実施の形態で用いられうる電子モジュールの平面図である。 図２０は、本発明の第６の実施の形態で用いられうる電子モジュールの側方図である。
第１の実施の形態
《構成》
　本実施の形態において、「一方側」は図１の上方側を意味し、「他方側」は図１の下方側を意味する。図１の上下方向を「第一方向」と呼び、左右方向を「第二方向」と呼び、紙面の表裏方向を「第三方向」と呼ぶ。第二方向及び第三方向を含む面内方向を「面方向」といい、一方側から見た場合には「平面視」という。
　本実施の形態の電子モジュールは、第一電子ユニットと、第二電子ユニットとを有してもよい。
　図１に示すように、第一電子ユニットは、第一基板１１と、第一基板１１の一方側に設けられた複数の第一導体層１２と、第一導体層１２の一方側に設けられた第一電子素子１３と、を有してもよい。第一電子素子１３はスイッチング素子であってもよいし、制御素子であってもよい。第一電子素子１３がスイッチング素子である場合には、第一電子素子１３はＭＯＳＦＥＴやＩＧＢＴ等であってもよい。第一電子素子１３及び後述する第二電子素子２３の各々は半導体素子から構成されてもよく、半導体材料としてはシリコン、炭化ケイ素、窒化ガリウム等であってもよい。第一電子素子１３の他方側の面は第一導体層１２とはんだ等の導電性接着剤を介して接続されてもよい。
　第一電子素子１３の一方側には第一接続体６０が設けられてもよい。第一接続体６０は第一電子素子１３の一方側の面とはんだ等の導電性接着剤を介して接続されてもよい。
　図１に示すように、第一接続体６０の一方側には第二電子ユニットが設けられてもよい。第二電子ユニットは、第一接続体６０の一方側に設けられた第二電子素子２３を有してもよい。また、第二電子ユニットは、第二基板２１と、第二基板２１の他方側に設けられた第二導体層２２を有してもよい。第二導体層２２の他方側には第二接続体７０が設けられてもよい。第二導体層２２が設けられている場合には、図１に示す態様とは異なり第二導体層２２に第二電子素子２３が設けられてもよい。第二接続体７０は第二電子素子２３の一方側の面及び第二導体層２２の他方側の面とはんだ等の導電性接着剤を介して接続されてもよい。
　第二電子素子２３はスイッチング素子であってもよいし、制御素子であってもよい。第二電子素子２３がスイッチング素子である場合には、第二電子素子２３はＭＯＳＦＥＴやＩＧＢＴ等であってもよい。
　第一接続体６０は、第一ヘッド部６１と、第一ヘッド部６１から他方側に延びた第一柱部６２を有してもよい。第二接続体７０は、第二ヘッド部７１と、第二ヘッド部７１から他方側に延びた第二柱部７２を有してもよい。第一接続体６０は断面が略Ｔ字形状となり、第二接続体７０も断面が略Ｔ字形状となってもよい。
　図２に示すように、第一ヘッド部６１の一方側の面には第一溝部６４が設けられてもよい。第一溝部６４は、平面視（面方向）において、第一柱部６２の周縁外方に設けられているが、周縁外方の一部に設けられてもよいし、第一柱部６２の周縁外方の全部に設けられてもよい。第一ヘッド部６１の一方側の面であって、第一溝部６４の周縁内方にははんだ等の導電性接着剤が設けられてもよく、導電性接着剤を介して第二電子素子が設けられてもよい。第一溝部６４の断面は、図３（ｂ）で示すように矩形状であってもよいし、図３（ａ）で示すように三角形状であってもよい。三角形状としては、直角三角形であってもよいし、二等辺三角形であってもよい。
　図４に示すように、第二ヘッド部７１の一方側の面には第二溝部７４が設けられてもよい。第二溝部７４は、平面視において、第二柱部７２の周縁外方の一部に設けられてもよいし、第二柱部７２の周縁外方の全部に設けられてもよい。第二ヘッド部７１の一方側の面であって、第二溝部７４の周縁内方にははんだ等の導電性接着剤が設けられてもよく、導電性接着剤を介して第二ヘッド部７１の一方側の面と第二導体層２２とが接続されてもよい。第二溝部７４の断面も、図４（ｂ）で示すように矩形状であってもよいし、図４（ａ）で示すように三角形状であってもよい。三角形状としては、直角三角形であってもよいし、二等辺三角形であってもよい。
　図５に示すように、第一ヘッド部６１の一方側の面は第一柱部６２に対応した位置で第一凹部６７を有してもよく、第一溝部６４は第一凹部６７の周縁部に設けられてもよい。なお、このような態様に限られることはなく、後述する第２の実施の形態のように、第一溝部６４は第一凹部６７の周縁外方に設けられてもよいし、第３の実施の形態のように、第一溝部６４は第一凹部６７の周縁内方に設けられてもよい。「第一柱部６２に対応した位置で第一凹部６７」が設けられるというのは、第一方向に沿って見たときに、第一柱部６２が設けられた位置に第一凹部６７が設けられていることを意味している。
