JPH04196574A - リードフレーム - Google Patents

リードフレーム

Info

Publication number
JPH04196574A
JPH04196574A JP2331348A JP33134890A JPH04196574A JP H04196574 A JPH04196574 A JP H04196574A JP 2331348 A JP2331348 A JP 2331348A JP 33134890 A JP33134890 A JP 33134890A JP H04196574 A JPH04196574 A JP H04196574A
Authority
JP
Japan
Prior art keywords
chip
brazing material
lead
die pad
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2331348A
Other languages
English (en)
Inventor
Ryuichi Sakano
坂野　竜一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2331348A priority Critical patent/JPH04196574A/ja
Publication of JPH04196574A publication Critical patent/JPH04196574A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
    • H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83009—Pre-treatment of the layer connector or the bonding area
    • H01L2224/83051—Forming additional members, e.g. dam structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、樹脂封止部の半導体装置に用いられるリー
ドフレームの構造に関するものである。
〔従来の技術〕
第６図は従来の半導体装置に用いられるリードフレーム
を示す平面図、第７図は第６図の■−■線の断面図であ
る。図において％ｌはリードフレーム、２はリードフレ
ーム１上のインナーリード。
３はリードフレーム１上のダイパラ）”、４ｄグイパツ
ド３を支える宙吊りリード、５は上記ダイパッド３上の
チップ、６はこのチップ５上のボンディングパッド、７
は上記チップ５とインナーリード２もしくは宙吊りリー
ド４を接続するワイヤー。
８は上記ダイパッド３上にチップ５を固定するためのロ
ウ材である。
次にその組立！１様について説明する。半導体装置を組
み立てる場合、ダイパッド３にロウ材８をのせ、ダイパ
ッド３を高温にしてロウ材８を溶融させ、その状態でデ
ツプ５をロウ材８の上にの飢チップ５とグイバッド３を
密着させる。この場合、チップ５がロウ材８を上から押
し付ける形になるので、ロウ材８がチップからはみ出し
ダイパッド３上を流れ、更に高温になった宙吊りリード
４上をロウ材８がはい上がる。次に、チップ５上のボン
ディングパッド６とインナーリード２とを、ワイヤー７
によりワイヤーボンドする。ここで、チツブ５上のボン
ディングパッド６と宙吊りリード４とを、ワイヤー７に
よりワイヤーボンドしようとすると、宙吊りリード４上
をはい上がったロウ材８のために、正常なワイヤーボン
ドができなくなる。
〔発明が解決しようとする課題〕
従来のリードフレームは以上のように構成されているが
、ワイヤーボンドする際の歩留まりが悪く、またロウ材
上にワイヤーを打てた場合でも密着性が悪く、温度サイ
クルや熱衝撃等の信頼性試験を行った場合、ワイヤーが
外れる等の問題点がめった。
この発明は上記のような問題点を解消するためになされ
たもので、ワイヤーボンドの歩留まシが良く％信頼性の
高いリードフレームを得ることを目的とする。
〔課題を解決するための手段〕
この発明に係るリードフレームは、宙吊りリードとにロ
ウ材溜りを備えたものでめる０〔作用〕 この発明におけるリードフレームは、ダイパッドから溢
れたロウ材をロウ材溜りに溜めることで、宙吊りリード
上へのロウ材のはい上がりを防ぐ。
〔実施例〕
以′Ｆ、この発明の実施例を図について説明する。
第１図はこの発明の−実り例を示すリードフレームの構
造を示す平面図、第２図は第１図のｌ−１線の断面図で
あり、上記従来例と異なるところは。
百出シリード４上にロウ材溜り９を設けた点である０ このようなものにおいて、半導体装置を組み立てる場合
、ダイパッド３にロウ材８をのせ、ダイパッド３を高温
にしてロウ材８を溶融させ、その状態でチップ５をロウ
材８の上にのせ、チップ５とダイパッド３を密着させる
。この場合、チップ５がロウ材８を上から押し付ける形
になるので、ロウ材８がテップ５からはみ出してダイパ
ッド３上を流れ％更に高温になった宙吊りリード４上の
ロウ材溜り９にロウ材８が流れ込み、このロウ材溜り９
に溜ったロウ材８はそこでせき止められる。
次に、チップ５）：のポンプイングツくラド６と、イン
ナーリード２もしくは宙吊りリード４とをワイヤー７に
よりワイヤーボンドする。
なお、上記実り例では宙吊りリード４をフレームの中心
に２個所あるものを示したが、第３図の如く１個所にあ
るもの、もしくは第４図のように３個所以上で中心以外
の位置でも良い。また、上記実施例では、ダイパッド３
がリードフレーム１より低い位置にあるものを示したが
、第５図の如くダイパッド３とリードフレーム１が同じ
高さにあるものでも、同様の効果を奏する。
〔発明の効果〕
以上のように、この発明によれば、宙吊りリード上にロ
ウ材溜りを設けたので、宙吊シリードヘのロウ材のはい
土がシを防ぐことができ、これによってワイヤーボンド
の歩留まりが曳く、信頼性の高いリードフレームが得ら
れる効果があるＯ
【図面の簡単な説明】
第１図はこの発明の−実り例によるリードフレームを示
す平面図、第２図は第１図の１−１線の断面図、第３図
、＠４図はこの発明の他の実施例を示す平面図、第５図
はこの発明の他の実施例を示す断面図、第６図は従来の
リードフレームを示す平面図、第７図は第６図の■−４
線の断面図である。 図中％　１はリードフレーム、２はインナーリード、３
はダイパッド、４は宙吊りリード、５はチップ、６はボ
ンディングパッド、７はワイヤー。 ８はロウ材、９はロウ材溜りである。 なお、図中％同一符号は同一、又は相当部分を示す。

