WO2018176760A1 - 一种柔性显示面板、显示装置及柔性显示面板的制作方法 - Google Patents

一种柔性显示面板、显示装置及柔性显示面板的制作方法 Download PDF

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Publication number
WO2018176760A1
WO2018176760A1 PCT/CN2017/102744 CN2017102744W WO2018176760A1 WO 2018176760 A1 WO2018176760 A1 WO 2018176760A1 CN 2017102744 W CN2017102744 W CN 2017102744W WO 2018176760 A1 WO2018176760 A1 WO 2018176760A1
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Prior art keywords
insulating layer
layer
display panel
flexible
flexible substrate
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PCT/CN2017/102744
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English (en)
French (fr)
Inventor
黄炜赟
刘庭良
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京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Priority to US16/339,205 priority Critical patent/US10803776B2/en
Publication of WO2018176760A1 publication Critical patent/WO2018176760A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a flexible display panel, a display device, and a method of fabricating the flexible display panel.
  • the display market is currently booming, and as consumers continue to increase demand for various display products such as laptops, smartphones, TVs, tablets, smart watches and fitness wristbands, more new displays will emerge in the future. product.
  • the full-screen, borderless display product can give users a better viewing experience and will definitely set off a new consumer market.
  • Pad Bending is the core technology for full-screen, borderless display products.
  • Embodiments of the present disclosure provide a flexible display panel, a display device, and a method of fabricating the flexible display panel.
  • a flexible display panel includes: a flexible substrate, a conductive layer disposed on the flexible substrate display area, and a plurality of traces disposed on the edge of the flexible substrate substrate And an inorganic insulating layer disposed between the conductive layer and the plurality of traces and the flexible substrate; the conductive layer is electrically connected to the plurality of traces and disposed in the same layer;
  • first organic insulating layer disposed at least at an edge bending region of the flexible substrate; the first organic insulating layer is located between the plurality of traces and the inorganic insulating layer and the first organic insulating layer
  • the material is a cured photoresist.
  • the material of the first organic insulating layer is photosensitive polyimide.
  • the first organic insulating layer is further disposed on the flexible substrate display region; and the first organic insulating layer is located Between the conductive layer and the inorganic insulating layer.
  • the conductive layer is a source/drain metal layer
  • the inorganic insulating layer includes a gate insulating layer and an interlayer insulating layer.
  • the first organic insulating layer is used to pattern the gate insulating layer and the interlayer insulating layer.
  • the first organic insulating layer has a via pattern occupying an area larger than a via pattern of the interlayer insulating layer. The area.
  • the method further includes: a second organic insulating layer disposed at least at an edge bending region of the flexible substrate substrate; and the second An organic insulating layer is over the plurality of traces.
  • the second organic insulating layer and the flat layer, the spacer layer or the pixel disposed on the display area of the flexible substrate Define layer layer settings.
  • the method further includes: an organic electroluminescent diode or quantum dot illumination disposed on the conductive layer of the flexible substrate display region diode.
  • An embodiment of the present disclosure further provides a display device comprising: the above flexible display panel.
  • the embodiment of the present disclosure further provides a method for manufacturing a flexible display panel, including:
  • a conductive layer is formed on the inorganic insulating layer of the flexible substrate display region, and a plurality of traces are formed on the first organic insulating layer of the flexible substrate substrate edge bent region.
  • the at least the photoresist film layer of the flexible substrate substrate edge bending region is cured to form a first
  • the organic insulating layer specifically includes:
  • the flexible substrate substrate edge bending region and the photoresist substrate layer of the flexible substrate display region are cured to form a first organic insulating layer.
  • the photoresist film is simultaneously applied to the flexible substrate substrate edge bending region and the flexible substrate substrate display region.
  • the method further includes:
  • the via pattern of the photoresist film layer is subjected to ashing treatment so that the area occupied by the via pattern of the first organic insulating layer is larger than the area occupied by the via pattern of the inorganic insulating layer.
  • a conductive layer is formed on the inorganic insulating layer of the flexible substrate display region while being at the edge of the flexible substrate After forming a plurality of traces on the first organic insulating layer of the bending region, the method further includes:
  • a second organic insulating layer is formed on the plurality of traces of the edge of the flexible substrate substrate bending region, and include:
  • a flat layer, a spacer layer or a pixel defining layer is formed on the flexible substrate display region.
  • FIG. 1A is a schematic structural view of a flexible display panel according to a comparative example of the present disclosure
  • FIG. 1B is a schematic structural view showing an enlarged portion of a broken line in FIG. 1A;
  • FIG. 2 is a second schematic structural view of a flexible display panel in the prior art
  • FIG. 3 is a schematic structural diagram of a flexible display panel according to Embodiment 1 of the present disclosure.
  • FIG. 4 is a schematic structural diagram of a flexible display panel according to Embodiment 2 of the present disclosure.
  • FIG. 5 is a schematic structural diagram of a flexible display panel according to Embodiment 3 of the present disclosure.
  • FIG. 6 is a flowchart of a method for fabricating a flexible display panel according to Embodiment 4 of the present disclosure
  • FIG. 7 is a schematic structural diagram of a corresponding flexible display panel after performing each step in the method for fabricating a flexible display panel according to Embodiment 4 of the present disclosure
  • FIG. 8 is a flowchart of a method for fabricating a flexible display panel according to Embodiment 5 of the present disclosure
  • FIG. 9 is a flowchart of a method for fabricating a flexible display panel according to Embodiment 6 of the present disclosure.
  • a flexible display panel, a display device, and a method for fabricating the flexible display panel provided by the embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.
  • each film layer in the drawings do not reflect the true scale of the flexible display panel, and are merely intended to illustrate the disclosure.
  • FIGS. 1A and 1B illustrate a flexible display panel according to a comparative example of the present disclosure, as shown in FIGS. 1A and 1B, due to the greater brittleness of the inorganic insulating layer 101, Pad Bending causes an inorganic insulating layer to display a product bending region.
  • a crack S occurs in 101, and the crack S further spreads to the signal line layer 102, resulting in display failure.
  • the insulating layer 101 generates a crack S, as shown in FIG.