　第一接続体６０の一方側の面は、第一傾斜面６８と、第一傾斜面６８の周縁外方に設けられた第一平坦面６９とを有してもよい。第一溝部６４は、第一傾斜面６８と第一平坦面６９との境界に設けられてもよい。第一平坦面６９は必ずしも完全に面方向に沿って延在している必要はない。本実施の形態における第一平坦面６９とは、第一傾斜面６８より周縁外方に位置し、かつ第二方向及び第三方向を含む面に対する傾斜角度が第一傾斜面６８よりも小さい面のことを意味している。なお、第一傾斜面６８は第一凹部６７に含まれており、第一凹部６７の周縁部が第一傾斜面６８と第一平坦面６９との境界に該当している。また、第一溝部６４が第一傾斜面６８と第一平坦面６９の「境界」に設けられるとは、第一溝部６４の一部が当該境界に位置していればよく、図５に示すように第一傾斜面６８に第一溝部６４の大部分が位置してもよいし、図８（ｃ）に示すように第一平坦面６９に第一溝部６４の大部分が位置してもよい。
　図６に示すように、第二ヘッド部７１の一方側の面は第二柱部７２に対応した位置で第二凹部７７を有してもよく、第二溝部７４は第二凹部７７の周縁部に設けられてもよい。なお、このような態様に限られることはなく、後述する第２の実施の形態のように、第二溝部７４は第二凹部７７の周縁外方に設けられてもよいし、第３の実施の形態のように、第二溝部７４は第二凹部７７の周縁内方に設けられてもよい。「第二柱部７２に対応した位置で第二凹部７７」が設けられるというのは、第一方向に沿って見たときに、第二柱部７２が設けられた位置に第二凹部７７が設けられていることを意味している。
　第二接続体７０の一方側の面は、第二傾斜面７８と、第二傾斜面７８の周縁外方に設けられた第二平坦面７９とを有してもよい。第二溝部７４は、第二傾斜面７８と第二平坦面７９との境界に設けられてもよい。第二平坦面７９は必ずしも完全に面方向に沿って延在している必要はない。本実施の形態における第二平坦面７９とは、第二傾斜面７８より周縁外方に位置し、かつ第二方向及び第三方向を含む面に対する傾斜角度が第二傾斜面７８よりも小さい面のことを意味している。なお、第二傾斜面７８は第二凹部７７に含まれており、第二凹部７７の周縁部が第二傾斜面７８と第二平坦面７９との境界に該当している。また、第二溝部７４が第二傾斜面７８と第二平坦面７９の「境界」に設けられるとは、第二溝部７４の一部が当該境界に位置していればよく、図６に示すように第二傾斜面７８に第二溝部７４の大部分が位置してもよいし、図８（ｃ）に示すように第二平坦面７９に第二溝部７４の大部分が位置してもよい。
　図７に示すように、第二電子素子２３の一方側に第三接続体８０が設けられてもよい。この第三接続体８０は、第三ヘッド部８１と、第三ヘッド部８１から他方側に延びた第三柱部８２を有してもよい。第三接続体８０は、はんだ等の導電性接着剤を介して第二導体層２２の他方側の面及び第二電子素子２３の一方側の面に接続されてもよい。なお、第三接続体８０として、第三柱部８２を有する縦断面が略Ｔ字形状となっているものではなく、一般的な接続子８５（図１８参照）を利用してもよい。
　図２に示すように、平面視において、第一電子素子１３は、第一ヘッド部６１から外方に露出する態様となってもよい。第一電子素子１３がＭＯＳＦＥＴ等のスイッチング素子である場合には、外方から露出した部分に第一ゲート端子１３ｇ等が設けられてもよい。同様に、第二電子素子２３がＭＯＳＦＥＴ等のスイッチング素子である場合には、一方側の面に第二ゲート端子２３ｇ等が設けられてもよい。図２に示す第一電子素子１３は、一方側の面に第一ゲート端子１３ｇと第一ソース端子１３ｓを有し、第二電子素子２３は、一方側の面に第二ゲート端子２３ｇと第二ソース端子２３ｓを有している。この場合、第二接続体７０が第二電子素子２３の第二ソース端子２３ｓに導電性接着剤を介して接続され、第三接続体８０が第二電子素子２３の第二ゲート端子２３ｇに導電性接着剤を介して接続されてもよい。また、第一接続体６０は第一電子素子１３の第一ソース端子１３ｓと第二電子素子２３の他方側に設けられた第二ドレイン端子とを導電性接着剤を介して接続してもよい。第一電子素子１３の他方側に設けられた第一ドレイン端子は導電性接着剤を介して第一導体層１２に接続されてもよい。第一電子素子１３の第一ゲート端子１３ｇは導電性接着剤を介して第四接続体９５（例えば接続子、図１９参照）に接続され、当該第四接続体９５は導電性接着剤を介して第一導体層１２に接続されてもよい。
　第一電子素子１３及び第二電子素子２３のいずれか一方だけがスイッチング素子の場合には、第一接続体６０に載置される第二電子素子２３を発熱性の低い制御素子とし、第一電子素子１３をスイッチング素子にすることも考えられる。逆に、第一接続体６０に載置される第二電子素子２３をスイッチング素子とし、第一電子素子１３を発熱性の低い制御素子にすることも考えられる。
　電子モジュールは、第一電子素子１３、第二電子素子２３、第一接続体６０、第二接続体７０、第三接続体８０、第四接続体９５、第一導体層１２及び第二導体層２２を封止する封止樹脂等から構成される封止部９０を有してもよい（図１参照）。