Claims (1)

    【特許請求の範囲】
  1. 樹脂封止型半導体装置のリードフレームであつて、ダイ
    パッド上にロウ材を介して固定されるチップと、このチ
    ップ上のボンディングパッドに接続されたワイヤーと導
    通をとるためのインナーリードと、上記ダイパッドを支
    えるための宙吊りリードとを有するものにおいて、上記
    宙吊りリード上に、上記チップとダイパッドを密着させ
    るためのロウ材が溢れた時に流れ込み溜めるためのロウ
    材溜りを設けたことを特徴とするリードフレーム。
JP2331348A 1990-11-28 1990-11-28 リードフレーム Pending JPH04196574A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2331348A JPH04196574A (ja) 1990-11-28 1990-11-28 リードフレーム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2331348A JPH04196574A (ja) 1990-11-28 1990-11-28 リードフレーム

Publications (1)

Publication Number Publication Date
JPH04196574A true JPH04196574A (ja) 1992-07-16

Family

ID=18242681

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2331348A Pending JPH04196574A (ja) 1990-11-28 1990-11-28 リードフレーム

Country Status (1)

Country Link
JP (1) JPH04196574A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6455348B1 (en) 1998-03-12 2002-09-24 Matsushita Electric Industrial Co., Ltd. Lead frame, resin-molded semiconductor device, and method for manufacturing the same
NL2020928A (en) * 2017-05-19 2018-11-23 Shindengen Electric Mfg Electronic module, method of manufacturing connector, and method of manufacturing electronic module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5724555A (en) * 1980-07-22 1982-02-09 Nec Kyushu Ltd Semiconductor device
JPS594647B2 (ja) * 1975-01-15 1984-01-31 ロ−ベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 流入媒体の流量測定器
JPS6392048A (ja) * 1986-10-06 1988-04-22 Mitsubishi Electric Corp 半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594647B2 (ja) * 1975-01-15 1984-01-31 ロ−ベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 流入媒体の流量測定器
JPS5724555A (en) * 1980-07-22 1982-02-09 Nec Kyushu Ltd Semiconductor device
JPS6392048A (ja) * 1986-10-06 1988-04-22 Mitsubishi Electric Corp 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6455348B1 (en) 1998-03-12 2002-09-24 Matsushita Electric Industrial Co., Ltd. Lead frame, resin-molded semiconductor device, and method for manufacturing the same
NL2020928A (en) * 2017-05-19 2018-11-23 Shindengen Electric Mfg Electronic module, method of manufacturing connector, and method of manufacturing electronic module
US11437340B2 (en) 2017-05-19 2022-09-06 Shindengen Electric Manufacturing Co., Ltd. Electronic module, method of manufacturing connector, and method of manufacturing electronic module

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