  • a flexible display panel as shown in FIG. 3, includes a flexible substrate 301, a conductive layer 302 disposed on the flexible substrate display area A, and a bend disposed on the edge of the flexible substrate. a plurality of traces 303 of the region B, and an inorganic insulating layer 304 disposed between the conductive layer 302 and the plurality of traces 303 and the flexible substrate 301; the conductive layer 302 is electrically connected to the plurality of traces 303 and disposed in the same layer
  • the flexible display panel further includes:
  • the first organic insulating layer 305 is disposed at least on the edge of the flexible substrate substrate bending portion B; the first organic insulating layer 305 is located between the plurality of traces 303 and the inorganic insulating layer 304 and the material of the first organic insulating layer 305 is cured After the photoresist.
  • the photoresist has good bending properties and thermal stability.
  • the photoresist may be a photosensitive polyimide, which is not limited herein.
  • the first organic insulating layer 305 is disposed on the flexible substrate substrate edge bending region B, and the first organic insulating layer 305 is located in the plurality of traces 303 and inorganic Between the insulating layers 304; therefore, when the inorganic insulating layer 304 located at the edge bending portion B of the flexible substrate substrate is cracked, the first organic insulating layer 305 may be located between the plurality of traces 303 and the inorganic insulating layer 304.
  • the shielding function effectively prevents the crack from spreading to the film layer where the plurality of traces 303 are located, thereby avoiding the display failure phenomenon.
  • the material of the first organic insulating layer 305 is a cured photoresist
  • the photoresist may be a photoresist coated during the process of fabricating the inorganic insulating layer 304, and thus, In the prior art, the technical solution of adding two Mask processes is added, and the present disclosure can save two Mask processes, thereby saving production cost and improving production efficiency.
  • the conductive layer 302 is disposed in the same layer as the plurality of traces 303, so that the conductive layer 302 and the plurality of traces 303 can be simultaneously fabricated by using one patterning process, which simplifies The production process saves production costs.
  • the conductive layer 302 is a source/drain metal layer and a signal line;
  • the inorganic insulating layer 304 includes: a gate insulating layer 3041 and a layer.
  • the insulating layer 3042 is interposed, and the interlayer insulating layer 3042 is located on a side of the gate insulating layer 3041 facing away from the flexible substrate 301.
  • the first organic insulating layer 305 is used to form a via pattern of the gate insulating layer 3041 and the interlayer insulating layer 3042.
  • the material of the conductive layer 302 and the plurality of traces 303 may be one of molybdenum, aluminum, tungsten, titanium, copper or a combination of alloys, which is not limited herein.
  • the material of the inorganic insulating layer 304 may be one or a combination of silicon oxide and silicon nitride, which is not limited herein.
  • the inorganic insulating layer 304 has a via pattern, and the via pattern of the inorganic insulating layer 304 is located in the flexible substrate display area A.
  • the active layer 306 located between the flexible substrate 301 and the gate insulating layer 3041 and the gate insulating layer may be further included.
  • the material of the active layer 306 may be a polysilicon semiconductor material, an amorphous silicon semiconductor material, an oxide semiconductor material or an organic semiconductor material, which is not limited herein.
  • the material of the gate metal layer 307 and the gate scan line may be one of molybdenum, aluminum, tungsten, titanium, copper or a combination of alloys, which is not limited herein.
  • the flat layer 308 may be further disposed on the conductive layer 302 of the flexible substrate display area A.
  • the material of the flat layer 308 may be an organic insulating material such as polyacrylic resin, polyepoxy acrylic resin, photosensitive polyimide resin, polyester acrylate, urethane acrylate resin or phenolic epoxy acrylic resin. This is not limited.
  • the flexible display panel provided in the second embodiment of the present disclosure is similar to the flexible display panel provided in the first embodiment of the present disclosure, and only the flexible display panel provided in the second embodiment of the present disclosure and the flexible display panel provided in the first embodiment of the present disclosure are provided. The differences are introduced, and the repetitions are not repeated here.
  • the inorganic insulating layer 304 has a via pattern.
  • the conductive layer 302 located at the via pattern may be broken, affecting the display effect of the flexible display panel.
  • the first organic insulating layer 305 has a via pattern occupied by the area. It is larger than the area occupied by the via pattern of the interlayer insulating layer 3042. With this arrangement, the slope angle of the conductive layer 302 can be improved, thereby effectively preventing the conductive layer 302 from being broken at the via pattern.
  • each film layer in the flexible display panel provided in the second embodiment of the present disclosure is the same as the material of each film layer in the flexible display panel provided in the first embodiment of the present disclosure, and details are not described herein.
  • the flexible display panel provided in the third embodiment of the present disclosure is similar to the flexible display panel provided in the second embodiment of the present disclosure, and the flexible display panel provided in the third embodiment of the present disclosure is the same as the flexible display panel provided in the second embodiment of the present disclosure. The differences are introduced, and the repetitions are not repeated here.
  • a second organic insulating layer 310 disposed at least on the edge portion B of the flexible substrate substrate is added; and the second organic insulating layer 310 is located above the plurality of traces 303, that is, The two organic insulating layers 310 are located on a side of the plurality of traces 303 facing away from the flexible substrate 301. In this way, the second organic insulating layer 310 can protect the plurality of traces 303 from scratches, thereby improving the quality of the display image.
  • the second organic insulating layer 310 may be a separately provided film layer, or may be disposed in the same layer as the flat layer 308 of the flexible substrate display area A.
  • a film layer is not limited herein.
  • the second organic insulating layer 310 is disposed in the same layer as the flat layer 308, the second organic insulating layer 310 and the flat layer 308 can be simultaneously prepared by using one patterning process, which simplifies the preparation process and saves production cost.
  • the second organic insulating layer 310 may also be disposed in the same layer as the spacer layer or the pixel defining layer. Not limited.
  • each film layer in the flexible display panel provided in the third embodiment of the present disclosure is the same as the material of each film layer in the flexible display panel provided in the second embodiment of the present disclosure, and details are not described herein.
  • the flexible display panel provided in Embodiment 1 of the present disclosure may be further improved, that is, only added to at least the flexible substrate.
  • the second organic insulating layer 310 over the plurality of traces 303 of the substrate edge bending region B does not define the size of the via pattern of the first organic insulating layer 305 and the via pattern of the interlayer insulating layer 3042.
  • the fourth embodiment of the present disclosure provides a method for manufacturing a flexible display panel. As shown in FIG. 6, the method may specifically include the following steps:
  • At least the photoresist layer of the edge of the flexible substrate substrate is cured to form a first organic insulating layer
  • the conductive layer is a source/drain metal layer and a signal line
  • the inorganic insulating film layer is patterned by using a photoresist film layer to form an inorganic insulating layer.