　第一導体層１２は端子部（図示せず）と接続されてもよく、端子部の先端側は封止部９０の外方に露出して、外部装置と接続可能となってもよい。
　また、第一電子素子１３、第二電子素子２３、第一接続体６０、第二接続体７０、第三接続体８０及び第四接続体９５によってチップモジュールが構成されてもよい。この場合には、第一電子素子１３、第二電子素子２３、第一接続体６０、第二接続体７０、第三接続体８０及び第四接続体９５を有するチップモジュールを、第一導体層１２が設けられた第一基板１１及び第二導体層２２が設けられた第二基板２１の間に配置した後で封止部９０によって封止することで、電子モジュールが製造されてもよい。
　第一基板１１及び第二基板２１としては、セラミック基板、絶縁樹脂層等を採用することができる。導電性接着剤としては、はんだの他、ＡｇやＣｕを主成分とする材料を用いることもできる。第一接続体６０及び第二接続体７０の材料としてはＣｕ等の金属を用いることができる。なお、基板１１，２１としては例えば回路パターニングを施した金属基板を用いることもでき、この場合には、基板１１，２１が導体層１２，２２を兼ねることになる。
　端子部と導体層１２，２２との接合は、はんだ等の導電性接着剤を利用する態様だけではなく、レーザ溶接を利用してもよいし、超音波接合を利用してもよい。
《製造方法》
　本実施の形態の第一接続体６０の製造方法の一例について説明する。
　まず、導体板３００を、金型凹部４１０を有する金型４００に載置する（第一載置工程、図８（ａ）参照）。
　次に、導体板３００を金型４００に向かって押付部材等によって押し付けて、金型凹部４１０に対応した第一柱部６２を導体板３００の他方側に形成する（第一柱部形成工程、図８（ｂ）参照）。この際、導体板３００は金型凹部４１０側に曲がり、導体板３００の一方側であって第一柱部６２に対応した位置に第一凹部６７が形成されることになる。なお、図８（ｂ）（ｃ）は導体板３００の曲がり具合を誇張して記載したものとなっている。
　次に、突出部４６０を有する押圧部材４５０を導体板３００の一方側に押し付けることで、導体板３００の一方側の面に第一溝部６４を形成する（第一溝部形成工程、図８（ｃ）参照）。このような押し付けを行うことで、導体板３００の周縁部における金型凹部４１０側への曲げが矯正され、平坦に近い形状になり、第一平坦面６９が形成される。
　なお、第一平坦面６９を形成する工程と第一溝部６４を形成する工程とは別々に行われてもよい。例えば、押圧部材によって第一平坦面６９を形成し、その後で、突出部４６０のような部材を押し付けることで第一溝部６４を形成してもよいし、逆に、第一溝部６４を形成した後で第一平坦面６９を形成してもよい。
　次に、本実施の形態の第二接続体７０の製造方法の一例について説明する。基本的には、第一接続体６０の製造方法と同様であり、図８を用いて説明する。
　まず、導体板３００を、金型凹部４１０を有する金型に載置する（第二載置工程、図８（ａ）参照）。
　次に、導体板３００を金型に向かって押し付けて、金型凹部４１０に対応した第二柱部７２を導体板３００の他方側に形成する（第二柱部形成工程、図８（ｂ）参照）。この際、導体板３００は金型凹部４１０側に曲がり、導体板３００の一方側であって第二柱部７２に対応した位置に第二凹部７７が形成されることになる。なお、図８（ｂ）（ｃ）は導体板３００の曲がり具合を誇張して記載したものとなっている。
　次に、突出部４６０を有する押圧部材４５０を導体板３００の一方側に押し付けることで、導体板３００の一方側の面に第二溝部７４を形成する（第二溝部形成工程、図８（ｃ）参照）。このような押し付けを行うことで、導体板３００の金型凹部４１０側への曲げが矯正され、平坦に近い形状になり、第二平坦面７９が形成される。
　なお、第二平坦面７９を形成する工程と第二溝部７４を形成する工程とは別々に行われてもよい。例えば、押圧部材によって第二平坦面７９を形成し、その後で、突出部４６０のような部材を押し付けることで第二溝部７４を形成してもよいし、逆に、第二溝部７４を形成した後で第二平坦面７９を形成してもよい。
　次に、本実施の形態の電子モジュールの製造方法の一例について説明する。ここで利用される第一接続体６０及び第二接続体７０は、前述した製造工程によって製造されたものを用いることができる。
　まず、第一治具５００に第一電子素子１３を配置する（第一電子素子配置工程、図９（ａ）参照）。
　次に、第一電子素子１３にはんだ等の導電性接着剤を介して第一接続体６０を配置する（第一接続体配置工程、図９（ｂ）参照）。なお、図９でははんだ等の導電性接着剤を示していない。
　次に、第一接続体６０に導電性接着剤を介して第二電子素子２３を配置する（第二電子素子配置工程、図９（ｃ）参照）。なお、第一接続体６０上の導電性接着剤は第一電子素子１３の第一溝部６４の周縁内方に配置されている。