  • the pattern can be achieved in the following ways:
  • the inorganic insulating film layer is patterned by using a photoresist film layer to form a gate insulating layer and an interlayer insulating layer.
  • the inorganic insulating film layer is patterned by using a photoresist film layer, and before the interlayer insulating layer is formed, the method may further include: An active layer, a gate insulating layer, and a gate metal layer and a gate scan line are sequentially formed on the flexible substrate display region.
  • step S604 at least the photoresist film layer in the edge bending region of the flexible substrate substrate is cured to form a first organic insulating layer, which can be realized by the following manner. :
  • the photoresist film layer of the flexible substrate substrate edge bending region and the flexible substrate substrate display region is cured to form a first organic insulating layer.
  • the step S605 in the above manufacturing method provided in the fourth embodiment of the present disclosure forms a conductive layer on the inorganic insulating layer of the flexible substrate display region, and the first organic layer in the edge of the flexible substrate substrate is bent.
  • the method further includes: sequentially forming a planar layer and an organic electroluminescent diode or a quantum dot light emitting diode on the conductive layer of the flexible substrate display region.
  • FIG. 7A to FIG. 7E the structure of the flexible display panel obtained by implementing the steps in the above manufacturing method provided in the fourth embodiment of the present disclosure is specifically provided.
  • a flexible substrate 301 is provided, and an active layer 306, a gate insulating layer 3041, a gate metal layer 307, and a gate scan line (not shown) are sequentially formed on the flexible substrate 301, as shown in FIG. 7A. Show
  • the interlayer insulating film layer of the flexible substrate display area A is etched by using the pattern of the exposed and developed photoresist film layer to form an interlayer insulating layer 3042 having a via pattern; and then the flexible substrate is simultaneously The substrate edge bending region and the photoresist film layer of the flexible substrate display region are cured to form a first organic insulating layer 305, as shown in FIG. 7C;
  • a conductive layer 302 is formed on the interlayer insulating layer 3042 of the flexible substrate display region A, and a plurality of traces 303 are formed on the first organic insulating layer 305 of the flexible substrate substrate edge bent region B, as shown in FIG. 7D. Show
  • a flat layer 308 and an organic electroluminescent diode or a quantum dot light emitting diode 309 are sequentially formed on the conductive layer 302 of the flexible substrate display area A as shown in FIG. 7E.
  • the patterning process involved in forming each layer structure may include not only photoresist coating, mask masking, exposure, development, etching, and light. Part or all of the process, such as stripping, may also include other processes, which are specifically based on the pattern that forms the desired pattern in the actual manufacturing process, and are not limited herein.
  • a post-baking process may also be included after development and prior to etching. The etching may be dry etching or wet etching, which is not limited herein.
  • the content of the material of each of the film layers of the flexible display panel can be referred to the related content of the flexible display panel provided in the first embodiment of the present disclosure, and details are not described herein.
  • the fifth embodiment of the present disclosure provides a method for fabricating a flexible display panel.
  • the manufacturing method of the flexible display panel provided by the fifth embodiment of the present disclosure is similar to the manufacturing method of the flexible display panel provided by the fourth embodiment of the present disclosure, and the manufacturing method of the flexible display panel provided by the fifth embodiment of the present disclosure and the embodiment of the present disclosure The differences in the manufacturing methods of the flexible display panels provided by the four are introduced, and the repetitions will not be described again.
  • step S604 in the method for fabricating the flexible display panel provided in the fourth embodiment of the present disclosure, at least the photoresist layer in the edge of the flexible substrate substrate is cured, and the first organic insulating layer is formed differently.
  • step S604' after simultaneously curing the flexible substrate substrate edge bending region and the flexible substrate display region of the photoresist film layer, The photoresist film layer has a via pattern and is subjected to ashing treatment to form a first organic insulating layer, so that the area of the via pattern of the first organic insulating layer is larger than the area of the via pattern of the inorganic insulating layer. Establish a basis for the subsequent formation of a conductive layer.
  • the content of the material of the film layer of the flexible display panel can be referred to the related content of the flexible display panel provided by the second embodiment of the present disclosure, and details are not described herein.
  • Embodiment 6 of the present disclosure provides a method for fabricating a flexible display panel.
  • the manufacturing method of the flexible display panel provided in the sixth embodiment of the present disclosure is similar to the manufacturing method of the flexible display panel provided in the fifth embodiment of the present disclosure, and the manufacturing method of the flexible display panel provided in the sixth embodiment of the present disclosure and the embodiment of the present disclosure The differences between the manufacturing methods of the flexible display panels provided by the five are introduced, and the repetitions will not be described again.
  • the method further includes:
  • the second organic insulating layer can protect a plurality of traces from being scratched, thereby improving the quality of the display image.
  • the step S606 forms a second organic insulating layer on the plurality of traces of the flexible substrate substrate bending region, which can be specifically achieved by:
  • a second organic insulating layer is formed on a plurality of traces of the flexible substrate substrate bending region while forming a flat layer on the conductive layer of the flexible substrate display region.
  • the step S606 is in the method of manufacturing the flexible display panel provided in the sixth embodiment of the present disclosure
  • the pixel organic layer of the flexible substrate display area A generally includes a flat layer, a spacer layer, and a pixel defining layer.
  • the second organic insulating layer is formed on the plurality of traces of the flexible substrate substrate bending region, and can also be realized in the following manner:
  • the second organic insulating layer is formed on the plurality of traces of the flexible substrate substrate bending region, and is not limited herein.
  • the content of the material of each of the film layers of the flexible display panel may be referred to the related content of the flexible display panel provided in the third embodiment of the present disclosure, and details are not described herein.
  • an embodiment of the present disclosure further provides a display device, including
  • the flexible display panel provided by the embodiment of the present disclosure may be any product or component having a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
  • a display function such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
  • the display device reference may be made to the embodiment of the flexible display panel described above, and the repeated description is omitted.
  • the flexible display panel includes: a flexible substrate, a conductive layer disposed on the flexible substrate display area, and disposed on the flexible substrate a plurality of traces of the edge bend region, and an inorganic insulating layer disposed between the conductive layer and the plurality of traces and the flexible substrate; the conductive layer is electrically connected to the plurality of traces and disposed in the same layer; and further includes: at least a first organic insulating layer disposed on the edge of the flexible substrate substrate; the first organic insulating layer is between the plurality of traces and the inorganic insulating layer; and the material of the first organic insulating layer is a cured photoresist.
  • the first organic insulating layer is disposed between the plurality of traces and the inorganic insulating layer in the bent region at the edge of the flexible substrate; therefore, when located at the edge of the flexible substrate substrate When the inorganic insulating layer is cracked, the first organic insulating layer between the plurality of traces and the inorganic insulating layer can serve as a shielding function, thereby effectively preventing the crack from spreading to the film layer where the plurality of traces are located, thereby avoiding display failure. .
  • the material of the first organic insulating layer is a cured photoresist
  • the photoresist may be a photoresist coated during the process of fabricating the inorganic insulating layer, and thus, compared to the existing In the technology, two technical solutions of the Mask process are added, and the present disclosure can save two Mask processes, thereby saving production cost and improving production efficiency.
  • the conductive layer is disposed in the same layer as the plurality of traces, so that the conductive layer and the plurality of traces can be simultaneously produced by using one patterning process, which simplifies the manufacturing process and saves production costs.
  • a flexible display panel, a display device, and a manufacturing method of the flexible display panel comprising: a flexible substrate, a conductive layer disposed on the display region of the flexible substrate, disposed on the flexible substrate a plurality of traces of the edge of the substrate edge, and an inorganic insulating layer disposed between the conductive layer and the plurality of traces and the flexible substrate; the conductive layer is electrically connected to the plurality of traces and disposed in the same layer; And a first organic insulating layer disposed at least between the plurality of traces and the inorganic insulating layer; and the material of the first organic insulating layer is a cured photoresist.
  • a first organic insulating layer is disposed on the edge of the flexible substrate substrate, and the first organic insulating layer is located between the plurality of traces and the inorganic insulating layer; therefore, when located at the edge of the flexible substrate substrate When the inorganic insulating layer is cracked, the first organic insulating layer between the plurality of traces and the inorganic insulating layer can serve as a shielding function, thereby effectively preventing the crack from spreading to the film layer where the plurality of traces are located, thereby avoiding display failure. .
  • the photoresist may be a photoresist coated during the process of fabricating the inorganic insulating layer, and thus, compared to the existing In the technology, two technical solutions of the Mask process are added, and the present disclosure can save two Mask processes, thereby saving production cost and improving production efficiency.