　第二治具５５０に第二接続体７０を配置する（第二電子素子配置工程、図９（ｄ）参照）。第二治具５５０は、第二接続体７０が配置される位置に複数の治具凹部５６０を有してもよい。治具凹部５６０の高さは、チップモジュールの高さに対応してもよい。なお、治具凹部５６０の高さがチップモジュールの高さに対応しているというのは、導電性接着剤の厚みも考慮したチップモジュールの全体の設計上の厚み以上の高さを治具凹部５６０が有していることを意味している。
　吸引部材等を用いて第二接続体７０を第二治具５５０に吸着させた状態で第二治具５５０を反転させて、第二電子素子２３に導電性接着剤を介して第二接続体７０を配置する（反転載置工程、図９（ｅ）参照）。
　次に、導電性接着剤を硬化させる（硬化工程）。このようにして、第一電子素子１３及び第二電子素子２３を有するチップモジュールが製造される。
　なお、第一電子素子１３及び第二電子素子２３が封止樹脂等の封止部９０内に封入される場合には、第一基板１１と第二基板２１との間にチップモジュールを載置し、第一基板１１と第二基板２１との間に封止樹脂等の封止部９０を注入することで、本実施の形態の電子モジュールが製造される。
《作用・効果》
　次に、上述した構成からなる本実施の形態による作用・効果の一例について説明する。なお、「作用・効果」で説明するあらゆる態様を、上記構成で採用することができる。
　図３に示すように、第一ヘッド部６１の一方側の面であって、第一溝部６４が設けられる態様を採用した場合には、導電性接着剤が溶融したときに第一溝部６４よりも外方に広がることを防止できる。
　また、前述した製造工程で説明したように、第一柱部６２を形成する際に導体板３００が曲がることになるが、図８（ｃ）で示すように、この曲げを矯正する際に第一溝部６４が形成される。そして、本実施の形態では、第一溝部６４を境界として、第一凹部６７と第一平坦面６９が形成されることになる。このような態様を採用した場合には、導電性接着剤が溶融したときに第一凹部６７内に導電性接着剤を留めるとともに、周縁外方で第一平坦面６９を確実に設けることができる点で有益である。このように第一凹部６７内に導電性接着剤を留めることで、導電性接着剤の厚みを確保できる点で有益である。また、第一平坦面６９を設けることで、第二電子素子２３を第一平坦面６９に面方向に沿って配置することができ、第二電子素子２３に対して第一接続体６０からの応力がかかり難くなる点でも有益である。
　第一溝部６４が、平面視（面方向）において第一柱部６２の周縁外方の全部に設けられている態様を採用した場合には、導電性接着剤が溶融したときに周縁外方に導電性接着剤が流れ出ることをより確実に防止できる。
　なお、第一接続体６０が第一柱部６２を有する態様を採用した場合には、第一電子素子１３と第二電子素子２３とを一定程度離間させることができ、熱を逃がすことができる点でも有益である。本実施の形態では、このような第一柱部６２を形成することで第一凹部６７も形成することもできる。その結果として、溶融した導電性接着剤が第一凹部６７内に留まるようになり、溶融した導電性接着剤が周縁外方に流れ出ることを防止できる点で有益である。
　また、第二接続体７０でも第一接続体６０と同様である。前述した製造工程で説明したように、第二柱部７２を形成する際に導体板３００が曲がることになるが、図８（ｃ）で示すように、この曲げを矯正する際に第二溝部７４が形成される。そして、本実施の形態では、第二溝部７４を境界として、第二凹部７７と第二平坦面７９が形成されることになる。このような態様を採用した場合には、導電性接着剤が溶融したときに第二凹部７７内に導電性接着剤を留めるとともに、周縁外方で第二平坦面７９を確実に設けることができる点で有益である。
　また、第二接続体７０が第二ヘッド部７１から他方側に延びた第二柱部７２を有する態様を採用した場合には、第二電子素子２３の一方側に空間を設けることができ、第二電子素子２３から発生する熱が籠ることを防止できる。本実施の形態では、このような第二柱部７２を形成することで第二凹部７７も形成することもできる。その結果として、溶融した導電性接着剤が第二凹部７７内に留まるようになり、溶融した導電性接着剤が周縁外方に流れ出ることを防止できる点で有益である。
　第二溝部７４が、平面視（面方向）において第二柱部７２の周縁外方の全部に設けられている態様を採用した場合には、導電性接着剤が溶融したときに周縁外方に導電性接着剤が流れ出ることをより確実に防止できる。
　図３（ｂ）に示すように第一溝部６４の断面が矩形状である場合には、第一溝部６４の表面と第一凹部６７の表面とで形成される角度を９０度程度にすることができ、導電性接着剤が有する表面張力を強くすることができることから、第一凹部６７内に導電性接着剤が流れ込みにくくすることができる。同様に、図４（ｂ）に示すように第二溝部７４の断面が矩形状である場合には、第二溝部７４の表面と第二凹部７７の表面とで形成される角度を９０度程度にすることができ、導電性接着剤が有する表面張力を強くすることができることから、第二凹部７７内に導電性接着剤が流れ込みにくくすることができる。