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Abstract

一种柔性显示面板、显示装置及柔性显示面板的制作方法，该柔性显示面板包括：柔性衬底基板（301），位于柔性衬底基板（301）显示区（A）的导电层（302），位于柔性衬底基板（301）边缘弯折区（B）的多条走线（303），以及位于导电层（302）和多条走线（303）与柔性衬底基板（301）之间的无机绝缘层（304）；还包括：至少设置于柔性衬底基板（301）边缘弯折区（B）的多条走线（303）与无机绝缘层（304）之间的第一有机绝缘层（305）；且第一有机绝缘层（305）的材料为固化后的光刻胶。

Description

一种柔性显示面板、显示装置及柔性显示面板的制作方法
交叉引用
本申请要求于2017年3月30日提交的申请号为201710202454.0的中国专利申请的优先权，该中国专利申请的全部内容通过引用全部并入本文。
技术领域
本公开涉及显示技术领域，尤其涉及一种柔性显示面板、显示装置及柔性显示面板的制作方法。
背景技术
显示市场目前正在蓬勃发展，并且随着消费者对笔记本电脑、智能手机、电视、平板电脑、智能手表和健身腕带等各类显示产品的需求的持续提升，将来会涌现出更多的新显示产品。
全屏无边框的显示产品，可以使用户获得更好的观看体验，必将引爆新的消费市场。Pad弯折(Pad Bending)是全屏无边框的显示产品的核心技术。
发明内容
本公开实施例提供一种柔性显示面板、显示装置及柔性显示面板的制作方法。
本公开实施例提供的一种柔性显示面板，包括：柔性衬底基板，设置于所述柔性衬底基板显示区的导电层，设置于所述柔性衬底基板边缘弯折区的多条走线，以及设置于所述导电层和所述多条走线与所述柔性衬底基板之间的无机绝缘层；所述导电层与所述多条走线电连接且同层设置；还包括：
至少设置于所述柔性衬底基板边缘弯折区的第一有机绝缘层；所述第一有机绝缘层位于所述多条走线与所述无机绝缘层之间且所述第一有机绝缘层的材料为固化后的光刻胶。
在一种可能的实现方式中，在本公开实施例提供的上述柔性显示面板中，所述第一有机绝缘层的材料为光敏聚酰亚胺。
在一种可能的实现方式中，在本公开实施例提供的上述柔性显示面板中，所述第一有机绝缘层还设置于所述柔性衬底基板显示区；且所述第一有机绝缘层位于所述导电层与所述无机绝缘层之间。
在一种可能的实现方式中，在本公开实施例提供的上述柔性显示面板中，所述导电层为源漏极金属层；
所述无机绝缘层包括：栅绝缘层和层间绝缘层。
在一种可能的实现方式中，在本公开实施例提供的上述柔性显示面板中，所述第一有机绝缘层用于对所述栅绝缘层和所述层间绝缘层进行构图。
在一种可能的实现方式中，在本公开实施例提供的上述柔性显示面板中，所述第一有机绝缘层具有的过孔图案所占面积大于所述层间绝缘层具有的过孔图案所占面积。
在一种可能的实现方式中，在本公开实施例提供的上述柔性显示面板中，还包括：至少设置于所述柔性衬底基板边缘弯折区的第二有机绝缘层；且所述第二有机绝缘层位于所述多条走线之上。
在一种可能的实现方式中，在本公开实施例提供的上述柔性显示面板中，所述第二有机绝缘层与设置于所述柔性衬底基板显示区的平坦层、隔垫物层或像素定义层同层设置。
在一种可能的实现方式中，在本公开实施例提供的上述柔性显示面板中，还包括：设置于所述柔性衬底基板显示区的导电层之上的有机电致发光二极管或者量子点发光二极管。
本公开实施例还提供了一种显示装置，包括：上述柔性显示面板。
本公开实施例还提供了一种柔性显示面板的制作方法，包括：
提供一柔性衬底基板；
在所述柔性衬底基板显示区和边缘弯折区依次形成无机绝缘膜层和光刻胶膜层；
采用所述光刻胶膜层对所述无机绝缘膜层进行构图形成无机绝 缘层的图案；
至少对所述柔性衬底基板边缘弯折区的所述光刻胶层进行固化处理，形成第一有机绝缘层；
在所述柔性衬底基板显示区的所述无机绝缘层上形成导电层，同时在所述柔性衬底基板边缘弯折区的所述第一有机绝缘层上形成多条走线。
在一种可能的实现方式中，在本公开实施例提供的上述制作方法中，所述至少对所述柔性衬底基板边缘弯折区的所述光刻胶膜层进行固化处理，形成第一有机绝缘层，具体包括：
同时对所述柔性衬底基板边缘弯折区和所述柔性衬底基板显示区的所述光刻胶膜层进行固化处理，形成第一有机绝缘层。
在一种可能的实现方式中，在本公开实施例提供的上述制作方法中，在同时对所述柔性衬底基板边缘弯折区和所述柔性衬底基板显示区的所述光刻胶膜层进行固化处理，形成第一有机绝缘层之后，还包括：
对所述光刻胶膜层具有的过孔图案进行灰化处理，使所述第一有机绝缘层具有的过孔图案所占面积大于所述无机绝缘层具有的过孔图案所占面积。
在一种可能的实现方式中，在本公开实施例提供的上述制作方法中，在所述柔性衬底基板显示区的所述无机绝缘层上形成导电层，同时在所述柔性衬底基板边缘弯折区的所述第一有机绝缘层上形成多条走线之后，还包括：
在所述柔性衬底基板边缘弯折区的所述多条走线上形成第二有机绝缘层。
在一种可能的实现方式中，在本公开实施例提供的上述制作方法中，在所述柔性衬底基板边缘弯折区的所述多条走线上形成第二有机绝缘层的同时，还包括：
在所述柔性衬底基板显示区形成平坦层、隔垫物层或像素定义层。
附图说明
为了更清楚地说明本公开实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1A为根据本公开对比例的柔性显示面板的结构示意图之一；
图1B为图1A中虚线部分放大后的结构示意图；
图2为现有技术中柔性显示面板的结构示意图之二；
图3为本公开实施例一提供的柔性显示面板的结构示意图；
图4为本公开实施例二提供的柔性显示面板的结构示意图；
图5为本公开实施例三提供的柔性显示面板的结构示意图；
图6为本公开实施例四提供的柔性显示面板的制作方法的流程图；
图7A至图7E分别为实施本公开实施例四提供的柔性显示面板的制作方法中的各步骤后对应的柔性显示面板的结构示意图；
图8为本公开实施例五提供的柔性显示面板的制作方法的流程图；
图9为本公开实施例六提供的柔性显示面板的制作方法的流程图。
具体实施方式
下面结合附图，对本公开实施例提供的一种柔性显示面板、显示装置及柔性显示面板的制作方法进行详细的说明。
附图中各膜层的厚度和形状大小不反映柔性显示面板的真实比例，目的只是示意说明本公开内容。
图1A和图1B示出了根据本公开对比例的柔性显示面板，如图1A和图1B所示，由于无机绝缘层101的脆性较大，Pad Bending会使得显示产品弯折区的无机绝缘层101发生裂纹S，该裂纹S会进一步扩展到信号线层102，从而导致显示失效。为了避免弯折区的无机 绝缘层101产生裂纹S，如图2所示，现有技术中通过增加一道掩膜(Mask)工艺，以去除弯折区的无机绝缘层101；之后再通过增加另一道Mask工艺，在弯折区形成一有机绝缘层201；之后在有机绝缘层201上形成信号线层102。如此，由于在弯折区不存在无机绝缘层101，因此，在实现Pad Bending的时候，裂纹不易发生，更不会扩展到信号线层102，从而有效防止了显示失效。
实施例一
本公开实施例一提供的一种柔性显示面板，如图3所示，包括：柔性衬底基板301，设置于柔性衬底基板显示区A的导电层302，设置于柔性衬底基板边缘弯折区B的多条走线303，以及设置于导电层302和多条走线303与柔性衬底基板301之间的无机绝缘层304；导电层302与多条走线303电连接且同层设置；特别的，该柔性显示面板还包括：
至少设置于柔性衬底基板边缘弯折区B的第一有机绝缘层305；第一有机绝缘层305位于多条走线303与无机绝缘层304之间且第一有机绝缘层305的材料为固化后的光刻胶。较佳地，该光刻胶具有良好的弯折特性和热稳定性，例如该光刻胶可以为光敏聚酰亚胺，在此不做限定。
在本公开实施例一提供的上述柔性显示面板中，由于在柔性衬底基板边缘弯折区B设置了第一有机绝缘层305，且该第一有机绝缘层305位于多条走线303与无机绝缘层304之间；因此，当位于柔性衬底基板边缘弯折区B的无机绝缘层304发生裂纹时，位于多条走线303与无机绝缘层304之间第一有机绝缘层305可以起到屏蔽作用，从而有效防止了裂纹扩展到多条走线303所在膜层，进而避免了显示失效现象。进一步地，由于第一有机绝缘层305的材料为固化后的光刻胶，在具体实施时，该光刻胶可以为制作无机绝缘层304的过程中涂覆的光刻胶，因此，相对于现有技术中增加两道Mask工艺的技术方案，本公开可以省去两道Mask工艺，从而节省了生产成本，提高了生产效率。此外，导电层302与多条走线303同层设置，这样可以使用一次构图工艺同时制作出导电层302和多条走线303，简化 了制作工艺，节省了生产成本。
在具体实施时，在本公开实施例一提供的上述柔性显示面板中，如图3所示，导电层302为源漏极金属层和信号线；无机绝缘层304包括：栅绝缘层3041和层间绝缘层3042，并且层间绝缘层3042位于栅绝缘层3041背离柔性衬底基板301的一侧。第一有机绝缘层305用于形成对栅绝缘层3041和层间绝缘层3042的过孔图案。其中，导电层302和多条走线303的材料可以是钼、铝，钨、钛、铜其中之一或合金组合，在此不做限定。无机绝缘层304的材料可以为氧化硅、氮化硅其中之一或组合，在此不做限定。一般地，无机绝缘层304具有过孔图案，且无机绝缘层304的过孔图案位于柔性衬底基板显示区A。
具体地，在本公开实施例一提供的上述柔性显示面板中，如图3所示，还可以包括：位于柔性衬底基板301与栅绝缘层3041之间的有源层306，以及位于栅绝缘层3041和层间绝缘层3042之间的栅极金属层307和栅扫描线(图中未示出)。具体地，有源层306的材料可以为多晶硅半导体材料、非晶硅半导体材料、氧化物半导体材料或有机半导体材料，在此不做限定。栅极金属层307和栅扫描线的材料可以是钼、铝，钨、钛、铜其中之一或合金组合，在此不做限定。
具体地，在本公开实施例一提供的上述柔性显示面板中，如图3所示，还可以包括：依次设置于柔性衬底基板显示区A的导电层302之上的平坦层308有机电致发光二极管或者量子点发光二极管(Quantum Dot Light Emitting Diodes，QLED)309。其中，平坦层308的材料可以为聚丙烯酸树脂、聚环氧丙烯酸树脂、感光性聚酰亚胺树脂、聚酯丙烯酸酯、聚氨酯丙烯酸酯树脂、酚醛环氧压克力树脂等有机绝缘材料，在此不做限定。
实施例二
由于本公开实施例二提供的柔性显示面板与本公开实施例一提供的柔性显示面板的结构相似，这里仅对本公开实施例二提供的柔性显示面板与本公开实施例一提供的柔性显示面板的不同之处进行介绍，重复之处不再赘述。
根据上述描述可知，在本公开实施例一提供的柔性显示面板中，无机绝缘层304具有过孔图案。在实际应用中，位于过孔图案处的导电层302可能会发生断裂，影响柔性显示面板的显示效果。
具体地，为了防止导电层302在过孔图案处发生断裂，在本公开实施例二提供的上述柔性显示面板中，如图4所示，第一有机绝缘层305具有的过孔图案所占面积大于层间绝缘层3042具有的过孔图案所占面积。这样设置，可以改善导电层302的坡度角，从而有效防止导电层302在过孔图案处发生断裂。
此外，本公开实施例二提供的上述柔性显示面板中各膜层的材料与本公开实施例一提供的柔性显示面板中各膜层的材料相同，在此不做赘述。
实施例三
由于本公开实施例三提供的柔性显示面板与本公开实施例二提供的柔性显示面板的结构相似，这里仅对本公开实施例三提供的柔性显示面板与本公开实施例二提供的柔性显示面板的不同之处进行介绍，重复之处不再赘述。
具体地，在本公开实施例二提供的柔性显示面板的基础上，为了防止柔性衬底基板边缘弯折区B的的多条走线303被划伤，在本公开实施例三提供的上述柔性显示面板中，如图5所示，增加了至少设置于柔性衬底基板边缘弯折区B的第二有机绝缘层310；且第二有机绝缘层310位于多条走线303之上，即第二有机绝缘层310位于多条走线303背离柔性衬底基板301的一侧。这样，第二有机绝缘层310可以保护多条走线303，使其免受划伤，进而可以提高显示画面品质。
具体地，在本公开实施例三提供的上述柔性显示面板中，第二有机绝缘层310可以为单独设置的一个膜层，还可以为与柔性衬底基板显示区A的平坦层308同层设置的一个膜层，在此不做限定。当第二有机绝缘层310与平坦层308同层设置时，可以使用一次构图工艺同时制备出第二有机绝缘层310和平坦层308，简化了制备工艺，节省了生产成本。并且，由于柔性衬底基板显示区A的像素有机层 一般包括平坦层、隔垫物层(Photo Spacer，PS)和像素定义层，因此，在具体实施时，第二有机绝缘层310还可以与隔垫物层或像素定义层同层设置，在此不做限定。
此外，本公开实施例三提供的上述柔性显示面板中各膜层的材料与本公开实施例二提供的柔性显示面板中各膜层的材料相同，在此不做赘述。