　図３（ａ）に示すように第一溝部６４の断面が三角形状である場合には、第一溝部６４を比較的容易に形成することができ、また第一平坦面６９も形成しやすくなる点で有益である。同様に、図４（ａ）に示すように第二溝部７４の断面が三角形状である場合には、第二溝部７４を比較的容易に形成することができ、また第二平坦面７９も形成しやすくなる点で有益である。
　第一平坦面６９が、周縁外方に向かうに連れて第二方向及び第三方向を含む面に対して一方側に離間するように傾斜するようになっている場合には、第一平坦面６９の傾斜によっても溶融した導電性接着剤が第一接続体６０の周縁外方に流れ出ることを防止できる点で有益である。同様に、第二平坦面７９が、周縁外方に向かうに連れて第二方向及び第三方向を含む面に対して一方側に離間するように傾斜するようになっている場合には、第二平坦面７９の傾斜によっても溶融した導電性接着剤が第二接続体７０の周縁外方に流れ出ることを防止できる点で有益である。
第２の実施の形態
　次に、本発明の第２の実施の形態について説明する。
　第１の実施の形態では、第一溝部６４が第一傾斜面６８と第一平坦面６９との境界に設けられており、第二溝部７４が第二傾斜面７８と第二平坦面７９との境界に設けられている態様であったが、本実施の形態では、図１０乃至図１２に示すように、第一溝部６４が第一凹部６７の周縁外方に設けられ、第一溝部６４が第一平坦面６９に設けられており、第二溝部７４が第二凹部７７の周縁外方に設けられ、第二溝部７４が第二平坦面７９に設けられている。その他の構成については、第１の実施の形態と同様であり、第１の実施の形態で説明したあらゆる態様を採用することができる。第１の実施の形態で説明した部材については同じ符号を用いて説明する。
　本実施の形態のように、第一溝部６４が第一平坦面６９に設けられ、第二溝部７４が第二平坦面７９に設けられるようにするためには、第１の実施の形態で示した態様と比較すると、突出部４６０が金型凹部４１０の周縁部に対して、より周縁外方に位置するようになっている（図１２（ｃ）参照）。
　本実施の形態のように、第一溝部６４が第一凹部６７の周縁外方に設けられ、第一溝部６４が第一平坦面６９に設けられている態様を採用した場合には、第一凹部６７によって溶融した導電性接着剤が周縁外方に広がることを防止しつつ、第一凹部６７の周縁外方に導電性接着剤が流れ出したとしても第一溝部６４によって当該導電性接着剤が周縁外方に広がることを防止できる点で有益である。
　同様に、第二溝部７４が第二凹部７７の周縁外方に設けられ、第二溝部７４が第二平坦面７９に設けられている態様を採用した場合には、第二凹部７７によって溶融した導電性接着剤が周縁外方に広がることを防止しつつ、第二凹部７７の周縁外方に導電性接着剤が流れ出したとしても第二溝部７４によって当該導電性接着剤が周縁外方に広がることを防止できる点で有益である。
第３の実施の形態
　次に、本発明の第３の実施の形態について説明する。
　第１の実施の形態及び第２の実施の形態とは異なり、本実施の形態では、第一溝部６４が第一傾斜面６８に設けられており、第二溝部７４が第二傾斜面７８に設けられている。その他の構成については、上記各実施の形態で説明したあらゆる態様を採用することができる。上記各実施の形態で説明した部材については同じ符号を用いて説明する。
　本実施の形態のように、第一溝部６４が第一傾斜面６８に設けられる態様を採用することで、第一凹部６７から導電性接着剤が流れ出ること自体を抑止できる点で有益である。同様に、第二溝部７４が第二傾斜面７８に設けられる態様を採用することで、第二凹部７７から導電性接着剤が流れ出ること自体を抑止できる点で有益である。
　縦断面で見たときに、図１３に示すように、第一傾斜面６８と第一溝部６４の内周側の面が形成する角度α１が、第一傾斜面６８と第一溝部６４の外周側の面が形成する角度β１と比較して小さくなってもよい。この場合には、第一傾斜面６８と第一溝部６４の内周側の表面との間で形成される角度を小さくすることができ、導電性接着剤が有する表面張力を強くすることができることから、第一溝部６４内に導電性接着剤が流れ込み難くすることができ、ひいては、導電性接着剤が周縁外方に広がることを防止できる点でも有益である。
　また、図１４に示すように、縦断面で見たときに、第二傾斜面７８と第二溝部７４の内周側の面が形成する角度α２が、第一傾斜面６８と第二溝部７４の外周側の面が形成する角度と比較して小さくなる。この場合には、第二傾斜面７８と第二溝部７４の内周側の表面との間で形成される角度を小さくすることができ、導電性接着剤が有する表面張力を強くすることができることから、第二溝部７４内に導電性接着剤が流れ込み難くすることができ、ひいては、導電性接着剤が周縁外方に広がることを防止できる点でも有益である。