需要说明的是，在具体实施时，在本公开实施例三提供的上述柔性显示面板中，还可以本公开实施例一提供的柔性显示面板为基础进行改进，即仅增加至少设置于柔性衬底基板边缘弯折区B的多条走线303之上的第二有机绝缘层310，而不限定第一有机绝缘层305具有的过孔图案与层间绝缘层3042具有的过孔图案的大小。
实施例四
相应地，针对本公开实施例一提供的上述柔性显示面板，本公开实施例四提供了一种柔性显示面板的制作方法，如图6所示，具体可以包括以下步骤：
S601、提供一柔性衬底基板；
S602、在柔性衬底基板显示区和边缘弯折区依次形成无机绝缘膜层和光刻胶膜层；
S603、采用光刻胶膜层对无机绝缘膜层进行构图形成无机绝缘层的图案；
S604、至少对柔性衬底基板边缘弯折区的光刻胶层进行固化处理，形成第一有机绝缘层；
S605、在柔性衬底基板显示区的无机绝缘层上形成导电层，同时在柔性衬底基板边缘弯折区的第一有机绝缘层上形成多条走线。
具体地，在本公开实施例四提供的柔性显示面板的制作方法中，导电层为源漏极金属层和信号线，步骤S603采用光刻胶膜层对无机绝缘膜层进行构图形成无机绝缘层的图案，具体可以通过以下方式实现：
采用光刻胶膜层对无机绝缘膜层进行构图，形成栅绝缘层和层间绝缘层。
在具体实施时，在本公开实施例四提供的上述制作方法中，步骤S603的具体实现方式中采用光刻胶膜层对无机绝缘膜层进行构图，形成层间绝缘层之前，还可以包括：在柔性衬底基板显示区依次形成有源层，栅绝缘层，以及栅极金属层和栅扫描线。
具体地，在本公开实施例提供的上述制作方法中，步骤S604至少对柔性衬底基板边缘弯折区的光刻胶膜层进行固化处理，形成第一有机绝缘层，具体可以通过以下方式实现：
同时对柔性衬底基板边缘弯折区和柔性衬底基板显示区的光刻胶膜层进行固化处理，形成第一有机绝缘层。
在具体实施时，在本公开实施例四提供的上述制作方法中的步骤S605在柔性衬底基板显示区的无机绝缘层上形成导电层，同时在柔性衬底基板边缘弯折区的第一有机绝缘层上形成多条走线之后，还可以包括：在柔性衬底基板显示区的导电层上依次形成平坦层和有机电致发光二极管或者量子点发光二极管。
具体地，为了更好的理解本公开实施例四提供的上述制作方法，如图7A至图7E所示，为本公开实施例四提供的上述制作方法中实施各步骤后所得柔性显示面板的结构示意图：
提供一柔性衬底基板301，并在该柔性衬底基板301上依次形成有源层306、栅绝缘层3041、栅极金属层307和栅扫描线(图中未示出)，如图7A所示；
在栅极金属层307和栅扫描线所在膜层上沉积层间绝缘膜层和光刻胶膜层；采用掩膜板对光刻胶膜层依次进行曝光之后进行显影工艺，形成的柔性显示面板，如图7B所示；
采用曝光、显影后的光刻胶膜层的图案对柔性衬底基板显示区A的层间绝缘膜层进行刻蚀工艺，形成具有过孔图案的层间绝缘层3042；之后同时对柔性衬底基板边缘弯折区和柔性衬底基板显示区的光刻胶膜层进行固化处理，形成第一有机绝缘层305，如图7C所示；
在柔性衬底基板显示区A的层间绝缘层3042上形成导电层302，同时在柔性衬底基板边缘弯折区B的第一有机绝缘层305上形成多条走线303，如图7D所示；
在柔性衬底基板显示区A的导电层302上依次形成平坦层308和有机电致发光二极管或者量子点发光二极管309，如图7E所示。
需要说明的是，在本公开实施例四提供的上述制作方法中，形成各层结构涉及到的构图工艺，不仅可以包括光刻胶涂覆、掩模板掩模、曝光、显影、刻蚀、光刻胶剥离等部分或全部的工艺过程，还可以包括其他工艺过程，具体以实际制作过程中形成所需构图的图形为准，在此不做限定。例如，在显影之后和刻蚀之前还可以包括后烘工艺。其中，刻蚀可以为干法刻蚀或者湿法刻蚀，在此不做限定。
另外，在本公开实施例四提供的上述制作方法中关于柔性显示面板的各膜层的材料方面的内容可以援引本公开实施例一提供的柔性显示面板的相关内容，在此不做赘述。
实施例五
相应地，针对本公开实施例二提供的上述柔性显示面板，本公开实施例五提供了一种柔性显示面板的制作方法。由于本公开实施例五提供的柔性显示面板的制作方法与本公开实施例四提供的柔性显示面板的制作方法相似，这里仅对本公开实施例五提供的柔性显示面板的制作方法与本公开实施例四提供的柔性显示面板的制作方法的不同之处进行介绍，重复之处不再赘述。
具体地，与本公开实施例四提供的柔性显示面板的制作方法中的步骤S604至少对柔性衬底基板边缘弯折区的光刻胶层进行固化处理，形成第一有机绝缘层不同，在本公开实施例五提供的上述制作方法中，如图8所示，步骤S604’、同时对柔性衬底基板边缘弯折区和柔性衬底基板显示区的光刻胶膜层进行固化处理之后，对光刻胶膜层具有的过孔图案进行灰化处理，形成第一有机绝缘层，以使第一有机绝缘层具有的过孔图案所占面积大于无机绝缘层具有的过孔图案所占面积，为后续形成导电层建立基础。
另外，在本公开实施例五提供的上述制作方法中关于柔性显示面板的各膜层的材料方面的内容可以援引本公开实施例二提供的柔性显示面板的相关内容，在此不做赘述。
实施例六
相应地，针对本公开实施例三提供的上述柔性显示面板，本公开实施例六提供了一种柔性显示面板的制作方法。由于本公开实施例六提供的柔性显示面板的制作方法与本公开实施例五提供的柔性显示面板的制作方法相似，这里仅对本公开实施例六提供的柔性显示面板的制作方法与本公开实施例五提供的柔性显示面板的制作方法的不同之处进行介绍，重复之处不再赘述。
具体地，在本公开实施例五提供的柔性显示面板的制作方法中的步骤S605在柔性衬底基板边缘弯折区的第一有机绝缘层上形成多条走线之后，在本公开实施例六提供的柔性显示面板的制作方法中，如图9所示，还可以包括：
S606、在柔性衬底基板弯折区的多条走线上形成第二有机绝缘层。
这样，第二有机绝缘层可以保护多条走线，使其免受划伤，进而可以提高显示画面品质。
具体地，在本公开实施例六提供的上述制作方法中，步骤S606在柔性衬底基板弯折区的多条走线上形成第二有机绝缘层，具体可以通过以下方式实现：
在柔性衬底基板显示区的导电层上形成平坦层的同时，在柔性衬底基板弯折区的多条走线上形成第二有机绝缘层。
具体地，由于柔性衬底基板显示区A的像素有机层一般包括平坦层、隔垫物层和像素定义层，因此，在本公开实施例六提供的柔性显示面板的制作方法中，步骤S606在柔性衬底基板弯折区的多条走线上形成第二有机绝缘层，具体还可以通过以下方式实现：
在柔性衬底基板显示区的导电层上形成隔垫物层或像素定义层的同时，在柔性衬底基板弯折区的多条走线上形成第二有机绝缘层，在此不做限定。
另外，在本公开实施例六提供的上述制作方法中关于柔性显示面板的各膜层的材料方面的内容可以援引本公开实施例三提供的柔性显示面板的相关内容，在此不做赘述。