　なお、第１の実施の形態及び第２の実施の形態でも、第一ヘッド部６１の一方側の面（第一平坦面６９又は第一傾斜面６８）と第一溝部６４の内周側の面が形成する角度が、第一ヘッド部６１の一方側の面と第一溝部６４の外周側の面が形成する角度と比較して小さくなってもよい。また、第二ヘッド部７１の一方側の面（第二平坦面７９又は第二傾斜面７８）と第二溝部７４の内周側の面が形成する角度が、第二ヘッド部７１の一方側の面と第二溝部７４の外周側の面が形成する角度と比較して小さくなってもよい。
　上記各実施の形態では、第一接続体６０における第一溝部６４と第一傾斜面６８及び第一平坦面６９との関係と、第二接続体７０における第二溝部７４と第二傾斜面７８及び第二平坦面７９との関係は同一の態様を用いて説明したが、これに限られることはない。例えば、第一接続体６０が第１の実施の形態で説明した態様である場合に、第二接続体７０が第２の実施の形態又は第３の実施の形態で説明した態様であってもよい。また、第二接続体７０が第１の実施の形態で説明した態様である場合に、第一接続体６０が第２の実施の形態又は第３の実施の形態で説明した態様であってもよい。これらの組み合わせは任意に行うことができる。
第４の実施の形態
　次に、本発明の第４の実施の形態について説明する。
　上記各実施の形態では、断面が略Ｔ字形状の第一接続体６０が用いられていたが、本実施の形態の第一接続体６０は、図１６に示すように、第一ヘッド部６１から他方側に延びた４つの支持部６５（６５ａ－６５ｄ）を有している。支持体６５は、第一導体層１２又は第一基板１１に当接するようになっている。その他の構成については、上記各実施の形態で説明したあらゆる態様を採用することができる。上記各実施の形態で説明した部材については同じ符号を用いて説明する。
　本実施の形態では４つの支持部６５が利用されている態様を用いて説明するが、これに限られることはなく、１、２、３又は５つ以上の支持部６５が用いられてもよい。
　本実施の形態のように第一ヘッド部６１から延びた支持部６５が設けられている場合には、第二電子素子２３の実装時又は第二電子素子２３を実装した後で第二電子素子２３の重みによって第一接続体６０が傾いてしまうことを防止できる。また、このように支持部６５が第一基板１１又は第一導体層１２に当接することで、放熱性を高めることができる。特に支持部６５が第一導体層１２に当接する場合には、放熱効果をより高めることができる点で有益である。
　また、本実施の形態のように複数の支持部６５が設けられている場合には、第一接続体６０をより安定に設けることができ、かつより高い放熱効果を実現できる点で有益である。
　支持部６５の各々は、面方向で延び、第一基板１１又は第一導体層１２と当接する支持基端部６９（６９ａ－６９ｄ）を有してもよい。また、複数の支持部６５の各々に支持基端部６９が設けられる必要はなく、複数の支持部６５のうちの一部に支持基端部６９が設けられ、残部に支持基端部６９が設けられないようにしてもよい。
　このような支持基端部６９が設けられている場合には、第一接続体６０をよりバランスよく第一基板１１又は第一導体層１２に配置することができ、また支持基端部６９で第一基板１１又は第一導体層１２との接触面積を増やすことができることから、放熱効果を高めることできる。
　支持部６５の各々は第一導体層１２に当接してもよい。支持部６５に接続される第一導体層１２が他の第一導体層１２、第二導体層２２、第一電子素子１３及び第二電子素子２３に電気的に接続されておらず電気的な機能を果たさない態様を採用した場合には、支持部６５が導通して予想していない挙動を第一電子素子１３及び第二電子素子２３が示すことを防止できる点で有益である。
　本実施の形態のように支持部６５を用いる場合には、図５、図１０及び図１３に示すように、第一ヘッド部６１が周縁外方で第一平坦面６９を有していることは有益である。第一ヘッド部６１が周縁外方で第一方向に沿って傾斜している場合には、支持部６５と第一導体層１２又は第一基板１１とを確実に当接させることができなくなる可能性がある。他方、第一ヘッド部６１が周縁外方で第一平坦面６９を有している場合には、支持部６５と第一導体層１２又は第一基板１１とを確実に当接させることができ、支持部６５によって実現される安定性向上の効果及び放熱性向上の効果を高めることができる点で有益である。この観点からすると、第一平坦面６９の面方向に対する傾斜角度が小さい方がよく、第一平坦面６９の面方向に対する傾斜角度は例えば３度以下である方がよい。
　また、第一溝部６４を設けることで確実に第一平坦面６９を面方向に沿って延在させることができるようになる点で有益である。特に、第１の実施の形態のように第一溝部６４が第一平坦面６９と第一傾斜面６８の境界に位置する場合には、第一平坦面６９の面方向に対する傾斜角度をより確実に小さくできる点で有益である。また、第２の実施の形態のように第一溝部６４が第一平坦面６９に設けられている場合には、第一溝部６４よりも周縁外方で面方向に対する傾斜角度をより確実に小さくできる点で有益である。
　支持部６５の各々は、第一ヘッド部６１から面方向に延びた面方向支持部１６６（１６６ａ－１６６ｄ）と、面方向支持部１６６の端部から高さ方向（第一方向）に延びた高さ方向支持部１６５（１６５ａ－１６５ｄ）とを有してもよい（後述する第６の実施の形態も参照）。なお、面方向支持部１６６は、第一ヘッド部６１よりも幅方向の長さが短くなっている部分のことを意味している。
　支持部６５は、面方向支持部１６６を有さず、第一ヘッド部６１から高さ方向（第一方向）に延びた高さ方向支持部１６５だけを有してもよい。
第５の実施の形態
　次に、本発明の第５の実施の形態について説明する。
　上記各実施の形態では第二柱部７２を有する断面が略Ｔ字形状からなる第二接続体７０を用いて説明したが、本実施の形態では、図１７に示すように、第二接続体７０は、第二ヘッド部７１から他方側に延びる延在部７５（７５ａ，７５ｂ）を有している。その他の構成については、上述した各実施の形態で説明したあらゆる態様を採用することができる。上述した各実施の形態で説明した部材については同じ符号を用いて説明する。
　本実施の形態では２つの延在部７５が利用されている態様を用いて説明するが、これに限られることはなく、１つ又は３つ以上の延在部７５が用いられてもよい。
　本実施の形態によれば、延在部７５が設けられていることから、第二電子素子２３からの熱を効率よく放熱することができ、第二接続体７０によっても高い放熱効果を実現できる。また、本実施の形態のように複数の延在部７５が設けられている場合には、より高い放熱効果を実現できる点で有益である。
　延在部７５の各々は第一導体層１２に当接してもよい。延在部７５に接続される第一導体層１２は、他の第一導体層１２、第二導体層２２、第一電子素子１３及び第二電子素子２３に電気的に接続されていなくてもよい。
　延在部７５の各々は、面方向で延び、第一基板１１又は第一導体層１２と当接する延在基端部７９（７９ａ，７９ｂ）を有してもよい。また、複数の延在部７５の各々に延在基端部７９が設けられる必要はなく、複数の延在部７５のうちの一部に延在基端部７９が設けられ、残部に延在基端部７９が設けられないようにしてもよい。
　このような延在基端部７９が設けられている場合には、第二接続体７０をよりバランスよく第一基板１１又は第一導体層１２に配置することができ、また延在基端部７９で第一基板１１又は第一導体層１２との接触面積を増やすことができることから、放熱効果を高めることできる。
　本実施の形態のように延在部７５を用いる場合には、図６、図１１及び図１４に示すように、第二ヘッド部７１が周縁外方で第二平坦面７９を有していることは有益である。第二ヘッド部７１が周縁外方で第一方向に沿って傾斜している場合には、延在部７５と第一導体層１２又は第一基板１１とを確実に当接させることができなくなる可能性がある。他方、第二ヘッド部７１が周縁外方で第二平坦面７９を有している場合には、延在部７５と第一導体層１２又は第一基板１１とを確実に当接させることができ、延在部７５によって実現される安定性向上の効果及び放熱性向上の効果を高めることができる点で有益である。この観点からすると、第二平坦面７９の面方向に対する傾斜角度が小さい方がよく、第二平坦面７９の面方向に対する傾斜角度は例えば３度以下である方がよい。
　また、第二溝部７４を設けることで確実に第二平坦面７９を面方向に沿って延在させることができるようになる点で有益である。特に、第１の実施の形態のように第二溝部７４が第二平坦面７９と第二傾斜面７８の境界に位置する場合には、第二平坦面７９の面方向に対する傾斜角度をより確実に小さくできる点で有益である。また、第２の実施の形態のように第二溝部７４が第二平坦面７９に設けられている場合には、第二溝部７４よりも周縁外方で面方向に対する傾斜角度をより確実に小さくできる点で有益である。
　本実施の形態の態様を採用することで、第二接続体７０により第二基板２１を一方側に押し返す反発力を付与できるようになる。熱が加わることで第一基板１１及び第二基板２１が反ったり歪んだりしようとする力が加わるが、延在部７５（特に複数の延在部７５）を有する第二接続体７０を用いることで第一基板１１及び第二基板２１の反りや歪みを防止できる点で有益である。
　なお、本実施の形態の延在部７５は、第二ヘッド部７１から高さ方向（第一方向）に延びた高さ方向延在部１７５（１７５ａ，１７５ｂ）を有している。
第６の実施の形態
　次に、本発明の第６の実施の形態について説明する。
　第４の実施の形態では支持部６５が設けられ、第５の実施の形態では延在部７５が設けられる態様であったが、支持部６５及び延在部７５がともに採用されてもよい。本実施の形態では、図１８乃至図２０に示すように、３つの支持部６５及び３つの延在部７５が用いられている態様を一例として挙げて説明する。その他の構成については、上述した各実施の形態で説明したあらゆる態様を採用することができる。上述した各実施の形態で説明した部材については同じ符号を用いて説明する。