基于同一公开构思，本公开实施例还提供了一种显示装置，包 括本公开实施例提供的上述柔性显示面板，该显示装置可以为：手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。该显示装置的实施可以参见上述柔性显示面板的实施例，重复之处不再赘述。
本公开实施例提供的上述柔性显示面板、显示装置及柔性显示面板的制作方法，该柔性显示面板包括：柔性衬底基板，设置于柔性衬底基板显示区的导电层，设置于柔性衬底基板边缘弯折区的多条走线，以及设置于导电层和多条走线与柔性衬底基板之间的无机绝缘层；导电层与多条走线电连接且同层设置；还包括：至少设置于柔性衬底基板边缘弯折区的第一有机绝缘层；第一有机绝缘层位于多条走线与无机绝缘层之间且第一有机绝缘层的材料为固化后的光刻胶。由于在柔性衬底基板边缘弯折区设置了第一有机绝缘层，且该第一有机绝缘层位于多条走线与无机绝缘层之间；因此，当位于柔性衬底基板边缘弯折区的无机绝缘层发生裂纹时，位于多条走线与无机绝缘层之间第一有机绝缘层可以起到屏蔽作用，从而有效防止了裂纹扩展到多条走线所在膜层，进而避免了显示失效现象。进一步地，由于第一有机绝缘层的材料为固化后的光刻胶，在具体实施时，该光刻胶可以为制作无机绝缘层的过程中涂覆的光刻胶，因此，相对于现有技术中增加两道Mask工艺的技术方案，本公开可以省去两道Mask工艺，从而节省了生产成本，提高了生产效率。此外，导电层与多条走线同层设置，这样可以使用一次构图工艺同时制作出导电层和多条走线，简化了制作工艺，节省了生产成本。
本公开有益效果如下：
本公开实施例提供的一种柔性显示面板、显示装置及柔性显示面板的制作方法，该柔性显示面板包括：柔性衬底基板，设置于柔性衬底基板显示区的导电层，设置于柔性衬底基板边缘弯折区的多条走线，以及设置于导电层和多条走线与柔性衬底基板之间的无机绝缘层；导电层与多条走线电连接且同层设置；还包括：至少设置于柔性衬底基板边缘弯折区的第一有机绝缘层；第一有机绝缘层位于多条走线与无机绝缘层之间且第一有机绝缘层的材料为固化后的光刻胶。由 于在柔性衬底基板边缘弯折区设置了第一有机绝缘层，且该第一有机绝缘层位于多条走线与无机绝缘层之间；因此，当位于柔性衬底基板边缘弯折区的无机绝缘层发生裂纹时，位于多条走线与无机绝缘层之间第一有机绝缘层可以起到屏蔽作用，从而有效防止了裂纹扩展到多条走线所在膜层，进而避免了显示失效现象。进一步地，由于第一有机绝缘层的材料为固化后的光刻胶，在具体实施时，该光刻胶可以为制作无机绝缘层的过程中涂覆的光刻胶，因此，相对于现有技术中增加两道Mask工艺的技术方案，本公开可以省去两道Mask工艺，从而节省了生产成本，提高了生产效率。
显然，本领域的技术人员可以对本公开进行各种改动和变型而不脱离本公开的精神和范围。这样，倘若本公开的这些修改和变型属于本公开权利要求及其等同技术的范围之内，则本公开也意图包含这些改动和变型在内。

Claims (16)

  1. 一种柔性显示面板，包括：柔性衬底基板，设置于所述柔性衬底基板显示区的导电层，设置于所述柔性衬底基板边缘弯折区的多条走线，以及设置于所述导电层和所述多条走线与所述柔性衬底基板之间的无机绝缘层；所述导电层与所述多条走线电连接；所述柔性显示面板还包括：
    至少设置于所述柔性衬底基板边缘弯折区的第一有机绝缘层；所述第一有机绝缘层位于所述多条走线与所述无机绝缘层之间且所述第一有机绝缘层的材料为固化后的光刻胶。
  2. 如权利要求1所述的柔性显示面板，其中，所述第一有机绝缘层的材料为光敏聚酰亚胺。
  3. 如权利要求1所述的柔性显示面板，其中，所述第一有机绝缘层还设置于所述柔性衬底基板显示区；且所述第一有机绝缘层位于所述导电层与所述无机绝缘层之间。
  4. 如权利要求3所述的柔性显示面板，其中，所述导电层为源漏极金属层；
    所述无机绝缘层包括：栅绝缘层和层间绝缘层。
  5. 如权利要求4所述的柔性显示面板，其中，所述第一有机绝缘层用于对所述栅绝缘层和所述层间绝缘层进行构图。
  6. 如权利要求5所述的柔性显示面板，其中，所述第一有机绝缘层具有的过孔图案所占面积大于所述层间绝缘层具有的过孔图案所占面积。
  7. 如权利要求1所述的柔性显示面板，其中，还包括：至少设置于所述柔性衬底基板边缘弯折区的第二有机绝缘层；且所述第二有机绝缘层位于所述多条走线之上。
  8. 如权利要求7所述的柔性显示面板，其中，所述第二有机绝缘层与设置于所述柔性衬底基板显示区的平坦层、隔垫物层或像素定义层同层设置。
  9. 如权利要求1所述的柔性显示面板，其中，所述导电层与所述多条走线同层设置。
  10. 如权利要求1-9任一项所述的柔性显示面板，其中，还包括：设置于所述柔性衬底基板显示区的导电层之上的有机电致发光二极管或者量子点发光二极管。
  11. 一种显示装置，包括：如权利要求1-10任一项所述的柔性显示面板。
  12. 一种柔性显示面板的制作方法，包括：
    提供一柔性衬底基板；
    在所述柔性衬底基板显示区和边缘弯折区依次形成无机绝缘膜层和光刻胶膜层；
    采用所述光刻胶膜层对所述无机绝缘膜层进行构图形成无机绝缘层的图案；
    至少对所述柔性衬底基板边缘弯折区的所述光刻胶层进行固化处理，形成第一有机绝缘层；
    在所述柔性衬底基板显示区的所述无机绝缘层上形成导电层，同时在所述柔性衬底基板边缘弯折区的所述第一有机绝缘层上形成多条走线。
  13. 如权利要求12所述的制作方法，其中，所述至少对所述柔性衬底基板边缘弯折区的所述光刻胶膜层进行固化处理，形成第一有机绝缘层，具体包括：
    同时对所述柔性衬底基板边缘弯折区和所述柔性衬底基板显示区的所述光刻胶膜层进行固化处理，形成第一有机绝缘层。
  14. 如权利要求13所述的制作方法，其中，在同时对所述柔性衬底基板边缘弯折区和所述柔性衬底基板显示区的所述光刻胶膜层进行固化处理，形成第一有机绝缘层之后，还包括：
    对所述光刻胶膜层具有的过孔图案进行灰化处理，使所述第一有机绝缘层具有的过孔图案所占面积大于所述无机绝缘层具有的过孔图案所占面积。
  15. 如权利要求12所述的制作方法，其中，在所述柔性衬底基板显示区的所述无机绝缘层上形成导电层，同时在所述柔性衬底基板边缘弯折区的所述第一有机绝缘层上形成多条走线之后，还包括：
    在所述柔性衬底基板边缘弯折区的所述多条走线上形成第二有机绝缘层。
  16. 如权利要求15所述的制作方法，其中，在所述柔性衬底基板边缘弯折区的所述多条走线上形成第二有机绝缘层的同时，还包括：
    在所述柔性衬底基板显示区形成平坦层、隔垫物层或像素定义层。
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