　本実施の形態で示すように、延在部７５は、第二ヘッド部７１から面方向に延びた面方向延在部１７６（１７６ａ－１７６ｃ）と、面方向延在部１７６から高さ方向（第一方向）に延びた高さ方向延在部１７５（１７５ａ－１７５ｃ）とを有してもよい。なお、面方向延在部１７６は、第二ヘッド部７１よりも幅方向の大きさが小さくなっている部分のことを意味している。
　なお、本実施の形態では、第一接続体６０の一方側の面に第一溝部６４は設けられているが第二接続体７０には第二溝部７４は設けられていない。このような態様とは異なり、第二接続体７０の一方側の面に第二溝部７４は設けられているが第一接続体６０には第一溝部６４が設けられていない態様を採用することもできる。
　上述した各実施の形態の記載及び図面の開示は、請求の範囲に記載された発明を説明するための一例に過ぎず、上述した実施の形態の記載又は図面の開示によって請求の範囲に記載された発明が限定されることはない。また、出願当初の請求項の記載はあくまでも一例であり、明細書、図面等の記載に基づき、請求項の記載を適宜変更することもできる。
１１　　　　第一基板
１２　　　　第一導体層
１３　　　　第一電子素子
２３　　　　第二電子素子
６０　　　　第一接続体
６２　　　　第一柱部
６４　　　　第一溝部
６７　　　　第一凹部
６８　　　　第一傾斜面
６９　　　　第一平坦面
７０　　　　第二接続体
７２　　　　第二柱部
３００　　　導体板
４００　　　金型
４１０　　　金型凹部
４５０　　　押圧部材
４６０　　　突出部

Claims (7)

  1. 　第一電子素子と、
    　前記第一電子素子の一方側に設けられた第一接続体であって、他方側に延びた第一柱部と、一方側の面に設けられた第一溝部とを有する第一接続体と、
    　前記第一接続体の一方側であって、前記第一溝部の周縁内方に設けられた導電性接着剤を介して設けられた第二電子素子と、
    　を備え、
    　前記第一接続体は、一方側の前記第一柱部に対応した位置に第一凹部を有することを特徴とする電子モジュール。
  2. 　前記第一接続体の前記一方側の面は、第一傾斜面と、前記第一傾斜面の周縁外方に設けられた第一平坦面とを有し、
    　前記第一溝部は、前記第一傾斜面と前記第一平坦面との境界に設けられることを特徴とする請求項１に記載の電子モジュール。
  3. 　前記第一接続体の前記一方側の面は、第一傾斜面と、前記第一傾斜面の周縁外方に設けられた第一平坦面とを有し、
    　前記第一溝部は、前記第一平坦面に設けられることを特徴とする請求項１に記載の電子モジュール。
  4. 　前記第一接続体の前記一方側の面は、第一傾斜面と、前記第一傾斜面の周縁外方に設けられた第一平坦面とを有し、
    　前記第一溝部は、前記第一傾斜面に設けられることを特徴とする請求項１に記載の電子モジュール。
  5. 　縦断面で見たときに、前記第一傾斜面と前記第一溝部の内周側の面が形成する角度は、前記第一傾斜面と前記第一溝部の外周側の面が形成する角度と比較して小さくなっていることを特徴とする請求項４に記載の電子モジュール。
  6. 　導体板を、金型凹部を有する金型に載置する工程と、
    　前記導体板を前記金型に向かって押し付けて、前記金型凹部に対応した第一柱部を前記導体板の他方側に形成し、前記導体板の一方側であって前記第一柱部に対応した位置に第一凹部を形成する工程と、
    　突出部を有する部材を前記導体板の一方側に押し付けることで、前記導体板の一方側の面に第一溝部を形成する工程と、
    　を備えたことを特徴とする接続体の製造方法。
  7. 　請求項６に記載の接続体を第一電子素子に載置する工程と、
    　第二電子素子を前記接続体に導電性接着剤を介して載置する工程と、
    　を備え、
    　前記導電性接着剤は前記第一溝部の周縁内方に設けられることを特徴とする電子モジュールの製造方法。
PCT/JP2017/018823 2017-05-19 2017-05-19 電子モジュール、接続体の製造方法及び電子モジュールの製造方法 WO2018211683A1 (ja)

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CN201780005098.1A CN109314087B (zh) 2017-05-19 2017-05-19 电子模块、连接体的制造方法以及电子模块的制造方法
TW107114881A TWI669804B (zh) 2017-05-19 2018-05-02 電子模組以及電子模組的製造方法
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